CN110716071A - High-frequency probe card device and its crimping module and support - Google Patents

Abstract

The invention discloses a high-frequency probe card device, a crimping module and a support piece thereof. The stroke structure can move integrally relative to the positioning structure, and the stroke structure comprises a bracket and a plurality of conductive elastic pieces. The bracket is provided with a plurality of positioning slots penetrating through the bracket, and the bracket can be movably arranged on the positioning structure, and the surface of the bracket far away from the positioning structure defines a bearing surface. The conductive elastic pieces are respectively arranged in the positioning slot holes, and each conductive elastic piece is provided with a first end and a second end which are positioned on opposite sides. The first end of each conductive elastic element corresponds to the bearing surface, and the second end of each conductive elastic element penetrates out of the bracket. Therefore, the stroke structure can integrally move relative to the positioning structure, so that the displacement strokes of the detection lugs are the same, and a relatively accurate detection result is obtained.

Description

High-frequency probe card device and its crimping module and support

technical field

The invention relates to a high-frequency probe card, in particular to a high-frequency probe card device, a crimping module and a supporting member thereof.

Background technique

The existing high-frequency probe card includes a plunger, a flexible circuit board partially disposed on the end face of the plunger, and a plurality of detection bumps fixed on the flexible circuit board. Wherein, each of the detection bumps has no elasticity, and the detection bumps are used for abutting and electrically coupled to an object to be tested, and transmitting corresponding signals through the flexible circuit board.

However, since the plunger is of a single-piece structure, when the multiple detection bumps of the existing probe card are abutting against the object to be tested, the plunger is easily subjected to force and is deflected, so that the The above-mentioned plurality of detection bumps generate different displacement strokes, thereby affecting the detection results of the current probe card.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

SUMMARY OF THE INVENTION

The embodiment of the present invention is to provide a high-frequency probe card device, a crimping module and a support member thereof, which can effectively improve the defects that may occur in the existing high-frequency probe card.

The embodiment of the present invention discloses a high-frequency probe card device, which includes a support member, a transmission layer, a plurality of detection bumps and a circuit board. The support member includes a positioning structure and a stroke structure, the positioning structure is used to be arranged on a bearing member; a stroke structure is movably arranged on the positioning structure, and the stroke structure includes a bracket and a plurality of conductive elastic members, A plurality of through-shaped positioning slot holes are formed inside the bracket, and the bracket is movably arranged on the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; a plurality of conductive elastic members, are respectively arranged in a plurality of the positioning slot holes, and each of the conductive elastic members has a first end and a second end located on opposite sides; wherein, the first end of each conductive elastic member corresponds to on the bearing surface, and the second end of each of the conductive elastic members passes through the bracket and is used to abut the bearing member; a transmission layer is at least partially disposed on the bearing surface, and abutting against the first end of each of the conductive elastic members; a plurality of detection bumps disposed on the transmission layer, and the plurality of detection bumps and the support member are respectively located on the transmission layer opposite sides; a circuit board electrically connected to one of the detection bumps of the plurality of detection bumps, and the circuit board includes a first board surface and a second board surface on opposite sides a board surface, and the second board surface of the circuit board is used to electrically couple to a testing machine; wherein, the travel structure can move relative to the positioning structure as a whole, so that a plurality of the testing The displacement strokes of the bumps are the same.

Preferably, the circuit board is formed with an accommodating hole penetrating the first board surface and the second board surface, and a part of the support member is located in the accommodating hole; the support member further includes There is a connecting plate, and the positioning structure is arranged on the connecting plate.

Preferably, the circuit board and the corresponding detection bump are electrically coupled to each other through the support member; the connection board is connected to the second surface of the circuit board, and the connection The board includes a metal pad electrically coupled to the circuit board, and the first end of one of the conductive elastic members of the plurality of conductive elastic members abuts against the transmission layer and is electrically coupled The detection bump corresponding to the circuit board, and the second end of the detection bump abuts against the metal pad.

