CN110746782A - High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof - Google Patents
High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof Download PDFInfo
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- CN110746782A CN110746782A CN201911052124.3A CN201911052124A CN110746782A CN 110746782 A CN110746782 A CN 110746782A CN 201911052124 A CN201911052124 A CN 201911052124A CN 110746782 A CN110746782 A CN 110746782A
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000000741 silica gel Substances 0.000 title claims abstract description 33
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 33
- 238000005520 cutting process Methods 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000010030 laminating Methods 0.000 title claims description 4
- 239000000843 powder Substances 0.000 claims abstract description 25
- 229920002545 silicone oil Polymers 0.000 claims abstract description 24
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 19
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 19
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims abstract 2
- -1 methyl ethoxy Chemical group 0.000 claims description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims description 7
- 239000012975 dibutyltin dilaurate Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims description 4
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011268 mixed slurry Substances 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 239000011358 absorbing material Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000008204 material by function Substances 0.000 abstract description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910021389 graphene Inorganic materials 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention relates to the technical field of functional materials, in particular to a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching and a preparation method thereof; the composition comprises the following components in parts by mass: silicone oil: 5% -30%; electromagnetic wave-absorbing powder: 65.5% -95%; catalyst: 0.1% -2%; a crosslinking agent: 0.1% -2%; defoaming agent: 0.1% -1.5%; antioxidant: 0.1% -1%; the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of good flexibility, convenience for individualized die cutting shape, high heat conductivity coefficient, quick heat dissipation, high-frequency magnetic conductivity, good wave-absorbing effect and convenience for forming and processing by coating the heat-conducting wave-absorbing material on the polyester release material layer; the preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of simple process, good flexibility and convenience for individualized die cutting.
Description
Technical Field
The invention relates to the technical field of functional materials, in particular to a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching and a preparation method thereof.
Background
The heat-conducting wave-absorbing material is a bifunctional composite material integrating heat management and wave-absorbing functions. The material can be used between integrated circuits, heat sinks, other heat conducting elements and metal substrates, and the product can inhibit unnecessary electromagnetic energy coupling, resonance and surface current generated by electromagnetic interference besides solving the problem of heat conduction in the material. The material can be widely applied to electronic components and equipment such as communication equipment, network terminals, storage equipment, consumer electronics, power supply devices and the like.
With the rapid development of electronic communication technology, the heat dissipation requirements of light, thin and integrated electronic products are increasing, and meanwhile, the electromagnetic interference between electronic components can also interfere the signal receiving and processing of the electronic products. In the prior art, in order to meet the requirements of electromagnetic shielding and use, one scheme is to attach adhesives to two surfaces of a multilayer wave-absorbing material so as to achieve the purposes of wave absorption and attachment, and the method has low heat dissipation performance, and the finished product has a limited thickness adjustment range and heat dissipation; the other scheme is that the wave-absorbing alloy powder is added into silicone oil to prepare a paste material, the paste material is inconvenient to use, special equipment such as a dispenser and the like is required to be used, die cutting is inconvenient, the magnetic conductivity is low, and the heat dissipation performance is general.
Disclosure of Invention
The purpose of the invention is: the defects in the prior art are overcome, the high-performance wave-absorbing and heat-conducting silica gel gasket convenient for die cutting and attaching is provided, the silica gel gasket has the advantages of being good in flexibility and convenient for individualized die cutting shapes, and the wave-absorbing material is high in heat conductivity coefficient, fast in heat dissipation, high in high-frequency magnetic conductivity, good in wave-absorbing effect and convenient to mold and process.
Another object of the invention is: the preparation method has the advantages of simple process and high production efficiency, and the prepared wave-absorbing heat-conducting silica gel gasket has the advantages of good flexibility and convenience in individualized die cutting shape, and the wave-absorbing material has the advantages of high heat conductivity coefficient, quick heat dissipation, high-frequency magnetic conductivity and good wave-absorbing effect.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the utility model provides a high performance is inhaled ripples heat conduction silica gel gasket convenient to cross cutting laminating which the part by mass constitutes as follows:
silicone oil: 5% -30%;
electromagnetic wave-absorbing powder: 65.5% -95%;
catalyst: 0.1% -2%;
a crosslinking agent: 0.1% -2%;
defoaming agent: 0.1% -1.5%;
antioxidant: 0.1% -1%;
furthermore, the silicone oil is one or more of methyl silicone oil, phenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoro propyl silicone oil, methyl vinyl silicone oil and methyl hydroxyl silicone oil.
Further, the viscosity of the silicone oil is 200-3000cps at the temperature of 25 ℃.
