CN110716391B - Large size substrate exposure machine - Google Patents
Large size substrate exposure machine Download PDFInfo
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- CN110716391B CN110716391B CN201810757869.9A CN201810757869A CN110716391B CN 110716391 B CN110716391 B CN 110716391B CN 201810757869 A CN201810757869 A CN 201810757869A CN 110716391 B CN110716391 B CN 110716391B
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- 239000000758 substrate Substances 0.000 title claims abstract description 116
- 238000005286 illumination Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 238000005259 measurement Methods 0.000 claims description 85
- 230000000670 limiting effect Effects 0.000 claims description 73
- 230000033001 locomotion Effects 0.000 claims description 56
- 239000000919 ceramic Substances 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 13
- 230000035939 shock Effects 0.000 claims description 7
- 239000006096 absorbing agent Substances 0.000 claims description 6
- 230000005684 electric field Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 230000009897 systematic effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a large-size substrate exposure machine which comprises an exposure system, a measuring system, a moving table system, an illumination system, a mask transmission system, an outer frame, a core exposure measuring frame, an inner support frame and a position adjusting assembly, wherein the illumination system and the mask transmission system are arranged on the outer frame, the core exposure measuring frame is arranged on the inner side of the outer frame and is provided with the exposure system and the measuring system, the inner support frame is arranged between the outer frame and the core exposure measuring frame and is provided with the moving table system, the position adjusting assembly is respectively connected with the core exposure measuring frame and the inner support frame, and the position adjusting assembly is configured to be capable of generating structural deformation in the same direction as the offset deformation direction of the inner support frame when the inner support frame moves along with the moving table system, and the relative position of the moving table system and the exposure system is adjusted to be unchanged. The large-size substrate exposure machine can improve the exposure precision of the large-size substrate.
Description
Technical Field
The invention relates to the technical field of photoetching, in particular to a large-size substrate exposure machine.
Background
The size of the glass substrate in the traditional photoetching machine is smaller, and the moving quality of the workpiece table is smaller, so that the deformation influence of the movement of the workpiece table on the whole machine of the exposure machine is smaller. However, as the photolithography machine progresses to a larger generation, the size of the glass substrate is continuously increased, so that the moving quality of the stage is also greatly increased. Meanwhile, as equipment evolves toward larger generations, productivity requires that the motion speed of the motion stage must be fast. When the large-tonnage workpiece table moves rapidly in a large range, the relative positions of an exposure system and a measuring system interface supported on the main body frame can change due to limited rigidity of the interface, so that the relative positions of a projection objective and a mask table can change, a large system error is caused, and the exposure imaging quality is seriously affected. Therefore, there is an urgent need to provide an exposure machine capable of being quickly stabilized to meet the exposure requirement of a large-sized substrate.
Disclosure of Invention
The invention aims to provide a large-size substrate exposure machine which can meet the exposure requirement of a large-size substrate and ensure the exposure precision of the large-size substrate.
To achieve the purpose, the invention adopts the following technical scheme:
A large-size substrate exposure machine comprises an exposure system, a measurement system, a motion platform system, an illumination system and a mask transmission system, and further comprises:
An outer frame mounted with an illumination system and a mask transfer system;
the core exposure measurement frame is arranged on the inner side of the outer frame and is provided with an exposure system and a measurement system;
An inner support frame disposed between the outer frame and the core exposure measurement frame and connected to the core exposure frame, equipped with a motion stage system, and
And the position adjusting assembly is respectively connected with the core exposure measuring frame and the internal supporting frame, and is configured to be capable of generating structural deformation in the same direction as the offset deformation direction of the internal supporting frame when the internal supporting frame moves along with the motion stage system to generate offset deformation, so that the relative positions of the motion stage system and the exposure system are adjusted to be unchanged.
In one embodiment, the position adjusting assembly at least comprises a first connecting piece, a second connecting piece and a third connecting piece, wherein the first connecting piece, the second connecting piece and the third connecting piece comprise a rigid piece and a piezoelectric ceramic piece, the rigid piece is provided with a mounting groove and a plurality of adjusting holes, the piezoelectric ceramic piece is arranged in the mounting groove, and the adjusting holes are arranged adjacent to the mounting groove.
