CN110691477A - Method and system for manufacturing rigid-flex printing plate - Google Patents
Method and system for manufacturing rigid-flex printing plate Download PDFInfo
- Publication number
- CN110691477A CN110691477A CN201910880709.8A CN201910880709A CN110691477A CN 110691477 A CN110691477 A CN 110691477A CN 201910880709 A CN201910880709 A CN 201910880709A CN 110691477 A CN110691477 A CN 110691477A
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- flexible
- rigid
- board
- areas
- epoxy resin
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 39
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 39
- 239000003292 glue Substances 0.000 claims abstract description 27
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 239000010408 film Substances 0.000 claims description 13
- 229920006335 epoxy glue Polymers 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000003754 machining Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method and a system for manufacturing a rigid-flex printing plate, wherein the method comprises the following steps: laminating different flexible boards through epoxy resin glue and a non-flowing prepreg; laminating the flexible board and the rigid board through the non-flowing prepreg; the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas; the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas. The system is used for executing the method. According to the embodiment of the invention, different flexible boards are laminated through epoxy resin glue and a non-flowing prepreg; through the non-flowing prepreg pressfitting flexible board and rigid plate, can rationally arrange the regional setting that needs crooked and do not need crooked, improve the practicality of rigid-flex printing plate.
Description
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a method and a system for manufacturing a rigid-flex printing plate.
Background
Rigid-flex boards are composed of rigid and flexible substrates that are selectively laminated together. The layers are conductively connected by metallized holes, and one or more soft regions are exposed on each layer. The rigid-flex printing plate can realize bending and three-dimensional installation, can effectively utilize the installation space and has high reliability. The rigid-flex combined mode can replace a press plug-in unit, and high reliability of the PCB under vibration impact, humid and severe environments is guaranteed.
With the development of the rigid-flex board, the number of layers of the board is more and more; the rigid plate has a multi-layer design, the flexible plate also has a multi-layer design, and the multi-layer flexible plate with a plurality of core plates laminated together at the inner layer is conventionally designed into a layer-by-layer design, namely, each flexible core plate of the multi-layer flexible plate is laminated with another flexible core plate without adopting an adhesive. However, the manufacturing method cannot meet the designed multilayer flexible plate with impedance requirement; and if the flexible core plates are separated, signal shielding between the multilayer flexible plates of the inner layer cannot be realized, and signal transmission is influenced.
Disclosure of Invention
Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. It is therefore an object of embodiments of the present invention to provide a method and system for rigid-flex printing plate fabrication.
The technical scheme adopted by the invention is as follows:
in a first aspect, an embodiment of the present invention provides a method for manufacturing a rigid-flex printing plate, including: laminating different flexible boards through epoxy resin glue and a non-flowing prepreg; laminating the flexible board and the rigid board through the non-flowing prepreg; the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas; the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas.
Preferably, the flexible board and the rigid board are provided with position marks, and the epoxy resin glue and the no-flow prepreg are attached according to the position marks.
Preferably, the epoxy resin adhesive and the no-flow prepreg are attached based on a segment attaching manner.
Preferably, the epoxy glue and the no-flow prepreg are applied by a conforming tool that matches the profile of the flex and rigid plates.
Preferably, a covering film is further arranged between the flexible areas, and the epoxy resin glue and the covering film are arranged in a layered mode.
In a second aspect, embodiments of the present invention provide a rigid-flex printing plate manufacturing system, comprising:
the flexible module is used for laminating different flexible boards through epoxy resin glue and a non-flowing prepreg;
the rigid-flexible module is used for laminating the flexible board and the rigid board through the non-flowing prepreg;
the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas;
the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas.
Preferably, the flexible board and the rigid board are provided with position marks, and the epoxy resin glue and the no-flow prepreg are attached according to the position marks.
Preferably, the epoxy resin adhesive and the no-flow prepreg are attached based on a segment attaching manner.
Preferably, the epoxy glue and the no-flow prepreg are applied by a conforming tool that matches the profile of the flex and rigid plates.
Preferably, a covering film is further arranged between the flexible areas, and the epoxy resin glue and the covering film are arranged in a layered mode.