Preferably, the circuit board and the corresponding detection bumps are electrically coupled to each other only through the transmission layer, and the transmission layer includes a first block, a second block and a connection area piece. a first block is arranged on the bearing surface, and a plurality of the detection bumps are arranged on the first block; a second block is connected to the second board surface of the circuit board; A connecting block is located between the first block and the second block, and a part of the connecting block is located in the accommodating hole.

Preferably, the transmission layer includes a circuit matching unit disposed on the connection block, and the circuit matching unit is adjacent to the first block, and is electrically coupled to the circuit board and corresponds to of the detection bump.

Preferably, the transmission layer is completely disposed on the bearing surface, and the circuit board and the corresponding detection bump are electrically coupled to each other through the transmission layer and the support member.

Preferably, the transmission layer and the circuit board are located on opposite sides of the support member, respectively, and the circuit board includes a circuit board located on the first board surface and electrically coupled to the second board surface a metal pad; the positioning structure is disposed on the first surface of the circuit board, and the first end of one of the conductive elastic members abuts against the transmission layer And it is electrically coupled to the detection bump corresponding to the circuit board, and the second end of the detection bump abuts against the metal pad.

The embodiment of the present invention also discloses a crimping module of a high-frequency probe card device, which includes a support member, a transmission layer, and a plurality of detection bumps. The support member includes a positioning structure and a stroke structure; the stroke structure is movably arranged on the positioning structure, and the stroke structure includes: a bracket and a plurality of conductive elastic parts, and a plurality of through-shaped positioning members are formed inside the bracket a slot hole, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; a plurality of conductive elastic parts are respectively arranged in the positioning slot holes , and each of the conductive elastic members has a first end and a second end located on opposite sides; wherein, the first end of each conductive elastic member corresponds to the bearing surface, and each the second end of the conductive elastic piece passes through the bracket; a transmission layer is at least partially disposed on the bearing surface and abuts against the first end of each of the conductive elastic pieces; a plurality of The detection bumps are arranged on the transmission layer, and a plurality of the detection bumps and the support members are respectively located on opposite sides of the transmission layer; wherein, the stroke structure can be positioned relative to the whole as a whole The structure is moved so that the displacement strokes of the plurality of detection bumps are the same.

Preferably, the transmission layer is completely disposed on the bearing surface, and the first end of one of the conductive elastic members of the plurality of conductive elastic members abuts against the transmission layer and is electrically coupled to the transmission layer. One of the plurality of detection bumps has the second end abutted against a metal pad.

The embodiment of the present invention further discloses a support member of a high-frequency probe card device, which includes a positioning structure and a stroke structure. A stroke structure is movably disposed on the positioning structure, and the stroke structure can move relative to the positioning structure as a whole. The stroke structure includes a bracket and a plurality of conductive elastic members. a plurality of positioning slot holes, and the bracket is movably arranged on the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; a plurality of conductive elastic parts are respectively arranged on the plurality of the a positioning slot, and each of the conductive elastic members has a first end and a second end located on opposite sides; wherein, the first end of each conductive elastic member corresponds to the bearing surface, and The second end of each of the conductive elastic members protrudes out of the bracket.

To sum up, the high-frequency probe card device, the crimping module and the support member disclosed in the embodiments of the present invention are provided with a positioning structure and a stroke structure that cooperate with each other, so that the stroke structure can be integrally relative to the stroke structure. The positioning structure moves, so that the displacement strokes of the plurality of detection bumps located above the support member are approximately the same, so that the high-frequency probe card device can have relatively accurate detection results.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

Description of drawings

FIG. 1 is a schematic plan view of a high-frequency probe card device according to Embodiment 1 of the present invention.

FIG. 2 is a schematic plan view of a high-frequency probe card device according to Embodiment 2 of the present invention.

FIG. 3 is a schematic plan view of a high-frequency probe card device according to Embodiment 3 of the present invention.

