CN110788706A

CN110788706A - Intelligent equipment for semiconductor material production and use method thereof

Info

Publication number: CN110788706A
Application number: CN201910999772.3A
Authority: CN
Inventors: 武建军; 张培林; 柴利春; 王志辉; 张作文; 纪永良
Original assignee: Datong Xincheng New Material Co Ltd
Current assignee: Datong Xincheng New Material Co Ltd
Priority date: 2019-10-21
Filing date: 2019-10-21
Publication date: 2020-02-14
Anticipated expiration: 2039-10-21
Also published as: CN110788706B

Abstract

The invention discloses intelligent equipment for producing semiconductor materials, which comprises a shell, a turnover plate, a chip collecting groove, a first threaded rod, a first moving assembly, a clamping assembly, a bearing plate, a polishing disc, a connecting plate, an elastic assembly, a mounting plate, a second moving assembly and a protective cover, be connected with first threaded rod on the returning face plate, it is provided with the shift ring to remove through first removal subassembly on first threaded rod, shift ring week side is connected with the centre gripping subassembly, the one of returning face plate was kept away from to first threaded rod serves fixedly connected with loading board, the dish of polishing deviates from a side center fixedly connected with pivot of loading board, the other end of pivot slides and passes the spindle of sleeve pipe fixedly connected with third motor, the connecting plate is connected with the mounting panel with dish parallel arrangement of polishing through elastic component, the mounting panel still is connected with the second removal subassembly of installation on the returning face plate of loading board one side. The intelligent equipment for producing the semiconductor material has the advantages of good applicability, convenience in use and the like, and can be widely popularized and used.

Description

Intelligent equipment for semiconductor material production and use method thereof

Technical Field

The invention belongs to the technical field of semiconductor material production equipment, and particularly relates to intelligent equipment for semiconductor material production and a using method thereof.

Background

Wafers are the basic material for manufacturing semiconductor chips, and the most important raw material of semiconductor integrated circuits is silicon, so that the corresponding is silicon wafers. Silicon is widely found in nature in rocks, grits in the form of silicates or silica, and the manufacture of silicon wafers can be summarized in three basic steps: silicon extraction and purification, monocrystalline silicon growth and wafer molding.

When the wafer is packaged, the wafer is generally required to be thinned through a wafer grinding machine, the basic mode is realized through relative movement of a semiconductor wafer and a grinding wheel, the exposed grinding of the current thinning device affects the working environment, the built-in grinding is inconvenient to place, meanwhile, the size and the thickness of the semiconductor wafer are different, the fixing structure is fixed, and the adaptability is poor.

Disclosure of Invention

The invention aims to provide intelligent equipment for semiconductor material production and a using method thereof, so as to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: an intelligent device for producing semiconductor materials comprises a shell, a turnover plate, a chip collecting groove, a first threaded rod, a first moving assembly, a clamping assembly, a bearing plate, a polishing disc, a connecting plate, an elastic assembly, a mounting plate, a second moving assembly and a protective cover, wherein the shell is of a square box structure, the opening on one side surface of the shell is hinged with the turnover plate, the bottom end of the turnover plate is fixedly connected with a fourth motor for driving the turnover plate to turn over, the first threaded rod which is vertically arranged on one side surface of the turnover plate facing the shell is rotatably connected with the turnover plate through a bearing, one end of the first threaded rod, which is connected with the turnover plate, penetrates through a crankshaft of the first motor fixedly connected with the side wall of the turnover plate, a moving ring is movably arranged on the first threaded rod through the first moving assembly, a plurality of groups of clamping assemblies are connected on the periphery of the moving ring, the bearing plate is fixedly, with loading board interval parallel arrangement has the mill, it has the multiunit chip groove of form to disperse to polish to be provided with on the face of polishing of dish orientation loading board, mill and loading board all with returning face plate parallel arrangement, the side center fixedly connected with that the dish of polishing deviates from the loading board has rather than the pivot of perpendicular setting, the other end of pivot slides the spindle that passes sleeve pipe fixedly connected with third motor, the cover pipe is fixed on the connecting plate, connecting plate and the parallel arrangement of the dish of polishing, the connecting plate is connected with the mounting panel with the parallel arrangement of the dish of polishing through elastic component, the mounting panel still is connected with the second removal subassembly of installation on the returning face plate of loading board one side, still be provided with the observation window on a vertical lateral wall of shell, be fixed with the chip groove on the inside bottom surface of shell, it.

