CN110831331B - Optimization method of automatic hole plating process - Google Patents
Optimization method of automatic hole plating process Download PDFInfo
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- CN110831331B CN110831331B CN201910954762.8A CN201910954762A CN110831331B CN 110831331 B CN110831331 B CN 110831331B CN 201910954762 A CN201910954762 A CN 201910954762A CN 110831331 B CN110831331 B CN 110831331B
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- 238000000034 method Methods 0.000 title claims abstract description 191
- 238000007747 plating Methods 0.000 title claims abstract description 116
- 238000005457 optimization Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 71
- 238000013461 design Methods 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- 238000004801 process automation Methods 0.000 claims description 7
- 238000004590 computer program Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000005553 drilling Methods 0.000 description 32
- 238000007689 inspection Methods 0.000 description 9
- 238000000227 grinding Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to an optimization method of an automatic hole plating process, which comprises the following steps: the method comprises the steps of manufacturing a plated hole film CAM file and automatically writing an ERP flow, wherein the ERP flow is automatically written based on the plated hole film CAM file. According to the invention, through automatic production of the plated hole film CAM file and automatic compiling of the ERP process, the problems of poor production quality such as mismatching of the drilled hole and the plated hole film, poor plated hole and the like, incapability of automatically compiling the ERP of a plated hole process, low efficiency and incorrect compiling of the ERP in the prior art are solved, the automatic production of the plated hole CAM file according to rules is realized, the production efficiency is greatly improved, the corresponding plated hole file layer can be automatically replaced by any modification, mismatching of the drilled hole and the plated hole film is avoided, the ERP is compiled according to the plated hole film names corresponding to different process designs, and the efficiency and accuracy of the ERP compiling are ensured.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to an optimization method of an automatic hole plating process.
Background
CAM (computer Aided Manufacturing) refers to the computer Aided completion of the whole process from production preparation to product Manufacturing by directly or indirectly associating a computer with the Manufacturing process and the production equipment, using a computer system to plan, manage and control the operation of the Manufacturing process and the production equipment, process data required in the product Manufacturing process, control and process the flow of materials (blanks and parts, etc.), test and inspect the product, etc.
In the manufacturing process of the circuit board, a hole plating film is a common technical means, and because the hole plating film has higher requirement on accuracy in design, in order to meet the hole plating flows of various processes, the process identification and the distinguishing need to be carried out by combining the hole plating flows of different processes, and correct hole plating film operation is carried out on the different hole plating flows; at the present stage, in the manufacturing process of the hole-plating film, due to the fact that the hole moving and the hole diameter are adjusted according to different hole-plating processes, the drilled hole is not matched with the hole-plating film, and the production quality problems such as poor hole plating are caused; the simplification of the plating hole film nomenclature causes that the ERP of the plating hole technology can not be automatically written, and the problems of low efficiency and ERP wrongly written exist.
Disclosure of Invention
Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. Therefore, an object of an embodiment of the present invention is to provide an optimization method for an automated hole plating process, which includes hole plating film CAM file manufacturing and ERP process automation writing, and can implement automatic hole plating film CAM file manufacturing by a program, thereby improving manufacturing efficiency and quality without increasing additional cost.
The technical scheme adopted by the embodiment of the invention is as follows:
in a first aspect, an embodiment of the present invention provides an optimization method for an automated hole plating process, including:
the method comprises the following steps of (1) manufacturing a plated hole film CAM file and automatically compiling an ERP flow, wherein the ERP flow is based on the plated hole film CAM file to realize automatic compiling; the manufacturing method of the plated hole film CAM file comprises the following steps:
determining the name of a plated hole film according to different process types;
selecting the type of the plated hole according to the name of the plated hole film;
and identifying the naming of the drill belt layer, and automatically manufacturing a plated hole film according to the selected plated hole type to obtain a plated hole film CAM file.
Further, the ERP process automation writing comprises the following steps:
determining the corresponding relation between the name of the plated hole film and the work flow according to the process type;
storing the corresponding relation between the plated hole film name and the work flow in an ERP system;
and executing the ERP flow to automatically compile according to the corresponding relation.
