Disclosure of Invention
The invention aims to provide a temperature control device and a patrol system, which can improve temperature control precision.
Embodiments of the invention may be implemented as follows:
in a first aspect, the embodiment of the invention provides a temperature control device, which comprises a main path temperature sensor, a control unit, a main control unit, a circulating pump, a cooling tank, a plurality of circulating pipes, a plurality of auxiliary control temperature sensors and a plurality of auxiliary control units, wherein the main control unit and the circulating pump are connected through the circulating pipes, the circulating pump and the cooling tank are connected through the circulating pipes, the plurality of auxiliary control units are respectively communicated with the main control unit and the cooling tank through the circulating pipes after being connected in parallel, the main path temperature sensor is arranged at the main control unit, the plurality of auxiliary control temperature sensors are correspondingly arranged at the plurality of auxiliary control units, and the control unit is electrically connected with the main path temperature sensor, the auxiliary control temperature sensor, the main control unit and the auxiliary control unit;
the cooling box is used for storing cooling medium;
the circulating pump can enable a cooling medium to flow among the circulating pipe, the main control unit and the auxiliary control unit;
the main circuit temperature sensor is used for detecting the main circuit temperature at the main control unit;
the control unit is used for acquiring the main path temperature and controlling the main control unit to exchange heat when the main path temperature exceeds a first interval;
the slave temperature sensor is used for detecting the slave temperature at the slave control unit corresponding to the slave temperature sensor;
The control unit is also used for acquiring the slave control temperature and controlling the slave control unit to exchange heat when the slave control temperature exceeds a second interval.
In an optional embodiment, the control unit is further configured to obtain the slave temperature when the main path temperature does not exceed the first interval.
In an alternative embodiment, the main control unit comprises a main control water cooling tank and a main control heat exchange piece, the main control heat exchange piece is attached to the main control water cooling tank, a liquid inlet of the main control water cooling tank is communicated with a liquid outlet of the circulating pump through the circulating pipe, the main path temperature sensor is arranged at the liquid inlet of the main control water cooling tank, and the main path temperature sensor is electrically connected with the control unit;
the main path temperature sensor is used for detecting the main path temperature at the main control water cooling box;
And the control unit is used for controlling the main control heat exchange piece to exchange heat with the cooling medium in the water cooling tank when the temperature of the main path exceeds a first interval.
In an alternative embodiment, the main control heat exchange member comprises a main control heat exchange member and a main control heat dissipation member, wherein one side of the main control heat exchange member is attached to the main control water cooling tank, and the other side is attached to the main control heat dissipation member.
In optional implementation mode, the main control heat dissipation piece includes main control fin and main control heat dissipation fan, the main control fin with the main control temperature controller spare is kept away from one side laminating of main control water cooling tank, the main control heat dissipation fan with the main control fin is kept away from one side laminating of main control temperature controller spare.
In an optional embodiment, the secondary control unit comprises a secondary control water cooling tank and a secondary control temperature device, one side of the secondary control water cooling tank is attached to the secondary control temperature device, and the secondary control temperature sensor is arranged at the secondary control water cooling tank;
The slave temperature sensor is used for detecting the slave temperature at the slave water cooling box;
the control unit is used for acquiring the slave control temperature and controlling the slave control temperature to exchange heat when the slave control temperature exceeds a second interval.
In an optional embodiment, the slave control unit further comprises a slave control radiating fin and a slave control radiating fan, wherein the slave control radiating fin is attached to one side, far away from the slave control temperature control device, of the slave control water cooling tank, and the slave control radiating fan is attached to one side, far away from the slave control temperature control device, of the slave control radiating fin.
In an alternative embodiment, the slave control unit further comprises a mounting shell, the mounting shell is provided with a circulation channel, the slave control temperature control device is mounted on the mounting shell, the slave control temperature control device is arranged in the circulation channel, and the slave control water cooling tank is arranged outside the circulation channel.
In an alternative embodiment, the mounting shell includes a housing and a fixing shell, the fixing shell is mounted in the housing, and the flow channel is formed between the mounting shell and the fixing shell.
In a second aspect, an embodiment of the present invention provides a patrol system, including a patrol robot and a temperature control device according to any one of the foregoing embodiments, where the patrol robot includes a body and a plurality of devices, the master control unit is installed on the body, and the plurality of slave control units are attached to the plurality of devices in a one-to-one correspondence.
