CN110602894B - Method for improving solder mask printing efficiency of circuit board - Google Patents
Method for improving solder mask printing efficiency of circuit board Download PDFInfo
- Publication number
- CN110602894B CN110602894B CN201910794711.3A CN201910794711A CN110602894B CN 110602894 B CN110602894 B CN 110602894B CN 201910794711 A CN201910794711 A CN 201910794711A CN 110602894 B CN110602894 B CN 110602894B
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- board
- screen printing
- screen
- pcb production
- silk
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000007639 printing Methods 0.000 title description 3
- 238000004519 manufacturing process Methods 0.000 claims abstract description 73
- 238000007650 screen-printing Methods 0.000 claims abstract description 65
- 238000000465 moulding Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 238000001035 drying Methods 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The invention relates to the technical field of printed circuit boards, in particular to a method for improving the solder mask efficiency of a circuit board in screen printing. According to the invention, the screen printing auxiliary plate provided with the supporting block is used in cooperation with the screen printing auxiliary plate when the solder resist ink is screen-printed on the second surface of the PCB production board, screen printing can be immediately carried out on the second surface after the solder resist ink is screen-printed on the first surface, standing waiting for drying of the solder resist ink on the first surface and pre-baking are not needed, so that the time for first standing and pre-baking can be saved, the production efficiency is improved, the hidden quality trouble caused by oxidation due to the fact that the copper surface on the second surface is exposed in humid and warm air can be avoided, meanwhile, the influence factors of pre-baking on the solder resist ink on the two surfaces can be consistent, the control of the subsequent developing process is facilitated, and the solder resist layer with higher precision can be developed.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a method for improving the solder mask efficiency of a circuit board in screen printing.
Background
In the field of circuit board production, circuit board resistance welding refers to coating resistance welding ink on circuits and base materials of which the surfaces are not required to be welded to form a protective layer for preventing bridging among the circuits during welding and serving as a protective layer for providing a permanent electrical environment and resisting chemical corrosion, and meanwhile, circuit board resistance welding also plays a role in beautifying the appearance. The circuit board solder mask is generally completed by screen printing and then by alignment exposure and development, and is also called screen printing solder mask. Except for a traditional single-sided board, the front side and the back side of a double-sided board and a multilayer board both need silk-screen solder resist, the flow of silk-screen solder resist generally includes that firstly, silk-screen solder resist ink is printed on one surface of a production board with the two sides being pretreated, the solder resist ink from the production board to the board surface is kept static and is pre-baked after being preliminarily dried, then, the silk-screen solder resist ink is printed on the other surface of the production board, the solder resist ink is kept static and is pre-baked again after being preliminarily dried until being on the surface, and then, a needed solder resist layer is formed on the production board through counterpoint exposure and development. According to the silk-screen solder mask flow, after silk-screen solder mask ink is printed on one surface, silk screen printing can be carried out on the other surface only through standing and pre-baking, in the standing and pre-baking processes, the copper surface of the other surface which is subjected to pretreatment is exposed in humid and warm air and is easy to oxidize, so that potential quality hazards can be introduced, and on the other hand, the standing and pre-baking processes can cause production process congestion and the production efficiency is low.
Disclosure of Invention
The invention provides a method for improving the silk-screen solder mask efficiency of a circuit board by only carrying out one-time standing and pre-baking treatment, aiming at the problems that the existing silk-screen solder mask method of the double-sided circuit board needs two standing and pre-baking procedures, has low efficiency and leads to potential quality hazards because the copper surface on one side of the non-silk-screen solder mask ink is easy to oxidize.
In order to achieve the purpose, the invention adopts the following technical scheme.
A method for improving the silk-screen solder mask efficiency of a circuit board is characterized in that solder mask ink is silk-screen printed on a PCB production board, and the PCB production board is divided into the following areas: a board edge area, a unit board area, and a molding line area for isolating each unit board area; positioning holes are respectively formed in the plate edge areas at the four corners of the PCB production plate; the method for silk-screen solder resist comprises the following steps:
s1, solder resist ink is printed on the first surface of the PCB production board in a silk-screen mode;
s2, placing the PCB production board on a screen printing auxiliary board, wherein the first surface of the PCB production board faces downwards and is opposite to the screen printing auxiliary board, and screen printing solder resist ink on the second surface of the PCB production board;
areas which correspond to the board edge areas, the unit board areas and the forming line areas of the PCB production board one by one are divided on the screen printing auxiliary board, and supporting blocks are arranged on the board edge areas at three corners of the screen printing auxiliary board and at positions corresponding to the positioning holes;
s3, standing the PCB production board until the solder resist ink on the first surface and the second surface is dry and does not flow, and then sequentially carrying out pre-baking, alignment exposure and development treatment on the PCB production board to complete the manufacture of the solder resist layer on the PCB production board.
