CN110828707A - Preparation method of display substrate and release layer material - Google Patents
Preparation method of display substrate and release layer material Download PDFInfo
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- CN110828707A CN110828707A CN201911132000.6A CN201911132000A CN110828707A CN 110828707 A CN110828707 A CN 110828707A CN 201911132000 A CN201911132000 A CN 201911132000A CN 110828707 A CN110828707 A CN 110828707A
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- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 3
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 3
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- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesive Tapes (AREA)
Abstract
The disclosure provides a preparation method of a display substrate and a release layer material. The preparation method comprises the following steps: forming a layer of release layer material on a bearing substrate, wherein the release layer material comprises an adhesive and microspheres dispersed in the adhesive, and the microspheres are provided with an elastic shell and an expanding agent wrapped by the elastic shell; forming a flexible substrate on one side of the release layer material, which is back to the bearing substrate; forming a display function layer on one side, back to the bearing substrate, of the flexible substrate; heating the release layer material to enable the expanding agent to generate gas so as to enable the elastic shell to expand and exceed the adhesive to be back to the surface of the bearing substrate; and separating the flexible substrate from the heated release layer material. By applying the preparation method and the release layer material, the flexible substrate can be peeled off more easily, and the equipment cost is reduced.
Description
Technical Field
The disclosure belongs to the technical field of display, and particularly relates to a preparation method of a display substrate and a release layer material.
Background
The method for preparing the flexible Organic Light Emitting Diode (OLED) display substrate in the prior art comprises the following steps: after a flexible substrate, a display function layer and a thin film packaging layer are sequentially formed on a glass substrate, the flexible substrate is separated from the glass substrate by a laser stripping process. On the one hand, the flexible substrate is not completely peeled off, and residual flexible substrate material exists on the glass substrate, and on the other hand, the cost of the laser equipment adopted in the flexible substrate is high.
Disclosure of Invention
The present disclosure provides a method for manufacturing a display substrate and a release layer material to at least partially solve the problems of the prior art.
In a first aspect, a method for manufacturing a display substrate is provided, including: forming a layer of release layer material on a bearing substrate, wherein the release layer material comprises an adhesive and microspheres dispersed in the adhesive, and the microspheres are provided with an elastic shell and an expanding agent wrapped by the elastic shell; forming a flexible substrate on one side of the release layer material, which is back to the bearing substrate; forming a display function layer on one side, back to the bearing substrate, of the flexible substrate; heating the expanding agent to expand the elastic shell and extend the elastic shell beyond the surface of the adhesive opposite to the bearing substrate; and separating the flexible substrate from the heated release layer material.
In some embodiments, the material of the resilient shell comprises: a copolymer of acrylonitrile.
In some embodiments, the material of the swelling agent comprises: a liquid having a boiling point between 50 ℃ and 100 ℃.
In some embodiments, the material of the swelling agent comprises: any one of trichloroethane, ethanol and isopropanol.
In some embodiments, the ratio of the diameter D1 of the elastic shell before the release layer material is heated to the thickness h of the adhesive is between 30% and 60%; the difference between the diameter D2 of the elastic shell before the release layer material is heated and the thickness h of the adhesive is between 0.1um and 0.5 um.
In a second aspect, there is provided a release layer material comprising: the heat-insulation material comprises an adhesive and microspheres dispersed in the adhesive, wherein the microspheres are provided with an elastic shell and an expanding agent wrapped by the elastic shell, and the expanding agent is heated to expand the elastic shell.
In some embodiments, the material of the resilient shell comprises: a copolymer of acrylonitrile.
In some embodiments, the material of the swelling agent comprises: a liquid having a boiling point between 50 ℃ and 100 ℃.
In some embodiments, the material of the swelling agent comprises: any one of trichloroethane, ethanol and isopropanol.
