CN110600595A - Aluminum gallium nitrogen-based ultraviolet LED epitaxial structure and ultraviolet LED lamp - Google Patents
Aluminum gallium nitrogen-based ultraviolet LED epitaxial structure and ultraviolet LED lamp Download PDFInfo
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 title abstract description 19
- 229910052757 nitrogen Inorganic materials 0.000 title abstract description 10
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 title abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 93
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 93
- 239000000203 mixture Substances 0.000 claims abstract description 82
- 238000005215 recombination Methods 0.000 claims abstract description 20
- 230000006798 recombination Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 229910002704 AlGaN Inorganic materials 0.000 claims abstract 44
- 230000007423 decrease Effects 0.000 claims description 11
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical group [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 8
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002347 injection Methods 0.000 abstract description 29
- 239000007924 injection Substances 0.000 abstract description 29
- 230000005684 electric field Effects 0.000 abstract description 27
- 230000010287 polarization Effects 0.000 abstract description 26
- 229910002601 GaN Inorganic materials 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 11
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 1
- 229910052733 gallium Inorganic materials 0.000 abstract 1
- 230000000903 blocking effect Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 239000002019 doping agent Substances 0.000 description 5
- 230000003313 weakening effect Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
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- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2115/00—Light-generating elements of semiconductor light sources
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Abstract
本发明涉及一种铝镓氮基紫外LED外延结构及紫外LED灯,铝镓氮基紫外LED外延结构包括依次层叠设置的衬底、缓冲层、第一铝镓氮层、发光层以及第二铝镓氮层;第二铝镓氮层包括多个第二铝镓氮子层,多个第二铝镓氮子层依次层叠设置,多个第二铝镓氮子层的铝组分不同,与发光层连接的第二铝镓氮子层的铝组分大于其他第二铝镓氮子层的铝组分。靠近发光层的第二铝镓氮子层铝组分最大,远离发光层的第二铝镓氮子层铝组分最小,不同组分的第二铝镓氮子层,减弱了第二铝镓氮层的内建电场,使得第二铝镓氮层与发光层之间的压电极化效应减弱,从而提高空穴的有效注入率,使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率。
The invention relates to an AlGaN-based ultraviolet LED epitaxial structure and an ultraviolet LED lamp. The AlGaN-based ultraviolet LED epitaxial structure comprises a substrate, a buffer layer, a first AlGaN layer, a light-emitting layer and a second aluminum Gallium nitride layer; the second AlGaN layer includes a plurality of second AlGaN sublayers, the plurality of second AlGaN sublayers are stacked in sequence, and the aluminum composition of the plurality of second AlGaN sublayers is different from that of The aluminum composition of the second AlGaN sublayer connected to the light emitting layer is larger than the aluminum composition of other second AlGaN sublayers. The aluminum composition of the second AlGaN sublayer near the light-emitting layer is the largest, and the aluminum composition of the second AlGaN sublayer far away from the light-emitting layer is the smallest. The second AlGaN sublayers with different compositions weaken the second AlGaN sublayer. The built-in electric field of the nitrogen layer weakens the piezoelectric polarization effect between the second AlGaN layer and the light-emitting layer, thereby increasing the effective injection rate of holes, increasing the radiative recombination rate of electrons and holes, and improving the aluminum Intrinsic Quantum Rate and Luminous Efficiency of Gallium Nitride-Based UV LED Epitaxial Structure.
Description
技术领域technical field
本发明涉及半导体技术领域,特别是涉及一种铝镓氮基紫外LED外延结构及紫外LED灯。The invention relates to the technical field of semiconductors, in particular to an aluminum gallium nitrogen-based ultraviolet LED epitaxial structure and an ultraviolet LED lamp.
背景技术Background technique
随着发光二极管(Light Emitting Diode,LED)科技的不断发展,紫外发光二极管在商业领域中越来越重要,其具有重大的应用价值。并且,与传统的紫外光源汞灯相比,紫外LED具有超长寿命、无热辐射、能量高、照射均匀、效率高、体积小和不含有毒物质等优势,这就使紫外LED最有可能取代传统的紫外光光源。因此,紫外LED越来越受研究者们的关注。其中,紫外LED的发光功率与其内部的紫外LED外延片发出光线的内量子率相关,当前制备紫外LED外延片主要采用III族氮化物AlGaN(铝镓氮)材料。With the continuous development of light emitting diode (Light Emitting Diode, LED) technology, ultraviolet light emitting diodes are becoming more and more important in the commercial field, and have great application value. Moreover, compared with the traditional ultraviolet light source mercury lamp, ultraviolet LED has the advantages of super long life, no heat radiation, high energy, uniform irradiation, high efficiency, small size and no toxic substances, which makes ultraviolet LED the most likely Replace the traditional UV light source. Therefore, UV LEDs are receiving more and more attention from researchers. Among them, the luminous power of the ultraviolet LED is related to the internal quantum rate of the light emitted by the ultraviolet LED epitaxial wafer inside. Currently, the preparation of the ultraviolet LED epitaxial wafer mainly uses the III-nitride AlGaN (aluminum gallium nitrogen) material.
但是,由于III族氮化物材料之间存在强大的自发和压电极化,从而产生强大的极化电场,最终导致发光层的电子泄露,使得电子和空穴在发光层的辐射复合效率降低,从而使得紫外LED外延片发出光线的内量子率低下,进而造成紫外LED外延片的发光功率低下。However, due to the strong spontaneous and piezoelectric polarization between III-nitride materials, a strong polarization electric field is generated, which eventually leads to the leakage of electrons in the light-emitting layer, which reduces the radiative recombination efficiency of electrons and holes in the light-emitting layer. As a result, the internal quantum rate of the light emitted by the ultraviolet LED epitaxial wafer is low, which in turn causes the luminous power of the ultraviolet LED epitaxial wafer to be low.
发明内容Contents of the invention
基于此,有必要提供一种结构简单且提高内量子率和发光率的铝镓氮基紫外LED外延结构及紫外LED灯。Based on this, it is necessary to provide an AlGaN-based ultraviolet LED epitaxial structure and an ultraviolet LED lamp with a simple structure and improved internal quantum rate and luminous efficiency.
