CN110729274A - Smart card module and packaging process thereof - Google Patents
Smart card module and packaging process thereof Download PDFInfo
- Publication number
- CN110729274A CN110729274A CN201911093836.XA CN201911093836A CN110729274A CN 110729274 A CN110729274 A CN 110729274A CN 201911093836 A CN201911093836 A CN 201911093836A CN 110729274 A CN110729274 A CN 110729274A
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- metal layer
- card module
- smart card
- chip
- layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4875—Connection or disconnection of other leads to or from bases or plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses an intelligent card module and a packaging process thereof, wherein the intelligent card module adopts a substrate layer, a first metal layer is laid on the surface of the substrate layer, a second metal layer is glued on the surface of one side of the first metal layer, which is far away from the substrate layer, the second metal layer is electrically connected with the first metal layer through a metallized hole, the surface of one side of the second metal layer, which is far away from the first metal layer, is convexly provided with two oppositely-arranged connecting bulges, the two connecting bulges are arranged on the surface of the second metal layer in an extending way and form a die bonding area, and a chip is arranged in the die bonding area. The first metal layer and the second metal layer are electrically connected through the metallized holes, so that a gold thread bonding process can be omitted, the production time and the production cost are greatly saved, meanwhile, the chip is fixed on the two connecting bulges through a die bonding process, the electrical connection between the chip and the second metal layer is realized, and compared with gold thread connection, the electrical connection is more stable, so that the stability of the performance of the intelligent card module can be improved.
Description
Technical Field
The invention relates to the technical field of microelectronic semiconductor packaging, in particular to a smart card module and a packaging process thereof.
Background
Smart Card (Smart Card): a generic term for a plastic card (usually the size of a credit card) with a microchip embedded therein. Some smart cards contain a microelectronic chip and require data interaction via a reader/writer. The smart card is equipped with CPU, RAM and I/O, and can process a large amount of data without interfering the operation of the CPU of the host computer. The smart card may also filter out erroneous data to relieve the host CPU of the burden. The method is suitable for occasions with more ports and higher communication speed requirements. The integrated circuit in the card comprises a central processing unit CPU, a programmable read-only memory EEPROM, a random access memory RAM and a card Operating system COS (chip Operating system) solidified in the read-only memory ROM. The data in the card is divided into an external reading part and an internal processing part.
At present, the conventional intelligent module packaging generally adopts a substrate layer of a carrier tape, a single-sided or double-sided copper-clad circuit is arranged, then an intelligent card chip is connected by bonding and routing, and after the intelligent card chip is finished, the intelligent card module is directly molded or UV packaged to realize high reliability of the intelligent card module. The packaging method requires that a corresponding carrier tape can be directly provided with gold wires, the carrier tape is produced by foreign manufacturers exclusively at present, the cost of the die is high, and the unit price is expensive. This makes the cost of intelligent module encapsulation high, very big reduction corresponding intelligent module's market competition.
Disclosure of Invention
The invention mainly aims to provide a smart card module, aiming at shortening production, reducing production cost and improving the stability of the performance of the smart card module.
In order to achieve the above object, the present invention provides a smart card module, comprising:
a substrate layer;
the first metal layer is laid on the surface of the base material layer;
the second metal layer is glued to the surface of one side, away from the base material layer, of the first metal layer, and is electrically connected to the first metal layer through a metallization hole, two oppositely arranged connecting bulges are formed on the surface of one side, away from the first metal layer, of the second metal layer in a protruding mode, and the two connecting bulges extend from the surface of the second metal layer and form a die bonding area;
and the chip is arranged in the die bonding area.
Optionally, the cross section of the connecting projection is semi-elliptical.
Optionally, the surface of the second metal layer facing the first metal layer is recessed to form two opposite connecting recesses, and the two connecting recesses correspond to the two connecting protrusions respectively.
Optionally, the first metal layer and the second metal layer are made of copper foils with surfaces subjected to electroplating process and oxidation prevention treatment.
Optionally, the first metal layer and the second metal layer are bonded by resin.
Optionally, the material of the base material layer is composed of any one of polydimethylsilane, polyimide, polyethylene, polyvinylidene fluoride and natural rubber.
The invention also provides a packaging process of the smart card module, which comprises the following steps:
providing a substrate layer, a first metal layer, a second metal layer and a chip, wherein the surface of one side of the second metal layer is convexly provided with two oppositely arranged connecting bulges, and the two connecting bulges form a die bonding area;
and (3) laminating: sequentially pressing the first metal layer and the second metal layer on the surface of the substrate layer along a direction departing from the connecting protrusion;
drilling and metallizing: drilling holes at corresponding positions of the first metal layer and the second metal layer, and carrying out metallization treatment on the drilled holes;
etching the circuit: etching lines on the surfaces of the first metal layer and the second metal layer;
and (3) crystal solidification: fixing the chip in the die bonding area through dispensing treatment;
packaging: coating ultraviolet curing glue on the chip fixed in the die bonding area, and curing the chip in a UV (ultraviolet) furnace to obtain a strip;
card making: and carrying out a final card manufacturing process on the manufactured strip to manufacture the intelligent card module.