In a third aspect, a method for manufacturing a display substrate is provided, including: forming a layer of release layer material on a bearing substrate, wherein the release layer material comprises a semi-interpenetrating polymer network, a cross-linking agent and an initiator, a cross-linked polymer in the semi-interpenetrating polymer network is an adhesive, and a non-cross-linked polymer in the semi-interpenetrating polymer network can perform polymerization reaction; forming a flexible substrate on one side of the release layer material, which is back to the bearing substrate; forming a display function layer on one side, back to the bearing substrate, of the flexible substrate; treating the release layer material to polymerize the non-crosslinked polymer in the semi-interpenetrating polymer network; and separating the flexible substrate from the processed release layer material.
In some embodiments, the initiator is a photoinitiator, the carrier substrate is a transparent substrate, and the non-crosslinked polymer in the semi-interpenetrating polymer network is capable of undergoing a polymerization reaction under the irradiation of specific light; the polymerizing the non-crosslinked polymer in the semi-interpenetrating polymer network comprises: applying the specific light irradiation to the non-crosslinked polymer in the semi-interpenetrating polymer network.
In some embodiments, the non-crosslinked polymers in the semi-interpenetrating polymer network include: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer.
In some embodiments, the crosslinked polymer in the semi-interpenetrating polymer network is an acrylate adhesive.
In some embodiments, the release layer material further comprises: silicon-containing acrylates.
In some embodiments, the acrylate based adhesive is present in an amount ranging from 20 to 30 mass% based on the total mass of the release layer material, the silicon containing acrylate is present in an amount ranging from 30 to 40 mass% based on the total mass of the release layer material, the non-crosslinked polymer in the semi-interpenetrating polymer network is present in an amount ranging from 10 to 30 mass% based on the total mass of the release layer material, the crosslinking agent is present in an amount ranging from 5 to 10 mass% based on the total mass of the release layer material, and the photoinitiator is present in an amount ranging from 1 to 5 mass% based on the total mass of the release layer material.
In a fourth aspect, there is provided a release layer material comprising: the adhesive comprises a semi-interpenetrating polymer network, a cross-linking agent and an initiator, wherein a cross-linked polymer in the semi-interpenetrating polymer network is an adhesive, and a non-cross-linked polymer in the semi-interpenetrating polymer network can be subjected to polymerization reaction.
In some embodiments, the initiator is a photoinitiator, and the non-crosslinked polymer in the semi-interpenetrating polymer network is capable of undergoing a polymerization reaction upon exposure to specific light.
In some embodiments, the non-crosslinked polymers in the semi-interpenetrating polymer network include: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer.
In some embodiments, the crosslinked polymer in the semi-interpenetrating polymer network is an acrylate adhesive.
In some embodiments, the release layer material further comprises: silicon-containing acrylates.
In some embodiments, the acrylate based adhesive is present in an amount ranging from 20 to 30 mass% based on the total mass of the release layer material, the silicon containing acrylate is present in an amount ranging from 30 to 40 mass% based on the total mass of the release layer material, the non-crosslinked polymer in the semi-interpenetrating polymer network is present in an amount ranging from 10 to 30 mass% based on the total mass of the release layer material, the crosslinking agent is present in an amount ranging from 5 to 10 mass% based on the total mass of the release layer material, and the photoinitiator is present in an amount ranging from 1 to 5 mass% based on the total mass of the release layer material.
In some embodiments, the non-crosslinked polymers in the semi-interpenetrating polymer network include: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer.
In some embodiments, the crosslinking agent comprises: any one of a metal ion crosslinking agent, an isocyanate crosslinking agent, an amine crosslinking agent, and an aziridine crosslinking agent.
In some embodiments, the photoinitiator comprises: any one of 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-methyl-1- [4- (methylthio) phenyl ] -2- (4-morpholinyl) -1-propanone, benzil bismethyl ether, benzophenone, 2-isopropyl thioxanthone, and 2,4,6 (trimethylbenzoyl) diphenylphosphine oxide.