In one embodiment, the first connector, the second connector and the third connector are arranged in a triangle.
In one embodiment, the position adjustment assembly further comprises:
The first locking piece comprises a connecting bolt and a first limiting piece, one end of the connecting bolt is provided with a screw cap, the other end of the connecting bolt penetrates through the core exposure measurement frame to be connected with the rigid piece of the first connecting piece, the upper surface of the rigid piece of the first connecting piece is provided with a limiting plane, one end of the first limiting piece is abutted with the limiting plane, and the other end of the first limiting piece is abutted with the core exposure measurement frame;
the second locking piece comprises a connecting bolt and a second limiting piece, one end of the connecting bolt is provided with a screw cap, the other end of the connecting bolt penetrates through the core exposure measurement frame to be connected with the rigid piece of the second connecting piece, the upper surface of the rigid piece of the second connecting piece is provided with a spherical limiting groove, one end of the second limiting piece is inserted into the spherical limiting groove, and the other end of the second limiting piece is abutted with the core exposure measurement frame;
The third locking piece comprises a connecting bolt and a third limiting piece, wherein a nut is arranged at one end of the connecting bolt, the other end of the connecting bolt penetrates through the core exposure measurement frame to be connected with the rigid piece of the third connecting piece, a V-shaped limiting groove is formed in the upper surface of the rigid piece of the third connecting piece, one end of the third limiting piece is inserted into the V-shaped limiting groove, and the other end of the third limiting piece is abutted to the core exposure measurement frame.
In one embodiment, the first stop is a flat stop.
In one embodiment, the second and third stoppers are ball stoppers.
In one embodiment, the first locking member, the second locking member and the third locking member each further comprise a flexible member sleeved on the connecting bolt and disposed between the core exposure measurement frame and the nut.
In one embodiment, the first locking member, the second locking member and the third locking member each further comprise a spacer, and the spacer is sleeved on the connecting bolt and is arranged between the flexible member and the connecting bolt.
In one embodiment, the first, second and third connectors each have a different structural stiffness.
In one embodiment, the core exposure measurement frame includes a measurement substrate, a mask stage interferometer support and a workpiece stage interferometer support, the measurement substrate being connected to the internal support frame by a position adjustment assembly, the mask stage interferometer support being disposed above the measurement substrate, the workpiece stage interferometer support being connected below the measurement substrate.
In one embodiment, the internal support frame includes a mask table support, a main substrate, which is connected to the measurement substrate through a position adjustment assembly, a support leg, and a hanger frame, which is connected to the lower portion of the main substrate through the support leg, and the mask table support is disposed above the main substrate.
In one embodiment, the outer frame includes a first upright, a second upright, a top support, and a mask transfer support, the first upright and the second upright being disposed on opposite sides of the inner support frame, the top support being connected to the first upright and the second upright, respectively, the illumination system being disposed on the top support, the mask transfer support being disposed adjacent to the first upright or the second upright, the mask transfer system being disposed on the mask transfer support.
In one embodiment, the large-size substrate exposure machine further comprises a damper, wherein the damper is arranged between the inner support frame and the ground, and the damper is arranged at the center position of the zero long-stroke movement direction of the movement table system and/or the plurality of dampers are arranged in a central symmetry manner by taking the center position of the zero long-stroke movement direction of the movement table system as a symmetry center.
The large-size substrate exposure machine divides the frame structure into a core exposure measuring frame, an inner supporting frame and an outer frame from inside to outside. Wherein the core exposure measurement frame is mounted with an exposure system and a measurement system, the inner support frame is mounted with a motion stage system, and a position adjustment assembly is provided between the core exposure measurement frame and the inner support frame. When the internal support frame moves along with the motion platform system to generate offset deformation, the position adjusting component can generate structural deformation in the same direction as the offset deformation direction of the internal support frame, the relative positions of the motion platform system and the exposure system are adjusted to be unchanged, the core exposure measurement frame and the internal support frame are rapidly aligned in the motion process of the motion platform system, the relative positions of the motion platform system and the exposure system are ensured to be accurate, thereby avoiding systematic errors caused by static deformation of a frame interface and improving the exposure precision of a large-size substrate. In addition, the large-size substrate exposure machine is characterized in that an illumination system, a mask transmission system and the like are arranged on an external frame and are fully isolated from high-precision required components such as imaging, measuring and positioning, so that the influence of weight on compensation measurement of the whole machine system can be avoided, and the exposure precision of the large-size substrate is further ensured.