一种铝镓氮基紫外LED外延结构,包括:依次层叠设置的衬底、缓冲层、第一铝镓氮层、发光层以及第二铝镓氮层,所述第一铝镓氮层用于提供电子,所述第二铝镓氮层用于提供空穴,所述发光层用于电子和空穴的辐射复合发光;所述第二铝镓氮层包括多个第二铝镓氮子层,多个所述第二铝镓氮子层依次层叠设置,多个所述第二铝镓氮子层的铝组分不同,与所述发光层连接的所述第二铝镓氮子层的铝组分大于其他第二铝镓氮子层的铝组分。An AlGaN-based ultraviolet LED epitaxial structure, comprising: a substrate, a buffer layer, a first AlGaN layer, a light-emitting layer, and a second AlGaN layer that are sequentially stacked, and the first AlGaN layer is used for Provide electrons, the second AlGaN layer is used to provide holes, and the light-emitting layer is used for radiation recombination of electrons and holes to emit light; the second AlGaN layer includes a plurality of second AlGaN sublayers A plurality of second AlGaN sublayers are stacked in sequence, the aluminum components of the plurality of second AlGaN sublayers are different, and the aluminum gallium nitride sublayers connected to the light emitting layer are The aluminum composition is greater than that of the other second AlGaN sublayers.
在其中一个实施例中,由靠近所述发光层至远离所述发光层的顺序,各所述第二铝镓氮子层的铝组分依次减小。In one of the embodiments, the aluminum composition of each of the second AlGaN sublayers decreases sequentially from being close to the light emitting layer to being far away from the light emitting layer.
在其中一个实施例中,由靠近所述发光层至远离所述发光层的顺序,各所述第二铝镓氮子层的铝组分线性减小。In one embodiment, the aluminum composition of each of the second AlGaN sublayers decreases linearly from being close to the light emitting layer to being far away from the light emitting layer.
在其中一个实施例中,所述第二铝镓氮子层的铝组分为0~0.8。In one embodiment, the aluminum composition of the second AlGaN sub-layer is 0-0.8.
在其中一个实施例中,所述第二铝镓氮子层的铝组分为0.05~0.65。In one embodiment, the aluminum composition of the second AlGaN sub-layer is 0.05-0.65.
在其中一个实施例中,多个所述第二铝镓氮子层的厚度相等。In one embodiment, the plurality of second AlGaN sublayers have the same thickness.
在其中一个实施例中,所述第二铝镓氮子层的厚度为20~30nm。In one embodiment, the thickness of the second AlGaN sublayer is 20-30 nm.
在其中一个实施例中,所述第二铝镓氮层的掺杂原子包括镁原子。In one embodiment, the dopant atoms of the second AlGaN layer include magnesium atoms.
在其中一个实施例中,所述第二铝镓氮层中,镁原子的掺杂浓度为1×1017cm-3。In one embodiment, the doping concentration of magnesium atoms in the second AlGaN layer is 1×10 17 cm −3 .
一种紫外LED灯,包括灯座、灯罩以及上述任一实施例中所述的铝镓氮基紫外LED外延结构,所述铝镓氮基紫外LED外延结构设置于所述灯座上,所述灯罩与所述灯座连接,且罩设所述铝镓氮基紫外LED外延结构。An ultraviolet LED lamp, comprising a lamp holder, a lampshade, and the AlGaN-based ultraviolet LED epitaxial structure described in any of the above embodiments, the AlGaN-based ultraviolet LED epitaxial structure is arranged on the lamp holder, the The lampshade is connected with the lamp holder, and is covered with the AlGaN-based ultraviolet LED epitaxial structure.
上述铝镓氮基紫外LED外延结构及紫外LED灯,靠近所述发光层的第二铝镓氮子层铝组分最大,用于减少电子从发光层中泄露;远离所述发光层的第二铝镓氮子层铝组分最小,用于向发光层提供空穴;不同组分的第二铝镓氮子层,减弱了第二铝镓氮层的内建电场,使得第二铝镓氮层与发光层之间的压电极化效应减弱,从而提高空穴的有效注入率,使得第二铝镓氮子层兼具阻挡电子泄露和增大空穴注入率的功能,进而使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In the above-mentioned AlGaN-based ultraviolet LED epitaxial structure and ultraviolet LED lamp, the aluminum component of the second AlGaN sublayer close to the light-emitting layer is the largest, which is used to reduce the leakage of electrons from the light-emitting layer; the second AlGaN sublayer far away from the light-emitting layer The aluminum composition of the AlGaN sublayer is the smallest, which is used to provide holes to the light-emitting layer; the second AlGaN sublayer with different composition weakens the built-in electric field of the second AlGaN layer, making the second AlGaN The piezoelectric polarization effect between the layer and the light-emitting layer is weakened, thereby increasing the effective injection rate of holes, so that the second AlGaN sublayer has the functions of blocking electron leakage and increasing the hole injection rate, thereby making electrons and holes The radiation recombination rate of the hole is improved, and the internal quantum rate and luminous rate of the AlGaN-based ultraviolet LED epitaxial structure are improved.
附图说明Description of drawings
图1为一实施例的铝镓氮基紫外LED外延结构的结构示意图。FIG. 1 is a schematic structural view of an epitaxial structure of an AlGaN-based ultraviolet LED according to an embodiment.
