CN110828440A - Packaged LED integrated with constant current control chip - Google Patents
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- CN110828440A CN110828440A CN201910827947.2A CN201910827947A CN110828440A CN 110828440 A CN110828440 A CN 110828440A CN 201910827947 A CN201910827947 A CN 201910827947A CN 110828440 A CN110828440 A CN 110828440A
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- 239000002184 metal Substances 0.000 claims abstract description 50
- 239000000084 colloidal system Substances 0.000 claims abstract description 14
- 238000004021 metal welding Methods 0.000 claims description 6
- 239000011324 bead Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 230000007812 deficiency Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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Abstract
Description
技术领域:Technical field:
本发明涉及LED灯技术领域,尤其涉及一种集成恒流控制芯片的封装LED。The invention relates to the technical field of LED lamps, in particular to a packaged LED integrated with a constant current control chip.
背景技术:Background technique:
见图1所示,目前市面上LED灯串产品都是由多个普通LED并联于电子线上 完成,由于电子线之间存在电阻,电子线到负载之间的线路越长,串联的电阻越 大,根据欧姆定律U=I*R,电阻越大,产生的压降也越大。见图2所示,假设每 段产生的线路电阻为0.01欧姆,每颗LED电流为20mA,那么第一颗灯正负之间 线阻为0.02欧姆,那么电压经过第1颗灯将产生0.02*20=0.4mV,经过第2颗灯 产生压降为(0.02*2)*(20*2)=1.6mV,依次往下,经过第50颗产生的压降为 (0.02*50)*(20*50)=1V,假设电源电压为5V,那么第50颗灯分到的电压只有4V, 那么第50颗灯的亮度一定会比第一颗要暗。这样LED的亮度一致性就会差异较 大,假设后面再并联到第100颗灯,产生的压降会使LED亮度越来越明显(如图 2)。另外由于LED制作工艺上不可能保证每颗LED的VF值一致,在电压比较稳 定的情况下,每颗灯珠都可能由于VF值差异而导致流过电流不一致。当电源电 压波动不稳定的情况下,LED很容易因为电流过大而烧坏。导致线路的可靠性低。As shown in Figure 1, the current LED light string products on the market are completed by multiple ordinary LEDs connected in parallel to the electronic wire. Due to the resistance between the electronic wires, the longer the line between the electronic wire and the load, the longer the series resistance will be. Large, according to Ohm's law U=I*R, the greater the resistance, the greater the voltage drop. As shown in Figure 2, assuming that the line resistance generated by each segment is 0.01 ohms, and the current of each LED is 20mA, then the line resistance between the positive and negative of the first lamp is 0.02 ohms, then the voltage through the first lamp will generate 0.02* 20=0.4mV, the voltage drop after the second lamp is (0.02*2)*(20*2)=1.6mV, going down in order, the voltage drop after the 50th lamp is (0.02*50)*(20 *50)=1V, assuming that the power supply voltage is 5V, then the voltage shared by the 50th lamp is only 4V, then the brightness of the 50th lamp will definitely be darker than the first one. In this way, the brightness consistency of the LEDs will vary greatly. If the 100th lamp is connected in parallel later, the resulting voltage drop will make the LED brightness more and more obvious (see Figure 2). In addition, because the LED manufacturing process cannot guarantee the same VF value of each LED, under the condition that the voltage is relatively stable, the current flowing through each lamp may be inconsistent due to the difference in VF value. When the power supply voltage fluctuates and is unstable, the LED is easy to burn out due to excessive current. The reliability of the line is low.
本发明人为了克服现有产品所存在的不足,经过不断研发,提出以下技术方 案。In order to overcome the deficiencies existing in the existing products, the inventor of the present invention proposes the following technical solutions through continuous research and development.
发明内容:Invention content:
本发明所要解决的技术问题在于克服现有技术所存在的不足,提供一种集成 恒流控制芯片的封装LED。The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and provide a packaged LED with an integrated constant current control chip.