Drawings
FIG. 1 is a schematic diagram of a large-size substrate exposure machine in one embodiment;
FIG. 2 is a top view of a measurement substrate in one embodiment;
FIG. 3 is a side view of the measurement substrate shown in FIG. 2;
FIG. 4 is a schematic view of the structure of the first connector in one embodiment;
FIG. 5 is a schematic diagram of the structure of a second connector in one embodiment;
FIG. 6 is a schematic structural view of a third connector in one embodiment;
FIG. 7 is a schematic view of a portion of a shock absorbing system coupled to an internal support frame in one embodiment;
FIG. 8 is a schematic layout of a shock absorbing system in one embodiment;
FIG. 9 is a schematic layout of a shock absorbing system in yet another embodiment.
Reference numerals illustrate:
101-measuring a substrate, 102-a mask stage interferometer support, 103-a workpiece stage interferometer support;
201-a first connecting piece, 202-a second connecting piece, 203-a third connecting piece, 204-a rigid piece, 205-a piezoelectric ceramic piece, 206-a mounting groove, 207-an adjusting hole, 208-a spherical limit groove, 209-a V-shaped limit groove and 2041-a limit plane;
301-mask stage support, 302-main substrate, 303-support legs and 304-hanging frame;
401-a damper;
501-left mask stage, 502-left mask stage interferometer, 503-right mask stage interferometer, 504-right mask stage, 505-left lens, 506-right lens, 507-off-axis alignment system, 508-leveling focusing system, 509-workpiece stage interferometer, 510-workpiece stage;
601-first upright, 602-second upright, 603-top support, 604-mask transfer support;
701-left illumination, 702-right illumination, 703-mask transfer system, 704-control cabinet, 705-environmental cabinet;
801-first locking member, 802-second locking member, 803-third locking member, 804-connecting bolt, 805-first spacing member, 806-second spacing member, 807-third spacing member, 808-flexible member, 809-spacer.
Detailed Description
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The invention provides a large-size substrate exposure machine, which is used for improving the exposure precision of a large-size substrate. Referring to fig. 1, the large-sized substrate exposing apparatus of one embodiment includes an exposing system, a measuring system, a motion stage system, an illumination system and mask transfer system 703, an outer frame, a core exposure measuring frame, an inner support frame, and a position adjusting assembly. The outer frame mounts an illumination system and a mask transfer system 703. The core exposure measurement frame is arranged on the inner side of the outer frame, and is provided with an exposure system and a measurement system. The inner support frame is arranged between the outer frame and the core exposure measurement frame, is connected with the core exposure frame, and is provided with a motion stage system. The position adjusting component is respectively connected with the core exposure measuring frame and the internal supporting frame, and is configured to enable structural deformation to occur in the same direction as the offset deformation direction of the internal supporting frame when the internal supporting frame is offset deformed along with the movement of the moving table system, so that the relative positions of the moving table system and the exposure system are adjusted to be unchanged.
Specifically, as shown in fig. 1, the exposure system includes a left mask stage interferometer 502, a right mask stage interferometer 503, a left lens 505, a right lens 506, and a stage interferometer 509. The measurement system includes an off-axis alignment system 507 and a leveling focusing system 508. In one embodiment, the core exposure measurement frame includes a measurement substrate 101, a mask stage interferometer support 102, and a workpiece stage interferometer support 103, the measurement substrate 101 is connected to the internal support frame by a position adjustment assembly, and a left lens 505, a right lens 506, an off-axis alignment system 507, and a leveling focus system 508 are all disposed on the measurement substrate 101. The mask stage interferometer holder 102 is disposed above the measurement substrate 101, and the left mask stage interferometer 502 and the right mask stage interferometer 503 are disposed on the mask stage interferometer holder 102. The stage interferometer holder 103 is connected below the measurement substrate 101, and a stage interferometer 509 is mounted on the stage interferometer holder 103.