Further, the automatic compiling of the ERP flow is executed, specifically, the corresponding work flow is called out according to the production type of the plated-hole film stored in the ERP system, the work flow is automatically written into the system, and the automatic compiling of the ERP flow is realized.
Further, the automatic manufacturing of the plated hole film comprises the following steps:
and copying the corresponding hole of the layer of drilling tape into a newly-built hole-plated film layer to form the hole-plated film.
Further, the manufacturing of the plated hole film CAM file further comprises refreshing the plated hole film according to the selected plated hole type.
Further, the name of the film with plated holes is determined according to different process types, specifically, the name of the film with plated holes is determined according to the process design subdivided by the process types and the drilling program of the process design.
Further, the process types include a drill thick copper, selective hole plating film, resin plug hole, resin back drill, bond plate hole plating, and/or blind buried hole plating film.
The invention has the beneficial effects that:
according to the invention, through automatic production of the plated hole film CAM file and automatic compiling of the ERP process, the problems of poor production quality such as mismatching of the drilled hole and the plated hole, poor plated hole and the like, incapability of automatically compiling the ERP of a plated hole process, low efficiency and incorrect compiling of the ERP in the prior art are solved, the automatic production of the plated hole CAM file according to rules is realized, the production efficiency is greatly improved, an automatic replacement instruction is set in a program, when the updating exists, the program can automatically identify and update, and the plated hole film production program is automatically operated, so that the purpose of automatically updating the plated hole film is achieved, mismatching of the drilled hole and the plated hole film is avoided, the ERP is compiled according to the plated hole film names corresponding to different process designs, and the compiling efficiency and accuracy are ensured.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a plated-hole film CAM file according to an embodiment of the present invention;
FIG. 2 is a flow diagram illustrating an ERP flow automation compiling method according to an embodiment of the present invention;
FIG. 3 is a film automation production compilation interface in accordance with an embodiment of the present invention;
FIG. 4 is a diagram of an embodiment of the present invention implementing automated via-plating film interface fabrication;
fig. 5 is an interface view of the present invention performing a corresponding process design according to a plating hole type of a certain name.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
For a better understanding of the embodiments of the present invention, specific terms referred to in the embodiments of the present invention are defined:
CAM: CAM (computer Aided Manufacturing) mainly refers to: the activities of the whole process from preparation for production to production of the product are carried out with the aid of computers, i.e. by directly or indirectly connecting computers to the production process and the production equipment, planning, managing the production process and controlling and operating the production equipment with computer systems, processing data required in the production process of the product, controlling and processing the flow of materials (blanks and parts, etc.), testing and checking the product, etc.
Film: film, a term of art in printing, is a translation of film in the past, and is now commonly referred to as film, and may also be referred to as negative film in printing plate making.
F7: in the ERP system, F7 is a function button mainly used for calling basic data such as materials, suppliers, customers, employees, departments, and the like.
Example 1
Referring to fig. 1 to 2, embodiment 1 provides a method for optimizing an automated hole plating process, including:
the method comprises the steps of manufacturing a plated-hole film CAM file and automatically compiling an ERP flow, wherein the ERP flow is automatically compiled based on the plated-hole film CAM file.
In this embodiment, the manufacturing of the plated hole film CAM file includes the following steps:
s11: determining the name of a plated hole film according to different process types;
s12: selecting the type of the plated hole according to the name of the plated hole film;
s13: and identifying the naming of the drill belt layer, and automatically manufacturing a plated hole film according to the selected plated hole type to obtain a plated hole film CAM file.
In step S11, the process types include, but are not limited to: the method comprises the steps of drilling thick-hole copper, selectively plating a hole film, plugging a resin hole, back drilling a resin, plating a hole on a bonding plate and/or plating a hole on a blind buried hole, wherein different process types correspond to different process designs, and the plating hole film is named by corresponding drilling programs of different process designs, so that the naming of the plating hole film is regular and corresponds to the drilling program, and the problem that the drilling hole is not matched with the plating hole film is solved. In a specific embodiment, a process design corresponding to thick-hole copper drilling comprises a first thick-hole copper design (positive process) and a second thick-hole copper design (negative process), and according to a drilling program in the first thick-hole copper design (positive process) and the second thick-hole copper design (negative process), the plating hole film name is correspondingly determined as: dkhkt/b; for example, in the process flow of the selective hole-plating film, because the process design is not distinguished, according to the drilling program of the selective hole-plating film, the name of the hole-plating film is correspondingly determined as follows: dkxzt/dkxzb; dkxzlt/dxz1 b; dkxz2t/dxz2 b.