Drawings
Fig. 1 is a flow chart of a method of manufacturing a display substrate according to an embodiment of the present disclosure;
FIGS. 2 a-2 d are schematic views of the product structure at various stages of the preparation process shown in FIG. 1;
FIG. 3 is a flow chart of another method of fabricating a display substrate according to an embodiment of the present disclosure;
FIGS. 4 a-4 d are schematic structural views of the product at various stages of the manufacturing process shown in FIG. 3;
FIGS. 5a and 5b are reaction path diagrams of a portion of the components in an embodiment of the disclosure;
the reference signs are: 1. a carrier substrate; 2. release layer material; 21. an adhesive; 22. microspheres; 3. a flexible substrate; 4. the functional layer is displayed.
Detailed Description
For a better understanding of the technical aspects of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
It should be noted that, the embodiments of the present disclosure may be referred to each other, and the description of the same parts is not repeated.
Referring to fig. 1, an embodiment of the present disclosure provides a method for manufacturing a display substrate, including the following steps.
In step S11, referring to fig. 2a, a layer of release layer material 2 is formed on the carrier substrate 1, the release layer material 2 includes an adhesive 21 and microspheres 22 dispersed in the adhesive 21, and the microspheres 22 have an elastic shell and an expanding agent (not shown) wrapped by the elastic shell.
The adhesive 21 is used for adhering the flexible substrate 3 to the upper surface of the release layer material 2 in the subsequent process. In this embodiment, there is no particular requirement for the material of the adhesive 21, and a specific example is a silicone acrylate adhesive 21.
The elastic shell needs to be enlarged in the subsequent process, so the material should have certain elasticity. The material of choice for the elastic shell is, for example, an acrylonitrile copolymer.
It should be noted that the microspheres 22 may be standard spheres or non-standard spheres, which is not limited in this disclosure.
The expanding agent can be solid or liquid, and can be triggered to obtain gas in the subsequent process, so that the elastic shell is enlarged. The composition and the principle of action of the expanding agent are illustrated in the subsequent steps.
In step S12, referring to fig. 2b, the flexible substrate 3 is formed on the side of the release layer material 2 facing away from the carrier substrate 1.
For example, a layer of Polyimide (PI) is coated on the release layer material 2 and cured by heating. Of course, the material of the flexible substrate 3 is not limited thereto.
In step S13, referring to fig. 2c, the display functional layer 4 is formed on the side of the flexible substrate 3 facing away from the carrier substrate 1.
The display function layer 4 includes, for example, a driver circuit layer including a thin film transistor, a subpixel including an organic light emitting diode, and the like. The present disclosure is not particularly limited as to the structure of the display function layer 4 that can be manufactured on the flexible substrate 3.
A thin film encapsulation layer (not shown) covering the display functional layer 4 is also typically formed after the display functional layer 4 is formed to protect the organic light emitting diode, the thin film transistor, and the like in the display functional layer 4. The thin film encapsulation layer is formed by, for example, alternately an organic thin film encapsulation layer and an inorganic thin film encapsulation layer. This disclosure is also not limited thereto.
In step S14, referring to fig. 2d, the swelling agent is heated to swell the elastic shell beyond the surface of the adhesive 21 facing away from the carrier substrate 1.
The expansion agent is, for example, a solid explosive that can chemically react to produce a gas upon heating. Of course, the severity of the reaction needs to be carefully controlled so as not to damage the elastomeric shell.
Specifically, the heating source can be placed below the carrier substrate 1, and the release layer material 2 is heated through the carrier substrate 1, so that the expansion agent is heated.
In some more safely controllable embodiments, the material of the expansion agent comprises: a liquid having a boiling point between 50 ℃ and 100 ℃. Namely, a liquid material with a low boiling point is used as the expanding agent. When the liquid drop materials are heated and gasified, the elastic shell can be enlarged.
In some embodiments, the material of the swelling agent comprises: any one of trichloroethane, ethanol and isopropanol.