Further, the motion stage system includes a left mask stage 501, a right mask stage 504, and a workpiece stage 510. In one embodiment, the internal support frame includes a mask stage holder 301, a main substrate 302, support legs 303, and a hanger frame 304, the main substrate 302 being connected to the measurement substrate 101 by a position adjustment assembly, the mask stage holder 301 being disposed above the main substrate 302, the hanger frame 304 being connected to the underside of the main substrate 302 by the support legs 303. Specifically, as shown in fig. 1, the mask stage holder 301 is located above the measurement substrate 101, the left mask stage 501 and the right mask stage 504 are both disposed on the mask stage holder 301, and the left mask stage 501 is located on the left side of the left mask stage interferometer 502, and the right mask stage 504 is located on the right side of the right mask stage interferometer 503. The hanger 304 is disposed below the measurement substrate 101, the work stage 510 is disposed on the hanger 304, and the work stage 510 is disposed adjacent to the work stage interferometer 509.
In one embodiment, the lighting system includes left lighting 701 and right lighting 702. The outer frame includes first stand 601, second stand 602, top support 603 and mask transmission support 604, and first stand 601 and second stand 602 set up in inside braced frame both sides respectively, and top support 603 is connected with first stand 601 and second stand 602 respectively, and left illumination 701 and right illumination 702 all set up on top support 603, mask transmission support 604 and first stand 601 or second stand 602 adjacent setting, and mask transmission system 703 sets up on mask transmission support 604.
Further, in one embodiment, the large-sized substrate exposure machine further includes a control cabinet 704 and an environmental cabinet 705, where the control cabinet 704 and the environmental cabinet 705 are located outside the external frame and are independently placed, so as to avoid that the vibration of the control cabinet 704 and the environmental cabinet 705 affects the substrate exposure accuracy.
As shown in fig. 2-4, in one embodiment, the position adjustment assembly includes at least a first connector 201, a second connector 202, and a third connector 203. In this embodiment, the first connection member 201, the second connection member 202 and the third connection member 203 are arranged in a triangle shape, so that the relative position adjustment between the measurement substrate 101 and the main substrate 302 can be ensured to be stable and reliable, and the substrate exposure accuracy can be ensured. Further, in one embodiment, the first, second and third connectors 201, 202 and 203 are arranged in an isosceles triangle or equilateral triangle.
Specifically, as shown in fig. 4, in one embodiment, the first connecting member 201 includes a rigid member 204 and a piezoelectric ceramic plate 205, where the rigid member 204 is provided with a mounting groove 206 and a plurality of adjustment holes 207, and the piezoelectric ceramic plate 205 is disposed in the mounting groove 206, and the plurality of adjustment holes 207 are disposed adjacent to the mounting groove 206. In this embodiment, the adjusting hole 207 is formed in the rigid member 204, and the piezoelectric ceramic piece 205 is disposed in the rigid member 204, and the aperture of the adjusting hole 207 is controlled to be increased or decreased by extending or shortening the piezoelectric ceramic piece 205, so that the rigid member 204 is integrally extended or shortened, and micro-adjustment of the relative positions of the measurement substrate 101 and the main substrate 302 is realized. Specifically, when the rigid member 204 needs to be elongated, an electric field is applied to the piezoelectric ceramic sheet 205, so that the piezoelectric ceramic sheet 205 is elongated, the piezoelectric ceramic sheet 205 is elongated in the polarization direction, and the aperture of the adjustment hole 207 is enlarged, so that the rigid member 204 is elongated, whereas when the rigid member 204 needs to be shortened, a reverse electric field is applied to the piezoelectric ceramic sheet 205, the piezoelectric ceramic sheet 205 is shortened in the polarization direction, so that the aperture of the adjustment hole 207 is reduced, and the whole rigid member 204 is shortened. Further, as shown in fig. 4, the end of the adjusting hole 207 is provided with a process hole, so that the process hole can avoid the integral fracture of the rigid member 204 caused by the fact that the adjusting hole 207 penetrates through the rigid member 204, and the stable and reliable structure of the rigid member 204 is ensured.
