CN110828411A - Multi-chip bonding post-bending type packaging structure and method - Google Patents

Abstract

The invention discloses a multi-chip bonding and post-bending packaging structure and method, and relates to the technical field of chip packaging, including a flexible circuit board, a pad circuit is fixedly arranged on the outer surface of the flexible circuit board, and the flexible circuit board is The inner surface of the circuit board is fixedly provided with a pad surface layer, and the interior of the flexible circuit board is provided with a conduction hole between the pad circuit and the pad surface layer. The package size can be reduced by bending after setting. Compared with the traditional chip packaging process, it can increase the number of chips integrated and reduce the size of the chip package. According to the size of each chip, the side bending space of the flexible circuit board can be used to increase the number of packaged chips. Achieving higher utilization of packaging space, using the production advantages of the flexible circuit board industry for mass production of panels, and greatly reducing the number of chip pad bonding times and improving production efficiency.

Description

A multi-chip bonding post-bend packaging structure and method

technical field

The invention relates to the technical field of chip packaging, in particular to a multi-chip bonding and post-bending packaging structure and method.

Background technique

As the core device of integrated circuit control, signal conversion and transmission, chips are widely used in the electronic information industry. Because the chip must be isolated from the outside world during operation to prevent the corrosion of the chip circuit caused by the impurities in the air, the electrical performance of the chip will be reduced, and the packaged chip will be easier to install and transport, so the chip is protected and applied by packaging. With the rapid development of electronic information technology, it has become an important development direction to integrate multiple chips with different functions into one structure to save space on the circuit board and realize the miniaturization of the entire integrated circuit.

At present, Wire Bonding technology is widely used in the field of chip packaging. It uses metal wires (gold wires, aluminum wires, etc.), and uses thermal pressure or ultrasonic energy to complete the connection between the internal interconnections of solid-state circuits in microelectronic devices. The connection between circuits or metal lead frames. In this technology, the production of products is limited by the efficiency of metal wire bonding. Since the wire bonding process can only be produced one by one pad, the efficiency is low, and the cost of the wire bonding process is high. In addition, the chip can only have the pads facing up. For arrangement, the package size required for multi-chip integrated packaging is large, and it is difficult to meet the market demand for miniaturization and thinning of electronic products. method.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a multi-chip bonded and folded packaging structure and method, so as to solve the problem that the production of products proposed in the above-mentioned background technology is limited by the efficiency of metal wire bonding. Since the wire bonding process can only be produced one by one The cost of the wire bonding process is high. In addition, the chips can only be arranged with the pads facing up. The package size required for multi-chip integrated packaging is large, and it is difficult to meet the market demand for miniaturization and thinning of electronic products.

To achieve the above object, the present invention provides the following technical solutions:

A multi-chip bonded and folded packaging structure includes a flexible circuit board, a pad circuit is fixedly arranged on the outer surface of the flexible circuit board, and a pad surface layer is fixedly arranged on the inner surface of the flexible circuit board, One end of the flexible circuit board is provided with an IC1 bending terminal, the other end of the flexible circuit board is provided with an IC34 bending terminal, the middle position of the flexible circuit board is provided with an IC2 binding terminal, and the IC1 bending terminal is provided The side of the IC34 is fixedly provided with an IC1 chip, the side of the IC2 binding end is fixedly provided with an IC1 chip, the side of the IC34 bending terminal is fixedly provided with an IC3 chip, and the side of the IC34 bending terminal is close to the side of the IC3 chip. An IC4 chip is fixed at the place.

As a further solution of the present invention, a via hole is opened inside the flexible circuit board at a position between the pad circuit and the pad surface layer.

As a further solution of the present invention, a sealing layer is fixedly arranged at an outer position of the flexible circuit board.

As a further solution of the present invention: an IC5 bending terminal is provided at the position between the IC1 bending terminal and the IC2 binding end, and an IC6 bending terminal is set at the position between the IC34 bending terminal and the IC2 binding end .

As a further solution of the present invention, an IC5 chip is fixedly disposed on the side surface of the IC5 bending terminal, and an IC6 chip is fixedly disposed on the side surface of the IC6 bending terminal.

As a further solution of the present invention: a multi-chip bonding-back bending packaging method, comprising the following steps:

Sp1: Assemble the pad connection lines of multiple chips, and design the flexible circuit board as a double-sided structure. One side is the pad surface layer, and the other side is the pad circuit for chip bonding. The electrical functions on both sides are connected through The via hole is realized, and the length of the bent terminals on both sides of the flexible circuit board is calculated and determined according to the requirements of the bending radius and the position of the chip;

Sp2: Bond each chip to the corresponding area of the pad circuit of the flexible circuit board, and use the side bending space of the flexible circuit board to increase the number of chips to be packaged according to the size of each chip;

Sp3: Punch out the terminals that need to be bent after bonding the chip in the flexible circuit board assembly;

Sp4: Bend the punched flexible circuit board terminal to the opposite side of the bonding pad for fixing, and determine the bending sequence according to the designed length of the bending terminal of the circuit board. The short bending terminal is bent and fixed first;

Sp5: Sealing the fixed chip after bending to protect the chip from the external environment;

Sp6: Finally, the split processing is performed, and the encapsulated chip panel is cut to form a single chip to complete the bending and packaging design after the chip is bonded.

