CN110707426A - A broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias - Google Patents
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Abstract
本发明公开一种加载过孔的宽带高增益压缩高次模式双极化差分天线,包括微带介质基片(4);微带介质基片(4)上具有金属片(5);金属片(5)的中心位置,具有细长缝隙(3);金属片(5)上设置有多个过孔阵列(1);每个过孔阵列(1)包括等间隔设置的多个过孔,多个过孔的中心位于同一直线上。本发明公开的一种加载过孔的宽带高增益压缩高次模式双极化差分天线,其能够通过增加过孔以及细长缝隙,进一步增加天线的带宽,提高天线的增益,更好地满足人们对天线的使用需求,具有重大的生产实践意义。
The invention discloses a broadband high-gain compression high-order mode dual-polarization differential antenna loaded with via holes, comprising a microstrip dielectric substrate (4); the microstrip dielectric substrate (4) is provided with a metal sheet (5); the metal sheet The central position of (5) has an elongated slot (3); a plurality of via hole arrays (1) are arranged on the metal sheet (5); each via hole array (1) includes a plurality of via holes arranged at equal intervals, The centers of multiple vias are on the same line. The invention discloses a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with via holes, which can further increase the bandwidth of the antenna and improve the gain of the antenna by adding via holes and elongated slits, so as to better satisfy people's needs The demand for the use of the antenna has great practical significance in production.
Description
技术领域technical field
本发明涉及天线技术领域,特别是涉及一种加载过孔的宽带高增益压缩高次模式双极化差分天线。The invention relates to the technical field of antennas, in particular to a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias.
背景技术Background technique
目前,无线通讯市场对小型、全集成射频(RF)前端产品的需求日益增加。天线是收发机系统中的重要组成部分,它主要承载着发射与接收电磁波信号的功能,在军用或者民用方面都扮演着重要的角色。There is an increasing demand for small, fully integrated radio frequency (RF) front-end products in the wireless communications market. The antenna is an important part of the transceiver system. It mainly carries the function of transmitting and receiving electromagnetic wave signals, and plays an important role in military or civilian use.
天线的增益,是评价天线性能的最重要的指标。许多双极化差分馈电偶极型天线,由于是多层次结构,提高了其应用的成本。此外,一些单层差分双极化微带贴片天线,其具有的带宽相对较窄(例如小于2%),且其增益也相对较小(例如小于8dBi),无法满足用户对天线的使用需求。The gain of the antenna is the most important index to evaluate the performance of the antenna. Many dual-polarized differentially fed dipole-type antennas increase the cost of their application due to their multi-level structure. In addition, some single-layer differential dual-polarized microstrip patch antennas have relatively narrow bandwidth (for example, less than 2%), and their gain is also relatively small (for example, less than 8 dBi), which cannot meet the needs of users for the use of antennas. .
因此,目前迫切需要研发一种双极化差分天线,其能够进一步增加天线的带宽,提高天线的增益,更好地满足人们对天线的使用需求。Therefore, there is an urgent need to develop a dual-polarized differential antenna, which can further increase the bandwidth of the antenna, improve the gain of the antenna, and better meet people's needs for using the antenna.
发明内容SUMMARY OF THE INVENTION
本发明的目的是针对现有技术存在的技术缺陷,提供一种加载过孔的宽带高增益压缩高次模式双极化差分天线。The purpose of the present invention is to provide a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with via holes in view of the technical defects existing in the prior art.
为此,本发明提供了一种加载过孔的宽带高增益压缩高次模式双极化差分天线,包括微带介质基片;To this end, the present invention provides a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias, including a microstrip dielectric substrate;
微带介质基片上具有金属片;There is a metal sheet on the microstrip dielectric substrate;
金属片的中心位置,具有细长缝隙;The central position of the metal sheet has a slender slot;
金属片上设置有多个过孔阵列;A plurality of via hole arrays are arranged on the metal sheet;
每个过孔阵列包括等间隔设置的多个过孔,多个过孔的中心位于同一直线上。Each via hole array includes a plurality of via holes arranged at equal intervals, and the centers of the plurality of via holes are located on the same straight line.
其中,当金属片的形状为横向分布的长方形时,金属片的左右两端分别设置有一个纵向分布的过孔阵列;Wherein, when the shape of the metal sheet is a horizontally distributed rectangle, the left and right ends of the metal sheet are respectively provided with a longitudinally distributed via hole array;
两个过孔阵列为轴对称分布;The two via arrays are axisymmetrically distributed;
金属片的中部具有纵向分布的一条细长缝隙。The middle of the metal sheet has a longitudinally distributed elongated slit.
