CN110767730A - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
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- CN110767730A CN110767730A CN201911051206.6A CN201911051206A CN110767730A CN 110767730 A CN110767730 A CN 110767730A CN 201911051206 A CN201911051206 A CN 201911051206A CN 110767730 A CN110767730 A CN 110767730A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The application relates to a display panel, a preparation method thereof and a display device. The display panel comprises a flexible substrate, a display device layer, an ultrathin glass packaging layer and a first packaging part. The first packaging part is located between the flexible substrate base plate and the ultrathin glass packaging layer, and the first packaging part, the flexible substrate base plate and the ultrathin glass packaging layer are matched with the display device layer. The ultra-thin glass encapsulation layer and the first encapsulation part can improve the encapsulation performance of the display panel. The flexible substrate and the ultrathin glass packaging layer are adopted, so that the extrusion resistance, tensile resistance or bending resistance of the display panel are enhanced. The application provides a display panel has synthesized display panel's life.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
With the continuous development of display technology, the application of display panels is becoming more and more extensive, and Organic Light Emitting Diode (OLED) display panels are becoming more and more attractive in display panel industry due to the advantages of fast response speed, bright color, light and thin convenience, and the like.
At present, the display panel is widely applied to different technical fields to form different products. The flexible display panel has various forms and is concerned in the industry, however, at present, the flexible display panel is usually packaged by a thin film packaging process, and a thin film packaging layer is easily damaged after the flexible display panel is bent for many times, which results in a poor service life of the display panel.
Disclosure of Invention
Therefore, the display panel and the preparation method thereof and the display device are provided, wherein the packaging performance and the bending performance can be both achieved.
A display panel, comprising: the display device comprises a flexible substrate, a display device layer and an ultrathin glass packaging layer which are arranged in a stacked mode;
further comprising: the display device comprises a flexible substrate, an ultrathin glass packaging layer and a first packaging part, wherein the first packaging part is positioned between the flexible substrate and the ultrathin glass packaging layer, and the first packaging part, the flexible substrate and the ultrathin glass packaging layer are matched with each other to package the display device layer.
In one embodiment, the flexible substrate includes: an ultra-thin glass substrate.
In one embodiment, the ultra-thin glass substrate has a thickness of 0.05mm to 0.25 mm.
In one embodiment, the display panel further includes:
and the opening penetrates through the display device layer along a first direction, and the first direction is the direction in which the flexible substrate, the display device layer and the ultrathin glass packaging layer are stacked.
In one embodiment, the opening penetrates through the flexible substrate and the ultra-thin glass encapsulation layer along the first direction.
In one embodiment, further comprising: and the second packaging part is positioned between the flexible substrate and the ultrathin glass packaging layer, and the second packaging part, the flexible substrate and the ultrathin glass packaging layer are matched with each other to package the opening of the display device layer.
In one embodiment, the ultra-thin glass encapsulation layer has a thickness of 0.1mm to 0.2 mm.
A display device, comprising: the display panel of any of the above.
A preparation method of a display panel comprises the following steps:
forming a flexible substrate base plate on the hard substrate;
forming a display device layer on the flexible substrate;
forming an ultra-thin glass encapsulation layer on the display device layer;
forming a first packaging part between the flexible substrate and the ultrathin glass packaging layer;
the display device layer is packaged through the cooperation of the ultrathin glass packaging layer, the flexible substrate and the first packaging part;
and separating the hard substrate from the flexible substrate base plate.
In one embodiment, after the step of forming the display device layer on the flexible substrate, the method further comprises:
the display device layer is penetrated along a first direction to form an opening, and the first direction is the direction in which the flexible substrate, the display device layer and the ultrathin glass packaging layer are stacked.
The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a flexible substrate, a display device layer, an ultrathin glass packaging layer and a first packaging part. The first packaging part is located between the flexible substrate base plate and the ultrathin glass packaging layer, and the first packaging part, the flexible substrate base plate and the ultrathin glass packaging layer are matched with one another to package the display device layer. The ultra-thin glass encapsulation layer and the first encapsulation part can improve the encapsulation performance of the display panel. The flexible substrate and the ultrathin glass packaging layer are adopted, so that the extrusion resistance, tensile resistance or bending resistance of the display panel are enhanced. The application provides a display panel has synthesized display panel's life.