Preferably, the centre gripping subassembly is provided with the multiunit in the loading board below, including the centre gripping bolt, the connecting rod, first telescopic link, first spring, first outer tube and first slider, first outer tube one end and shift ring outer wall fixed connection, the one end outside at first telescopic link is put to other end opening slip cap, first telescopic link is in the inside first slider that slides and set up of the inside first outer tube of the inside one end fixedly connected with of first outer tube, and the cover has put first spring on being in the inside first telescopic link of first outer tube, the outside first telescopic link one end fixedly connected with of first outer tube rather than the perpendicular connecting rod that sets up, the one end threaded connection who passes the connecting rod and keep away from first telescopic link has the centre gripping bolt with loading board parallel arrangement.

Preferably, a plurality of groups of notches are formed in the bearing plate, the plurality of groups of notches are arranged at equal angles, and one ends, far away from the first telescopic rod, of the plurality of groups of connecting rods penetrate through the notches in the bearing plate.

Preferably, the first moving assembly comprises a threaded sleeve, one end, facing away from the bearing plate, of the threaded sleeve is rotatably connected with the moving ring through a bearing, the threaded sleeve of the threaded sleeve is arranged on the first threaded rod, and the inner diameter of the moving ring is larger than the diameter of the first threaded rod.

Preferably, elastic component includes second spring, second outer tube, second slider and second telescopic link, second outer tube one end fixed connection is on the mounting panel towards a side of connecting plate, and other end sliding sleeve puts on one end of second telescopic link, and the second telescopic link is in the inside second slider that slides and set up of second outer tube of the inside one end fixedly connected with second outer tube, and a side that the second slider deviates from the second telescopic link supports the second spring that has the inside setting of second outer tube, and the second telescopic link is in the outside one end fixed connection of second outer tube on a side of connecting plate towards the mounting panel.

Preferably, the second moving assembly comprises a second threaded rod, a fixed plate, a retaining rod and a second motor, the second threaded rod is arranged in parallel with the first threaded rod, one end of the second threaded rod is rotatably connected to the turnover plate on one side of the first threaded rod through a bearing and penetrates through a crankshaft of the second motor fixed on the side wall of the turnover plate fixedly connected with the turnover plate, the other end of the second threaded rod penetrates through the mounting plate and is rotatably connected with the fixed plate through the bearing, the retaining rod parallel to the second threaded rod is arranged on the mounting plate in a sliding mode, one end of the retaining rod is fixedly connected to the fixed plate, the other end of the retaining rod is fixedly connected to the turnover plate, and a bearing vertical plate used for bearing the fixed plate is further fixed.

Preferably, a protective cover covering the outside of the first motor and the second motor is further fixed on one side face of the turnover plate, and when the turnover plate is turned to be in a horizontal state, the bottom end face of the protective cover is flush with the bottom end face of the shell.