The temperature control device comprises a main path temperature sensor, a control unit, a main control unit, a circulating pump, a cooling tank, a plurality of circulating pipes, a plurality of auxiliary control temperature sensors and a plurality of auxiliary control units, wherein the main control unit and the circulating pump are connected through the circulating pipes, the circulating pump is connected with the cooling tank through the circulating pipes, the auxiliary control units are respectively communicated with the main control unit and the cooling tank through the circulating pipes after being connected in parallel, the main path temperature sensor is arranged at the main control unit, the plurality of auxiliary control temperature sensors are correspondingly arranged at the plurality of auxiliary control units, the control unit is electrically connected with the main path temperature sensor, the auxiliary control temperature sensors, the main control unit and the auxiliary control unit, the cooling tank is used for storing cooling medium, the circulating pump can enable the cooling medium to flow among the circulating pipes, the main control unit and the auxiliary control unit, the main path temperature sensor is used for detecting the main path temperature at the main control unit, the control unit is used for acquiring the main path temperature, when the main path temperature exceeds a first interval, the auxiliary control temperature sensor is used for detecting the auxiliary control temperature at the corresponding auxiliary control unit, the auxiliary control unit is correspondingly arranged, the auxiliary control unit is electrically connected with the auxiliary control unit, the auxiliary control unit is electrically connected with the main control unit, and the auxiliary control unit is used for heat exchanging heat when the auxiliary control unit is used for acquiring the auxiliary control unit and the auxiliary control unit exceeds a second temperature control unit.
In the invention, the main control unit is arranged on the mounting frame of the inspection equipment, the plurality of slave control units are arranged on the plurality of components in a one-to-one correspondence manner, and when the main path temperature acquired by the control unit exceeds a first interval, the main control unit is controlled to exchange heat for the cooling medium. When the slave control temperature obtained by the control unit exceeds the second interval, the slave control unit is controlled to exchange heat with the cooling medium at the slave control unit. In the invention, the main control unit mainly detects the main path temperature of the cooling medium on the main path, and the main path temperature of the cooling medium on the main path is regulated under the control of the control unit to primarily regulate the working temperature of each component. The slave control unit is correspondingly arranged with the components, and adjusts the working temperature of the corresponding components. According to the invention, the working temperature of each component is secondarily adjusted through the cooperation of the master control unit and the slave control unit, so that the accuracy of temperature adjustment is improved.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1 and 2, the present embodiment provides a temperature control device 100, where the temperature control device 100 provided in the present embodiment is mainly applied to inspection equipment, and can improve the temperature adjustment accuracy of the inspection equipment.
The temperature control device 100 provided in this embodiment is mainly applied to inspection equipment, and exchanges heat for the inspection equipment, so that the temperature of the inspection equipment is always within a working temperature range, and the inspection equipment can work normally in extremely cold areas or extremely hot areas. The inspection equipment comprises an installation body and a plurality of components, wherein the components are installed on the installation body.
In this embodiment, the temperature control device 100 includes a main path temperature sensor 110, a control unit 120, a main control unit 130, a circulating pump 140, a cooling tank 150, a plurality of circulating pipes 160, a plurality of slave temperature sensors 170 and a plurality of slave control units 180, wherein the main control unit 130 and the circulating pump 140 are connected through the circulating pipes 160, the circulating pump 140 and the cooling tank 150 are connected through the circulating pipes 160, the plurality of slave control units 180 are respectively communicated with the main control unit 130 and the cooling tank 150 through the circulating pipes 160 after being connected in parallel, the main path temperature sensor 110 is arranged at the main control unit 130, the plurality of slave temperature sensors 170 are correspondingly arranged at the plurality of slave control units 180, and the control unit 120 is electrically connected with the main path temperature sensor 110, the slave temperature sensors 170, the main control unit 130 and the slave control units 180;
the cooling tank 150 is used for storing a cooling medium;
The circulation pump 140 can flow a cooling medium among the circulation pipe 160, the master unit 130, and the slave unit 180;
the main circuit temperature sensor 110 is used for detecting the main circuit temperature at the main control unit 130;
The control unit 120 is configured to obtain a main circuit temperature, and when the main circuit temperature exceeds a first interval, control the main control unit 130 to exchange heat;
The slave temperature sensor 170 is used for detecting a slave temperature at the slave control unit 180 corresponding thereto;
the control unit 120 is further configured to obtain a slave control temperature, and control the slave control unit 180 to exchange heat when the slave control temperature exceeds the second interval.
