CN110600600B - LED waterproof packaging structure and packaging process - Google Patents

Abstract

The invention discloses an LED waterproof packaging structure and a packaging process, in particular to the field of LED packaging, comprising a packaging shell, an external lens is arranged on the top of the packaging shell, a metal heat dissipation plate is arranged in the inner cavity of the packaging shell, and the packaging The outer side and the bottom of the casing are provided with a plurality of screws, the bottom of the metal heat dissipation plate is provided with a circuit bottom plate; the top of the metal heat dissipation plate is provided with a plurality of LED inner packaging bodies, the LED inner packaging bodies include a base, the base A heat sink is fixedly embedded in the middle of the seat, a connection pad is fixed at the bottom of the heat sink, a connection pin is fixed inside the connection pad, and an insulating cushion layer is sleeved on the outside of the connection pin. The invention utilizes the increased air pressure inside the air cavity to prevent external water vapor from entering the air cavity, thereby eroding the LED chips and electrodes, prolonging the service life of the LED lamp, and improving the waterproof performance of the LED packaging structure.

Description

A kind of LED waterproof packaging structure and packaging process

technical field

The present invention relates to the field of LED packaging, and more particularly, to an LED waterproof packaging structure and packaging process.

Background technique

Light-emitting diodes are referred to as LEDs for short. Made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), and the like. LED (Light-emitting diode) is widely used in indication, display and other fields due to its advantages of long life and low energy consumption. Reliability, stability and high light yield are factors that must be considered when LEDs replace existing lighting sources.

Most of the existing LED packaging structures are relatively simple, and most of them are packaged with a simple structure of solid crystal glue and a lens, resulting in insufficient sealing performance of the LED chip. The service life is reduced and it is easy to be damaged.

SUMMARY OF THE INVENTION

In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a waterproof LED packaging structure. By using the heat generated by the LED chip during the working process, the expansion glue is expanded, and the gas in the air cavity is squeezed to make the air The air pressure inside the cavity is increased, and a sealing seat and a sealing cover are arranged at the connection between the plastic lens and the insulating layer. The board and the heat sink are connected with the connection pins, which ensures the integrity of the plastic lens and the insulating layer, and improves the sealing performance of the plastic lens and the air cavity. The increased air pressure inside the air cavity is used to prevent external water vapor from entering the air. inside the cavity, thereby eroding the LED chips and electrodes, prolonging the service life of the LED lamp, and improving the waterproof performance of the LED packaging structure.

In order to achieve the above purpose, the present invention provides the following technical solutions: an LED waterproof packaging structure and packaging process, including an encapsulation shell, an external lens is arranged on the top of the encapsulation shell, and a metal heat dissipation plate is arranged in the inner cavity of the encapsulation shell. The outer side and the bottom of the package shell are provided with a plurality of screws, and the bottom of the metal heat dissipation plate is provided with a circuit bottom plate;

The top of the metal heat dissipation plate is provided with a plurality of LED inner packaging bodies, the LED inner packaging bodies include a base, a heat sink is fixedly embedded in the middle of the base, and a connection pad is fixed at the bottom of the heat sink. The connecting pads are internally fixed with connecting pins, the connecting pins are externally sleeved with an insulating cushion layer, and the top edge of the heat sink is fixedly sleeved with an insulating layer;

The metal groove plate is provided with a heat dissipation groove, a fixed base is fixedly embedded in the middle of the metal groove plate, the top of the fixed base is recessed, and the LED chips and electrodes are welded to the recess at the top of the fixed base, and the number of the electrodes is set. It is two and symmetrically set by the LED chip;

The electrodes are fixedly connected with connecting wires, the top of the LED chip is provided with a phosphor layer, the top of the phosphor layer is fixedly provided with an expansion glue, an air cavity is arranged outside the expansion glue, and the outside of the air cavity is provided with a plastic lens, the top of the plastic lens is attached to the bottom of the external lens;

A first connection groove is formed on the surface of the metal heat dissipation plate, and a second connection groove is formed at the bottom of the first connection groove;

The circuit bottom plate is provided with a spring telescopic rod, and the top of the spring telescopic rod is provided with an electrode gasket.

A first connection groove is formed on the metal heat dissipation plate, and a second connection groove is formed at the bottom of the first connection groove;

The circuit bottom plate is provided with a spring telescopic rod, and the top of the spring telescopic rod is provided with an electrode gasket.

