CN110662352A - Circuit board device, processing method thereof and mobile terminal - Google Patents
Circuit board device, processing method thereof and mobile terminal Download PDFInfo
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- CN110662352A CN110662352A CN201911032915.XA CN201911032915A CN110662352A CN 110662352 A CN110662352 A CN 110662352A CN 201911032915 A CN201911032915 A CN 201911032915A CN 110662352 A CN110662352 A CN 110662352A
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- 238000003672 processing method Methods 0.000 title abstract description 12
- 239000003990 capacitor Substances 0.000 claims description 153
- 238000000034 method Methods 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000009467 reduction Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 8
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- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
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- 230000003796 beauty Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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Abstract
The embodiment of the invention provides a circuit board device, a processing method thereof and a mobile terminal, wherein the circuit board device comprises: the circuit board, the functional device and a plurality of electric capacity, the first side at the circuit board is connected to the functional device, a plurality of electric capacity are connected in the second side relative with the first side of circuit board, a plurality of electric capacities set up in the projection region of functional device at the circuit board, the length direction perpendicular to circuit board's second side of a plurality of electric capacities, can reduce the area of the shared projection region of electric capacity, consequently, the projection region of same size can set up more electric capacity, and like this, the volume at the functional device diminishes, the functional device is in under the condition that the projection region on the circuit board is corresponding little, still can set up more electric capacity in the projection region, consequently, the noise that the reduction functional device that the electric capacity can be better couples to the power end improves the stability that the functional device inserts the.
Description
Technical Field
The present invention relates to the field of communications technologies, and in particular, to a circuit board device, a processing method thereof, and a mobile terminal.
Background
With the extreme pursuit of the use experience, the requirements of users on mobile terminals such as smart phones and tablet computers are higher and higher, the mobile terminals are more and more miniaturized, and the built-in functional devices are smaller and smaller.
In the existing mobile terminal, the functional device is usually connected to the circuit board, and in order to reduce the noise of the functional device coupled to the power supply end and improve the stability of the functional device accessing the power supply, a capacitor needs to be installed on the circuit board.
Referring to fig. 1, a schematic structural diagram of a conventional circuit board device is shown, which may specifically include: a circuit board 10, a functional device 11, and a plurality of capacitors 12; the functional device 11 is connected to one side of the circuit board 10, the plurality of capacitors 12 are connected to the other side of the circuit board 10, and the capacitors 12 are arranged in a projection area of the functional device 11 on the circuit board 10, so that the distance between the capacitors 12 and the functional device 11 is short, the capacitors 12 can reduce noise generated when the functional device 11 is coupled to a power supply end, and stability of the functional device 11 connected to the power supply is improved.
However, as the size of the functional device 11 becomes smaller, the area of the projection area of the functional device 11 on the circuit board 10 becomes smaller, resulting in a reduction in the number of capacitors 12 that can be disposed in the projection area, thereby reducing the effect of the capacitors 12 on noise reduction of the functional device 11 coupled to the power supply terminal, and reducing the stability of the functional device 11 connected to the power supply.
Disclosure of Invention
In view of this, in order to solve the problems that the number of capacitors of a functional device is small, the noise reduction effect of the capacitors on the functional device is poor, and the stability of the functional device connected to a power supply is poor in the conventional mobile terminal, embodiments of the present invention provide a circuit board device, a processing method thereof, and a mobile terminal.
In order to solve the above problem, in one aspect, an embodiment of the present invention discloses a circuit board device, including: the circuit board, the functional device and a plurality of capacitors; wherein,
the functional device is connected to the first side of the circuit board;
the capacitors are connected to a second side of the circuit board, the second side is opposite to the first side, the capacitors are arranged in a projection area of the functional device on the circuit board in a direction perpendicular to the circuit board, and the length direction of the capacitors is perpendicular to the circuit board.
On the other hand, the embodiment of the invention also discloses a processing method of the circuit board device, which comprises the following steps:
connecting a functional device to a first side of a circuit board to obtain a first circuit board provided with the functional device;
connecting a plurality of capacitors to a second side of the first circuit board to obtain a circuit board device; the second side is opposite to the first side, the capacitor is arranged in a projection area of the functional device on the first circuit board in a direction perpendicular to the first circuit board, and the length direction of the capacitor is perpendicular to the first circuit board.