It should be understood that other process types in embodiments of the present invention may obtain the corresponding plated hole film name in the manner described above.
In step S12, the operator enters the automated via-plating film production programming interface (as shown in fig. 4) and selects a via-plating type. In other embodiments, for example, when the operator selects another process type, for example, the selective plating hole film (selective _ XZ), the resin plug hole (resin _ SZ), the resin back drill (resin back drill _ bzszz), and the bonding board plating hole (bonding _ BD), the corresponding process design will have a specific plating hole name, and the plating hole film with the name can be executed to perform the corresponding plating hole film process, thereby avoiding the occurrence of the phenomenon of product failure due to the implementation of an incorrect process caused by setting errors.
In step S13, after the plated hole film with a specific name corresponding to the corresponding process design is selected, the process of the process design can be automatically executed, and since the corresponding plated hole film name corresponds to the determined process flow, referring to fig. 5, fig. 5 shows an interface view for executing the corresponding process design according to the plated hole type with the determined name, after the execution is finished, each plated hole film with the specific name obtains a specific plated hole CAM file.
In the steps S11-S13, the names of the files are standardized by performing logical carding on the rules for making the plated hole files, and a specific name is given to a plated hole film corresponding to a specific process design, so that not only can the plated hole files be automatically made by a program, but also the subsequent operation flows are simplified by establishing a specific corresponding relationship, and the specific corresponding relationship also ensures that different process flows have different identifications, thereby avoiding the problem of poor product quality caused by calling errors of the process flows.
In this embodiment, the ERP process automation writing includes the following steps:
s21: determining the corresponding relation between the name of the plated hole film and the work flow according to the process type;
s22: storing the corresponding relation between the plated hole film name and the work flow in an ERP system;
s23: and executing the ERP flow for automatic writing.
In step S21, according to the above-mentioned processes, (including but not limited to, drilling thick copper, selectively plating a hole film, plugging a hole with resin, backdrilling resin, plating a hole with a bonding plate, and plating a hole with a blind via), in the steps S11-S13, the process design corresponding to each process has obtained the name of a corresponding plating hole film, and the plating hole film with the corresponding name is matched with the corresponding work flow to obtain the corresponding relationship between the name of the plating hole film and the work flow.
Wherein, a drill thick hole copper means: PTH holes in one pass, hole copper exceeded the three-level 25um standard.
In a specific embodiment, a process design corresponding to a drilling of thick hole copper is a first thick hole copper design (positive process) and a second thick hole copper design (negative process), and the names of the plating hole films corresponding to the thick hole copper design (positive process) and the thick hole copper design (negative process) are dkhkt/b, and the process flows of the design corresponding to the plating hole film and the processes of the first thick hole copper design (positive process) and the second thick hole copper design (negative process) are respectively: the upper process → drilling (controlled deep drilling) → deburring → copper deposition → plate plating → dry film inspection 1 → plating hole → film removal → plate grinding after plating → the rear process and the upper process → drilling (controlled deep drilling) → deburring → copper deposition → dry film plating → dry film inspection 1 → plating hole → film removal → plate grinding after plating → rear process, thus obtaining the specific correspondence of [ process type ] → [ process design ] → [ name of film plating ] → [ process flow ].
It should be understood that other process flows may have a one-to-one correspondence from process type to process flow in the manner described above.
In step S22, after a correspondence relationship from the process type to the process flow is obtained from each process type, the process flows are stored in the ERP system according to the correspondence relationship.
In step S23, when the operator operates a specific process type, the corresponding process design is selected, and the corresponding plated-hole film is triggered, because the workflow corresponding to the process type has been determined and stored in the ERP system in step S22, at this time, the execution program will directly call the corresponding workflow, execute the workflow, and when the execution is finished, the ERP flow automatic writing is realized.