FIG. 4 is a schematic plan view of a high-frequency probe card device according to Embodiment 4 of the present invention.

FIG. 5 is a schematic plan view of a high-frequency probe card device according to Embodiment 5 of the present invention.

Detailed ways

Please refer to FIG. 1 , which is an embodiment of the present invention. It should be noted that this embodiment corresponds to the relevant numbers and appearances mentioned in the accompanying drawings, which are only used to specifically describe the embodiments of the present invention, so as to facilitate understanding The content of the present invention is not intended to limit the protection scope of the present invention.

[Example 1]

As shown in FIG. 1 , it is the first embodiment of the present invention. This embodiment discloses a high-frequency probe card device 100, which can be used to test an object to be tested (not shown, such as a semiconductor wafer). It should be noted that, in order to facilitate the understanding of this embodiment, the accompanying drawings are illustrated by a partial plan view of the above-mentioned high-frequency probe card device 100 .

The high-frequency probe card device 100 includes a support member 1 , a transmission layer 2 disposed on the support member 1 , a plurality of detection bumps 3 disposed on the transmission layer 2 , the positions corresponding to the support member 1 . A circuit board 4 of the component 1 and a coaxial cable 5 disposed on the transmission layer 2 and the circuit board 4 . The structure of each component of the high-frequency probe card device 100 will be introduced separately below, and the connection relationship between the components of the high-frequency probe card device 100 will be described in a timely manner.

It should be noted that the above-mentioned transmission layer 2 , the plurality of detection bumps 3 , the circuit board 4 and the coaxial cable 5 can also be collectively defined as a signal transmission module in this embodiment. The signal transmission module is matched with the support member 1 for illustration, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the signal transmission module may also be used alone (eg, sold) or used in conjunction with other components.

The support member 1 includes a connecting plate 11 , a positioning structure 12 disposed on the connecting plate 11 (equivalent to a carrier), and a stroke structure 13 movably disposed on the positioning structure 12 . Wherein, the stroke structure 13 can move relative to the positioning structure 12 as a whole, so that the displacement strokes of the plurality of detection bumps 3 located above the support member 1 are substantially the same.

The connecting plate 11 is preferably a bendable flexible plate, but the embodiment is not limited thereto. The connection board 11 includes a conductive line 111, a metal pad 112 and a metal contact 113 respectively connected to both ends of the conductive line 111, and the metal pad 112 and the metal contact 113 are located on the same side of the connection board 11 (eg, FIG. 1 ). In other words, the metal pads 112 and the metal contacts 113 are electrically connected to each other through the above-mentioned conductive lines 111 .

In this embodiment, the positioning structure 12 includes a plurality of guide pins 121 fixed on the connecting plate 11 at intervals, and the plurality of guide pins 121 are fixed on the connecting plate 11 where the metal pads 112 are provided. However, the metal pad 112 is preferably not completely covered by the plurality of guide pins 121 .

The travel structure 13 is electrically coupled to the metal pad 112 of the connecting plate 11 , and the surface of the travel structure 13 away from the positioning structure 12 (eg, the top surface of the travel structure 13 in FIG. 1 ) is defined as a bearing surface 1311 , The above-mentioned bearing surface 1311 is connected to the transmission layer 2 . In this embodiment, the travel structure 13 includes a bracket 131 movably disposed in the positioning structure 12 and a plurality of conductive elastic members 132 disposed in the bracket 131 flexibly.

In more detail, the surface of the bracket 131 away from the positioning structure 12 (eg, the top surface of the bracket 131 in FIG. 1 ) is defined as the bearing surface 1311 , and the surface of the bracket 131 adjacent to the positioning structure 12 (eg, FIG. 1 ) is defined as the bearing surface 1311 . The bottom surface of the bracket 131 in 1) is concavely formed with a plurality of track grooves 1312.