Has the advantages that:
according to the technical scheme, the substrate layer is adopted, the first metal layer is laid on the surface of the substrate layer, the second metal layer is glued to the surface of the first metal layer, which is far away from one side of the substrate layer, the second metal layer is electrically connected to the first metal layer through the metallized hole, the surface of the second metal layer, which is far away from one side of the first metal layer, is convexly provided with the two oppositely-arranged connecting bulges, the two connecting bulges are arranged on the surface of the second metal layer in an extending mode and form a die bonding area, and the chip is arranged in the die bonding area. The first metal layer and the second metal layer are electrically connected through the metallized holes, so that a gold thread bonding process can be omitted, the production time and the production cost are greatly saved, meanwhile, the chip is fixed on the two connecting bulges through a die bonding process, the electrical connection between the chip and the second metal layer is realized, and compared with gold thread connection, the electrical connection is more stable, so that the stability of the performance of the intelligent card module can be improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a cross-sectional view of one embodiment of a smart card module of the present invention;
fig. 2 is a flowchart of a process for packaging a smart card module according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
30b | Connection recess |
| 1a | Metallized |
20 | Resin composition |
| 10 | A |
40 | Chip and method for manufacturing the same |
| 30 | |
50 | |
| 31 | Connecting |
50a | Clamping |
| 30a | Die |
60 | Ultraviolet curing adhesive |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, the present invention proposes a smart card module 1.
In an embodiment of the present invention, the smart card module 1 includes:
a substrate layer;
the first metal layer 10 is laid on the surface of the base material layer, and the first metal layer 10 is laid on the surface of the base material layer;
the second metal layer 30 is bonded to the surface of the first metal layer 10 on the side away from the substrate layer, the second metal layer 30 is electrically connected to the first metal layer 10 through the metalized hole 1a, two oppositely arranged connecting protrusions 31 are formed on the surface of the second metal layer 30 on the side away from the first metal layer 10 in a protruding manner, and the two connecting protrusions 31 extend from the surface of the second metal layer 30 to form a die bonding area 30 a;
and the chip 40 is arranged in the die bonding area 30 a.
In an embodiment of the invention, the substrate layer is made of FR4 or G10 material, the first metal layer 10 and the second metal layer 30 are made of copper foil material, the surface of the copper foil is subjected to electroplating process and anti-oxidation treatment, the first metal layer 10 and the second metal layer 30 are bonded into a whole through resin 20 and are pressed on the surface of the substrate layer through a pressing process, the second metal layer 30 is electrically connected to the first metal layer 10 through a metalized hole 1a, and the surface of the second metal layer 30, which is away from the first metal layer 10, is convexly provided with two oppositely-arranged connecting protrusions 31, the cross section of each connecting protrusion 31 is arranged in a semi-elliptical shape, the elliptically-arranged connecting protrusion 31 has high strength, the connecting protrusion 31 is used for forming a die bonding area 30a, and the chip 40 is connected to the two connecting protrusions 31 through a dispensing process.
According to the technical scheme, the substrate layer is adopted, the first metal layer 10 is laid on the surface of the substrate layer, the second metal layer 30 is glued to the surface of one side, away from the substrate layer, of the first metal layer 10, the second metal layer 30 is electrically connected to the first metal layer 10 through the metallized hole 1a, the surface of one side, away from the first metal layer 10, of the second metal layer 30 is convexly arranged to form two oppositely arranged connecting bulges 31, the two connecting bulges 31 extend from the surface of the second metal layer 30 to form a die bonding area 30a, and the chip 40 is arranged in the die bonding area 30 a. In the invention, the first metal layer 10 and the second metal layer 30 are electrically connected through the metallized hole 1a, so that a gold wire bonding process can be omitted, the production time and the production cost are saved to a greater extent, meanwhile, the chip 40 is fixed on the two connecting bulges 31 through a die bonding process, the electrical connection of the chip 40 and the second metal layer 30 is realized, compared with the gold wire connection, the electrical connection of the invention is more stable, and the performance stability of the smart card module 1 can be improved.
In order to make the bonding between the second metal layer 30 and the first metal layer 10 more firm, in an embodiment of the present application, the surface of the second metal layer 30 facing the first metal layer 10 is recessed to form two connecting recesses 30b disposed oppositely, the cross section of the connecting recess 30b is also semi-elliptical, and the two connecting recesses 30b correspond to the two connecting protrusions 31, respectively. By providing the two connecting recesses 30b, when the first metal layer 10 and the second metal layer 30 are bonded together by the resin 20, the resin 20 can penetrate into the two connecting recesses 30b to enlarge the connecting area, so that the overall structure of the smart card module 1 is more reliable, and the performance stability of the smart card module 1 is greatly improved.