In the steps S21-S23, by determining the correspondence from the process type to the process flow, actually writing the ERP flow in combination with different plated-hole films with specific names, a special identifier is essentially added to the corresponding work flow, and when the system writes the ERP flow, the specific work flow can be accurately corresponded, and the efficiency and accuracy of writing the ERP are improved.
In this embodiment, the automatic manufacturing of the hole-plated film includes the following steps:
s211: identifying the naming of the drilling belt layer and the type of the plated hole;
s212: and copying the hole corresponding to the drill belt into the newly-built hole-plated film layer.
Specifically, according to the layer names and the plating hole types of the drill belts, corresponding plating hole films are selected and manufactured, the system program firstly identifies the names of the drill belt layers, then the holes corresponding to the drill belts are copied into the newly-built plating hole film layers, and the size of a bonding pad in each plating hole film layer is-4 mil larger than the size of a drill knife single side of each drill hole layer. In a specific embodiment, the DRL drill tape layer needs a hole plating film, and then the program will copy the holes of the DRL layer to the DKT and DKB layers according to the rules, and will increase the elements of the DRL layer by 4 mils during the copying process, i.e. 2 mils size on one side. The drill belt is defined as a procedural document used for a drilling procedure in PCB industrial production, and mainly provides a coordinate file required by a numerical control drill in production for the drill, and indicates a drill bit to drill at a marking position of the procedural to complete a PCB hole forming process.
Further, the manufacturing of the CAM file of the hole-plated film further comprises the step of refreshing the hole-plated film according to the selected hole-plated type, specifically, when F7 outputs production data, the program performs refreshing operation according to the selected hole-plated type to refresh the hole-plated film, so that the hidden danger that a manufacturer does not modify the hole-plated film is avoided. The refreshing operation is specifically that the ERP program sets an automatic replacement instruction, when the updating exists, the program can automatically recognize the updating, and automatically run the hole-plating film making program, so that the purpose of automatically updating the hole-plating film is achieved.
Example 2
Embodiment 2 provides a method for producing a plated-hole film CAM file and automatically compiling an ERP process for a selective plated-hole film process type, comprising:
selectively plating a hole film according to the process type, wherein the corresponding process design is also the selective hole film because the processes are not distinguished, and the name of the hole film is correspondingly determined according to the drilling program of the selective hole film: dkxzt/dkxzb; dkxzlt/dxz1 b; dkxz2t/dxz2 b; an operator selects the type of the plated hole according to the name of the plated hole film, and automatically manufactures the plated hole film according to the type of the plated hole, wherein the specific key points of the film manufacture are as follows: (1) increasing 4mil for all DRL metal holes (if PTHROU exists, the closed milling belt of the metal milling belt layer needs to be compacted and manufactured to the plated hole film layer by +4 mil); (2) the method for manufacturing the local thick-hole copper is that a film with a selective plated hole is manufactured, the PNL edge sealing is performed according to the edge of the existing film with the plated hole, and after the automatic manufacturing of the film with the plated hole is completed, a CAM file of the film with the plated hole is obtained;
in this embodiment, since the selective hole-plating film does not distinguish the processes, the corresponding process design is also the selective hole-plating film, and the corresponding work flow is as follows: the method comprises the following steps of (1) performing an upper process → drilling (depth-controlled drilling) for deburring → copper deposition → a plated hole dry film → dry film inspection 1 → a mirror hole → a film removal → a plated hole rear grinding plate → a rear process, storing the name of the plated hole film (dkxzt/dkxzb; dkxzlt/dxz1 b; dkxz2t/dxz2b) and the work flow into an ERP system, and when an operator operates the type of the selective plated hole film process, selecting the selective plated hole film process design and triggering the corresponding name of the selective plated hole film process design to be dkxzt/dkxzb; dkxzlt/dxz1 b; because the work flow corresponding to the process type is determined and stored in the ERP system, the executive program directly calls the corresponding work flow to execute the work flow, and when the execution is finished, the automatic compiling of the ERP flow aiming at the selective hole plating film process is realized.
