CN110783236B - Chamber offline control method and system - Google Patents
Chamber offline control method and system Download PDFInfo
- Publication number
- CN110783236B CN110783236B CN201911103566.6A CN201911103566A CN110783236B CN 110783236 B CN110783236 B CN 110783236B CN 201911103566 A CN201911103566 A CN 201911103566A CN 110783236 B CN110783236 B CN 110783236B
- Authority
- CN
- China
- Prior art keywords
- chamber
- wafer
- wafers
- offline
- automatically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H10P72/0604—
-
- H10P72/0612—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
技术领域technical field
本发明涉及半导体制造领域,具体地,涉及一种腔室离线控制方法及系统。The present invention relates to the field of semiconductor manufacturing, in particular to a chamber off-line control method and system.
背景技术Background technique
目前,在半导体领域,工厂自动化系统监视设备的状态,特别是该设备在工艺过程中各个参数指标,一旦该设备的某个腔室的某个参数指标失控(Out Of Control,以下简称OOC),即某个参数指标超出预设范围时,需要人员停止该腔室的工作,即使腔室离线,该使腔室离线的方式人为因素影响比较大,人员从接到通知到使腔室离线往往需要耗时1-4小时不等,这样不能在第一时间使腔室离线,后续晶片会继续进入该腔室进行工艺,可能导致晶片工艺不达标甚至导致晶片报废。At present, in the field of semiconductors, the factory automation system monitors the status of the equipment, especially the various parameters of the equipment during the process. Once a certain parameter of a certain chamber of the equipment is out of control (Out Of Control, hereinafter referred to as OOC), That is, when a certain parameter index exceeds the preset range, personnel are required to stop the work of the chamber. Even if the chamber is offline, the way to make the chamber offline is greatly influenced by human factors. It takes 1-4 hours, so the chamber cannot be taken offline at the first time, and subsequent wafers will continue to enter the chamber for processing, which may cause the wafer process to fail to meet the standard or even cause the wafer to be scrapped.
进一步,人为使腔室离线,可能会导致整个设备的其他腔室也暂时无法使用,即耗时又费力同时还影响机台的正常运行和产量。Further, artificially taking the chamber offline may cause other chambers of the entire equipment to be temporarily unavailable, which is time-consuming and laborious, and also affects the normal operation and output of the machine.
发明内容Contents of the invention
本发明旨在至少解决现有技术中存在的技术问题之一,提出了一种腔室离线控制方法及系统。The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a chamber off-line control method and system.
为实现本发明的目的而提供一种腔室离线控制方法,所述方法包括:To achieve the object of the present invention, a chamber off-line control method is provided, the method comprising:
当接收到一腔室处于非正常工艺状态的通知信息时,判断所述腔室是否容纳有晶片;When receiving notification information that a chamber is in an abnormal process state, judging whether the chamber contains wafers;
若判断结果为是,则向所述腔室发送晶片传出指令,以尝试控制所述腔室将所述晶片传出该腔室;If the judgment result is yes, sending a wafer transfer command to the chamber to try to control the chamber to transfer the wafer out of the chamber;
再次判断所述腔室中是否容纳有晶片;Judging again whether wafers are accommodated in the chamber;
若所述再次判断的结果为否,则向所述腔室发送离线指令,以控制所述腔室转为离线状态。If the result of the re-judgment is negative, an offline command is sent to the chamber to control the chamber to be in an offline state.
优选地,所述控制所述腔室转为离线状态的步骤之后,还包括:Preferably, after the step of controlling the chamber to go offline, it also includes:
判断当前工艺任务中是否存在与所述腔室中的晶片属于同一批次的待加工晶片;Judging whether there are wafers to be processed belonging to the same batch as the wafers in the chamber in the current process task;
若判断结果为是,则调度其他待加工晶片进入至处于在线状态的腔室进行工艺,以完成当前所述工艺任务。If the judgment result is yes, other wafers to be processed are scheduled to enter the online chamber for processing, so as to complete the current processing task.
优选地,所述控制所述腔室转为离线状态的步骤之后,还包括:Preferably, after the step of controlling the chamber to go offline, it also includes:
向指定终端发送故障检修信息和/或警报信息。Send troubleshooting information and/or alarm information to designated terminals.
