CN110610911A - A Novel Three-Dimensional Uniform Distribution Manifold Microchannel - Google Patents

Abstract

The invention discloses a novel three-dimensional uniform distribution manifold microchannel, which relates to the technical field of heat dissipation and cooling of electronic components, including an orifice plate, a branched tube plate, a microchannel, a water storage area, a water injection hole, a water outlet channel, and a water inlet channel; The lower surface of the orifice plate is uniformly provided with water injection holes, and there is a certain space between the water injection holes and the orifice plate. There is a water outlet channel on the side of the orifice plate, and a water inlet channel on the top of the orifice plate. bottom. The invention adopts the inlet section effect and the header effect, shortens the flow length of the fluid in the microchannel, enhances the flow heat transfer, improves the temperature uniformity of the heat source surface, reduces the occurrence of hot spots, and enhances the heat dissipation capacity of the high heat flux surface, thereby improving the The stability of electronic components.

Description

A Novel Three-Dimensional Uniform Distribution Manifold Microchannel

technical field

The invention relates to the technical field of heat dissipation and cooling of electronic components, in particular to a novel three-dimensional uniform distribution manifold microchannel.

Background technique

At present, the global environment and energy problems are becoming more and more serious. How to greatly increase the effective utilization rate of coal, oil, natural gas and other non-renewable energy sources and reduce heat loss has become an urgent problem to be solved. At the same time, with the emergence of miniaturization technology, high-power integrated circuits have developed rapidly, and the cooling heat flux of electronic chips has exceeded the kW/cm ² order of magnitude. Excessively high temperatures will damage semiconductor nodes and circuit connection surfaces, increase resistance values, and even Formation of mechanical stress damage. As the temperature non-uniformity of electronic components increases, system reliability will decrease dramatically. The traditional convection and heat conduction cooling method can no longer meet the development needs of the new generation of integrated circuits, so more efficient chip cooling methods are urgently needed.

In conventional electronic cooling, the presence of thermal interface material between the chip and the remote heat sink increases the thermal resistance and thus makes it difficult to maintain the temperature of the chip surface within the safe operating range. As shown in Figure 1, recently, the significant heat transfer effect and heat transfer performance of efficient and compact microchannels have attracted widespread attention. Microchannels are generally defined as heat sinks with an equivalent size of less than 1 mm, and are widely used in electronic chip cooling. , air conditioning, aerospace, nuclear reactors and other fields. Embedded cooling with micro-channels etched on the back of the semiconductor substrate eliminates the multi-layer thermal resistance caused by traditional cooling thermal interface materials. Compared with traditional heat exchange devices, micro-channel heat sinks have higher heat transfer efficiency and more stable operation. , low manufacturing cost and long service life, as a way of heat exchange, it has broad development prospects.

In addition, a large number of previous studies have found that multi-terminal short channels have better heat transfer performance than single-section long channels, and the two-phase heat transfer has increased heat transfer uniformity compared with single-phase flow. As shown in Figure 2, considering that the flow boundary layer in the fluid inlet section is thinner and the heat transfer effect is better, in order to make full use of the inlet section effect and reduce the length of the flow section, a large number of manifold microchannels are used to eliminate high heat flow dissipation the goal of. The branched tube microchannel heat exchanger is composed of a branched tube sheet and a microchannel base. Alternate liquid replenishment flow channels and steam collection channels are arranged on the branch tube sheet, which are placed vertically on the microchannel base. The fluid flows from the branch tube sheet first The liquid supplements the channel to enter, flows down into the microchannel, is heated and evaporated to form steam, and then the steam flows out through the steam converging channel on the branch tube sheet. The branch tube microchannel heat exchanger has many excellent properties, such as high heat transfer coefficient, small pressure drop, vapor-liquid separation, etc., and has a broader application background in the field of microsystems, making more and more researchers turn their attention to In the research of flow heat transfer in branch tube microchannel, how to further innovate and optimize the structure of branch tube microchannel heat exchanger is a hot issue in this field.