It is necessary to experiment the material, content of the expanding agent and the temperature of heating, etc. to find suitable parameters so that the elastic shell can be non-cracking and can exceed the height of the adhesive 21 to a moderate degree. If the height of the elastic housing above the adhesive 21 is too low, there is a limit to reducing the adhesion between the flexible substrate 3 and the adhesive 21. If the height of the elastic shell exceeds the height of the adhesive 21, the lower surface of the flexible substrate 3 is seriously uneven after being peeled off.
Based on this, in some embodiments, the ratio of the diameter D1 of the elastic shell before the release layer material 2 is heated to the thickness h of the adhesive 21 is between 30% and 60%; the difference between the diameter D2 of the elastic shell before the release layer material 2 is heated and the thickness h of the adhesive 21 is between 0.1um and 0.5 um.
In step S15, see fig. 2d, the flexible substrate 3 is separated from the heated release layer material 2. Since the contact area between the upper surface of the adhesive 21 and the flexible substrate 3 becomes smaller, the adhesive force therebetween becomes weaker, and peeling of the flexible substrate 3 becomes easier. Furthermore, compared with laser equipment, equipment used in the preparation method is simpler and lower in cost.
Based on the same inventive concept as the previous embodiment, an embodiment of the present disclosure further provides a release layer material, including: the adhesive comprises an adhesive and microspheres dispersed in the adhesive, wherein the microspheres are provided with an elastic shell and an expanding agent wrapped by the elastic shell, and the expanding agent is heated to generate gas so as to expand the elastic shell.
It should be noted that the release layer material refers to a material used for a release layer disposed between a carrier substrate and a flexible substrate of a flexible display substrate when the flexible display substrate is manufactured. The purpose of setting up from type layer is the separation of the flexible display substrate of being convenient for with the carrier substrate.
In some embodiments, the material of the resilient shell comprises: a copolymer of acrylonitrile.
In some embodiments, the material of the swelling agent comprises: a liquid having a boiling point between 50 ℃ and 100 ℃.
In some embodiments, the material of the swelling agent comprises: any one of trichloroethane, ethanol and isopropanol.
Embodiments of the present disclosure also provide a method for manufacturing a display substrate, referring to fig. 3, including the following steps.
In step S21, referring to fig. 4a, a layer of release layer material 2 is formed on the carrier substrate 1, the release layer material 2 includes a semi-interpenetrating polymer network, a cross-linking agent and a photoinitiator, a cross-linked polymer in the semi-interpenetrating polymer network is an adhesive, and a non-cross-linked polymer in the semi-interpenetrating polymer network can undergo a polymerization reaction.
By semi-interpenetrating polymer network is meant that of the two polymers that make up the interpenetrating network, one polymer is crosslinked and the other polymer is linear, non-crosslinked (e.g., is a polyfunctional oligomer). The conditions for initiating the polymerization of the linear non-crosslinked polymer are, for example, heat treatment or irradiation with specific light. In contrast, the heat treatment method is preferably an excitation method in which specific light is irradiated, because the display functional layer 4 in the display substrate is damaged. The following description will be made by taking as an example a case where a non-crosslinked polymer in a semi-interpenetrating polymer network can undergo a polymerization reaction under specific light irradiation. The specific light is, for example, ultraviolet light. Correspondingly, the initiator is required to be a photoinitiator, and the carrier substrate 1 is a transparent substrate. So that irradiation of a specific light is applied to the release layer material 2 from the side of the carrier substrate 1.
The crosslinking agent is also called a bridging agent, and has the function of forming a bridge bond between polymer molecular chains, and is an insoluble substance of which the polymer is changed into a three-dimensional structure. The initiator is also called a radical initiator and functions to initiate polymerization.
In step S22, referring to fig. 4b, the flexible substrate 3 is formed on the side of the release layer material 2 facing away from the carrier substrate 1. Referring to step S12, this step may be performed according to existing processes.