Wherein, the bracket 131 is respectively assembled with the guide pins 121 of the positioning structure 12 by a plurality of rail grooves 1312, so that the bracket 131 can be positioned relative to the positioning structure 12 through the cooperation of the plurality of rail grooves 1312 and the guide pins 121. The structure 12 only moves along a height direction H (eg, the distance direction between the top surface and the bottom surface of the bracket 131 in FIG. 1 ); however, the matching method between the bracket 131 and the positioning structure 12 can also be adjusted according to design requirements. Variations are not limited to those contained in this example. For example, in other embodiments not shown in the present invention, the positioning structure 12 may include a plurality of rail grooves, and the bracket 131 may be formed with a plurality of rail grooves respectively assembled to the above-mentioned plurality of rail grooves. guide pin.

Furthermore, the bracket 131 is internally formed with a plurality of positioning slots 1313 (in the above-mentioned height direction H) penetrating through, and a plurality of conductive elastic members 132 are respectively disposed in the plurality of positioning slots 1313 of the bracket 131 . Wherein, each conductive elastic member 132 has a first end 1321 and a second end 1322 located on opposite sides, and the position of the first end 1321 of the conductive elastic member 132 corresponds to (or is adjacent to) the bearing surface 1311 of the bracket 131 , The second end 1322 of the conductive elastic member 132 penetrates (the bottom surface of) the bracket 131 and abuts against the connecting plate 11 . In this embodiment, the second end 1322 of one of the conductive elastic members 132 is abutted against the metal pad 112 of the connection board 11 so as to be electrically connected to each other.

It should be noted that the conductive elastic member 132 is described as a pogo-pin in this embodiment, but the specific structure of the conductive elastic member 132 can also be determined according to the needs of the designer in practical application. Adjustment changes are not limited to those contained in this embodiment.

In this embodiment, the transmission layer 2 is completely disposed on the bearing surface 1311 of the above-mentioned support member 1, and the transmission layer 2 has a multi-layer stack structure, while the transmission layer 2 in this embodiment is a bottom layer 21 and stacked on the A top layer 22 on the bottom layer 21 is illustrated. The bottom layer 21 is disposed on the bearing surface 1311 of the support member 1 and abuts against the first ends 1321 of the plurality of conductive elastic members 132 , and the transmission layer 2 is provided with a plurality of contacts 221 in the top layer 22 thereof. , and one of the contacts 221 extends to the bottom layer 21 to be in contact with the conductive elastic member 132 abutting against the metal pad 112 .

The plurality of detection bumps 3 are respectively disposed on the plurality of contact points 221 of the transmission layer 2 , that is, the plurality of detection bumps 3 and the support member 1 are respectively located on opposite sides of the transmission layer 2 . In this embodiment, the detection bumps 3 preferably have no elasticity, and the detection bumps 3 are used for detachably abutting against the object to be tested (not shown, such as a semiconductor wafer).

The circuit board 4 includes a first board surface 41 and a second board surface 42 on opposite sides, and the circuit board 4 is formed with a first board surface 41 and the second board surface 42 extending through the first board surface 41 and the second board surface 42 . An accommodating hole 43 and a connecting hole 44 . Wherein, the thickness of the circuit board 4 is preferably not greater than the thickness of the support member 1, and the diameter of the above-mentioned accommodating hole 43 corresponds to (eg slightly larger than) the width of the support member 1, and the diameter of the connection hole 44 corresponds to (eg: slightly larger than) the width of the coaxial cable 5 . The accommodating hole 43 is located approximately at the center of the circuit board 4, and the connecting hole 44 is located on one side of the accommodating hole 43. The number of the accommodating holes 44 can be adjusted (eg, increased) according to the test requirements. not limited to those contained in the accompanying drawings.

More specifically, the circuit board 4 is provided with a machine contact electrically coupled to each other on one side of the second board surface 42 (eg, the right side of the second board surface 42 in FIG. 1 ). 421 and a transmission contact 422 , and the second surface 42 of the circuit board 4 is electrically coupled to a testing machine (not shown) through the machine contact 421 .

