CN110650556A - Electronic equipment component heating control system and control method - Google Patents
Electronic equipment component heating control system and control method Download PDFInfo
- Publication number
- CN110650556A CN110650556A CN201910821171.3A CN201910821171A CN110650556A CN 110650556 A CN110650556 A CN 110650556A CN 201910821171 A CN201910821171 A CN 201910821171A CN 110650556 A CN110650556 A CN 110650556A
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- Prior art keywords
- heating
- temperature
- circuit board
- electronic equipment
- heater
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- Pending
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 72
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000005485 electric heating Methods 0.000 claims abstract description 20
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
Landscapes
- Control Of Resistance Heating (AREA)
Abstract
The invention relates to the technical field of environmental temperature adaptability of electronic products, in particular to a heating control system for electronic equipment components, which comprises a circuit board and two electric heating plates provided with heaters, wherein the two electric heating plates are distributed on two sides of the circuit board in parallel; the bottom of the circuit board is provided with a sensor, the sensor is connected with a controller, the controller is connected with the electric heating plate, meanwhile, the controller is connected with a direct current power supply module, the direct current power supply module is connected with the heater, and then the direct current power supply module can supply power to the controller and the heater; the heating power requirement is small, the heating is fast, and the low-temperature adaptability problem of electronic equipment components is solved under the condition that the cost of the electronic equipment is not increased and the problems of circuit interference and the like caused by the traditional method are solved.
Description
Technical Field
The invention relates to the technical field of environmental temperature adaptability of electronic products, in particular to a heating control system and a heating control method for electronic equipment components.
Background
Along with the development of various fields of sea, land and air related to the electronic equipment carrying platform in a more profound direction, higher requirements, particularly low-temperature adaptability requirements, are put forward on the environmental temperature adaptability of electronic equipment components, some platforms already put forward the requirements of normal work in a low-temperature environment of minus 55 ℃, and even lower, and most industrial components cannot meet the requirements; in order to solve the problem of adaptability of the electronic equipment to the low-temperature environment, components with higher grade and higher price cost can be selected, and a method for actively heating and compensating the components can be adopted; the conventional temperature compensation method has two types:
firstly, a shell of the electronic equipment is heated, a film heater is adhered to the inner wall of a shell of the electronic equipment, most of heating power is dissipated to a low-temperature environment from the outer surface of the shell of the instrument, meanwhile, heat capacity of the shell of the instrument absorbs part of heat, and the rest can heat a circuit board, so that the heating efficiency is low and the heating power requirement is very high;
secondly, heating the key components, and welding resistance heaters around or at the bottom of the key components. The device is directly heated, the heating power requirement is low, the heating time is short, but great troubles are brought to the design of the circuit board of the electronic equipment, and the interference of the heating power supply of the heater to the components of the circuit board of the electronic equipment is also a problem which needs to be considered and solved.
The invention provides a heating control system and a heating control method for electronic equipment components, which have the advantages of low heating power requirement and quick heating, and can solve the problem of low-temperature adaptability of the electronic equipment components under the condition of not increasing the cost of the electronic equipment and solving the problems of circuit interference and the like brought by the traditional method.
Disclosure of Invention
The present invention is directed to a system and a method for controlling heating of electronic device components, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a heating control system for electronic equipment components comprises a circuit board and two electric heating plates provided with heaters, wherein the two electric heating plates are distributed on two sides of the circuit board in parallel;
the bottom of the circuit board is provided with a sensor, the sensor is connected with a controller, the controller is connected with the electric heating plate, meanwhile, the controller is connected with a direct current power supply module, the direct current power supply module is connected with the heater, and then the direct current power supply module can supply power to the controller and the heater;
furthermore, the heating power requirement is low, the heating is fast, and the low-temperature adaptability problem of electronic equipment components is solved under the condition that the cost of the electronic equipment is not increased and the problems of circuit interference and the like caused by the traditional method are solved.
The further scheme of the invention is as follows: the circuit board and the sensor are fixed in a sticking way.
The invention further comprises the following scheme: the heater is a film heater and is adhered to the electric heating plate.
The invention further comprises the following scheme: the heater is adhered to the electric heating plate through silicon rubber glue.
The invention further comprises the following scheme: the silicon rubber is GD414 silicon rubber.
The invention further comprises the following scheme: the thickness of the heater is not more than 2 mm.