The embodiment of the invention has the beneficial effects that:
according to the embodiment of the invention, different flexible boards are laminated through epoxy resin glue and a non-flowing prepreg; through the non-flowing prepreg pressfitting flexible board and rigid plate, can rationally arrange the regional setting that needs crooked and do not need crooked, improve the practicality of rigid-flex printing plate.
Drawings
FIG. 1 is a flow chart of one embodiment of a method of making a rigid-flex printing plate;
FIG. 2 is a block diagram of one embodiment of a multilayer rigid-flex printing plate;
FIG. 3 is a schematic diagram of an embodiment of a rigid-flex printing plate making system.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Example 1.
A method of making a rigid-flex printing plate as shown in fig. 1, comprising:
s1, pressing different flexible boards through epoxy resin glue and a non-flowing prepreg;
s2, laminating the flexible board and the rigid board through the no-flow prepreg; the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas; the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas.
No flow prepreg flow PP: or a low-flow prepreg (low-flow PP), wherein a low-flow high polymer material is contained in the PP sheet to reduce the fluidity of the PP sheet, but the performance of other glass fibers is not influenced, and the toughness of the high polymer material is very good. Therefore, after the flexible printed circuit board is combined with a flexible printed circuit board, the effects of machining drilling and routing are very good, the combining force and the heat resistance are also very good, and abnormal pressing can not occur. The material is therefore chosen as an intermediary material for the press.
Epoxy Adhesive (i.e. epoxy resin Adhesive) has high softness, is usually used for laminating bendable multilayer boards, and has the properties of moisture resistance, chemical resistance, temperature resistance and the like. The application of the flexible plate in the conventional multilayer structure is not abnormal. But has the following disadvantages: the thermal stability expansion coefficient of the hard board base material is greatly different, and the hard board base material are laminated together to have a layering risk; the softness is too high and the heat dissipation performance is poor after the hard plate is pressed together, and the holes drilled during machining the drilled holes cause the risk of separation of the functional copper layer.
The solution of this embodiment is to use no-flow prepreg and epoxy glue at the designated locations for the above problems. The method specifically comprises the following steps: no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas; no-flow prepreg is arranged between the non-exposed areas, and the exposed areas are in a hollow state. The positions of the flexible region and the exposed region in the up-down direction of the printed board are corresponding, that is, bendable portions. Different pressing structures are adopted in different areas, so that the requirements of heat resistance, machining performance and use durability of the multilayer rigid-flex printing plate can be met.
The flexible board and the rigid board are provided with position marks, and epoxy resin glue and a non-flowing prepreg are attached according to the position marks.
Both the flex board and the rigid board may have traces disposed thereon. When the circuit is manufactured or silk-screen printed, a position mark can be arranged, an independent copper wire, such as a ring surrounded by copper sheets, is not connected with other circuits, namely is not electrified; silk-screen frame, character and other contents; may be used as a position marker.
And attaching the epoxy resin adhesive and the non-flowing prepreg based on a segmented attaching mode.
And adhering the epoxy resin adhesive and the no-flow prepreg by an adhering tool matched with the shapes of the flexible plate and the rigid plate.
The application of the epoxy glue and the no-flow prepreg can be done by hand, but normally by a special machine. And just scratching the printing plate because the problem of design, a plurality of regions (flexible region, inflexible region etc.) appear on can appearing the face, if take the attached mode of integration, be about to whole epoxy glue (specifically be one deck resin film) and/or do not flow the prepreg and attach, cause the cavitation phenomenon very easily because reasons such as pressure is uneven, attached speed is unusual at the attached in-process, arouse attached unusual, influence subsequent pressfitting. Therefore, the segmented attaching mode is adopted, namely the cut epoxy resin glue and the non-flowing prepreg are attached gradually in one area and one area, and the yield of production can be improved. The specific cutting mode is to cut corresponding raw materials by laser.
The attaching machine and the corresponding fixture for holding the rigid-flex printed board are collectively called as attaching tools.
A covering film is further arranged between the flexible areas, and epoxy resin glue and the covering film are arranged in a layered mode.
The cover film with the attaching thickness of 50um is adopted, so that the purpose that the circuit of the flexible board (namely the flexible board) is not corroded and damaged by liquid medicine and other materials used in various processing processes is ensured, and the bending performance can be improved.
