CN110753486B - High-integration intelligent power module and air conditioner - Google Patents
High-integration intelligent power module and air conditioner Download PDFInfo
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- CN110753486B CN110753486B CN201810831042.8A CN201810831042A CN110753486B CN 110753486 B CN110753486 B CN 110753486B CN 201810831042 A CN201810831042 A CN 201810831042A CN 110753486 B CN110753486 B CN 110753486B
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- 239000000758 substrate Substances 0.000 claims abstract description 185
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 238000005192 partition Methods 0.000 claims description 22
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 238000002955 isolation Methods 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910018464 Al—Mg—Si Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inverter Devices (AREA)
Abstract
The invention discloses a high-integration intelligent power module and an air conditioner, wherein the high-integration intelligent power module comprises: a fixed bracket; the first mounting substrate and the second mounting substrate are mounted on the fixed bracket and are arranged at intervals; a plurality of mounting positions are arranged on one side surface of the first mounting substrate and one side surface of the second mounting substrate; the control module is correspondingly arranged on the mounting position of the first mounting substrate; the rectifier bridge, the PFC power switch module and the IPM modules are respectively and correspondingly arranged on the mounting positions of the second mounting substrate; the first mounting substrate is connected with the second mounting substrate through metal wires, and the control module is electrically connected with the PFC power switch module and the IPM module through the metal wires and the mounting positions respectively. The technical scheme of the invention realizes the isolation of the strong current module and the weak current module, and strong current and weak current are not interfered with each other, thereby solving the problems of electromagnetic interference, voltage breakdown or current burnout and the like.
Description
Technical Field
The invention relates to the technical field of electric appliance control, in particular to a high-integration intelligent power module and an air conditioner.
Background
In the electric equipment with frequency converter such as air conditioner and refrigerator, the electric control board of outdoor unit integrates power circuit, compressor inverter, fan inverter, PFC circuit and control circuit on a PCB board, the power supply part and the inversion part have the characteristics of high voltage, strong current and strong magnetic field, are dangerous parts on the PCB board, and are easy to produce electromagnetic interference, voltage breakdown or current burnout to the self or control circuit.
Disclosure of Invention
The invention mainly aims to provide a high-integration intelligent power module, which aims to realize isolation of a strong current module and a weak current module and is not mutually interfered, so that the problems of electromagnetic interference, voltage breakdown or current burnout and the like are solved.
In order to achieve the above object, the present invention provides a highly integrated intelligent power module, which includes:
a fixed bracket;
the first mounting substrate and the second mounting substrate are mounted on the fixed bracket and are arranged at intervals; a plurality of mounting positions are arranged on one side surface of the first mounting substrate and one side surface of the second mounting substrate;
the control module is correspondingly arranged on the mounting position of the first mounting substrate;
the rectifier bridge, the PFC power switch module and the IPM modules are respectively and correspondingly arranged on the mounting positions of the second mounting substrate;
the first mounting substrate is connected with the second mounting substrate through a metal wire, and the control module is electrically connected with the PFC power switch module and the IPM module through the metal wire and the mounting position respectively.
Optionally, the fixing bracket includes a plate-shaped member and a mounting groove formed on the plate-shaped member, and the first mounting substrate and the second mounting substrate are mounted in the mounting groove side by side and are disposed at a mutual distance.
Optionally, a partition plate is further disposed in the mounting groove, the partition plate divides the mounting groove into a first mounting sub-groove and a second mounting sub-groove, the first mounting substrate is mounted in the first mounting sub-groove, and the second mounting substrate is mounted in the second mounting sub-groove.
Optionally, openings are formed in the bottoms of the first mounting sub-groove and the second mounting sub-groove in a penetrating manner.
Optionally, the baffle deviates from the side surface setting of the first mounting substrate and the second mounting substrate of both sides of the notch of mounting groove, the baffle deviates from the one end of the notch of mounting groove is provided with a plurality of wire casings that set up each other at intervals, connects the metal wire between first mounting substrate with the second mounting substrate is many, and corresponds and follow a plurality of pass in the wire casing.
Optionally, a limiting structure is formed at the edge of the opening, so that the corresponding first mounting substrate and second mounting substrate are limited.
Optionally, a screw mounting position or a buckle for buckling the corresponding first mounting substrate and second mounting substrate is arranged on the limiting structure.
Optionally, the high-integration intelligent power module further comprises a radiator, and the radiator and the second mounting substrate are attached to each other.
Optionally, the first mounting substrate is provided with a plurality of first bonding pads near the board edge of the second mounting substrate, the second mounting substrate corresponds to a plurality of first bonding pads and is provided with a plurality of second bonding pads, and the plurality of first bonding pads and the plurality of second bonding pads are welded in a one-to-one correspondence manner through a plurality of metal wires.
Optionally, the IPM module is a direct current fan power module and/or a compressor power module.
The invention also provides an air conditioner which comprises the high-integration intelligent power module; the high-integration intelligent power module comprises a fixed bracket;
the first mounting substrate and the second mounting substrate are mounted on the fixed bracket and are arranged at intervals; a plurality of mounting positions are arranged on one side surface of the first mounting substrate and one side surface of the second mounting substrate;
the control module is correspondingly arranged on the mounting position of the first mounting substrate;
the rectifier bridge, the PFC power switch module and the IPM modules are respectively and correspondingly arranged on the mounting positions of the second mounting substrate;
the first mounting substrate is connected with the second mounting substrate through a metal wire, and the control module is electrically connected with the PFC power switch module and the IPM module through the metal wire and the mounting position respectively.
The high-integration intelligent power module is characterized in that a weak current module such as a control module is arranged on a first mounting substrate, a rectifier bridge, an IPM module, a PFC power switch module and other strong current modules are arranged on a second mounting substrate, the first mounting substrate and the second mounting substrate are mutually arranged in a fixed support at intervals, a certain gap is kept between the two mounting substrates, the control module is electrically connected with the IPM module and the control module and the PFC power switch module through corresponding mounting positions and metal wires for connecting the two mounting substrates, and the strong current module is controlled by the weak current module, so that the strong current module and the weak current module are isolated, the problems of electromagnetic interference, voltage breakdown, current burnout and the like are avoided, and the problems of dense components, difficult circuit wiring and electric appliance isolation when the whole mounting substrate is adopted for implementation are solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a first embodiment of a high-integrated intelligent power module according to the present invention;
FIG. 2 is a schematic diagram of a second embodiment of a high-integrated intelligent power module according to the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of a fixing bracket in a high-integrated intelligent power module according to the present invention;
FIG. 4 is a schematic diagram of a third embodiment of a high-integrated intelligent power module according to the present invention;
FIG. 5 is a schematic circuit diagram of a first embodiment of a first mounting substrate in a high-integrated intelligent power module according to the present invention;
fig. 6 is a schematic circuit structure diagram of an embodiment of a second mounting substrate in the high-integrated intelligent power module according to the present invention.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 10 | Fixing support | 31 | Rectifier bridge |
| 20 | First mounting substrate | 32 | PFC power switch module |
| 30 | Second mounting substrate | 33 | IPM module |
| 40 | Metal wire | 34 | Second power input interface |
| 50 | Radiator | 11 | Partition board |
| 21 | Control module | 12 | First limiting piece |
| 22 | First power input interface | 13 | Second limiting piece |
| 23 | Communication interface |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides a high-integration intelligent power module.
In many electric appliances such as an air conditioner, a washing machine, and a refrigerator, a motor is provided, and other loads are driven to operate by the motor. For example, an air conditioner generally includes an indoor unit and an outdoor unit, and electric control boards for driving the motor and the motor are disposed in the indoor unit and the outdoor unit. For the electric control board of the outdoor unit, most of the electric control board of the outdoor unit is provided with an intelligent power module for driving the compressor, and functional modules such as an intelligent power module for driving the fan, a main control module, a power module and the like. Most of the functional modules are integrated on an electric control PCB, but because the power module and the power module often have the characteristics of high voltage, strong current and strong magnetic field, and the control module usually works in the environment of low voltage, weak current and weak magnetic field, electromagnetic signals generated during the working of the power module easily interfere with control signals sent by the control module to influence the working of the control module, and meanwhile, the danger that the power module generates voltage breakdown or current burning loss easily affects the control module, so that the weak current modules such as the control module need to be far away from the strong current modules such as the power module.
In order to solve the above-mentioned problems, referring to fig. 1 and 6, in an embodiment of the present invention, the high-integration intelligent power module includes:
a fixing bracket 10;
a first mounting substrate 20 and a second mounting substrate 30 mounted on the fixing bracket 10 and spaced apart from each other; a plurality of mounting positions are provided on one side surface of the first mounting substrate 20 and one side surface of the second mounting substrate 30;
a control module 21 correspondingly mounted on the mounting position of the first mounting substrate 20;
a rectifier bridge 31, a PFC power switch module 32, and a plurality of IPM modules 33, which are respectively and correspondingly mounted on the mounting positions of the second mounting substrate 30;
the first mounting substrate 20 and the second mounting substrate 30 are connected by a wire 40, and the control module 21 is electrically connected to the PFC power switch module 32 and the IPM module 33 by the wire 40 and the mounting site, respectively.
The power input end of the rectifier bridge 31 inputs an alternating current power supply, and the output end of the rectifier bridge 31 is connected with the input end of the PFC power switch module 32; the output end of the PFC power switch module 32 is connected with the power input end of the IPM module 33; the control ends of the control module 21 are connected to the controlled ends of the PFC power switch module 32 and the IPM module 33 in a one-to-one correspondence manner through metal wires 40.
The control module 21 drives the PFC power switch module 32 to correct the dc voltage output from the rectifier bridge 31 and output the corrected dc voltage to the IPM module 33 or the control module 21, and the control module 21 outputs a corresponding control signal to control the IPM module 33 to drive the corresponding load to operate.
In this embodiment, the high-integration intelligent power module is configured by disposing the weak current module, such as the control module 21, on the first mounting substrate 20, and disposing the strong current modules, such as the rectifier bridge 31, the IPM module 33, and the PFC power switch module 32, on the second mounting substrate 30, then disposing the first mounting substrate 20 and the second mounting substrate 30 in the fixed support 10 at intervals, keeping a certain gap between the two mounting substrates, and correspondingly connecting the circuits on the first mounting substrate 20 and the second mounting substrate 30 through the metal wires to form an electrical connection, so that the circuits on the first mounting substrate 20 and the second mounting substrate 30 form a whole, thereby realizing driving corresponding load operation. It can be understood that, because a certain gap is formed between the two mounting substrates, the isolation of the strong current module and the weak current module is realized, the problems of electromagnetic interference, voltage breakdown or current burnout and the like are avoided, and the purpose that the strong current module is controlled by the weak current module is realized. Further, the problems of dense components and devices and difficult circuit wiring and electrical isolation when the integrated mounting substrate is adopted for implementation can be solved, and the two mounting substrates can also reduce the volume of the integrated mounting substrate, such as the second mounting substrate 30, and simplify the layout of the second mounting substrate 30.
In this embodiment, the material of the fixing bracket 10 may be metal, injection molding material or other materials such as wood, and the shape of the fixing bracket 10 is not limited, and may be designed according to the shape of the first mounting substrate 20 and the second mounting substrate 30.
In the present embodiment, the shapes of the first mounting substrate 20 and the second mounting substrate 30 are not limited, and may be square or other shapes. The first and second mounting substrates 20 and 30 are provided with circuit wiring and mounting positions, i.e., bonding pads, on which the circuit wiring forms corresponding circuits and bonding pads according to the circuit design of the high-integration intelligent power module, and the circuit wiring can be realized by laying copper foil, and etching the copper foil according to the preset circuit design, thereby forming a circuit wiring layer.
The first mounting substrate 20 and the second mounting substrate 30 may be made of plastic substrates, cardboard, semi-glass fiber board, or other materials, or may be made of special materials, such as aluminum substrates for improving heat dissipation capability. In this embodiment, the first mounting substrate 20 has no high heat dissipation requirement, but the rectifier bridge 31, PFC power switch module 32 and IPM module 33 on the second mounting substrate 30 are in a high-power module, and belong to heating elements, especially the IPM module 33 generally generates heat seriously during operation, and the ideal operating temperature of the control module 21 is mostly lower than that of the power device, so in order to avoid the power device from failure due to over-high temperature, an aluminum substrate can be adopted to realize, and the aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and generally consists of three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer. The structure of the double-sided board is a circuit layer, an insulating layer, an aluminum base, an insulating layer and a circuit layer. The aluminum substrate is a low alloyed Al-Mg-Si based high plastic alloy plate, which can minimize thermal resistance, has excellent heat conductive properties, and can improve the heat dissipation efficiency of the power element, and the first mounting substrate 20 is substantially free of heating elements, so that a general PCB board can be used. It should be noted that, since the aluminum substrate is not easy to be perforated, the rectifier bridge 31, the PFC power switch module 32 and the IPM module 33 may be mounted by being attached to the bonding pad, and it is understood that, when the second mounting substrate 30 is implemented by using materials such as a plastic substrate, a cardboard, a semi-glass fiber board, and a glass fiber board, the rectifier bridge 31, the PFC power switch module 32 and the IPM module 33 may be mounted by being welded through the perforation, and may be specifically set correspondingly according to the material of the second mounting substrate 30, which is not limited herein.
The first mounting substrate 20 and the second mounting substrate 30 may be disposed on the fixing support 10 at a distance, specifically, they may be disposed side by side, or they may be separated by a separation member to achieve a distance arrangement. The design can realize strong and weak electric isolation, and can avoid the danger that the metal wires are possibly overlapped, misplaced or even broken to influence the transmission of control signals or cause the burning loss of the mounting substrate in actual use.
After the first mounting substrate 20 and the second mounting substrate 30 are mounted on the fixing bracket 10, they may be connected by a metal wire 40, and the metal wire 40 may be a copper wire, an aluminum wire, or a copper bar or an aluminum bar, which is not limited herein.
In the above embodiment, the rectifier bridge 31 may be implemented by combining four patch diodes, and the rectifier bridge 31 formed by four patch diodes converts the input ac power into dc power and outputs the dc power.
In the above embodiment, the PFC power switch module 32 may be implemented by a PFC switch only, or may also form a PFC circuit with other components such as a diode and an inductor to implement power factor correction for the dc power supply. The PFC circuit may be implemented with a passive PFC circuit to form a boost PFC circuit, or a buck PFC circuit, or a boost PFC circuit. It can be appreciated that, in practical applications, the positions and connection relations of the PFC power switch module 32 and the rectifier bridge 31 may be adaptively adjusted according to the PFC circuit setting type, which is not limited herein. The PFC power switch module 32 adjusts the power factor of the dc power input from the rectifier bridge 31 based on the control of the control module 21, and the adjusted dc power may be used to generate various values of driving voltages, for example, voltages of 5V, 15V, etc., for the MCU and the IPM driving IC, respectively, through an external switching power supply circuit.
In the above embodiment, the control module 21 mainly includes an MCU and peripheral circuits thereof for controlling the IPM module and the PFC circuit to operate, and a real-time detection circuit capable of continuously detecting the current, temperature, voltage and other parameters of each element in the rectifier bridge 31, the PFC power switch module 32 and the IPM module 33 is integrated in the MCU, and when a serious overload, even a direct short circuit, or a fault such as a temperature overheat, a driving voltage overvoltage and the like occurs, the control module can control the soft shutdown of the power device in the IPM module 33, and send a fault signal to the control circuit to enable the control circuit to control the operation of other circuit modules, thereby avoiding damaging other circuit modules due to the fault. In addition, the control module 21 can integrate a bridge arm pair tube interlocking circuit and a driving power supply undervoltage protection circuit, so that the power module can run safely and stably.
Referring to fig. 5, in this embodiment, the first mounting substrate 20 is further provided with a first power input interface 22 for accessing a dc power supply, and a communication interface 23 for communicating with an external device, where the first power input interface 22 and the communication interface 23 are electrically connected to the control module 21, respectively, and the dc power input by the first power input interface 22 may be obtained from an external device or obtained from the second mounting substrate 30, and specifically set according to actual requirements, which is not limited herein.
Referring to fig. 6, fig. 6 is a schematic circuit diagram of an embodiment of a second mounting substrate 30 in a high-integrated intelligent power module, in this embodiment, a second power input interface 34 connected to an ac power source is further provided on the second mounting substrate 30, and the second power input interface 34 is connected to the rectifier bridge 31, and it should be noted that an EMC circuit for supplying power to the control module 21 and providing protection of EMC, EMS, lightning protection, and other related functions to the high-integrated intelligent power module may be provided on the second mounting substrate 30, or separately provided outside the two mounting substrates, and may be specifically set according to actual requirements, which is not limited herein.
In this embodiment, after the rectifier bridge 31, the PFC power switch module 32 and the IPM module 33 are fixed at the corresponding mounting positions of the second mounting substrate 30, the second mounting substrate 30 is subjected to glue filling or paint brushing treatment, and when a glue or paint material is selected, a silica gel or paint with a relatively good heat conducting property can be selected, so that on one hand, heat dissipation can be solved, and on the other hand, the effects of protecting electronic components, such as waterproof, dampproof, anti-corrosion and fixing, can be achieved.
In an alternative embodiment, the IPM module 33 is a dc fan power module and/or a compressor power module.
In this embodiment, the dc fan power module integrated in the high-integration intelligent power module is used for driving a wind wheel motor, and the compressor power module is used for driving a compressor motor, however, in other embodiments, the IPM module 33 may also be used for driving a frequency converter and various inverter power sources of other motors, and applied to the fields of variable frequency speed regulation, metallurgical machinery, electric traction, servo driving, variable frequency home appliances such as air conditioning, and the like. The fan driving power module and the compressor driving power module 42 are respectively integrated with a plurality of power switch tubes such as IGBTs and MOS tubes, the number of the power switch tubes can be four or six, the specific number of the power switch tubes can be set according to the type of the motor, the driving power and the like, and the power switch tubes are not limited here.
Referring to fig. 1 to 4, in an alternative embodiment, the fixing bracket 10 includes a plate member and a mounting groove formed on the plate member, and the first mounting substrate 20 and the second mounting substrate 30 are mounted in the mounting groove side by side and spaced apart from each other.
In this embodiment, the fixing bracket 10 may be in a groove shape, and the first mounting substrate 20 and the second mounting substrate 30 are spaced in the groove, or are separated by a separating component to achieve a spacing arrangement, so as to achieve a fixing effect on one hand, achieve a purpose of separating from an external environment on the other hand, and prevent the first mounting substrate 20 and the second mounting substrate 30 from electromagnetic interference or collision.
Referring to fig. 1 to 4, in an alternative embodiment, a partition 11 is further disposed in the mounting groove, the partition 11 divides the mounting groove into a first mounting sub-groove in which the first mounting substrate 20 is mounted and a second mounting sub-groove in which the second mounting substrate 30 is mounted.
In this embodiment, the first mounting substrate 20 and the second mounting substrate 30 are connected by wire bonding through the metal wire 40, after being fixed to the fixing bracket 10, in order to prevent the risk of the metal wire 40 breaking due to sliding in the fixing bracket 10 when the first mounting substrate 20 and the second mounting substrate 30 deform under the change of temperature difference, a partition 11 is further provided in the fixing bracket 10, the partition 11 and the fixing bracket 10 cooperate to fix the first mounting substrate 20 and the second mounting substrate 30 in the groove, the partition 11 and the fixing bracket 10 may be designed integrally, the partition 11 and the fixing bracket 10 may be designed separately, when the partition 11 and the fixing bracket 10 are formed integrally, the first mounting substrate 20 and the second mounting substrate 30 are mounted in the groove respectively, and when the partition 11 and the fixing bracket 10 are designed separately, the partition 11 is clamped between the first mounting substrate 20 and the second mounting substrate 30, and then the metal wire 40 is welded.
Referring to fig. 1 to 4, in an alternative embodiment, the bottoms of the first and second mounting sub-grooves are provided with openings therethrough.
In this embodiment, the first mounting sub-slot and the second mounting sub-slot may further penetrate up and down, the first mounting substrate 20 and the second mounting substrate 30 may be fastened in the slots from the top or bottom of the mounting slot through a clamping connection or other manners, or the first mounting sub-slot is not provided with an opening, and the second mounting sub-slot is provided with an opening, so that heat dissipation of the rectifier bridge 31, the PFC power switch module 32, the IPM module 33 and other power elements on the second mounting substrate 30 is facilitated, and heat dissipation efficiency is improved.
Referring to fig. 1 to 4, in an alternative embodiment, one end of the partition 11 facing away from the slot opening of the mounting slot is protruded from the side surfaces of the first mounting substrate 20 and the second mounting substrate 30 on both sides, one end of the partition 11 facing away from the slot opening of the mounting slot is provided with a plurality of wire slots (not shown) disposed at intervals, and a plurality of wires 40 connecting the first mounting substrate 20 and the second mounting substrate 30 correspondingly pass through the plurality of wire slots.
In this embodiment, the partition 11 protrudes relatively to the mounting substrates on both sides, and a wire slot for limiting is provided on the partition 11, and the plurality of metal wires 40 connecting the first mounting substrate 20 and the second mounting substrate 30 pass through the wire slot of the partition 11, so as to avoid the problem of short circuit or signal interference caused by excessively long contact between the adjacent metal wires 40.
Referring to fig. 1 to 4, in an alternative embodiment, the edges of the opening form a limiting structure for limiting the corresponding first and second mounting substrates 20 and 30.
In this embodiment, in order to avoid the risk that the first mounting substrate 20 and the second mounting substrate 30 deform under the temperature difference change and fall off from the fixing support 10, a limiting structure is further extended from the inner side of the fixing support 10, the limiting structure includes a first limiting member 12 and a second limiting member 13, the first limiting member 12 is used for limiting the first mounting substrate 20, the second limiting member 13 is used for limiting the second mounting substrate 30, and the fixing support 10 is prevented from moving relatively to the first mounting substrate 20 and the second mounting substrate 30, and in addition, the first limiting member 12 can isolate the first power input interface 22 and the communication interface 23 on the first mounting substrate 20 from the control module 21 so as to fix and protect the first power input interface 22 and the communication interface 23.
Referring to fig. 1 to 4, in an alternative embodiment, a screw mounting position or a buckle for fastening the corresponding first mounting substrate 20 and the second mounting substrate 30 is provided on the limiting structure.
In this embodiment, a plurality of screw holes or buckles are correspondingly formed on the limiting structure and the first mounting substrate 20 and the second mounting substrate 30, the first mounting substrate 20 and the first limiting member 12 are fixed by means of screws, bolts or clamping, and the second mounting substrate 30 and the second limiting member 13 are fixed by means of screws, bolts or clamping, so that the first mounting substrate 20, the second mounting substrate 30 and the fixing bracket 10 are prevented from moving radially.
Referring to fig. 1 to 4, in an alternative embodiment, the highly integrated smart power module further includes a heat sink 50, and the heat sink 50 is disposed to be attached to the second mounting substrate 30.
In this embodiment, the heat sink 50 may be made of copper, aluminum substrate, ceramic, or the like, or the heat sink 50 may be made of a mixture of the above materials. The radiator 50 is arranged at one side far away from the rectifier bridge 31, the PFC power switch module 32 and the power modules, and the radiator 50 is attached to the metal base layer of the second mounting substrate 30, so that heat generated by the rectifier bridge 31, the PFC power switch module 32 and the IPM module 33 is conducted to air, and the high-integration intelligent power radiating capacity is improved.
Referring to fig. 1 to 4, in an alternative embodiment, the first mounting substrate 20 is provided with a plurality of first bonding pads near the board edge of the second mounting substrate 30, the second mounting substrate 30 is provided with a plurality of second bonding pads corresponding to the plurality of first bonding pads, and the plurality of first bonding pads and the plurality of second bonding pads are bonded in a one-to-one correspondence through a plurality of metal wires 40.
In this embodiment, the side of the first mounting substrate 20, which is close to the second mounting substrate 30, is provided with a plurality of bonding pads, because in this embodiment, the second mounting substrate 30 is an aluminum substrate, which is not easy to drill, the rectifier bridge 31, the PFC power switch module 32 and the IPM module 33 are attached to the bonding pads, and in the same way, two ends of the plurality of metal wires 40 are correspondingly welded to the first bonding pads and the second bonding pads respectively, so that drilling operations on the first mounting substrate 20 and the second mounting substrate 30 are not required, and the process flow is reduced.
The invention also provides an air conditioner comprising the high-integration intelligent power module, and the detailed structure of the high-integration intelligent power module can refer to the embodiment, and the detailed description is omitted here. It can be understood that, because the above-mentioned high-integration intelligent power module is used in the air conditioner of the present invention, the embodiments of the air conditioner of the present invention include all the technical schemes of all the embodiments of the above-mentioned high-integration intelligent power module, and the achieved technical effects are identical, and are not repeated herein.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (9)
1. A highly integrated smart power module, the highly integrated smart power module comprising:
a fixed bracket;
the first mounting substrate and the second mounting substrate are mounted on the fixed bracket and are arranged at intervals; a plurality of mounting positions are arranged on one side surface of the first mounting substrate and one side surface of the second mounting substrate;
the control module is correspondingly arranged on the mounting position of the first mounting substrate;
the rectifier bridge, the PFC power switch module and the IPM modules are respectively and correspondingly arranged on the mounting positions of the second mounting substrate;
the control module is electrically connected with the PFC power switch module and the IPM module through metal wires and the mounting positions respectively;
the fixing bracket comprises a plate-shaped piece and a mounting groove formed on the plate-shaped piece, and the first mounting substrate and the second mounting substrate are arranged in the mounting groove side by side and are arranged at intervals;
a partition plate is further arranged in the mounting groove, the partition plate divides the mounting groove into a first mounting sub-groove and a second mounting sub-groove, the first mounting substrate is mounted in the first mounting sub-groove, and the second mounting substrate is mounted in the second mounting sub-groove;
the first mounting substrate and the second mounting substrate are fixed in the mounting groove by the partition plate and the fixing support.
2. The highly integrated intelligent power module according to claim 1, wherein the bottoms of the first mounting sub-slot and the second mounting sub-slot are provided with openings therethrough.
3. The highly integrated intelligent power module according to claim 2, wherein one end of the partition plate, which is away from the notch of the mounting groove, protrudes from the side surfaces of the first mounting substrate and the second mounting substrate on both sides, one end of the partition plate, which is away from the notch of the mounting groove, is provided with a plurality of wire slots which are arranged at intervals, and a plurality of wires connecting the first mounting substrate and the second mounting substrate, and correspondingly pass through the plurality of wire slots.
4. The highly integrated intelligent power module according to claim 2, wherein edges of the opening form a limiting structure for limiting the corresponding first and second mounting substrates.
5. The high-integration intelligent power module according to claim 4, wherein screw mounting positions or buckles for buckling the corresponding first mounting substrate and second mounting substrate are arranged on the limiting structure.
6. The highly integrated smart power module of any one of claims 1 to 5 further comprising a heat sink disposed in a conforming relationship with the second mounting substrate.
7. The high-integration intelligent power module according to any one of claims 1 to 5, wherein a plurality of first bonding pads are arranged on the first mounting substrate near the board edge of the second mounting substrate, a plurality of second bonding pads are arranged on the second mounting substrate at positions corresponding to the plurality of first bonding pads, and the plurality of first bonding pads and the plurality of second bonding pads are welded in a one-to-one correspondence manner through a plurality of metal wires.
8. The highly integrated intelligent power module according to any one of claims 1 to 5, wherein said IPM module is a direct current fan power module and/or a compressor power module.
9. An air conditioner comprising a highly integrated intelligent power module as claimed in any one of claims 1 to 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810831042.8A CN110753486B (en) | 2018-07-24 | 2018-07-24 | High-integration intelligent power module and air conditioner |
| PCT/CN2018/112752 WO2020019555A1 (en) | 2018-07-24 | 2018-10-30 | Highly integrated intelligent power module and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810831042.8A CN110753486B (en) | 2018-07-24 | 2018-07-24 | High-integration intelligent power module and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110753486A CN110753486A (en) | 2020-02-04 |
| CN110753486B true CN110753486B (en) | 2024-02-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810831042.8A Active CN110753486B (en) | 2018-07-24 | 2018-07-24 | High-integration intelligent power module and air conditioner |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110753486B (en) |
| WO (1) | WO2020019555A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020019555A1 (en) | 2020-01-30 |
| CN110753486A (en) | 2020-02-04 |
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