However, the traditional microchannel and the traditional manifold microchannel also have the following problems:

1. Since the temperature of the fluid increases with the length of the flow channel, the temperature distribution uniformity of the traditional microchannel is poor, and there are hot spots, which affect the efficiency and service life of electronic components, and increase the cost of system maintenance and manufacturing;

2. Both the traditional microchannel and the traditional manifold microchannel have uneven fluid distribution, and the fluid flow into each channel is inconsistent, resulting in an imbalance of flow resistance, which eventually leads to excessive temperature at some points and uneven temperature distribution on the entire surface. Also affect the service life of electronic components;

3. The entrance arrangement of the traditional microchannel is parallel to the flow direction of the microchannel, which belongs to the one-dimensional flow problem; the entrance arrangement of the traditional manifold microchannel is perpendicular to the plane of the flow direction of the microchannel, which belongs to the two-dimensional flow problem; The uniformity of flow distribution caused some adverse effects.

Therefore, those skilled in the art are committed to developing a new type of three-dimensional uniform distribution manifold microchannel to solve the problems of uneven temperature distribution, uneven fluid distribution, and single dimension of the microchannel structure in the current chip heat dissipation and cooling technology, and to enhance flow and heat transfer. , Improve the temperature uniformity of the surface of the heat source, reduce the occurrence of hot spots, enhance the heat dissipation capacity of the high heat flux surface, and then improve the stability of electronic components.

Contents of the invention

In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is how to enhance flow heat transfer, improve the temperature uniformity of the surface of the heat source, reduce the occurrence of hot spots, and at the same time enhance the heat dissipation capacity of the surface with high heat flux density, thereby improving the performance of electronic components. Use stability.

In order to achieve the above object, the present invention provides a novel three-dimensional uniform distribution manifold microchannel, including an orifice plate, a branch tube plate, a microchannel, a water storage area, a water injection hole, a water outlet channel, and a water inlet channel; The surface is evenly provided with the water injection holes, the water storage area with a certain space between the water injection holes and the orifice plate, the water outlet channel is provided on the side of the orifice plate, and the water outlet channel is provided on the top of the orifice plate. The water inlet channel and the branch tube plate are arranged at the bottom of the orifice plate.

Further, the water injection hole, the water outlet channel, and the water inlet channel are all engraved on the orifice plate by laser etching, thereby forming the split-type branch tube plate.

Further, the water injection hole sequence and the water outlet channel sequence are alternately arranged at the upper end of the orifice plate.

Further, the microchannel is etched on the back of the silicon-based chip, using methods including wet etching and laser etching.

Further, the orifice plate is a flat plate, and the material includes a glass plate and a silicon substrate.

Further, the present invention is formed by bonding the branch tube plate and the chip engraved with the microchannel.

Further, the water inlet channel is used to inject cold liquid, the water outlet channel is used to discharge hot gas, and the liquid supply and exhaust channels are separated.

Further, the header effect is formed in the water storage area, so that the flow entering the water injection hole is evenly distributed, and the initial temperature is consistent.

Further, the branch tube plate is used to reduce the flow length of the fluid in the microchannel, and the flow resistance is reduced by utilizing the effect of the inlet section.

Furthermore, the present invention can be used in conjunction with the jet heat dissipation technology, based on the existing invention technology, to further realize the thermal management of high heating power electronic components with high efficiency and low consumption.

In a preferred embodiment of the present invention, the lower surface of the orifice plate is evenly provided with the water injection holes, and the water storage area with a certain space between the water injection holes and the orifice plate has added a third The multi-dimensional structure uses the header effect generated by the water storage area to replenish the microchannel in multiple dimensions and angles, so that the flow rate injected into the water injection hole is evenly distributed and the initial temperature is consistent, so that the flow entering the microchannel The fluid flow in the channel is uniform, and at the same time, the cold fluid with a lower initial temperature is continuously injected to keep the temperature in the microchannel at a lower level, so that the temperature uniformity of the surface of the heat source is greatly improved, the occurrence of hot spots is reduced, and the reliability of electronic components is improved. Use stability.

In another preferred embodiment of the present invention, the side of the orifice plate is provided with the water outlet channel, and the top of the orifice plate is provided with the water inlet channel to separate the water inlet channel from the water outlet channel, The flow channels of the inlet cold fluid and the outlet hot fluid do not interfere with each other, promote evaporation, reduce the flow resistance increase and heat exchange caused by the possible mixing of the two during the flow process, and use the two-phase heat exchange to increase temperature uniformity and improve the exchange rate. Thermal efficiency, reduced flow resistance. At the same time, the branch tube plate is arranged at the bottom of the orifice plate, effectively utilizing the inlet section effect, shortening the flow length of the fluid in the microchannel, avoiding the increase of the fluid temperature with the increase of the flow length, and reducing the The internal resistance of the flow channel reduces the pump work required by the system and enhances the heat dissipation capacity of the high heat flux surface.