优选地,所述当接收到一腔室处于非正常工艺状态的通知信息的步骤之后,且判断所述腔室中是否容纳有晶片的步骤之前,还包括:重新获取新的物料传输路径,以完成所述晶片对应的所述工艺任务;以及所述尝试控制所述腔室将所述晶片传出该腔室的步骤之后,且再次判断所述腔室中是否容纳有晶片的步骤之前,还包括:根据已获取的所述能够完成所述晶片的工艺任务的新的物料传输路径来传输所述晶片。Preferably, after the step of receiving the notification information that a chamber is in an abnormal process state, and before the step of judging whether wafers are accommodated in the chamber, it further includes: reacquiring a new material transmission path to completing the process task corresponding to the wafer; and after the step of trying to control the chamber to transfer the wafer out of the chamber and before the step of judging again whether a wafer is contained in the chamber, The method includes: transporting the wafer according to the acquired new material transport path capable of completing the process task of the wafer.
优选地,所述控制所述腔室转为离线状态,包括:Preferably, said controlling said chamber to turn off-line includes:
控制所述腔室停止当前工艺;以及在预设时间段内,控制所述腔室之外的处于在线状态的腔室或其他设备拒绝接收处于非正常工艺状态的所述腔室所发出的信息。Control the chamber to stop the current process; and within a preset period of time, control the online chamber or other equipment other than the chamber to refuse to receive the information sent by the chamber in the abnormal process state .
优选地,所述非正常工艺状态的通知信息,包括:Preferably, the notification information of the abnormal process state includes:
至少一个超出预设指标范围的电源值、功率值、压力值以及工艺气体流量值。At least one power supply value, power value, pressure value and process gas flow value are out of the preset index range.
优选地,所述控制所述腔室转为离线状态的步骤之后,还包括:Preferably, after the step of controlling the chamber to go offline, it also includes:
判断所述晶片在进入所述腔室之前、装载该晶片的晶圆传送盒中是否存在未出盒晶片;judging whether there are unloaded wafers in the FOUP loaded with the wafers before the wafers enter the chamber;
若判断结果为是,则停止从该晶圆传送盒中拾取晶片。If the determination result is yes, stop picking up wafers from the FOUP.
优选地,在所述判断所述腔室是否容纳有晶片的步骤之后,Preferably, after the step of judging whether the chamber contains wafers,
若判断结果为否,则直接向所述腔室发送离线指令,以控制所述腔室转为离线状态。If the judgment result is no, an offline command is directly sent to the chamber to control the chamber to be in an offline state.
一种腔室离线控制系统,包括:状态判断模块以及离线控制模块;An off-line control system for a chamber, comprising: a state judging module and an off-line control module;
所述状态判断模块,在接收到一腔室处于非正常工艺状态的通知信息时,判断所述腔室是否容纳有晶片;若判断结果为是,则向所述离线控制模块发送晶片传出指令;The state judging module, when receiving a notification that a chamber is in an abnormal process state, judges whether the chamber contains a wafer; if the judgment result is yes, then sends a wafer outgoing instruction to the off-line control module ;
所述状态判断模块还用于再次判断所述腔室中是否容纳有晶片;若所述腔室中未容纳有晶片,则向所述离线控制装置发送离线指令;The state judging module is also used to judge again whether wafers are accommodated in the chamber; if no wafers are accommodated in the chamber, send an offline command to the offline control device;
所述离线控制模块用于在接收到所述晶片传出指令时,尝试控制所述腔室将所述晶片传出该腔室;在接收到所述离线指令时,控制所述腔室转为离线状态。The off-line control module is configured to attempt to control the chamber to transfer the wafer out of the chamber when receiving the wafer-out instruction; when receiving the off-line instruction, control the chamber to turn Offline status.
优选地,还包括:Preferably, it also includes:
警报模块,用于在所述腔室转为离线状态之后,向指定终端发送故障检修和/或报警信息。The alarm module is configured to send troubleshooting and/or alarm information to a designated terminal after the chamber is turned off-line.