Another object of the present invention is to provide a method for controlling a system for controlling heating of components of electronic devices, including the steps of:
the temperature of the circuit board is collected in real time by using the sensor, the collected temperature is fed back to the controller, the controller compares the collected temperature with a set heating threshold temperature, if the temperature is not higher than the heating threshold temperature, the heater is controlled to start heating, the temperature of the working environment of the circuit board is raised, meanwhile, the controller compares the temperature of the circuit board collected in real time with the set heating stop threshold temperature, and if the temperature exceeds the heating stop threshold temperature, the heater is controlled to stop heating.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention has small heating power requirement and quick heating, and solves the problem of low-temperature adaptability of components of the electronic equipment under the condition of not increasing the cost of the electronic equipment and solving the problems of circuit interference and the like brought by the traditional method;
2. when the temperature is higher than a certain temperature, the heating is stopped, the low-temperature adaptability problem of the electronic equipment components is solved under the conditions that the cost of the electronic equipment is not increased, the problems of circuit interference and the like caused by the traditional method are eliminated, the upper heating limit is restricted by the method, and the energy is saved.
Drawings
Fig. 1 is a schematic structural diagram of a component heating control system of an electronic device according to the present invention.
In the figure: 1-a circuit board; 2-electric heating plate; 3-a direct current power supply module; 4-a sensor; 5-a controller; 6-a heater.
Detailed Description
The technical solution of the present invention will be described in further detail with reference to specific embodiments.
Along with the development of various fields of sea, land and air related to the electronic equipment carrying platform in a more profound direction, higher requirements, particularly low-temperature adaptability requirements, are put forward on the environmental temperature adaptability of electronic equipment components, some platforms already put forward the requirements of normal work in a low-temperature environment of minus 55 ℃, and even lower, and most industrial components cannot meet the requirements; in order to solve the problem of adaptability of the electronic equipment to the low-temperature environment, components with higher grade and higher price cost can be selected, and a method for actively heating and compensating the components can be adopted; the conventional temperature compensation method has two types:
firstly, a shell of the electronic equipment is heated, a film heater is adhered to the inner wall of a shell of the electronic equipment, most of heating power is dissipated to a low-temperature environment from the outer surface of the shell of the instrument, meanwhile, heat capacity of the shell of the instrument absorbs part of heat, and the rest can heat a circuit board, so that the heating efficiency is low and the heating power requirement is very high;
secondly, heating the key components, and welding resistance heaters around or at the bottom of the key components. The device is directly heated, the heating power requirement is low, the heating time is short, but great troubles are brought to the design of the circuit board of the electronic equipment, and the interference of the heating power supply of the heater to the components of the circuit board of the electronic equipment is also a problem which needs to be considered and solved.
The invention provides a heating control system and a heating control method for electronic equipment components, which have the advantages of low heating power requirement and quick heating, and can solve the problem of low-temperature adaptability of the electronic equipment components under the condition of not increasing the cost of the electronic equipment and solving the problems of circuit interference and the like brought by the traditional method, and please refer to fig. 1 and embodiments 1-3.
Example 1
The utility model provides an electronic equipment components and parts control system that heats, this system includes circuit board 1 to and install electric heating plate 2 of heater 6, electric heating plate 2 is provided with two, and is parallel distribution and is in the both sides of circuit board 1.
Wherein, 1 bottom of circuit board is equipped with sensor 4, and is connected with controller 5 on the sensor 4, and controller 5 is connected with electric heating board 2, is connected with DC power supply module 3 on the simultaneous control ware 5, and DC power supply module 3 is connected with heater 6, and then DC power supply module 3 can supply power for controller 5, heater 6.
Furthermore, the heating power requirement is low, the heating is fast, and the low-temperature adaptability problem of electronic equipment components is solved under the condition that the cost of the electronic equipment is not increased and the problems of circuit interference and the like caused by the traditional method are solved.
Example 2
The embodiment of the invention provides a heating control system for electronic equipment components, which is further defined on the basis of embodiment 1.
As shown in fig. 1, the circuit board 1 and the sensor 4 are fixed by adhesion.
The heater 6 is a film heater and is adhered to the electric heating plate 2.
Further, the heater 6 is attached to the electric heating plate 2 by silicone rubber.
Preferably, the silicone rubber is GD414 silicone rubber.
Further, the heater 6 has a thickness of not more than 2 mm.
Example 3
The present embodiment is further defined on the basis of embodiments 1 and 2.
A control method of an electronic equipment component heating control system comprises the following steps:
the temperature of the circuit board 1 is collected in real time by the sensor 4, the collected temperature is fed back to the controller 5, the collected temperature is compared with a set heating threshold temperature by the controller 5, if the temperature does not exceed the heating threshold temperature, the heater 6 is controlled to start heating, the temperature of the working environment of the circuit board 1 rises, meanwhile, the temperature of the circuit board 1 collected in real time is compared with the set heating stop threshold temperature by the controller 5, and if the temperature exceeds the heating stop threshold temperature, the heater 6 is controlled to stop heating.
