CN110628350A - Protective film for protecting workpieces in a processing state and use thereof - Google Patents
Protective film for protecting workpieces in a processing state and use thereof Download PDFInfo
- Publication number
- CN110628350A CN110628350A CN201810659122.XA CN201810659122A CN110628350A CN 110628350 A CN110628350 A CN 110628350A CN 201810659122 A CN201810659122 A CN 201810659122A CN 110628350 A CN110628350 A CN 110628350A
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- China
- Prior art keywords
- layer
- protective film
- adhesive layer
- workpiece
- parts
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- 230000001681 protective effect Effects 0.000 title claims abstract description 51
- 239000010410 layer Substances 0.000 claims abstract description 75
- -1 polypropylene Polymers 0.000 claims abstract description 54
- 239000012790 adhesive layer Substances 0.000 claims abstract description 44
- 239000004698 Polyethylene Substances 0.000 claims abstract description 23
- 229920000573 polyethylene Polymers 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 238000000227 grinding Methods 0.000 claims abstract description 13
- 238000010894 electron beam technology Methods 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 11
- 239000004743 Polypropylene Substances 0.000 claims abstract description 10
- 229920001155 polypropylene Polymers 0.000 claims abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 238000004132 cross linking Methods 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 239000010959 steel Substances 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims abstract description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000004925 Acrylic resin Substances 0.000 claims description 8
- 229920000178 Acrylic resin Polymers 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 7
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- 125000005907 alkyl ester group Chemical group 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229920001519 homopolymer Polymers 0.000 claims description 4
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 claims description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000013032 Hydrocarbon resin Substances 0.000 claims description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000003851 corona treatment Methods 0.000 claims description 3
- 229920006270 hydrocarbon resin Polymers 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 229940065472 octyl acrylate Drugs 0.000 claims description 3
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 150000003505 terpenes Chemical class 0.000 claims description 3
- 235000007586 terpenes Nutrition 0.000 claims description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001684 low density polyethylene Polymers 0.000 claims description 2
- 239000004702 low-density polyethylene Substances 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- 238000003756 stirring Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a protective film for protecting a workpiece in a processing state, which is adhered to the surface of the workpiece, and sequentially comprises the following components: the substrate layer comprises a polypropylene layer and a polyethylene layer; an adhesive layer, the polyethylene layer of the substrate layer disposed adjacent to the adhesive layer, the adhesive comprising a vinyl siloxane and an acrylate; and a release layer comprising a release surface disposed adjacent to the adhesive layer; after the protective film is formed, the vinyl siloxane and the acrylate in the adhesive layer are subjected to crosslinking reaction through electron beam irradiation treatment. The high-temperature resistant protective film can be used for the process protection of high-precision workpieces such as the grinding of semiconductor wafers, the cutting of glass screens or organic glass screen products, the cutting and processing of steel plates and the like.
Description
Technical Field
The invention relates to the technical field of protective films, in particular to a protective film for protecting a workpiece in a processing state and application thereof.
Background
In the manufacturing process of metal or nonmetal precision workpieces, the workpieces are often scratched or polluted by substances such as grinding fluid and cutting scraps during the processes of grinding, thinning, CNC cutting and the like, so that the problems of poor appearance quality, warping, poor surface precision and the like are caused.
Therefore, a protective film is needed which has high cleanliness and extremely low content of ionic impurities, has excellent dimensional stability, moderate adhesiveness and thermal stability, can be well adhered to a workpiece in grinding and thinning processing, and can prevent a glue layer from being separated at high temperature generated by grinding. Meanwhile, the protective film also has the function of protecting the surface of the workpiece from being polluted by other impurities; after processing, the adhesiveness of the adhesive layer is not changed, the protective film is easy to peel off from the workpiece, the protective film does not shrink, and the workpiece is prevented from warping and deforming along with the protective film.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a protective film for protecting a workpiece in a processing state, wherein the adhesive layer can form a net structure, improve the heat resistance and aging resistance, and enhance the chemical stability and solvent resistance.