In one embodiment, as shown in fig. 5 and 6, the second connecting member 202 and the third connecting member 203 also each include a rigid member 204 and a piezoelectric ceramic plate 205, where the rigid member 204 is provided with a mounting slot 206 and a plurality of adjustment holes 207, and the piezoelectric ceramic plate 205 is disposed in the mounting slot 206, and the plurality of adjustment holes 207 are disposed adjacent to the mounting slot 206. The working principles of the second connector 202 and the third connector 203 are the same as those of the first connector 201, and will not be described herein.
Specifically, during the movement of the table 510, the relative position between the measurement substrate 101 and the main substrate 302 is adjusted by the position adjustment assembly, in which when the table 510 moves leftward, the internal support frame is deformed statically, the left side of the main substrate 302 is low, and the right side is high, at this time, an electric field is applied to the piezoelectric ceramic sheet of the second connector 202 to shorten the piezoelectric ceramic sheet of the second connector 202, the whole of the rigid member 204 of the second connector 202 is shortened, and simultaneously, a reverse electric field is applied to the piezoelectric ceramic sheet of the third connector 203 to elongate the piezoelectric ceramic sheet of the third connector 203 and the whole of the rigid member 204 of the third connector 203, and correspondingly, the piezoelectric ceramic sheet of the first connector 201 is adjusted according to the deformation amount, so that the whole of the measurement substrate 101 is deflected leftward, and the left side and the right side of the measurement substrate 101 are low, and the deformation of the same as the main substrate 302, so that the relative position between the measurement substrate 101 and the main substrate 302 is unchanged. Conversely, when the workbench 510 moves to the right, the piezoelectric ceramic piece of the second connecting piece 202 is adjusted to extend, so that the rigid piece 204 of the second connecting piece 202 extends integrally, meanwhile, the piezoelectric ceramic piece of the third connecting piece 203 is adjusted to shorten, so that the rigid piece 204 of the third connecting piece 203 shortens integrally, the piezoelectric ceramic piece of the first connecting piece 201 is correspondingly adjusted according to the deformation amount, so that the rigid piece 204 of the first connecting piece 201 extends or shortens, the measuring substrate 101 deviates to the right along with the main substrate 302, and the relative position of the measuring substrate 101 along with the main substrate 302 is ensured to be unchanged. In this embodiment, the deformation of the piezoelectric ceramic sheet is controlled to change the structures of the rigid member 204 of the first connecting member 201, the rigid member 204 of the second connecting member 202, and the rigid member 204 of the third connecting member 203, so as to adjust the relative positions of the measurement substrate 101 and the main substrate 302, and keep the relative positions of the measurement substrate 101 and the main substrate 302 unchanged all the time during the movement of the workbench 510, thereby ensuring the exposure precision of the substrate, avoiding the influence of large-tonnage rapid movement of the workbench on the exposure precision, and improving the exposure precision of the large-size substrate.
Further, in one embodiment, the position adjustment assembly further comprises a position detection sensor and a controller. Specifically, the position detection sensor and the piezoelectric ceramic plates are connected to the controller, the position detection sensor is disposed on the main substrate 302, and is configured to detect a position of the main substrate 302 and send the detected position information of the main substrate 302 to the controller, the controller calculates a deformation amount of the main substrate 302 according to the position information of the main substrate 302, and controls the piezoelectric ceramic plates of each connecting piece to apply different electric fields according to the deformation amount of the main substrate 302, so as to control each piezoelectric ceramic plate to adjust a relative position of the measurement substrate 101 and the main substrate 302. Specifically, the position detection sensor may employ a photoelectric sensor, and the controller may be integrated in a control system of the exposure machine, and the embodiment is not particularly limited.
In one embodiment, the position adjusting assembly further comprises a first locking member 801, wherein the first locking member 801 comprises a connecting bolt 804 and a first limiting member 805, the connecting bolt 804 penetrates through the core exposure measuring frame, one end of the connecting bolt is fixed on the core exposure measuring frame through a nut, the other end of the connecting bolt is connected with the rigid member 204 of the first connecting member 201 through the first limiting member 805, a limiting plane 2041 is arranged on the upper surface of the rigid member 204 of the first connecting member 201, one end of the first limiting member 805 is abutted against the limiting plane 2041, and the other end of the first limiting member 805 is abutted against the core exposure measuring frame. Specifically, the connecting bolt 804 passes through the measurement substrate 101 and the first limiting member 805 to be connected with the rigid member 204 of the first connecting member 201, one end of the first limiting member 805 abuts against the limiting plane 2041, and the other end of the first limiting member 805 abuts against the measurement substrate 101.
