CN110744450A - Dresser and dressing method for polishing pad - Google Patents
Dresser and dressing method for polishing pad Download PDFInfo
- Publication number
- CN110744450A CN110744450A CN201911002359.1A CN201911002359A CN110744450A CN 110744450 A CN110744450 A CN 110744450A CN 201911002359 A CN201911002359 A CN 201911002359A CN 110744450 A CN110744450 A CN 110744450A
- Authority
- CN
- China
- Prior art keywords
- section
- trimming
- dresser
- polishing pad
- dressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000009966 trimming Methods 0.000 claims abstract description 109
- 230000003750 conditioning effect Effects 0.000 claims description 9
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000009987 spinning Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 5
- 238000005452 bending Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000005484 gravity Effects 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911002359.1A CN110744450B (en) | 2019-10-21 | 2019-10-21 | Dresser and dressing method for polishing pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911002359.1A CN110744450B (en) | 2019-10-21 | 2019-10-21 | Dresser and dressing method for polishing pad |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110744450A true CN110744450A (en) | 2020-02-04 |
CN110744450B CN110744450B (en) | 2021-11-26 |
Family
ID=69279177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911002359.1A Active CN110744450B (en) | 2019-10-21 | 2019-10-21 | Dresser and dressing method for polishing pad |
Country Status (1)
Country | Link |
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CN (1) | CN110744450B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114012605A (en) * | 2022-01-05 | 2022-02-08 | 杭州众硅电子科技有限公司 | Polishing pad dressing device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690544A (en) * | 1995-03-31 | 1997-11-25 | Nec Corporation | Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad |
JPH11123658A (en) * | 1997-10-21 | 1999-05-11 | Speedfam Co Ltd | Dresser and dressing device |
JP2000343406A (en) * | 1999-06-02 | 2000-12-12 | Sumitomo Metal Ind Ltd | Sample polishing method and sample polishing apparatus |
CN102814738A (en) * | 2011-06-08 | 2012-12-12 | 株式会社荏原制作所 | Method and apparatus for conditioning a polishing pad |
CN107553262A (en) * | 2017-09-14 | 2018-01-09 | 嘉善惠龙金属制品有限公司 | A kind of fastener sanding apparatus |
CN208514310U (en) * | 2018-06-04 | 2019-02-19 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Single double-faced grinding and polishing machine |
CN209319540U (en) * | 2018-11-25 | 2019-08-30 | 醴陵市东方电子有限公司 | Twin grinder is used in a kind of processing of power semiconductor device |
-
2019
- 2019-10-21 CN CN201911002359.1A patent/CN110744450B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690544A (en) * | 1995-03-31 | 1997-11-25 | Nec Corporation | Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad |
JPH11123658A (en) * | 1997-10-21 | 1999-05-11 | Speedfam Co Ltd | Dresser and dressing device |
JP2000343406A (en) * | 1999-06-02 | 2000-12-12 | Sumitomo Metal Ind Ltd | Sample polishing method and sample polishing apparatus |
CN102814738A (en) * | 2011-06-08 | 2012-12-12 | 株式会社荏原制作所 | Method and apparatus for conditioning a polishing pad |
CN107553262A (en) * | 2017-09-14 | 2018-01-09 | 嘉善惠龙金属制品有限公司 | A kind of fastener sanding apparatus |
CN208514310U (en) * | 2018-06-04 | 2019-02-19 | 湖南省新化县鑫星电子陶瓷有限责任公司 | Single double-faced grinding and polishing machine |
CN209319540U (en) * | 2018-11-25 | 2019-08-30 | 醴陵市东方电子有限公司 | Twin grinder is used in a kind of processing of power semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114012605A (en) * | 2022-01-05 | 2022-02-08 | 杭州众硅电子科技有限公司 | Polishing pad dressing device |
CN114012605B (en) * | 2022-01-05 | 2022-05-17 | 杭州众硅电子科技有限公司 | Polishing pad trimming device |
Also Published As
Publication number | Publication date |
---|---|
CN110744450B (en) | 2021-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211026 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |