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CN110828636A - Commercial display oriented device based on display product - Google Patents

Commercial display oriented device based on display product Download PDF

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Publication number
CN110828636A
CN110828636A CN201911296130.3A CN201911296130A CN110828636A CN 110828636 A CN110828636 A CN 110828636A CN 201911296130 A CN201911296130 A CN 201911296130A CN 110828636 A CN110828636 A CN 110828636A
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Prior art keywords
display
medium
film
light
emitting device
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CN201911296130.3A
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Chinese (zh)
Inventor
谭海麟
冯艳荣
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Shenzhen Hengtai New Material Technology Co Ltd
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Shenzhen Hengtai New Material Technology Co Ltd
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Priority to CN201911296130.3A priority Critical patent/CN110828636A/en
Publication of CN110828636A publication Critical patent/CN110828636A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10W90/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0362Manufacture or treatment of packages of encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

一种基于显示产品面向商业显示的器件,它涉及显示技术领域。它包含PCB基板、发光器件、保护介质、覆膜介质,PCB基板上表面通过锡焊固定发光器件,发光器件外部设置保护介质,保护介质外表面设有覆膜介质,覆膜介质内分散若干散射粒子。采用上述技术方案后,本发明的有益效果为:它的结构设计合理,减少了封装环节,可以解决目前封装环节出现的不可控异常因素,并大幅度缩短了制造环节和周期,可以实现平整度要求及改变目前点光源显示的缺点,可实现LED显示屏体更好面向商业显示的应用和推广。

Figure 201911296130

A commercial display-oriented device based on display products relates to the field of display technology. It includes a PCB substrate, a light-emitting device, a protective medium, and a film-coated medium. The light-emitting device is fixed on the upper surface of the PCB substrate by soldering, a protective medium is arranged outside the light-emitting device, and a film-coated medium is arranged on the outer surface of the protective medium. particle. After adopting the above technical scheme, the beneficial effects of the present invention are: its structural design is reasonable, the packaging links are reduced, the uncontrollable abnormal factors currently occurring in the packaging links can be solved, the manufacturing links and cycles are greatly shortened, and the flatness can be achieved. Requirements and change the shortcomings of the current point light source display, can realize the application and promotion of the LED display body for better commercial display.

Figure 201911296130

Description

一种基于显示产品面向商业显示的器件A commercial display-oriented device based on display products

技术领域technical field

本发明涉及显示技术领域,具体涉及一种基于显示产品面向商业显示的器件。The present invention relates to the field of display technology, in particular to a commercial display-oriented device based on a display product.

背景技术Background technique

目前小间距显示屏主要使用的是分离式器件显示或正装芯片焊线方式显示,其显示效果存在明显的点光源状态,在目前显示屏面向商业显示推广中不能达到终端使用客户的需求,制约了小间距显示市场的推广,本发明可以有效的解决目前小间距显示存在点光源状发光及商业显示客户群体要求的屏体轻薄、平整等。At present, small-pitch display screens mainly use separate device display or positive chip bonding wire display, and the display effect has obvious point light source state. At present, the display screen cannot meet the needs of end-use customers in the current commercial display promotion, which restricts With the promotion of the small-pitch display market, the present invention can effectively solve the current small-pitch display with point-light-like light-emitting and commercial display customer groups that require a thin, flat screen and the like.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于针对现有技术的缺陷和不足,提供一种基于显示产品面向商业显示的器件,它的结构设计合理,彻底改变传统的器件型发光显示,减少了封装环节,可以解决目前封装环节出现的不可控异常因素,并大幅度缩短了制造环节和周期,同时采用了完全水平的保护介质和覆膜介质,可以实现平整度要求及改变目前点光源显示的缺点,可实现LED显示屏体更好面向商业显示的应用和推广。The purpose of the present invention is to provide a commercial display-oriented device based on display products in view of the defects and deficiencies of the prior art. Uncontrollable abnormal factors appear in the link, and greatly shorten the manufacturing process and cycle, and at the same time use a completely horizontal protective medium and film-coated medium, which can meet the flatness requirements and change the shortcomings of the current point light source display, and can realize the LED display. It is better for the application and promotion of commercial display.