具体实施方式Detailed ways
为了便于理解本发明,下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施方式。相反地,提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
需要说明的是,当元件被称为“设置于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的,并不表示是唯一的实施方式。It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or there may also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的,不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used in the description of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
本发明涉及一种铝镓氮基紫外LED外延结构。例如,所述铝镓氮基紫外LED外延结构包括:依次层叠设置的衬底、缓冲层、第一铝镓氮层、发光层以及第二铝镓氮层,所述第一铝镓氮层用于提供电子,所述第二铝镓氮层用于提供空穴,所述发光层用于电子和空穴的辐射复合发光;所述第二铝镓氮层包括多个第二铝镓氮子层,多个所述第二铝镓氮子层依次层叠设置,多个所述第二铝镓氮子层的铝组分不同,与所述发光层连接的所述第二铝镓氮子层的铝组分大于其他第二铝镓氮子层的铝组分。靠近所述发光层的第二铝镓氮子层铝组分最大,用于减少电子从发光层中泄露;远离所述发光层的第二铝镓氮子层铝组分最小,用于向发光层提供空穴;不同组分的第二铝镓氮子层,减弱了第二铝镓氮层的内建电场,使得第二铝镓氮层与发光层之间的压电极化效应减弱,从而提高空穴的有效注入率,使得第二铝镓氮子层兼具阻挡电子泄露和增大空穴注入率的功能,进而使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率。The invention relates to an epitaxial structure of an aluminum gallium nitrogen-based ultraviolet LED. For example, the AlGaN-based ultraviolet LED epitaxial structure includes: a substrate, a buffer layer, a first AlGaN layer, a light-emitting layer, and a second AlGaN layer that are sequentially stacked, and the first AlGaN layer is used for The second AlGaN layer is used for providing electrons, the second AlGaN layer is used for providing holes, and the light-emitting layer is used for radiation recombination of electrons and holes to emit light; the second AlGaN layer includes a plurality of second AlGaN layers layer, a plurality of second AlGaN sublayers are stacked in sequence, the aluminum components of the plurality of second AlGaN sublayers are different, and the second AlGaN sublayer connected to the light emitting layer The aluminum composition of the second AlGaN sublayer is greater than that of the other second AlGaN sublayers. The aluminum composition of the second AlGaN sublayer close to the light-emitting layer is the largest, which is used to reduce the leakage of electrons from the light-emitting layer; the aluminum composition of the second AlGaN sublayer far away from the light-emitting layer is the smallest, used to emit light The layer provides holes; the second AlGaN sublayer with different components weakens the built-in electric field of the second AlGaN layer, so that the piezoelectric polarization effect between the second AlGaN layer and the light-emitting layer is weakened, Thereby improving the effective injection rate of holes, so that the second AlGaN sublayer has the functions of blocking electron leakage and increasing the hole injection rate, thereby improving the radiative recombination rate of electrons and holes, and improving the AlGaN-based ultraviolet radiation. Intrinsic Quantum Rate and Luminous Efficiency of LED Epitaxial Structures.
请参阅图1,其为本发明一实施例的铝镓氮基紫外LED外延结构的结构示意图。Please refer to FIG. 1 , which is a schematic structural diagram of an epitaxial structure of an AlGaN-based ultraviolet LED according to an embodiment of the present invention.
一种铝镓氮基紫外LED外延结构10,包括:依次层叠设置的衬底100、缓冲层200、第一铝镓氮层300、发光层400以及第二铝镓氮层500,所述第一铝镓氮层300用于提供电子,所述第二铝镓氮层500用于提供空穴,所述发光层400用于电子和空穴的辐射复合发光;所述第二铝镓氮层500包括多个第二铝镓氮子层510,多个所述第二铝镓氮子层510依次层叠设置,多个所述第二铝镓氮子层510的铝组分不同,与所述发光层400连接的第二铝镓氮子层的铝组分大于其他第二铝镓氮子层的铝组分。An AlGaN-based ultraviolet LED epitaxial structure 10, comprising: a substrate 100, a buffer layer 200, a first AlGaN layer 300, a light-emitting layer 400, and a second AlGaN layer 500, which are sequentially stacked. The AlGaN layer 300 is used to provide electrons, the second AlGaN layer 500 is used to provide holes, and the light-emitting layer 400 is used for radiation recombination of electrons and holes to emit light; the second AlGaN layer 500 It includes a plurality of second AlGaN sublayers 510, the plurality of second AlGaN sublayers 510 are stacked in sequence, and the aluminum components of the plurality of second AlGaN sublayers 510 are different from the light-emitting The aluminum composition of the second AlGaN sublayer to which layer 400 is connected is greater than the aluminum composition of the other second AlGaN sublayers.
在本实施例中,所述第二铝镓氮子层的铝组分为所述第二铝镓氮子层的材质中的铝含量。靠近所述发光层400的第二铝镓氮子层510铝组分最大,用于减少电子从发光层400中泄露;远离所述发光层400的第二铝镓氮子层510铝组分最小,用于向发光层400提供空穴;不同组分的第二铝镓氮子层510,减弱了第二铝镓氮层500的内建电场,使得第二铝镓氮层500与发光层400之间的压电极化效应减弱,从而提高空穴的有效注入率,使得第二铝镓氮子层510兼具阻挡电子泄露和增大空穴注入率的功能,进而使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In this embodiment, the aluminum composition of the second AlGaN sublayer is the aluminum content in the material of the second AlGaN sublayer. The aluminum composition of the second AlGaN sublayer 510 close to the light emitting layer 400 is the largest, which is used to reduce the leakage of electrons from the light emitting layer 400; the aluminum composition of the second AlGaN sublayer 510 far away from the light emitting layer 400 is the smallest , used to provide holes to the light-emitting layer 400; the second AlGaN sublayer 510 with different components weakens the built-in electric field of the second AlGaN layer 500, so that the second AlGaN layer 500 and the light-emitting layer 400 The piezoelectric polarization effect between them is weakened, thereby increasing the effective injection rate of holes, so that the second AlGaN sublayer 510 has the functions of blocking electron leakage and increasing the hole injection rate, thereby making the radiation of electrons and holes The recombination rate is improved, and the internal quantum rate and luminous rate of the AlGaN-based ultraviolet LED epitaxial structure are improved.