Preferably, a plurality of supporting blocks are arranged on the forming line area of the silk-screen auxiliary plate.
More preferably, the interval between two adjacent supporting blocks on the forming line area is 40 mm.
Preferably, the board edge area of the PCB production board is provided with a routing vacancy, and the board edge area of the screen printing auxiliary board is provided with a supporting block at a position corresponding to the routing vacancy.
Preferably, the PCB production board is provided with non-metallized hole sites on the board edge area, and the screen printing auxiliary board is provided with support blocks on the board edge area and at positions corresponding to the non-metallized hole sites.
Preferably, the PCB production board is provided with a non-silk-screen printing position on a board edge area, and a support block is arranged on the board edge area of the silk-screen printing auxiliary board and at a position corresponding to the non-silk-screen printing position.
Preferably, the unit board area of the screen printing auxiliary board is provided with a supporting block, and the position of the supporting block is staggered with the position corresponding to the circuit arranged on the PCB production board.
Preferably, in the method for improving the solder mask printing efficiency of the circuit board, the solder mask ink layer formed by the solder mask ink covers the supporting block in the screen printing auxiliary board.
Preferably, the supporting block is adhered to the screen printing auxiliary plate through an adhesive tape.
Preferably, the supporting block is composed of a flat plate and a convex nail protruding from the surface of the flat plate.
Preferably, the silk screen auxiliary board is 20mm larger than the single side of the PCB production board.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the screen printing auxiliary plate provided with the supporting block is used in cooperation with the screen printing auxiliary plate when the solder resist ink is screen-printed on the second surface of the PCB production board, screen printing can be immediately carried out on the second surface after the solder resist ink is screen-printed on the first surface, standing waiting for drying of the solder resist ink on the first surface and pre-baking are not needed, so that the time for first standing and pre-baking can be saved, the production efficiency is improved, the hidden quality trouble caused by oxidation due to the fact that the copper surface on the second surface is exposed in humid and warm air can be avoided, meanwhile, the influence factors of pre-baking on the solder resist ink on the two surfaces can be consistent, the control of the subsequent developing process is facilitated, and the solder resist layer with higher precision can be developed. In addition, the support block of the silk screen auxiliary board is adhered to the silk screen auxiliary board through the sticky tape, the support block can be conveniently and quickly detached or adjusted to change the position, when the pressing condition exists between the circuit on the PCB production board and the support block, the support block and the circuit can be staggered by finely adjusting the position of the support block, so that the silk screen solder mask is efficiently and smoothly carried out, and the silk screen auxiliary board can be suitable for the production of circuit boards in different batches by adjusting and changing the position of the support block.
Drawings
FIG. 1 is a schematic view of a PCB production board according to an embodiment;
FIG. 2 is a schematic structural diagram of the silk-screen auxiliary plate in the embodiment;
fig. 3 is a schematic view of a support block having a bolt provided at a non-central position.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Examples
The embodiment provides a method for improving the silk-screen solder mask efficiency of a circuit board, wherein a PCB production board for silk-screen solder mask is shown in FIG. 1, and the PCB production board is divided into the following areas: a board edge area, a unit board area, and a molding line area for isolating each unit board area; and positioning holes are arranged in the plate edge areas at the four corners of the PCB production plate.
