CN110740002A - an electronic device - Google Patents

Abstract

The invention provides electronic equipment which comprises a shell, a millimeter wave antenna module and a processing module, wherein the millimeter wave antenna module and the processing module are positioned in the shell, the processing module comprises a processing component and a metal piece arranged at the periphery of the processing component, and the millimeter wave antenna module is arranged at any position of the periphery of the metal piece.

Description

an electronic device

technical field

The present application relates to the field of electronic technology, and in particular, to an electronic device.

Background technique

5G NR mainly uses two frequency bands: FR1 band and FR2 band. The frequency range of the FR1 band is 450MHz to 6GHz, also known as the sub-6GHz band; the frequency range of the FR2 band is 24.25GHz to 52.6GHz, which is usually called millimeter wave (mmWave). For mobile phone antenna design, the sub-6GHz from 1G to 5G is basically the increase in quantity (such as the number of frequency bands and the number of antennas), which is the refinement and optimization of antenna design, such as the increase in the number of wireless communication frequency bands and the increase in the number of antennas. The increase in quantity, however, the antenna design of the millimeter wave band is a qualitative leap for mobile phone antennas (such as array design and beamforming).

In order to achieve better beamforming to achieve wider space coverage, antenna types with complementary radiation beams (such as broadside radiation, that is, broadside radiation, and end-fire radiation, that is, end-fire) are generally used (such as patchantenna. The chip antenna is designed in conjunction with the quasi-Yagi antenna, and is based on the appropriate design of the antenna feed point to achieve dual-polarization (vertical and horizontal polarization) coverage to increase the wireless communication connection capability, and The RFIC (ie radio frequency chip) is soldered upside down to shorten the antenna feed line as much as possible to reduce the high path loss caused by high frequency transmission, so that the millimeter wave antenna array has a higher radiation gain and achieves a better EIRP (ie effective isotropic radiation power) and coverage strength, but there is still a problem in the prior art that the radiation performance of the millimeter-wave antenna in the whole machine is difficult to control.

SUMMARY OF THE INVENTION

The present invention provides an electronic device for solving the problem that the radiation performance regulation of the millimeter wave antenna module in the electronic device is difficult in the prior art.

In order to achieve the above object, the present invention provides an electronic device, comprising: a casing, a millimeter-wave antenna module and a processing module, wherein the millimeter-wave antenna module and the processing module are located in the casing, and the processing The module includes a processing component and a metal piece arranged on the periphery of the processing component, and the millimeter-wave antenna module is arranged anywhere on the periphery of the metal piece.

Further, the processing module is a camera module, and the camera module includes an imaging component and a bracket for accommodating the imaging component, and the bracket is the metal piece.

Further, the processing module is an audio module, and the audio module includes a sound-generating unit and a housing case for accommodating the sound-generating unit, and the housing housing is the metal piece.

Further, the processing module is a central processing component module, and the central processing component module includes a central processing component and a shielding cover disposed on the periphery of the central processing component, and the shielding cover is the metal piece.

Further, the outer surface of the metal piece is arranged in a corrugated structure.

Further, the wavelength of the millimeter-wave antenna module is λ, and the distance between the millimeter-wave antenna module and the processing module is (0.5-1)λ.

Further, the electronic device further includes a mainboard, the millimeter-wave antenna module is flat on the mainboard, and the upper end surface of the millimeter-wave antenna module is located between the upper end surface of the processing module and the processing module. between the lower end faces of the group.

Further, the electronic device further includes a mainboard, the millimeter-wave antenna module is placed obliquely on the mainboard, and the millimeter-wave antenna module includes an upper slope obliquely opposite to the metal piece and a surface opposite to the upper slope. The slope is opposite to the lower slope, and the upper slope is located between the upper end surface of the processing module and the lower end surface of the processing module.

Further, the millimeter wave antenna module is arranged on one side of the metal piece.

Further, the millimeter wave antenna modules are symmetrically arranged on both sides of the metal piece.