在其中一个实施例中,请参阅图1,由靠近所述发光层400至远离所述发光层400的顺序,各所述第二铝镓氮子层510的铝组分依次减小。由于所述二铝镓氮层是由多个所述第二铝镓氮子层510组成的,而且,每一个所述第二铝镓氮子层510的铝组分不同,即靠近所述发光层400的第二铝镓氮子层510的铝组分最大,与所述发光层400最远的所述第二铝镓氮子层510的铝组分最小。在本实施例中,将与所述发光层400连接的所述第二铝镓氮子层510记为第一层,将与所述发光层400距离最远的所述第二铝镓氮子层510记为第二层,位于所述第一层和所述第二层之间的第二铝镓氮子层510记为第三层,所述第三层包括至少一个第三子层,所述第一层的铝组分最大,所述第二层的铝组分最小,所述第三子层的铝组分位于所述第一层的铝组分和所述第二层的铝组分之间,即所述第三子层的铝组分小于所述第一层的铝组分,且大于所述第二层的铝组分。由于所述第一层的铝组分最大,使得所述发光层400内的电子被所述第一层所阻挡,减少了所述发光层400内的电子泄露至所述第二铝镓氮层500中,起到阻挡电子泄露的功能;所述第二层的铝组分最小,而且,所述第二层用于与外部电极连接,用于提供高浓度的空穴,所述第三层的铝组分小于所述第一层的铝组分,用于和所述第二层共同提供高浓度的空穴。这样,所述第二铝镓氮层500由所述第一层、所述第二层以及所述第三层组成,即所述第二铝镓氮层500由铝组分不同的第二铝镓氮子层510组成,也即所述第二铝镓氮层500由铝组分依次减小的第二铝镓氮子层510组成,使得所述第二铝镓氮层500内的相邻两个第二铝镓氮子层510之间形成于内建电场相反的电场,从而使得所述第二铝镓氮层500的内建电场减弱,进而使得所述第二铝镓氮层500与发光层400之间的压电极化效应减弱,提高了空穴的有效注入率,使得第二铝镓氮子层510兼具阻挡电子泄露和增大空穴注入率的功能,提高了电子与空穴的辐射复合率,从而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In one embodiment, please refer to FIG. 1 , the aluminum composition of each of the second AlGaN sub-layers 510 decreases sequentially from close to the light emitting layer 400 to away from the light emitting layer 400 . Since the diAlGaN layer is composed of a plurality of second AlGaN sublayers 510, and each of the second AlGaN sublayers 510 has a different aluminum composition, that is, it is close to the light emitting The second AlGaN sublayer 510 of the layer 400 has the largest aluminum composition, and the second AlGaN sublayer 510 furthest from the light emitting layer 400 has the smallest Al composition. In this embodiment, the second AlGaN sublayer 510 connected to the light emitting layer 400 is recorded as the first layer, and the second AlGaN sublayer 510 that is farthest from the light emitting layer 400 Layer 510 is denoted as a second layer, and the second AlGaN sublayer 510 located between said first layer and said second layer is denoted as a third layer, said third layer comprising at least one third sublayer, The aluminum composition of the first layer is the largest, the aluminum composition of the second layer is the smallest, and the aluminum composition of the third sublayer is between the aluminum composition of the first layer and the aluminum composition of the second layer. Among the components, that is, the aluminum component of the third sublayer is smaller than the aluminum component of the first layer and larger than the aluminum component of the second layer. Since the aluminum composition of the first layer is the largest, the electrons in the light emitting layer 400 are blocked by the first layer, reducing the leakage of electrons in the light emitting layer 400 to the second AlGaN layer In 500, it plays the function of blocking electron leakage; the aluminum component of the second layer is the smallest, and the second layer is used to connect with the external electrode to provide a high concentration of holes, and the third layer The aluminum composition of the first layer is smaller than that of the first layer, and is used to provide a high concentration of holes together with the second layer. In this way, the second AlGaN layer 500 is composed of the first layer, the second layer and the third layer, that is, the second AlGaN layer 500 is composed of a second aluminum alloy with different aluminum components. Gallium nitride sublayer 510, that is, the second AlGaN layer 500 is composed of the second AlGaN sublayer 510 whose aluminum composition decreases successively, so that the adjacent layers in the second AlGaN layer 500 An electric field opposite to the built-in electric field is formed between the two second AlGaN sub-layers 510, so that the built-in electric field of the second AlGaN layer 500 is weakened, so that the second AlGaN layer 500 and The piezoelectric polarization effect between the light-emitting layers 400 is weakened, which improves the effective injection rate of holes, so that the second AlGaN sublayer 510 has the functions of blocking electron leakage and increasing the hole injection rate, and improves the electron and hole injection rate. The radiative recombination rate of the hole, thereby improving the internal quantum rate and luminance of the AlGaN-based UV LED epitaxial structure.
在其中一个实施例中,请参阅图1,由靠近所述发光层400至远离所述发光层400的顺序,各所述第二铝镓氮子层510的铝组分线性减小。在本实施例中,所述第二铝镓氮子层510的数量为四层,从靠近所述发光层400至远离所述发光层400,所述第二铝镓氮层500包括依次层叠设置的第一极化层、第二极化层、第三极化层以及第四极化层,所述第一极化层与所述发光层400背离所述第一铝镓氮层300的一面连接,所述第二极化层与所述第一极化层背离所述发光层400连接,所述第三极化层与所述第二极化层背离所述第一极化层连接,所述第四极化层与所述第三极化层背离所述第二极化层连接。所述第一极化层的铝组分、所述第二极化层的铝组分、所述第三极化层的铝组分以及所述第四极化层的铝组分依次线性减少,即所述第一极化层的铝组分、所述第二极化层的铝组分、所述第三极化层的铝组分以及所述第四极化层的铝组分呈等差数列排列,也即相邻两个所述第二铝镓氮子层510的铝组分的差值的绝对值相等。这样,多个所述第二铝镓氮子层510的铝组分呈线性下降,使得相邻两个所述第二铝镓氮子层510之间形成的电场更加均匀,从而使得所述第二铝镓氮层500的内建电场的减弱均匀,即所述第二铝镓氮层500的内建电场的电场强度依次均匀减弱,从而使得在所述第二铝镓氮层500的内建电场均匀减弱的情况下,提高空穴的有效注入率,使得第二铝镓氮子层510兼具阻挡电子泄露和增大空穴注入率的功能,提高了电子与空穴的辐射复合率,从而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In one embodiment, referring to FIG. 1 , the aluminum composition of each second AlGaN sub-layer 510 decreases linearly from close to the light emitting layer 400 to away from the light emitting layer 400 . In this embodiment, the number of the second AlGaN sub-layers 510 is four layers, from close to the light-emitting layer 400 to away from the light-emitting layer 400, the second AlGaN sub-layers 500 include sequentially stacked The first polarized layer, the second polarized layer, the third polarized layer and the fourth polarized layer, the first polarized layer and the side of the light emitting layer 400 away from the first AlGaN layer 300 connected, the second polarized layer is connected to the first polarized layer away from the light emitting layer 400, the third polarized layer is connected to the second polarized layer away from the first polarized layer, The fourth polarized layer is connected to the third polarized layer away from the second polarized layer. The aluminum composition of the first polarized layer, the aluminum composition of the second polarized layer, the aluminum composition of the third polarized layer, and the aluminum composition of the fourth polarized layer decrease linearly in sequence , that is, the aluminum composition of the first polarized layer, the aluminum composition of the second polarized layer, the aluminum composition of the third polarized layer, and the aluminum composition of the fourth polarized layer are The arithmetic sequence is arranged, that is, the absolute value of the difference between the aluminum components of two adjacent second AlGaN sub-layers 510 is equal. In this way, the aluminum composition of the plurality of second AlGaN sub-layers 510 decreases linearly, so that the electric field formed between two adjacent second AlGaN sub-layers 510 is more uniform, so that the first The weakening of the built-in electric field of the diAlGaN layer 500 is uniform, that is, the electric field intensity of the built-in electric field of the second AlGaN layer 500 is uniformly weakened sequentially, so that the built-in electric field of the second AlGaN layer 500 When the electric field is uniformly weakened, the effective injection rate of holes is increased, so that the second AlGaN sublayer 510 has the functions of blocking electron leakage and increasing the hole injection rate, and improving the radiative recombination rate of electrons and holes, thereby The internal quantum rate and luminous efficiency of the AlGaN-based ultraviolet LED epitaxial structure are improved.