In this embodiment, the master control unit 130 is mounted on a mounting frame of the inspection apparatus, and the plurality of slave control units 180 are mounted on the plurality of components in a one-to-one correspondence, and when the main path temperature acquired by the control unit 120 exceeds the first interval, the master control unit 130 is controlled to perform heat exchange for the cooling medium. When the slave temperature obtained by the control unit 120 exceeds the second interval, the slave control unit 180 is controlled to exchange heat with the cooling medium. In this embodiment, the main control unit 130 mainly detects the main path temperature of the cooling medium on the main path, and adjusts the main path temperature of the cooling medium on the main path under the control of the control unit 120 to perform preliminary adjustment on the operating temperatures of the respective components. The slave control unit 180 is installed corresponding to the components, and adjusts the operating temperature of the corresponding components. In this embodiment, the working temperature of each component is secondarily adjusted by the cooperation of the master control unit 130 and the slave control unit 180, so that the accuracy of temperature adjustment is improved.
In this embodiment, the slave control unit 180 may independently adjust the working temperatures of the corresponding components, that is, may independently adjust the working temperatures of the multiple components, so as to implement multi-point temperature adjustment.
Wherein the cooling medium is in the same environment as the respective components, the operating temperature of the respective components may thus be approximately equal to the temperature of the cooling medium at the corresponding slave unit 180.
In this embodiment, the control unit 120 is further configured to obtain the slave temperature when the master temperature does not exceed the first interval.
In this embodiment, after the inspection apparatus starts to work, the control unit 120 first obtains the main path temperature detected by the main control temperature detector, and when the main path temperature exceeds the first interval, the main control unit 130 is controlled to perform heat exchange, so as to adjust the main path temperature to the first interval. When the main path temperature does not exceed the first interval, the slave temperature detected by the slave temperature detector is acquired, and when the slave temperature exceeds the second interval, the slave control unit 180 is controlled to exchange heat. That is, when the main-path temperature is within the first section, the main-path temperature is adjusted preferentially, and then the sub-control temperatures are adjusted.
In the present embodiment, the main-path temperature is preferentially adjusted
Referring to fig. 3 and 4, in the present embodiment, the master control unit 130 includes a master control water-cooling tank 132 and a master control heat exchange member 134, the master control heat exchange member 134 is attached to the master control water-cooling tank 132 through a master control temperature control member 1342, a liquid inlet of the master control water-cooling tank 132 is communicated with a liquid outlet of the circulation pump 140 through a circulation pipe 160 to the slave control unit 180, the master circuit temperature sensor 110 is disposed at the liquid inlet of the master control water-cooling tank 132, and the master circuit temperature sensor 110 is electrically connected with the control unit 120;
The main circuit temperature sensor 110 is used for detecting the main circuit temperature at the main control water cooling box 132;
the control unit 120 is configured to control the main control heat exchange unit 134 to exchange heat with the cooling medium in the water cooling tank when the main path temperature exceeds the first interval.
In this embodiment, when the main circuit temperature is greater than the upper limit of the first interval, which indicates that the main circuit temperature is too high, the control unit 120 controls the main control heat exchange element 134 to radiate heat to the cooling medium in the main control water cooling tank 132, so that the cooling medium flowing out from the liquid outlet of the main control water cooling tank 132 and entering the auxiliary control unit 180 through the circulation pipe 160 is subjected to the first cooling treatment. When the cooling medium entering the slave unit 180 is not in the second zone, the slave unit 180 performs the heat exchange process on the cooling medium again.
When the main circuit temperature is less than the lower limit of the first interval, which means that the main circuit temperature is too low, the control unit 120 controls the main control heat exchange element 134 to heat the cooling medium in the main control water cooling tank 132, so that the cooling medium flowing out from the liquid outlet of the main control water cooling tank 132 and entering the auxiliary control unit 180 through the circulation pipe 160 is subjected to the first heating treatment. When the cooling medium entering the slave unit 180 is not in the second zone, the slave unit 180 performs the heat exchange process again on the cooling medium.
In this embodiment, the main control heat exchange member 134 includes a main control heat exchange member 1342 and a main control heat dissipation member 1344, one side of the main control heat exchange member 1342 is attached to the main control water cooling tank 132, and the other side is attached to the main control heat dissipation member 1344.
In this embodiment, when the main path temperature detected by the main control temperature sensor is less than the lower limit of the first interval, the main control temperature controller 1342 is attached to the main control water-cooling tank 132 and heats the main control water-cooling tank 132, so that the temperature of the cooling medium contained in the main control water-cooling tank 132 is gradually increased. When the main path temperature detected by the main control temperature sensor is greater than the upper limit of the first interval, the main control water cooling tank 132 is gradually cooled by reducing the power of the main control temperature controller 1342, so that the temperature of the cooling medium accommodated in the main control water cooling tank 132 is gradually reduced.