In order to achieve the above object, the protective film for protecting a workpiece in a processed state of the present invention and its applications are as follows:
the invention provides a protective film for protecting a workpiece in a processing state, which is removably adhered to the surface of the workpiece, and is characterized in that the protective film sequentially comprises:
the substrate layer comprises a polypropylene layer and a polyethylene layer;
an adhesive layer, the polyethylene layer of the substrate layer disposed adjacent to the adhesive layer, the adhesive comprising a vinyl siloxane and an acrylate; and
a release layer comprising a release surface disposed adjacent to the adhesive layer;
after the protective film is formed, the vinyl siloxane and the acrylate in the adhesive layer are subjected to crosslinking reaction through electron beam irradiation treatment.
Preferably, the adhesive layer comprises the following raw materials in parts by mass: 1-100 parts of acrylic resin, 1-100 parts of ethyl acetate, 1-50 parts of acrylic acid, 0.01-50 parts of curing agent, 0.01-30 parts of curing accelerator, 1-100 parts of vinyl siloxane and 1-20 parts of tackifying resin
More preferably, the acrylic resin is homopolymerized acrylic ester or copolymerized C1～C20One or more alkyl esters, said homopolymeric acrylates comprising methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, or methyl substituents thereof, said copolymeric C1～C20The alkyl ester comprises alkyl acrylate or alkyl methacrylate and a copolymerizable monomer;
the tackifying resin is one or more of hydrocarbon resin, coumarone-indene resin, rosin resin and terpene resin.
Preferably, the release layer comprises a polyethylene terephthalate layer and a silicon release agent layer, and the silicon release agent layer is the release surface.
Preferably, the adhesive layer is coated on the release surface of the release layer, and is compounded with the substrate layer after the solvent in the adhesive is completely volatilized, and the compounding surface of the substrate layer is the polyethylene layer.
More preferably, the composite surface of the substrate layer is subjected to surface treatment before the adhesive layer is compounded, and the surface treatment comprises corona treatment and/or chemical treatment.
Preferably, the electron beam irradiation dose is 1-300 kGy.
Preferably, the thickness of the adhesive layer is 10-50 μm, the thickness of the polypropylene layer is 1-100 μm, the thickness of the polyethylene layer is 1-100 μm, the total thickness of the substrate layer is 1-200 μm, and the thickness of the release layer is 1-80 μm.
The invention also provides application of the protective film for protecting the workpiece in a processing state in grinding of semiconductor wafers, cutting of glass screen products and cutting of steel plates.
The protective film for protecting the workpiece in a processing state is adopted, the base material layer is a transparent or white matte plastic film, the adhesive layer is coated on the polyethylene layer by a transfer coating method, and the adhesive layer is subjected to irradiation crosslinking technology, high-energy electron beams emitted by an electron accelerator are utilized to ionize and excite high molecular chains, so that vinyl siloxane and acrylate are subjected to crosslinking reaction to form a net structure, the heat resistance and the aging resistance are improved, various performances such as chemical resistance, solvent resistance and the like are enhanced, the molecular weight is improved, and the residual gum amount is reduced; meanwhile, after the adhesive layer is subjected to high temperature generated in processing of the adherend, the generated shrinkage deformation does not influence the size of the substrate, and the adherend is prevented from generating dimensional change along with the shrinkage of the substrate film.
The protective film has higher cleanliness, extremely low ionic impurity content, excellent dimensional stability, moderate adhesiveness and thermal stability, can be well adhered to a workpiece in grinding and thinning processing, and can avoid the phenomenon of glue line separation at high temperature generated by grinding; meanwhile, the surface of the workpiece is protected from being polluted by other impurities; the protective film has better thermal stability of the adhesive layer, the size of the base material is not influenced by the shrinkage generated after high temperature, the adhered workpiece is prevented from warping and deforming along with the protective film, the adhesiveness of the adhesive layer is not changed after processing, and the protective film is easy to peel off from the workpiece.