A method for using intelligent equipment for producing semiconductor materials comprises the steps of turning a turning plate to be horizontal through a fourth motor when polishing semiconductor material plates, moving a bearing plate for bearing the semiconductor material plates to the outside of a shell and to be in a horizontal state, rotating a plurality of groups of clamping bolts to extend outwards, reserving a semiconductor material plate placing space, then rotating a threaded sleeve, moving a clamping assembly on a first threaded rod, adjusting the height of the top end of a connecting rod extending out of the bearing plate, wherein the extending height is lower than the thickness of the semiconductor material plates, placing the semiconductor material plates and reversing the plurality of groups of clamping bolts after adjustment is finished, clamping and fixing the semiconductor material plates through the plurality of groups of clamping assemblies, screwing the plurality of groups of clamping bolts into different lengths according to the polishing range of a polishing disc to adjust the positions of the semiconductor material plates, and turning the turning plate to be vertical through the fourth motor, bear the riser this moment and bear the fixed plate, bear the loading board of semiconductor material panel and be used for the polishing dish of polishing and get into inside the shell and be vertical state, it makes semiconductor material panel rotate to rotate through first motor drive loading board, it rotates to polish the dish through third motor drive, it is opposite with loading board direction of rotation to make the dish of rotation of polishing, second motor drive second threaded rod rotates simultaneously, it will polish the dish and be close to the semiconductor material panel on the loading board to move the mounting panel on the second threaded rod, elastic pressure is applyed to the in-process elastic component that polishes in the contact, the piece of polishing is arranged to the chip groove through the chip groove on polishing the dish, observe the condition of polishing through the observation window, clear up clastic in the chip groove through switch chip door.

The invention has the technical effects and advantages that: the intelligent equipment for producing the semiconductor material and the using method thereof are characterized in that a bearing plate for bearing the semiconductor material plates and a polishing disc for polishing are arranged on a turnover plate, the semiconductor material plates can be conveniently placed by utilizing the turnover characteristic of the turnover plate, the polishing disc is positioned in a shell, the quality of a working environment can be better improved, a plurality of groups of clamping assemblies can conveniently clamp and fix the semiconductor material plates with different sizes, meanwhile, a first moving assembly can change the height of a connecting rod and a clamping bolt in the clamping assembly extending out of the bearing plate so as to completely expose the surface to be polished of the semiconductor material plates and prevent accidents caused by accidental touch of the polishing disc, the clamping assemblies are more flexible through the design of the first moving assembly and have better adaptability, and the force applied during polishing can be not hardened through the design of an elastic assembly, the intelligent device for producing the semiconductor material and the use method thereof have the advantages of good applicability, convenience in use and the like, and can be widely popularized and used.

Drawings

FIG. 1 is a schematic view of the structure of the roll-over panel of the present invention in a horizontal state;

FIG. 2 is a schematic structural view of the roll-over panel of the present invention in a vertical position;

FIG. 3 is a schematic view of a clamping assembly according to the present invention;

FIG. 4 is a schematic view of the elastic member of the present invention;

FIG. 5 is a schematic view of a carrier plate structure according to the present invention;

figure 6 is a schematic view of the abrasive disc structure of the present invention.