Example 3
Embodiment 3 provides a method for manufacturing a plated-hole film CAM file and automatically compiling an ERP process for a resin hole plugging (including C resin hole plugging) process, comprising the following steps:
according to the process type, resin hole plugging is carried out, the process design corresponding to the process type is also the resin hole plugging because the process is not distinguished, and according to the drilling program of the selective hole-plating film, the name of the hole-plating film is correspondingly determined as follows: dkstb (sz/resin); an operator selects the type of the plated hole according to the name of the plated hole film, and automatically manufactures the plated hole film according to the type of the plated hole, wherein the specific key points of the film manufacture are as follows: increasing 4mil in the SZDRL metal hole, sealing the edge of the PNL according to the edge of the existing plated hole film plate, and automatically manufacturing the plated hole film to obtain a plated hole film CAM file after the plated hole film is completely manufactured;
in this embodiment, since the selective hole-plating film does not distinguish the processes, the corresponding process design is also resin hole plugging, and the corresponding work flow is as follows: the method comprises the following steps of performing an upper process → resin drilling and deburring 1 → copper deposition 1 → plate plating 1 → plated hole dry film → dry film inspection 1 → plated hole → film removal resin hole plugging → plate grinding-plate grinding inspection → a lower process, storing the name of a plated hole film (dkstb (sz/resin) and the work flow into an ERP system, selecting a resin hole plugging process design when an operator operates the resin hole plugging process, and triggering the plated hole film corresponding to the process type and storing the work flow corresponding to the process type into the ERP system.
Example 4
Embodiment 4 provides a method for manufacturing a plated-hole film CAM file and automatically compiling an ERP process for a resin back drilling process, comprising:
according to the process type: the resin back drill has the corresponding process design that: plating holes firstly and then back drilling and plating holes firstly and then back drilling, and correspondingly determining the names of the plating hole films according to the selective plating hole film drilling program as follows: dkst/B (SZ/resin) and dksbzt/B (B + SZ/resin backdrilling); an operator selects the type of the plated hole according to the name of the plated hole film, and automatically manufactures the plated hole film according to the type of the plated hole, wherein the specific film manufacturing key points are as follows: (1) increasing the szdrl by 4mil, and manufacturing the PNL edge sealing by increasing the back drilling by 4mil according to the edge of the existing plated film plate and (2) the same hole position of the back drilling and the szdrl 1; adding 4mi1 on the basis of the metal hole SZDRL in the non-identical hole site (when the back drill is in the same hole site as the metal hole SZDRL, the back drill in the top layer is used for manufacturing bzdkt, and the back drill in the bottom layer is used for manufacturing bzdkb), sealing the edge of the PNL according to the edge of the existing film plate for plating the hole, and automatically manufacturing the film for plating the hole to obtain the CAM file for plating the hole after the film for plating the hole is completely executed;
in this embodiment, the back drill is to drill a non-metal hole on the metal hole, and the back drill generally divides the top layer and the bottom layer, when the back drill is corresponding to the hole to be plugged with resin. For the holes in this case, the BZDKT layer is made when back-drilling the top layer and the BZDKB layer is made when back-drilling the bottom layer.
In this embodiment, the process design corresponding to the resin back drilling is also hole plating before back drilling and hole plating after back drilling, and the work flows corresponding to the above are respectively: (1) the upper process → the resin drilling deburring 1 → the copper deposition 1 → the plate plating 1 → the mirror hole dry film → the dry film inspection 1 → the plating hole → the film removal → the plating hole rear grinding plate tin plating → the back drill → the outer layer etching 1 → the tin removal → the deburring 2 → the back drill plug baking plate → the resin plug hole → the grinding plate inspection → the lower process; (2) the method comprises the following steps of (1) performing upper process → resin drilling → deburring 1 → copper deposition 1 → plate mirror 1 → tin plating → back drill → outer layer etching 1 → tin stripping → deburring 2 → dry film inspection of plated hole 1 → plated hole → film stripping → back drill plug drying plate → resin plug hole → grinding plate inspection → the following process, wherein the name of the plated hole film and the work flow are stored in an ERP system, and when an operator operates the resin back drilling process, the resin back drilling process design is selected, and the corresponding name is triggered: because the work flow corresponding to the process type is determined and stored in an ERP system, at the moment, an executive program directly calls the corresponding work flow and executes the work flow, and when the execution is finished, the automatic compiling of the ERP flow aiming at the resin back drilling process is realized.
