CN110809615A - 抛光剂、铜件及其抛光处理方法 - Google Patents
抛光剂、铜件及其抛光处理方法 Download PDFInfo
- Publication number
- CN110809615A CN110809615A CN201780092855.3A CN201780092855A CN110809615A CN 110809615 A CN110809615 A CN 110809615A CN 201780092855 A CN201780092855 A CN 201780092855A CN 110809615 A CN110809615 A CN 110809615A
- Authority
- CN
- China
- Prior art keywords
- parts
- polishing agent
- polishing
- water
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 107
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 23
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 11
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims abstract description 11
- 229960001484 edetic acid Drugs 0.000 claims abstract description 11
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 11
- 238000005406 washing Methods 0.000 claims description 17
- 238000001035 drying Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 2
- 238000002161 passivation Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000009965 odorless effect Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
一种抛光剂、铜件及其抛光处理方法。抛光剂用于铜件表面预处理，以200重量份计，包括如下重量份数的成分：5‑20份磨料，2‑10份乙二胺四乙酸，2‑10份硫酸，2‑10份过硫酸铵，2‑10份聚乙二醇和余量水。经过上述抛光剂处理后，铜件表面清洁光亮，而且整个抛光处理方法工艺简单、安全环保，无气味，操作方便，使用成本低。
Description
PCT国内申请，说明书已公开。
Claims (1)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/091534 WO2019006600A1 (zh) | 2017-07-03 | 2017-07-03 | 抛光剂、铜件及其抛光处理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110809615A true CN110809615A (zh) | 2020-02-18 |
Family
ID=64950539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780092855.3A Withdrawn CN110809615A (zh) | 2017-07-03 | 2017-07-03 | 抛光剂、铜件及其抛光处理方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110809615A (zh) |
| WO (1) | WO2019006600A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI733069B (zh) * | 2017-12-31 | 2021-07-11 | 美商羅門哈斯電子材料有限公司 | 單體、聚合物及包含其的微影組合物 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087525A1 (en) * | 2000-08-31 | 2003-05-08 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| CN101671527A (zh) * | 2009-09-27 | 2010-03-17 | 大连三达奥克化学股份有限公司 | 高去除率、低损伤的铜化学机械抛光液及制备方法 |
| CN102516878A (zh) * | 2011-12-12 | 2012-06-27 | 上海新安纳电子科技有限公司 | 一种改善相变材料抛光后表面质量的抛光液 |
| CN106811744A (zh) * | 2015-11-30 | 2017-06-09 | 侯霞 | 铜板表面处理工艺 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1580302A1 (en) * | 2004-03-23 | 2005-09-28 | JohnsonDiversey Inc. | Composition and process for cleaning and corrosion inhibition of surfaces of aluminum or colored metals and alloys thereof under alkaline conditions |
| CN101974297A (zh) * | 2010-11-12 | 2011-02-16 | 大连三达奥克化学股份有限公司 | 核/壳型复合纳米磨料铜化学机械抛光液 |
| US10570313B2 (en) * | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
-
2017
- 2017-07-03 CN CN201780092855.3A patent/CN110809615A/zh not_active Withdrawn
- 2017-07-03 WO PCT/CN2017/091534 patent/WO2019006600A1/zh active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087525A1 (en) * | 2000-08-31 | 2003-05-08 | Micron Technology, Inc. | Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| CN101671527A (zh) * | 2009-09-27 | 2010-03-17 | 大连三达奥克化学股份有限公司 | 高去除率、低损伤的铜化学机械抛光液及制备方法 |
| CN102516878A (zh) * | 2011-12-12 | 2012-06-27 | 上海新安纳电子科技有限公司 | 一种改善相变材料抛光后表面质量的抛光液 |
| CN106811744A (zh) * | 2015-11-30 | 2017-06-09 | 侯霞 | 铜板表面处理工艺 |
Non-Patent Citations (2)
| Title |
|---|
| 任颂赞编: "《金相分析原理及技术》", 31 August 2013, 上海科学技术文献出版社 * |
| 方景礼著: "《金属材料抛光技术》", 31 January 2007, 国防工业出版社 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019006600A1 (zh) | 2019-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200218 |
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| WW01 | Invention patent application withdrawn after publication |