The multilayer rigid-flex printed board shown in fig. 2 includes a copper layer (i.e. a circuit) of L1, a copper layer of L2, and a rigid substrate between L1 and L2, wherein the rigid substrate is made of a common PCB material, such as a PP plate, and the rigid substrate is composed of layers L1 to L2. The copper layer of L3, the copper layer of L4, and the flexible substrate between L3 and L4 can be polyester substrate type, organic fiber substrate type, polytetraethylene oxide dielectric film substrate type, etc., and L3-L4 constitute the flexible substrate. The structures of L5-L6 and L7-L8 are the same as those of L3-L4, and a laminating medium layer formed by epoxy resin glue and a non-flowing prepreg is arranged between L4-L5, and a covering film can be preferably added. L9 and L10 are copper layers, a hard substrate with FR4 specification is arranged between L9 and L10, and L9 to L10 form a rigid plate.
Example 2.
A rigid-flex printing plate making system as shown in fig. 3, comprising:
the flexible module 1 is used for laminating different flexible boards through epoxy resin glue and a non-flowing prepreg;
the rigid-flexible module 2 is used for laminating the flexible board and the rigid board through the non-flowing prepreg;
the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas;
the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas.
The flexible board and the rigid board are provided with position marks, and epoxy resin glue and a non-flowing prepreg are attached according to the position marks.
And attaching the epoxy resin adhesive and the non-flowing prepreg based on a segmented attaching mode.
And adhering the epoxy resin adhesive and the no-flow prepreg by an adhering tool matched with the shapes of the flexible plate and the rigid plate.
A covering film is further arranged between the flexible areas, and epoxy resin glue and the covering film are arranged in a layered mode.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method of making a rigid-flex printing plate, comprising:
laminating different flexible boards through epoxy resin glue and a non-flowing prepreg;
laminating the flexible board and the rigid board through the non-flowing prepreg;
the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas;
the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas.
2. The method according to claim 1, wherein the flexible board and the rigid board are provided with position marks for determining a position for attaching the epoxy resin paste and the no-flow prepreg.
3. The method according to claim 1 or 2, wherein the epoxy resin paste and the non-flowing prepreg are attached based on a segment attaching manner.
4. A method of manufacturing a flex-rigid printing plate according to claim 3, wherein said epoxy resin paste and said no-flow prepreg are applied by an application tool matching the outer shape of said flexible board and said rigid board.
5. A method of making a flex-rigid printing plate as claimed in claim 1 or 4, wherein a cover film is further provided between said flexible areas, said epoxy glue and said cover film being layered.
6. A rigid-flex printing plate production system, comprising:
the flexible module is used for laminating different flexible boards through epoxy resin glue and a non-flowing prepreg;
the rigid-flexible module is used for laminating the flexible board and the rigid board through the non-flowing prepreg;
the laminated different flexible boards comprise flexible areas and non-flexible areas, no-flow prepregs are arranged between the non-flexible areas, and epoxy resin glue is arranged between the flexible areas;
the flexible board and the rigid board which are pressed together comprise non-exposed areas, and no-flow prepregs are arranged between the non-exposed areas.
7. The system according to claim 6, wherein the flexible board and the rigid board are provided with position marks for determining a position for applying the epoxy resin paste and the no-flow prepreg.
8. The system according to claim 6 or 7, wherein the epoxy resin paste and the no-flow prepreg are attached based on a segment attaching manner.
9. The system of claim 8, wherein the epoxy glue and the no-flow prepreg are applied by a bonding tool that matches the shape of the flexplate and the rigidizer.
10. A flex-rigid printing plate production system according to claim 6 or 9, wherein cover films are further provided between said flexible areas, said epoxy glue being layered with said cover films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910880709.8A CN110691477A (en) | 2019-09-18 | 2019-09-18 | Method and system for manufacturing rigid-flex printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910880709.8A CN110691477A (en) | 2019-09-18 | 2019-09-18 | Method and system for manufacturing rigid-flex printing plate |
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| Publication Number | Publication Date |
|---|---|
| CN110691477A true CN110691477A (en) | 2020-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910880709.8A Pending CN110691477A (en) | 2019-09-18 | 2019-09-18 | Method and system for manufacturing rigid-flex printing plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340220A (en) * | 2021-11-09 | 2022-04-12 | 深圳市实锐泰科技有限公司 | Rigid-flex board with plug-in hole and manufacturing method thereof |
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