在其中一个实施例中,请参阅图1,所述第二铝镓氮子层510的铝组分为0~0.8。在其中一个实施例中,所述第二铝镓氮子层的铝组分为0~0.8且不为0。在本实施例中,所述第二铝镓氮层500包括四层第二铝镓氮子层510,四层第二铝镓氮子层510的铝组分在0~0.8之间,其中,靠近所述发光层400的第二铝镓氮子层510的铝组分最大,即靠近所述发光层400的第二铝镓氮子层510的铝组分小于且趋近于0.8;与所述发光层400最远位置的第二铝镓氮子层510的铝组分最小,即与所述发光层400最远位置的第二铝镓氮子层510的铝组分大于且趋近于0;位于上述两个第二铝镓氮子层510之间的第二铝镓氮子层510的铝组分位于0~0.8之间。这样,四层所述第二铝镓氮子层510的铝组分各不相同,而且,靠近所述发光层400的第二铝镓氮子层510的铝组分最大,作为电子阻挡层,其作用是阻挡所述发光层400内的电子泄露至所述第二铝镓氮层500中,其他第二铝镓氮子层510的铝组分小于靠近所述发光层400的第二铝镓氮子层510的铝组分,即其他第二铝镓氮子层510提供空穴,其中,与所述发光层400距离最远的第二铝镓氮子层510的铝组分最小,其作用是提供高浓度的空穴。不同铝组分的第二铝镓氮子层510减弱了所述第二铝镓氮层500的内建电场,从而使得所述第二铝镓氮层500与所述发光层400之间的压电极化效应减弱,提高了空穴的有效注入率,使得第二铝镓氮子层510兼具阻挡电子泄露和增大空穴注入率的功能,提高了电子与空穴的辐射复合率,从而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。在其他实施例中,所述第二铝镓氮子层510的铝组分为0.05~0.65,所述第二铝镓氮层500包括依次层叠设置四层第二铝镓氮子层510,四层第二铝镓氮子层510依次为第一极化层、第二极化层、第三极化层以及第四极化层,所述第一极化层的铝组分为0.65,所述第二极化层的铝组分为0.45,所述第三极化层的铝组分为0.25,所述第四极化层的铝组分为0.05。上述四层第二铝镓氮子层510的铝组分的等差值减少,使得相邻两个所述第二铝镓氮子层510之间形成的电场更加均匀,从而使得所述第二铝镓氮层500的内建电场的减弱均匀,即所述第二铝镓氮层500的内建电场的电场强度依次均匀减弱,从而使得在所述第二铝镓氮层500的内建电场均匀减弱的情况下,提高空穴的有效注入率,使得第二铝镓氮子层510兼具阻挡电子泄露和增大空穴注入率的功能,提高了电子与空穴的辐射复合率,从而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In one embodiment, please refer to FIG. 1 , the aluminum composition of the second AlGaN sublayer 510 is 0˜0.8. In one of the embodiments, the aluminum composition of the second AlGaN sub-layer is 0-0.8 and not 0. In this embodiment, the second AlGaN layer 500 includes four second AlGaN sublayers 510, and the aluminum composition of the four second AlGaN sublayers 510 is between 0 and 0.8, wherein, The aluminum composition of the second AlGaN sublayer 510 close to the light emitting layer 400 is the largest, that is, the aluminum composition of the second AlGaN sublayer 510 close to the light emitting layer 400 is less than and close to 0.8; The aluminum composition of the second AlGaN sublayer 510 at the farthest position of the light emitting layer 400 is the smallest, that is, the aluminum composition of the second AlGaN sublayer 510 at the farthest position from the light emitting layer 400 is greater than and close to 0; the aluminum composition of the second AlGaN sublayer 510 located between the two second AlGaN sublayers 510 is between 0 and 0.8. In this way, the aluminum composition of the four second AlGaN sublayers 510 is different, and the aluminum composition of the second AlGaN sublayer 510 close to the light emitting layer 400 is the largest, as an electron blocking layer, Its function is to block electrons in the light emitting layer 400 from leaking into the second AlGaN layer 500, and the aluminum composition of the other second AlGaN sublayers 510 is smaller than that of the second AlGaN sublayers close to the light emitting layer 400 The aluminum composition of the nitrogen sublayer 510, that is, other second AlGaN sublayers 510 provide holes, wherein the aluminum composition of the second AlGaN sublayer 510 farthest from the light-emitting layer 400 is the smallest, which The role is to provide a high concentration of holes. The second AlGaN sublayer 510 with different aluminum composition weakens the built-in electric field of the second AlGaN layer 500, so that the pressure between the second AlGaN layer 500 and the light emitting layer 400 The electric polarization effect is weakened, which improves the effective injection rate of holes, so that the second AlGaN sublayer 510 has the functions of blocking electron leakage and increasing the hole injection rate, and improves the radiative recombination rate of electrons and holes, thereby The internal quantum rate and luminous efficiency of the AlGaN-based ultraviolet LED epitaxial structure are improved. In other embodiments, the aluminum composition of the second AlGaN sublayer 510 is 0.05-0.65, and the second AlGaN layer 500 includes four second AlGaN sublayers 510 stacked in sequence, four The second AlGaN sublayer 510 is sequentially composed of the first polarized layer, the second polarized layer, the third polarized layer and the fourth polarized layer, and the aluminum composition of the first polarized layer is 0.65, so The aluminum composition of the second polarization layer is 0.45, the aluminum composition of the third polarization layer is 0.25, and the aluminum composition of the fourth polarization layer is 0.05. The above-mentioned four-layer second AlGaN sub-layer 510 has a lower difference in aluminum composition, so that the electric field formed between two adjacent second AlGaN sub-layers 510 is more uniform, so that the second The weakening of the built-in electric field of the AlGaN layer 500 is uniform, that is, the electric field strength of the built-in electric field of the second AlGaN layer 500 is uniformly weakened sequentially, so that the built-in electric field of the second AlGaN layer 500 In the case of uniform weakening, the effective injection rate of holes is increased, so that the second AlGaN sublayer 510 has the functions of blocking electron leakage and increasing the hole injection rate, and improving the radiative recombination rate of electrons and holes, thereby improving The internal quantum rate and luminous efficiency of AlGaN-based ultraviolet LED epitaxial structure were studied.