In another aspect, an embodiment of the present invention further discloses an electronic device, including: the circuit board device is provided.
The embodiment of the invention has the following advantages:
in the circuit board device provided by the embodiment of the invention, the functional device is connected to the first side of the circuit board, the plurality of capacitors are connected to the second side of the circuit board opposite to the first side, in the direction perpendicular to the circuit board, the capacitors are arranged in the projection area of the functional device on the circuit board, and the length direction of the capacitors is perpendicular to the circuit board, so that the area of the projection area occupied by the capacitors can be reduced, and more capacitors can be arranged in the projection area with the same size.
Drawings
Fig. 1 is a schematic structural diagram of a conventional circuit board device;
FIG. 2 is a schematic diagram of a circuit board assembly according to the present invention;
FIG. 3 is a flow chart illustrating one of the steps of a method of manufacturing a circuit board assembly in accordance with the present invention;
FIG. 4 is a second flowchart illustrating the steps of a circuit board device processing method according to the present invention;
FIG. 5 is a schematic diagram of a first circuit board according to the present invention;
fig. 6 is a second schematic diagram of a first circuit board structure according to the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example one
Referring to fig. 2, a schematic structural diagram of a circuit board device of the present invention is shown, which may specifically include: a circuit board 20, a functional device 21, and a plurality of capacitors 22; the functional device 21 is connected to a first side of the circuit board 20, the plurality of capacitors 22 are connected to a second side of the circuit board 20, the second side is opposite to the first side, and the capacitors 22 are disposed in a projection area of the functional device 21 on the circuit board 20 in a direction perpendicular to the circuit board 20, where the projection area refers to a projection area of the functional device 21 along a direction perpendicular to the circuit board 20. The length of the capacitor 22 is perpendicular to the circuit board 20. In the embodiment of the present invention, the length direction of the capacitor 22 is perpendicular to the circuit board 20, so that the area of the projection area occupied by the capacitor 22 can be reduced, and the projection area has the same size. In this way, when the volume of the functional device 21 is reduced and the projection area of the functional device 21 on the circuit board 20 is relatively small, more capacitors 22 can still be disposed in the projection area, so that the capacitors 22 can better reduce the noise of the functional device 21 coupled to the power supply end, and improve the stability of the functional device 21 accessing the power supply.
In practical applications, there may be a plurality of functional devices 21, and each functional device 21 is provided with a plurality of capacitors 22 in the projection area on the circuit board 20, where the number of the capacitors 22 may be determined according to the number of power supply terminals of the functional device 21, which is not limited in the embodiment of the present invention.
In practical applications, the capacitance values of the capacitors 22 may be different, the capacitor 22 with a larger capacitance value is used for removing low-frequency noise, and the capacitor 22 with a smaller capacitance value is used for removing high-frequency noise, wherein the setting positions of the capacitors 22 with a larger capacitance value and a smaller capacitance value may be determined according to the frequency of power-supply-end noise on the functional device 21. For example, the capacitor 22 with a larger capacitance value is arranged at a position close to the low-frequency noise of the power supply terminal, the capacitor 22 with a smaller capacitance value is arranged at a position close to the high-frequency noise of the power supply terminal, the capacitor 22 with a larger capacitance value has a larger volume, and the capacitor 22 with a smaller capacitance value has a smaller volume.
In the embodiment of the present invention, one end of the capacitor 22 along the length direction is provided with a first pole plate 221, the other end of the capacitor 22 along the length direction is provided with a second pole plate 222, the first pole plate 221 is connected to the second side of the circuit board 20, and the second pole plate 222 is far away from the second side of the circuit board 20 and is electrically connected to the circuit board 20. Compared with the prior circuit board device in which the first plate and the second plate of the capacitor 12 are both directly contacted with the circuit board 20, in the circuit board device provided by the embodiment of the present invention, the area occupied by the capacitor 22 in the projection area is smaller, and more capacitors 22 can be disposed in the projection area of the same size. Therefore, under the condition that the volume of the functional device 21 is reduced and the projection area of the functional device 21 on the circuit board 20 is relatively small, more capacitors 22 can still be arranged in the projection area, so that the noise of the functional device 21 coupled to a power supply end can be well reduced by the capacitors 22, and the stability of the functional device 21 connected to the power supply end is improved.