The high-temperature-resistant protective film can be used for the process protection of high-precision workpieces such as grinding of semiconductor wafers, cutting of glass screens or organic glass screen products, cutting and processing of steel plates and the like, is temporarily protected in the manufacturing process of workpieces (such as mobile phone screens, semiconductor wafers, steel plates and the like), and can be torn off after the processing is finished.
Drawings
Fig. 1 is a schematic structural view of a protective film for protecting a workpiece in a processing state according to the present invention.
Reference numerals
1 Release layer
2 adhesive layer
3 polyethylene layer
4 Polypropylene layer
Detailed Description
In order to more clearly describe the technical contents of the present invention, the following further description is given in conjunction with specific embodiments.
As shown in fig. 1, there is shown an embodiment of the present invention of a protective film for protecting a workpiece in a processing state, the protective film being removably adhered to a surface of the workpiece, the protective film comprising in sequence:
the substrate layer comprises a polypropylene layer 4 and a polyethylene layer 3;
an adhesive layer 2, a polyethylene layer in the substrate layer being disposed adjacent to the adhesive layer, the adhesive comprising a vinyl siloxane and an acrylate; and
a release layer 1 comprising a release surface disposed adjacent to said adhesive layer;
after the protective film is formed, the vinyl siloxane and the acrylate in the adhesive layer are subjected to crosslinking reaction through electron beam irradiation treatment;
the protective film is subjected to electron beam irradiation treatment after film formation.
In a preferred embodiment, the polyethylene layer is a low density polyethylene layer.
In a preferred embodiment, the adhesive layer comprises the following raw materials in parts by mass: 1-100 parts of acrylic resin, 1-100 parts of ethyl acetate, 1-50 parts of acrylic acid, 0.01-50 parts of curing agent, 0.01-30 parts of curing accelerator, 1-100 parts of vinyl siloxane and 1-20 parts of tackifying resin
In a preferred embodiment, the acrylic resin is a homopolymeric acrylate or a copolymeric C1～C20One or more alkyl esters, said homopolymeric acrylates comprising methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, or methyl substituents thereof, said copolymeric C1～C20The alkyl ester comprises alkyl acrylate or alkyl methacrylate and a copolymerizable monomer;
the tackifying resin is one or more of hydrocarbon resin, coumarone-indene resin, rosin resin and terpene resin.
In a preferred embodiment, the release layer comprises a polyethylene terephthalate layer and a silicon release agent layer, and the silicon release agent layer is the release surface.
In a preferred embodiment, the adhesive layer is coated on the release surface of the release layer, and is then combined with the substrate layer after the solvent in the adhesive is completely volatilized, and the combination surface of the substrate layer is the polyethylene layer.
In a preferred embodiment, the laminating surface of the substrate layer is subjected to surface treatment before the laminating of the adhesive layer, and the surface treatment comprises corona treatment and/or chemical treatment.
In a preferred embodiment, the electron beam irradiation dose is 1 to 300 kGy.
In a preferred embodiment, the thickness of the adhesive layer is 10 to 50 μm, the thickness of the polypropylene layer is 1 to 100 μm, the thickness of the polyethylene layer is 1 to 100 μm, the total thickness of the substrate layer is 1 to 200 μm, and the thickness of the release layer is 1 to 80 μm.
Example 1
The raw materials are calculated according to the parts by weight.
Adding 50 parts of acrylic resin, 2 parts of acrylic acid and 90 parts of ethyl acetate into a stirring kettle, fully stirring uniformly, then adding 40 parts of vinyl siloxane and 3 parts of tackifying resin, fully stirring, then adding 0.5 part of curing agent, 0.01 part of curing accelerator and 10 parts of ethyl acetate, and fully stirring uniformly.
And (3) coating the stirred glue on the release surface of the release film by using a scraper type coating machine, and entering a hot drying tunnel until the solvent is completely volatilized. Meanwhile, the polyethylene surface of the polypropylene/polyethylene composite film is well corona, compounded with a release film coated with an adhesive layer, and rolled.