在其中一个实施例中,请参阅图1,多个所述第二铝镓氮子层510的厚度相等。所述铝镓氮基紫外LED外延结构在通电的情况下,相邻两个所述第二铝镓氮子层510的表面之间形成电场,此电场的场强方向和所述第二铝镓氮子层510内的内建电场的场强方向相反,其作用是使得所述第二铝镓氮层500的内建电场减弱,使得空穴从所述第二铝镓氮层500更加容易注入所述发光层400,即提高了空穴的有效注入率。而多个所述第二铝镓氮子层510的厚度均匀且相等,所述第二铝镓氮层500产生的高浓度的空穴依次通过相同的厚度的第二铝镓氮子层510,使得空穴通过每一层所述第二铝镓氮子层510的行程相同,从而使得空穴更加容易通过所述第二铝镓氮层500,提高空穴的有效注入率,从而提高了电子与空穴的辐射复合率,进而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In one embodiment, please refer to FIG. 1 , the plurality of second AlGaN sub-layers 510 have the same thickness. When the AlGaN-based ultraviolet LED epitaxial structure is energized, an electric field is formed between the surfaces of two adjacent second AlGaN sub-layers 510, and the field strength direction of this electric field is the same as that of the second AlGaN sublayer 510. The field strength direction of the built-in electric field in the nitrogen sub-layer 510 is opposite, and its effect is to weaken the built-in electric field of the second AlGaN layer 500, making it easier for holes to be injected from the second AlGaN layer 500 The light-emitting layer 400 improves the effective injection rate of holes. While the thicknesses of the plurality of second AlGaN sublayers 510 are uniform and equal, the high-concentration holes generated by the second AlGaN layers 500 pass through the second AlGaN sublayers 510 with the same thickness in sequence, Make holes travel through the second AlGaN sub-layer 510 in the same way, so that holes can pass through the second AlGaN layer 500 more easily, and the effective injection rate of holes is improved, thereby improving the efficiency of electrons. The radiative recombination rate with the holes, thereby improving the internal quantum rate and luminous rate of the AlGaN-based ultraviolet LED epitaxial structure.
在其中一个实施例中,请参阅图1,所述第二铝镓氮子层510的厚度为20~30nm。在本实施例中,所述第二铝镓氮层500包括四层所述第二铝镓氮子层510,所述第二铝镓氮子层510的材质均为铝镓氮,只是每一层的第二铝镓氮子层510的铝组分不同。四层所述第二铝镓氮子层510依次层叠设置,每一层的所述第二铝镓氮子层510的厚度相同,四层厚度相等且铝组分不同的所述第二铝镓氮子层510共同组成所述第二铝镓氮层500。在所述铝镓氮基紫外LED外延结构通电的情况下,所述第二铝镓氮层500用于产生空穴,其中,远离所述发光层400的所述铝镓氮子层的铝组成分小于靠近所述发光层400的所述铝镓氮子层的铝组成分,远离所述发光层400的所述铝镓氮子层用于产生高浓度的空穴,而厚度相等的四层第二铝镓氮子层510使得各所述铝镓氮子层的空穴有效注入率增大,从而使得所述铝镓氮层的空穴有效注入率增大,提高了电子与空穴的辐射复合率,进而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。在其他实施例中,四层所述第二铝镓氮子层510的厚度相等,且每一所述第二铝镓氮子层510的厚度为25nm,使得在确保所述第二铝镓氮层500的空穴有效注入率的情况下,降低所述第二铝镓氮层500的厚度,从而减小铝镓氮基紫外LED外延结构的整体厚度。In one embodiment, please refer to FIG. 1 , the thickness of the second AlGaN sublayer 510 is 20-30 nm. In this embodiment, the second AlGaN layer 500 includes four layers of the second AlGaN sublayers 510, and the materials of the second AlGaN sublayers 510 are all AlGaN, except that each The aluminum composition of the second AlGaN sublayer 510 of the layer is different. Four layers of the second AlGaN sublayers 510 are stacked in sequence, the thickness of the second AlGaN sublayers 510 in each layer is the same, and the four second AlGaN sublayers 510 have the same thickness and different aluminum components. The nitrogen sublayer 510 together constitutes the second AlGaN layer 500 . When the AlGaN-based ultraviolet LED epitaxial structure is energized, the second AlGaN layer 500 is used to generate holes, wherein the aluminum composition of the AlGaN sublayer far away from the light emitting layer 400 is The aluminum composition composition of the AlGaN sublayer close to the light emitting layer 400 is smaller than that of the AlGaN sublayer far away from the light emitting layer 400 for generating high-concentration holes, and the four layers with equal thickness The second AlGaN sublayer 510 increases the effective hole injection rate of each of the AlGaN sublayers, thereby increasing the effective hole injection rate of the AlGaN layer and improving the electron-hole ratio. The radiative recombination rate improves the internal quantum rate and luminous rate of the AlGaN-based ultraviolet LED epitaxial structure. In other embodiments, the thicknesses of the four second AlGaN sublayers 510 are equal, and each of the second AlGaN sublayers 510 has a thickness of 25 nm, so that the second AlGaN In the case of the effective hole injection rate of the layer 500, the thickness of the second AlGaN layer 500 is reduced, thereby reducing the overall thickness of the AlGaN-based ultraviolet LED epitaxial structure.