Drawings
Fig. 1 is a schematic view of a display panel structure provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of a display panel according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a display panel structure provided in an embodiment of the present application;
FIG. 4 is a schematic diagram of a display panel structure provided in an embodiment of the present application;
FIG. 5 is a schematic diagram of a display panel structure provided in an embodiment of the present application;
FIG. 6 is a schematic diagram of a display panel structure provided in an embodiment of the present application;
fig. 7 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure.
The reference numbers illustrate:
Flexible substrate 111
Ultra-thin glass substrate 112
Ultra-thin glass encapsulation layer 130
First via 150
First blind hole 152
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 1, the present application provides a display panel, including: a flexible substrate 110, a display device layer 120, an ultra-thin glass encapsulation layer 130, and a first encapsulation part 140. The display device layer is located between the flexible substrate and the ultra-thin glass packaging layer, the first packaging part 140 is located between the flexible substrate 110 and the ultra-thin glass packaging layer 130, and the display device layer 120 is packaged by the first packaging part 140, the flexible substrate 110 and the ultra-thin glass packaging layer 130 in a matched mode.
The flexible substrate 110 may include two or more layers. The substrate of each layer may be a flexible material or an elastomeric material. The flexible or elastic material is a material that can be deformed by compression. For example, in one embodiment, the flexible substrate 110 includes a PI substrate layer (PI is an abbreviation for polyimide, PI is a polymer having an imido group in its main chain) or a PDMS substrate layer (PDMS is polydimethylsiloxane) or a PET substrate layer (PET is an abbreviation for polyethylene terephthalate).
The display device layer 120 is disposed on the flexible substrate 110. The display device layer 120 may specifically include a thin film transistor array layer, an organic light emitting diode display layer, or a touch layer. The display device layer 120 may further include other display devices or display control layers, which are not specifically limited herein.
The ultra-thin glass encapsulation layer 130 is disposed on the surface of the display device layer 120 away from the flexible substrate 110. The display device layer 120 is adjacent to the ultra-thin glass layer encapsulation layer 130. Specifically, the ultra-thin glass encapsulation layer 130 may directly cover the surface of the display device layer 120. The ultra-thin glass encapsulation layer 130 may be soda glass, potassium glass, aluminum magnesium glass, or aluminosilicate glass. It should be noted that, in the conventional display panel 10, a glass encapsulation layer with a relatively large thickness is used for encapsulation, and the glass encapsulation layer with a relatively large thickness cannot be applied to a flexible panel because the glass encapsulation layer with a relatively large thickness cannot be bent. In this embodiment, the thickness of the ultra-thin glass encapsulation layer 130 may be determined according to the bending performance parameters of the glass made of various materials and the bending angle of the flexible display panel, so that the ultra-thin glass encapsulation layer 130 can give consideration to both the encapsulation strength and the bending performance. For example, the thickness of the ultra-thin glass encapsulation layer 130 may be set between 0.1mm-0.2mm, and ultra-thin glass encapsulation layers in this thickness range are particularly suitable for flexible display panels such as smart phone panels.
The first encapsulation part 140 is disposed between the ultra-thin glass encapsulation layer 130 and the flexible substrate 110. The first encapsulation part 140 may be formed around the display device layer 120 and disposed around the display device layer 120 to wrap the display device layer 120 in the middle to prevent the display device layer 120 from being attacked by water and oxygen. The first encapsulation part 140 serves to prevent water and oxygen from laterally intruding into each structural layer of the display device layer 120.
In this embodiment, the display panel 10 includes the ultra-thin glass sealing layer 130 and the first sealing portion 140, so that the waterproof performance of the display panel 10 can be improved, and the service life of the display panel 10 can be prolonged. Meanwhile, the ultra-thin glass encapsulation layer 130 has certain hardness, mechanical strength and flexibility, so that the display panel 10 has a stronger encapsulation effect and a longer service life. In this embodiment, the ultra-thin glass encapsulation layer 130 and the first encapsulation portion 140 can improve the encapsulation performance of the display panel 10, so that the encapsulation structure is not prone to failure, and the problem of poor display, such as black spots, is avoided. With the flexible substrate 110, the extrusion resistance, stretch resistance or bending resistance of the display panel 10 is enhanced. The application provides display panel 10 has comprehensively improved display panel 10's life. The ultra-thin glass encapsulation layer 130 of the display panel 10 has certain hardness and bending resistance, and the encapsulation effect is improved.
Referring to fig. 2, as a preferred embodiment, based on the above embodiment, the flexible substrate 110 includes an ultra-thin glass substrate 112. Specifically, the flexible substrate 110 may include a flexible substrate 111 and an ultra-thin glass substrate 112.