The idea, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings, so as to fully understand the purpose, features and effects of the present invention.

Description of drawings

Fig. 1 is the traditional manifold structure schematic diagram of the novel three-dimensional uniform distribution manifold microchannel of a preferred embodiment of the present invention;

Fig. 2 is the traditional single straight structure schematic diagram of the novel three-dimensional uniform distribution manifold microchannel of a preferred embodiment of the present invention;

Fig. 3 is the schematic diagram of orifice plate splitting type bifurcated tube plate formed by the novel structure of the new three-dimensional uniform splitting manifold microchannel of a preferred embodiment of the present invention;

Fig. 4 is the microchannel schematic diagram of the novel structural composition of the novel three-dimensional uniform distribution manifold microchannel of a preferred embodiment of the present invention;

Fig. 5 is the assembly drawing of the novel structure of the novel three-dimensional uniform distribution manifold microchannel of a preferred embodiment of the present invention;

Fig. 6 is the schematic diagram of the external fluid flow direction of the novel structure of the novel three-dimensional uniform distribution manifold microchannel of a preferred embodiment of the present invention;

Fig. 7 is a schematic diagram of the fluid flow direction inside the unit of the novel structure of the new three-dimensional uniform distribution manifold microchannel according to a preferred embodiment of the present invention.

Among them, 1-orifice plate, 2-branch tube plate, 3-microchannel, 4-water storage area, 5-water injection hole, 6-water outlet channel, 7-water inlet channel.

Detailed ways

The following describes several preferred embodiments of the present invention with reference to the accompanying drawings, so as to make the technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned herein.

In the drawings, components with the same structure are denoted by the same numerals, and components with similar structures or functions are denoted by similar numerals. The size and thickness of each component shown in the drawings are shown arbitrarily, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of parts is appropriately exaggerated in some places in the drawings.

As shown in Figure 3, Figure 4, and Figure 5, a new three-dimensional uniform distribution manifold microchannel, including orifice plate 1, branch tube plate 2, microchannel 3, water storage area 4, water injection hole 5, water outlet channel 6, Water inlet channel 7. Among them, the lower surface of the orifice plate 1 is evenly provided with water injection holes 5, and there is a water storage area 4 with a certain space between the water injection holes 5 and the orifice plate 1. The side of the orifice plate 1 is provided with a water outlet channel 6. The water channel 7; the water injection hole 5, the water outlet channel 6, and the water inlet channel 7 are all engraved on the orifice plate 1 by laser etching, thereby forming a split-type branch tube plate 2, and the branch tube plate 2 is arranged at the bottom of the orifice plate 1; The sequence of holes 5 and the sequence of water outlet channels 6 are alternately arranged on the upper end of the orifice plate 1 . A plurality of microchannels 3 are etched on the back of the silicon-based chip by wet etching or laser etching, and the entire structural layout is formed by bonding the branched tube plate 2 of the orifice plate 1 and the chip engraved with the microchannels 3 .

As shown in Fig. 6 and Fig. 7, the present invention adopts the flow mode of "top in and side out", utilizes the effect of the inlet section, after the cold liquid flows into the water storage area 4 from the water inlet channel 7, a header effect is formed, and the cold liquid passes through the orifice plate 1 The diversion effect of the water injection holes 5 on the surface evenly flows into the microchannel 3, and the cold liquid exchanges heat with the silicon-based chip in the microchannel 3, and after the wall surface is heated and evaporated, it is discharged in a hot gas state through the water outlet channel 6 on the side of the orifice plate 1. Realize the heat exchange between cold liquid and electronic components.

As shown in Figure 5, the present invention uses the header effect to add a water storage area with a third-dimensional structure between the water injection hole 5 and the orifice plate 1, and replenish the microchannel 3 from multiple dimensions and angles, so that it can be injected into the water injection hole The flow distribution of 5 is uniform, and the initial temperature is consistent, so that the fluid flow entering the microchannel 3 is uniform. Due to the continuous injection of cold liquid with a low initial temperature, the temperature in the microchannel 3 is kept low, so that the temperature uniformity of the surface of the heat source is greatly improved, the occurrence of hot spots is reduced, and the use stability of electronic components is improved.