Furthermore, a part of the support member 1 (eg, at least a part of the positioning structure 12 and the stroke structure 13 ) is located in the accommodating hole 43 of the circuit board 4 , and the transmission contact 422 of the circuit board 4 is connected to the support member 1 . The metal contacts 113 of the connecting plate 11 are connected to the second surface 42 of the circuit board 4 ; that is, the metal pads 112 of the connecting plate 11 can be electrically coupled to the metal contacts 113 through the conductive lines 111 Connected to the above circuit board 4 . Accordingly, the circuit board 4 can be electrically coupled to one of the plurality of detection bumps 3 through the transmission layer 2 and the support member 1 (the connecting plate 11 and the conductive elastic member 132 electrically coupled thereto) The detection bump 3' (ie, the detection bump 3' electrically coupled to the metal pad 112).

In other words, the first end 1321 of one of the conductive elastic members 132 of the plurality of conductive elastic members 132 abuts against the transmission layer 2 and is electrically coupled to the detection bump 3 ′ corresponding to the circuit board 4 , and The second end 1322 extends out of the bracket 131 and abuts against the metal pad 112 of the connecting plate 11 .

The coaxial cable 5 includes a core wire 5a, an insulating layer (not shown) in which the core wire 5a is embedded, and a net surrounding the core wire 5a and wrapped outside the insulating layer. Mesh shielding layer 5b and a plastic envelope (not shown) covering the mesh shielding layer 5b. When the coaxial cable 5 is changed to the connection relationship with other components, the coaxial cable 5 includes a passing section 51 and a buried end located on opposite sides of the passing section 51 Segment 52 and a circumscribed end segment 53 .

Wherein, the through section 51 of the coaxial cable 5 is located in the connection hole 44 of the circuit board 4, and the embedded end section 52 is embedded and fixed in the transmission layer 2 (between the bottom layer 21 and the top layer 22), and The portion of the core wire 5a located in the embedded end section 52 is electrically coupled to one of the detection bumps 3 ″ of the plurality of detection bumps 3 . The external end section 53 penetrates through the second surface of the circuit board 4 42 is used to be electrically coupled to the testing machine. In this embodiment, the coaxial cable 5 is electrically connected to the core wire 5a and the mesh shielding layer 5b located in the embedded end section 52 respectively. Two of the detection bumps 3" are coupled to the plurality of detection bumps 3; that is, the core wire 5a and the mesh shielding layer 5b are electrically coupled to different detection bumps 3" respectively. , and the detection bump 3 ″ to which the core wire 5 a and the mesh shielding layer 5 b are electrically coupled is also different from the detection bump 3 ′ that is electrically coupled to the circuit board 4 .

Accordingly, the detection bump 3" electrically coupled to the core wire 5a can directly transmit the detected signal to the testing machine through the coaxial cable 5, thereby having a better transmission effect. The core wire 5a and the corresponding detection bump 3" are preferably used for transmitting a high frequency signal in this embodiment.

Further, the above-mentioned external end section 53 may be provided with a coaxial connector, so as to be able to be inserted into a testing machine to achieve electrical coupling, the length direction of the embedded end section 52 and the length of the through section 51 Preferably, the directions include an angle between 80 degrees and 100 degrees. Furthermore, the high-frequency probe card device 100 in this embodiment preferably does not need to be provided with any capacitors or inductors, but the present invention is not limited thereto.

[Example 2]

As shown in FIG. 2 , which is the second embodiment of the present invention, this embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned first embodiment. The difference mainly lies in the structure of the transmission layer 2 and the support member 1 .

The circuit board 4 and the corresponding detection bumps 3 ′ are electrically coupled to each other only through the transmission layer 2 in this embodiment; There is no electrical connection, and the plurality of conductive elastic members 132 are only used to provide the elastic force required for the support member 1 to move back and forth, but are not used for signal transmission. Furthermore, the connecting plate 11 is only used as a carrier for the positioning structure 12 , but is not provided with the conductive lines 111 , metal pads 112 , and metal contacts 113 for electrical transmission.

