CN110763054A - Heat transfer device capable of quickly changing food temperature and manufacturing method thereof - Google Patents
Heat transfer device capable of quickly changing food temperature and manufacturing method thereof Download PDFInfo
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Abstract
本发明提供一种快速改变食物温度的传热装置,包括第一板材、第二板材、空腔和储能工质。所述第一板材为高导热装置,置于该传热装置的上层;第一板材下端、空腔、储能工质和第二板材构成高储能装置,置于该传热装置的下层。所述高导热装置与高储能装置相互嵌入,能够快速吸收食物中的热量或释放传热装置中的热量,并把热量均摊开来,以使食物快速达到目标温度。本发明还提供该传热装置的制造方法,第一板材与第二板材仅需通过热压、焊接或粘接的方式就能实现密封连接;或者,第一板材与第二板材一体成型,通过挤压方式构成该传热装置主体,端盖可通过粘接、焊接或螺丝紧固方式与装置主体形成密闭结构。
The invention provides a heat transfer device for rapidly changing the temperature of food, comprising a first plate, a second plate, a cavity and an energy storage medium. The first plate is a high thermal conductivity device, which is placed on the upper layer of the heat transfer device; the lower end of the first plate, the cavity, the energy storage medium and the second plate constitute a high energy storage device and are placed on the lower layer of the heat transfer device. The high thermal conductivity device and the high energy storage device are embedded in each other, which can quickly absorb the heat in the food or release the heat in the heat transfer device, and spread the heat evenly, so that the food can quickly reach the target temperature. The present invention also provides a method for manufacturing the heat transfer device, the first plate and the second plate can be sealed and connected only by hot pressing, welding or bonding; or, the first plate and the second plate are integrally formed, and the The main body of the heat transfer device is formed by extrusion, and the end cover can form a closed structure with the main body of the device by bonding, welding or screwing.
Description
技术领域technical field
本发明属于传热技术领域,特别涉及一种快速改变食物温度的传热装置及其制造方法。The invention belongs to the technical field of heat transfer, and in particular relates to a heat transfer device for rapidly changing the temperature of food and a manufacturing method thereof.
背景技术Background technique
出于抑菌的需要,冷冻食物通常会储存在-18℃的环境中。对于这样的食物,在烹饪前,都需将其解冻。常见的解冻方式各有利弊,比如:(1)冷冻食物在自然环境中解冻,节能,但需要的时间长,容易滋生细菌;(2)冷冻食物在微波炉中解冻,快捷方便,但解冻不均匀,能耗较高;(3)浸水解冻,快速,但食物容易受到污染。For bacteriostatic needs, frozen foods are usually stored at -18°C. For such food, it needs to be thawed before cooking. Common thawing methods have their own advantages and disadvantages, such as: (1) thawing frozen food in the natural environment saves energy, but it takes a long time and is easy to breed bacteria; (2) thawing frozen food in a microwave oven is quick and convenient, but the thawing is uneven , high energy consumption; (3) soaking and freezing, fast, but the food is easily contaminated.
另一方面,刚刚烹饪好的食物温度通常在100℃左右,而通常,食物的最佳食用温度在50℃-80℃之间。希望食物可以尽快的冷却到可食用的温度也成为了一种需求。On the other hand, the temperature of freshly cooked food is usually around 100°C, and usually, the best eating temperature of food is between 50°C-80°C. There is also a need for food to be cooled to an edible temperature as quickly as possible.
发明内容SUMMARY OF THE INVENTION
鉴于以上缺点,本发明提出一种快速改变食物温度的传热装置及其制造方法,该方案将具有高导热装置与高储能装置相互嵌入,这样可以提高改变食物温度的效率。In view of the above shortcomings, the present invention proposes a heat transfer device for rapidly changing food temperature and a manufacturing method thereof. The solution embeds a high thermal conductivity device and a high energy storage device into each other, which can improve the efficiency of changing food temperature.