In this embodiment, the main control heat dissipation member 1344 is mainly used for dissipating heat for the main control heat dissipation member 1342, so as to prevent the main control heat dissipation member 1342 from being damaged due to too high temperature of itself when heat exchanging for the cooling medium in the main control water cooling tank 132.
In this embodiment, the main control heat dissipation part 1344 includes a main control heat dissipation plate 1346 and a main control heat dissipation fan 1348, the main control heat dissipation plate 1346 is attached to a side of the main control temperature control device 1342 away from the main control water cooling box 132, and the main control heat dissipation fan 1348 is attached to a side of the main control heat dissipation plate 1346 away from the main control temperature control device 1342.
In this embodiment, when the main path temperature is less than the lower limit of the first interval, which indicates that the main path temperature of the cooling medium in the main control water cooling tank 132 is low, the main control temperature control device 1342 needs to heat the cooling medium in the main control water cooling tank 132, and at this time, the control unit 120 controls the main control temperature control device 1342 to increase the heat exchange power, thereby improving the heating effect. Simultaneously, the main control cooling fan 1348 works to blow away the refrigeration generated on the other side of the main control temperature control device 1342.
When the main path temperature is greater than the upper limit of the first interval, which indicates that the main path temperature of the cooling medium in the main control water cooling tank 132 is higher, the main control temperature controller 1342 needs to dissipate heat to the cooling medium in the main control water cooling tank 132, and at this time, the control unit 120 controls the main control temperature controller 1342 to increase the heat exchange power so as to quickly reduce the temperature of the cooling medium in the main control water cooling tank 132. In this embodiment, the main control temperature device 1342 is a semiconductor temperature control device.
In this embodiment, the main control temperature sensor is disposed at the liquid inlet of the main control water cooling tank 132, the cooling medium flows in the whole device under the action of the circulating pump 140, and the cooling medium flows out from the liquid outlet of the main control water cooling tank 132 and enters the liquid inlet of the main control water cooling property after one cycle, and the main path temperature of the liquid inlet is the highest temperature or the lowest temperature in the whole main path, and when the main path temperature of the liquid inlet of the main control water cooling tank 132 detected by the main control temperature sensor is in the first interval, the main path temperature can be considered to be in the first interval.
Referring to fig. 5, in the present embodiment, the slave control unit 180 includes a slave control water cooling tank 182 and a slave control temperature control device 184, one side of the slave control water cooling tank 182 is attached to the slave control temperature control device 184, and the slave control temperature sensor 170 is disposed at the slave control water cooling tank 182;
the slave temperature sensor 170 is used for detecting the slave temperature at the slave water cooling tank 182;
the control unit 120 is configured to obtain the slave temperature, and control the slave temperature control device 184 to exchange heat when the slave temperature exceeds the second interval.
In this embodiment, the side of the slave water cooling tank 182 away from the slave temperature control device 184 is attached to the surface of the corresponding component. The slave temperature sensor 170 is disposed at the liquid inlet of the slave water cooling tank 182, detects the slave temperature at the liquid inlet of the slave water cooling tank 182, and when the slave temperature is greater than the upper limit of the first interval, which indicates that the slave temperature is too high, the control unit 120 controls the slave heat exchange member to dissipate heat from the cooling medium in the slave water cooling tank 182, and the cooled cooling medium cools the component. When the slave temperature is less than the lower limit of the first interval, which means that the slave temperature is too low, the control unit 120 controls the slave heat exchange member to heat the cooling medium in the slave water cooling tank 182, and the heated cooling medium heats the component.
It should be noted that, the slave control unit 180 provided in this embodiment is mainly applied to a component with a flat shape and a smaller volume, such as an inertial navigation unit (IMU), a camera, etc., where the slave control temperature device 184 is attached to the component at a side far from the slave control water cooling tank 182.
In this embodiment, the slave control unit 180 further includes a slave control heat dissipation fin 186 and a slave control heat dissipation fan 188, where the slave control heat dissipation fin 186 is attached to a side of the slave control heat dissipation fin 184 away from the slave control water cooling box 182, and the slave control heat dissipation fan 188 is attached to a side of the slave control heat dissipation fin 186 away from the slave control heat dissipation fin 184.