And then the wound film passes through electron beam irradiation equipment, and the irradiation dose is 50 kGy. And (3) rolling, placing in a drying room at 60 ℃, taking out after 24 hours, cutting to the required width, and dividing into rolls to obtain the high-temperature-resistant multilayer adhesive protective film.
Example 2
The raw materials are calculated according to the parts by weight.
Adding 30 parts of acrylic resin, 1 part of acrylic acid and 90 parts of ethyl acetate into a stirring kettle, fully stirring uniformly, then adding 30 parts of vinyl siloxane and 3 parts of tackifying resin, fully stirring, then adding 0.3 part of curing agent, 0.01 part of curing accelerator and 10 parts of ethyl acetate, and fully stirring uniformly.
And (3) coating the stirred glue on the release surface of the release film by using a scraper type coating machine, and entering a hot drying tunnel until the solvent is completely volatilized. Meanwhile, the polyethylene surface of the polypropylene/polyethylene composite film is well corona, compounded with a release film coated with an adhesive layer, and rolled.
And then the wound film passes through electron beam irradiation equipment, and the irradiation dose is 40 kGy. And (3) rolling, placing in a drying room at 60 ℃, taking out after 24 hours, cutting to the required width, and dividing into rolls to obtain the high-temperature-resistant multilayer adhesive protective film.
The protective film for protecting the workpiece in a processing state is adopted, the base material layer is a transparent or white matte plastic film, the adhesive layer is coated on the polyethylene layer by a transfer coating method, and the adhesive layer is subjected to irradiation crosslinking technology, high-energy electron beams emitted by an electron accelerator are utilized to ionize and excite high molecular chains, so that vinyl siloxane and acrylate are subjected to crosslinking reaction to form a net structure, the heat resistance and the aging resistance are improved, various performances such as chemical resistance, solvent resistance and the like are enhanced, the molecular weight is improved, and the residual gum amount is reduced; meanwhile, after the adhesive layer is subjected to high temperature generated in processing of the adherend, the generated shrinkage deformation does not influence the size of the substrate, and the adherend is prevented from generating dimensional change along with the shrinkage of the substrate film.
The protective film has higher cleanliness, extremely low ionic impurity content, excellent dimensional stability, moderate adhesiveness and thermal stability, can be well adhered to a workpiece in grinding and thinning processing, and can avoid the phenomenon of glue line separation at high temperature generated by grinding; meanwhile, the surface of the workpiece is protected from being polluted by other impurities; the protective film has better thermal stability of the adhesive layer, the size of the base material is not influenced by the shrinkage generated after high temperature, the adhered workpiece is prevented from warping and deforming along with the protective film, the adhesiveness of the adhesive layer is not changed after processing, and the protective film is easy to peel off from the workpiece.
The high-temperature-resistant protective film can be used for the process protection of high-precision workpieces such as grinding of semiconductor wafers, cutting of glass screens or organic glass screen products, cutting and processing of steel plates and the like, is temporarily protected in the manufacturing process of workpieces (such as mobile phone screens, semiconductor wafers, steel plates and the like), and can be torn off after the processing is finished.
In this specification, the invention has been described with reference to specific embodiments thereof. It will, however, be evident that various modifications and changes may be made thereto without departing from the broader spirit and scope of the invention. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
Claims (10)
1. A protective film for protecting a workpiece in a processing state, said protective film being removably adhered to a surface of said workpiece, said protective film comprising in sequence:
the substrate layer comprises a polypropylene layer and a polyethylene layer;
an adhesive layer, the polyethylene layer of the substrate layer disposed adjacent to the adhesive layer, the adhesive comprising a vinyl siloxane and an acrylate; and
a release layer comprising a release surface disposed adjacent to the adhesive layer;
after the protective film is formed, the vinyl siloxane and the acrylate in the adhesive layer are subjected to crosslinking reaction through electron beam irradiation treatment.
2. The protective film for protecting a workpiece in a processing state as claimed in claim 1, wherein said polyethylene layer is a low density polyethylene layer.
