CN110708085A

CN110708085A - Terminal device and method for manufacturing the same

Info

Publication number: CN110708085A
Application number: CN201910858542.5A
Authority: CN
Inventors: 张诗豪; 雷高兵; 苏天杰
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-09-11
Filing date: 2019-09-11
Publication date: 2020-01-17
Also published as: WO2021047409A1

Abstract

The application provides a terminal device and a manufacturing method thereof, wherein the terminal device comprises: a circuit board, a housing and an elevated plate; the shell with the board of elevating is all fixed on the circuit board, the board of elevating is located the shell with between the circuit board, the board of elevating with form first cavity between the circuit board, first cavity is semi-enclosed construction or totally enclosed structure, the board of elevating with form the second cavity between the shell, the second cavity is used for placing the SIM card. The space occupied by the SIM card seat assembly in the terminal equipment can be fully utilized, and the partial space occupied by the SIM card seat assembly in the terminal equipment is released.

Description

Terminal device and method for manufacturing the same

Technical Field

The present application relates to the field of communications, and in particular, to a terminal device and a method for manufacturing the same.

Background

Nowadays, a terminal device is an indispensable necessity in daily life as a tool facilitating people to communicate, and with the improvement of living standard of consumers, the requirements on the terminal device from performance to appearance are higher and higher, and under the condition, the light and thin terminal device is popular, and under the condition of the same hardware configuration, the appearance of the terminal device is beautiful, and the size is small, so that the favor of the consumers is increased. A fixing structure of a Subscriber Identity Module (SIM) card socket component, which is an important component in a terminal device with a separated machine and a card, is also a place of interest for many developers.

Due to the trend of light, thin and small terminal equipment, the SIM card seat assembly with the structure occupies more layout area of the circuit board, is not beneficial to the full utilization of the internal space of the mobile phone, and becomes a key obstacle for restricting the terminal equipment from further making small.

Disclosure of Invention

The application provides a terminal equipment and manufacturing method thereof, raise traditional cassette through the board of elevating, form first cavity between board of elevating and the circuit board, on the unchangeable basis of the area of the shared circuit board of present SIM card seat subassembly like this, put into more devices in first cavity, make the shared space of SIM card seat subassembly obtain make full use of, the space of saving through the board of elevating, it is enough important to fill for terminal equipment, can reduce terminal equipment's thickness, realize terminal equipment miniaturization and ultra-thinness.

In a first aspect, a terminal device is provided, which includes: the circuit board, shell and elevating plate are all fixed on the circuit board, and elevating plate is located between shell and the circuit board, forms first cavity between elevating plate and the circuit board, and first cavity is semi-enclosed structure or totally enclosed structure, forms the second cavity between elevating plate and the shell, and the second cavity is used for placing the SIM card.

Like this, through set up the board of elevating between circuit board and shell, can form first cavity between circuit board and the board of elevating, through arrange the device in first cavity, can release the inside partial space of terminal equipment that occupies of SIM card seat subassembly with the space make full use of the shared circuit board of SIM card seat subassembly.

With reference to the first aspect, in certain implementation manners of the first aspect, the terminal device further includes a card socket and a metal elastic sheet, where the card socket and the metal elastic sheet are located in the second cavity, the metal elastic sheet is fixed on the card socket, the metal elastic sheet is directly or indirectly electrically connected with the circuit board, and the card socket and the metal elastic sheet are used to fix the SIM card. Therefore, the card seat and the metal elastic sheet are arranged in the second cavity, so that better stability and better electric connection can be provided for the externally inserted SIM card.

With reference to the first aspect, in certain implementations of the first aspect, the terminal device further includes a card socket located in the second cavity, the card socket being provided with at least one metal contact, and the at least one metal contact is electrically connected to the circuit board directly or indirectly. Therefore, the metal elastic sheet structure is reduced, and the structure of the SIM card can be further simplified while good stability and electric connection are provided for the SIM card.