其中,当金属片的形状为横向分布的长方形时,金属片在细长缝隙的左右两边,分别具有一个差分馈电探针;Wherein, when the shape of the metal sheet is a horizontally distributed rectangle, the metal sheet has a differential feeding probe on the left and right sides of the elongated slit, respectively;
差分馈电探针与细长缝隙的中心点,位于同一横向直线上;The center point of the differential feed probe and the elongated slot is located on the same horizontal straight line;
差分馈电探针,位于过孔阵列内侧方向的金属片上。Differential feed probe, located on the metal sheet in the inner direction of the via array.
其中,过孔阵列从上往下,贯穿金属片和微带介质基片,且位于接地板的底面上方;The via array runs through the metal sheet and the microstrip dielectric substrate from top to bottom, and is located above the bottom surface of the grounding plate;
细长缝隙是位于金属片上的开口,其底面为微带介质基片的顶面;The elongated slit is an opening located on the metal sheet, and its bottom surface is the top surface of the microstrip dielectric substrate;
差分馈电探针从上往下,依次垂直插入金属片和微带介质基片。The differential feeding probes are vertically inserted into the metal sheet and the microstrip dielectric substrate from top to bottom.
其中,当金属片的形状为十字形状时,金属片的中心位置,设置有呈十字交叉分布的第一细长缝隙和第二细长缝隙;Wherein, when the shape of the metal sheet is a cross shape, the center position of the metal sheet is provided with a first elongated slot and a second elongated slot distributed in a crisscross pattern;
第一细长缝隙和第二细长缝隙的相交点,为金属片的中心点;The intersection point of the first elongated slot and the second elongated slot is the center point of the metal sheet;
金属片的上下两端,分别设置有一个纵向分布的过孔阵列;The upper and lower ends of the metal sheet are respectively provided with a longitudinally distributed via hole array;
金属片的左右两端,分别设置有一个横向分布的过孔阵列;The left and right ends of the metal sheet are respectively provided with a laterally distributed via hole array;
以金属片的中心点为中心,四个过孔阵列为中心对称分布。Taking the center point of the metal sheet as the center, the four via arrays are distributed symmetrically around the center.
其中,当金属片的形状为十字形状时,金属片在第二细长缝隙的左右两边,分别具有一个差分馈电探针;Wherein, when the shape of the metal sheet is a cross shape, the metal sheet has a differential feeding probe on the left and right sides of the second elongated slot respectively;
金属片在第一细长缝隙的上下两边,也分别具有一个差分馈电探针;The metal sheet also has a differential feeding probe on the upper and lower sides of the first elongated slot;
差分馈电探针,位于过孔阵列内侧方向的金属片上。Differential feed probe, located on the metal sheet in the inner direction of the via array.
其中,每个过孔的半径为0.5mm。Among them, the radius of each via is 0.5mm.
由以上本发明提供的技术方案可见,与现有技术相比较,本发明提供了一种加载过孔的宽带高增益压缩高次模式双极化差分天线,其能够通过增加过孔以及细长缝隙,进一步增加天线的带宽,提高天线的增益,更好地满足人们对天线的使用需求,具有重大的生产实践意义。It can be seen from the above technical solutions provided by the present invention that, compared with the prior art, the present invention provides a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias, which can increase the vias and elongated slits by adding vias. , further increase the bandwidth of the antenna, improve the gain of the antenna, and better meet people's needs for the use of the antenna, which has great practical significance in production.
附图说明Description of drawings
图1为本发明提供的一种加载过孔的宽带高增益压缩高次模式双极化差分天线的俯视结构示意图;1 is a schematic top view of a via-loaded broadband high-gain compressed high-order mode dual-polarized differential antenna provided by the present invention;
图2为图2所示本发明提供的一种加载过孔的宽带高增益压缩高次模式双极化差分天线,在沿着长边方向居中垂直剖开后的结构示意简图;2 is a schematic structural diagram of a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias provided by the present invention shown in FIG. 2, after being vertically cut in the middle along the long side direction;
图3为本发明提供的一种加载过孔的宽带高增益压缩高次模式双极化差分天线,在最佳实施方式的俯视结构示意图;Fig. 3 is a kind of broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias provided by the present invention, and is a top-view structural schematic diagram of the preferred embodiment;
图4为本发明提供的一种加载过孔的宽带高增益压缩高次模式双极化差分天线,与现有的没有增加过孔的双极化差分天线,分别具有的相对带宽|S11|与增益的示意图;4 is a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias provided by the present invention, and the existing dual-polarized differential antennas without vias have relative bandwidths |S 11 | Schematic diagram with gain;
图5为本发明提供的一种加载过孔的宽带高增益压缩高次模式双极化差分天线,在最佳实施方式的仿真与测试增益示意图。FIG. 5 is a schematic diagram of simulation and test gain of a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias provided by the present invention, in the preferred embodiment.