In addition, compared with the conventional circuit board device in which the side surfaces of the first plate and the second plate of the capacitor 12 are in contact with the circuit board, the circuit board device according to the embodiment of the present invention can increase the contact area between the first plate 221 and the circuit board 20, reduce the contact resistance, and save energy by contacting the front surface of the first plate 221 of the capacitor 22 with the circuit board 20.
In practical applications, the functional device 21 may be disposed on a first side of the circuit board 20 to obtain the circuit board 20 having the functional device 21, and then the first plate 221 of the capacitor 22 is connected to a projection area on a second side of the circuit board 20 by using a surface mount technology to obtain the circuit board apparatus. The first plate 221 of the capacitor 22 is connected to the functional device 21 through a connecting wire or a pre-laid conducting medium, and a certain gap is formed between the capacitors 22, so that the second plate 222 is electrically connected to the circuit board 20.
In practical applications, the first plate 221 of the capacitor 22 may be a positive electrode or a negative electrode, and specifically, may be determined according to the polarity of the functional device 21 close to the capacitor 22. For example, when the polarity of the functional device 21 near the capacitor 22 is positive, i.e., the power supply terminal, the first plate 221 is positive; when the polarity of the functional device 21 close to the capacitor 22 is negative, i.e. grounded, the first plate 221 is negative. In addition, when the first electrode plate 221 is a positive electrode, the second electrode plate 222 is a negative electrode; when the first plate 221 is a negative electrode, the second plate 222 is a positive electrode.
In an embodiment of the present invention, in order to improve the firmness of the connection between the capacitor 22 and the circuit board 20, the circuit board apparatus may further include: the package structure 23, the package structure 23 covers the plurality of capacitors 22 and fills the gaps between the plurality of capacitors 22, and the package structure 23 is connected to the second side of the circuit board 20, so that the package structure 23 can further fix the capacitors 22 on the circuit board 20 to prevent the capacitors 22 from falling off under the action of external force.
In practical applications, the package structure 23 may be covered on the capacitor 22 by a plastic filling method. Specifically, the material of the package structure 23 is an insulating material to prevent the plurality of capacitors 22 from being electrically conductive, wherein the insulating material may be plastic.
In the embodiment of the present invention, in order to electrically connect the second electrode plate 222 and the circuit board 20, the conductive structure 25 is disposed on the package structure 23, the second electrode plate 222 is connected to the circuit board 20 through the conductive structure 25, and the conductive structure 25 plays a role in electrically connecting the second electrode plate 222 and the circuit board 20.
In practical application, the package structure 23 is provided with a conduction channel 24, a conductive structure 25 is disposed in the conduction channel 24, the conductive structure 25 is respectively connected to the second electrode plate 222 and the circuit board 20, and the conductive structure 25 plays a role in conducting the second electrode plate 222 and the circuit board 20. Specifically, the conductive structure 25 may be directly connected to the second side of the circuit board 20, or may be connected to the first side of the circuit board 20, wherein when the conductive structure 25 is connected to the first side of the circuit board 20, the second electrode 222 may be electrically connected to the functional device 21 through a connection line or a pre-laid conductive medium. The conductive path 24 can provide a space for electrical connection between the second plate 222 and the circuit board 20, so as to avoid the circuit layout of the circuit board device from being too complicated, thereby achieving the purposes of beauty and cost saving.
In practical applications, one pole of the functional device 21 close to the capacitor 22 is connected to the first pole plate 221 of the capacitor 22 through a conducting medium, and the other pole of the functional device 21 is connected to the second pole plate 222 of the capacitor 22 through the conductive structure 25 to form a decoupling loop, which can remove noise from the functional device 21 coupled to the power supply terminal and improve the stability of the functional device 21 connected to the power supply.