The second locking member 802 comprises a connecting bolt 804 and a second limiting member 806, wherein the connecting bolt 804 penetrates through the core exposure measurement frame, one end of the connecting bolt 804 is fixed on the core exposure measurement frame through a nut, the other end of the connecting bolt is connected with the rigid member 204 of the second connecting member 202 through the second limiting member 806, the upper surface of the rigid member 204 of the second connecting member 202 is provided with a spherical limiting groove 208, one end of the second limiting member 806 is inserted into the spherical limiting groove 208, and the other end of the second limiting member is abutted against the core exposure measurement frame. Specifically, the connecting bolt 804 passes through the measuring substrate 101 and the second limiting member 806 to be connected with the rigid member 204 of the second connecting member 202, one end of the second limiting member 806 is inserted into the spherical limiting groove 208, and the other end of the second limiting member 806 abuts against the measuring substrate 101.
The third locking piece 803 comprises a connecting bolt 804 and a third limiting piece 807, wherein the connecting bolt 804 penetrates through the core exposure measurement frame, one end of the connecting bolt 804 is fixed on the core exposure measurement frame through a nut, the other end of the connecting bolt 807 is connected with the rigid piece 204 of the third connecting piece 203 through the third limiting piece 807, a V-shaped limiting groove 209 is formed in the upper surface of the rigid piece 204 of the third connecting piece 203, one end of the third limiting piece 807 is inserted into the V-shaped limiting groove 209, and the other end of the third limiting piece 807 is abutted against the core exposure measurement frame. Specifically, the connecting bolt 804 passes through the measurement substrate 101 and the third stopper 807 to be connected to the rigid member 204 of the third connector 203, one end of the third stopper 807 is inserted into the V-shaped stopper groove 209, and the other end of the third stopper 807 abuts against the measurement substrate 101.
In one embodiment, the first stop 805 is a flat stop, and the second stop 806 and the third stop 807 are ball stops. Specifically, as shown in fig. 2, the geometric center of the measurement substrate 101 is taken as an origin, the horizontal left direction is the positive X-axis direction, the direction in which the horizontal direction extends to the second connection member 202 and the third connection member 203 is the positive Y-axis direction, and the vertical upward direction is the positive Z-axis direction, and a coordinate system is established. The flat plate limiting piece and the limiting plane 2041 can limit the Z-direction freedom degree of the first connecting piece 201, the second limiting piece 806 is a ball limiting piece, the ball limiting piece is inserted into the spherical limiting groove 208 on the surface of the rigid piece 204 of the second connecting piece 202 and can limit the freedom degree of the second connecting piece 202 in the X, Y and Z directions, the third limiting piece 807 is a ball limiting piece, the ball limiting piece is inserted into the V-shaped limiting groove 209 on the surface of the rigid piece 204 of the third connecting piece 203 and can limit the freedom degree of the third connecting piece in the X and Z directions, the three connecting pieces are combined together to limit the Rx, ry and Rz freedom degrees together, six-freedom-degree decoupling is achieved, and therefore the first connecting piece 201, the second connecting piece 202 and the third connecting piece 203 cannot be loose or offset in the moving process of the workpiece table 510, and the stable and reliable installation of the first connecting piece 201, the second connecting piece 202 and the third connecting piece 203 is ensured, and the exposure precision is further ensured.
In one embodiment, the first locking member 801, the second locking member 802, and the third locking member 803 each further include a flexible member 808, and the flexible member 808 is sleeved on the connection bolt 804 and disposed between the core exposure measurement frame and the nut. Specifically, the flexible member 808 is disposed between the measurement substrate 101 and the nut, so that the flexible member 808 can avoid abrasion of components caused by direct hard connection of the measurement substrate 101 and the nut, which is beneficial to prolonging the service lives of the measurement substrate 101 and the connecting bolt 804 and improving the connection stability of the measurement substrate 101 and the connecting bolt 804. Specifically, the flexible member 808 is made of a flexible metal.