More specifically, the transport layer 2 includes a first block 2a, a second block 2b, and a connection area between the first block 2a and the second block 2b in this embodiment The block 2c and a circuit matching unit 2d disposed in the connection block 2c. Wherein, the first block 2a is completely disposed on the bearing surface 1311 of the support member 1, and a plurality of detection bumps 3 are disposed on the first block 2a; that is, the first block 2a It is equivalent to the transmission layer 2 of the first embodiment, and the connection block 2c and the second block 2b are formed by integrally extending the top layer 22 of the first block 2a toward the outside.

A part of the connection block 2c is located in the accommodating hole 43 of the circuit board 4 and is located between the support member 1 and the wall of the accommodating hole 43 of the circuit board 4 . A through hole 21c is formed in the connection block 2c, and the through hole 21c is located outside the accommodating hole 43 and adjacent to the first block 2a, so that the coaxial cable 5 can pass through the connection block 2c. Perforation 21c.

The second block 2b is connected to the second surface 42 (eg, metal contacts 113 ) of the circuit board 4 , and the transmission layer 2 in this embodiment extends from the first block 2a to the second region At least one transmission line 23 of the block 2b, and the detection bump 3' corresponding to the circuit board 4 is disposed on the transmission line 23, so that the circuit board 4 and its corresponding detection bump 3' can pass through the transmission line of the transmission layer 2 23 to achieve electrical coupling.

Furthermore, the circuit matching unit 2d (eg, a capacitor or/and an inductor) is mounted on the transmission layer 2 on the connection block 2c and adjacent to the first block 2a. The circuit matching unit 2d is electrically coupled to the circuit board 4 and the corresponding detection bumps 3', so as to adjust the characteristic impedance through the circuit matching unit 2d, thereby achieving the effect of impedance matching.

[Example 3]

As shown in FIG. 3 , which is the third embodiment of the present invention, this embodiment is similar to the above-mentioned second embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned second embodiment. The main difference is that the high-frequency probe card device 100 of this embodiment does not include the coaxial cable 5 and its corresponding structures (eg, the connection hole 44 , the through hole 21 c , and the contact point 221 ).

More specifically, the transmission line 23 on the transmission layer 2 is a patterned transmission structure, and the plurality of detection bumps 3 are all disposed on the transmission line 23, so that all the detection bumps 3 in this embodiment can only be used Electrical coupling is achieved with the circuit board 4 through the transmission layer 2 . That is to say, the plurality of detection bumps 3 in this embodiment are all detection bumps 3' electrically coupled to the circuit board 4 . It should be noted that, the plurality of detection bumps 3' can be patterned through the transmission line 23, so that the plurality of detection bumps 3 are electrically coupled to the circuit board 4 independently.

Furthermore, there is no electrical connection between the transmission layer 2 and the conductive elastic members 132, and the plurality of conductive elastic members 132 are only used to provide the elastic force required for the support member 1 to move back and forth, but Not used as a signal transmission.

[Example 4]

As shown in FIG. 4 , which is the fourth embodiment of the present invention, this embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned first embodiment. The difference mainly lies in: the circuit board 4 and the corresponding relationship between the circuit board 4 and the support member 1 , and the support member 1 in this embodiment does not include the above-mentioned connecting board 11 .

In this embodiment, the circuit board 4 includes at least one metal pad 411 located on the first board surface 41 and electrically coupled to the second board surface 42 . The number of the metal pads 411 in this embodiment is multiple, and the circuit board 4 is also provided with a plurality of transmission contacts 422 electrically coupled to the machine contacts 421 on the second board surface 42 , and the above-mentioned multiple metal pads 411 The plurality of transmission contacts 422 are respectively electrically coupled to the second board surface 42 .