In step S23, referring to fig. 4c, the display function layer 4 is formed on the side of the flexible substrate 3 facing away from the carrier substrate 1. Referring to step S13, this step may be performed according to existing processes.
In step S24, referring to fig. 4d, the release layer material 2 is treated to polymerize the non-crosslinked polymer in the semi-interpenetrating polymer network. The method specifically comprises the following steps: the carrier substrate 1 is used to irradiate the release layer material 2 with specific light to form the interpenetrating polymer network. In this process, the synergistic relationship between the molecular chains in the initial state is broken. The molecular chain viscosity is high in the semi-interpenetrating polymer network state, and the molecular chain viscosity is low in the interpenetrating polymer network state.
In step S25, see fig. 4d, the flexible substrate 3 is separated from the treated release layer material 2. The flexible substrate 3 is more easily peeled off due to the reduced viscosity of the release layer material 2. It is apparent that the cost of the apparatus is reduced by the process using, for example, ultraviolet light irradiation, as compared with the process using laser light irradiation.
In some embodiments, the non-crosslinked polymers in the semi-interpenetrating polymer network include: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer. These components are capable of undergoing polymerization under ultraviolet light irradiation.
In some embodiments, the crosslinked polymer in the semi-interpenetrating polymer network is an acrylate adhesive.
The molecular formula is as follows:
this is because the chemical bond of the acrylate adhesive is broken under the irradiation of ultraviolet rays, and the viscosity of the acrylate adhesive itself is also reduced. This further reduces the viscosity of the release layer material 2.
Referring to fig. 5a, the synthetic route of the acrylate adhesive is, for example: butyl acrylate, 1R, 2S, 4S) -1,7, 7-trimethylbicyclo [2.2.1] heptane-2-yl acrylate, 3-methylbut-3-en-1-ol are subjected to polymerization reaction, then are subjected to esterification reaction with 5-cyano-1- (isocyanatomethyl) -1,3, 3-trimethylcyclohexane to generate an intermediate, and then are subjected to reaction with triacrylate (PETA) to form the acrylate adhesive.
In some embodiments, the release layer material 2 further comprises: silicon-containing acrylates. The molecular formula is as follows:
the silicon-containing acrylate is used as a low surface energy molecule, and can improve the characteristics of high temperature resistance, water resistance, oil resistance and the like of the acrylate adhesive. In addition, in the above treatment process, in the process of reducing the viscosity of the release layer material 2, the connection between molecular chains is tighter and is in a dense network shape, so that the silicon-containing acrylate as a small molecule does not migrate to the surface of the release layer material 2, and further does not remain on the bottom surface of the flexible substrate 3 when the flexible substrate 3 is peeled off.
Referring to fig. 5b, the synthetic route for silicon-containing acrylates is, for example: butyl acrylate, heptane-2-yl (1R, 2S, 4S) -1,7, 7-trimethylbicyclo [2.2.1] acrylate, 3-methylbut-3-en-1-ol, and hydroxybutyl-2-ylmethyl isobutyrate, are polymerized and reacted with disiloxane to form silicon-containing acrylates.
In some embodiments, the acrylate adhesive is present in an amount ranging from 20 to 30 mass% based on the total mass of the release layer material 2, the silicon-containing acrylate is present in an amount ranging from 30 to 40 mass% based on the total mass of the release layer material 2, the non-crosslinked polymer in the semi-interpenetrating polymer network is present in an amount ranging from 10 to 30 mass% based on the total mass of the release layer material 2, the crosslinking agent is present in an amount ranging from 5 to 10 mass% based on the total mass of the release layer material 2, and the photoinitiator is present in an amount ranging from 1 to 5 mass% based on the total mass of the release layer material 2.
Experiment shows that the viscosity of the prepared release layer material 2 can be obviously different before and after treatment under the proportion of the content range.