The flexible substrate 111 may be a flexible material or an elastic material. A flexible or elastic material is a material that can be deformed by compression. For example, the flexible substrate 111 may be a PI layer, a PDMS layer, or a PET layer. The ultra-thin glass substrate 112 is disposed on the surface of the flexible substrate 111, and the ultra-thin glass substrate 112 is in direct contact with the display device layer 120. The ultra-thin glass substrate 112 may be made of soda glass, potassium glass, aluminum-magnesium glass, or aluminosilicate glass. To simplify the manufacturing process, the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130 may be the same material. In this embodiment, the thickness of the ultra-thin glass substrate 112 may be determined according to the bending performance parameters of the glass made of various materials and the bending angle of the flexible display panel, so that the ultra-thin glass substrate 112 may have both the packaging strength and the bending performance. For example, the thickness of the ultra-thin glass substrate 112 may be set between 0.05mm-0.25mm, and the ultra-thin glass substrate 112 in this thickness range is particularly suitable for a flexible display panel such as a smartphone panel. In this embodiment, the flexible substrate 110 includes the ultra-thin glass substrate 112, and the ultra-thin glass substrate 112 has certain hardness and mechanical strength, and also has certain flexibility. The ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130 can well block water and oxygen from entering the display device layer 120.
Referring to fig. 3, as a preferred implementation manner, on the basis of the above embodiment, the display panel further includes an opening, where the opening penetrates through the display device layer 120 along a first direction, where the first direction is a direction in which the flexible substrate 110, the display device layer 120, and the ultra-thin glass encapsulation layer 130 are stacked. Specifically, in one embodiment, as shown in FIG. 3, the opening is a first blind hole 152. The first blind hole 152 is disposed in the display device layer 120 along a first direction, where the ultra-thin glass substrate 112, the display device layer 120, and the ultra-thin glass encapsulation layer 130 are stacked.
In this embodiment, the opening formed in the display panel 10 allows the display panel 10 to be added with additional structures. For example, when the display panel 10 is used as a vehicle-mounted display device, a camera or other structures requiring transparent detection may be disposed at the position of the opening, or other structures requiring cooperation with the display panel 10 may be disposed. In this embodiment, the arrangement of the first blind hole 152 enriches the use scenes of the display panel 10.
Referring to fig. 4, as a preferred implementation manner, on the basis of the foregoing embodiment, the display panel 10 further includes: and a third encapsulation part 153.
The third encapsulation part 153 is disposed between the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130, and is used for preventing water and oxygen from entering each structural layer of the display device layer 120 from the sidewall of the first blind via 152.
In this embodiment, the third encapsulation part 153 is directly disposed between the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130. As shown in fig. 4, the first encapsulation part 140, the third encapsulation part 153, the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130 are used for encapsulating the display device layer 120. In this embodiment, the third package portion 153 is arranged to enhance the waterproof performance of the first blind hole 152 in the display panel 10, so as to improve the service life of the display panel 10. Meanwhile, the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130 both have certain hardness and mechanical strength, so that the display panel 10 has a stronger encapsulation effect and a longer service life.
Referring to fig. 5, as a preferred implementation manner, in the above embodiment, the opening of the display panel 10 penetrates through the flexible substrate 110 and the ultra-thin glass encapsulation layer 130 along a first direction.
The first direction is a direction in which the flexible substrate 110, the display device layer 120, and the ultra-thin glass encapsulation layer 130 are stacked.
Specifically, in one embodiment, the display panel 10 further includes a first through hole 150 as shown in fig. 5. The first through hole 150 includes the ultra-thin glass encapsulation layer 130, the display device layer 120, and the flexible substrate 110 disposed along a first direction.
In this embodiment, the opening is formed in the display panel 10, so that the display panel 10 may be additionally provided with some additional structures. For example, when the display panel 10 is used as an in-vehicle display device, a pointer of an instrument panel may be disposed at the position of the opening, or other structures that need to be used in cooperation with the display panel 10 may be disposed. The arrangement of the holes enriches the use scene of the display panel 10.
Referring to fig. 6, as a preferred implementation manner, on the basis of the foregoing embodiment, the display panel 10 further includes: a second encapsulation part 151 for encapsulating the display device layer 120. The second encapsulation part 151 is located between the flexible substrate 110 and the ultra-thin glass encapsulation layer 130. The second encapsulation part 151, the flexible substrate 110 and the ultra-thin glass encapsulation layer 130 cooperate to encapsulate the opening of the display device layer 120.