Furthermore, the transmission layer 2 and the circuit board 4 are respectively located on opposite sides of the support member 1 , and the circuit board 4 and the corresponding detection bumps 3 ′ are electrically coupled to each other through the transmission layer 2 and the support member 1 . catch. The positioning structure 12 of the support member 1 is disposed on the first surface 41 of the circuit board 4 and adjacent to the plurality of metal pads 411 , and the travel structure 13 is movably disposed on the positioning structure 12 , And electrically coupled to the plurality of metal pads 411, so that the travel structure 13 can move relative to the positioning structure 12 as a whole, so that the plurality of detection bumps 3 can move synchronously and the displacement stroke is approximately same.

More specifically, the first ends 1321 of the plurality of conductive elastic members 132 abut against the transmission layer 2 and are electrically coupled to the detection bumps 3 ′ corresponding to the circuit board 4 , and the plurality of conductive elastic members The second ends 1322 of the 132 pass through the bracket 131 and abut against the plurality of metal pads 411 respectively.

[Example 5]

As shown in FIG. 5 , which is the fifth embodiment of the present invention, this embodiment is similar to the above-mentioned fourth embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the fourth embodiment above. The difference mainly lies in the structure of the circuit board 4 .

The circuit board 4 further includes a build-up structure 45 , and the build-up structure 45 is located at a part of the circuit board 4 away from the second board surface 42 (eg, on the top of the circuit board 4 ), and the build-up structure 45 is outside. The surface is defined as the above-mentioned first board surface 41 . The above-mentioned plurality of metal pads 411 are arranged on the build-up structure 45 , and the positioning structure 12 of the support member 1 is also arranged on the build-up structure 45 of the circuit board 4 . In addition, the build-up structure 45 is described as being located on the top of the circuit board 4 in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the circuit board 5 may further be provided with a build-up structure 45 at the bottom thereof.

[Technical effects of the embodiments of the present invention]

To sum up, in the high-frequency probe card device 100 and the signal transmission module thereof disclosed in the embodiments of the present invention, the coaxial cable 5 is arranged and fixed through the transmission layer 2 and the circuit board 4, so that the coaxial cable The detection bumps 3, 3', 3" to which the core wire 5a of the wire 5 is electrically coupled can directly transmit the detected signal (eg, high-frequency signal) to the testing machine through the coaxial cable 5 station, so as to have a better transmission effect.

Furthermore, the high-frequency probe card device 100 disclosed in the embodiment of the present invention can provide the support member 1 including the positioning structure 12 and the stroke structure 13, so that the stroke structure 13 can move relative to the positioning structure 12 as a whole. , and the displacement strokes of the plurality of detection bumps 3 , 3 ′, 3 ″ located above the support member 1 are approximately the same, so that the high-frequency probe card device 100 can have relatively accurate detection results.

The above descriptions are only preferred and feasible embodiments of the present invention, and are not intended to limit the protection scope of the present invention. All equivalent changes and modifications made according to the patent scope of the present invention shall fall within the protection scope of the claims of the present invention.

Claims (10)