3. A protective film for protecting a workpiece in a processed state as defined in claim 1, wherein said adhesive layer comprises the following raw materials in parts by mass: 1-100 parts of acrylic resin, 1-100 parts of ethyl acetate, 1-50 parts of acrylic acid, 0.01-50 parts of curing agent, 0.01-30 parts of curing accelerator, 1-100 parts of vinyl siloxane and 1-20 parts of tackifying resin
4. A protective film for protecting a workpiece in a processed state according to claim 3,
the acrylic resin is homopolymerized acrylic ester or copolymerized C1～C20One or more alkyl esters, said homopolymeric acrylates comprising methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, or methyl substituents thereof, said copolymeric C1～C20The alkyl ester comprises alkyl acrylate or alkyl methacrylate and a copolymerizable monomer;
the tackifying resin is one or more of hydrocarbon resin, coumarone-indene resin, rosin resin and terpene resin.
5. The protective film according to claim 1, wherein the release layer comprises a polyethylene terephthalate layer and a silicon release agent layer, and the silicon release agent layer is the release surface.
6. The protective film according to claim 1, wherein the adhesive layer is coated on the release surface of the release layer, and the adhesive layer is combined with the substrate layer after the solvent in the adhesive is completely volatilized, and the combination surface of the substrate layer is the polyethylene layer.
7. The protective film according to claim 6, wherein the lamination surface of the base material layer is subjected to a surface treatment before being laminated with the adhesive layer, and the surface treatment comprises a corona treatment and/or a chemical treatment.
8. The protective film for protecting a workpiece in a processing state according to claim 1, wherein the irradiation dose of electron beam is 1 to 300 kGy.
9. The protective film according to claim 1, wherein the adhesive layer has a thickness of 10 to 50 μm, the polypropylene layer has a thickness of 1 to 100 μm, the polyethylene layer has a thickness of 1 to 100 μm, the substrate layer has a total thickness of 1 to 200 μm, and the release layer has a thickness of 1 to 80 μm.
10. Use of the protective film according to any one of claims 1 to 9 for protecting a workpiece in a processed state in grinding of semiconductor wafers, cutting of glass screen products, cutting processing of steel plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810659122.XA CN110628350A (en) | 2018-06-25 | 2018-06-25 | Protective film for protecting workpieces in a processing state and use thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810659122.XA CN110628350A (en) | 2018-06-25 | 2018-06-25 | Protective film for protecting workpieces in a processing state and use thereof |
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| CN110628350A true CN110628350A (en) | 2019-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810659122.XA Withdrawn CN110628350A (en) | 2018-06-25 | 2018-06-25 | Protective film for protecting workpieces in a processing state and use thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115353821A (en) * | 2021-10-28 | 2022-11-18 | 广东东立新材料科技股份有限公司 | High-temperature-resistant PE protective film easy to cut and preparation method thereof |
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| CN104263266A (en) * | 2010-12-06 | 2015-01-07 | 第一毛织株式会社 | Adhesive Film For Semiconductor Device |
| WO2015145807A1 (en) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | Protective film forming film, protective film forming sheet and work product manufacturing method |
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| US20110220295A1 (en) * | 2006-08-18 | 2011-09-15 | Tesa Se | Pressure-sensitive adhesive strip for moisture-insensitive peelable adhesive bonds |
| CN104263266A (en) * | 2010-12-06 | 2015-01-07 | 第一毛织株式会社 | Adhesive Film For Semiconductor Device |
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| WO2015145807A1 (en) * | 2014-03-24 | 2015-10-01 | リンテック株式会社 | Protective film forming film, protective film forming sheet and work product manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112029429A (en) * | 2020-08-07 | 2020-12-04 | 湖南尚鑫新材料科技有限公司 | Shock-absorbing protective film and preparation method thereof |
| CN115353821A (en) * | 2021-10-28 | 2022-11-18 | 广东东立新材料科技股份有限公司 | High-temperature-resistant PE protective film easy to cut and preparation method thereof |
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