在其中一个实施例中,请参阅图1,所述第二铝镓氮层500的掺杂原子包括镁原子。在本实施例中,所述第二铝镓氮层500的材质为是P型铝镓氮,且所述第二铝镓氮层500是通过极化掺杂的工艺制作而成,所述第二铝镓氮层500包括四层所述第二铝镓氮子层510,即所述第二铝镓氮层500包括一次层叠设置的第一极化掺杂铝镓氮层、第二极化掺杂铝镓氮层、第三极化掺杂铝镓氮层以及第四极化掺杂铝镓氮层,所述第一极化掺杂铝镓氮层与所述发光层400连接,所述第一极化掺杂铝镓氮层、所述第二极化掺杂铝镓氮层、所述第三极化掺杂铝镓氮层以及所述第四极化掺杂铝镓氮层的铝组分依次线性减少。由于所述第二铝镓氮层500的各层是相同的材质,即所述第一极化掺杂铝镓氮层、所述第二极化掺杂铝镓氮层、所述第三极化掺杂铝镓氮层以及所述第四极化掺杂铝镓氮层的材质均为P型铝镓氮,使得所述第二铝镓氮层500掺杂更加容易,其中,所述第二铝镓氮层500掺杂的原子为镁原子,根据镁原子的活泼性强于铝原子,使得镁原子还在铝镓氮层混合物中产生的空穴增多,从而使得所述第二铝镓氮层500提供的空穴浓度增大,便于所述第二铝镓氮层500为所述发光层400提供高浓度的空穴,进而提高了所述第二铝镓氮层500的空穴有效注入率,提高了电子与空穴的辐射复合率,进而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。在其他实施例中,所述第二铝镓氮层500的掺杂原子还包括其他可产生大量空穴的原子,例如,所述第二铝镓氮层500的掺杂原子包括金原子;又如,所述第二铝镓氮层500的掺杂原子包括银原子。上述掺杂原子用于提高所述第二铝镓氮层500的空穴数量,使得所述第二铝镓氮层500的空穴有效注入率增大,便于提高了电子与空穴的辐射复合率,进而提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In one embodiment, please refer to FIG. 1 , the dopant atoms of the second AlGaN layer 500 include magnesium atoms. In this embodiment, the material of the second AlGaN layer 500 is P-type AlGaN, and the second AlGaN layer 500 is made by a polarization doping process. The diAlGaN layer 500 includes four layers of the second AlGaN sublayer 510, that is, the second AlGaN layer 500 includes a first polarization-doped AlGaN layer, a second polarization a doped AlGaN layer, a third polarization doped AlGaN layer, and a fourth polarization doped AlGaN layer, the first polarization doped AlGaN layer is connected to the light-emitting layer 400, and the The first polarization doped AlGaN layer, the second polarization doped AlGaN layer, the third polarization doped AlGaN layer and the fourth polarization doped AlGaN layer The aluminum component of the order decreases linearly. Since each layer of the second AlGaN layer 500 is made of the same material, that is, the first polarization-doped AlGaN layer, the second polarization-doped AlGaN layer, and the third pole The material of the polarization-doped AlGaN layer and the fourth polarization-doped AlGaN layer is P-type AlGaN, which makes doping of the second AlGaN layer 500 easier, wherein the first The atoms doped in the dialuminium-gallium-nitride layer 500 are magnesium atoms. According to the activity of the magnesium atoms is stronger than that of the aluminum atoms, the magnesium atoms also generate more holes in the mixture of the aluminum-gallium-nitride layer, so that the second aluminum-gallium-nitride layer The hole concentration provided by the nitrogen layer 500 is increased, so that the second AlGaN layer 500 can provide high-concentration holes for the light-emitting layer 400, thereby improving the hole effectiveness of the second AlGaN layer 500. The injection rate improves the radiative recombination rate of electrons and holes, thereby improving the internal quantum rate and luminous rate of the epitaxial structure of the AlGaN-based UV LED. In other embodiments, the doping atoms of the second AlGaN layer 500 also include other atoms that can generate a large number of holes, for example, the doping atoms of the second AlGaN layer 500 include gold atoms; For example, the dopant atoms of the second AlGaN layer 500 include silver atoms. The above-mentioned dopant atoms are used to increase the number of holes in the second AlGaN layer 500, so that the effective hole injection rate of the second AlGaN layer 500 increases, which facilitates the improvement of the radiative recombination of electrons and holes. rate, thereby improving the internal quantum rate and luminous rate of the AlGaN-based ultraviolet LED epitaxial structure.
在其中一个实施例中,所述第二铝镓氮层500包括四层铝组分依次线性减少的P型铝镓氮层,所述第二铝镓氮层500的掺杂原子为镁原子,其掺杂浓度为1×1017cm-3,所述衬底100包括C面蓝宝石衬底100,所述缓冲层200包括未掺杂的铝镓氮层,所述缓冲层200的厚度为1~2μm,所述第一铝镓氮层300为N型铝镓氮层,所述第一铝镓氮层300的厚度为1~3μm,所述发光层400包括多个量子垒层和多个量子阱层,所述量子垒层和所述量子阱层依次层叠设置,所述量子垒层的厚度为8~20μm,所述量子阱层的厚度为2~7μm。这样,靠近所述发光层的第二铝镓氮子层铝组分最大,用于减少电子从发光层中泄露;远离所述发光层的第二铝镓氮子层铝组分最小,用于向发光层提供空穴;不同组分的第二铝镓氮子层,减弱了第二铝镓氮层的内建电场,使得第二铝镓氮层与发光层之间的压电极化效应减弱,从而提高空穴的有效注入率,使得第二铝镓氮子层兼具阻挡电子泄露和增大空穴注入率的功能,进而使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In one of the embodiments, the second AlGaN layer 500 includes four P-type AlGaN layers whose aluminum composition decreases linearly in sequence, and the dopant atoms of the second AlGaN layer 500 are magnesium atoms, Its doping concentration is 1×10 17 cm -3 , the substrate 100 includes a C-plane sapphire substrate 100 , the buffer layer 200 includes an undoped AlGaN layer, and the thickness of the buffer layer 200 is 1 ~2μm, the first AlGaN layer 300 is an N-type AlGaN layer, the thickness of the first AlGaN layer 300 is 1~3μm, and the light emitting layer 400 includes multiple quantum barrier layers and multiple Quantum well layer, the quantum barrier layer and the quantum well layer are stacked in sequence, the thickness of the quantum barrier layer is 8-20 μm, and the thickness of the quantum well layer is 2-7 μm. In this way, the aluminum composition of the second AlGaN sublayer close to the light-emitting layer is the largest, which is used to reduce the leakage of electrons from the light-emitting layer; the aluminum composition of the second AlGaN sublayer far away from the light-emitting layer is the smallest, used for Provide holes to the light-emitting layer; the second AlGaN sublayer with different components weakens the built-in electric field of the second AlGaN layer, making the piezoelectric polarization effect between the second AlGaN layer and the light-emitting layer weakening, thereby improving the effective injection rate of holes, so that the second AlGaN sublayer has the function of blocking electron leakage and increasing the hole injection rate, thereby increasing the radiative recombination rate of electrons and holes, and improving the AlGaN Intrinsic Quantum Rate and Luminous Efficiency of Epitaxial Structures Based on UV LEDs.