In this embodiment, when the slave temperature is less than the lower limit of the second interval, it is indicated that the slave temperature of the cooling medium in the slave water cooling tank 182 is low, and the slave temperature control device 184 needs to heat the cooling medium in the slave water cooling tank 182, at this time, the control unit 120 controls the slave temperature control device 184 to increase the heating power, heat the cooling medium therein, and the cooling medium heats the component by heat conduction, so that the temperature of the component gradually increases.
When the slave temperature is greater than the upper limit of the second interval, which means that the slave temperature of the cooling medium in the slave water cooling tank 182 is higher, the slave temperature control device 184 needs to radiate heat to the cooling medium in the slave water cooling tank 182, and at this time, the control unit 120 controls the slave temperature control device 184 to reduce the power, and the cooled cooling medium absorbs the heat in the component, so that the temperature of the component gradually decreases.
In the present embodiment, the slave temperature control device 184 is a semiconductor temperature control device.
In other embodiments of the present invention, the slave unit 180 may not include the slave heat sink 186 and the slave heat dissipation fan 188, and when the slave unit 180 does not include the slave heat sink 186 and the slave heat dissipation fan 188, a side of the slave temperature control device 184 away from the slave water cooling box 182 is attached to a surface of a component to achieve heat dissipation of the component, which is equivalent to the embodiment, and can achieve the effects of the embodiment, which is within the scope of the present invention.
Referring to fig. 6, it should be noted that, in other embodiments of the present invention, the slave unit 180 may further include a mounting housing 189, the mounting housing 189 has a flow channel 1892, the slave temperature control device 184 is mounted on the mounting housing 189, the slave temperature control device 184 is disposed in the flow channel 1892, and the slave water cooling tank 182 is disposed outside the flow channel 1892.
In the present embodiment, the components are installed in the inner space surrounded by the flow channel 1892, and the slave unit 180 is mainly applicable to components having a large volume or a large number of curved surfaces, for example, radar, by means of thermal convection.
In this embodiment, when the slave temperature is less than the lower limit of the second interval, which means that the temperature of the component is low, the slave temperature controlling device 184 needs to heat the cooling medium in the slave water cooling tank 182, at this time, the control unit 120 controls the slave temperature controlling device 184 to increase the heating power, and the slave heat dissipation fan 188 operates to blow the heat generated by the slave temperature controlling device 184 into the circulation channel 1892 and heat the component located in the circulation channel 1892. When the slave temperature is greater than the upper limit of the second interval, the temperature of the component is higher, and the slave temperature control device 184 needs to radiate heat to the cooling medium in the slave water cooling tank 182, at this time, the control unit 120 controls the slave temperature control device 184 to reduce the power, reduce the rotation speed of the slave heat radiation fan 188, and radiate heat in the circulation channel 1892 to the component located in the circulation channel 1892.
In the present embodiment, the mounting case 189 includes a housing 1894 and a fixing case 1896, the fixing case 1896 is mounted in the housing 1894, and a flow passage 1892 is formed between the mounting case 189 and the fixing case 1896.
In this embodiment, the components are mounted within a stationary housing 1896.
In summary, in the temperature control device 100 provided in this embodiment, the master control unit 130 is mounted on the mounting rack of the inspection equipment, the plurality of slave control units 180 are mounted on the plurality of components in a one-to-one correspondence, and when the main path temperature obtained by the control unit 120 exceeds the first interval, the master control unit 130 is controlled to exchange heat with the cooling medium. When the slave temperature obtained by the control unit 120 exceeds the second interval, the slave control unit 180 is controlled to exchange heat with the cooling medium. In this embodiment, the main control unit 130 mainly detects the main path temperature of the cooling medium on the main path, and adjusts the main path temperature of the cooling medium on the main path under the control of the control unit 120 to perform preliminary adjustment on the operating temperatures of the respective components. The slave control unit 180 is installed corresponding to the components, and adjusts the operating temperature of the corresponding components. In this embodiment, the working temperature of each component is secondarily adjusted by the cooperation of the master control unit 130 and the slave control unit 180, so that the accuracy of temperature adjustment is improved.
Second embodiment
The embodiment provides a system of patrolling and examining, and the system of patrolling and examining that this embodiment provided can improve temperature regulation precision.
For the sake of brief description, the first embodiment may be referred to where this embodiment is not mentioned.
In this embodiment, the inspection system includes an inspection robot and the temperature control device 100 provided in the first embodiment, where the inspection robot includes a body and a plurality of devices, the master control unit 130 is installed on the body, and the plurality of slave control units 180 are set in one-to-one correspondence with the plurality of devices.
Note that, the inspection apparatus in the first embodiment is an inspection robot in this embodiment, and the components in the first embodiment are apparatuses in this embodiment.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.