In a preferred embodiment, a sealing seat is fixed on the top of the base, a sealing cover is fixed on the top of the sealing seat, the sealing seat is sleeved on the outside of the insulating layer and the plastic lens, and the sealing cover is sleeved Set on the outside of the plastic lens, the sealing cover is clamped with the sealing seat.

In a preferred embodiment, the screws on the outer side of the package shell extend through the package shell to the inside of the side wall of the metal heat dissipation plate, the screws on the bottom of the package shell extend through the package shell to the bottom of the circuit bottom plate, the metal heat dissipation plate and The circuit backplanes are all detachably connected to the package shell through screws.

In a preferred embodiment, a thermally conductive adhesive is provided between the LED inner package and the metal heat dissipation plate, the heat sink and the base are connected to the metal heat dissipation plate by the thermally conductive adhesive, and the thickness of the thermally conductive adhesive is equal to The sum of the thicknesses of the first connecting grooves is the same as the thickness of the connecting pads.

In a preferred embodiment, the number of the connection pads, the first connection grooves, the second connection grooves, the connection pins, the spring telescopic rods and the electrode spacers is the same, and the first connection grooves and the second connection grooves have the same number. In an integrated configuration, the bottom of the connection pad is attached to the inner wall of the first connection slot, the connection pin penetrates the connection pad, and the bottom end of the connection pin is inserted into the top of the inner cavity of the second connection slot.

In a preferred embodiment, the top end of the spring lift rod extends to the bottom of the inner cavity of the second connection groove, the electrode pad is arranged just below the connection pin, and the top of the electrode pad is connected to the connection pin The bottoms are in contact with each other, and the connecting wires pass through the phosphor layer, the expansion glue, the metal groove plate, the heat sink and the insulating cushion layer in sequence and are connected to the tops of the connecting pins.

In a preferred embodiment, the bottom of the expanding glue is fixedly connected with the phosphor layer and the metal groove plate, the air cavity is arranged between the plastic lens, the metal groove plate and the phosphor layer, and the air cavity is filled with nitrogen, the bottom of the plastic lens is fixedly connected to the top of the insulating layer, and the inside of the plastic lens is fixedly connected to the outside of the metal groove plate.

A packaging process for an LED waterproof structure specifically includes the following steps:

Step 1: Fix the circuit base plate on the bottom of the inner cavity of the package shell with screws, open a second connection slot on the metal heat sink at the position corresponding to the spring telescopic rod on the circuit base plate, and open a first connection slot at the top of the second connection slot , and then set the metal heat dissipation plate on the top of the circuit base plate, so that the spring telescopic rod is inserted into the second connection groove, and the metal heat dissipation plate is fixed with screws;

Step 2: Weld the fixed base on which the LED chip is installed on the heat sink, set the metal groove plate on the outside of the fixed base and weld, and set a plastic lens on the outside of the metal groove plate, between the plastic lens and the expansion glue. Form an air cavity, fill the air cavity with nitrogen gas with an inflatable device, and then use the LED packaging production line to encapsulate the LED inner package, bond the sealing seat on the top of the base, and snap the sealing cover on the top of the sealing seat to complete the process. Assembly of LED inner package;

Step 3: At the connection between the LED inner package and the metal heat sink, use a glue dispenser to sequentially dispense the thermally conductive adhesive onto the surface of the metal heat sink to form a thermally conductive adhesive, and align the connecting pins at the bottom of the LED inner package to the metal. The second connection slot on the heat sink, insert the connection pins into the second connection slot, place the connection pad in the first connection slot, press the LED inner package, make the base and the heat sink and the metal heat sink on the heat sink The thermal conductive glue is bonded to fix the LED inner package body in the package shell, and the bottom end of the connecting pin is connected to the electrode pad;

Step 4: Fix the external lens on the top of the package shell, and press the bottom of the external lens to the outside of the plastic lens to complete the package.

Technical effects and advantages of the present invention:

1. By using the heat generated by the LED chip during the working process, the expansion glue is expanded, the gas in the air cavity is squeezed, the air pressure inside the air cavity is increased, and a sealing seat is set at the connection between the plastic lens and the insulating layer And the sealing cover, the inside of the sealing seat and the sealing cover are connected with the outside of the plastic lens, and then the connecting leads are connected with the connecting pins through the expansion glue, metal groove plate and heat sink to ensure the integrity of the plastic lens and the insulating layer. The sealing performance of the plastic lens and the air cavity is improved, and the air pressure inside the air cavity is used to prevent the external water vapor from entering the air cavity, thereby eroding the LED chips and electrodes, prolonging the service life of the LED lamp and improving the Waterproof performance of LED package structure;

2. When the LED inner package is in the process of packaging, the thermal conductive adhesive between the LED inner package and the metal heat sink will be squeezed to strengthen the connection strength between the LED inner package and the package shell, so that the bottom of the heat sink is connected to the heat sink. The gap between the metal heat sinks is isolated from the space inside the package shell, and an insulating layer is welded between the base and the heat sink, and a sealing seat is fixed outside the insulating layer, so that the heat sink, the base and the metal heat sink are installed between the heat sink and the heat sink. The gap is sealed to reduce the entry of external water vapor into the heat sink part;

3. Press the external lens on the top of the plastic lens, so that the plastic lens is fixed on the top of the LED inner package. The double-layer package structure of the package shell and the LED inner package can greatly strengthen the LED inner package. The sealing performance of the body further extends the life of the LED lamp.

Description of drawings

FIG. 1 is a schematic diagram of the overall structure of the present invention.

FIG. 2 is a schematic diagram of the cross-sectional structure at A-A in FIG. 1 of the present invention.

FIG. 3 is a schematic structural diagram of the LED inner package body of the present invention.

FIG. 4 is a schematic diagram of the detailed structure at B in FIG. 2 of the present invention.

FIG. 5 is a schematic diagram of the detailed structure of the position C in FIG. 2 of the present invention.

FIG. 6 is a schematic structural diagram of a part of the LED inner package body of the present invention.

FIG. 7 is a schematic diagram of the internal structure of the packaging shell of the present invention.

Reference numerals are: 1 package shell, 2 external lens, 3 metal heat sink, 4 circuit bottom plate, 5 LED inner package, 6 base, 7 heat sink, 8 connection pad, 9 connection pin, 10 insulating pad , 11 insulating layer, 12 heat sink, 13 fixed base, 14 LED chip, 15 electrode, 16 connecting wire, 17 phosphor layer, 18 expanding glue, 19 air cavity, 20 plastic lens, 21 first connection slot, 22 second connection Slot, 23 spring telescopic rod, 24 electrode gasket, 25 sealing seat, 26 sealing cover, 27 thermal conductive adhesive, 28 metal groove plate.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

As shown in Figures 1-5, a waterproof LED packaging structure includes a packaging casing 1, an external lens 2 is arranged on the top of the packaging casing 1, and a metal heat dissipation plate 3 is arranged in the inner cavity of the packaging casing 1. The outer side and the bottom of the casing 1 are provided with a plurality of screws, and the bottom of the metal heat dissipation plate 3 is provided with a circuit bottom plate 4;

The top of the metal heat dissipation plate 3 is provided with a plurality of LED inner packaging bodies 5, the LED inner packaging body 5 includes a base 6, a heat sink 7 is fixedly embedded in the middle of the base 6, and the bottom of the heat sink 7 is fixed There is a connection pad 8, the connection pad 8 is fixed with a connection pin 9 inside, the connection pin 9 is sleeved with an insulating cushion layer 10, and the top edge of the heat sink 7 is fixedly sleeved with an insulating layer 11;

The metal groove plate 28 is provided with a heat dissipation groove 12 , a fixed base 13 is fixedly embedded in the middle of the metal groove plate 28 , the top of the fixed base 13 is recessed, and the LED chip 14 and electrodes are welded to the recess at the top of the fixed base 13 . 15. The number of the electrodes 15 is set to two and symmetrically arranged through the LED chip 14;

A connecting wire 16 is fixedly connected to the electrode 15 , a phosphor layer 17 is provided on the top of the LED chip 14 , an expanding glue 18 is fixed on the top of the phosphor layer 17 , and an air cavity 19 is arranged outside the expanding glue 18 , the outside of the air cavity 19 is provided with a plastic lens 20, and the top of the plastic lens 20 is attached to the bottom of the external lens 2;

A first connection groove 21 is formed on the surface of the metal heat dissipation plate 3, and a second connection groove 22 is formed at the bottom of the first connection groove 21;

The circuit base plate 4 is provided with a spring telescopic rod 23, and the top of the spring telescopic rod 23 is provided with an electrode gasket 24;

A first connection groove 21 is formed on the metal heat dissipation plate 3, and a second connection groove 22 is formed at the bottom of the first connection groove 21;

The circuit bottom plate 4 is provided with a spring telescopic rod 23, and the top of the spring telescopic rod 23 is provided with an electrode pad 24, the connecting pin 9 is inserted into the second connection groove 22, and a spring is used on the circuit bottom plate 4. The telescopic rod 23 fixedly installs the electrode pads 24, which facilitates the connection of the connection pins 9 and the electrode pads 24, allows certain dimensional errors and installation errors between the circuit base plate 4 and the metal heat sink 3, and reduces the difficulty of the packaging process.