With reference to the first aspect, in certain implementations of the first aspect, the cartridge is fixed to a surface of the elevated plate within the second cavity, or the cartridge is fixed to a surface of the housing opposite the surface of the elevated plate. Therefore, the position of the clamping seat can be flexibly set according to design and actual requirements.

With reference to the first aspect, in certain implementations of the first aspect, the elevated plate includes three sides or four sides, and the three sides or four sides are fixed on the circuit board. Therefore, the structure of the first cavity can be changed according to design and actual requirements, so that the first cavity is of a fully-closed structure or a semi-closed structure.

With reference to the first aspect, in certain implementations of the first aspect, the material of the elevated plate is metal. Therefore, the elevated plate is made of metal materials, and when the electronic device is arranged in the first cavity, the electromagnetic interference of an external electric signal to the device in the first cavity can be effectively reduced.

With reference to the first aspect, in certain implementations of the first aspect, an electronic device is disposed within the first cavity, and the electronic device is electrically connected to the circuit board directly or indirectly. Therefore, the electronic device can be arranged in the first cavity, the space of the circuit board occupied by the SIM card seat assembly is effectively utilized, and the partial space of the SIM card seat assembly, which occupies the interior of the terminal equipment, is released.

With reference to the first aspect, in certain implementations of the first aspect, the electronic device is at least one of a capacitor, an inductor, or a resistor. Therefore, partial space of the SIM card seat assembly occupying the interior of the terminal equipment can be released, the electronic device can be placed in the released space, the layout space of the circuit board is saved, and the electronic device can also be a switch, a duplexer and the like used for a radio frequency circuit or a decoding chip used for a baseband circuit and the like.

With reference to the first aspect, in certain implementations of the first aspect, an embedded SIM card is disposed within the first cavity, and the embedded SIM card is electrically connected to the circuit board directly or indirectly. Therefore, the embedded SIM card can be arranged in the first cavity, the space of the circuit board occupied by the SIM card seat assembly is effectively utilized, the partial space of the SIM card seat assembly, which occupies the interior of the terminal equipment, is released, and more space is saved for the circuit board.

With reference to the first aspect, in some implementations of the first aspect, the SIM card is a third-generation SIM card or a fourth-generation SIM card. Therefore, the terminal equipment can support different types of SIM cards, and meanwhile, the used SIM card can be a third-generation SIM card or a fourth-generation SIM card, so that the occupied area is smaller, and more space can be saved for the circuit board.

In a second aspect, there is provided a manufacturing method of a terminal device, the manufacturing method being capable of manufacturing any one of the terminal devices of the first aspect, the manufacturing method including: the elevating plate is fixed on the circuit board, a first cavity is formed between the elevating plate and the circuit board, the first cavity is of a semi-closed structure or a fully-closed structure, the shell is fixed on the circuit board at the same side of the elevating plate, the shell is located above the elevating plate, a second cavity is formed between the elevating plate and the shell, and the second cavity is used for placing an SIM card.

With reference to the second aspect, in some implementations of the second aspect, the manufacturing method further includes fixing the card socket and the metal dome in the second cavity, where the metal dome is fixed on the card socket and electrically connected to the circuit board directly or indirectly, and the card socket and the metal dome are used to fix the SIM card. Therefore, the card seat and the metal elastic sheet are arranged in the second cavity, so that better stability and better electric connection can be provided for the externally inserted SIM card.

With reference to the second aspect, in certain implementations of the second aspect, the manufacturing method further includes fixing a socket within the second cavity, the socket being provided with at least one metal contact, the at least one metal contact being electrically connected to the circuit board directly or indirectly. Therefore, the metal elastic sheet structure is reduced, and the structure of the SIM card can be further simplified while good stability and electric connection are provided for the SIM card.

With reference to the second aspect, in certain implementations of the second aspect, the cartridge is fixed to a surface of the elevated plate within the second cavity, or the cartridge is fixed to a surface of the housing opposite the surface of the elevated plate. Therefore, the position of the clamping seat can be flexibly set according to design and actual requirements.