Specifically, the conductive structure 25 may include: the conductive metal such as copper, silver, etc., the conducting wire or the conductive coating plated on the inner wall of the conducting channel 24, when the conductive structure 25 is conductive metal, the conducting channel 24 can be filled with the conductive metal, so as to increase the sectional area of the conductive structure 25, reduce the conductive resistance, and save the power. When the conductive structure 25 is a wire, the cost can be saved, and at the same time, the conducting channel 24 can be set smaller to improve the strength of the package structure 23. When the conductive structure 25 is a conductive plating layer, the second plate 222 and the circuit board 20 are electrically connected, and the cost is saved.
Alternatively, the Circuit Board 20 may be a Printed Circuit Board (PCB) or a flexible Circuit Board, the functional device 21 may be a Central Processing Unit (CPU), and the CPU is soldered on the PCB.
To sum up, the circuit board device according to the embodiment of the present invention at least includes the following advantages:
in an embodiment of the present invention, a circuit board device includes: the circuit board, the functional device and a plurality of electric capacity, the first side at the circuit board is connected to the functional device, a plurality of electric capacity are connected in the second side relative with the first side of circuit board, a plurality of electric capacities set up in the projection region of functional device at the circuit board, the length direction perpendicular to circuit board of a plurality of electric capacities, can reduce the area of the shared projection region of electric capacity, consequently, the projection region of the same size can set up more electric capacity, and like this, the volume at the functional device diminishes, the functional device is in under the condition that the projection region on the circuit board is corresponding little, still can set up more electric capacity in the projection region, consequently, the noise that the reduction functional device that the electric capacity can be better couples to the power end improves the stability that the functional device inserts the.
Example two
Referring to fig. 3, one of the flow charts of the steps of the circuit board device processing method of the present invention is shown, and the method may specifically include the following steps:
step 301: and connecting the functional device on the first side of the circuit board to obtain the first circuit board provided with the functional device.
Specifically, the functional device may be connected to the first side of the circuit board by soldering, and the functional device may include a plurality of power terminals and a plurality of ground terminals, that is, a plurality of anodes and a plurality of cathodes, wherein the anodes of the functional device are soldered to the circuit board, and the cathodes of the functional device are grounded through the circuit board.
In practical applications, a plurality of functional devices can be connected to the first side of the circuit board.
Step 302: connecting a plurality of capacitors to a second side of the first circuit board to obtain a circuit board device, wherein the second side is opposite to the first side, the capacitors are arranged in a projection area of the functional device on the first circuit board in a direction perpendicular to the first circuit board, and the length direction of the capacitors is perpendicular to the first circuit board.
In the embodiment of the present invention, the plurality of capacitors may be soldered to the second side of the first circuit board, specifically, the plurality of capacitors are soldered in a projection area of the functional device on the first circuit board, a length direction of the capacitor is perpendicular to the first circuit board, and a polarity of one end of the capacitor close to the circuit board is determined by a polarity of a nearest functional device.
In practical applications, the capacitor may be connected in other manners as long as the connection firmness and the electrical connectivity of the capacitor on the second side of the first circuit board can be achieved, for example, the capacitor may be fixed on the second side of the first circuit board by means of a solder paste patch.
In practical applications, after the functional device is connected to the first side of the circuit board, the plurality of capacitors are connected to the projection area. In the embodiment of the invention, the length direction of the capacitor is vertical to the first circuit board, so that the area of the projection area occupied by the capacitor can be reduced, and more capacitors can be arranged in the projection area with the same size. Therefore, under the condition that the size of the functional device is reduced and the projection area of the functional device on the first circuit board is relatively small, more capacitors can be still arranged in the projection area, so that the noise of the functional device coupled to a power supply end can be well reduced through the capacitors, and the stability of the functional device connected to a power supply is improved.
In practical applications, there may be a plurality of functional devices, and each functional device is provided with a plurality of capacitors in the projection area on the first circuit board, where the number of the capacitors may be determined according to the number of the power source terminals of the functional device, and this is not limited in the embodiment of the present invention.
In practical applications, the capacitance values of the plurality of capacitors may be different, and the capacitor with the larger capacitance value is used for removing low-frequency noise, and the capacitor with the smaller capacitance value is used for removing high-frequency noise, where the setting positions of the capacitors with the larger capacitance value and the smaller capacitance value may be determined according to the frequency of the power supply end noise on the functional device, for example, the capacitor with the larger capacitance value is set near the position of the power supply end low-frequency noise, and the capacitor with the smaller capacitance value is set near the position of the power supply end high-frequency noise.