Compared with the prior art, the beneficial effects of the present invention are:

The present invention utilizes the flexible circuit board's feature of being bendable to realize the multi-chip bonding and then bending package, which can realize smaller package size, is conducive to realizing the miniaturization of electronic components, and can increase the number of integrated chips and Reducing the size of the chip package, it is possible to use the side bending space of the flexible circuit board to increase the number of chips packaged according to the size of each chip, to achieve a higher utilization rate of packaging space, and use the production advantages of the flexible circuit board industry for mass production of panels. Greatly reduces the number of chip pad bonding and improves production efficiency.

Description of drawings

FIG. 1 is a schematic side view of the package structure before bending in the first embodiment of the present invention;

Fig. 2 is the side view structure schematic diagram of the flexible circuit board in the present invention;

FIG. 3 is a schematic side view of the package structure after bending in Embodiment 1 of the present invention;

4 is a schematic side view of the structure of the package structure after the encapsulation process in the first embodiment of the present invention;

FIG. 5 is a schematic structural diagram of the package structure after bending in the second embodiment of the present invention.

In the figure: 1. IC1 chip; 2. IC2 chip; 3. IC3 chip; 4. IC4 chip; 5. IC1 bending terminal; 6. IC2 binding terminal; 7. IC34 bending terminal; 8. Flexible circuit board; 801, pad circuit; 802, pad surface layer; 803, via hole; 9, sealing layer; 10, IC5 chip; 11, IC5 bending terminal; 12, IC6 chip; 13, IC6 bending terminal.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1:

Referring to FIGS. 1-4 , in an embodiment of the present invention, a multi-chip bonded and folded packaging structure includes a flexible circuit board 8 , and a pad circuit 801 is fixedly arranged on the outer surface of the flexible circuit board 8 . The inner surface of the circuit board 8 is fixedly provided with a pad surface layer 802, one end of the flexible circuit board 8 is provided with an IC1 bending terminal 5, the other end of the flexible circuit board 8 is provided with an IC34 bending terminal 7, and the middle position of the flexible circuit board 8 is provided. IC2 binding end 6 is provided, IC1 chip 1 is fixed on the side of IC1 bending terminal 5, IC1 chip 2 is fixed on the side of IC2 binding end 6, IC3 chip 3 is fixed on the side of IC34 bending terminal 7, The IC4 chip 4 is fixedly arranged on the side of the IC34 bending terminal 7 close to the side of the IC3 chip 3, and the interior of the flexible circuit board 8 is located between the pad circuit 801 and the pad surface layer 802. A via hole 803 is opened. A sealing layer 9 is fixedly disposed at the outer position of the flexible circuit board 8, which plays a protective role of isolating the chip from the external environment.

Embodiment 2:

Please refer to FIG. 2 and FIG. 5 , in an embodiment of the present invention, a multi-chip bonded and folded packaging structure includes a flexible circuit board 8 , and a pad circuit 801 is fixedly arranged on the outer surface of the flexible circuit board 8 . The inner surface of the flexible circuit board 8 is fixedly provided with a pad surface layer 802, one end of the flexible circuit board 8 is provided with an IC1 bending terminal 5, the other end of the flexible circuit board 8 is provided with an IC34 bending terminal 7, and the middle position of the flexible circuit board 8 An IC2 binding end 6 is provided at the place, an IC1 chip 1 is fixed on the side of the IC1 bending terminal 5, an IC1 chip 2 is fixed on the side of the IC2 binding end 6, and an IC3 chip 3 is fixed on the side of the IC34 bending terminal 7. , the side of the IC34 bending terminal 7 is close to the side of the IC3 chip 3, and the IC4 chip 4 is fixedly arranged. The interior of the flexible circuit board 8 is located between the pad circuit 801 and the pad surface layer 802. A via hole 803 is opened , the outer position of the flexible circuit board 8 is fixed with a sealing layer 9, the position between the IC1 bending terminal 5 and the IC2 binding end 6 is provided with an IC5 bending terminal 11, and the IC34 bending terminal 7 and the IC2 binding end The IC6 bending terminal 13 is provided at the position between 6, the IC5 chip 10 is fixedly disposed on the side of the IC5 bending terminal 11, and the IC6 chip 12 is fixedly disposed on the side of the IC6 bending terminal 13.