Furthermore, the electromagnetic wave-absorbing powder material is one or more of ferrite powder, iron-nickel alloy powder, iron-silicon-aluminum alloy powder, carbonyl iron powder and graphene oxide powder.
Furthermore, the D50 particle size of the electromagnetic wave-absorbing powder is 5-100 μm.
Further, the catalyst is one or more of dibutyl tin dilaurate, stannous octoate and methyl vinyl dipyrrolidone silane.
Further, the cross-linking agent is one or more of ethyl orthosilicate, an organic silicon compound and dicumyl peroxide.
Further, the defoaming agent is one or more of an organic silicon type defoaming agent and a fluorine-containing defoaming agent.
Further, the antioxidant is one or more of a multi-element hindered phenol antioxidant and a phosphite antioxidant.
A preparation method of a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and fitting comprises the following steps:
(1) uniformly mixing the selected silica gel, adding the wave-absorbing powder, the defoaming agent and the antioxidant at a certain stirring speed, stirring for 2 hours, uniformly mixing, adding the catalyst and the crosslinking agent, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;
(2) and coating the uniformly mixed slurry on a polyester release layer, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.
The technical scheme adopted by the invention has the beneficial effects that:
the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of good flexibility, convenience in individualized die cutting shape, high heat conductivity coefficient, high heat dissipation speed, high-frequency magnetic conductivity, good wave-absorbing effect and convenience in forming and processing.
The preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching has the advantages of simple process, good flexibility and convenience for individualized die cutting.
Drawings
Fig. 1 is a performance test chart of the high-performance wave-absorbing heat-conducting silica gel gasket in embodiment 4 of the invention.
Detailed Description
The following examples are intended to provide those skilled in the art with a more complete understanding of the present invention, and are not intended to limit the scope of the present invention. Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic may be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Example 1
Methyl ethoxy silicone oil (25 ℃, 1000 cps): 25.5 percent;
ferrite powder (D50: 30 μm): 50 percent;
carbonyl iron powder (D50: 10 μm): 20 percent;
dibutyl tin dilaurate: 0.1 percent;
dicumyl peroxide: 2 percent;
and (3) organic silicon defoaming agent: 1.5 percent;
multi-element hindered phenol antioxidant: 0.9 percent;
example 2
Methyl vinyl silicone oil (25 ℃, 2000 cps): 30 percent;
iron-nickel alloy powder (D50: 20 μm): 43 percent;
iron-silicon-aluminum alloy powder (D50: 10 μm): 22.5 percent;
dibutyl tin dilaurate: 2 percent;
dicumyl peroxide: 2 percent;
and (3) organic silicon defoaming agent: 0.1 percent;
multi-element hindered phenol antioxidant: 0.4 percent;
example 3
Methyl ethoxy silicone oil (25 ℃, 1000 cps): 5 percent;
ferrite powder (D50: 30 μm): 60 percent;
graphene oxide (D50: 10 μm): 32.4 percent;
dibutyl tin dilaurate: 0.1 percent;
dicumyl peroxide: 0.5 percent;
and (3) organic silicon defoaming agent: 1 percent;
multi-element hindered phenol antioxidant: 1 percent;
example 4
Methyl ethoxy silicone oil (25 ℃, 1000 cps): 4 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
dibutyl tin dilaurate: 0.3 percent;
dicumyl peroxide: 0.1 percent;
and (3) organic silicon defoaming agent: 0.5 percent;
multi-element hindered phenol antioxidant: 0.1 percent;
example 5
Methyl silicone oil (25 ℃, 1000 cps): 4 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
stannous octoate: 0.3 percent;
dibenzoyl peroxide: 0.1 percent;
fluorine-containing defoaming agent: 0.5 percent;
phosphite ester antioxidant: 0.1 percent;
example 6
Methyl phenyl silicone oil (25 ℃, 1000 cps): 4 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
stannous octoate: 0.12 percent;
methylvinyldipyrrolidone silane: 0.18 percent;
ethyl orthosilicate: 0.1 percent;
silicone type defoaming agent: 0.5 percent;
multi-element hindered phenol antioxidant: 0.1 percent;
example 7
Methyl trifluoropropyl silicone oil (25 ℃, 1000 cps): 2 percent;
methyl vinyl silicone oil (25 ℃, 1000 cps): 2 percent;
ferrite powder (D50: 30 μm): 55 percent;
graphene oxide (D50: 10 μm): 40 percent;
dibutyl tin dilaurate: 0.3 percent;
dibenzoyl peroxide: 0.1 percent;
silicone type defoaming agent: 0.5 percent;
multi-element hindered phenol antioxidant: 0.1 percent;
the preparation method of the high-performance wave-absorbing heat-conducting silica gel gasket in the embodiments 1 to 7 is as follows:
(1) uniformly mixing the selected silica gel, controlling the stirring speed to be 500rpm, adding the wave-absorbing powder, the defoaming agent and the antioxidant, stirring for 2 hours, adding the catalyst and the crosslinking agent after uniform mixing, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;
(2) and coating the uniformly mixed slurry on a polyester release layer, wherein the thickness of the coating is 1.5mm, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.