The specific embodiment is as follows: in the process of operation, the circuit base plate 4 is connected to an external power supply to supply power to the LED inner package 5 in the package shell 1, and when the LED inner package 5 is packaged inside the package shell 1, the bottom of the connecting pin 9 is connected. The end is inserted into the second connecting groove 22, and the bottom end of the connecting pin 9 is pressed against the electrode pad 24. The electrode pad 24 is squeezed by the connecting pin 9 and pushes the spring telescopic rod 23 to shrink to adapt itself. The connecting line 16 at the top of the pin 9 is connected to the electrodes 15 on both sides of the LED chip 14 to complete the power supply to the LED chip 14, so that the LED chip 14 emits light, and the LED inner package 5 will squeeze the LED during the packaging process. The thermally conductive adhesive 27 between the inner package body 5 and the metal heat dissipation plate 3 strengthens the connection strength between the LED inner package body 5 and the package shell 1, so that the gap between the bottom of the heat sink 7 and the metal heat dissipation plate 3 is close to the package shell. 1. The internal space is isolated, and the insulating layer 11 is welded between the base 6 and the heat sink 7 at the same time. The gap is sealed, reducing the entry of external water vapor into the heat sink 7 part.

As shown in Figures 1-7, a sealing seat 25 is fixed on the top of the base 6, a sealing cover 26 is fixed on the top of the sealing seat 25, and the sealing seat 25 is sleeved on the insulating The outer part of the layer 11 and the plastic lens 20, the sealing cover 26 is sleeved on the outer part of the plastic lens 20, the sealing cover 26 is clamped with the sealing seat 25, and the screws on the outside of the package shell 1 extend through the package shell 1 to the metal Inside the side wall of the heat dissipation plate 3, the screws at the bottom of the encapsulation casing 1 extend through the encapsulation casing 1 to the bottom of the circuit base plate 4, and the metal heat dissipation plate 3 and the circuit base plate 4 are detachably connected to the encapsulation casing 1 through screws;

A thermally conductive adhesive 27 is provided between the LED inner package 5 and the metal heat dissipation plate 3, and the heat sink 7 and the base 6 are connected to the metal heat dissipation plate 3 through the thermally conductive adhesive 27. The thickness of the thermally conductive adhesive 27 is equal to The sum of the thicknesses of the first connection grooves 21 is the same as the thickness of the connection pads 8 . The number is the same, the first connection slot 21 and the second connection slot 22 are integrally arranged, the bottom of the connection pad 8 is attached to the inner wall of the first connection slot 21, the connection pin 9 penetrates the connection pad 8, The bottom end of the connecting pin 9 is inserted into the top of the inner cavity of the second connecting groove 22;

The top of the spring lift rod extends to the bottom of the inner cavity of the second connection groove 22 , the electrode pad 24 is arranged directly below the connection pin 9 , and the top of the electrode pad 24 is attached to the bottom of the connection pin 9 In combination, the connecting wire 16 runs through the phosphor layer 17 , the expansion glue 18 , the metal groove plate 28 , the heat sink 7 and the insulating cushion layer 10 in sequence and is connected to the top of the connecting pin 9 , and the bottom of the expansion glue 18 is connected to the phosphor layer 17 It is fixedly connected with the metal groove plate 28. The air cavity 19 is arranged between the plastic lens 20, the metal groove plate 28 and the phosphor layer 17. The air cavity 19 is filled with nitrogen gas. The bottom of the plastic lens 20 is connected to the insulating layer. 11 The top is fixedly connected, and the inner side of the plastic lens 20 is fixedly connected with the outer side of the metal groove plate 28 .