图中,1为过孔阵列,2为差分馈电探针,3为细长缝隙,4为微带介质基片;In the figure, 1 is an array of vias, 2 is a differential feed probe, 3 is an elongated slot, and 4 is a microstrip dielectric substrate;
5为金属片,6为接地板;5 is a metal sheet, 6 is a ground plate;
71为第一细长缝隙,72为第二细长缝隙。71 is the first elongated slot, and 72 is the second elongated slot.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明方案,下面结合附图和实施方式对本发明作进一步的详细说明。In order to make those skilled in the art better understand the solution of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
参见图1至图5,本发明提供了一种加载过孔的宽带高增益压缩高次模式双极化差分天线,包括微带介质基片4;Referring to FIG. 1 to FIG. 5, the present invention provides a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias, including a microstrip
微带介质基片4上具有(例如通过印刷的方式)金属片5;The microstrip
金属片5的中心位置,具有细长缝隙3;The central position of the
金属片5上设置有多个过孔阵列1;The
每个过孔阵列1包括等间隔设置的多个过孔(即金属化孔),多个过孔的中心位于同一直线上。Each via
在本发明中,具体实现上,当金属片5的形状为横向分布的长方形时,金属片5的左右两端分别设置有一个纵向分布的过孔阵列1;In the present invention, in terms of specific implementation, when the shape of the
两个过孔阵列1为轴对称分布;The two via
金属片5的中部具有纵向分布的一条细长缝隙3。The middle of the
具体实现上,当金属片5的形状为横向分布的长方形时,金属片5在细长缝隙3的左右两边,分别具有一个差分馈电探针2;In terms of specific implementation, when the shape of the
差分馈电探针2与细长缝隙3的中心点,位于同一横向直线上;The center point of the
差分馈电探针2,位于过孔阵列1内侧方向(即朝向金属片5中心点的方向)的金属片5上。The
具体实现上,细长缝隙位于天线中心,为长方形,长度为24mm,宽度0.3mm。In terms of specific implementation, the elongated slot is located in the center of the antenna and is rectangular, with a length of 24 mm and a width of 0.3 mm.
具体实现上,参见图2所示,过孔阵列1从上往下,贯穿金属片5和微带介质基片4,且位于接地板6的底面上方;In terms of specific implementation, as shown in FIG. 2 , the
细长缝隙3是位于金属片5上的开口,其底面为微带介质基片4的顶面;The
差分馈电探针2从上往下,依次垂直插入金属片5和微带介质基片4。The
具体实现上,微带介质基片4位于接地板(即金属薄层)上。In specific implementation, the microstrip
在本发明中,具体实现上,当金属片5的形状为十字形状时,金属片5的中心位置,设置有呈十字交叉分布的第一细长缝隙71和第二细长缝隙72;In the present invention, in terms of specific implementation, when the shape of the
第一细长缝隙71和第二细长缝隙72的相交点,为金属片5的中心点;The intersection point of the first
金属片5的上下两端,分别设置有一个纵向分布的过孔阵列1;The upper and lower ends of the
金属片5的左右两端,分别设置有一个横向分布的过孔阵列1;The left and right ends of the
以金属片5的中心点为中心,四个过孔阵列1为中心对称分布。Taking the center point of the
具体实现上,当金属片5的形状为十字形状时,金属片5在第二细长缝隙72的左右两边,分别具有一个差分馈电探针2;In terms of specific implementation, when the shape of the
金属片5在第一细长缝隙71的上下两边,也分别具有一个差分馈电探针2;The
差分馈电探针2,位于过孔阵列1内侧方向(即朝向金属片5中心点的方向)的金属片5上。The
在本发明中,具体实现上,每个过孔的半径为0.5mm。需要说明的是,0.5mm是通过仿真软件在贴片的腔体模式下进行优化调试的到的。过孔的形状是半径为0.5mm的圆形,其圆心距离中心缝隙15.65mm,并且关于中心缝隙对称分布。In the present invention, in terms of specific implementation, the radius of each via hole is 0.5 mm. It should be noted that 0.5mm is obtained through optimization and debugging in the cavity mode of the patch through the simulation software. The shape of the via hole is a circle with a radius of 0.5mm, the center of which is 15.65mm from the central slot, and is symmetrically distributed about the central slot.
在本发明中,具体实现上,左右或者上下对称分布的两个过孔阵列的距离,优选为一个波导波长。In the present invention, the distance between two via arrays that are symmetrically distributed up, left and right or up and down is implemented, and is preferably one wavelength of the waveguide.
具体实现上,两个过孔阵列1包括的过孔的数量为10,加入细长缝隙后,能够将天线的谐振频带调节在5GHz左右。In terms of specific implementation, the number of via holes included in the two via
需要说明的是,在本发明中,过孔是为了增加天线的增益以及带宽。天线通过差分馈电探针与外部现有的射频电路连接,为天线进行馈电。细长缝隙的设置,能够将天线的频带调节在5GHz左右。It should be noted that, in the present invention, the via hole is used to increase the gain and bandwidth of the antenna. The antenna is connected to an external existing radio frequency circuit through a differential feeding probe to feed the antenna. The setting of the slender slot can adjust the frequency band of the antenna to about 5GHz.