In the figure: 1 grinding disc, 2 clamping bolts, 3 bearing plates, 4 clamping assemblies, 5 first moving assemblies, 6 turnover plates, 7 threaded sleeves, 8 first threaded rods, 9 first motors, 10 protective covers, 11 second moving assemblies, 12 second motors, 13 shells, 14 chip collecting grooves, 15 chip removing doors, 16 observation windows, 17 bearing vertical plates, 18 moving rings, 19 retaining rods, 20 connecting plates, 21 third motors, 22 elastic assemblies, 23 mounting plates, 24 second threaded rods, 25 fixing plates, 26 connecting rods, 27 first telescopic rods, 28 first springs, 29 first outer tubes, 30 first sliding blocks, 31 second springs, 32 second outer tubes, 33 second sliding blocks and 34 second telescopic rods.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides intelligent equipment for producing semiconductor materials, which comprises a shell 13, a turnover plate 6, a chip collecting groove 14, a first threaded rod 8, a first moving component 5, a clamping component 4, a bearing plate 3, a polishing disc 1, a connecting plate 20, an elastic component 22, a mounting plate 23, a second moving component 11 and a protective cover 10, wherein the shell 13 is of a square box structure, the turnover plate 6 is hinged at an opening at one side surface of the shell 13, a fourth motor for driving the turnover plate 6 to turn over is fixedly connected with a hinged shaft of the bottom end of the turnover plate 6 and the shell 13, the first threaded rod 8 vertically arranged on one side surface of the turnover plate 6 facing the shell 13 is rotatably connected through a bearing, one end of the first threaded rod 8, which is connected with the turnover plate 6, penetrates through a shaft of a first motor 9 fixed on the side wall of the turnover plate 6, a moving ring 18 is movably arranged on the first threaded rod 8 through the first moving component 5, a plurality of groups of clamping components 4 are connected on the periphery of the movable ring 18, one end of the first threaded rod 8 far away from the turnover plate 6 is fixedly connected with a bearing plate 3, a polishing disc 1 is arranged in parallel with the bearing plate 3 at intervals, a plurality of groups of scattered chip grooves are arranged on the polishing surface of the polishing disc 1 facing the bearing plate 3, the polishing disc 1 and the bearing plate 3 are both arranged in parallel with the turnover plate 6, the center of one side surface of the polishing disc 1 far away from the bearing plate 3 is fixedly connected with a rotating shaft which is vertically arranged with the polishing disc 1, the other end of the rotating shaft slides through a shaft of a sleeve fixedly connected with a third motor 21, the sleeve is fixed on a connecting plate 20, the connecting plate 20 is arranged in parallel with the polishing disc 1, the connecting plate 20 is connected with a mounting plate 23 arranged in parallel with the polishing disc 1 through an elastic component 22, the mounting plate 23 is also connected with a, a chip collecting groove 14 is fixed on the inner bottom surface of the shell 13, and a chip removing door 15 is hinged on the side wall of the shell 13 below the observation window 16.

Specifically, centre gripping subassembly 4 is provided with the multiunit in loading board 3 below, including clamping bolt 2, connecting rod 26, first telescopic link 27, first spring 28, first outer tube 29 and first slider 30, first outer tube 29 one end and the outer wall fixed connection of shift ring 18, other end opening slip cap is put at the one end of first telescopic link 27 outsidely, first telescopic link 27 is in the inside first slider 30 that slides and set up of first outer tube 29 of the inside one end fixedly connected with of first outer tube 29, and the first spring 28 has been put to the cover on being in the inside first telescopic link 27 of first outer tube 29, be in the outside first telescopic link 27 one end fixedly connected with of first outer tube 29 rather than the perpendicular connecting rod 26 that sets up, the one end threaded connection who passes connecting rod 26 and keep away from first telescopic link 27 has clamping bolt 2 with loading board 3 parallel arrangement.

Specifically, a plurality of groups of notches are formed in the bearing plate 3, the plurality of groups of notches are arranged at equal angles, and one end, far away from the first telescopic rod 27, of each group of connecting rods 26 penetrates through the notches in the bearing plate 3.

Specifically, the first moving assembly 5 comprises a threaded sleeve 7, one end, facing away from the bearing plate 3, of the threaded sleeve 7 is rotatably connected with a moving ring 18 through a bearing, the threaded sleeve 7 is sleeved on the first threaded rod 8, and the inner diameter of the moving ring 18 is larger than the diameter of the first threaded rod 8.

Specifically, elastic component 22 includes second spring 31, second outer tube 32, second slider 33 and second telescopic link 34, second outer tube 32 one end fixed connection is on the side of mounting panel 23 towards connecting plate 20, and other end sliding sleeve puts on one end of second telescopic link 34, and second telescopic link 34 is in the inside second slider 33 that slides and set up of second outer tube 32 of the inside one end fixedly connected with of second outer tube 32 of second outer tube 34, and second slider 33 deviates from a side of second telescopic link 34 and has connect the inside second spring 31 that sets up of second outer tube 32, and second telescopic link 34 is in the outside one end fixed connection of second outer tube 32 on the side of connecting plate 20 towards mounting panel 23.