本发明具有以下有益效果:The present invention has the following beneficial effects:
本发明提供的腔室离线控制方法及系统的技术方案中,当接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若是,则向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室;再次判断腔室中是否容纳有晶片;若再次判断的结果为否,则向腔室发送离线指令,以控制腔室转为离线状态。因此,遇到工艺OOC后设备能够自动接受命令,识别腔室是否还有未出片的晶片,有则不出片,并且同时等待出现OOC问题的晶片传出该腔室后立即离线该腔室,因此,并不需要人员手动终止当前运行的工作,更重要的一点是能够保证后续晶片不会再进入OOC腔室工艺影响后续晶片工艺质量甚至出现报废的情况,减小了机台的损失,提高了机台产量。In the technical scheme of the chamber off-line control method and system provided by the present invention, when receiving the notification information that a chamber is in an abnormal process state, it is judged whether the chamber contains a wafer; if so, the wafer is sent out to the chamber command to try to control the chamber to transfer the wafer out of the chamber; judge again whether there is a wafer in the chamber; if the result of the judgment again is no, then send an offline command to the chamber to control the chamber to go offline. Therefore, after the process OOC, the equipment can automatically accept the order, identify whether there are still undischarged wafers in the chamber, and if there are any, the wafers will not be discharged, and at the same time wait for the wafers with OOC problems to pass out of the chamber and immediately offline the chamber Therefore, there is no need for personnel to manually terminate the current running work. More importantly, it can ensure that subsequent wafers will not enter the OOC chamber process to affect the quality of subsequent wafer processes or even be scrapped, reducing the loss of the machine. Increased machine output.
附图说明Description of drawings
图1为本发明实施例一提供的腔室离线控制方法的流程框图;FIG. 1 is a flowchart of a chamber off-line control method provided in
图2为本发明实施例二提供的腔室离线控制方法的流程框图;FIG. 2 is a flowchart of a chamber off-line control method provided in
图3为本发明实施例三提供的腔室离线控制方法的流程框图;FIG. 3 is a flowchart of a chamber off-line control method provided in
图4为本发明实施例四提供的腔室离线控制方法的流程框图;FIG. 4 is a flowchart of a chamber off-line control method provided in Embodiment 4 of the present invention;
图5为本发明实施例五提供的腔室离线控制方法的流程框图;FIG. 5 is a flowchart of a chamber off-line control method provided in Embodiment 5 of the present invention;
图6为本发明实施例六提供的腔室离线控制系统的结构示意图;FIG. 6 is a schematic structural diagram of a chamber off-line control system provided by Embodiment 6 of the present invention;
图7为本发明实施例七提供的腔室离线控制系统的结构示意图。FIG. 7 is a schematic structural diagram of an off-line chamber control system provided by Embodiment 7 of the present invention.
具体实施方式Detailed ways
为使本领域的技术人员更好地理解本发明的技术方案,下面结合附图来对本发明提供的腔室离线控制方法及系统进行详细描述。In order for those skilled in the art to better understand the technical solutions of the present invention, the chamber off-line control method and system provided by the present invention will be described in detail below with reference to the accompanying drawings.
实施例一Embodiment one
如图1所示,为本发明实施例一提供的腔室离线控制方法的流程框图,本发明实施例一中,腔室离线控制方法包括:As shown in FIG. 1 , it is a flow chart of the chamber off-line control method provided in
步骤101:当接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若是,执行步骤102。Step 101 : When receiving notification information that a chamber is in an abnormal process state, determine whether the chamber contains wafers; if yes, perform
具体地,非正常工艺状态的通知信息包括:至少一个超出预设指标范围的电源值、功率值、压力值以及工艺气体流量值。Specifically, the notification information of the abnormal process state includes: at least one power supply value, power value, pressure value, and process gas flow value exceeding a preset index range.
进一步,预设指标范围是针对不同参数指标设置的不同的参数指标范围值,该不同的参数指标范围值由不同工艺要求以及不同机台型号确定。Further, the preset index ranges are different parameter index range values set for different parameter indexes, and the different parameter index range values are determined by different process requirements and different machine models.
步骤102:向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室。Step 102: Send a wafer transfer command to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
步骤103:再次判断腔室中是否容纳有晶片;若否,执行步骤104。Step 103: judge again whether there is a wafer in the chamber; if not, go to
步骤104:向腔室发送离线指令,以控制腔室转为离线状态。Step 104: Send an offline command to the chamber to control the chamber to go offline.
具体地,控制腔室转为离线状态,包括:控制腔室停止当前工艺;以及在预设时间段内,控制腔室之外的处于在线状态的腔室或其他设备拒绝接收处于非正常工艺状态的腔室所发出的信息。Specifically, the control chamber is turned offline, including: the control chamber stops the current process; and within a preset period of time, the chambers or other equipment in the online state other than the control chamber refuse to receive the abnormal process state information from the chamber.