Example 5
Embodiment 5 provides a method for hole-plating film CAM file production and ERP process automation compilation for bondboard hole-plating (DRL hole-plating) process:
according to the process type: the bonding plate is plated with holes, and the bonding plate is designed according to the process: the negative film and the gold plating and soft gold process respectively comprise: (1) a full through hole; (2) blind holes and through holes; (3) the process design of resin hole plugging, POFV and through hole correspondingly determines the names of the film with plated holes as follows according to the drilling program of the film with plated holes selectively: (1) dkbdtb (negative flow) [ BD/binding ]; (2) dkbdtb (gold plating process + soft gold process) [ BD/bonding ]; the operator selects the type of the plated hole according to the name of the plated hole film, and automatically manufactures the plated hole film according to the type of the plated hole, and the specific key points of the film manufacture are as follows: reducing all metal holes of the DRL by-1 mil, automatically manufacturing a hole-plated film according to the edge of the existing hole-plated film by the PNL edge sealing, and obtaining a hole-plated film CAM file after the hole-plated film is manufactured;
in this embodiment, the plating holes of the bonding plate correspond to the work flow according to the corresponding process design, the plating hole film name ((1) dkbdtb (negative film process) [ BD/bonding ], (2) dkbdtb (gold plating process + soft gold process) [ BD/bonding ]) and the work flow are stored in the ERP system, when the operator operates the plating hole process of the bonding plate, the process design is selected, and the plating hole film corresponding to the process type is triggered.
It should be understood that the optimization method of the automated hole plating process in embodiment 1 is also applicable to the CAM file making and ERP process automation writing of hole plating films of other process types.
Example 6
Embodiment 6 provides a computer-readable storage medium on which a computer program is stored, which program, when executed by a processor, implements the steps of the methods of embodiments 1 to 5. Therefore, the plated-hole film CAM file manufacturing and ERP flow automatic compiling are realized.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. An optimization method of an automatic hole plating process is characterized by comprising the following steps:
the method comprises the following steps of (1) manufacturing a plated hole film CAM file and automatically compiling an ERP flow, wherein the ERP flow is based on the plated hole film CAM file to realize automatic compiling; the manufacturing of the plated hole film CAM file comprises the following steps:
determining the name of a film with plated holes according to different process types;
selecting the type of the plated hole according to the name of the plated hole film;
and identifying the naming of the drill belt layer, and automatically manufacturing a plated hole film according to the selected plated hole type to obtain a plated hole film CAM file.
2. The method for optimizing an automated via plating process of claim 1, wherein the ERP process automated writing comprises:
determining the corresponding relation between the name of the plated hole film and the work flow;
storing the corresponding relation between the plated hole film name and the work flow in an ERP system;
and executing the ERP process automation compiling according to the corresponding relation.
3. The optimization method of the automated hole plating process according to claim 2, wherein the performing of the ERP process automation compilation according to the correspondence specifically comprises: and calling out a corresponding work flow according to the manufacturing type of the plated-hole film stored in the ERP system, automatically writing into the system, and realizing automatic writing of the ERP flow.
4. The optimization method of the automatic hole plating process according to claim 1, wherein the automatic hole plating film manufacturing comprises the following steps:
and copying the corresponding hole of the drill belt layer into a newly-built hole-plated film layer to form the hole-plated film.
5. The method for optimizing an automated hole plating process according to any one of claims 1 to 4, wherein the hole plating film CAM file creation further comprises refreshing the hole plating film according to the selected hole plating type.
6. The method for optimizing an automated hole plating process according to claim 2, wherein the name of the hole plating film is determined according to different process types, specifically, according to a process design subdivided by process types, the name of the hole plating film is determined according to a drilling program of the process design.
7. The method for optimizing an automated hole plating process according to claim 5, wherein the process types include a drill thick copper, a selective hole plating film, a resin plug hole, a resin back drill, a bond plate hole plating, and/or a blind buried hole plating film.
8. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 7.
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