Specifically, the second moving assembly 11 includes a second threaded rod 24, a fixed plate 25, a retaining rod 19 and a second motor 12, the second threaded rod 24 is parallel to the first threaded rod 8, one end of the second threaded rod 24 is rotatably connected to the turning plate 6 on one side of the first threaded rod 8 through a bearing and passes through a crankshaft of the second motor 12 fixed on the side wall of the turning plate 6 fixedly connected to the turning plate 6, the other end of the second threaded rod 24 passes through a mounting plate 23 and is rotatably connected to the fixed plate 25 through a bearing, the retaining rod 19 parallel to the second threaded rod 24 is slidably arranged through the mounting plate 23, one end of the retaining rod 19 is fixedly connected to the fixed plate 25, the other end of the retaining rod 19 is fixedly connected to the turning plate 6, and a bearing vertical plate 17 for bearing the fixed plate 25 is further fixed on the inner bottom surface of the.

Specifically, a protective cover 10 covering the outside of the first motor 9 and the second motor 12 is further fixed on one side surface of the turnover plate 6, and when the turnover plate 6 is turned to be in a horizontal state, the bottom end surface of the protective cover 10 is flush with the bottom end surface of the shell 13.

A using method of intelligent equipment for semiconductor material production comprises the steps of firstly turning a turning plate 6 to be horizontal through a fourth motor when a semiconductor material plate is polished, setting the fourth motor as a servo motor with the model being PD2-CB59M-E-01, effectively controlling the turning angle of the turning plate 6 to be 90 degrees each time, moving a bearing plate 3 used for bearing the semiconductor material plate to the outside of a shell 13 and be in a horizontal state, rotating a plurality of groups of clamping bolts 2 to extend outwards to reserve a semiconductor material plate placing space, then rotating a threaded sleeve 7, moving a clamping assembly 4 on a first threaded rod 8, adjusting the height of the top end of a connecting rod 26 extending out of the bearing plate 3, wherein the extending height is lower than the thickness of the semiconductor material plate, placing the semiconductor material plate and reversing the plurality of groups of clamping bolts 2 after adjustment is finished, and clamping and fixing the semiconductor material plate by using the plurality of groups of clamping assemblies 4, according to the polishing range of the polishing disc 1, a plurality of groups of clamping bolts 2 are screwed in different lengths to adjust the position of the semiconductor material plate, then the turnover plate 6 is turned to be in a vertical state through a fourth motor, at the moment, the bearing vertical plate 17 bears the fixed plate 25, the bearing plate 3 bearing the semiconductor material plate and the polishing disc 1 for polishing enter the shell 13 and are in a vertical state, the bearing plate 3 is driven to rotate through the first motor 9 so that the semiconductor material plate rotates, the polishing disc 1 is driven to rotate through the third motor 21 so that the rotating direction of the polishing disc 1 is opposite to that of the bearing plate 3, meanwhile, the second motor 12 drives the second threaded rod 24 to rotate, the mounting plate 23 is moved on the second threaded rod 24 so that the polishing disc 1 is close to the semiconductor material plate on the bearing plate 3, the elastic assembly 22 applies elastic pressure in the contact polishing process, polishing debris is discharged into the chip collecting groove 14 through a chip, the grinding condition is observed through the observation window 16, and the chip in the chip collecting groove 14 is cleaned through opening and closing the chip removing door 15.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides an intelligent equipment is used in semiconductor material production, includes shell (13), returning face plate (6), collection bits groove (14), first threaded rod (8), first removal subassembly (5), centre gripping subassembly (4), loading board (3), make mill dish (1), connecting plate (20), elastic component (22), mounting panel (23), second remove subassembly (11) and safety cover (10), its characterized in that: the shell (13) is of a square box structure, a turnover plate (6) is hinged at an opening at one side of the shell (13), a fourth motor for driving the turnover plate (6) to turn over is fixedly connected with the bottom end of the turnover plate (6) and a hinge shaft of the shell (13), a first threaded rod (8) which is vertically arranged on one side of the turnover plate (6) facing the shell (13) is rotatably connected with the turnover plate through a bearing, one end of the first threaded rod (8) connected with the turnover plate (6) penetrates through a crankshaft of a first motor (9) which is fixedly connected with the side wall of the turnover plate (6) and is connected with the turnover plate (6), a movable ring (18) is movably arranged on the first threaded rod (8) through a first movable component (5), a plurality of groups of clamping components (4) are connected on the peripheral side of the movable ring (18), and one end of the first threaded rod (8) far away from the turnover plate, a grinding disc (1) is arranged in parallel with the bearing plate (3) at an interval, a plurality of groups of divergent chip grooves are arranged on the grinding surface of the grinding disc (1) facing the bearing plate (3), the grinding disc (1) and the bearing plate (3) are both arranged in parallel with the turnover plate (6), a rotating shaft which is perpendicular to the grinding disc (1) is fixedly connected to the center of one side surface of the grinding disc (1) deviating from the bearing plate (3), the other end of the rotating shaft penetrates through a shaft of a sleeve fixedly connected with a third motor (21), the sleeve is fixed on a connecting plate (20), the connecting plate (20) is arranged in parallel with the grinding disc (1), the connecting plate (20) is connected with a mounting plate (23) which is arranged in parallel with the grinding disc (1) through an elastic component (22), the mounting plate (23) is also connected with a second moving component (11) which is arranged on the turnover plate (6) at one side of the bearing plate (3), a chip collecting groove (14) is fixed on the bottom surface inside the shell (13), and a chip removing door (15) is hinged on the side wall of the shell (13) below the observation window (16).