具体地,预设时间可以由工艺需求确定。Specifically, the preset time may be determined by process requirements.
本发明实施例提供的腔室离线控制方法,当接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若是,则向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室;再次判断腔室中是否容纳有晶片;若再次判断的结果为否,则向腔室发送离线指令,以控制腔室转为离线状态。因此,遇到工艺OOC后设备能够自动接受命令,识别腔室是否还有未出片的晶片,有则不出片,并且同时等待出现OOC问题的晶片传出该腔室后立即离线该腔室,因此,并不需要人员手动终止当前运行的工作,更重要的一点是能够保证后续晶片不会再进入OOC腔室工艺影响后续晶片工艺质量甚至出现报废的情况,减小了机台的损失,提高了机台产量。The chamber off-line control method provided by the embodiment of the present invention, when receiving a notification information that a chamber is in an abnormal process state, judges whether the chamber contains a wafer; if so, sends a wafer outgoing instruction to the chamber to try The control chamber transfers the wafer out of the chamber; judges again whether there is a wafer in the chamber; if the result of the judgment again is no, then sends an offline command to the chamber to control the chamber to be in an offline state. Therefore, after the process OOC, the equipment can automatically accept the order, identify whether there are still undischarged wafers in the chamber, and if there are any, the wafers will not be discharged, and at the same time wait for the wafers with OOC problems to pass out of the chamber and immediately offline the chamber Therefore, there is no need for personnel to manually terminate the current running work. More importantly, it can ensure that subsequent wafers will not enter the OOC chamber process to affect the quality of subsequent wafer processes or even be scrapped, reducing the loss of the machine. Increased machine output.
实施例二Embodiment two
如图2所示,为本发明实施例二提供的腔室离线控制方法的流程框图,本发明实施例二中,腔室离线控制方法包括:As shown in FIG. 2 , it is a flow chart of the chamber off-line control method provided in
步骤201:当接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若是,执行步骤202;若否,执行步骤204。Step 201 : When receiving a notification that a chamber is in an abnormal process state, determine whether the chamber contains wafers; if yes, perform
步骤202:向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室。Step 202: Send a wafer transfer command to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
步骤203:再次判断腔室中是否容纳有晶片;若否,执行步骤204。Step 203: judge again whether there is a wafer in the chamber; if not, go to step 204.
步骤204:向腔室发送离线指令,以控制腔室转为离线状态。Step 204: Send an offline command to the chamber to control the chamber to go offline.
步骤205:判断当前工艺任务中是否存在与腔室中的晶片属于同一批次的待加工晶片;若是,执行步骤206。Step 205: Determine whether there are wafers to be processed belonging to the same batch as the wafers in the chamber in the current process task; if yes, execute
步骤206:调度待加工晶片进入至处于在线状态的腔室进行工艺,已完成当前工艺任务。Step 206: Scheduling the wafers to be processed to enter the online chamber for processing, and the current processing task has been completed.
本发明实施例二提供的腔室离线控制方法,对于片盒中未出片的晶片不再出片盒,对于片盒中已出片的同一腔室的、同一批次的待加工晶片,控制代加工晶片进入处于在先状态的腔室,以对待加工晶片进行工艺。一方面能够及时离线指定腔室,避免已出晶片再次进入有问题的腔室,对于已出片的晶片利用处于在线状态的腔室完成工艺,直至值班人员来到设备端检查有问题的腔室即可,减小了机台的损失;另一方面,保证机台不会因为有问题的腔室,使整个机台停止工作,影响机台产量。In the chamber off-line control method provided by
实施例三Embodiment Three
如图3所示,为本发明实施例三提供的腔室离线控制方法的流程框图,本发明实施例三中,腔室离线控制方法包括:As shown in FIG. 3 , it is a flow chart of the chamber off-line control method provided by
步骤301:当接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若是,执行步骤302;若否,执行步骤304。Step 301 : When receiving a notification that a chamber is in an abnormal process state, determine whether the chamber contains wafers; if yes, perform
步骤302:向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室。Step 302: Send a wafer transfer command to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
步骤303:再次判断腔室中是否容纳有晶片;若否,执行步骤304。Step 303: judge again whether there is a wafer in the chamber; if not, go to step 304.
步骤304:向腔室发送离线指令,以控制腔室转为离线状态。Step 304: Send an offline command to the chamber to control the chamber to go offline.