To sum up, the circuit board device processing method according to the embodiment of the present invention at least includes the following advantages:
in the circuit board device according to the embodiment of the invention, the functional device is connected to the first side of the circuit board, the plurality of capacitors are connected to the second side of the circuit board opposite to the first side, the plurality of capacitors are arranged in the projection area of the functional device in the circuit board, and the length directions of the plurality of capacitors are perpendicular to the circuit board, so that the area of the projection area occupied by the capacitors can be reduced, and more capacitors can be arranged in the projection area with the same size.
EXAMPLE III
Referring to fig. 4, a second step flow chart of the circuit board device processing method of the present invention is shown, and the method may specifically include the following steps:
step 401: and connecting the functional device to the first side of the circuit board to obtain the first circuit board provided with the functional device.
Step 402: and electrically connecting the first polar plates of the capacitors to the second side of the first circuit board.
Referring to fig. 5, one of the structural diagrams of a first circuit board of the present invention is shown. As shown in fig. 5, the capacitor 22 may be connected to the second side of the first circuit board by surface mount technology, wherein the capacitor 22 has a certain gap therebetween, and the reliability of the connection between the capacitor 22 and the first circuit board may be improved by connecting the capacitor 22 by surface mount technology.
The polarity of the first plate 221 of the capacitor 22 is determined by the polarity of the functional device 21 close to the capacitor 22, for example, when the polarity of the functional device 21 close to the capacitor 22 is positive, the first plate 221 is positive; when the polarity of the functional device 21 near the capacitor 22 is negative, the first plate 221 is negative.
Step 403: and electrically connecting a plurality of second polar plates of the capacitors with the first circuit board to obtain the circuit board device, wherein the first polar plates are arranged at one ends of the capacitors along the length direction, the second polar plates are arranged at the other ends of the capacitors along the length direction, and the second polar plates are far away from the second side of the first circuit board.
In the embodiment of the present invention, the first plate 221 of the capacitor 22 is electrically connected to the second side of the first circuit board, and the second plate 222 of the capacitor 22 is far away from the second side of the first circuit board, so that the length direction of the capacitor 22 can be ensured to be perpendicular to the first circuit board, the area of the projection area occupied by the capacitor 22 is smaller, and a relatively large number of capacitors 22 can be disposed in the projection area of the same size. Thus, when the volume of the functional device 21 is reduced and the projection area of the functional device 21 on the first circuit board is relatively small, more capacitors 22 can still be disposed in the projection area, and therefore, the capacitors 22 can better reduce the noise of the functional device 21 coupled to the power supply end, and improve the stability of the functional device 21 connected to the power supply.
In addition, the front surface of the first electrode plate 221 of the capacitor 22 is in contact with the first circuit board, so that the contact area between the first electrode plate 221 and the first circuit board can be increased, the contact resistance is reduced, and the energy is saved.
In practical applications, the second plate 222 of the capacitor 22 may be electrically connected to the first circuit board in various ways, for example, the second plate 222 of the capacitor 22 may be directly connected to the first circuit board through a wire, or may be connected through other conductive materials, which is not limited in this embodiment of the invention.
Optionally, step 403 may specifically include the following steps:
firstly, the second side surface of the first circuit board is subjected to plastic package molding through plastic cement, and a packaging structure which is fixed on the second side surface and covers the capacitor is obtained.
Referring to fig. 6, a second schematic structural diagram of a first circuit board according to the present invention is shown. As shown in fig. 6, a plastic material is molded on the first circuit board to obtain a package structure 23, the package structure 23 covers the plurality of capacitors 22 and fills gaps between the plurality of capacitors 22, the package structure 23 is connected to the second side surface of the first circuit board, and the package structure 23 can further fix the capacitors 22 on the first circuit board to prevent the capacitors 22 from falling off under the action of external force. Since the plastic material is an insulating material, the plurality of capacitors 22 can be prevented from being electrically conductive.
Then, arranging a conductive structure on the packaging structure to obtain the circuit board device; the second pole plate is electrically connected with the first circuit board through the conductive structure.