With reference to the second aspect, in some implementations of the second aspect, the elevated plate includes three sides or four sides, and the three sides or four sides are fixed on the circuit board. Therefore, the structure of the first cavity can be changed according to design and actual requirements, so that the first cavity is of a fully-closed structure or a semi-closed structure.

With reference to the second aspect, in certain implementations of the second aspect, the material of the elevated plate is metal. Therefore, the elevated plate is made of metal materials, and when the electronic device is arranged in the first cavity, the electromagnetic interference of an external electric signal to the device in the first cavity can be effectively reduced.

With reference to the second aspect, in certain implementations of the second aspect, an electronic device is disposed within the first cavity, and the electronic device is electrically connected to the circuit board directly or indirectly. Therefore, the electronic device can be arranged in the first cavity, the space of the circuit board occupied by the SIM card seat assembly is effectively utilized, and the partial space of the SIM card seat assembly, which occupies the interior of the terminal equipment, is released.

With reference to the second aspect, in certain implementations of the second aspect, the electronic device is at least one of a capacitor, an inductor, or a resistor. Therefore, partial space of the SIM card seat assembly occupying the interior of the terminal equipment can be released, the electronic device can be placed in the released space, the layout space of the circuit board is saved, and the electronic device can also be a switch, a duplexer and the like used for a radio frequency circuit or a decoding chip used for a baseband circuit and the like.

With reference to the second aspect, in some implementations of the second aspect, an embedded SIM card is disposed within the first cavity, and the embedded SIM card is electrically connected to the circuit board directly or indirectly. Therefore, the embedded SIM card can be arranged in the first cavity, the space of the circuit board occupied by the SIM card seat assembly is effectively utilized, the partial space of the SIM card seat assembly, which occupies the interior of the terminal equipment, is released, and more space is saved for the circuit board.

With reference to the second aspect, in some implementations of the second aspect, the SIM card is a third generation SIM card or a fourth generation SIM card. Therefore, the terminal equipment can support different types of SIM cards, and meanwhile, the used SIM card can be a third-generation SIM card or a fourth-generation SIM card, so that the occupied area is smaller, and more space can be saved for the circuit board.

In a third aspect, a SIM card holder assembly is provided, which is used for a terminal device, and includes: the shell and the elevating plate are fixed on a circuit board of the terminal equipment, the elevating plate is located between the shell and the circuit board, a first cavity is formed between the elevating plate and the circuit board, the first cavity is of a semi-closed structure or a fully-closed structure, a second cavity is formed between the elevating plate and the shell, and the second cavity is used for placing an SIM card.

With reference to the third aspect, in some implementations of the third aspect, the SIM card holder assembly further includes a card holder and a metal elastic piece, where the card holder and the metal elastic piece are located in the second cavity, the metal elastic piece is fixed on the card holder and electrically connected to the circuit board directly or indirectly, and the card holder and the metal elastic piece are used to fix the SIM card. Therefore, the card seat and the metal elastic sheet are arranged in the second cavity, so that better stability and better electric connection can be provided for the externally inserted SIM card.

With reference to the third aspect, in certain implementations of the third aspect, the SIM card holder assembly further includes a card holder, the card holder being located in the second cavity, the card holder being provided with at least one metal contact, the at least one metal contact being electrically connected to the circuit board directly or indirectly. Therefore, the metal elastic sheet structure is reduced, and the structure of the SIM card can be further simplified while good stability and electric connection are provided for the SIM card.

With reference to the third aspect, in certain implementations of the third aspect, the cartridge is fixed to a surface of the elevated plate within the second cavity, or the cartridge is fixed to a surface of the housing opposite the surface of the elevated plate. Therefore, the position of the clamping seat can be flexibly set according to design and actual requirements.

With reference to the third aspect, in some implementations of the third aspect, the elevated plate includes three sides or four sides, and the three sides or four sides are fixed on the circuit board. Therefore, the structure of the first cavity can be changed according to design and actual requirements, so that the first cavity is of a fully-closed structure or a semi-closed structure.