In one embodiment, the first locking member 801, the second locking member 802, and the third locking member 803 each further include a spacer 809, where the spacer 809 is sleeved on the connecting bolt 804 and disposed between the flexible member 808 and the connecting bolt 804, to ensure that the flexible member 808 is uniformly stressed.
In one embodiment, the structural rigidity of the first, second and third connectors 201, 202, 203 are all different. Specifically, the setting positions of the three connectors are different, and the stress of each connector is different, so, in order to ensure the rigidity design, the structural rigidity of the first connector 201, the second connector 202 and the third connector 203 are different, and the structural rigidity of the first connector 201, the second connector 202 and the third connector 203 may be specifically set according to the actual stress situation, which is not specifically limited in this embodiment. In one embodiment, the rigid member 204 of the first connection member 201, the rigid member 204 of the second connection member 202, and the rigid member 204 of the third connection member 203 may be made of hard metal or cemented carbide.
In one embodiment, the large-sized substrate exposure machine further comprises a damper 401, wherein the damper 401 is arranged between the inner support frame and the ground, and the damper 401 is arranged at the center position of the zero long-stroke movement direction of the motion table system and/or the plurality of dampers 401 are arranged in a central symmetry manner with the center position of the zero long-stroke movement direction of the motion table system as a symmetry center.
Specifically, in the damper layout, the more reasonably the dampers 401 are distributed, the less the overall machine internal support frame is affected by the movement of the workpiece table 510, i.e., the less the overall machine internal support frame is deformed, and thus the less the exposure performance of the objective lens is affected. The damper 401 should be positioned at a node point where static deformation is sensitive so that the relative deformation of the rail in the extreme position relative to the zero position of the workpiece table 510 is minimized. Due to the influence of factors such as the space size of the environmental return air channel and the difficulty in controlling the vibration reduction system, in the embodiment, the vibration absorbers 401 are arranged at the center position of the zero long-stroke movement direction of the moving table system, and/or the vibration absorbers 401 are arranged in a central symmetry manner with the center position of the zero long-stroke movement direction of the moving table system as a symmetry center. As shown in fig. 7 and 8, in one embodiment, the large-sized substrate exposure machine includes seven dampers 401, one damper 401 is disposed at the center position of the zero-position long-stroke movement direction of the motion stage system, and the other six dampers 401 are symmetrically disposed at both sides of the center position of the zero-position long-stroke movement direction of the motion stage system in groups of three. As further shown in fig. 9, in still another embodiment, the large-size substrate exposure machine includes eight vibration dampers 401, two vibration dampers 401 are symmetrically disposed on both sides of the center position of the zero long-stroke movement direction of the motion stage system along the center line of the zero long-stroke movement direction of the motion stage system, and six vibration dampers 401 are symmetrically disposed on both sides of the center line of the zero long-stroke movement direction of the motion stage system in groups of three.
The large-size substrate exposure machine divides the frame structure into a core exposure measuring frame, an inner supporting frame and an outer frame from inside to outside. Wherein the core exposure measurement frame is mounted with an exposure system and a measurement system, the inner support frame is mounted with a motion stage system, and a position adjustment assembly is provided between the core exposure measurement frame and the inner support frame. When the internal support frame moves along with the motion platform system to generate offset deformation, the position adjusting component can generate structural deformation in the same direction as the offset deformation direction of the internal support frame, the relative positions of the motion platform system and the exposure system are adjusted to be unchanged, the core exposure measurement frame and the internal support frame are rapidly