为了解决上述技术问题,本发明采用了下述技术方案:一种集成恒流控 制芯片的封装LED,该封装LED包括:LED发光芯片、用于安装LED发光芯片的 第一金属支架、恒流控制芯片和用于安装恒流控制芯片的第二金属支架,所述的 LED发光芯片、恒流控制芯片、第一金属支架、第二金属支架通过导线电性连, 且通过胶体将上述的LED发光芯片、恒流控制芯片、第一金属支架、第二金属支 架以及导线封装;所述的第一金属支架和第二金属支架至少部分显露于胶体外, 构成该封装LED的电极。In order to solve the above technical problems, the present invention adopts the following technical scheme: a packaged LED integrating a constant current control chip, the packaged LED includes: an LED light-emitting chip, a first metal bracket for installing the LED light-emitting chip, a constant current control chip The chip and the second metal bracket for installing the constant current control chip, the LED light-emitting chip, the constant current control chip, the first metal bracket, and the second metal bracket are electrically connected by wires, and the above-mentioned LEDs are illuminated by colloid. The chip, the constant current control chip, the first metal support, the second metal support and the wire package; the first metal support and the second metal support are at least partially exposed outside the colloid and constitute the electrodes of the packaged LED.
进一步而言,上述技术方案中,所述的导线包括:用于第一金属支架与LED 发光芯片其中一电极连接的第一电极导线;用于LED发光芯片另一电极与恒流控 制芯片其中一电极连接的第二电极导线;用于恒流控制芯片另一电极与第二金属 支架连接的第三电极导线。Further, in the above technical solution, the wire includes: a first electrode wire used for connecting the first metal bracket and one electrode of the LED light-emitting chip; one of the other electrode of the LED light-emitting chip and the constant current control chip. The second electrode wire connected to the electrode; the third electrode wire used for connecting the other electrode of the constant current control chip to the second metal bracket.
进一步而言,上述技术方案中,所述的第一金属支架显露于胶体外的部分构 成该封装LED的金属焊脚,用于连接到电源的正极,所述的第一电极导线连接于 第一金属支架与LED发光芯片的正极之间;所述的第二金属支架显露于胶体外的 部分构成该封装LED的金属焊脚,用于连接到电源的负极,所述的第三导线连接 于第二金属支架与恒流控制芯片的负极之间;所述的第二导线连接与LED发光芯 片的负极与恒流控制芯片正极之间。Further, in the above technical solution, the part of the first metal bracket exposed outside the colloid constitutes the metal welding pin of the packaged LED, which is used to connect to the positive pole of the power supply, and the first electrode wire is connected to the first electrode wire. Between the metal bracket and the positive pole of the LED light-emitting chip; the part of the second metal bracket exposed outside the colloid constitutes the metal welding pin of the packaged LED, which is used to connect to the negative pole of the power supply, and the third wire is connected to the first Between the two metal brackets and the negative electrode of the constant current control chip; the second wire is connected between the negative electrode of the LED light-emitting chip and the positive electrode of the constant current control chip.
进一步而言,上述技术方案中,所述的恒流控制芯片包括:耗尽管Q1和Q4、 常规管Q2和Q3,其中耗尽管Q1的漏端接输入端VIN,其栅端和源端相连;所述 的常规管Q2的栅端和漏端相连并接入耗尽管Q1的源端,常规管Q2的源端接地; 所述的耗尽管Q1和常规管Q2共同作用产生了内部基准电压Vref;所述的常规 管Q3的栅接Vref,源端和漏端接地;耗尽管Q4的栅接Vref,源端接地,漏端 接入输入端VIN。Further, in the above-mentioned technical solution, the constant current control chip includes: power consumption Q1 and Q4, conventional tubes Q2 and Q3, wherein the drain terminal of power consumption Q1 is connected to the input terminal VIN, and its gate terminal is connected to the source terminal; The gate terminal and the drain terminal of the conventional transistor Q2 are connected and connected to the source terminal of the drain Q1, and the source terminal of the conventional transistor Q2 is grounded; the drain Q1 and the conventional transistor Q2 work together to generate the internal reference voltage Vref; The gate of the conventional transistor Q3 is connected to Vref, the source terminal and the drain terminal are connected to ground; the gate of the consumption Q4 is connected to Vref, the source terminal is connected to ground, and the drain terminal is connected to the input terminal VIN.