According to the size of each chip, the side bending space of the flexible circuit board 8 is used to increase the number of chips to be packaged, so as to achieve a higher utilization rate of packaging space.

Embodiment three:

In an embodiment of the present invention, a multi-chip bonding-back bending packaging method includes the following steps of use:

Sp1: Assemble the pad connection circuits of multiple chips, and design the flexible circuit board 8 as a double-sided structure, one side is the pad surface layer 802, the other side is the pad circuit 801 for chip bonding, and the electrical circuits on both sides are The functional connection is realized through the through hole 803, and the length of the bent terminals on both sides of the flexible circuit board 8 is calculated and determined according to the requirements of the bending radius and the position of the chip;

Sp2: Bond each chip to the area corresponding to the pad circuit 801 of the flexible circuit board, and use the side bending space of the flexible circuit board 8 to increase the number of chips to be packaged according to the size of each chip;

Sp3: Punch out the terminals that need to be bent after bonding the chip in the 8-piece assembly of the flexible circuit board;

Sp4: Bend the 8 terminals of the punched flexible circuit board to the opposite side of the bonding pad for fixing, and determine the bending sequence according to the designed length of the bending terminals of the circuit board. The short bending terminals are bent and fixed first;

Sp5: Sealing the fixed chip after bending to protect the chip from the external environment;

Sp6: Finally, the split processing is performed, and the encapsulated chip panel is cut to form a single chip to complete the bending and packaging design after the chip is bonded.

The above are only preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. The equivalent replacement or modification of the solution and its inventive concept shall be included within the protection scope of the present invention.

Claims (6)

1. A multi-chip bonding rear bending type packaging structure is characterized by comprising a flexible circuit board (8), a pad circuit (801) is fixedly arranged on the outer side surface of the flexible circuit board (8), the inner side surface of the flexible circuit board (8) is fixedly provided with a pad surface layer (802), one end of the flexible circuit board (8) is provided with an IC1 bending terminal (5), the other end of the flexible circuit board (8) is provided with an IC34 bending terminal (7), an IC2 binding end (6) is arranged at the middle position of the flexible circuit board (8), the side surface of the IC1 bending terminal (5) is fixedly provided with an IC1 chip (1), the side surface of the binding end (6) of the IC2 is fixedly provided with an IC1 chip (2), the side surface of the IC34 bending terminal (7) is fixedly provided with an IC3 chip (3), the side face of the IC34 bending terminal (7) is fixedly provided with an IC4 chip (4) at a position close to one side of the IC3 chip (3).

2. The multi-chip bonded rear-bending packaging structure of claim 1, wherein a via hole (803) is opened in the flexible circuit board (8) at a position between the pad circuit (801) and the pad surface layer (802).

3. The multi-chip bonded rear-bending packaging structure according to claim 1, wherein an adhesive sealant layer (9) is fixedly arranged at the outer side position of the flexible circuit board (8).

4. A multi-chip bonding rear-bending package structure according to claim 1, wherein an IC5 bending terminal (11) is disposed at a position between the IC1 bending terminal (5) and the IC2 binding end (6), and an IC6 bending terminal (13) is disposed at a position between the IC34 bending terminal (7) and the IC2 binding end (6).

5. The multi-chip bonding rear-bending packaging structure according to claim 4, wherein the IC5 chip (10) is fixedly arranged on the side of the IC5 bending terminal (11), and the IC6 chip (12) is fixedly arranged on the side of the IC6 bending terminal (13).

6. A multi-chip bond post-bend packaging method, a multi-chip bond post-bend packaging structure according to any one of claims 1-5, comprising the steps of:

sp 1: the method comprises the following steps of performing plate splicing design on pad connecting circuits of a plurality of chips, designing a flexible circuit board (8) into a double-sided board structure, wherein one side of the flexible circuit board is a pad surface layer (802), the other side of the flexible circuit board is a pad circuit (801) bonded by the chips, the electrical function connection of the two sides is realized through a via hole (803), and the length of bent terminals on the two sides of the flexible circuit board (8) is calculated and determined according to requirements of bending radius, chip position and the like;

sp 2: bonding each chip to a corresponding area of a pad circuit (801) of the flexible circuit board, and increasing the number of packaged chips by utilizing a side bending space of the flexible circuit board (8) according to the size of each chip;

sp 3: punching and forming terminals which need to be bent after bonding chips in jointed boards of the flexible circuit boards (8);

sp 4: bending the punched flexible circuit board (8) terminal to the surface opposite to the bonding pad for fixing, determining the bending sequence according to the designed length of the circuit board bending terminal, and bending and fixing the short bending terminal;

sp 5: the chip fixed after being bent is subjected to glue sealing treatment, so that the chip is isolated from the external environment;

sp 6: and finally, carrying out splitting treatment, and cutting the chip jointed board after glue sealing to form a single chip, namely finishing the bending packaging design after bonding the chip.

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