The specific embodiment is as follows: in the process of the LED chip 14 being energized and emitting light, the LED chip 14 will generate heat, and the heat will be dissipated to the outside through the fixed base 13, the metal groove plate 28 and the phosphor layer 17. During this process, the expansion glue 18 is heated. Expansion will occur, and the gas in the air cavity 19 will be squeezed to increase the air pressure inside the air cavity 19. A sealing seat 25 and a sealing cover 26 are also provided at the connection between the plastic lens 20 and the insulating layer 11. The sealing seat 25 and The inside of the sealing cover 26 is connected with the outside of the plastic lens 20, and the connecting leads are connected with the connecting pins 9 through the expansion glue 18, the metal groove plate 28 and the heat sink 7, which ensures the integrity of the plastic lens 20 and the insulating layer 11. Therefore, the sealing performance of the plastic lens 20 and the air cavity 19 is improved, and the increased air pressure inside the air cavity 19 is used to prevent external water vapor from entering the air cavity 19, thereby eroding the LED chip 14 and the electrode 15, extending the LED lamp. During the working process of the LED chip 14, a part of the heat will be directly dissipated into the space inside the package casing 1 through the plastic lens 20, and the other part of the heat will be dissipated to the metal heat sink 3 through the heat sink 7, using metal The heat dissipation plate 3 and the thermal conductive adhesive 27 conduct heat to the bottom of the metal heat dissipation plate 3, and the external lens 2 can be pressed on the top of the plastic lens 20, so that the plastic lens 20 is fixed on the top of the LED inner package 5, strengthening the The sealing performance of the LED inner package 5 .

Further, it also includes a packaging process for the LED waterproof structure, which specifically includes the following steps:

Step 1: Fix the circuit base plate 4 on the bottom of the inner cavity of the package casing 1 with screws, and open a second connection slot 22 on the metal heat sink 3 at the position corresponding to the spring telescopic rod 23 on the circuit base plate 4, and in the second connection slot. A first connection slot 21 is opened at the top of 22, and then the metal heat sink 3 is sleeved on the top of the circuit base plate 4, so that the spring telescopic rod 23 is inserted into the second connection slot 22, and the metal heat sink 3 is fixed by screws;

Step 2: Weld the fixed base 13 on which the LED chip 14 is installed on the heat sink 7, set the metal groove plate 28 on the outside of the fixed base 13 and weld it, and set the plastic lens 20 on the outside of the metal groove plate 28. An air cavity 19 is formed between the plastic lens 20 and the expansion glue 18, and nitrogen gas is filled in the air cavity 19 by means of an inflatable device, and then the LED inner package body 5 is packaged by the LED packaging production line, and then the top of the base 6 is bonded and sealed. seat 25, and the sealing cover 26 is clamped on the top of the sealing seat 25 to complete the assembly of the LED inner package body 5;

Step 3, at the connection between the LED inner package 5 and the metal heat sink 3, use a glue dispenser to sequentially dispense the thermally conductive adhesive onto the surface of the metal heat sink 3 to form a thermally conductive adhesive 27, and connect the bottom of the LED inner package 5 to the surface of the metal heat sink 3. The pins 9 are aligned with the second connection grooves 22 on the metal heat sink 3, the connection pins 9 are inserted into the second connection grooves 22, the connection pads 8 are placed in the first connection grooves 21, and the LED inner package body 5 is pressed. , the base 6 and the heat sink 7 are bonded with the thermally conductive adhesive on the metal heat sink 3, so that the LED inner package 5 is fixed in the package shell 1, and the bottom end of the connecting pin 9 is connected with the electrode pad 24;

Step 4: Fix the external lens 2 on the top of the package casing 1, and press the bottom of the external lens 2 to the outside of the plastic lens 20 to complete the packaging.

The working principle of the present invention:

Referring to Figures 2-5 of the description, the heat generated by the LED chip 14 during the working process is used to expand the expansion glue 18, and the gas in the air cavity 19 is squeezed, so that the air pressure inside the air cavity 19 is increased, and the plastic lens is formed. 20 and the insulating layer 11 are connected with a sealing seat 25 and a sealing cover 26, the interior of the sealing seat 25 and the sealing cover 26 are connected with the outside of the plastic lens 20, and then the connecting leads are connected through the expansion glue 18, the metal groove plate 28 and the plastic lens 20. The heat sink 7 is connected with the connecting pin 9, which ensures the integrity of the plastic lens 20 and the insulating layer 11, and improves the sealing performance of the plastic lens 20 and the air cavity 19;

Referring to FIG. 1 of the description, the external lens 2 is pressed on the top of the plastic lens 20, so that the plastic lens 20 is fixed on the top of the LED inner package 5, and the double-layer package of the package shell 1 and the LED inner package 5 is used. The structure can greatly enhance the sealing performance of the LED inner package 5 .