With reference to the third aspect, in certain implementations of the third aspect, the material of the elevated plate is metal. Therefore, the elevated plate is made of metal materials, and when the electronic device is arranged in the first cavity, the electromagnetic interference of an external electric signal to the device in the first cavity can be effectively reduced.

With reference to the third aspect, in certain implementations of the third aspect, an electronic device is disposed within the first cavity, and the electronic device is electrically connected to the circuit board directly or indirectly. Therefore, the electronic device can be arranged in the first cavity, the space of the circuit board occupied by the SIM card seat assembly is effectively utilized, and the partial space of the SIM card seat assembly, which occupies the interior of the terminal equipment, is released.

With reference to the third aspect, in certain implementations of the third aspect, the electronic device is at least one of a capacitor, an inductor, or a resistor. Therefore, partial space of the SIM card seat assembly occupying the interior of the terminal equipment can be released, the electronic device can be placed in the released space, the layout space of the circuit board is saved, and the electronic device can also be a switch, a duplexer and the like used for a radio frequency circuit or a decoding chip used for a baseband circuit and the like.

With reference to the third aspect, in certain implementations of the third aspect, an embedded SIM card is disposed within the first cavity, and the embedded SIM card is electrically connected to the circuit board directly or indirectly. Therefore, the embedded SIM card can be arranged in the first cavity, the space of the circuit board occupied by the SIM card seat assembly is effectively utilized, the partial space of the SIM card seat assembly, which occupies the interior of the terminal equipment, is released, and more space is saved for the circuit board.

With reference to the third aspect, in some implementations of the third aspect, the SIM card is a third generation SIM card or a fourth generation SIM card. Therefore, the terminal equipment can support different types of SIM cards, and meanwhile, the used SIM card can be a third-generation SIM card or a fourth-generation SIM card, so that the occupied area is smaller, and more space can be saved for the circuit board.

Like this, can raise traditional cassette through the board of elevating, the first cavity that forms between board and the circuit board of elevating to set up electron device or eSIM card etc. in first cavity, can release the space make full use of the shared circuit board of SIM card seat subassembly, release SIM card seat subassembly and occupy the partial space of terminal equipment inside, also can reduce terminal equipment's thickness, realize terminal equipment miniaturization and ultra-thinness.

Drawings

Fig. 1 is a schematic diagram of a terminal device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a SIM card holder assembly according to an embodiment of the present disclosure.

Fig. 3 is a side cross-sectional view of fig. 2 taken along the direction of insertion of the SIM card.

Fig. 4 is an enlarged schematic view of a detail of fig. 3.

Fig. 5 is a schematic structural diagram of another SIM card holder assembly according to an embodiment of the present disclosure.

Fig. 6 is a side cross-sectional view of fig. 5 taken along the direction of insertion of the SIM card.

Fig. 7 is an enlarged schematic view of a detail of fig. 6.

Fig. 8 is a schematic structural diagram of a terminal device according to an embodiment of the present application.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

The terminal device in the embodiment of the application can be a mobile phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, an intelligent helmet, intelligent glasses and other terminal devices which need to be inserted with an SIM card for communication. The terminal device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, a terminal device in a 5G network, or a terminal device in a Public Land Mobile Network (PLMN) for future evolution, and the like, which are not limited in this embodiment.

Fig. 1 is a schematic diagram of a terminal device 100, and here, the terminal device 100 is described as a mobile phone.

As shown in fig. 1, the terminal device 100 may include a housing and a display screen mounted on the housing. The terminal device 100 further includes electronic components (not shown in the figure) disposed inside the housing, including but not limited to a processor, a camera, a flash, a microphone, a battery, and the like.

The housing may be a metal housing, such as a metal such as magnesium alloy, stainless steel, etc. In addition, the housing may be a plastic housing, a glass housing, a ceramic housing, or the like, but is not limited thereto.