本发明采用上述技术方案后,相比于普通LED产品,本发明外部不需要任何 其他其他元器,使用简单便利。不会因为每颗LED发光芯片的导通电压(VF值) 不一致而导致产品出现亮度差异问题,也不会因为供电电压变化发光亮度变化问 题。另外,在同一组电子线上,本发明所述的封装LED可以并联更多,产品长度 可以做的更长,而不用担心电子线传输中导线压降而导致灯珠前后亮度不一致。 产品在整体使用时亮度一致性好、可靠性高、并联灯珠数多、产品长度更长等优 点。After the present invention adopts the above technical solution, compared with ordinary LED products, the present invention does not need any other external components, and the use is simple and convenient. There will be no difference in brightness of the product due to the inconsistency of the on-voltage (VF value) of each LED light-emitting chip, and there will be no problem of brightness changes due to changes in the power supply voltage. In addition, in the same group of electronic wires, the packaged LEDs described in the present invention can be connected in parallel, and the product length can be made longer, without worrying about the inconsistent brightness of the lamp beads before and after the voltage drop of the wires during the transmission of the electronic wires. The product has the advantages of good brightness consistency, high reliability, large number of parallel lamp beads, and longer product length during overall use.
附图说明:Description of drawings:
图1为现有市面上普通LED灯串线路结构图;Figure 1 is a circuit structure diagram of a common LED light string on the market;
图2为图1中LED灯串计算线路等效电阻后线路图;Figure 2 is a circuit diagram of the LED light string in Figure 1 after calculating the equivalent resistance of the circuit;
图3为本发明的立体结构示意图;Fig. 3 is the three-dimensional structure schematic diagram of the present invention;
图4为本发明的正视图;Fig. 4 is the front view of the present invention;
图5为本发明的侧视图;Fig. 5 is the side view of the present invention;
图6为本发明中LED恒流芯片的电路原理图;Fig. 6 is the circuit schematic diagram of LED constant current chip in the present invention;
图7为本发明封装后的简化原理图;7 is a simplified schematic diagram of the present invention after encapsulation;
图8为本发明的应用在灯串中的线路原理图。FIG. 8 is a schematic diagram of a circuit of the present invention applied to a light string.
具体实施方式:Detailed ways:
下面结合具体实施例和附图对本发明进一步说明。The present invention will be further described below with reference to specific embodiments and accompanying drawings.
本发明公开了一种集成恒流控制芯片的封装LED,见图3至图5所示,本发 明包括:LED发光芯片1、用于安装LED发光芯片的第一金属支架4、恒流控制 芯片2和用于安装恒流控制芯片2的第二金属支架3,所述的LED发光芯片1、 恒流控制芯片2、第一金属支架4、第二金属支架3通过导线电性连,且通过胶 体8将上述的LED发光芯片1、恒流控制芯片2、第一金属支架4、第二金属支 架3以及导线封装;所述的第一金属支架4和第二金属支架3至少部分显露于胶 体8外,构成该封装LED的电极。The present invention discloses a packaged LED integrated with a constant current control chip. As shown in FIGS. 3 to 5 , the present invention includes: an LED light-
其中,所述的导线包括:用于第一金属支架4与LED发光芯片1其中一电极 连接的第一电极导线7;用于LED发光芯片1另一电极与恒流控制芯片2其中一 电极连接的第二电极导线5;用于恒流控制芯片2另一电极与第二金属支架3连 接的第三电极导线6。Wherein, the wire includes: a
具体而言,所述的第一金属支架4显露于胶体8外的部分构成该封装LED的 金属焊脚,用于连接到电源的正极,所述的第一电极导线7连接于第一金属支架 4与LED发光芯片1的正极之间;Specifically, the part of the
所述的第二金属支架3显露于胶体8外的部分构成该封装LED的金属焊脚, 用于连接到电源的负极,所述的第三导线6连接于第二金属支架3与恒流控制芯 片2的负极之间;The part of the
所述的第二导线5连接与LED发光芯片1的负极与恒流控制芯片2正极之间。The
见图6所示,这是所述的恒流控制芯片2内部电路原理图,其包括:耗尽管 Q1和Q4、常规管Q2和Q3,其中耗尽管Q1的漏端接输入端VIN,其栅端和源端 相连;所述的常规管Q2的栅端和漏端相连并接入耗尽管Q1的源端,常规管Q2 的源端接地;所述的耗尽管Q1和常规管Q2共同作用产生了内部基准电压Vref; 所述的常规管Q3的栅接Vref,源端和漏端接地;耗尽管Q4的栅接Vref,源端 接地,漏端接入输入端VIN。As shown in Fig. 6, this is the internal circuit schematic diagram of the constant