And manufacturing a screen printing auxiliary plate according to the size of the PCB production plate and the area division of the PCB production plate, wherein the screen printing auxiliary plate is 20mm larger than the single side of the PCB production plate. The screen printing auxiliary plate is divided into areas which correspond to the plate edge areas, the unit plate areas and the forming line areas of the PCB production plate one by one, supporting blocks are arranged on the plate edge areas at three corners of the screen printing auxiliary plate and at positions corresponding to the positioning holes, a plurality of supporting blocks are arranged on the forming line areas of the screen printing auxiliary plate, the distance between every two adjacent supporting blocks is 40mm, supporting blocks are arranged on the unit plate areas of the screen printing auxiliary plate, the positions of the supporting blocks are staggered with the positions corresponding to circuits arranged on the PCB production plate, and as shown in figure 2, when the PCB production plate is placed on the screen printing auxiliary plate, the supporting blocks are in direct contact with the PCB production plate. And coating a layer of solder resist ink on the supporting block and completely drying the solder resist ink to form a layer of solder resist ink layer on the supporting block. The supporting block is fixed on the screen printing auxiliary plate in a sticking mode through the sticky tape, and the supporting block can be directly taken down and then stuck and fixed again when the position of the supporting block needs to be adjusted and changed. The supporting block can be a block-shaped flat plate with the shape of a circle or an ellipse and the like, the shape is not limited to the shape shown in fig. 2, and the flat plate can be further provided with convex nails protruding out of the surface of the flat plate, namely the supporting block is composed of the flat plate and the convex nails, and when the PCB production board is placed on the screen printing auxiliary board, the convex nails on the supporting block are directly contacted with the PCB production board.
In other embodiments, if the screen printing solder-resist PCB production board is provided with positioning holes in the board edge area, the board edge area may further include non-metalized hole locations, routing vacant locations, non-screen printing locations, and the like, and the screen printing auxiliary board may be provided with supporting blocks at positions corresponding to these locations, that is, the supporting blocks are provided at positions corresponding to the routing vacant locations on the board edge area of the screen printing auxiliary board, and/or the supporting blocks are provided at positions corresponding to the non-metalized hole locations on the board edge area of the screen printing auxiliary board, and/or the supporting blocks are provided at positions corresponding to the non-screen printing locations on the board edge area of the screen printing auxiliary board.
The method for silk-screen printing of solder resist ink on the PCB production board comprises the following steps:
(1) carrying out board grinding pretreatment on the PCB production board according to a conventional method;
(1) solder resist ink is printed on the first surface of the PCB production board in a silk-screen mode;
(2) placing the PCB production board on a screen printing auxiliary board, enabling a first surface to face the screen printing auxiliary board downwards, and screen printing solder resist ink on a second surface of the PCB production board;
(3) standing the PCB production board until the solder resist ink on the first surface and the second surface is dry and does not flow;
(4) pre-baking the PCB production boards in sequence;
(5) and carrying out contraposition exposure on the PCB production board by using exposure equipment, then carrying out development treatment, and finishing the manufacture of the solder mask on the PCB production board.
In the screen printing auxiliary plate used in the method of the present invention, the support block may be fixed on the screen printing auxiliary plate by other methods, for example, a bolt is arranged at a non-central position of the bottom of the support block, as shown in fig. 3, the support block is installed on the screen printing auxiliary plate by the bolt and a screw hole arranged on the screen printing auxiliary plate in a matching manner. The PCB production board is placed on the silk screen printing accessory plate, and when there is the butt pressure condition in circuit and supporting shoe on the PCB production board, the position of accessible rotatory fine setting supporting shoe can make supporting shoe and circuit stagger to the guarantee silk screen printing hinders and welds high-efficient smooth and easy going on.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (8)
1. A method for improving the silk-screen solder mask efficiency of a circuit board is characterized in that solder mask ink is silk-screen printed on a PCB production board, and the PCB production board is divided into the following areas: a board edge area, a unit board area, and a molding line area for isolating each unit board area; positioning holes are respectively arranged in the plate edge areas at the four corners of the PCB production plate; the method for silk-screen solder mask is characterized by comprising the following steps:
s1, solder resist ink is printed on the first surface of the PCB production board in a silk-screen mode;
s2, placing the PCB production board on a screen printing auxiliary board, wherein the first surface of the PCB production board faces downwards and is opposite to the screen printing auxiliary board, and screen printing solder resist ink on the second surface of the PCB production board;
areas which correspond to the board edge areas, the unit board areas and the forming line areas of the PCB production board one by one are divided on the screen printing auxiliary board, supporting blocks are arranged on the board edge areas at three corners of the screen printing auxiliary board and correspond to the positioning holes, and each supporting block is composed of a flat board and convex nails protruding out of the surface of the flat board; the non-central position of the bottom of the supporting block is provided with a bolt, the supporting block is arranged on the screen printing auxiliary plate in a matching way with a screw hole arranged on the screen printing auxiliary plate through the bolt, and when the pressing condition exists between the circuit on the PCB production plate and the supporting block, the supporting block and the circuit can be staggered by rotating and finely adjusting the position of the supporting block;
s3, standing the PCB production board until the solder resist ink on the first surface and the second surface is dry and does not flow, and then sequentially carrying out pre-baking, alignment exposure and development treatment on the PCB production board to complete the manufacture of the solder resist layer on the PCB production board.