Meanwhile, in order to ensure that the terminal device 100 can access the cellular network, the terminal device may further include an SIM card interface, and the SIM card interface is used for connecting an SIM card. The SIM card can be inserted into or pulled out of the SIM card interface to realize contact and separation with the terminal equipment. The terminal equipment can support 1 or N SIM card interfaces, and N is a positive integer greater than 1. The SIM card interface may support a third generation SIM card (micro-SIM) or a fourth generation SIM card (nano-SIM), etc. Multiple cards can be inserted into the same SIM card interface at the same time. The types of the plurality of cards may be the same or different. The SIM card interface may also be compatible with different types of SIM cards. The SIM card interface may also be compatible with external memory cards. The terminal equipment interacts with the network through the SIM card to realize functions of conversation, data communication and the like. In some embodiments, the terminal device employs an embedded SIM (eSIM) card. The eSIM card can be embedded in the terminal device and cannot be separated from the terminal device.

In some embodiments, in order to implement the method for placing the SIM card, the terminal device 100 may further include a SIM card holder component 110, where the SIM card in this application may be a Nano SIM card, a Micro SIM card, a SIM card, or an eSIM card, or a card with a subscriber identity module that implements the same function in future applications, and the application does not limit the type of the SIM card.

Alternatively, the SIM card holder assembly 110 may be fixed on a circuit board of the terminal device 100, and a card socket of the SIM card holder assembly may be disposed on a housing of the terminal device 100 to facilitate insertion and removal of the SIM card.

It should be understood that, due to different shape designs of different terminal devices and usage requirements of users, the card socket of the SIM card holder assembly 110 of the terminal device can be disposed at any position of the housing according to design or actual requirements, and the SIM card can be inserted into the terminal device through the card socket.

Fig. 2 and 3 are schematic structural views of a SIM card holder assembly, wherein fig. 3 is a cross-sectional view of fig. 2 taken along a direction of inserting a SIM card.

As shown in fig. 2 and 3, the SIM card holder assembly may include a housing 140 and an elevated plate 150.

The housing 140 and the raised plate 150 may be fixed to a circuit board of the terminal device, the fixing manner may be welding, gluing, or fastening, the raised plate 150 may be located between the housing 140 and the circuit board, the bottom of the raised plate 150 may be fixed to the circuit board, a first cavity 160 may be formed between the raised plate 150 and the circuit board, a second cavity 170 may be formed between the raised plate 150 and the housing 140, the second cavity 170 is used for placing a SIM card, and the second cavity 170 may have a card slot for inserting the SIM card.

Optionally, the SIM card holder assembly may further include a card holder 120, and the card holder 120 may be fixed in the second cavity 170, and the material thereof may be plastic. The socket 120 may be provided with at least one metal contact, which is electrically connected to the circuit board directly or indirectly, and the socket 120 may be configured to hold the inserted SIM card with other components of the SIM card socket assembly, such as the housing 140 or the raised plate 150, so that after the SIM card is fixed, the at least one metal contact on the socket 120 may be in contact with the plurality of contacts of the SIM card, which is electrically connected to the circuit board directly or indirectly. Due to the design of the card socket 120, better stability can be provided for the SIM card.

Optionally, the SIM card socket assembly may further include a metal dome 130, and the metal dome 130 may be fixed on the card socket 120 and electrically connected to the circuit board directly or indirectly.

As shown in fig. 4, the card socket 120 may be fixed on the surface of the raised plate 150 in the second cavity 170 by welding, gluing, or fastening, one end of the metal elastic sheet 130 may be fixed on the card socket 120 and electrically connected to the circuit board directly or indirectly, and the other end of the metal elastic sheet 130 may be tilted upward to clamp the SIM card together with the card socket 120 and the housing 140.

Optionally, the metal dome 130 may have a plurality of metal domes 130, and the plurality of metal domes 130 may respectively contact with a plurality of contacts on the SIM card, so as to provide a better electrical connection for the SIM card due to the design of the plurality of metal domes 130.

