CN110675756A - Panel module, manufacturing method thereof and touch device - Google Patents
Panel module, manufacturing method thereof and touch device Download PDFInfo
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- CN110675756A CN110675756A CN201910975845.5A CN201910975845A CN110675756A CN 110675756 A CN110675756 A CN 110675756A CN 201910975845 A CN201910975845 A CN 201910975845A CN 110675756 A CN110675756 A CN 110675756A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 240
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 18
- 238000005286 illumination Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 28
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Position Input By Displaying (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a panel module, a manufacturing method thereof and a touch device. The manufacturing method of the panel module comprises the following steps: providing a first substrate and a second substrate, wherein the first substrate and the second substrate are both provided with light shielding areas, a gap is formed between the light shielding areas of the first substrate and the second substrate, and the light shielding area of at least one of the first substrate and the second substrate is also provided with a diffraction structure which is arranged in the gap; filling photosensitive glue in the gap; and carrying out illumination treatment on the gap to enable light rays to directly irradiate the diffraction structure so as to cure the photosensitive adhesive. The manufacturing method of the panel module can enable the photosensitive adhesive in the gap to be cured uniformly and can be suitable for the bonding of substrates in different shapes.
Description
Technical Field
The invention relates to a panel module, a manufacturing method thereof and a touch device.
Background
In the gap between the Flexible Print Circuit (fpc) and the substrate in the panel module, the gap is usually filled with a gap filling adhesive for reinforcement. After the gap filling glue is injected into the gap, under the irradiation of a UV light source, the gap filling glue is irradiated by the light source in a certain direction, but the gap is narrow, the two sides of the substrate and the soft board are not transparent, light rays can not reach the region, the curing of the gap filling glue is not uniform, and the laminating property between the substrate and the soft board is poor. To the laminating of L type base plate and soft board in the conventional art, place a speculum in the corner of L type base plate for UV light reflection, thereby change light advancing direction, make before not by irradiant gap filling glue can the illumination. However, the above method is only suitable for the L-shaped substrate, and is not suitable for the bonding between the substrate of other structure and the flexible printed circuit board, and in practice, the gap between the substrate and the flexible printed circuit board is very small, and the above method cannot provide a space for reflecting light, and even cannot place a reflector, so that the problem of uneven curing of the gap filling adhesive cannot be solved.
Disclosure of Invention
Accordingly, it is desirable to provide a method for manufacturing a panel module, which can uniformly cure the photosensitive adhesive in the gap and is suitable for bonding substrates of various shapes.
In addition, a panel module and a touch device are also provided.
A method for manufacturing a panel module comprises the following steps:
providing a first substrate and a second substrate, wherein the first substrate and the second substrate are both provided with light shielding areas, a gap is formed between the light shielding areas of the first substrate and the second substrate, the light shielding area of at least one of the first substrate and the second substrate is provided with a diffraction structure, and the diffraction structure is arranged in the gap;
filling photosensitive glue in the gap; and
and carrying out illumination treatment on the gap to enable light rays to directly irradiate the diffraction structure so as to enable the photosensitive adhesive to be cured to obtain the panel module.
In one embodiment, the substrate provided with the diffraction structure in the first substrate and the second substrate is an L-shaped substrate, a planar substrate, a curved substrate, or a special-shaped substrate.
In one embodiment, the substrate provided with the diffraction structure in the first substrate and the second substrate is an L-shaped substrate, the L-shaped substrate has a bottom surface and a side surface intersecting with the bottom surface, the diffraction structure is provided on the bottom surface of the L-shaped substrate, and in the step of performing the light irradiation treatment on the gap, the light irradiation treatment direction is perpendicular to the bottom surface.
In one embodiment, the photosensitive paste includes at least one of epoxy acrylate, urethane acrylate, polyether acrylate, and acrylic resin.
In one embodiment, the method further comprises the step of forming the diffraction structure by adopting a plating or yellow light method.
In one embodiment, the diffractive structure is a reflective diffraction grating.