2. The method for improving the screen printing solder mask efficiency of the circuit board as claimed in claim 1, wherein a plurality of supporting blocks are arranged on the forming line area of the screen printing auxiliary board.
3. The method for improving the screen printing solder mask efficiency of the circuit board as claimed in claim 2, wherein the distance between two adjacent support blocks on the molding line area is 40 mm.
4. The method for improving the silk-screen solder mask efficiency of the circuit board as claimed in claim 1, wherein the board edge area of the PCB production board is provided with a routing vacancy, and a support block is arranged on the board edge area of the silk-screen auxiliary board and at a position corresponding to the routing vacancy.
5. The method for improving the screen printing solder mask efficiency of the circuit board as claimed in claim 1, wherein the board edge area of the PCB production board is provided with non-metallized hole sites, and the board edge area of the screen printing auxiliary board is provided with support blocks at positions corresponding to the non-metallized hole sites.
6. The method for improving the silk-screen solder mask efficiency of the circuit board as claimed in claim 1, wherein the PCB production board is provided with non-silk-screen positions on the board edge area, and support blocks are provided on the board edge area of the silk-screen auxiliary board and at positions corresponding to the non-silk-screen positions.
7. The method for improving the screen printing solder mask efficiency of the circuit board as claimed in claim 1, wherein a support block is provided on the area of the unit board of the screen printing auxiliary board.
8. The method for improving the screen printing solder mask efficiency of the circuit board according to any one of claims 1 to 7, wherein the supporting block is covered with a solder mask ink layer formed by solder mask ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910794711.3A CN110602894B (en) | 2019-08-26 | 2019-08-26 | Method for improving solder mask printing efficiency of circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910794711.3A CN110602894B (en) | 2019-08-26 | 2019-08-26 | Method for improving solder mask printing efficiency of circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN110602894A CN110602894A (en) | 2019-12-20 |
| CN110602894B true CN110602894B (en) | 2021-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910794711.3A Active CN110602894B (en) | 2019-08-26 | 2019-08-26 | Method for improving solder mask printing efficiency of circuit board |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473739A (en) * | 2020-03-31 | 2021-10-01 | 深南电路股份有限公司 | Method for silk-screen solder resist ink of circuit board |
| CN111806111B (en) * | 2020-06-08 | 2022-02-08 | 深圳市景旺电子股份有限公司 | Antenna board resistance welding double-sided printing method and antenna board |
| CN111800955B (en) * | 2020-07-17 | 2024-06-11 | 景旺电子科技(龙川)有限公司 | Method for double-sided solder resist printing of 5G power amplification plate sheet |
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| CN106507602A (en) * | 2016-11-30 | 2017-03-15 | 重庆凯歌电子股份有限公司 | A kind of circuit board double-face printing method |
| CN206149606U (en) * | 2016-08-19 | 2017-05-03 | 中航华东光电有限公司 | Frock is scribbled to circuit board three proofings paint brush |
| CN109587972A (en) * | 2019-01-22 | 2019-04-05 | 西安微电子技术研究所 | A kind of printed board welding resistance craft printed on both sides tooling |
-
2019
- 2019-08-26 CN CN201910794711.3A patent/CN110602894B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040154166A1 (en) * | 2001-06-07 | 2004-08-12 | Lg Electronics Inc. | Hole plugging method for printed circuit boards, and hole plugging device |
| CN201919244U (en) * | 2010-12-23 | 2011-08-03 | 北大方正集团有限公司 | Board support device |
| CN203387785U (en) * | 2013-08-27 | 2014-01-08 | 胜华电子（惠阳）有限公司 | Solder mask printing universal tool |
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