Alternatively, the housing 140 may be made of a metal material, which may reduce interference of external electrical signals with devices in the first and second cavities, for example, the metal material may be iron, copper, aluminum alloy, magnesium alloy, stainless steel, etc. Due to the fact that the shell 140 is made of the metal material, interference of external electric signals to devices in the first cavity and the second cavity can be avoided.

Alternatively, the bottom of the housing 140 and the raised plate 150 may be fixed to the circuit board by soldering, which may improve the stability of the SIM card holder assembly as a whole.

Alternatively, since the first cavity 160 is a cavity formed between the elevated plate 150 and the circuit board, and the shape of the elevated plate 150 is not limited in this application, the shape of the elevated plate 150 may be determined according to design requirements, and the internal structure of the first cavity 160 may be determined according to the shape of the elevated plate 150.

Optionally, the elevated plate 150 may have four sides, the bottom of the four sides may be fixed on the circuit board, and a fully-enclosed first cavity 160 similar to a rectangular cavity is formed between the elevated plate 150 and the circuit board, so that due to the fully-enclosed design of the first cavity 160, a better shielding environment may be provided for the devices disposed therein.

Optionally, the elevated plate 150 may have three sides, the bottoms of the three sides may be fixed on the circuit board, and a semi-closed first cavity 160 similar to a rectangular cavity is formed between the elevated plate 150 and the circuit board, and due to the semi-closed design of the first cavity 160, a larger placing space may be provided for devices disposed in the first cavity, wherein a part of the devices may be disposed in the first cavity, and another part of the devices may be disposed outside the first cavity.

Alternatively, the elevated plate 150 may be made of a metal material or designed as a shield, and the influence of the electrical signal on the inside of the first cavity 160 may be reduced due to the metal design.

Optionally, an electronic device may be disposed inside the first cavity 160 and electrically connected to the circuit board of the terminal device, so as to fully utilize the area of the circuit board, and meanwhile, the electronic device disposed inside the first cavity is protected by the metal raised plate 150, so that the electronic device can work more stably. For example, the electronic device may be a capacitor, an inductor, or a resistor, and may be one or a combination of several of them, and may also be a switch, a duplexer, or the like for a radio frequency circuit, or a decoding chip for a baseband circuit, and the like, and the application is not limited herein.

Optionally, an eSIM card may be disposed inside the first cavity 160, and electrically connected to a circuit board of the terminal device, so as to fully utilize the area of the circuit board, and meanwhile, the electronic device disposed in the first cavity is protected by the metal raised plate, so that the electronic device can work more stably.

Because the traditional cassette is raised by adopting the elevating plate, a first cavity can be formed between the elevating plate and the circuit board, an electronic device or an eSIM card and the like can be arranged by utilizing the first cavity, the space of the circuit board occupied by the SIM card seat component can be fully utilized, the SIM card seat component is released to occupy the partial space inside the terminal equipment, the thickness of the terminal equipment can be reduced, and the terminal equipment is miniaturized and ultra-thinned.

Fig. 5 and 6 are schematic structural views of another SIM card holder assembly, wherein fig. 6 is a cross-sectional view of fig. 5 taken along a direction of inserting a SIM card.

As shown in fig. 5 and 6, the housing 140 and the elevated plate 150 may be fixed on a circuit board of the terminal device, the fixing manner may be welding, gluing, or fastening, the elevated plate 150 may be located between the housing 140 and the circuit board, the bottom of the elevated plate 150 may be fixed on the circuit board, a first cavity 160 may be formed between the elevated plate 150 and the circuit board, a second cavity 170 may be formed between the elevated plate 150 and the housing 140, the second cavity 170 is used for placing a SIM card, and the second cavity 170 may have a card slot for inserting the SIM card.