Compared with the prior art, the beneficial effect of the present invention is: by arranging the millimeter-wave antenna module at the periphery of the processing module, the main radiation direction of the millimeter-wave antenna module is toward the processing module, and when the millimeter-wave antenna module is directed toward the processing module, the When the millimeter wave is radiated externally, the millimeter wave is reflected by the metal parts of the processing module, so that the main radiation direction of the millimeter wave antenna module is deflected, and the radiation direction and range of the millimeter wave antenna module are changed. A set of metal parts provides a means to control the pattern of the millimeter-wave antenna. The present technical solution solves the problem that the radiation performance of the millimeter-wave antenna in the electronic equipment is difficult to control in the prior art.

Description of drawings

1 is a schematic structural diagram of an electronic device in Embodiment 1 of the present application;

Fig. 2 is the sectional view of Fig. 1;

3 is a schematic structural diagram of an electronic device according to Embodiment 1 of the present application;

Fig. 4 is the sectional view of Fig. 3;

FIG. 5 is a cross-sectional view of the electronic device in the second embodiment of the application.

Wherein, the above-mentioned drawings include the following reference signs:

10. Housing; 20. Millimeter wave antenna module; 30. Processing module; 31. Processing component; 32. Metal parts.

Detailed ways

In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described above are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1:

Please refer to FIG. 1 to FIG. 4, an electronic device includes: a housing 10, a millimeter-wave antenna module 20 and a processing module 30, the millimeter-wave antenna module 20 and the processing module 30 are located in the housing 10, and the processing module The group 30 includes a processing component 31 and a metal piece 32 disposed on the periphery of the processing component 31 , and the millimeter-wave antenna module 20 is arranged anywhere on the periphery of the metal piece 32 .

In the present invention, by disposing the millimeter wave antenna module 20 at the periphery of the processing module 30, the main radiation direction of the millimeter wave antenna module 20 faces the processing module 30, and when the millimeter wave antenna module 20 radiates the millimeter wave outwards When the millimeter wave hits the metal parts 32 of the processing module 30 and is reflected, the main radiation direction of the millimeter wave antenna module 20 is deflected, and the radiation direction and range of the millimeter wave antenna module 20 are changed. The metal pieces of group 30 provide a means of adjusting the pattern of the mmWave antenna. The present technical solution solves the problem that the radiation performance of the millimeter-wave antenna in the electronic equipment is difficult to control in the prior art.

In this embodiment, the processing module 30 is a camera module, and the camera module includes an imaging component and a bracket for accommodating the imaging component, and the bracket is a metal piece 32 . It should be noted that the processing module 30 is not limited to the camera module, and further, the processing module 30 is an audio module, and the audio module includes a sounding unit and a housing case for housing the sounding unit, and the housing case is a metal part 32, that is, the millimeter-wave antenna module 20 can also be arranged at the periphery of the audio module, and the main radiation direction of the millimeter-wave antenna module 20 can be deflected by the receiving shell on the periphery of the audio module. Further, the processing module 30 may be a central processing unit module, and the central processing unit module includes a central processing unit and a shielding cover disposed on the periphery of the central processing unit, and the shielding cover is a metal piece 32 . That is, the millimeter-wave antenna module 20 is arranged around the central processing unit module, that is, the millimeter-wave can be reflected by the shielding cover, so as to realize the regulation and control of the pattern of the millimeter-wave antenna. From the above, it can be seen that the means of adjusting the pattern of the millimeter wave antenna by means of the equipped parts with the metal parts 32 according to the parts arrangement and space allocation of the electronic equipment belong to the technical content of the present invention.

Preferably, the outer surface of the metal piece 32 is arranged in a corrugated structure. By setting the corrugated structure on the surface of the metal part 32 , the reflection range of the millimeter wave can be increased. Of course, the outer surface of the metal part 32 can be roughened by other structures to adjust the reflection range of the millimeter wave antenna module 20 . The material of the metal part 32 is composed of copper, stainless steel, aluminum alloy or other metal materials, and the reflection intensity of the millimeter wave can be changed by selecting the material of the metal part 32 .

Preferably, when the wavelength of the millimeter wave antenna module 20 is λ, the distance between the millimeter wave antenna module 20 and the processing module 30 is (0.5-1)λ, and the millimeter wave antenna module 20 and the processing module are set according to the wavelength of the millimeter wave. The distance between the groups 30 is to ensure the radiation performance of the millimeter wave antenna module 20 .

