CN110767641A - A high-power LED device - Google Patents

Abstract

The invention discloses a high-power LED device, comprising several substrates, LED chips electrically connected to the substrates, and insulating sheets for insulating the several substrates from each other; Adjacent substrates are insulated from each other; the substrates are connected to a power source to make the LED chips conduct. In the present invention, the LED chip is directly welded on the substrate, and the substrate is a copper plate plated with a gold layer, so that the heat dissipation efficiency of the LED chip is high. Under the same LED chip packaging density, compared with the prior art, the current drive can be increased to 1.5 times, and the driveable power is significantly improved.

Description

A high-power LED device

technical field

The present invention relates to the technical field of LEDs, and more particularly to a high-power LED device.

Background technique

The existing high-power LED COB package is usually to package the LED on a substrate (including aluminum, copper, aluminum nitride and other types of substrates), and then fix the substrate on the heat dissipation component, and the heat dissipation component dissipates the heat generated by the LED during operation. It is transferred to the heat dissipation medium by means of heat conduction to achieve the heat dissipation and cooling effect of the LED. Due to the low thermal conductivity between the insulating layer of the substrate and the heat dissipation component and the substrate, the thermal conduction efficiency of the final LED is very low. If you want the LED on a unit light emitting area to work with higher power, it is necessary to improve the thermal conductivity between the LED and the heat dissipation component. coefficient to improve heat dissipation efficiency.

There are also existing substrates that are used for a relatively single purpose, and are only used to conduct heat for the LED chip, and cannot be used for other purposes, which makes the structure of the LED device more complicated.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies of the prior art and provide a high-power LED device.

To achieve the above object, the present invention adopts the following technical solutions:

A high-power LED device includes several substrates, LED chips electrically connected to the substrates, and insulating sheets used to insulate the several substrates from each other; Insulated from each other; the base plate is connected with the power source to make the LED chip conduct.

Its further technical scheme is: the substrate includes a positive substrate connected to the positive electrode of the power supply, and a negative substrate connected to the negative electrode of the power supply; one terminal of the LED chip is connected to the positive substrate or the negative substrate, and the other terminal is connected to the negative substrate or the negative substrate. Positive substrate connection.

Its further technical scheme is that: the positive electrode substrate and the negative electrode substrate are superimposed on each other, and the positive electrode substrate and the negative electrode substrate are insulated by an insulating sheet.

Its further technical scheme is as follows: the base plate is a copper plate; the outer side of the copper plate is provided with a gold-plated layer.

Its further technical scheme is: the LED chip is arranged on the end face of the substrate; the LED chip is welded to the end face of the positive electrode substrate or the negative electrode substrate by solder paste to form a terminal, and the other terminal of the LED chip is connected with the wire through the wire. Adjacent negative electrode substrates or positive electrode substrates are connected.

A further technical solution is: the positive electrode substrate is provided with a convex portion; the negative electrode substrate is provided with a concave portion; when the positive electrode substrate and the negative electrode substrate are overlapped with each other, the concave portion and the convex portion match each other.

Its further technical scheme is as follows: the outer sides of a plurality of the substrates are superimposed on each other and extend laterally, so that two sides of the plurality of substrates form an installation plane; the installation plane is provided with a heat dissipation plate.

Its further technical scheme is: an optical component is arranged on the outer side of the LED chip.

A further technical solution is that: the end of the substrate farther from the LED chip is provided with a fixing seat, so that several substrates are fixed to each other.

Its further technical scheme is: the substrate is provided with two terminals at one end farther from the LED chip; wherein one terminal is connected to the positive substrate, and the other terminal is connected to the negative substrate.

Compared with the prior art, the present invention has the beneficial effects that the present invention directly welds the LED chip on the substrate, and the substrate is a copper plate plated with a gold layer, so that the heat dissipation efficiency of the LED chip is high. Under the same LED chip packaging density, compared with the prior art, the current driving can be increased to 1.5 times, and the drivable power can be significantly improved.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented in accordance with the content of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable, the following A preferred embodiment is given, and the detailed description is as follows.

Description of drawings

1 is a three-dimensional structural view of a high-power LED device according to the present invention;

2 is a side view of a high-power LED device of the present invention;

3 is a three-dimensional structural view and a partial enlarged view of a high-power LED device of the present invention with a part of the radiator removed;

4 is an assembly view and a partial enlarged view of a substrate of a high-power LED device according to the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore It should not be construed as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense, for example, it may be a connection or a detachable connection, It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

Drawings 1 to 4 are drawings of the present invention.

This embodiment provides a high-power LED device, please refer to FIGS. 1 to 3 , including a plurality of substrates 10 , LED chips 11 electrically connected to the substrates 10 , and insulating sheets 12 for insulating the substrates 10 from each other. The insulating sheet 12 is disposed outside the substrates 10 to insulate adjacent substrates 10 from each other. The substrate 10 is connected to a power source so that the LED chips 11 are turned on. The insulating sheet 12 is wrapped around the outside of the substrate 10 to insulate the substrate 10 .

The insulating sheet 12 may be resin or other insulating materials capable of bonding the adjacent substrates 10 together.

Referring to FIGS. 1 to 3 , the substrate 10 includes a positive electrode substrate 101 connected to the positive electrode of the power source, and a negative electrode substrate 102 connected to the negative electrode of the power source. One terminal of the LED chip 11 is connected to the positive electrode substrate 101 or the negative electrode substrate 102 , and the other terminal is connected to the negative electrode substrate 102 or the positive electrode substrate 101 . The LED chip 11 is connected between the positive electrode substrate 101 and the negative electrode substrate 102 so as to form a circuit.

The positive electrode substrate 101 and the negative electrode substrate 102 are disposed on top of each other, and the positive electrode substrate 101 and the negative electrode substrate 102 are insulated by the insulating sheet 12 .

The LED chip 11 is provided on the end surface of the substrate 10 . The LED chip 11 is soldered to the end surface of the positive substrate 101 or the negative substrate 102 by solder paste to form a terminal, and the other terminal of the LED chip 11 is connected to the adjacent negative substrate 102 or the positive substrate 101 by wires. The negative electrode substrate 102 and the lower end of the positive electrode substrate 101 are fixed by screws, so that the negative electrode substrate 102 and the positive electrode substrate 101 are stacked together to form a whole.

Preferably, the end face where the LED chip 11 and the substrate 10 are fixed is a large end with a larger area, and can be used not only as a heat dissipation end but also as an electrode end. The LED chip 11 is fixed on the positive electrode substrate 101 , the positive electrode substrate 101 is energized, and the heat of the LED chip 11 during operation is conducted to the positive electrode substrate 101 through the end face of the positive electrode substrate 101 , and the leads provided on the side of the LED chip 11 are adjacent to the The negative electrode substrate 102 is connected, so that the LED chip 11 forms a loop. The substrate 10 functions as an electrode and also functions as a heat conductor. One end of the LED chip 11 is connected to the positive electrode substrate 101 and the other end is connected to the negative electrode substrate 102 , so that a plurality of LED chips 11 are connected in parallel between the positive electrode substrate 101 and the negative electrode substrate 102 .

Referring to FIGS. 3 to 4 , the positive electrode substrate 101 is provided with a convex portion 1011 , and the negative electrode substrate 102 is provided with a recessed portion 1021 . When the positive electrode substrate 101 and the negative electrode substrate 102 are superimposed on each other, the concave portion 1021 and the protruding portion 1011 match each other.

Alternatively, the negative electrode substrate 102 is provided with a convex portion 1011 , and the positive electrode substrate 101 is provided with a recessed portion 1021 .

Referring to FIGS. 1 to 4 , the outer sides of a plurality of the substrates 10 are stacked on each other and extend laterally, so that two sides of the plurality of substrates 10 form a mounting plane 13 , and the mounting plane 13 is provided with a heat dissipation plate 14 . Since the convex portion 1011 of the positive electrode substrate 101 is matched with the recessed portion 1021 of the negative electrode substrate 102 , the two positive electrode substrates 101 and the negative electrode substrate 102 are superimposed on each other and extend to the left and right sides, so that the two sides of the substrate 10 form a plane, that is, the installation plane 13 . The heat dissipation plate 14 is in close contact with the mounting plane 13 , so that the heat of the base plate 10 can be conducted to the heat dissipation plate 14 , thereby taking away the heat on the base plate 10 . The heat dissipation method of the heat dissipation plate 14 may be air cooling or water cooling.

Preferably, the substrate 10 is a copper plate, and the outer side of the copper plate is provided with a gold-plated layer.

In order to improve the utilization rate of LED light, an optical component 15 is provided on the outer side of the LED chip 11 . The optical element 17 is made of a transparent material, so that the light emitted by the LED chip 11 can be distributed better and the utilization rate can be improved.