As shown in Figure 5, the present invention separates the water inlet channel 7 for injecting cold liquid and the water outlet channel 6 for discharging hot gas, so that the inlet flow channel and the outlet flow channel do not interfere with each other, promote evaporation, and reduce the flow of the two during the flow process. The increase of flow resistance and heat exchange caused by possible mixing, the use of two-phase heat exchange to increase temperature uniformity, improve heat exchange efficiency, and reduce flow resistance.

As shown in Figure 5, the present invention adopts the inlet section effect to form branch tube plate 2 by etching water injection hole 5, water outlet channel 6, and water inlet channel 7 on orifice plate 1, shortening the flow length of fluid in microchannel 3 , to avoid the increase of the fluid temperature with the increase of the flow length, and at the same time reduce the internal resistance of the flow channel, reduce the pump work required by the system, and enhance the heat dissipation capacity of the high heat flux surface.

The above descriptions are only preferred embodiments of the method of the present invention, and are not intended to limit the method of the present invention. In the actual implementation process, according to the material of the branched tube plate 2 and the microchannel 3 chip of the prepared orifice plate 1, the aperture diameter on the orifice plate 1 and the branched tube plate 2 and the size, arrangement distance, and number of the outlet channels 6, the microchannel 3 Different spacing, cross-sectional size and shape can obtain microchannel 3 heat exchangers with different heat transfer efficiency and temperature uniformity. The processing method, material type, size and shape of the new structure, the choice of cooling fluid, and the application environment of the microchannel 3 heat exchange equipment may all change or be replaced.

However, none of the changes in the above forms will fundamentally change the method of the present invention, that is, on the basis of the traditional manifold microchannel, the arrangement of the third-dimensional water storage area is increased to form a header effect, so that the fluid entering the microchannel The flow is as even as possible. Therefore, they are all considered to be within the scope defined by the claims of the present invention.

The preferred specific embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make many modifications and changes according to the concept of the present invention without creative efforts. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning or limited experiments on the basis of the prior art shall be within the scope of protection defined by the claims.

Claims (10)

1. A novel three-dimensional uniform flow distribution manifold type microchannel is characterized by comprising a pore plate, a manifold plate, a microchannel, a water storage area, a water injection hole, a water outlet channel and a water inlet channel; the orifice plate lower surface evenly is equipped with the water injection hole, shown water injection hole extremely leave certain space between the orifice plate the water storage area, the orifice plate side is equipped with exhalant canal, the orifice plate top is equipped with inhalant canal, branch manifold plate sets up the orifice plate bottom.

2. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the water injection holes, the water outlet channels, and the water inlet channels are all etched on the pore plate by laser etching, thereby forming the flow distribution manifold plate.

3. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the water injection hole sequence and the water outlet channel sequence are arranged alternately at the upper end of the orifice plate.

4. The novel three-dimensional uniform flow distribution manifold type microchannel of claim 1, wherein the microchannel is etched on the back surface of the silicon-based chip by a method comprising a wet etching method and a laser etching method.

5. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the orifice plate is a flat plate and the material comprises a glass plate and a silicon substrate.

6. The novel three-dimensional uniform flow distribution manifold type microchannel as claimed in claim 1, wherein the invention is formed by bonding the manifold plate and the chip engraved with the microchannel.

7. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the inlet channel is used for injecting cold liquid, and the outlet channel is used for discharging hot gas, and the inlet and outlet channels are separated.

8. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the header effect is formed in the impoundment area to provide uniform distribution of flow into the water injection holes and uniform initial temperature.

9. The novel three-dimensional uniform flow distribution manifold microchannel of claim 1, wherein the manifold plate is configured to reduce the flow length of the fluid in the microchannel, and to reduce the flow resistance by using the inlet section effect.

10. The novel three-dimensional uniform flow-dividing manifold type microchannel as claimed in claim 1, wherein the invention can be used in combination with a jet flow heat dissipation technology, and further realizes high-efficiency and low-consumption thermal management of high-heating-power electronic components based on the existing invention technology.