一种快速改变食物温度的传热装置,该传热装置包括:A heat transfer device for rapidly changing the temperature of food, the heat transfer device comprising:
第一板材,位于传热装置的上层;The first plate is located on the upper layer of the heat transfer device;
第二板材,位于传热装置的下层,所述第二板材中间呈凹陷状设置,与第一板材密封连接;The second plate is located at the lower layer of the heat transfer device, the middle of the second plate is arranged in a concave shape, and is sealed with the first plate;
空腔,第一板材与第二板材连接形成空腔;a cavity, the first plate is connected with the second plate to form a cavity;
储能工质,所述储能工质填充在所述空腔中,与所述第一板材下端接触。The energy storage medium is filled in the cavity and is in contact with the lower end of the first plate.
优选地,所述传热装置的外观为板形或蝶形。Preferably, the appearance of the heat transfer device is plate-shaped or butterfly-shaped.
优选地,所述第一板材内具有槽道,所述槽道中填充有传热工质。Preferably, the first plate has a channel, and the channel is filled with a heat transfer medium.
优选地,所述第一板材下端朝向第二板材方向具有凸起结构。Preferably, the lower end of the first plate has a convex structure toward the direction of the second plate.
优选地,所述第一板材上表面涂覆有高导热材料。Preferably, the upper surface of the first plate is coated with a high thermal conductivity material.
优选地,所述第一板材材质为金属、陶瓷或高分子材料。Preferably, the first plate material is metal, ceramic or polymer material.
优选地,所述储能工质为无机水合盐、石蜡或有机储能材料。Preferably, the energy storage medium is an inorganic hydrated salt, paraffin or an organic energy storage material.
优选地,所述空腔两端具有端盖,所述端盖与第一板材和第二板材通过粘接、焊接或螺丝紧固连接。Preferably, both ends of the cavity are provided with end caps, and the end caps are connected with the first sheet material and the second sheet material by bonding, welding or screwing.
一种快速改变食物温度的传热装置的制造方法,其特征在于,所述第一板材中密封填充传热工质,第二板材凹陷处填充有储能工质,第一板材与第二板材边缘通过热压、焊接或粘接的方式密封连接形成密闭传热装置;A manufacturing method of a heat transfer device for rapidly changing the temperature of food, characterized in that the first plate is sealed and filled with a heat transfer medium, the recess of the second plate is filled with an energy storage medium, and the first plate and the second plate are filled with a heat transfer medium. The edges are sealed and connected by hot pressing, welding or bonding to form a closed heat transfer device;
或者,在所述第一板材上表面通过喷淋、涂布、粘接或气相沉积的方式附着一层高导热材料,第二板材凹陷处填充有储能工质,第一板材与第二板材边缘通过热压、焊接或粘接的方式密封连接形成密闭传热装置。Alternatively, a layer of high thermal conductivity material is attached to the upper surface of the first plate by means of spraying, coating, bonding or vapor deposition, the recesses of the second plate are filled with energy storage medium, and the first plate and the second plate are The edges are sealed and connected by hot pressing, welding or bonding to form a closed heat transfer device.
一种快速改变食物温度的传热装置的制造方法,其特征在于,所述第一板材和第二板材通过挤出成型工艺一体成型为传热装置主体,上层填充传热工质和下层填充储能工质后,端盖通过粘接、焊接、或是通过螺丝紧固方式与装置主体连接形成密闭传热装置。A manufacturing method of a heat transfer device for rapidly changing food temperature, characterized in that the first plate and the second plate are integrally formed into a heat transfer device body by extrusion molding, the upper layer is filled with a heat transfer medium and the lower layer is filled with a storage medium. After the working medium is activated, the end cover is connected to the main body of the device by bonding, welding, or screwing to form a closed heat transfer device.