Optionally, the SIM card holder assembly may further include a card holder 120, and the card holder 120 may be fixed in the second cavity 170, and the material thereof may be plastic. The socket 120 may be provided with at least one metal contact, and the at least one metal contact is electrically connected to the circuit board directly or indirectly, and the socket 120 may be configured to hold the inserted SIM card with other components in the SIM card socket assembly, for example, the other components may be the housing 140 or the raised plate 150, and after the SIM card is fixed, the at least one metal contact on the socket 120 may be in contact with the plurality of contacts of the SIM card, and electrically connect the plurality of contacts of the SIM card with the circuit board directly or indirectly. Due to the design of the card socket 120, better stability can be provided for the SIM card.

As shown in fig. 7, the card socket 120 may be fixed on the surface of the housing 140 opposite to the surface of the elevated plate 150 in the second cavity 170 by welding, gluing, or fastening, one end of the metal elastic sheet 130 may be fixed on the card socket 120 and electrically connected to the circuit board directly or indirectly, the other end of the metal elastic sheet 130 may be tilted upward and bow-shaped, and the card socket 120 and the elevated plate 150 together clamp the SIM card.

Alternatively, the metal dome 130 may have a plurality of metal domes, and the plurality of metal domes may respectively contact a plurality of contacts on the SIM card.

Optionally, an eSIM card may be disposed inside the first cavity 160, and the eSIM card is electrically connected to a circuit board of the terminal device, so as to fully utilize the area of the circuit board, and meanwhile, the electronic device disposed in the first cavity is protected by the metal raised plate, so that the electronic device can work more stably.

Alternatively, the SIM card socket assembly in the embodiments provided herein may be applied to a third generation SIM card (micro-SIM), which may be referred to as a small card, or a fourth generation SIM card (nano-SIM), which may be referred to as a fourth form factor integrated circuit board. The third generation SIM card size may be 12 mm x 15 mm and the fourth generation SIM card size may be 12 mm x 9 mm.

Because the traditional cassette is raised by adopting the elevating plate, a first cavity can be formed between the elevating plate and the circuit board, an electronic device or an eSIM card and the like can be arranged by utilizing the first cavity, the space of the circuit board occupied by the SIM card seat component can be fully utilized, the SIM card seat component is released to occupy the partial space inside the terminal equipment, the thickness of the terminal equipment can be reduced, and the terminal equipment is miniaturized and ultra-thinned. Meanwhile, the fixing mode of the clamping seat can be selected according to design requirements, and various choices are provided.

According to the technical design that this application embodiment provided, raise traditional cassette through the board of elevating, set up electron device or eSIM card etc. in the first cavity that forms between board of elevating and circuit board, can set for according to the demand, on the unchangeable basis of the area of the shared circuit board of present SIM card seat subassembly like this, put into more devices in first cavity, make the shared space of SIM card seat subassembly obtain make full use of, the space of saving through the board of elevating, it is important enough to fill for terminal equipment, can reduce terminal equipment's thickness, realize terminal equipment miniaturization and ultra-thinness.

Fig. 8 is a schematic diagram of a terminal device.

As shown in fig. 8, the terminal device may further include a circuit board 180, and the SIM card holder assembly may be fixed on the circuit board 180 by welding, snapping, riveting or gluing.

It should be understood that fig. 8 is only used as a schematic reference, and the circuit board 180 may be located below the SIM card holder assembly, and the circuit board 180 may also be located above the SIM card holder assembly, which is not limited herein.

The first cavity 160 may be formed between the elevating plate 150 and the circuit board 180, the second cavity 170 may be formed between the elevating plate 150 and the housing 140, the second cavity 170 may have a card slot for inserting a SIM card, the card slot may be disposed on the left side of the second cavity 170, the card socket 120 may be fixed in the second cavity 170, the metal dome 130 may be fixed on the card socket 120 and electrically connected to the circuit board, the metal dome 130 may have a plurality of metal domes, and the plurality of metal domes may contact with a plurality of contacts on the SIM card, respectively.

Alternatively, the elevated plate 150 may be made of a metal material, which may reduce the influence of the electrical signal on the inside of the first cavity 160.