In an embodiment of the present application, the smart card module 1 includes a smart card substrate 50, the smart card substrate 50 is formed with a whole rectangular-shaped slot 50a, when the chip 40 is fixed to the two connection protrusions 31 of the second metal layer 30 through the ultraviolet curing adhesive 60, after the smart card strip is obtained, the smart card strip is bonded to the smart card substrate 50, the chip 40 is accommodated in the slot 50a, so not only the smart card module 1 can be manufactured through a card manufacturing process, but also the chip 40 is accommodated in the slot 50a, which can protect the smart card module 1, thereby prolonging the service life of the smart card module 1.
Referring to fig. 2, the present invention further provides a packaging process for producing the smart card module 1 in the above embodiment, wherein the packaging process includes the following steps:
providing a substrate layer, a first metal layer 10, a second metal layer 30 and a chip 40, wherein the surface of one side of the second metal layer 10 is convexly provided with two oppositely arranged connecting bulges 31, and the two connecting bulges 31 form a die bonding area 30 a;
and (3) laminating: sequentially pressing the first metal layer 10 and the second metal layer 30 on the surface of the substrate layer along the direction departing from the connecting projection 31;
drilling and metallizing: drilling holes at corresponding positions of the first metal layer 10 and the second metal layer 30, and carrying out metallization treatment on the drilled holes to form metallized holes 1 a;
etching the circuit: etching lines on the surfaces of the first metal layer 10 and the second metal layer 30;
and (3) crystal solidification: fixing the chip 40 to the die bonding area 30a by dispensing;
packaging: coating ultraviolet curing glue 60 on the chip 40 fixed on the die bonding area 30a, and curing the chip in a UV (ultraviolet) furnace to obtain a strip;
card making: and performing a final card manufacturing process on the manufactured strip to manufacture the intelligent card module 1.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A smart card module, comprising:
a substrate layer;
the first metal layer is laid on the surface of the base material layer;
the second metal layer is glued to the surface of one side, away from the base material layer, of the first metal layer, and is electrically connected to the first metal layer through a metallization hole, two oppositely arranged connecting bulges are formed on the surface of one side, away from the first metal layer, of the second metal layer in a protruding mode, and the two connecting bulges extend from the surface of the second metal layer and form a die bonding area;
and the chip is arranged in the die bonding area.
2. The smart card module of claim 1, wherein the connecting protrusion has a semi-elliptical shape in cross section.
3. The smart card module as claimed in claim 1, wherein the surface of the second metal layer facing the first metal layer is recessed to form two opposing connection recesses, and the two connection recesses correspond to the two connection protrusions, respectively.
4. The smart card module of claim 1, wherein the first metal layer and the second metal layer are made of copper foil with surfaces subjected to an electroplating process and an oxidation prevention treatment.
5. The smart card module of claim 1, wherein the first metal layer and the second metal layer are glued by a resin.
6. The smart card module of claim 1 wherein the substrate layer is made of material FR4 or G10.
7. A packaging process of a smart card module is characterized by comprising the following steps:
providing a substrate layer, a first metal layer, a second metal layer and a chip, wherein the surface of one side of the second metal layer is convexly provided with two oppositely arranged connecting bulges, and the two connecting bulges form a die bonding area;
and (3) laminating: sequentially pressing the first metal layer and the second metal layer on the surface of the substrate layer along a direction departing from the connecting protrusion;
drilling and metallizing: drilling holes at corresponding positions of the first metal layer and the second metal layer, and carrying out metallization treatment on the drilled holes;
etching the circuit: etching lines on the surfaces of the first metal layer and the second metal layer;
and (3) crystal solidification: fixing the chip in the die bonding area through dispensing treatment;
packaging: coating ultraviolet curing glue on the chip fixed in the die bonding area, and curing the chip in a UV (ultraviolet) furnace to obtain a strip;
card making: and carrying out a final card manufacturing process on the manufactured strip to manufacture the intelligent card module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911093836.XA CN110729274A (en) | 2019-11-11 | 2019-11-11 | Smart card module and packaging process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911093836.XA CN110729274A (en) | 2019-11-11 | 2019-11-11 | Smart card module and packaging process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110729274A true CN110729274A (en) | 2020-01-24 |
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ID=69225165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911093836.XA Pending CN110729274A (en) | 2019-11-11 | 2019-11-11 | Smart card module and packaging process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110729274A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19640304A1 (en) * | 1996-09-30 | 1998-04-02 | Siemens Ag | Chip module in particular for implantation in a chip card body |
| CN104636793A (en) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | Intelligent card and method for manufacturing same |
| CN210516715U (en) * | 2019-11-11 | 2020-05-12 | 澄天伟业(宁波)芯片技术有限公司 | Smart card module |
-
2019
- 2019-11-11 CN CN201911093836.XA patent/CN110729274A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19640304A1 (en) * | 1996-09-30 | 1998-04-02 | Siemens Ag | Chip module in particular for implantation in a chip card body |
| CN104636793A (en) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | Intelligent card and method for manufacturing same |
| CN210516715U (en) * | 2019-11-11 | 2020-05-12 | 澄天伟业(宁波)芯片技术有限公司 | Smart card module |
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