本发明技术方案提供一种快速改变食物温度的传热装置,包括第一板材,第二板材,第一板材与第二板材间形成的空腔及填充在空腔中的储能工质。所述第一板材为高导热装置,具有传热速率快和均温性好的特点;所述第一板材下端、空腔、储能工质和第二板材组成高储能装置,所述高导热装置与高储能装置相互嵌入,能够快速吸收食物中的热量或释放传热装置中的热量,并把热量均摊开来,以使食物快速达到目标温度。本发明还提供该传热装置的制造方法,制造方法简单实用,效果显著。The technical scheme of the present invention provides a heat transfer device for rapidly changing the temperature of food, comprising a first plate, a second plate, a cavity formed between the first plate and the second plate, and an energy storage medium filled in the cavity. The first plate is a high thermal conductivity device, which has the characteristics of fast heat transfer rate and good temperature uniformity; the lower end of the first plate, the cavity, the energy storage medium and the second plate form a high energy storage device. The heat conduction device and the high energy storage device are embedded in each other, which can quickly absorb the heat in the food or release the heat in the heat transfer device, and spread the heat evenly, so that the food can quickly reach the target temperature. The invention also provides a manufacturing method of the heat transfer device, which is simple and practical, and has remarkable effects.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.
图1为本发明一种快速改变食物温度的传热装置的工作原理图。FIG. 1 is a working principle diagram of a heat transfer device for rapidly changing the temperature of food according to the present invention.
图2为本发明一种快速改变食物温度的传热装置的一实施例的截面结构示意图。2 is a schematic cross-sectional structural diagram of an embodiment of a heat transfer device for rapidly changing the temperature of food according to the present invention.
图3A至图3D为图2中第一板材内的槽道结构示意图。3A to 3D are schematic views of the structure of the channel in the first plate in FIG. 2 .
图4为本发明一种快速改变食物温度的传热装置的另一实施例的截面结构示意图。4 is a schematic cross-sectional structural diagram of another embodiment of a heat transfer device for rapidly changing the temperature of food according to the present invention.
图5A至图5C为图4中凸起结构示意图。5A to 5C are schematic diagrams of the protrusion structure in FIG. 4 .
图6为本发明一种快速改变食物温度的传热装置的又一实施例的截面结构示意图和分解图。6 is a schematic cross-sectional structure diagram and an exploded view of another embodiment of a heat transfer device for rapidly changing the temperature of food according to the present invention.
附图标号说明:1-传热装置、01-食物、10-第一板材、11-第一板材上表面、111-上层板材、112-下层板材、113-槽道、114-传热工质、12-凸起结构、13-高导热装置、20-第二板材、21-高储能装置、22-端盖、30-空腔、40-储能工质、50-高导热材料。Description of reference numerals: 1-heat transfer device, 01-food, 10-first plate, 11-upper surface of first plate, 111-upper plate, 112-lower plate, 113-channel, 114-heat transfer medium , 12-protruding structure, 13-high thermal conductivity device, 20-second plate, 21-high energy storage device, 22-end cover, 30-cavity, 40-energy storage medium, 50-high thermal conductivity material.
本发明的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The implementation, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
需要说明的是,当组件被称为“固定于”另一组件,它可以直接在另一组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件,它可以是直接连接到另一组件或者可能同时存在居中组件。当一个组件被认为是“设置于”另一个组件,它可以是直接设置在另一组件上或者可能同时存在居中组件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the other component or there may be an intervening component at the same time. When a component is considered to be "set on" another component, it may be directly on the other component or there may be a co-located component. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for illustrative purposes only.
另需要说明,若本发明实施例中有涉及“第一”、“第二”等的描述,则该“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。It should be further noted that if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for the purpose of description, and should not be construed as instructions Either imply their relative importance or imply the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.
本发明实施例提出一种改变食物温度的传热装置,请参阅图1所示,所述传热装置1包括第一板材10、第二板材20、第一板材10与第二板材20之间形成的空腔30、储能工质40。An embodiment of the present invention provides a heat transfer device for changing the temperature of food. Please refer to FIG. 1 . The
第一板材10设置于该传热装置的上层,第一板材10上表面11与食物01充分接触,以便与食物01发生热交换;第一板材下端具有凸起结构12,增大与储能工质40的接触面积,便于热量在储能工质40与第一板材10以及食物01之间快速传导。The
第二板材20中间呈凹陷状设置,第二板材20边缘与第一板材10边缘对应连接。The middle of the
空腔30由第一板材10与第二板材20密封连接形成。The
储能工质40被密封灌装在空腔30中,并与第一板材10下端凸起结构12接触。The
可以理解的是,食物01与第一板材10的上表面11接触,由于两者之间存在温差,两者接触后会进行热交换。同时,第一板材10利用其导热能力高、热阻低的特性,可以将交换来的能量快速的传递到第一板材10上距离食物01较远的地方,在第一板材10上形成大范围的低温度梯度区域,甚至是均温区域,这些低温区域的形成,提高了第一板材10与周围环境的换热能力,如第一板材10上表面11与空气接触,通过与空气之间的对流换热和辐射换热,从而加快了食物温度变化,第一板材10可以将从食物01交换来的能量散到周围环境中。即,第一板材10利用其导热能力强的特点(如:具有高的导热系数),增加了食物01与周围环境的换热能力,从而实现快速改变食物温度的效果。另一方面,第一板材10下端凸起结构12还与储能工质40接触,两者之间可以进行热交换,从而可将其从食物01获取的能量存储在储能工质40中。It can be understood that, when the
进一步地,高导热装置13利用其导热能力高、热阻低的特性,可以在传热装置1上形成大范围的低温度梯度区域,甚至是均温区域,这就增大了高导热装置13与高储能装置21两者之间的热交换能力,并且,可以在高导热装置13及高储能装置21之间设置一些波浪、锯齿、条纹状的结构,以增加两个装置之间的接触面积,从而增强两者之间的热交换能力。高储能装置21中含有具有高比热容的储能工质40,其在吸收了热量后,相较于低比热容的物质,其温度变化较小,可以持续吸收热量,并将其储存在装置本身内。即,高导热装置13将从食物上交换来的能量传导到储能装置21中储存,从而实现快速改变食物温度的效果。Further, the high
本发明技术方案提供一种快速改变食物温度的传热装置,包括第一板材,第二板材,第一板材与第二板材间形成的空腔及填充在空腔中的储能工质。该传热装置为上下的层叠结构,并相互嵌入形成一个整体装置。这个装置上层为高导热层,用于接触食物;下层为高储能层,用于储存热量。该传热装置在被使用时,通常为水平放置,因为与上层接触的空气流动性较好,所以可以发挥上层为高导热层的特点,使高导热层与空气进行充分的换热,由于下层受到放置台面的影响,其周围的空气流动性较差,即对流换热效果较差,因此将高储能层置于下层,利用高导热层与高储能层间的传导换热来增强整个传热装置的换热能力。The technical scheme of the present invention provides a heat transfer device for rapidly changing the temperature of food, comprising a first plate, a second plate, a cavity formed between the first plate and the second plate, and an energy storage medium filled in the cavity. The heat transfer device is a layered structure up and down, and is embedded in each other to form an integral device. The upper layer of this device is a high thermal conductivity layer, which is used to contact food; the lower layer is a high energy storage layer, which is used to store heat. When the heat transfer device is used, it is usually placed horizontally. Because the air in contact with the upper layer has better fluidity, the upper layer can be used as a high thermal conductivity layer, so that the high thermal conductivity layer can conduct sufficient heat exchange with the air. Affected by the placement of the table top, the air around it has poor fluidity, that is, the convective heat transfer effect is poor. Therefore, the high energy storage layer is placed in the lower layer, and the conduction heat exchange between the high thermal conductivity layer and the high energy storage layer is used to enhance the whole. The heat transfer capacity of the heat transfer device.
在本发明的一实施例中,请参阅图2所示,在本实施例中,第一板材10为双层复合板材,当然在其他实施例中可以为单层或多层板材结构。第一板材10可使用金属材料或高分子材料制成,此处优选使用导热性能较好的铝制材料。第一板材10上表面平整,用于接触食物,第一板材10的上层板材111与下层板材112之间形成具有特定结构的密闭槽道113,槽道113对应在第一板材10下端为凸起结构12。上层板材111、下层板材112和第二板材20的边缘通过热压、焊接或粘接的方式连接在一起。在申请号为201721039920.X中披露了一种高传热装置的制作方法。按此方法,在槽道113中加入传热工质114,并将传热工质114密封在槽道113中,由此上层板材111、下层板材112、槽道113、传热工质114构成高导热装置13。由于传热工质114的作用,在第一板材10局部受热或受冷时,第一板材10可将能量快速的传递到第一板材10上的其他区域,从而在第一板材10上形成均温的效果,并通过对流换热和辐射换热将能量散到空气中。下层板材112与第二板材20间形成密闭空腔30,在空腔30中加入储能工质40,此处的储能工质40优选无机水合盐,如硝酸盐、碳酸盐、磷酸盐或醋酸盐,这些材料容易获得,成本适中,也可使用石蜡等,或有机储能材料。下层板材112、第二板材20、空腔30及储能液40构成了高储能装置21。储能工质40与下层板材112上的突起结构12接触,第一板材10获得的能量可以传递到储能工质40中。In an embodiment of the present invention, please refer to FIG. 2 , in this embodiment, the
如图3 A至图3D为图2中第一板材内的槽道结构示意图,上层板材111与下层板材112之间形成的槽道113结构可以为六边形网状结构(图3A)、井字型网状结构(图3B)、蛇形结构(图3C)、圆环网状结构(图3D)或其他几何图形彼此联通所构成的网状结构。此处优选六边形网状结构。3A to 3D are schematic diagrams of the channel structure in the first plate in FIG. 2 , the
图4为本发明一种快速改变食物温度的传热装置的另一实施例的截面结构示意图。第一板材10上表面具有一层高导热材料50,如纳米碳涂成或石墨烯,该高导热材料50可通过喷淋、涂布、粘接或是气相沉积等方式附着在第一板材10的上表面11上,第一板材10的材质可以为金属、陶瓷、或高分子材料,此处优选金属材料铝或铝合金。第一板材10下端设置有凸起结构12,这些结构可以通过铸造、锻压的方式成型。第一板材10与第二板材20连接并形成密封的腔体,腔体中设置有储能工质40,此处的储能工质40优选无机水合盐,也可使用石蜡等,或有机储能材料。凸起结构12与储能工质40相接触。将食物放置在导热装置1的上表面时,高导热材料50将能量快速的传递到第一板材10上的其他区域,并通过对流换热和辐射换热将能量散到空气中,同时会将能量传递到第一板材10上,第一板材10上的凸起结构12与储能工质40接触,将能量传递到储能工质40中。4 is a schematic cross-sectional structural diagram of another embodiment of a heat transfer device for rapidly changing the temperature of food according to the present invention. The upper surface of the
图5为图4中凸起结构12的结构示意图,凸起结构12可以为柱状阵列(图5A),可以为同心矩形结构(图5B)、可以为网格状结构(图5C),或其他线条结构,此处优选柱状阵列结构。FIG. 5 is a schematic structural diagram of the protruding
图6为本发明一种快速改变食物温度的传热装置的又一实施例的截面结构示意图(上)和分解图(下)。传热装置1的第一板材10与第二板材20属同种材质,可一体成型,传热装置1上层具有槽道113,槽道113中装有传热工质114,空腔30中装有储能工质40。此处的储能工质优选无机水合盐,也可使用石蜡等,或有机储能材料,第一板材10下端设置有凸起结构12,凸起结构12与储能工质40相接触。此实施例的装置成体可由挤出工艺成型,此处优选铝挤型工艺,也可以采用其他金属或是高分子材料的挤出成型工艺进行成型。该传热装置1两端设置有端盖22,端盖22将槽道113和空腔30分别密封,形成彼此独立的封闭的腔体,密封的方式可以是粘接、焊接、或是通过螺丝紧固的方式,将端盖22与装置1紧密连接在一起。将食物01放置在传热装置1的上表面上时,传热工质114受热启动工作,将能量快速的传递到装置1上的其他区域,并通过对流换热和辐射换热将能量散到空气中,同时通过凸起结构12将能量传递到储能工质40中。6 is a schematic cross-sectional structure diagram (top) and an exploded view (bottom) of another embodiment of a heat transfer device for rapidly changing the temperature of food according to the present invention. The
以上所述仅为本发明的优选实施例,并非因此限制本发明的专利范围,凡是在本发明的发明构思下,利用本发明说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。The above descriptions are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structural transformations made by the contents of the description and drawings of the present invention, or the direct/indirect application Other related technical fields are included in the scope of patent protection of the present invention.
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