Referring to Figures 1 to 7 of the description, during the packaging process of the LED inner package 5, the thermally conductive adhesive 27 between the LED inner package 5 and the metal heat sink 3 will be squeezed to strengthen the LED inner package 5 and the package shell 1. The connection strength between the heat sink 7 and the metal heat sink 3 isolates the gap between the bottom of the heat sink 7 and the metal heat sink 3 from the space inside the package casing 1, while the insulating layer 11 is welded between the base 6 and the heat sink 7, and the insulating layer 11 is outside. , the sealing seat 25 is fixedly arranged, so that the gap between the heat sink 7, the base 6 and the metal heat sink 3 can be sealed.

The last points that should be noted are: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, and may be mechanical connection. Or electrical connection, or internal communication between two components, or direct connection, "up", "down", "left", "right", etc. are only used to indicate relative positional relationship, when the absolute position of the object being described changes, the relative positional relationship may change;

Secondly: in the drawings of the disclosed embodiments of the present invention, only the structures involved in the embodiments of the present disclosure are involved, other structures may refer to the general design, and the same embodiment and different embodiments of the present invention can be combined with each other under the condition of no conflict;

Finally: the above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the present invention. within the scope of protection.

Claims (8)

1. The LED waterproof packaging structure is characterized by comprising a packaging shell (1), wherein an external lens (2) is arranged at the top of the packaging shell (1), a metal heat dissipation plate (3) is arranged in an inner cavity of the packaging shell (1), a plurality of screws are arranged on the outer side and the bottom of the packaging shell (1), and a circuit bottom plate (4) is arranged at the bottom of the metal heat dissipation plate (3);

the LED heat dissipation structure is characterized in that a plurality of LED inner packaging bodies (5) are arranged at the top of the metal heat dissipation plate (3), each LED inner packaging body (5) comprises a base (6), a heat sink (7) is fixedly embedded in the middle of each base (6), a connecting cushion block (8) is fixedly arranged at the bottom of each heat sink (7), a connecting pin (9) is fixedly arranged inside each connecting cushion block (8), an insulating cushion layer (10) is sleeved outside each connecting pin (9), and an insulating layer (11) is fixedly sleeved at the edge of the top of each heat sink (7);

the LED lamp is characterized in that a heat dissipation groove (12) is formed in the metal groove plate (28), a fixed base (13) is fixedly embedded in the middle of the metal groove plate (28), the top end of the fixed base (13) is arranged in a concave mode, LED chips (14) and electrodes (15) are welded at the concave position of the top end of the fixed base (13), and the number of the electrodes (15) is two and the two electrodes are symmetrically arranged through the LED chips (14);

the electrode (15) is fixedly connected with a connecting wire (16), the top of the LED chip (14) is provided with a fluorescent powder layer (17), the top of the fluorescent powder layer (17) is fixedly provided with an expansion glue (18), an air cavity (19) is arranged outside the expansion glue (18), a plastic lens (20) is arranged outside the air cavity (19), and the top of the plastic lens (20) is attached to the bottom of the external lens (2);

a first connecting groove (21) is formed in the surface of the metal heat dissipation plate (3), and a second connecting groove (22) is formed in the bottom of the first connecting groove (21);

the circuit board (4) is provided with a spring telescopic rod (23), and the top of the spring telescopic rod (23) is provided with an electrode gasket (24).

2. The waterproof packaging structure of LED of claim 1, characterized in that: the fixed seal receptacle (25) that is equipped with in base (6) top, fixed sealed lid (26) that is equipped with in seal receptacle (25) top, the outside of insulating layer (11) and plastic lens (20) is located in seal receptacle (25) cover, the outside of plastic lens (20) is located in sealed lid (26) cover, sealed lid (26) and seal receptacle (25) joint.

3. The waterproof packaging structure of LED of claim 1, characterized in that: the screw in encapsulation shell (1) outside runs through inside encapsulation shell (1) extends to the lateral wall of metal heating panel (3), encapsulation shell (1) bottom screw runs through the bottom that encapsulation shell (1) extended to circuit bottom plate (4), metal heating panel (3) and circuit bottom plate (4) all can dismantle with encapsulation shell (1) through the screw and are connected.