需要说明的是,如图1所示,对于本发明,本发明提供的是单层双压缩模式差分贴片天线。为了使其工作在压缩系数为2的高次模式,金属片5的长度为1.5波导波长,金属片5的宽度为0.75自由空间波长。为了将其中心谐振频率确定在5GHZ左右,在贴片中心加入细长缝隙。为了增加其带宽,加入了以细长缝隙进行对称分布的过孔阵列。It should be noted that, as shown in FIG. 1 , for the present invention, the present invention provides a single-layer dual compressed mode differential patch antenna. In order to make it work in a higher-order mode with a compressibility factor of 2, the length of the
对于本发明,在加入过孔阵列后,并进行一系列的优化后,得到在4.8~5GHz的频率上,贴片天线可达到大于9.6dBi的增益。According to the present invention, after adding a via array and performing a series of optimizations, it is obtained that the patch antenna can achieve a gain greater than 9.6 dBi at a frequency of 4.8-5 GHz.
如图3所示,本发明作为单层双压缩模式双极化差分贴片天线,其在金属片5上增加每个过孔的半径为0.5mm的过孔阵列1。金属片5的中心增设两条细长缝隙(第一细长缝隙71和第二细长缝隙72),将天线的中心频率调整在5GHz左右。本发明的贴片天线采用的是差分馈电,馈电端口为差分馈电探针2。As shown in FIG. 3 , the present invention is used as a single-layer dual-compression-mode dual-polarization differential patch antenna, which adds a via
参见图4所示,图3是增加与未增加过孔时贴片天线的相对带宽|S11|与增益图。从图4可以明显的看出,贴片天线在增加过孔后,可得到没加过孔时所需要的4.8~5GHz的频带,在4.8~5GHz频段内增益大于9.6dBi。Referring to FIG. 4 , FIG. 3 is a graph of relative bandwidth |S 11 | and gain of the patch antenna with and without vias. It can be clearly seen from Figure 4 that the patch antenna can obtain the 4.8-5GHz frequency band required without the via hole after adding the via hole, and the gain in the 4.8-5GHz frequency band is greater than 9.6dBi.
参见图5所示,图5是本发明的最佳实施方式天线的仿真与测试增益图。从图5可以看出,关于单层双极化差分贴片天线的测量值与模拟值的差值,在允许的误差范围内。在进行关于过孔的半径、空间位置等一系列的优化后,增益大于9.6dBi,而且几乎是不变的。在该频段外,增益迅速减小。Referring to FIG. 5, FIG. 5 is a simulation and test gain diagram of the antenna according to the preferred embodiment of the present invention. It can be seen from Figure 5 that the difference between the measured value and the simulated value of the single-layer dual-polarized differential patch antenna is within the allowable error range. After a series of optimizations on the radius and spatial position of the via hole, the gain is greater than 9.6dBi and is almost constant. Outside this frequency band, the gain decreases rapidly.
基于以上技术方案可知,本发明作为一种高增益宽带天线,通过天线工作在高次模式,实现天线高增益,并通过加载过孔提高天线带宽,并且通过增加细长缝隙,来调节天线的中心频率。Based on the above technical solutions, the present invention, as a high-gain broadband antenna, realizes high antenna gain by operating the antenna in a high-order mode, increases the antenna bandwidth by loading vias, and adjusts the center of the antenna by adding elongated slits. frequency.
综上所述,与现有技术相比较,本发明提供的一种加载过孔的宽带高增益压缩高次模式双极化差分天线,其能够通过增加过孔以及细长缝隙,进一步增加天线的带宽,提高天线的增益,更好地满足人们对天线的使用需求,具有重大的生产实践意义。To sum up, compared with the prior art, the present invention provides a broadband high-gain compressed high-order mode dual-polarized differential antenna loaded with vias, which can further increase the antenna's efficiency by adding vias and elongated slots. Bandwidth, increase the gain of the antenna, and better meet people's needs for the use of the antenna, which has great practical significance in production.
本专利创新的地方在于贴片尺寸为1.5波导波长,使贴片天线工作在高次模式,实现了高增益,另外,加了两排过孔,两排过孔的距离为一个波导波长,增加了带宽。The innovation of this patent is that the patch size is 1.5 waveguide wavelength, which makes the patch antenna work in high-order mode and realizes high gain. In addition, two rows of via holes are added, and the distance between the two rows of via holes is one waveguide wavelength, which increases the bandwidth.
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made. It should be regarded as the protection scope of the present invention.
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