Referring to FIGS. 1 to 3 , a fixing seat 16 is provided at one end of the substrate 10 farther from the LED chip 11 , so that a plurality of substrates 10 can be fixed to each other. The fixing base 16 is provided with an installation groove, so that the positive electrode substrate 101 and the negative electrode substrate 102 are superimposed and then inserted into the installation groove. The fixing hole 16 is provided with a fixing hole for locking the superposed positive electrode substrate 101 and the negative electrode substrate 102 .

The substrate 10 is provided with two terminals 17 at one end farther from the LED chip 11 ; one terminal 17 is connected to the positive substrate 101 , and the other terminal 17 is connected to the negative substrate 102 .

After the LED chip 11 is powered on, the LED chip 11 generates a large amount of heat. The LED chip 11 of the device is directly welded on the substrate 10 , the heat generated can be conducted to the substrate 10 , and the heat of the substrate 10 is then dissipated from the heat sink 14 . The substrate 10 not only serves as a conductor of heat conduction, but also serves as an electrode of the LED chip 11 for supplying power to the LED chip 11 .

The LED chip 11 is directly welded on the copper substrate 10 , and the solder between the substrate 10 and the LED chip 11 is solder paste. The components of solder paste are tin, silver and copper. The thermal conductivity of tin, silver, and copper are 67, 429, and 407W/M*K, respectively, so the thermal conductivity of solder is better than 67W/M*K. Solders with higher thermal conductivity of other formulations can also be used. The thermal conductivity of the existing better aluminum-based circuit boards is less than 8W/M*K.

Compared with the prior art, the present invention directly welds the LED chip on the substrate, and the substrate is a copper plate plated with a gold layer, so that the heat dissipation efficiency of the LED chip is high. Under the same LED chip packaging density, compared with the prior art, the current driving can be increased to 1.5 times, and the drivable power can be significantly improved.

The above only uses examples to further illustrate the technical content of the present invention, so that readers can understand it more easily, but it does not mean that the embodiments of the present invention are limited to this. Any technical extension or re-creation made according to the present invention is subject to the protection of. The protection scope of the present invention is subject to the claims.

Claims (10)

1. A high-power LED device is characterized by comprising a plurality of substrates, LED chips electrically connected with the substrates, and insulating sheets for insulating the substrates from each other; the insulation sheets are arranged on the outer sides of the substrates so as to enable adjacent substrates to be mutually insulated; the substrate is connected with a power supply to enable the LED chip to be conducted.

2. The high power LED device as claimed in claim 1, wherein the substrate comprises a positive substrate connected to the positive electrode of the power supply, a negative substrate connected to the negative electrode of the power supply; one wiring terminal of the LED chip is connected with the anode substrate or the cathode substrate, and the other wiring terminal of the LED chip is connected with the cathode substrate or the anode substrate.

3. The high power LED device as claimed in claim 2, wherein the positive substrate and the negative substrate are stacked on each other and insulated by an insulating sheet.

4. A high power LED device according to claim 3, wherein said substrate is a copper plate; and a gold plating layer is arranged on the outer side of the copper plate.

5. The high power LED device as claimed in claim 3, wherein the LED chip is disposed on the end surface of the substrate; the LED chip is welded on the end face of the anode substrate or the cathode substrate through solder paste to form a terminal, and the other terminal of the LED chip is connected with the adjacent cathode substrate or the anode substrate through a lead.

6. A high power LED device according to claim 3, wherein the anode substrate is provided with a protrusion; the negative electrode substrate is provided with a concave part; when the positive electrode substrate and the negative electrode substrate are mutually overlapped, the concave part is matched with the convex part.

7. The high power LED device as claimed in claim 1, wherein the outer sides of the plurality of substrates are stacked and extended in a transverse direction so that the two sides of the plurality of substrates form a mounting plane; the mounting plane is provided with a heat dissipation plate.

8. The high power LED device as claimed in claim 1, wherein the LED chip is provided with an optical component on the outer side.

9. The high power LED device as claimed in claim 1, wherein the substrate is provided with a fixing base at an end thereof away from the LED chip, so that the plurality of substrates are fixed to each other.

10. The high power LED device as claimed in claim 9, wherein the substrate has two terminals at an end thereof away from the LED chip; one of the connector lug is connected with the positive electrode substrate, and the other connector lug is connected with the negative electrode substrate.

Images