结合图6所示,该恒流控制芯片2的工作原理为:耗尽管Q1和常规管Q2 两个管子共同作用产生了内部基准电压Vref,由于耗尽管Q1(M237)的G和S 相连,VGS=0,产生恒定的基准电流Iref。常规管Q2(M2)的G和D相连,由于 电流恒定,故其VGS(即Vref)恒定,调整上下两个管子的宽长比可调整温度系 数。常规管Q3(M266)为常规管,栅接Vref,源端和漏端接地,为基准电压Vref 的到地低通滤波电容。耗尽管Q4(M272)的栅接Vref,源端接地,漏端接VIN; 耗尽管Q4做输出功率管用,基准电压Vref固定,不考虑沟道调制效应,输出电 流恒定。As shown in Figure 6, the working principle of the constant
见图7所示,这是本发明封装线路简化原理图,LED发光芯片1与恒流控制 芯片2串联在一起,LED发光芯片1的正极连接至外部电源正极(+),LED发光 芯片1负极与恒流控制芯片2输入端口(VIN)连接在一起,恒流控制芯片2负 极(GND)与外部电源负极(-)连接在一起。该封装LED中的发光芯片与恒流控 制芯片封装成一个完整的集成电子元件,LED发光芯片的电流都由恒流控制芯片 进行控制,在外部电源电压波动或变化的情况下,可以保证应用产品中每颗LED 发光芯片流过的电流一致,亮度一致,且内部恒流控制芯片还可以对LED发光芯 片进行过流保护、过热保护,以提高LED灯珠的稳定性。As shown in Figure 7, this is a simplified schematic diagram of the packaging circuit of the present invention. The LED light-
见图8所示,这是将图7所示的单颗封装LED全部并联电子线上(例如灯 串产品),给它供电后,每颗新型LED内部的LED发光芯片都可以通过恒流控制 芯片恒定控制流过的电流,保证前后所有新型LED的亮度一致。且当并联点数越 多,尾端电压缓慢下降的情况下,该新型LED可以保证内部LED发光芯片的电流 一致。同时恒流控制芯片内置过热过流保护电路,防止发光芯片过流和过热损 坏。As shown in Figure 8, this is to connect all the single-package LEDs shown in Figure 7 in parallel with the electronic wire (such as a light string product), and after powering it, the LED light-emitting chip inside each new LED can be controlled by constant current. The chip constantly controls the current flowing through it to ensure the same brightness of all new LEDs before and after. And when the number of parallel points is more, and the tail voltage drops slowly, the new LED can ensure that the current of the internal LED light-emitting chip is consistent. At the same time, the constant current control chip has built-in overheating and overcurrent protection circuit to prevent overcurrent and overheating damage to the light-emitting chip.
当然,以上所述仅为本发明的具体实施例而已,并非来限制本发明实施范 围,凡依本发明申请专利范围所述构造、特征及原理所做的等效变化或修饰,均 应包括于本发明申请专利范围内。Of course, the above descriptions are only specific embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. All equivalent changes or modifications made according to the structures, features and principles described in the scope of the patent application of the present invention shall be included in the within the scope of the patent application of the present invention.
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JP2006313438A (en) * | 2005-05-06 | 2006-11-16 | Mitsumi Electric Co Ltd | Reference voltage generation circuit |
JP2007226710A (en) * | 2006-02-27 | 2007-09-06 | Ricoh Co Ltd | Constant current circuit and constant voltage circuit |
CN201273466Y (en) * | 2008-05-18 | 2009-07-15 | 杨松伟 | Constant-current LED |
KR20180061685A (en) * | 2016-11-30 | 2018-06-08 | 이정문 | Led driver ic and led package with embedded driver ic |
CN107143771A (en) * | 2017-05-05 | 2017-09-08 | 赵红春 | A kind of constant current LED lamp string |
CN206960995U (en) * | 2017-07-13 | 2018-02-02 | 上海南麟电子股份有限公司 | One kind exhausts pipe reference current source circuit |
CN207880485U (en) * | 2018-03-14 | 2018-09-18 | 无锡永友电子有限公司 | A kind of COB lamp plates |
CN108712807A (en) * | 2018-08-03 | 2018-10-26 | 江西美的贵雅照明有限公司 | The driving circuit of light emitting diode |
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