The magnetic conductivity and the heat conductivity of the high-performance wave-absorbing heat-conducting silica gel gasket in the embodiments 1 to 7 are detected, and the detection results are shown in table 1.
And (3) testing conditions are as follows: the samples were concentric circles 8 mm in inner diameter and 18 mm in outer diameter, and the test temperature was 25 ℃ and the relative humidity was 50.
TABLE 1
As can be seen from the data in table 1, the high performance thermal silica gel gasket in example 4 has a permeability of 7.99 at 3MHZ, a permeability of 9.29 at 1GHZ, and a thermal conductivity of 2.03, which are preferred embodiments of the present invention.
Referring to fig. 1, fig. 1 is a performance test chart of the high-performance wave-absorbing heat-conducting silica gel gasket according to embodiment 4 of the present invention.
In fig. 1, the upper curve shows the magnetic conductivity of the high-performance wave-absorbing heat-conducting silica gel gasket, and the lower curve shows the electromagnetic wave transmission loss of the high-performance wave-absorbing heat-conducting silica gel gasket; as can be seen from FIG. 1, in example 4, the magnetic loss at a frequency of 1GHZ is 4.21, and the microwave absorbing material has good microwave absorbing performance.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. The utility model provides a high performance is inhaled wave heat conduction silica gel gasket convenient to cross cutting laminating which characterized in that: the composition comprises the following components in parts by mass:
silicone oil: 5% -30%;
electromagnetic wave-absorbing powder: 65.5% -95%;
catalyst: 0.1% -2%;
a crosslinking agent: 0.1% -2%;
defoaming agent: 0.1% -1.5%;
antioxidant: 0.1% -1%;
the high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the silicone oil is one or more of methyl silicone oil, phenyl silicone oil, methyl ethoxy silicone oil, methyl trifluoro propyl silicone oil, methyl vinyl silicone oil and methyl hydroxyl silicone oil.
2. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the viscosity of the silicone oil is 200-3000cps at the temperature of 25 ℃.
3. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the electromagnetic wave absorbing powder is one or more of ferrite powder, iron-nickel alloy powder, iron-silicon-aluminum alloy powder, carbonyl iron powder and graphene oxide powder.
4. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the D50 particle size of the electromagnetic wave-absorbing powder is 5-100 μm.
5. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the catalyst is one or more of dibutyl tin dilaurate, stannous octoate and methyl vinyl dipyrrolidone silane.
6. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the cross-linking agent is one or more of ethyl orthosilicate and dibenzoyl peroxide.
7. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the defoaming agent is one or more of an organic silicon type defoaming agent and a fluorine-containing defoaming agent.
8. The high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching of claim 1, characterized in that: the antioxidant is one or more of multi-component hindered phenol antioxidant and phosphite antioxidant.
9. A preparation method of a high-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and attaching is characterized by comprising the following steps of: the method comprises the following steps:
(1) uniformly mixing the selected silica gel, adding the wave-absorbing powder, the defoaming agent and the antioxidant at a certain stirring speed, stirring for 2 hours, uniformly mixing, adding the catalyst and the crosslinking agent, and finally defoaming for 1 hour under the vacuum of 0.08MPa to prepare the heat-conducting wave-absorbing slurry;
(2) and coating the uniformly mixed slurry on a polyester release layer, and baking for 20min at 150 ℃ to obtain a finished product of the heat-conducting wave-absorbing coiled material for later use.
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| CN201911052124.3A CN110746782A (en) | 2019-10-31 | 2019-10-31 | High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof |
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| CN201911052124.3A CN110746782A (en) | 2019-10-31 | 2019-10-31 | High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113249031A (en) * | 2021-06-07 | 2021-08-13 | 宁波晶飞新材料有限公司 | High-thermal-conductivity silica gel wave absorbing plate and preparation method thereof |
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| CN119391189A (en) * | 2024-12-31 | 2025-02-07 | 中国计量大学 | A terahertz shield and its preparation method and application |
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