为实现上述目的,本发明采用以下技术方案是:它包含PCB基板1、发光器件2、保护介质3、覆膜介质4,PCB基板1上表面通过锡焊固定发光器件2,发光器件2外部设置保护介质3,保护介质3外表面设有覆膜介质4,覆膜介质4内分散若干散射粒子。In order to achieve the above object, the present invention adopts the following technical solutions: it includes a PCB substrate 1, a light-emitting device 2, a protective medium 3, and a film-coated medium 4, the light-emitting device 2 is fixed on the upper surface of the PCB substrate 1 by soldering, and the light-emitting device 2 is externally arranged. The protective medium 3 is provided with a film-coated medium 4 on the outer surface of the protective medium 3, and a plurality of scattering particles are dispersed in the film-coated medium 4.

所述的保护介质3包含扩散粉、色剂,且保护介质3的厚度为2-5mm。The protective medium 3 includes diffusion powder and toner, and the thickness of the protective medium 3 is 2-5 mm.

所述的覆膜介质4内分散的散射粒子的粒径为1-10μm,覆膜介质4的厚度为50-200μm,且覆膜介质4远离PCB基板1的外表面为向远离PCB基板1方向凸起的圆弧形。The particle size of the scattering particles dispersed in the film-covered medium 4 is 1-10 μm, the thickness of the film-covered medium 4 is 50-200 μm, and the outer surface of the film-covered medium 4 away from the PCB substrate 1 is a direction away from the PCB substrate 1 . Raised arc shape.

本发明的工作原理:倒装焊接芯片直接焊接在基板上,包括保护介质及用于将LED发光芯片发出的光均匀散射的薄膜介质和覆膜工艺,从而将目前显示器件发光体形成的点光源转换成面光源,并使得显示屏体适用于商业显示。The working principle of the present invention: the flip-chip welding chip is directly welded on the substrate, including a protective medium, a thin film medium and a coating process for uniformly scattering the light emitted by the LED light-emitting chip, so as to convert the point light source formed by the current display device illuminant. Converted into a surface light source and make the display body suitable for commercial display.

采用上述技术方案后,本发明有益效果为:它的结构设计合理,彻底改变传统的器件型发光显示,减少了封装环节,可以解决目前封装环节出现的不可控异常因素,并大幅度缩短了制造环节和周期,同时采用了完全水平的保护介质和覆膜介质,可以实现平整度要求及改变目前点光源显示的缺点,可实现LED显示屏体更好面向商业显示的应用和推广。After adopting the above technical solution, the present invention has the following beneficial effects: its structural design is reasonable, the traditional device-type light-emitting display is completely changed, the encapsulation link is reduced, the uncontrollable abnormal factors in the current encapsulation link can be solved, and the manufacturing process is greatly shortened. At the same time, it adopts a completely horizontal protective medium and film-coated medium, which can meet the flatness requirements and change the shortcomings of the current point light source display, and can realize the application and promotion of the LED display body for better commercial display.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

图1是本发明的结构示意图。Figure 1 is a schematic structural diagram of the present invention.

附图标记说明:PCB基板1、发光器件2、保护介质3、覆膜介质4。Description of reference numerals: PCB substrate 1 , light-emitting device 2 , protective medium 3 , film-coated medium 4 .

具体实施方式Detailed ways

参看图1所示,本具体实施方式采用的技术方案是:它由PCB基板1、发光器件2、保护介质3、覆膜介质4组成,PCB基板1上表面通过锡焊固定有整齐排列的发光器件2,发光器件2外部设有保护介质3,保护介质3外表面设置覆膜介质4,覆膜介质4内部分散有若干散射粒子。Referring to FIG. 1, the technical solution adopted in this specific embodiment is: it consists of a PCB substrate 1, a light-emitting device 2, a protective medium 3, and a film-coated medium 4, and the upper surface of the PCB substrate 1 is fixed by soldering. In the device 2, a protective medium 3 is provided outside the light-emitting device 2, a film-coated medium 4 is provided on the outer surface of the protective medium 3, and a number of scattering particles are dispersed inside the film-coated medium 4.

所述的保护介质3包含用于扩散作用的扩散粉、色剂,并且保护介质3的厚度在2-5μm之间。The protective medium 3 contains diffusing powder and toner for diffusion, and the thickness of the protective medium 3 is between 2-5 μm.

所述的覆膜介质4内分散的散射粒子的粒径在1-10μm之间,覆膜介质4的厚度在50-200μm之间,并且覆膜介质4远离PCB基板1的外表面为向远离PCB基板1方向凸起的圆弧形。The particle size of the scattering particles dispersed in the film-coated medium 4 is between 1-10 μm, the thickness of the film-covered medium 4 is between 50-200 μm, and the film-covered medium 4 is far away from the outer surface of the PCB substrate 1 . A circular arc that protrudes in the direction of PCB substrate 1.