步骤305:向指定终端发送故障检修信息和/或警报信息。Step 305: Send troubleshooting information and/or alarm information to a designated terminal.
具体地,指定终端可以是维修人员的终端,向指定终端发送故障检修信息和/或警报信息,可以便于维修人员及时得到信息。Specifically, the designated terminal may be the terminal of the maintenance personnel, and sending troubleshooting information and/or alarm information to the designated terminal can facilitate the maintenance personnel to obtain information in time.
本发明实施例三提供的腔室离线控制方法,进一步,在控制指定腔室离线之后,发出表示检查指定腔室的通知信息和/或报警,以有效提示操作人员对指定腔室进行检修,进一步提高了机台了工作效率。In the chamber off-line control method provided by
实施例四Embodiment Four
如图4所示,为本发明实施例四提供的腔室离线控制方法的流程框图,本发明实施例四中,腔室离线控制方法包括:As shown in FIG. 4 , it is a flow chart of the chamber off-line control method provided by Embodiment 4 of the present invention. In Embodiment 4 of the present invention, the chamber off-line control method includes:
步骤401:接收一腔室处于非正常工艺状态的通知信息。Step 401: Receive notification information that a chamber is in an abnormal process state.
步骤402:重新获取新的物料传输路径,以完成晶片对应的工艺任务。Step 402: re-acquire a new material transmission path to complete the process task corresponding to the wafer.
步骤403:判断腔室是否容纳有晶片;若是,执行步骤404;若否,执行步骤407。Step 403: Determine whether the chamber contains wafers; if yes, perform
步骤404:向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室。Step 404: Send a wafer transfer command to the chamber to attempt to control the chamber to transfer the wafer out of the chamber.
步骤405:根据已获取的能够完成晶片的工艺任务的新的物料传输路径来传输晶片。Step 405: Transfer the wafer according to the acquired new material transfer path that can complete the process task of the wafer.
步骤406:再次判断腔室中是否容纳有晶片;若否,执行步骤407。Step 406 : Determine again whether there are wafers in the chamber; if not, go to
步骤407:向腔室发送离线指令,以控制腔室转为离线状态。Step 407: Send an offline command to the chamber to control the chamber to go offline.
本发明实施例四提供的腔室离线控制方法,在接收到腔室离线的指令时,重新计算出新的物料传输路径,按新的物料传输路径完成晶片对应的工艺任务,可以使机台在指定腔室即将离线时,继续使指定腔室之外的腔室参与工作,保证了机台的工作效率。The chamber off-line control method provided by Embodiment 4 of the present invention recalculates a new material transmission path when receiving the chamber off-line command, and completes the process task corresponding to the wafer according to the new material transmission path, so that the machine can When the designated chamber is about to go offline, the chambers other than the designated chamber will continue to participate in the work, ensuring the working efficiency of the machine.
实施例五Embodiment five
如图5所示,为本发明实施例五提供的腔室离线控制方法的流程框图,本发明实施例五中,腔室离线控制方法包括:As shown in FIG. 5, it is a flow chart of the chamber off-line control method provided by Embodiment 5 of the present invention. In Embodiment 5 of the present invention, the chamber off-line control method includes:
步骤501:当接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若是,执行步骤502。Step 501 : When receiving notification information that a chamber is in an abnormal process state, determine whether the chamber contains wafers; if yes, perform
步骤502:向腔室发送晶片传出指令,以尝试控制腔室将晶片传出该腔室。Step 502: Send a wafer transfer command to the chamber to try to control the chamber to transfer the wafer out of the chamber.
步骤503:再次判断腔室中是否容纳有晶片;若否,执行步骤504。Step 503 : Determine again whether there is a wafer in the chamber; if not, go to
步骤504:向腔室发送离线指令,以控制腔室转为离线状态。Step 504: Send an offline command to the chamber to control the chamber to go offline.
步骤505:判断晶片在进入腔室之前、装载该晶片的晶圆传送盒中是否存在未出盒晶片;若是,执行步骤506。Step 505: Determine whether there are unloaded wafers in the FOUP loaded with the wafer before the wafer enters the chamber; if yes, execute
步骤506:则停止从该晶圆传送盒中拾取晶片。Step 506: Stop picking up wafers from the FOUP.