aligned in the motion process of the motion platform system, the relative positions of the motion platform system and the exposure system are ensured to be accurate, thereby avoiding systematic errors caused by static deformation of a frame interface and improving the exposure precision of a large-size substrate. In addition, the large-size substrate exposure machine is provided with the illumination system, the mask transmission system 703 and the like on the external frame, is fully isolated from high-precision required components such as imaging, measuring and positioning, can avoid the influence of weight on compensation measurement of the whole machine system, and further ensures the exposure precision of the large-size substrate.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (10)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810757869.9A CN110716391B (en) | 2018-07-11 | 2018-07-11 | Large size substrate exposure machine |
| TW108124545A TWI702479B (en) | 2018-07-11 | 2019-07-11 | Exposure machine |
| PCT/CN2019/095542 WO2020011222A1 (en) | 2018-07-11 | 2019-07-11 | Exposure machine |
| KR1020217004236A KR102537339B1 (en) | 2018-07-11 | 2019-07-11 | exposure machine |
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| CN201810757869.9A CN110716391B (en) | 2018-07-11 | 2018-07-11 | Large size substrate exposure machine |
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| CN110716391A CN110716391A (en) | 2020-01-21 |
| CN110716391B true CN110716391B (en) | 2025-02-11 |
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| KR (1) | KR102537339B1 (en) |
| CN (1) | CN110716391B (en) |
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| CN112635366B (en) * | 2020-12-24 | 2024-03-12 | 江苏汇成光电有限公司 | UV machine wafer iron frame positioner |
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| CN208351246U (en) * | 2018-07-11 | 2019-01-08 | 上海微电子装备（集团）股份有限公司 | Large-size substrate exposure machine |
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| JP3193586B2 (en) * | 1995-04-21 | 2001-07-30 | キヤノン株式会社 | Semiconductor exposure equipment |
| JP3825921B2 (en) * | 1998-07-23 | 2006-09-27 | キヤノン株式会社 | Scanning exposure apparatus and device manufacturing method |
| US7049585B2 (en) * | 2000-07-27 | 2006-05-23 | Ebara Corporation | Sheet beam-type testing apparatus |
| US7275925B2 (en) * | 2001-08-30 | 2007-10-02 | Micron Technology, Inc. | Apparatus for stereolithographic processing of components and assemblies |
| JP2005311165A (en) * | 2004-04-23 | 2005-11-04 | Canon Inc | Active mount and exposure apparatus |
| US8482716B2 (en) * | 2004-06-10 | 2013-07-09 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
| NL1036511A1 (en) * | 2008-02-13 | 2009-08-14 | Asml Netherlands Bv | Movable support, position control system, lithographic apparatus and method of controlling a position or an exchangeable object. |
| US8817236B2 (en) * | 2008-05-13 | 2014-08-26 | Nikon Corporation | Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method |
| WO2010098474A1 (en) * | 2009-02-27 | 2010-09-02 | 株式会社 ニコン | Optical element holding device, optical system, exposure apapratus, device manufacturing method, and interchange method for optical element |
| CN102243440B (en) * | 2010-05-10 | 2014-11-12 | 上海微电子装备有限公司 | Lithography machine for monitoring positional precision of wafer stage |
| CN102608879A (en) * | 2011-01-24 | 2012-07-25 | 上海华虹Nec电子有限公司 | Method for aligning exposure in engineering photoetching by photoetching machine |
| CN102736431B (en) * | 2011-04-08 | 2015-08-26 | 上海微电子装备有限公司 | A kind of measurement mechanism and measuring method thereof measuring motion precision of motion bench |
| CN102323720B (en) * | 2011-08-03 | 2013-03-27 | 河北工业大学 | Flexible micro-positioning platform based on driving of piezoelectric ceramics |
| JP6150043B2 (en) * | 2012-03-29 | 2017-06-21 | 株式会社ブイ・テクノロジー | Exposure equipment |
| WO2013160082A1 (en) * | 2012-04-27 | 2013-10-31 | Asml Netherlands B.V. | Lithographic apparatus |
| CN103901733B (en) * | 2012-12-28 | 2017-02-22 | 上海微电子装备有限公司 | Exposure device |
| CN104678711B (en) * | 2013-11-26 | 2017-06-27 | 上海微电子装备有限公司 | Sports table reaction force offset device |
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| CN208351246U (en) * | 2018-07-11 | 2019-01-08 | 上海微电子装备（集团）股份有限公司 | Large-size substrate exposure machine |
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| Publication number | Publication date |
|---|---|
| KR20210034018A (en) | 2021-03-29 |
| KR102537339B1 (en) | 2023-05-26 |
| TWI702479B (en) | 2020-08-21 |
| CN110716391A (en) | 2020-01-21 |
| WO2020011222A1 (en) | 2020-01-16 |
| TW202006483A (en) | 2020-02-01 |
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