本发明的工作原理:倒装焊接芯片直接焊接在基板上,包括保护介质及用于将LED发光芯片发出的光均匀散射的薄膜介质和覆膜工艺,从而将目前显示器件发光体形成的点光源转换成面光源,并使得显示屏体适用于商业显示。The working principle of the present invention: the flip-chip welding chip is directly welded on the substrate, including a protective medium, a thin-film medium and a coating process for uniformly scattering the light emitted by the LED light-emitting chip, so that the point light source formed by the illuminant of the current display device is formed. Converted into a surface light source and make the display body suitable for commercial display.

采用上述技术方案后,本发明有益效果为:它的结构设计合理,彻底改变传统的器件型发光显示,减少了封装环节,可以解决目前封装环节出现的不可控异常因素,并大幅度缩短了制造环节和周期,同时采用了完全水平的保护介质和覆膜介质,可以实现平整度要求及改变目前点光源显示的缺点,可实现LED显示屏体更好面向商业显示的应用和推广。After adopting the above technical solution, the present invention has the following beneficial effects: its structural design is reasonable, the traditional device-type light-emitting display is completely changed, the encapsulation link is reduced, the uncontrollable abnormal factors in the current encapsulation link can be solved, and the manufacturing process is greatly shortened. At the same time, it adopts a completely horizontal protective medium and film-coated medium, which can meet the flatness requirements and change the shortcomings of the current point light source display, and can realize the application and promotion of the LED display body for better commercial display.

以上所述,仅用以说明本发明的技术方案而非限制,本领域普通技术人员对本发明的技术方案所做的其它修改或者等同替换,只要不脱离本发明技术方案的精神和范围,均应涵盖在本发明的权利要求范围当中。The above is only used to illustrate the technical solution of the present invention and not to limit it. Other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solution of the present invention, as long as they do not depart from the spirit and scope of the technical solution of the present invention, should be Included within the scope of the claims of the present invention.

Claims (3)

1. A device for commercial display based on display products, characterized in that: the LED light-emitting device comprises a PCB (printed circuit board) substrate (1), a light-emitting device (2), a protective medium (3) and a film-coated medium (4), wherein the light-emitting device (2) is fixed on the upper surface of the PCB substrate (1) through tin soldering, the protective medium (3) is arranged outside the light-emitting device (2), the film-coated medium (4) is arranged on the outer surface of the protective medium (3), and a plurality of scattering particles are dispersed in the film-coated medium (4).
2. A display product oriented commercial display device according to claim 1, wherein: the protective medium (3) comprises diffusion powder and a toner, and the thickness of the protective medium (3) is 2-5 mm.
3. A display product oriented commercial display device according to claim 1, wherein: the particle size of scattering particles dispersed in the film-coated medium (4) is 1-10 μm, the thickness of the film-coated medium (4) is 50-200 μm, and the outer surface of the film-coated medium (4) far away from the PCB substrate (1) is in the shape of a circular arc protruding towards the direction far away from the PCB substrate (1).
CN201911296130.3A 2019-12-16 2019-12-16 Commercial display oriented device based on display product Pending CN110828636A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201911296130.3A CN110828636A (en) 2019-12-16 2019-12-16 Commercial display oriented device based on display product

Publications (1)

Publication Number Publication Date
CN110828636A true CN110828636A (en) 2020-02-21

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120161182A1 (en) * 2010-12-27 2012-06-28 Canon Kabushiki Kaisha Display device
CN103715340A (en) * 2013-12-16 2014-04-09 常州市武进区半导体照明应用技术研究院 LED packaging unit and LED packaging method and array surface light source
CN107861291A (en) * 2017-10-24 2018-03-30 华为技术有限公司 Backlight module, display screen and terminal

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120161182A1 (en) * 2010-12-27 2012-06-28 Canon Kabushiki Kaisha Display device
CN103715340A (en) * 2013-12-16 2014-04-09 常州市武进区半导体照明应用技术研究院 LED packaging unit and LED packaging method and array surface light source
CN107861291A (en) * 2017-10-24 2018-03-30 华为技术有限公司 Backlight module, display screen and terminal

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Application publication date: 20200221