In order to realize the electrical connection between the second plate 222 and the first circuit board, the conducting channel 24 is etched on the package structure 23 of the first circuit board, the conducting channel 24 is respectively connected with the second plate 222 and the first circuit board, and the conducting channel 24 can provide a space for the electrical connection between the second plate 222 and the circuit board 20, so as to avoid the circuit arrangement of the circuit board device from being too complex, and achieve the purposes of being beautiful and saving cost.
In practical applications, one end of the conduction channel 24 is communicated with the second electrode plate 222, and the other end of the conduction channel 24 is communicated with the first circuit board, so that the second electrode plate 222 can be electrically connected with the first circuit board.
In the embodiment of the present invention, the conducting channel 24 is etched on the package structure by using a low-cost and high-reliability etching technique, the conducting channel 24 is communicated with the second electrode plate 222 and the first circuit board, the conducting channel 24 improves the spatial support for the electrical connection between the second electrode plate 222 and the functional device 21, and the circuit arrangement of the circuit board device is prevented from being too complicated, thereby achieving the purposes of beautiful appearance and cost saving.
Finally, arranging a conductive structure in the conduction channel to obtain the circuit board device; the conductive structure is connected with the second polar plate and the first circuit board respectively.
The conducting channel is internally provided with a conducting structure 25, the conducting structure 25 is respectively connected with the second pole plate 222 and the first circuit board, and the conducting structure 25 plays a role in conducting current between the second pole plate 222 and the first circuit board. Specifically, the conductive structure 25 may be connected to the second side of the first circuit board, and may also be connected to the first side of the first circuit board, wherein when the conductive structure 25 is connected to the first side of the first circuit board, the second electrode plate 222 may be connected to the functional device 21 through a connection line or a pre-laid conductive medium, and finally, the second electrode plate 222 is electrically connected to the functional device 21.
In practical application, one pole of the functional device 21 close to the capacitor 22 is communicated with the first pole plate 221 of the capacitor 22 through a conducting medium, the second pole plate 222 of the capacitor 22 is communicated with the other pole of the functional device 21 through the conducting structure 25 to form a loop, the capacitor 22 can remove noise of the functional device 21 coupled to a power supply end, and stability of the functional device 21 connected to the power supply is improved.
Specifically, the conductive structure 25 may include: when the conductive structure 25 is made of conductive metal, such as copper, silver, etc., and the conductive metal is a conductive plating layer plated on the inner wall of the conduction channel, the conduction channel 24 can be filled with the conductive metal, so that the sectional area of the conductive structure 25 is increased, the conductive resistance is reduced, and the effect of saving power is achieved. When the conductive structure 25 is a wire, the cost can be saved, and at the same time, the conducting channel 24 can be set smaller to improve the strength of the package structure 23. When the conductive structure 25 is a conductive plating layer, the second plate 222 and the circuit board 20 are electrically connected, and the cost is saved. .
To sum up, the circuit board device processing method according to the embodiment of the present invention at least includes the following advantages:
in the circuit board apparatus according to the embodiment of the present invention, the functional device is connected to the first side of the circuit board, the plurality of capacitors are connected to the second side of the circuit board opposite to the first side, the plurality of capacitors are disposed in the projection region of the functional device in the circuit board, and the length direction of the plurality of capacitors is perpendicular to the second side of the circuit board, so that the area of the projection region occupied by the capacitors can be reduced, and therefore, more capacitors can be disposed in the projection region of the same size, so that under the condition that the volume of the functional device is reduced and the projection region of the functional device on the circuit board is relatively small, more capacitors can be disposed in the projection region, and therefore, the capacitors can better reduce the noise of the functional device coupled to the power source end, and improve the stability of the functional device accessing
In addition, in the embodiment of the invention, the first polar plate of the capacitor is connected to the second side of the first circuit board, so that the contact area between the first polar plate and the first circuit board can be increased while the area of the projection area occupied by the capacitor is reduced, the contact resistance is reduced, and the energy is saved.
It should be noted that, for simplicity of description, the method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the illustrated order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments of the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no particular act is required to implement the invention.