Furthermore, when the temperature is higher than a certain temperature, the heating is stopped, the low-temperature adaptability problem of the electronic equipment components is solved under the conditions that the cost of the electronic equipment is not increased, the problems of circuit interference and the like caused by the traditional method are eliminated, the upper heating limit is restricted, and the energy is saved.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
While the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (7)
1. The electronic equipment component heating control system is characterized by comprising a circuit board (1) and two electric heating plates (2) provided with heaters (6), wherein the two electric heating plates (2) are distributed on two sides of the circuit board (1) in parallel;
the electric heating device is characterized in that a sensor (4) is arranged at the bottom of the circuit board (1), a controller (5) is connected onto the sensor (4), the controller (5) is connected with the electric heating plate (2), a direct current power supply module (3) is connected onto the controller (5), and the direct current power supply module (3) is connected with the heater (6).
2. The system for controlling heating of the electronic device components as claimed in claim 1, wherein the circuit board (1) and the sensor (4) are fixed by adhesion.
3. The system for controlling the heating of the electronic equipment components as claimed in claim 1, wherein the heater (6) is a thin film heater and is adhered to the electric heating plate (2).
4. The system for controlling the heating of the electronic equipment components as claimed in claim 3, wherein the heater (6) is adhered to the electric heating plate (2) by silicone rubber.
5. The system for controlling heating of electronic device components as claimed in claim 4, wherein the silicone rubber is GD414 silicone rubber.
6. The electronic device component heating control system according to claim 1, wherein the thickness of the heater (6) is not more than 2 mm.
7. A control method of an electronic device component heating control system according to any one of claims 1 to 6, characterized by comprising the steps of:
the temperature of the circuit board (1) is collected in real time by the aid of the sensor (4), the collected temperature is fed back to the controller (5), the collected temperature is compared with a set heating threshold temperature by the controller (5), if the temperature does not exceed the heating threshold temperature, the heater (6) is controlled to start heating, the temperature of the working environment of the circuit board (1) rises, meanwhile, the temperature of the circuit board (1) is collected in real time by the controller (5) and the set heating stopping threshold temperature are compared, and if the temperature exceeds the heating stopping threshold temperature, the heater (6) is controlled to stop heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910821171.3A CN110650556A (en) | 2019-09-02 | 2019-09-02 | Electronic equipment component heating control system and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910821171.3A CN110650556A (en) | 2019-09-02 | 2019-09-02 | Electronic equipment component heating control system and control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110650556A true CN110650556A (en) | 2020-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910821171.3A Pending CN110650556A (en) | 2019-09-02 | 2019-09-02 | Electronic equipment component heating control system and control method |
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| Country | Link |
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| CN (1) | CN110650556A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113631013A (en) * | 2021-06-22 | 2021-11-09 | 成都凯天电子股份有限公司 | High-reliability aviation airborne electronic system capable of working at ultralow temperature |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5582757A (en) * | 1993-10-13 | 1996-12-10 | Kabushiki Kaisha Dairin Shoji | Sheet-like electric heater and a sheet-like thermal sensing element using carbon fiber mixed paper |
| CN1633230A (en) * | 2003-12-24 | 2005-06-29 | 华为技术有限公司 | a heating system |
| CN201557323U (en) * | 2009-11-26 | 2010-08-18 | 杭州华三通信技术有限公司 | Structure for heating devices on PCB |
| CN204206601U (en) * | 2014-11-26 | 2015-03-11 | 四川威特龙消防设备有限公司 | A kind of new type low temperature controller |
-
2019
- 2019-09-02 CN CN201910821171.3A patent/CN110650556A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5582757A (en) * | 1993-10-13 | 1996-12-10 | Kabushiki Kaisha Dairin Shoji | Sheet-like electric heater and a sheet-like thermal sensing element using carbon fiber mixed paper |
| CN1633230A (en) * | 2003-12-24 | 2005-06-29 | 华为技术有限公司 | a heating system |
| CN201557323U (en) * | 2009-11-26 | 2010-08-18 | 杭州华三通信技术有限公司 | Structure for heating devices on PCB |
| CN204206601U (en) * | 2014-11-26 | 2015-03-11 | 四川威特龙消防设备有限公司 | A kind of new type low temperature controller |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113631013A (en) * | 2021-06-22 | 2021-11-09 | 成都凯天电子股份有限公司 | High-reliability aviation airborne electronic system capable of working at ultralow temperature |
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Application publication date: 20200103 |