4. The waterproof packaging structure of LED of claim 1, characterized in that: be equipped with heat conduction viscose (27) between encapsulation body (5) and metal heating panel (3) in the LED, heat sink (7) and base (6) all are connected with metal heating panel (3) through heat conduction viscose (27), and heat conduction viscose (27) thickness and first connecting groove (21) thickness sum are the same with connection cushion (8) thickness.

5. The waterproof packaging structure of LED of claim 1, characterized in that: the electrode gasket connecting structure is characterized in that the number of the connecting cushion blocks (8), the first connecting grooves (21), the second connecting grooves (22), the connecting pins (9), the spring telescopic rods (23) and the electrode gaskets (24) is the same, the first connecting grooves (21) and the second connecting grooves (22) are integrally arranged, the bottoms of the connecting cushion blocks (8) are attached to the inner wall of the first connecting grooves (21), the connecting pins (9) penetrate through the connecting cushion blocks (8), and the bottoms of the connecting pins (9) are inserted into the top of the inner cavity of the second connecting grooves (22).

6. The waterproof LED packaging structure of claim 5, wherein: the spring telescopic rod top extends to the bottom of an inner cavity of the second connecting groove (22), the electrode gasket (24) is arranged under the connecting pin (9), the top of the electrode gasket (24) is attached to the bottom of the connecting pin (9), and the connecting wire (16) sequentially penetrates through the fluorescent powder layer (17), the expansion glue (18), the metal groove plate (28), the heat sink (7) and the insulating cushion layer (10) and is connected with the top of the connecting pin (9).

7. The waterproof packaging structure of LED of claim 1, characterized in that: the bottom of the expansion glue (18) is fixedly connected with the fluorescent powder layer (17) and the metal groove plate (28), the air cavity (19) is arranged among the plastic lens (20), the metal groove plate (28) and the fluorescent powder layer (17), nitrogen is filled in the air cavity (19), the bottom of the plastic lens (20) is fixedly connected with the top of the insulating layer (11), and the inner side of the plastic lens (20) is fixedly connected with the outer side of the metal groove plate (28).

8. A packaging process of an LED waterproof structure specifically comprises the following steps:

firstly, fixing a circuit bottom plate (4) at the bottom of an inner cavity of a packaging shell (1) by using screws, forming a second connecting groove (22) in a position, corresponding to a spring telescopic rod (23) on the circuit bottom plate (4), on a metal heat dissipation plate (3), forming a first connecting groove (21) at the top of the second connecting groove (22), then sleeving the metal heat dissipation plate (3) at the top of the circuit bottom plate (4), inserting the spring telescopic rod (23) into the second connecting groove (22), and fixing the metal heat dissipation plate (3) by using the screws;

welding a fixed base (13) provided with an LED chip (14) on a heat sink (7), sleeving a metal groove plate (28) outside the fixed base (13) and welding, sleeving a plastic lens (20) outside the metal groove plate (28), forming an air cavity (19) between the plastic lens (20) and expansion glue (18), filling nitrogen gas into the air cavity (19) by using air filling equipment, bonding a sealing seat (25) on the top of a base (6) after the LED inner packaging body (5) is packaged by using an LED packaging production line, and clamping a sealing cover (26) on the top of the sealing seat (25) to complete the assembly of the LED inner packaging body (5);

thirdly, utilizing a dispenser to sequentially dispense heat-conducting glue on the surface of the metal heat dissipation plate (3) at the joint of the LED inner packaging body (5) and the metal heat dissipation plate (3) to form heat-conducting glue (27), aligning a connecting pin (9) at the bottom of the LED inner packaging body (5) with a second connecting groove (22) on the metal heat dissipation plate (3), inserting the connecting pin (9) into the second connecting groove (22), placing a connecting cushion block (8) in the first connecting groove (21), pressing the LED inner packaging body (5), bonding the base (6) and the heat sink (7) with the heat-conducting glue on the metal heat dissipation plate (3), fixing the LED inner packaging body (5) in the packaging shell (1), and connecting the bottom ends of the connecting pins (9) with the electrode gasket (24);

and step four, fixing the external lens (2) on the top of the packaging shell (1), and pressing the bottom of the external lens (2) outside the plastic lens (20) to complete packaging.

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