在其中一个实施例中,所述第二铝镓氮层500包括四层厚度相等的所述第二铝镓氮子层510,每一所述第二铝镓氮子层510的厚度为20~30nm,即所述第二铝镓氮层500的厚度为80~120nm。其中,四层所述第二铝镓氮子层510分别为依次层叠设置的第一极化掺杂铝镓氮层、第二极化掺杂铝镓氮层、第三极化掺杂铝镓氮层以及第四极化掺杂铝镓氮层,所述第一极化掺杂铝镓氮层与所述发光层400背离所述第一铝镓氮层300连接,所述第一极化掺杂铝镓氮层的铝组分为0.65,所述第二极化掺杂铝镓氮层的铝组分为0.45,所述第三极化掺杂铝镓氮层的铝组分为0.25,所述第四极化掺杂铝镓氮层的铝组分为0.05。In one of the embodiments, the second AlGaN layer 500 includes four second AlGaN sublayers 510 with the same thickness, each of the second AlGaN sublayers 510 has a thickness of 20˜ 30 nm, that is, the thickness of the second AlGaN layer 500 is 80-120 nm. Wherein, the four second AlGaN sub-layers 510 are the first polarization-doped AlGaN layer, the second polarization-doped AlGaN layer, the third polarization-doped AlGaN layer, and the third polarization-doped AlGaN layer, respectively. A nitrogen layer and a fourth polarization-doped Al-GaN layer, the first polarization-doped Al-GaN layer is connected to the light-emitting layer 400 away from the first Al-GaN layer 300, and the first polarization The aluminum composition of the doped AlGaN layer is 0.65, the aluminum composition of the second polarization doped AlGaN layer is 0.45, and the aluminum composition of the third polarization doped AlGaN layer is 0.25 , the aluminum composition of the fourth polarization-doped AlGaN layer is 0.05.
上述铝镓氮基紫外LED外延结构,靠近所述发光层的第二铝镓氮子层铝组分最大,用于减少电子从发光层中泄露;远离所述发光层的第二铝镓氮子层铝组分最小,用于向发光层提供空穴;不同组分的第二铝镓氮子层,减弱了第二铝镓氮层的内建电场,使得第二铝镓氮层与发光层之间的压电极化效应减弱,从而提高空穴的有效注入率,使得第二铝镓氮子层兼具阻挡电子泄露和增大空穴注入率的功能,进而使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率。In the above-mentioned AlGaN-based ultraviolet LED epitaxial structure, the aluminum component of the second AlGaN sublayer close to the light-emitting layer is the largest, which is used to reduce the leakage of electrons from the light-emitting layer; the second AlGaN sublayer far away from the light-emitting layer The smallest aluminum composition is used to provide holes to the light-emitting layer; the second Al-GaN sub-layer with different components weakens the built-in electric field of the second Al-GaN layer, so that the second Al-GaN layer and the light-emitting layer The piezoelectric polarization effect between them is weakened, thereby increasing the effective injection rate of holes, so that the second AlGaN sublayer has the functions of blocking electron leakage and increasing the hole injection rate, thereby enabling the radiative recombination of electrons and holes The rate is improved, and the internal quantum rate and luminous rate of the AlGaN-based ultraviolet LED epitaxial structure are improved.
在其中一个实施例中,本申请还提供一种紫外LED灯,包括灯座、灯罩以及上述任一实施例中所述的铝镓氮基紫外LED外延结构,所述铝镓氮基紫外LED外延结构设置于所述灯座上,所述灯罩与所述灯座连接,且罩设所述铝镓氮基紫外LED外延结构。In one embodiment, the present application also provides an ultraviolet LED lamp, including a lamp holder, a lampshade, and the AlGaN-based ultraviolet LED epitaxial structure described in any of the above-mentioned embodiments, and the AlGaN-based ultraviolet LED epitaxial structure The structure is arranged on the lamp holder, the lampshade is connected with the lamp holder, and the AlGaN-based ultraviolet LED epitaxial structure is covered.
上述紫外LED灯中,靠近所述发光层的第二铝镓氮子层铝组分最大,用于减少电子从发光层中泄露;远离所述发光层的第二铝镓氮子层铝组分最小,用于向发光层提供空穴;不同组分的第二铝镓氮子层,减弱了第二铝镓氮层的内建电场,使得第二铝镓氮层与发光层之间的压电极化效应减弱,从而提高空穴的有效注入率,使得第二铝镓氮子层兼具阻挡电子泄露和增大空穴注入率的功能,进而使得电子与空穴的辐射复合率提高,提高了铝镓氮基紫外LED外延结构的内量子率和发光率,即提高紫外LED灯的发光效率。In the above-mentioned ultraviolet LED lamp, the aluminum composition of the second AlGaN sublayer close to the light-emitting layer is the largest, which is used to reduce the leakage of electrons from the light-emitting layer; the aluminum composition of the second AlGaN sublayer far away from the light-emitting layer is The minimum is used to provide holes to the light-emitting layer; the second AlGaN sublayer with different components weakens the built-in electric field of the second AlGaN layer, making the pressure between the second AlGaN layer and the light-emitting layer The electric polarization effect is weakened, thereby increasing the effective injection rate of holes, so that the second AlGaN sublayer has the functions of blocking electron leakage and increasing the hole injection rate, thereby increasing the radiative recombination rate of electrons and holes, improving The internal quantum rate and luminous efficiency of the AlGaN-based ultraviolet LED epitaxial structure are improved, that is, the luminous efficiency of the ultraviolet LED lamp is improved.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The various technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.
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