A panel module, comprising: the light-shielding structure comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are both provided with light-shielding areas, a gap is formed between the light-shielding areas of the first substrate and the second substrate, a diffraction structure is arranged in at least one light-shielding area of the first substrate and the second substrate, the diffraction structure is arranged in the gap, and photosensitive glue is filled in the gap.
In one embodiment, the substrate provided with the diffraction structure in the first substrate and the second substrate is an L-shaped substrate, a planar substrate, a curved substrate, or a special-shaped substrate.
In one embodiment, the diffractive structure is a reflective diffraction grating.
A touch device comprises the panel module or the panel module manufactured by the manufacturing method of the panel module.
According to the manufacturing method of the panel module, the diffraction structure is arranged on at least one of the first substrate and the second substrate with the shading area, the diffraction structure is arranged in the gap, the photosensitive adhesive is filled in the gap, when the gap is subjected to illumination treatment, diffraction occurs when light rays encounter the diffraction structure in the advancing process, diffracted light waves interfere with each other, the diffracted light waves can be seen from the part subjected to constructive interference, and the diffracted light waves can form an envelope surface to be transmitted continuously, so that the area which is not directly irradiated by the light rays in the gap can be illuminated. The photosensitive adhesives at different positions in the gap can be cured under the irradiation of light rays so as to be uniformly cured. In addition, the manufacturing method of the panel module directly improves the substrate, adds the diffraction structure, enables the light to irradiate different areas in the gap by utilizing the diffraction principle, is not influenced by the shape of the substrate, and can be suitable for the substrates with various shapes. Therefore, the manufacturing method of the panel module can enable the photosensitive adhesive in the gap to be cured uniformly and is suitable for bonding substrates in various shapes. The second substrate can be a flexible circuit board, so that the problem of uneven curing of the gap filling glue between the flexible circuit board and the first substrate is solved through the method.
Drawings
FIG. 1 is a process flow diagram of a method for fabricating a panel module according to an embodiment;
FIGS. 2-a and 2-b are schematic diagrams of the propagation of light rays when encountering a diffractive structure, respectively;
fig. 3 is a schematic structural diagram of a panel module according to embodiment 1;
fig. 4 is a schematic structural diagram of a panel module according to embodiment 2;
fig. 5 is a schematic structural diagram of a panel module according to embodiment 3;
fig. 6 is a schematic structural view of a panel module of comparative example 1.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description taken in conjunction with the accompanying drawings. The detailed description sets forth the preferred embodiments of the invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1, a method for manufacturing a panel module according to an embodiment includes the following steps:
step S110: providing a first substrate and a second substrate, wherein the first substrate and the second substrate are both provided with light shielding areas, a gap is formed between the light shielding areas of the first substrate and the second substrate, and the light shielding area of at least one of the first substrate and the second substrate is provided with a diffraction structure which is arranged in the gap.
Specifically, in some embodiments, the substrate provided with the diffraction structure of the first substrate and the second substrate is an L-shaped substrate. The L-shaped substrate has a bottom surface and a side surface intersecting the bottom surface. A diffraction structure is provided on at least one of the bottom surface and the side surface of the L-shaped substrate. In one embodiment, a diffractive structure is provided on the bottom surface of the L-shaped substrate. In another embodiment, the side of the L-shaped substrate is also provided with diffractive structures. Further, the first substrate and the second substrate are both L-shaped substrates.
In other embodiments, the substrate of the first and second substrates on which the diffractive structure is provided is a planar substrate. The diffraction structure is provided on the surface of the other of the first substrate and the second substrate on which the diffraction structure is provided. Further, the first substrate and the second substrate are both planar substrates.
In still other embodiments, the substrate of the first substrate and the second substrate on which the diffraction structure is disposed is a curved substrate. The diffraction structure is provided on the surface of the other of the first substrate and the second substrate on which the diffraction structure is provided. Furthermore, the first substrate and the second substrate are both curved substrates.
In some embodiments, the substrate provided with the diffraction structure in the first substrate and the second substrate may also be a profiled substrate. It is to be understood that the shapes of the first substrate and the second substrate are not limited to the above-mentioned shapes, and the first substrate and the second substrate may have other shapes commonly used in the art. Any first substrate and second substrate that have a light-shielding region and can form a gap and have a region in the gap that cannot be directly irradiated with light can be used as the first substrate and the second substrate in this embodiment.