Optionally, a first electronic device 1601, a second electronic device 1602, and a third electronic device 1603 may be disposed inside the first cavity 160, where the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 may be the same kind of electronic device or different kinds of electronic devices.

It should be understood that the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 may be one or more of a capacitor, a resistor, and an inductor, and may also be a switch, a duplexer, and the like for a radio frequency circuit, or a decoding chip for a baseband circuit, and the like. The first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 are merely examples of the embodiments of the present application, and the embodiments of the present application do not limit the specific types or numbers of the electronic devices.

Optionally, the first electronic device 1601, the second electronic device 1602, and the third electronic device 1603 may be soldered on the circuit board 180, and then the SIM card holder assembly is soldered, so that the elevated board 150 may shield the electronic signal in the first cavity, and reduce the influence of the external electrical signal on the first cavity.

Optionally, an eSIM card may be disposed inside the first cavity 160, and meanwhile, electronic devices related to the eSIM may be disposed therein, and the eSIM card and the related devices may be soldered to the circuit board 180, and then the SIM card holder assembly is soldered, so that the elevated plate 150 may wrap the eSIM card and the related devices, and influence of an external electrical signal on the eSIM card is reduced.

The application also provides a terminal device, and the terminal device comprises the SIM card seat component with any structure.

The SIM card seat component of the terminal equipment can set the card seat and the metal elastic sheet in the second cavity through the second cavity formed between the shell and the elevating plate, the first cavity between the elevating plate and the circuit board, the electronic device or the eSIM card is arranged in the first cavity, and the SIM card seat component can be fully utilized to occupy the space of the circuit board.

Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A terminal device, comprising:

a circuit board, a housing and an elevated plate;

the shell with the board of elevating is all fixed on the circuit board, the board of elevating is located the shell with between the circuit board, the board of elevating with form first cavity between the circuit board, first cavity is semi-enclosed construction or totally enclosed structure, the board of elevating with form the second cavity between the shell, the second cavity is used for placing the SIM card.

2. The terminal device according to claim 1, further comprising a socket and a metal spring, wherein the socket and the metal spring are located in the second cavity, the metal spring is fixed on the socket, the metal spring is electrically connected to the circuit board directly or indirectly, and the socket and the metal spring are used for fixing the SIM card.

3. The terminal device of claim 1, further comprising a socket located in the second cavity, the socket being provided with at least one metal contact, the at least one metal contact being electrically connected to the circuit board directly or indirectly.

4. A terminal device according to claim 2 or 3, characterised in that the cartridge is fixed to a surface of the elevated plate within the second cavity or the cartridge is fixed to a surface of the housing opposite to the surface of the elevated plate.

5. The terminal device according to any one of claims 1 to 4, wherein the elevated plate comprises three sides or four sides, and the three sides or the four sides are fixed on the circuit board.

6. The terminal device of any one of claims 1 to 5, wherein the elevated plate is made of metal.

7. The terminal device of claim 6, wherein at least one electronic component is disposed within the first cavity, the at least one electronic component being electrically connected to the circuit board, directly or indirectly.

8. The terminal device of claim 7, wherein the electronic component is at least one of a capacitor, an inductor, or a resistor.

9. The terminal device of claim 6, wherein an embedded SIM card is disposed within the first cavity, the embedded SIM card being electrically connected to the circuit board directly or indirectly.

10. The terminal device according to any of claims 1 to 9, wherein the SIM card is a third generation SIM card or a fourth generation SIM card.

11. A manufacturing method of a terminal device, characterized in that the manufacturing method is used for manufacturing the terminal device according to any one of claims 1 to 10, the manufacturing method comprising: the elevating plate is fixed on the circuit board, form first cavity between elevating plate and the circuit board, first cavity is semi-enclosed construction or totally enclosed structure, with the shell fix with elevating plate homonymy on the circuit board, the shell is located elevating plate top, elevating plate with form the second cavity between the shell, the second cavity is used for placing the SIM card.