发明实施例五提供的腔室离线控制方法,在控制腔室转为离线状态后,通过判断晶片在进入腔室之前、装载该晶片的晶圆传送盒中是否存在未出盒晶片,若是,则停止从该晶圆传送盒中拾取晶片。通过本实施例,提高了晶盒传送盒中晶片传输的安全性。In the chamber off-line control method provided by Embodiment 5 of the invention, after the control chamber is turned into an offline state, by judging whether there are unloaded wafers in the FOUP loaded with the wafer before the wafer enters the chamber, if so, then Stop picking wafers from this FOUP. Through this embodiment, the security of wafer transmission in the cassette transfer box is improved.
实施例六Embodiment six
如图6所示,为本发明实施例六提供的腔室离线控制系统的结构示意图,本发明实施例六中,腔室离线控制系统包括:状态判断模块1以及离线控制装置2。As shown in FIG. 6 , it is a schematic structural diagram of the chamber off-line control system provided by Embodiment 6 of the present invention. In Embodiment 6 of the present invention, the chamber off-line control system includes: a
状态判断模块1,在接收到一腔室处于非正常工艺状态的通知信息时,判断腔室是否容纳有晶片;若判断结果为是,则向离线控制模块发送晶片传出指令;The
状态判断模块1还用于再次判断腔室中是否容纳有晶片;若腔室中未容纳有晶片,则向离线控制装置发送离线指令;The
离线控制模块2用于在接收到晶片传出指令时,尝试控制腔室将晶片传出该腔室;在接收到离线指令时,控制腔室转为离线状态。The
本发明实施例六提供的腔室离线控制系统,遇到工艺OOC后设备能够自动接受命令,识别腔室是否还有未出片的晶片,有则不出片,并且同时等待出现OOC问题的晶片传出该腔室后立即离线该腔室,因此,并不需要人员手动终止当前运行的工作,更重要的一点是能够保证后续晶片不会再进入OOC腔室工艺影响后续晶片工艺质量甚至出现报废的情况,减小了机台的损失,提高了机台产量。In the chamber off-line control system provided by Embodiment 6 of the present invention, the equipment can automatically accept commands after encountering a process OOC, and identify whether there are still undischarged wafers in the chamber. Immediately after the chamber is released, the chamber is offline. Therefore, there is no need for personnel to manually terminate the current running work. More importantly, it can ensure that subsequent wafers will not enter the OOC chamber again, which will affect the process quality of subsequent wafers or even be scrapped. In the case of the machine, the loss of the machine is reduced and the output of the machine is improved.
实施例七Embodiment seven
如图7所示,为本发明实施例七提供的腔室离线控制系统的结构示意图,相当于图6所示实施例,本实施例七中,腔室离线控制系统还包括:警报模块3。As shown in FIG. 7 , the schematic structural diagram of the chamber off-line control system provided by Embodiment 7 of the present invention is equivalent to the embodiment shown in FIG. 6 . In this embodiment 7, the chamber off-line control system further includes: an
警报模块3用于在腔室转为离线状态之后,向指定终端发送故障检修和/或报警信息。The
本发明实施例七提供的腔室离线控制系统,警报模块在控制指定腔室离线之后,发出表示检查指定腔室的通知信息和/或报警,以有效提示操作人员对指定腔室进行检修,进一步提高了机台了工作效率。In the chamber off-line control system provided by Embodiment 7 of the present invention, after the alarm module controls the designated chamber to go offline, it sends a notification message and/or an alarm indicating that the designated chamber is inspected, so as to effectively prompt the operator to perform maintenance on the designated chamber, and further Improve the work efficiency of the machine.
综上,本发明实施例提供的腔室离线控制方法及系统,遇到工艺OOC后设备能够自动接受命令,重新进行调度计算,识别设备端是否还有未出片的晶片,有则不出片,并且同时等待出现OOC问题的晶片传出该腔室后立即离线该腔室,对于已出片的晶片利用其他腔室完成工艺最后回到片盒,值班人员来到设备端检查有问题的腔室即可,并不需要人员手动终止当前运行的工作,更重要的一点是能够保证后续晶片不在进入OOC腔室工艺影响后续晶片工艺质量甚至出现报废的情况。To sum up, the chamber off-line control method and system provided by the embodiments of the present invention can automatically accept commands after encountering process OOC, perform scheduling calculations again, and identify whether there are still undischarged wafers at the equipment end, and if there are, no wafers will be produced. , and at the same time wait for the wafers with OOC problems to pass out of the chamber and immediately go offline. For the wafers that have been released, use other chambers to complete the process and finally return to the cassette. The on-duty personnel will come to the equipment to check the problematic chamber. It only needs to be in the OOC chamber, and there is no need for personnel to manually terminate the current running work. More importantly, it can ensure that the subsequent wafers will not enter the OOC chamber process to affect the quality of the subsequent wafer process or even be scrapped.