Specifically, in the present embodiment, the first substrate and the second substrate are shaped to correspond to each other so that the first substrate and the second substrate can be bonded.
Specifically, in some embodiments, a diffractive structure is provided on the light-shielding region of one of the first and second substrates. In other embodiments, the light-shielding regions of the first and second substrates are both provided with diffractive structures.
In one embodiment, the second substrate is a flexible printed circuit board, and the first substrate is provided with a diffraction structure. When the second substrate is a flexible circuit board, the diffraction structure is arranged on the first substrate, so that the problem of uneven solidification of the gap filling glue between the first substrate and the flexible circuit board can be solved.
In particular, the diffractive structure is a reflective diffraction grating. Diffraction gratings are scribed by a scribing machine, requiring that each scribe be straight, spaced very evenly, and of a depth consistent with the profile shape, which is very difficult to manufacture. The traditional manufacturing method is to use the carved grating as a model, inject a layer of collodion solution on the model, take off the collodion film consistent with the model after the collodion solution is solidified, and fix the collodion film between two glass sheets to form the transmission type diffraction grating. If the removed collodion film is fixed on the metal surface, a reflection type diffraction grating is formed.
The light-shielding region of the first substrate or the second substrate may be formed with a diffraction structure itself, or the diffraction structure may be formed in the light-shielding region of the first substrate or the second substrate by a predetermined method.
In some embodiments, before step S110, a step of forming a diffraction structure in a light-shielding region of at least one of the first substrate and the second substrate is further included. Specifically, a diffraction structure is formed in a light-shielding region of at least one of the first substrate and the second substrate using a plating or yellow light method.
Step S120: and filling photosensitive glue in the gap.
Specifically, the method of filling the photosensitive paste in the gap may be a method commonly used in the art.
In some embodiments, the photosensitive glue includes at least one of epoxy acrylate, urethane acrylate, polyether acrylate, and acrylic resin. The photosensitive adhesive can generate a crosslinking reaction and be cured under the irradiation of UV light, so that the first substrate and the second substrate are bonded. It is to be understood that, in the present embodiment, the photosensitive adhesive is not limited to the above photosensitive adhesives, and may be other photosensitive adhesives commonly used in the art.
Step S130: and carrying out illumination treatment on the gap to enable light rays to directly irradiate the diffraction structure so as to enable the photosensitive adhesive to be cured to obtain the panel module.
Because the light-shielding area of the substrate is provided with the diffraction structure, when illumination is carried out, as shown in figure 2-a, UV light waves are diffracted when traveling to touch the protrusions of the diffraction structure, and because the diffraction of each protrusion, the light waves interfere with each other, and finally diffracted light waves can be seen from the part with constructive interference, and the light waves can form an envelope surface to be continuously transmitted, as shown in figure 2-b, so that the light can not be directly irradiated through the area, and further the photosensitive adhesives at different positions of the gap can be cured under illumination, and the curing uniformity is improved.
In one embodiment, the substrate provided with the diffraction structure of the first substrate and the second substrate is an L-shaped substrate, the L-shaped substrate has a bottom surface and a side surface intersecting with the bottom surface, the diffraction structure is provided on the bottom surface of the L-shaped substrate, and in the step of performing the light irradiation treatment on the gap, the light irradiation treatment direction is perpendicular to the bottom surface.
The manufacturing method of the panel module directly improves the substrate, adds the diffraction structure, enables light rays to irradiate different areas in the gap by utilizing the diffraction principle, is not influenced by the shape of the substrate, and can be suitable for the substrates with various shapes.
The manufacturing method of the panel module at least has the following advantages:
(1) according to the manufacturing method of the panel module, the diffraction structure is arranged on at least one of the first substrate and the second substrate with the shading area, the diffraction structure is arranged in the gap, the photosensitive adhesive is filled in the gap, when the gap is subjected to illumination treatment, diffraction occurs when light rays encounter the diffraction structure in the advancing process, diffracted light waves interfere with each other, the diffracted light waves can be seen from the part subjected to constructive interference, and the diffracted light waves can form an envelope surface to be transmitted continuously, so that the area which is not directly irradiated by the light rays in the gap can be illuminated. The photosensitive adhesives at different positions in the gap can be cured under the irradiation of light rays so as to be uniformly cured.