In this embodiment, the second encapsulation part 151 is directly disposed between the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130. As shown in fig. 6, the first encapsulation part 140, the second encapsulation part 151, the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130 are used to wrap the display device layer 120. In this embodiment, the second sealing portion 151 may enhance the waterproof performance of the opening in the display panel 10, so as to prolong the service life of the display panel 10. Meanwhile, the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130 both have certain hardness and mechanical strength, so that the display panel 10 has a stronger encapsulation effect and a longer service life.
As a preferable implementation manner, on the basis of the above embodiment, the first encapsulation part 140, the second encapsulation part 151, or the third encapsulation part 153 is a glass frit encapsulation layer or a UV glue encapsulation layer.
In this embodiment, the first package portion 140, the second package portion 151, or the third package portion 153 may be formed by laser curing using glass frit, UV paste, or high-molecular resin. Wherein the spot size of the laser is covered with glass powder, UV glue or high-grouping resin. The energy of the laser light spot satisfies that the energy of the light spot center is the highest, and the energy gradually decreases from the light spot center to the two sides. The arrangement of the packaging part can realize the water and oxygen separation of the display panel, thereby improving the impact resistance of the display panel 10, reducing the curing process and cost, improving the production efficiency and prolonging the service life of the display panel 10.
Referring to fig. 7, the present application further provides a method for manufacturing a display panel. The display panel obtained by the manufacturing method of the display panel is shown in fig. 4. Specifically, the manufacturing method of the display panel comprises the following steps:
s100, a flexible substrate 110 is formed on the hard substrate. The flexible substrate 110 may include the flexible substrate 111 and the ultra-thin glass substrate 112 arranged in layers.
S200, forming a display device layer 120 on the flexible substrate 110. The display device layer 120 may specifically include a thin film transistor array layer, an organic light emitting diode display layer, or a touch layer. The display device layer 120 may further include other display devices or display control layers, which are not specifically limited herein.
S300, forming an ultra-thin glass encapsulation layer 130 on the display device layer 120. The ultra-thin glass encapsulation layer 130 may directly cover the surface of the display device layer 120. The ultra-thin glass encapsulation layer 130 may be soda glass, potassium glass, aluminum magnesium glass, aluminosilicate glass, or other feasible ultra-thin glass. The thickness of the single ultra-thin glass layer is generally between 0.03mm and 0.05mm, and the single ultra-thin glass layer is relatively soft, in this embodiment, the thickness of the ultra-thin glass encapsulation layer 130 may be set between 0.1mm and 0.2 mm. The thickness of the ultra-thin glass sealing layer 130 may also be determined according to the thickness of the display panel 10, and is not further limited herein.
S400, forming a first encapsulation part 140 between the flexible substrate 110 and the ultra-thin glass encapsulation layer 130. The first encapsulation part 140 serves to prevent water and oxygen from laterally intruding into each structural layer of the display device layer 120. The first direction is a direction in which the flexible substrate 110, the display device layer 120, and the ultra-thin glass encapsulation layer 130 are stacked. It is understood that the display device layer 120 forms a plane. Four first encapsulation parts 140 are respectively formed on four sides of the display device layer 120 to wrap the display device layer 120 in the middle, so as to prevent the display device layer 120 from being corroded by water and oxygen.
S500, cooperatively encapsulating the display device layer 120 through the ultra-thin glass encapsulation layer 130, the flexible substrate 110 and the first encapsulation part 140. Here, the ultra-thin glass encapsulation layer 130 and the flexible substrate 110 are two film layers parallel to each other. The first encapsulation part 140 is perpendicular to the ultra-thin glass encapsulation layer 130 and the flexible substrate 110, respectively.
S600, separating the hard substrate from the flexible substrate 110.
In this embodiment, the display panel 10 includes the flexible substrate 110, the display device layer 120, the ultra-thin glass encapsulation layer 130, and the first encapsulation portion 140. The first encapsulating portion 140 is located between the flexible substrate 110 and the ultra-thin glass encapsulating layer 130, and the first encapsulating portion 140, the flexible substrate 110 and the ultra-thin glass encapsulating layer 130 cooperate to encapsulate the display device layer 120. The ultra-thin glass encapsulation layer 130 and the first encapsulation part 140 may improve the encapsulation performance of the display panel 10. With the flexible substrate 110, the extrusion resistance, stretch resistance or bending resistance of the display panel 10 is enhanced. According to the preparation method of the display panel 10, the display panel 10 with long service life can be prepared.