In some embodiments, the crosslinking agent comprises: any one of a metal ion crosslinking agent, an isocyanate crosslinking agent, an amine crosslinking agent, and an aziridine crosslinking agent.
In some embodiments, the photoinitiator comprises: any one of 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-methyl-1- [4- (methylthio) phenyl ] -2- (4-morpholinyl) -1-propanone, benzil bismethyl ether, benzophenone, 2-isopropyl thioxanthone, and 2,4,6 (trimethylbenzoyl) diphenylphosphine oxide.
The embodiment of the invention also provides a release layer material, which comprises: the adhesive comprises a semi-interpenetrating polymer network, a cross-linking agent and an initiator, wherein the cross-linked polymer in the semi-interpenetrating polymer network is an adhesive.
It should be noted that the release layer material refers to a material used for a release layer disposed between a carrier substrate and a flexible substrate of a flexible display substrate when the flexible display substrate is manufactured. The purpose of setting up from type layer is the separation of the flexible display substrate of being convenient for with the carrier substrate.
In some embodiments, the initiator is a photoinitiator, and the non-crosslinked polymer in the semi-interpenetrating polymer network is capable of undergoing a polymerization reaction upon exposure to specific light.
In some embodiments, the non-crosslinked polymers in the semi-interpenetrating polymer network include: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer.
In some embodiments, the crosslinked polymer in the semi-interpenetrating polymer network is an acrylate adhesive.
In some embodiments, the release layer material further comprises: silicon-containing acrylates.
In some embodiments, the acrylate based adhesive is present in an amount ranging from 20 to 30 mass% based on the total mass of the release layer material, the silicon containing acrylate is present in an amount ranging from 30 to 40 mass% based on the total mass of the release layer material, the non-crosslinked polymer in the semi-interpenetrating polymer network is present in an amount ranging from 10 to 30 mass% based on the total mass of the release layer material, the crosslinking agent is present in an amount ranging from 5 to 10 mass% based on the total mass of the release layer material, and the photoinitiator is present in an amount ranging from 1 to 5 mass% based on the total mass of the release layer material.
In some embodiments, the non-crosslinked polymers in the semi-interpenetrating polymer network include: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer.
In some embodiments, the crosslinking agent comprises: any one of a metal ion crosslinking agent, an isocyanate crosslinking agent, an amine crosslinking agent, and an aziridine crosslinking agent.
In some embodiments, the photoinitiator comprises: any one of 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-methyl-1- [4- (methylthio) phenyl ] -2- (4-morpholinyl) -1-propanone, benzil bismethyl ether, benzophenone, 2-isopropyl thioxanthone, and 2,4,6 (trimethylbenzoyl) diphenylphosphine oxide.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (13)
1. A method for preparing a display substrate is characterized by comprising the following steps:
forming a layer of release layer material on a bearing substrate, wherein the release layer material comprises an adhesive and microspheres dispersed in the adhesive, and the microspheres are provided with an elastic shell and an expanding agent wrapped by the elastic shell;
forming a flexible substrate on one side of the release layer material, which is back to the bearing substrate;
forming a display function layer on one side, back to the bearing substrate, of the flexible substrate;
heating the expanding agent to expand the elastic shell and extend the elastic shell beyond the surface of the adhesive opposite to the bearing substrate;
and separating the flexible substrate from the heated release layer material.
2. The method for preparing the rubber gasket material of claim 1, wherein the ratio of the diameter D1 of the elastic shell before the release layer material is heated to the thickness h of the adhesive is between 30% and 60%; the difference between the diameter D2 of the elastic shell before the release layer material is heated and the thickness h of the adhesive is between 0.1um and 0.5 um.
3. A release layer material, comprising: the heat-insulation material comprises an adhesive and microspheres dispersed in the adhesive, wherein the microspheres are provided with an elastic shell and an expanding agent wrapped by the elastic shell, and the expanding agent is heated to expand the elastic shell.