The millimeter-wave is reflected by the metal parts of the processing module. Therefore, the millimeter-wave antenna module 20 can be arbitrarily arranged around the processing module 30 under the condition of spare space. When considering the internal space of the electronic device, the millimeter-wave antenna module 20 can be arranged on one side of the processing module 30, so that the millimeter-wave antenna module 20 can be reflected obliquely toward the metal part 32 of the processing module 30. , thereby improving the spatial coverage of the millimeter-wave antenna module 20 .

When considering the radiation range of the millimeter-wave antenna module 20, referring to FIG. 3 and FIG. 4, the millimeter-wave antenna module 20 can be symmetrically arranged on both sides of the processing module 30, so the two millimeter-wave antenna modules 20 Pointing in the opposite direction not only changes the main radiation directions of the two millimeter-wave antenna modules 20 at the same time, but also greatly improves the spatial coverage of the millimeter-wave antenna modules 20 .

Further, the electronic device also includes a main board, the millimeter wave antenna module 20 is placed on the main board, and the upper end surface of the millimeter wave antenna module 20 is located between the upper end surface of the processing module 30 and the lower end surface of the processing module 30, By properly adjusting the angle and position between the millimeter-wave antenna module 20 and the processing module 30 , the reflection range of the millimeter-wave can be appropriately increased.

Embodiment 2, this embodiment and Embodiment 1 mainly have the following differences: refer to FIG. 5 in detail, when the space of the electronic equipment is spare, it can also be considered to place the millimeter-wave antenna module 20 on the main board obliquely, and the millimeter-wave antenna module 20 includes an upper slope opposite to the metal piece 32 and a lower slope opposite to the upper slope. The upper slope is located between the upper end surface of the processing module 30 and the lower end surface of the processing module 30 . Similarly, by adjusting the inclination angle of the millimeter-wave antenna module 20 relative to the processing module 30, the reflection range can be further expanded on this basis. The rest of the structural components are the same as those in the first embodiment, and are not repeated here.

In the above-mentioned embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

The above is a description of the electronic equipment provided in this application. For those skilled in the art, according to the ideas of the embodiments of this application, there will be changes in the specific implementation and application scope. In conclusion, the content of this specification should not be It is construed as a limitation of this application.

Claims (10)

1. An electronic device of the type , comprising:

   the millimeter wave antenna module and the processing module are located in the shell, the processing module comprises a processing assembly and a metal piece arranged on the periphery of the processing assembly, and the millimeter wave antenna module is arranged at any position of the periphery of the metal piece.
2. 2. The electronic device of claim 1, wherein the processing module is a camera module, the camera module comprises an imaging component and a bracket for receiving the imaging component, and the bracket is the metal piece.
3. 3. The electronic device according to claim 1, wherein the processing module is an audio module, the audio module includes a sound-emitting unit and a housing case for housing the sound-emitting unit, and the housing case is the metal member.
4. 4. The electronic device of claim 1, wherein the processing module is a central processor module, the central processor module comprising a central processing unit and a shield cover disposed around the central processing unit, the shield cover being the metallic member.
5. 5. The electronic device according to any of of claims 1-4, wherein an outer surface of the metallic article is configured in a corrugated configuration.
6. 6. The electronic device of claim 5, wherein the millimeter wave antenna module has a wavelength λ and is located at a distance of (0.5-1) λ from the processing module.
7. 7. The electronic device according to claim 6, further comprising a motherboard on which the millimeter wave antenna module lies, wherein an upper end surface of the millimeter wave antenna module is located between an upper end surface of the processing module and a lower end surface of the processing module.
8. 8. The electronic device according to claim 6, further comprising a motherboard on which the millimeter wave antenna module is obliquely placed, wherein the millimeter wave antenna module comprises an upper inclined surface diagonally opposite to the metal member and a lower inclined surface diagonally opposite to the upper inclined surface, and the upper inclined surface is located between an upper end surface of the processing module and a lower end surface of the processing module.
9. 9. The electronic device of claim 1, wherein the millimeter wave antenna module is disposed on an side of the metallic article.
10. 10. The electronic device of claim 1, wherein the millimeter wave antenna modules are symmetrically disposed on two sides of the metal member.

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