(2) The manufacturing method of the panel module directly improves the substrate, adds the diffraction structure, enables light rays to irradiate different areas in the gap by utilizing the diffraction principle, is not influenced by the shape of the substrate, and can be suitable for the substrates with various shapes.
(3) In the traditional method, the reflector is arranged in the gap and is subjected to the gap with the size of the space in the gap, and the manufacturing method of the panel module is used for arranging the diffraction structure on the substrate, is not limited by the size of the space in the gap and can be applied to the bonding of various substrates.
(4) The manufacturing method of the panel module is simple in process and easy for industrial production.
The panel module of an embodiment includes a first substrate and a second substrate, both the first substrate and the second substrate have a light-shielding region, a gap is formed between the light-shielding region of the first substrate and the light-shielding region of the second substrate, at least one light-shielding region of the first substrate and the second substrate is further provided with a diffraction structure, the diffraction structure is arranged in the gap, and the gap is further filled with photosensitive glue.
In one embodiment, the substrate provided with the diffraction structure in the first substrate and the second substrate is an L-shaped substrate, a planar substrate, a curved substrate, or a special-shaped substrate.
In particular, the diffractive structure is a reflective diffraction grating.
Specifically, the panel module of the present embodiment can be manufactured by the method for manufacturing a panel module of the above embodiment.
The first substrate and the second substrate in the panel module can be designed into various shapes, and the first substrate and the second substrate are good in laminating performance and not easy to separate, so that the panel module can be applied to a touch device.
The touch device of an embodiment includes the panel module manufactured by the method for manufacturing a panel module of the embodiment or the panel module of the embodiment.
The following are specific examples:
example 1
The manufacturing process of the panel module 200 of this embodiment is as follows:
(1) providing a first substrate 210 and a second substrate 220, as shown in fig. 3, the first substrate 210 and the second substrate 220 are both L-shaped substrates, the first substrate 210 and the second substrate 220 both have light-shielding regions, a gap 230 is formed between the light-shielding regions of the first substrate 210 and the light-shielding regions of the second substrate 220, a reflective diffraction grating 212 is further disposed on the first substrate 210, and the reflective diffraction grating 212 is disposed in the gap 230.
(2) The gap 230 is uniformly filled with photosensitive glue (not shown).
(3) The photosensitive adhesive in the gap 230 is irradiated to make the light directly irradiate the reflective diffraction grating 212, so that the photosensitive adhesive is cured to obtain the panel module 200.
Example 2
The manufacturing process of the panel module 300 of this embodiment is as follows:
(1) providing a first substrate 310 and a second substrate 320, as shown in fig. 4, the first substrate 310 and the second substrate 320 are both planar substrates, the first substrate 310 and the second substrate 320 both have light-shielding regions, a gap 330 is formed between the light-shielding regions of the first substrate 310 and the light-shielding regions of the second substrate 320, a reflective diffraction grating 312 is further disposed on the first substrate 310, and the reflective diffraction grating 312 is disposed in the gap 330.
(2) The gap 330 is uniformly filled with photosensitive glue (not shown).
(3) The photosensitive adhesive in the gap 330 is irradiated by light to directly irradiate the reflective diffraction grating 312, so that the photosensitive adhesive is cured to obtain the panel module 300.
Example 3
The manufacturing process of the panel module 400 of this embodiment is as follows:
(1) a first substrate 410 and a second substrate 420 are provided, as shown in fig. 5, the first substrate 410 and the second substrate 420 are both curved substrates. The first substrate 410 and the second substrate 420 both have light-shielding regions, a gap 430 is formed between the light-shielding regions of the first substrate 410 and the second substrate 420, a reflective diffraction grating 412 is further disposed on the first substrate 410, and the reflective diffraction grating 412 is disposed in the gap 430.
(2) The gap 430 is uniformly filled with photosensitive glue (not shown).
(3) The photosensitive adhesive in the gap 430 is irradiated to make the light directly irradiate the reflective diffraction grating 412, so that the photosensitive adhesive is cured to obtain the panel module 400.
Comparative example 1
The manufacturing process of the panel module 500 of comparative example 1 is as follows:
(1) a first substrate 510 and a second substrate 520 are provided, as shown in fig. 6, the first substrate 510 and the second substrate 520 are both L-shaped substrates. The first substrate 510 and the second substrate 520 each have a light-shielding region, and a gap 530 is formed between the light-shielding region of the first substrate 510 and the light-shielding region of the second substrate 520.
(2) The gap 530 is uniformly filled with photosensitive glue (not shown).
(3) The photosensitive adhesive in the gap 530 is irradiated with light to cure the photosensitive adhesive, so as to obtain the panel module 500.
The curing rates of the photosensitive adhesives at three different positions (position a, position B, and position C) in the gap between the panel modules obtained in examples 1 to 3 and comparative example 1 were measured by a DSC method, and the results show that the curing rates of the photosensitive adhesives at position a, position B, and position C in examples 1 to 3 are significantly improved as compared with the curing rates of the photosensitive adhesives at position a, position B, and position C in comparative example 1.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for manufacturing a panel module is characterized by comprising the following steps:
providing a first substrate and a second substrate, wherein the first substrate and the second substrate are both provided with light shielding areas, a gap is formed between the light shielding areas of the first substrate and the second substrate, the light shielding area of at least one of the first substrate and the second substrate is provided with a diffraction structure, and the diffraction structure is arranged in the gap;
filling photosensitive glue in the gap; and
and carrying out illumination treatment on the gap to enable light rays to directly irradiate the diffraction structure so as to enable the photosensitive adhesive to be cured to obtain the panel module.
2. The method of claim 1, wherein the substrate of the first substrate and the second substrate on which the diffraction structure is disposed is an L-shaped substrate, a planar substrate, a curved substrate, or a profile substrate.
3. The method according to claim 2, wherein the substrate of the first substrate and the second substrate on which the diffraction structure is disposed is an L-shaped substrate, the L-shaped substrate has a bottom surface and a side surface intersecting the bottom surface, the diffraction structure is disposed on the bottom surface of the L-shaped substrate, and in the step of performing the light irradiation treatment on the gap, a direction of the light irradiation treatment is perpendicular to the bottom surface.
4. The method of claim 1, wherein the photosensitive adhesive comprises at least one of epoxy acrylate, urethane acrylate, polyether acrylate, and acrylic resin.
5. The method of claim 1, further comprising forming the diffractive structure by a plating or yellow light method.
6. The method of manufacturing a panel module according to any one of claims 1 to 5, wherein the diffraction structure is a reflective diffraction grating.
7. A panel module, comprising: the light-shielding structure comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are both provided with light-shielding areas, a gap is formed between the light-shielding areas of the first substrate and the second substrate, a diffraction structure is arranged in at least one light-shielding area of the first substrate and the second substrate, the diffraction structure is arranged in the gap, and photosensitive glue is filled in the gap.
8. The panel module according to claim 7, wherein the substrate of the first substrate and the second substrate on which the diffraction structure is disposed is an L-shaped substrate, a planar substrate, a curved substrate, or a profiled substrate.
9. A panel module according to claim 7 or 8, characterized in that the diffractive structure is a reflective diffraction grating.
10. A touch device comprising the panel module manufactured by the method for manufacturing a panel module according to any one of claims 1 to 6 or the panel module according to any one of claims 7 to 9.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111933675A (en) * | 2020-08-18 | 2020-11-13 | 维沃移动通信有限公司 | Display module, electronic equipment and display module preparation method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111933675A (en) * | 2020-08-18 | 2020-11-13 | 维沃移动通信有限公司 | Display module, electronic equipment and display module preparation method |
| CN111933675B (en) * | 2020-08-18 | 2023-07-11 | 维沃移动通信有限公司 | Display module, electronic equipment and preparation method of display module |
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