In one embodiment, after the step of forming the display device layer 120 on the flexible substrate 110, the method further comprises:
an opening is formed through the display device layer 120 along a first direction, where the flexible substrate 110, the display device layer 120, and the ultra-thin glass encapsulation layer 130 are stacked.
Specifically, the opening formed in the display panel 10 may be a blind hole as shown in fig. 3 and 4, or a through hole as shown in fig. 5 and 6.
The application also provides a display device, which comprises the display panel 10 or the display panel 10 manufactured by adopting the display panel manufacturing method.
The display device may be an in-vehicle display device, and the specific display device may include: the flexible substrate 110, the display device layer 120, the ultra-thin glass encapsulation layer 130 and different encapsulation parts, which are formed by the flexible substrate 111 and the ultra-thin glass substrate 112.
The ultra-thin glass substrate 112, the display device layer 120 and the ultra-thin glass encapsulation layer 130 are stacked, and a through hole or a blind hole may be formed on the display device. When a through hole is formed between two ultra-thin glass layers (the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130), a structure penetrating the display panel 10 (e.g., a pointer in the middle of an automobile dashboard) may be provided. When blind vias are drilled between two ultra-thin glass layers (the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130), a transparent display or sensing structure (such as a camera or a sensor) can be disposed between the ultra-thin glass substrate 112 and the ultra-thin glass encapsulation layer 130.
In this embodiment, the display device provided may be an in-vehicle display device. For example, the in-vehicle display device having the through hole may be provided as an instrument panel of an automobile. And a pointer is arranged at the through hole in the middle of the instrument panel. The application provides display device can improve on-vehicle display device's (like the instrument dish) waterproof performance for on-vehicle display device's test security is higher, and the encapsulation effect can be long-term the maintenance. Besides the vehicle-mounted display, the display panel can be applied to other scenes as understood by those skilled in the art, and the details are not repeated herein.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display panel, comprising: the display device comprises a flexible substrate base plate (110), a display device layer (120), an ultrathin glass packaging layer (130) and a first packaging part (140), wherein the display device layer is located between the flexible substrate base plate (110) and the ultrathin glass packaging layer (130), the first packaging part (140) is located between the flexible substrate base plate (110) and the ultrathin glass packaging layer (130), and the first packaging part (140), the flexible substrate base plate (110) and the ultrathin glass packaging layer (130) are jointly matched and packaged with the display device layer (120).
2. The display panel according to claim 1, wherein the flexible substrate (110) comprises an ultra-thin glass substrate (112).
3. The display panel according to claim 2, wherein the ultra-thin glass substrate (112) has a thickness of 0.05mm to 0.25 mm.
4. The display panel according to claim 1, further comprising: and the opening penetrates through the display device layer (120) along a first direction, and the first direction is a direction in which the flexible substrate (110), the display device layer (120) and the ultrathin glass packaging layer (130) are stacked.
5. The display panel of claim 4, wherein the aperture extends through the flexible substrate (110) and the ultra-thin glass encapsulation layer (130) in the first direction.
6. The display panel of claim 5, further comprising a second encapsulation portion (151), wherein the second encapsulation portion (151) is located between the flexible substrate (110) and the ultra-thin glass encapsulation layer (130), and wherein the second encapsulation portion (151), the flexible substrate (110), and the ultra-thin glass encapsulation layer (130) cooperate to encapsulate the opening of the display device layer (120).
7. The display panel according to any of claims 1 to 6, wherein the thickness of the ultra-thin glass encapsulation layer (130) is 0.1mm-0.2 mm.
8. A display device, comprising: the display panel (10) of any one of claims 1-7.
9. A preparation method of a display panel is characterized by comprising the following steps:
forming a flexible substrate (110) on a hard substrate;
forming a display device layer (120) on the flexible substrate (110);
forming an ultra-thin glass encapsulation layer (130) on the display device layer (120);
forming a first encapsulation section (140) between the flexible substrate (110) and the ultra-thin glass encapsulation layer (130);
cooperatively encapsulating the display device layer (120) by the ultra-thin glass encapsulation layer (130), the flexible substrate (110) and the first encapsulation part (140);
separating the rigid substrate from the flexible substrate base plate (110).
10. The method of claim 9, wherein: after the step of forming a display device layer (120) on the flexible substrate (110), the method further comprises:
penetrating the display device layer (120) along a first direction to form an opening, wherein the first direction is a direction in which the flexible substrate (110), the display device layer (120) and the ultrathin glass packaging layer (130) are stacked.
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