4. The release layer material of claim 6, wherein the material of the elastic shell comprises: a copolymer of acrylonitrile.
5. The release layer material according to claim 6, wherein the material of the swelling agent comprises: a liquid having a boiling point between 50 ℃ and 100 ℃.
6. The release layer material of claim 8, wherein the material of the swelling agent comprises: any one of trichloroethane, ethanol and isopropanol.
7. A method for preparing a display substrate is characterized by comprising the following steps:
forming a layer of release layer material on a bearing substrate, wherein the release layer material comprises a semi-interpenetrating polymer network, a cross-linking agent and an initiator, a cross-linked polymer in the semi-interpenetrating polymer network is an adhesive, and a non-cross-linked polymer in the semi-interpenetrating polymer network can perform polymerization reaction;
forming a flexible substrate on one side of the release layer material, which is back to the bearing substrate;
forming a display function layer on one side, back to the bearing substrate, of the flexible substrate;
treating the release layer material to polymerize the non-crosslinked polymer in the semi-interpenetrating polymer network;
and separating the flexible substrate from the processed release layer material.
8. The preparation method according to claim 7, wherein the initiator is a photoinitiator, the carrier substrate is a transparent substrate, and the non-crosslinked polymer in the semi-interpenetrating polymer network can be polymerized under the condition of irradiation of specific light; the polymerizing the non-crosslinked polymer in the semi-interpenetrating polymer network comprises: applying the specific light irradiation to the non-crosslinked polymer in the semi-interpenetrating polymer network.
9. A release layer material, comprising: the adhesive comprises a semi-interpenetrating polymer network, a cross-linking agent and an initiator, wherein a cross-linked polymer in the semi-interpenetrating polymer network is an adhesive, and a non-cross-linked polymer in the semi-interpenetrating polymer network can be subjected to polymerization reaction.
10. The release layer material according to claim 9, wherein the initiator is a photoinitiator, and the non-crosslinked polymer in the semi-interpenetrating polymer network is capable of undergoing polymerization under specific light irradiation.
11. The release layer material according to claim 10, wherein the non-crosslinked polymer in the semi-interpenetrating polymer network comprises: any one of aliphatic urethane acrylate oligomer, aromatic urethane acrylate oligomer, pure acrylate oligomer, pattern acrylate oligomer, and polyester acrylate oligomer.
12. The release layer material according to claim 10, wherein the cross-linked polymer in the semi-interpenetrating polymer network is an acrylate adhesive.
13. The release layer material of claim 12, further comprising: silicon-containing acrylates.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020192463A1 (en) * | 1999-03-01 | 2002-12-19 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
| US20040038020A1 (en) * | 2000-11-08 | 2004-02-26 | Akihisa Murata | Heat-peelable pressure-sensitive adhesive sheet |
| US20160137887A1 (en) * | 2013-08-05 | 2016-05-19 | Lg Chem, Ltd. | PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME (As Amended) |
| CN110305588A (en) * | 2019-07-12 | 2019-10-08 | 太仓斯迪克新材料科技有限公司 | The ultraviolet dissociation contact adhesive of one kind and adhesive tape |
-
2019
- 2019-11-19 CN CN201911132000.6A patent/CN110828707A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020192463A1 (en) * | 1999-03-01 | 2002-12-19 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
| US20040038020A1 (en) * | 2000-11-08 | 2004-02-26 | Akihisa Murata | Heat-peelable pressure-sensitive adhesive sheet |
| US20160137887A1 (en) * | 2013-08-05 | 2016-05-19 | Lg Chem, Ltd. | PRESSURE-SENSITIVE ADHESIVE FILM AND METHOD OF MANUFACTURING ORGANIC ELECTRONIC DEVICE USING THE SAME (As Amended) |
| CN110305588A (en) * | 2019-07-12 | 2019-10-08 | 太仓斯迪克新材料科技有限公司 | The ultraviolet dissociation contact adhesive of one kind and adhesive tape |
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