2. The intelligent equipment for semiconductor material production according to claim 1, wherein: a plurality of groups of clamping components (4) are arranged below the bearing plate (3) and comprise clamping bolts (2), connecting rods (26), first telescopic rods (27), first springs (28), first outer tubes (29) and first sliding blocks (30), one end of each first outer tube (29) is fixedly connected with the outer wall of the moving ring (18), the opening at the other end of each first telescopic rod (27) is sleeved outside one end of each first telescopic rod in a sliding mode, the first telescopic rods (27) are positioned inside the first outer tubes (29), one end of each first telescopic rod (27) is fixedly connected with the first sliding block (30) arranged inside the first outer tubes (29) in a sliding mode, and a first spring (28) is sleeved on the first telescopic rod (27) positioned in the first outer pipe (29), one end of the first telescopic rod (27) positioned outside the first outer pipe (29) is fixedly connected with a connecting rod (26) vertically arranged with the first telescopic rod, and one end of the first telescopic rod (27) penetrating through the connecting rod (26) is in threaded connection with a clamping bolt (2) parallel to the bearing plate (3).

3. The intelligent equipment for semiconductor material production according to claim 2, wherein: a plurality of groups of notches are formed in the bearing plate (3), the plurality of groups of notches are arranged at equal angles, and one end, far away from the first telescopic rod (27), of each group of connecting rods (26) penetrates through the notches in the bearing plate (3).

4. The intelligent equipment for semiconductor material production according to claim 1, wherein: the first moving assembly (5) comprises a threaded sleeve (7), one end, facing away from the bearing plate (3), of the threaded sleeve (7) is rotatably connected with a moving ring (18) through a bearing, the threaded sleeve (7) is sleeved on the first threaded rod (8), and the inner diameter of the moving ring (18) is larger than that of the first threaded rod (8).