As for the method embodiment, since it is basically similar to the apparatus embodiment, the description is simple, and the relevant points can be referred to the partial description of the method embodiment.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The circuit board device, the processing method thereof and the mobile terminal provided by the invention are described in detail, a specific example is applied in the description to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A circuit board arrangement, comprising: the circuit board, the functional device and a plurality of capacitors; wherein,
the functional device is connected to the first side of the circuit board;
the capacitors are connected to a second side of the circuit board, the second side is opposite to the first side, the capacitors are arranged in a projection area of the functional device on the circuit board in a direction perpendicular to the circuit board, and the length direction of the capacitors is perpendicular to the circuit board.
2. The circuit board arrangement according to claim 1, wherein one end of the capacitor along the length direction is provided with a first plate, and the other end of the capacitor along the length direction is provided with a second plate;
the first polar plate is connected to the second side of the circuit board, and the second polar plate is far away from the second side of the circuit board and is electrically connected with the circuit board.
3. The circuit board arrangement according to claim 2, characterized in that the circuit board arrangement further comprises: the packaging structure covers the capacitors and is connected with the second side of the circuit board; wherein,
the packaging structure is provided with a conductive structure, and the second pole plate is connected with the circuit board through the conductive structure.
4. The circuit board device according to claim 3, wherein the package structure defines a conduction channel, and the conduction channel is provided with the conductive structure therein.
5. The circuit board arrangement according to claim 4, characterized in that the conductive structure is: conductive metal, wire or conductive plating plated on the inner wall of the conduction channel.
6. A method of processing a circuit board device, comprising:
connecting a functional device to a first side of a circuit board to obtain a first circuit board provided with the functional device;
connecting a plurality of capacitors to a second side of the first circuit board to obtain a circuit board device; the second side is opposite to the first side, the capacitor is arranged in a projection area of the functional device on the first circuit board in a direction perpendicular to the first circuit board, and the length direction of the capacitor is perpendicular to the first circuit board.
7. The method of claim 6, wherein the step of coupling a plurality of capacitors to the second side of the first circuit board to obtain a circuit board assembly comprises:
electrically connecting the first plates of the capacitors to the second side of the first circuit board;
electrically connecting second polar plates of the capacitors with the first circuit board to obtain the circuit board device; the first polar plate is arranged at one end of the capacitors along the length direction, the second polar plate is arranged at the other end of the capacitors along the length direction, and the second polar plate is far away from the second side of the first circuit board.
8. The method of claim 7, wherein said step of electrically connecting a second plate of a plurality of said capacitors to said first circuit board to obtain a circuit board assembly comprises:
carrying out plastic package molding on the second side surface of the first circuit board through plastic cement to obtain a packaging structure which is fixed on the second side surface and covers the capacitor;
arranging a conductive structure on the packaging structure to obtain the circuit board device; the second pole plate is electrically connected with the first circuit board through the conductive structure.
9. The method of claim 8, comprising:
etching a conduction channel on the packaging structure of the first circuit board, wherein the conduction channel is respectively connected with the second polar plate and the first circuit board;
and arranging a conductive structure in the conduction channel to obtain the circuit board device.
10. An electronic device, characterized in that it comprises a circuit board arrangement according to any one of claims 1 to 5.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911032915.XA CN110662352A (en) | 2019-10-28 | 2019-10-28 | Circuit board device, processing method thereof and mobile terminal |
| PCT/CN2020/113593 WO2021082734A1 (en) | 2019-10-28 | 2020-09-04 | Circuit board device and processing method thereof, and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911032915.XA CN110662352A (en) | 2019-10-28 | 2019-10-28 | Circuit board device, processing method thereof and mobile terminal |
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| Publication Number | Publication Date |
|---|---|
| CN110662352A true CN110662352A (en) | 2020-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911032915.XA Pending CN110662352A (en) | 2019-10-28 | 2019-10-28 | Circuit board device, processing method thereof and mobile terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110662352A (en) |
| WO (1) | WO2021082734A1 (en) |
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|---|---|---|---|---|
| WO2021082734A1 (en) * | 2019-10-28 | 2021-05-06 | 维沃移动通信有限公司 | Circuit board device and processing method thereof, and mobile terminal |
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| WO2021082734A1 (en) | 2021-05-06 |
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Application publication date: 20200107 |