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。It can be understood that, the above embodiments are only exemplary embodiments adopted for illustrating the principle of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911103566.6A CN110783236B (en) | 2019-11-12 | 2019-11-12 | Chamber offline control method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911103566.6A CN110783236B (en) | 2019-11-12 | 2019-11-12 | Chamber offline control method and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110783236A CN110783236A (en) | 2020-02-11 |
| CN110783236B true CN110783236B (en) | 2023-06-16 |
Family
ID=69390792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911103566.6A Active CN110783236B (en) | 2019-11-12 | 2019-11-12 | Chamber offline control method and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110783236B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112484922A (en) * | 2020-11-13 | 2021-03-12 | 北京北方华创微电子装备有限公司 | Process chamber leakage rate detection method and semiconductor process equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5452349B2 (en) * | 2010-05-11 | 2014-03-26 | 東京エレクトロン株式会社 | To-be-processed object conveying method, to-be-treated object conveying apparatus, and program |
| CN103227126A (en) * | 2013-03-27 | 2013-07-31 | 上海宏力半导体制造有限公司 | Interlock control system |
| US9606519B2 (en) * | 2013-10-14 | 2017-03-28 | Applied Materials, Inc. | Matching process controllers for improved matching of process |
| CN104952761B (en) * | 2014-03-27 | 2018-11-06 | 北京北方华创微电子装备有限公司 | Semiconductor equipment technique processes the method and system of abnormality processing |
| CN105807732B (en) * | 2014-12-31 | 2018-11-06 | 北京北方华创微电子装备有限公司 | Semiconductor technology control method and semiconductor technology control system |
| CN105810618B (en) * | 2016-05-31 | 2018-08-10 | 北京七星华创电子股份有限公司 | Improve the system and method for wafer transfer efficiency |
-
2019
- 2019-11-12 CN CN201911103566.6A patent/CN110783236B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110783236A (en) | 2020-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101097912B1 (en) | Substrate processing apparatus | |
| CN111118458B (en) | Chamber cleaning method and apparatus | |
| US6795745B1 (en) | Methods of operating vacuum processing equipment and methods of processing wafers | |
| US10133264B2 (en) | Method of performing aging for a process chamber | |
| CN107272630A (en) | A kind of automatic production line method for scheduling task | |
| CN101996359A (en) | Dispatching method of semiconductor manufacturing process | |
| CN110783236B (en) | Chamber offline control method and system | |
| CN101615025B (en) | Maintenance control method and system used for semiconductor processing equipment | |
| CN115116909A (en) | Wafer scheduling control method and device under abnormal working condition of semiconductor processing equipment | |
| CN104142632B (en) | The process task processing method of semiconductor equipment and system | |
| CN113436991B (en) | Wafer scheduling method and system for batch processing semiconductor equipment | |
| US7505828B2 (en) | Carrier transportation management system and method for internal buffer process tools | |
| CN111952211B (en) | Wafer scheduling method and device, semiconductor processing equipment, storage medium | |
| CN114361075B (en) | Semiconductor process method and semiconductor process equipment | |
| CN108227508B (en) | Wafer Loader Efficiency Monitoring Method | |
| CN215250966U (en) | Blast furnace top charging bucket sealing system | |
| CN103811375A (en) | Loading and unloading device for batch processing of silicon chips, equipment and method thereof | |
| CN113848831A (en) | Automatic statistics and control method and system for utilization rate of old equipment | |
| CN118849019B (en) | Robot control system, power supply monitoring method, robot and storage device | |
| KR102128722B1 (en) | Inspection method of Apparatus for Processing Substrate | |
| CN120006240A (en) | Semiconductor process equipment and control method thereof | |
| CN120428675A (en) | Panel production control method and system | |
| CN121436431A (en) | Wafer batch dispatching method and system | |
| CN121143236A (en) | Intelligent dispatching method for automatic start-stop function of electrolytic aluminum plant based on industrial control data platform | |
| CN120428666A (en) | A DCS control system and control method for artificial graphite negative electrode material finished product process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |