CN110748118A - Environmentally friendly thermally conductive wood floor and method for laying the same - Google Patents

Abstract

An environmentally friendly heat-conducting wooden floor, a base material layer is provided with a vertical card groove, the card groove vertically penetrates the base material layer, and the card groove includes a heat dissipation groove at the top and a communication groove vertically connected with the heat dissipation groove. The lateral dimension of the slot is larger than that of the communication slot, and a heat dissipation unit is arranged in the card slot. The heat dissipation unit includes a heat dissipation block on the upper part and a heat absorption block at the bottom. The heat chamber, the heat dissipation chamber and the heat absorption chamber are connected by a communication pipe, and the heat absorption chamber is filled with a phase change liquid. The invention provides an environment-friendly heat-conducting wooden floor, which has high heat-conducting efficiency, can be used as an excellent floor heating floor, and has the function of absorbing harmful substances released by the floor itself.

Description

Environmentally friendly thermally conductive wood floor and method for laying the same

technical field

The invention relates to a wooden floor, in particular to an environment-friendly heat-conducting wooden floor and a laying method thereof, belonging to the technical field of construction.

Background technique

Wooden floor has outstanding advantages such as warm in winter and cool in summer, comfortable foot feeling, natural warmth, noble and elegant, safe to use, etc., and has become the preferred material for indoor and outdoor floor decoration. However, in the application of solid wood flooring, it is highly dependent on wood resources, so composite wood flooring came into being. The composite imitation wood floor made according to the size and thickness of the solid wood floor has strong wear resistance and hardness, and can simulate various wood grain patterns and colors. bright future. However, for buildings that use floor heating as a heating method, due to the poor thermal conductivity of wood itself and easy deformation when heated, especially composite floors (including reinforced, multi-layer and three-layer, etc.) need to use glue, and glue will be Contains formaldehyde. The characteristic of formaldehyde is that the volatilization point is 19 degrees, and the amount of formaldehyde released will increase by 15%-30% for every 1 degree rise in temperature. Existing floor heating wood floors generally use wood with strong thermal stability such as merbau, teak, etc. with a moisture content of not more than 2.5% as floor heating boards, and use environmentally friendly glue with low formaldehyde content as an adhesive. However, the Zhejiang Provincial Consumer Council has announced a test result: 15 batches of composite geothermal floors that meet the E1 level requirements at room temperature, 87% of the formaldehyde emission exceeds the national standard at 40 degrees, and the highest exceeding the standard exceeds The national standard is 20 times higher, and the composite floor heating floors of many well-known brands also exceed the standard by more than 6 times. It can be seen that the current commercially available composite geothermal floors are nominally suitable for floor heating, and it is common to release a large amount of formaldehyde in the floor heating environment. Happening. Therefore, the problem that the formaldehyde emission of the traditional composite wood floor used for floor heating exceeds the standard is a technical problem to be solved urgently in the industry, and the problem of low heat transfer efficiency used for floor heating wood floor has not been solved in the prior art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an environmentally friendly thermally conductive wooden floor, which has high thermal conductivity, can be used as an excellent floor heating floor, and has the function of absorbing harmful substances released by the floor itself.

In order to achieve the above purpose, the technical solution adopted in the present invention is: an environmentally friendly thermally conductive wooden floor, which includes a wear-resistant layer, a decorative layer and a base material layer from top to bottom, and the base material layer is provided with a vertical slot, The card slot vertically penetrates through the base material layer, and the card slot includes a heat dissipation slot on the top and a communication slot vertically connected to it, the lateral dimension of the heat dissipation slot is larger than the lateral dimension of the communication slot, and a heat dissipation unit is arranged in the card slot, The heat dissipation unit includes a heat dissipation block at the top and a heat absorption block at the bottom. The heat dissipation block is hollow inside to form a heat dissipation chamber, and the heat absorption block is hollow to form a heat absorption chamber. The heat dissipation chamber and the heat absorption chamber are connected by a communication pipe. Filled with phase change liquid; the heat dissipation block is arranged in the heat dissipation groove, the bottom surface of the heat dissipation block is fitted with the bottom surface of the heat dissipation groove, the shape of the heat dissipation block is matched with the heat dissipation groove, and the communication pipe is penetrated in the communication groove and is connected with the heat dissipation groove. The heat dissipation block arranged at the bottom of the card slot is connected, and the bottom surface of the heat dissipation block is flush with the bottom surface of the base material layer; a gap is left between the communication pipe and the card slot, and an absorbing material is arranged in the gap; further, the base material layer A plurality of card slots are provided, a heat dissipation unit is respectively arranged in the plurality of card slots, a flat groove is arranged on the top of the base material layer above the plurality of card slots, and the top surface of the plurality of card slots is arranged flush with the bottom surface of the flat groove, so A heat-conducting material is laid in the flat groove; further, the bottom surface of the heat-dissipating chamber is inclined toward the center of the heat-dissipating chamber to form the bottom surface of the heat-dissipating chamber with a V-shaped cross-section; The connecting pipes are connected, and absorbing materials are filled between the plurality of connecting pipes and between each connecting pipe and the through groove; further, the absorbing material is expanded graphite; further, the thermally conductive material is a thermally conductive silicone film;

A method for laying an environmentally friendly thermally conductive wooden floor provided by the present invention comprises the following steps:

step one. Floor base treatment: use 1:3 cement mortar on the concrete structure layer to level the floor level to an error of no more than 2mm;

Step two. Lay a flexible thermal conductive film on the treated floor base, or a siliceous thermal conductive adhesive on the floor;

Step three. Environmentally friendly thermally conductive wooden floors are laid by conventional wooden floor laying methods such as I-shaped pavement, inclined paving, etc.

The positive and beneficial technical effects of the present invention are: the present invention provides a heat dissipation unit in the base material layer, and the heat dissipation unit is filled with a phase change liquid. After the phase change liquid in the heat absorption chamber is heated, the vapor is released upward in the heat dissipation chamber after being liquefied. heat, to achieve the effect of heat transfer, the liquefied phase change liquid can quickly return to the connecting pipe under the action of the bottom of the inclined heat dissipation chamber to carry out the next round of liquid-gas circulation; the expanded graphite set in the card groove plays a role in strengthening Heat transfer and absorption of harmful gases released by the floor itself, the thermal conductive silica gel set in the flat groove can isolate most of the harmful gases in the floor so that they are absorbed by the expanded graphite in the groove.

Description of drawings

FIG. 1 is a schematic structural diagram of a substrate layer according to an embodiment of the present invention.

FIG. 2 is a schematic structural diagram of a heat dissipation unit according to an embodiment of the present invention.

3 is a schematic cross-sectional view of a heat dissipation unit according to an embodiment of the present invention.

FIG. 4 is a schematic front view of the assembly of a floor and a heat dissipation unit according to an embodiment of the present invention.

FIG. 5 is a schematic diagram of the assembled rear surface of a floor and a heat dissipation unit according to an embodiment of the present invention.

FIG. 6 is an assembled cross-sectional perspective view of an embodiment of the present invention.

FIG. 7 is an assembled cross-sectional view of an embodiment of the present invention.

Detailed ways

In order to more fully explain the implementation of the present invention, the following examples of implementations of the present invention are provided, which are merely illustrative of the present invention and do not limit the scope of the present invention.

The present invention is further explained in detail with reference to the accompanying drawings, which are marked as: 1. base material layer; 2. card slot; 3. flat groove; 4. heat dissipation block; 5. heat absorption block; 6. communication pipe; 7. Heat dissipation chamber; 8. Heat absorption chamber; 9. Decorative layer; 10. Thermal conductive silicone film; 11. Bottom surface of heat dissipation chamber; 12. Phase change liquid;

As shown in the figure: an environmentally friendly thermally conductive wooden floor, including a wear-resistant layer, a decorative layer 9 and a base material layer 1 from top to bottom, the wear-resistant layer is not shown in the figure, and the base material layer is provided with a vertical through-base The card slot 2 of the material layer, the card slot includes a heat dissipation slot at the top and a communication slot vertically connected to it, a heat dissipation unit is arranged in the card slot, and the heat dissipation unit includes the upper heat dissipation block 4 and the bottom heat absorption block 5. The heat dissipation block The interior is hollow to form a heat dissipation chamber 7, and the interior of the heat-absorbing block is hollow to form a heat-absorbing chamber 8. The heat-absorbing chamber is filled with a phase-change liquid 12. The liquid-gas-phase change liquid used in this embodiment is an ethanol-water mixed solution. In order to reduce the negative pressure to the phase change starting temperature of 18 degrees, the working temperature is 20 to 60 degrees. In practical applications, ammonia, freon, methanol, propanol and other working fluids can also be used as phase change fluids to dissipate heat. The chamber and the heat-absorbing chamber are connected by a communication pipe 6. In this embodiment, a structure of five communication pipes is used to connect the heat-dissipating chamber and the heat-absorbing chamber.

As shown in Figure 1, the lateral dimension of the heat dissipation groove is larger than that of the communication groove, the heat dissipation block is arranged in the heat dissipation groove, and the bottom surface of the heat dissipation block is attached to the bottom surface of the heat dissipation groove. This structure allows the pressure applied to the floor to pass through. The radiating blocks are dispersed to the bottom of the radiating trough to be supported and strengthen the pressure bearing capacity of the floor.

As shown in Figures 6 and 7, the communication pipe is inserted into the communication groove 13 and connected to the heat dissipation block arranged at the bottom of the communication groove. The gap 15 for absorbing materials is filled with expanded graphite. The expanded graphite can absorb the harmful gas emitted by the base material. Since the glue content in the floor base material is certain, the expanded graphite can absorb and solidify most of the It does not need to reactivate the absorption of expanded graphite, and as a thermally conductive material, expanded graphite can also improve the thermal conductivity of the entire floor.

As shown in FIG. 4 and FIG. 5 , in this embodiment, there are 20 card slots in the base material layer of each floor. Each slot is provided with a heat dissipation unit, and a flat slot 3 is arranged on the top of the base material layer above the plurality of card slots. The top surface of each card slot is flush with the bottom surface of the flat slot. Thermally conductive silicone film, thermally conductive silicone film has a sealing function, which can seal the harmful gas emitted by the substrate inside the substrate and be absorbed by the absorbing material, and the thicker thermally conductive silicone film can also improve the floor comfort because of its elasticity. effect.

As shown in Figure 7, the bottom surface of the heat dissipation chamber is inclined toward the center of the heat dissipation chamber to form a V-shaped bottom surface of the heat dissipation chamber, which can collect the condensed phase change liquid and make it quickly return to the heat absorption chamber.

The present invention also provides a method for laying an environmentally friendly thermally conductive wooden floor provided by the present invention, comprising the following steps:

step one. Floor base treatment: use 1:3 cement mortar on the concrete structure layer to level the floor level to an error of no more than 2mm;

Step two. Lay flexible heat-conducting film on the treated floor base, or brush silicon heat-conducting adhesive on the floor, and stick the wooden floor on the floor base;

Step three. Environmentally friendly thermally conductive wooden floors are laid by conventional wooden floor laying methods such as I-shaped pavement, inclined paving, etc.

In this construction method, the flexible heat-conducting film can use the heat-conducting rubber or heat-conducting plate commonly used in the prior art. When constructing on the floor with good levelness and smoothness, the silicon heat-conducting adhesive can also be used to adhere the wooden floor to the floor. construction method.

After describing the embodiments of the present invention in detail, those who are familiar with the technology can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the above-mentioned patent application. Any simple modifications, equivalent changes and modifications made belong to the scope of the technical solutions of the present invention, and the present invention is not limited to the embodiments of the examples in the description.

Claims (7)

1. An environmentally friendly thermally conductive wooden floor, comprising a wear-resistant layer, a decorative layer and a base material layer from top to bottom, characterized in that: the base material layer is provided with a vertical card slot, and the card slot vertically penetrates The base material layer, the card slot includes a heat dissipation slot on the top and a communication slot vertically connected to it, the lateral dimension of the heat dissipation slot is larger than the lateral dimension of the communication slot, and a heat dissipation unit is arranged in the card slot, and the heat dissipation unit includes an upper The heat dissipation block and the heat absorption block at the bottom are hollow inside the heat dissipation block to form a heat dissipation chamber, the interior of the heat absorption block is hollow to form a heat absorption chamber, the heat dissipation chamber and the heat absorption chamber are connected by a communication pipe, and the heat absorption chamber is filled with a phase change liquid; The heat dissipation block is arranged in the heat dissipation groove, the bottom surface of the heat dissipation block is attached to the bottom surface of the heat dissipation groove, the shape of the heat dissipation block is matched with the heat dissipation groove, and the communication pipe is penetrated in the communication groove and is connected with the heat dissipation device arranged at the bottom of the card groove. The blocks are connected, and the bottom surface of the heat dissipation block is flush with the bottom surface of the base material layer; a gap is left between the communication pipe and the clamping groove, and an absorbing material is arranged in the gap. 2. An environmentally friendly thermally conductive wooden floor according to claim 1, characterized in that: the base material layer is provided with a plurality of card slots, a heat dissipation unit is respectively arranged in the plurality of card slots, and the upper The top of the base material layer is provided with a flat groove, the top surfaces of the plurality of clamping grooves are arranged flush with the bottom surface of the flat grooves, and the heat-conducting material is laid in the flat grooves. 3 . The environmentally friendly thermally conductive wooden floor according to claim 1 , wherein the bottom surface of the heat dissipation chamber is inclined toward the center of the heat dissipation chamber to form the bottom surface of the heat dissipation chamber with a V-shaped cross section. 4 . 4. An environmentally friendly thermally conductive wooden floor according to claim 1, wherein the heat dissipation chamber and the heat absorption chamber are connected by a plurality of communication pipes, and between the plurality of communication pipes and each communication pipe and a through groove Absorbent material is filled in between. 5 . The environmentally friendly thermally conductive wooden floor according to claim 1 , wherein the absorbing material is expanded graphite. 6 . 6 . The environmentally friendly thermally conductive wooden floor according to claim 2 , wherein the thermally conductive material is a thermally conductive silicone film. 7 . 7. A method for laying an environmentally friendly thermally conductive wooden floor as claimed in claim 1, characterized in that, comprising the following steps: step one. Floor base treatment: use 1:3 cement mortar on the concrete structure layer to level the floor level to an error of no more than 2mm; Step two. Lay a flexible thermal conductive film on the treated floor base, or a siliceous thermal conductive adhesive on the floor; Step three. Environmentally friendly thermally conductive wooden floors are laid by conventional wooden floor laying methods such as I-shaped pavement, inclined paving, etc.

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