1. A high-frequency probe card device, wherein the high-frequency probe card device comprises: a support, comprising; a positioning structure, used for setting on a carrier; A stroke structure is movably arranged on the positioning structure, and the stroke structure includes: a bracket with a plurality of positioning slot holes formed therein, and the bracket is movably arranged on the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and A plurality of conductive elastic pieces are respectively disposed in the plurality of positioning slots, and each of the conductive elastic pieces has a first end and a second end located on opposite sides; wherein, the the first end corresponds to the bearing surface, and the second end of each of the conductive elastic members penetrates the bracket and is used for abutting the bearing member; a transmission layer, at least partially disposed on the bearing surface and abutting against the first end of each of the conductive elastic members; a plurality of detection bumps disposed on the transmission layer, and a plurality of the detection bumps and the support member are respectively located on opposite sides of the transmission layer; and A circuit board is electrically connected to one of the detection bumps of the plurality of detection bumps, and the circuit board includes a first board surface and a second board surface located on opposite sides, and the the second surface of the circuit board is used for electrically coupling to a testing machine; Wherein, the stroke structure can move relative to the positioning structure as a whole, so that the displacement strokes of the plurality of detection bumps are the same. 2 . The high-frequency probe card device according to claim 1 , wherein the circuit board is formed with an accommodating hole penetrating the first board surface and the second board surface, and the support A part of the component is located in the accommodating hole; the supporting component further includes a connecting plate, and the positioning structure is arranged on the connecting plate. 3 . The high-frequency probe card device according to claim 2 , wherein the circuit board and the corresponding detection bump are electrically coupled to each other through the support member; the connection board is connected to on the second surface of the circuit board, and the connection board includes a metal pad electrically coupled to the circuit board, and one of the conductive elastic members of the plurality of conductive elastic members is The first end abuts on the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end abuts on the metal pad. 4. The high-frequency probe card device according to claim 2, wherein the circuit board and the corresponding detection bump are electrically coupled to each other only through the transmission layer, and the transmission Layers contain: a first block, disposed on the bearing surface, and a plurality of the detection bumps are disposed on the first block; a second block connected to the second surface of the circuit board; A connecting block is located between the first block and the second block, and a part of the connecting block is located in the accommodating hole. 5 . The high-frequency probe card device according to claim 4 , wherein the transmission layer includes a circuit matching unit disposed in the connection block, and the circuit matching unit is adjacent to the first A block is electrically coupled to the circuit board and the corresponding detection bump. 6 . The high-frequency probe card device according to claim 1 , wherein the transmission layer is completely disposed on the bearing surface, and the circuit board and the corresponding detection bump pass through the The transmission layer and the support member are electrically coupled to each other. 7. The high-frequency probe card device according to claim 6, wherein the transmission layer and the circuit board are respectively located on opposite sides of the support member, and the circuit board includes a The first board surface is electrically coupled to a metal pad of the second board surface; the positioning structure is disposed on the first board surface of the circuit board, and one of the plurality of conductive elastic members is The first end of the conductive elastic element abuts against the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end of the conductive elastic element abuts against the metal pad . 8. A crimping module of a high-frequency probe card device, wherein the crimping module comprises: a support, comprising; a positioning structure; A stroke structure is movably arranged on the positioning structure, and the stroke structure includes: a bracket with a plurality of positioning slot holes formed therein, and the bracket is movably arranged on the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and A plurality of conductive elastic pieces are respectively disposed in the plurality of positioning slots, and each of the conductive elastic pieces has a first end and a second end located on opposite sides; wherein, the the first end corresponds to the bearing surface, and the second end of each of the conductive elastic members protrudes out of the bracket; a transmission layer at least partially disposed on the bearing surface and abutting against the first end of each of the conductive elastic members; and a plurality of detection bumps, disposed on the transmission layer, and the plurality of detection bumps and the support member are respectively located on opposite sides of the transmission layer; Wherein, the stroke structure can move relative to the positioning structure as a whole, so that the displacement strokes of the plurality of detection bumps are the same. 9 . The crimping module of a high-frequency probe card device according to claim 8 , wherein the transmission layer is completely disposed on the bearing surface, and one of the plurality of conductive elastic members is conductive. 10 . The first end of the elastic element is in contact with the transmission layer and is electrically coupled to one of the detection bumps, and the second end of the elastic element is used for abutting on a detection bump. metal pad. 10. A support for a high-frequency probe card device, wherein the support comprises: a positioning structure; and A stroke structure is movably arranged on the positioning structure, and the stroke structure can move relative to the positioning structure as a whole, and the stroke structure includes: a bracket, with a plurality of positioning slot holes formed therein, and the bracket is movably arranged on the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and A plurality of conductive elastic pieces are respectively disposed in the plurality of positioning slots, and each of the conductive elastic pieces has a first end and a second end located on opposite sides; wherein, the The first end corresponds to the bearing surface, and the second end of each of the conductive elastic members protrudes out of the bracket.

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