5. The intelligent equipment for semiconductor material production according to claim 1, wherein: elastic component (22) includes second spring (31), second outer tube (32), second slider (33) and second telescopic link (34), second outer tube (32) one end fixed connection is on mounting panel (23) a side towards connecting plate (20), other end sliding sleeve puts one of second telescopic link (34) and serves, second slider (33) that second telescopic link (34) are in the inside one end fixedly connected with second outer tube (32) of second outer tube (32) inside slip setting, second slider (33) deviate from a side butt joint that second telescopic link (34) have second spring (31) of the inside setting of second outer tube (32), second telescopic link (34) are in the outside one end fixed connection of second outer tube (32) on a side of connecting plate (20) towards mounting panel (23).

6. The intelligent equipment for semiconductor material production according to claim 1, wherein: the second moving component (11) comprises a second threaded rod (24), a fixed plate (25), a holding rod (19) and a second motor (12), the second threaded rod (24) is arranged in parallel with the first threaded rod (8), one end of the second threaded rod (24) is rotatably connected to the turnover plate (6) on one side of the first threaded rod (8) through a bearing, a crankshaft of a second motor (12) fixed on the side wall of the turnover plate (6) is fixedly connected through the turnover plate (6), the other end of a second threaded rod (24) penetrates through a mounting plate (23) and is rotatably connected with a fixing plate (25) through a bearing, a holding rod (19) parallel to the second threaded rod (24) is arranged through the mounting plate (23) in a sliding way, one end of the holding rod (19) is fixedly connected on the fixing plate (25), the other end is fixedly connected on the turnover plate (6), a bearing vertical plate (17) for bearing the fixing plate (25) is also fixed on the bottom surface in the shell (13).

7. The intelligent equipment for semiconductor material production according to claim 1, wherein: a protective cover (10) covering the outside of the first motor (9) and the second motor (12) is further fixed on one side face of the turnover plate (6), and when the turnover plate (6) is turned to be in a horizontal state, the bottom end face of the protective cover (10) is flush with the bottom end face of the shell (13).

8. The use method of the intelligent device for semiconductor material production according to claim 1, wherein the method comprises the following steps: when the semiconductor material plate is polished, the turnover plate (6) is firstly turned to be horizontal through the fourth motor, at the moment, the bearing plate (3) used for bearing the semiconductor material plate is moved to the outside of the shell (13) and is in a horizontal state, the plurality of groups of clamping bolts (2) are rotated and extended outwards, a semiconductor material plate placing space is reserved, then the thread sleeve (7) is rotated, the clamping assembly (4) is moved on the first threaded rod (8), the height of the top end of the connecting rod (26) extending out of the bearing plate (3) is adjusted, the extending height is lower than the thickness of the semiconductor material plate, the semiconductor material plate is placed and the plurality of groups of clamping bolts (2) are reversed after adjustment is completed, the semiconductor material plate is clamped and fixed through the plurality of groups of clamping assemblies (4), and the plurality of groups of clamping bolts (2) are screwed into different lengths to adjust the position of the semiconductor material plate according to, then the turnover plate (6) is turned to be in a vertical state through a fourth motor, at the moment, the bearing vertical plate (17) bears a fixing plate (25), the bearing plate (3) bearing the semiconductor material plate and the polishing disc (1) used for polishing enter the shell (13) and are in a vertical state, the bearing plate (3) is driven to rotate through the first motor (9), so that the semiconductor material plate rotates, the polishing disc (1) is driven to rotate through the third motor (21), the rotating direction of the polishing disc (1) is opposite to that of the bearing plate (3), meanwhile, the second motor (12) drives the second threaded rod (24) to rotate, the mounting plate (23) is moved on the second threaded rod (24) to enable the polishing disc (1) to be close to the semiconductor material plate on the bearing plate (3), the elastic assembly (22) applies elastic pressure in the contact polishing process, polishing debris is discharged into the chip collecting groove (14) through a chip groove on the polishing disc (1), the grinding condition is observed through an observation window (16), and the chips in the chip collecting groove (14) are cleaned through opening and closing a chip removing door (15).