CN110549223B - Water jet machining device - Google Patents
Water jet machining device Download PDFInfo
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- CN110549223B CN110549223B CN201910444907.XA CN201910444907A CN110549223B CN 110549223 B CN110549223 B CN 110549223B CN 201910444907 A CN201910444907 A CN 201910444907A CN 110549223 B CN110549223 B CN 110549223B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
- B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
技术领域technical field
本发明涉及水射流加工装置,通过喷射已加压的液体而对被加工物进行加工。The present invention relates to a water jet processing device for processing a workpiece by spraying pressurized liquid.
背景技术Background technique
在以利用由树脂构成的密封材料(模制树脂)对配置在基板上的器件芯片进行包覆而成的封装基板和形成有多个器件的半导体晶片等为代表的板状的被加工物的分割中,主要使用安装有圆环状的切削刀具的切削装置。在将被加工物保持在切削装置所具有的卡盘工作台上的状态下,使切削刀具旋转而切入至被加工物,从而能够将被加工物切断。For plate-shaped workpieces such as packaging substrates in which device chips placed on a substrate are covered with a sealing material (molding resin) made of resin, and semiconductor wafers on which multiple devices are formed, etc. For division, a cutting device equipped with an annular cutting blade is mainly used. With the workpiece held on the chuck table included in the cutting device, the cutting blade is rotated to cut into the workpiece, thereby cutting the workpiece.
在被加工物中包含金属的情况下,当通过切削刀具对被加工物进行切削时,有时该金属与切削刀具接触而被拉长,产生须状的飞边。该飞边会导致通过被加工物的分割而得到的芯片的品质降低,因此期望在对被加工物进行分割时极力抑制飞边的产生。When the workpiece contains metal, when the workpiece is cut with a cutting tool, the metal may be elongated in contact with the cutting tool, and whisker-like flashes may be generated. Since the burrs cause a decrease in the quality of chips obtained by dividing the workpiece, it is desired to suppress the generation of burrs as much as possible when dividing the workpiece.
为了抑制飞边的产生,提出了使用水射流加工装置而对被加工物进行分割的方法。该水射流加工装置将水用泵加压而朝向被加工物喷射,从而进行将被加工物的一部分去除等的加工。在专利文献1和专利文献2中公开了沿着封装基板的间隔道(分割预定线)喷射高压水而将封装基板分割成多个芯片的方法。In order to suppress generation of burrs, a method of dividing a workpiece using a water jet processing device has been proposed. This water jet processing apparatus pressurizes water with a pump and sprays it toward a workpiece to perform processing such as removing a part of the workpiece. Patent Document 1 and
另外,还提出了在被加工物的切削中一边使用切削刀具一边利用水射流将因切削加工而产生的飞边去除的方法。在专利文献3中公开了一种加工装置,其中,在与切削刀具相邻的位置设置有喷射高压水的去飞边喷嘴,该去飞边喷嘴朝向利用切削刀具对被加工物进行切削而形成的切削槽喷射高压水而将飞边去除。In addition, there has been proposed a method of removing burrs generated by cutting with a water jet while using a cutting tool during cutting of a workpiece. Patent Document 3 discloses a machining device in which a deburring nozzle that sprays high-pressure water is provided at a position adjacent to a cutting tool, and the deburring nozzle is directed toward a workpiece formed by cutting a workpiece with a cutting tool. The cutting groove sprays high-pressure water to remove the flash.
专利文献1:日本特开2004-130401号公报Patent Document 1: Japanese Patent Laid-Open No. 2004-130401
专利文献2:日本特开2012-109327号公报Patent Document 2: Japanese Patent Laid-Open No. 2012-109327
专利文献3:日本特开2016-157722号公报Patent Document 3: Japanese Patent Laid-Open No. 2016-157722
在水射流加工装置中安装有从喷射口朝向被加工物喷射高压水的喷射喷嘴。该喷射喷嘴的喷射口的形状和直径根据加工区域的大小、加工区域的形状、被加工物的材质等各种加工条件进行设定,因此当加工条件改变时,需要更换喷射喷嘴。A spray nozzle that sprays high-pressure water from a spray port toward a workpiece is attached to the water jet processing device. The shape and diameter of the injection port of the injection nozzle are set according to various processing conditions such as the size of the processing area, the shape of the processing area, and the material of the workpiece. Therefore, when the processing conditions change, the injection nozzle needs to be replaced.
该喷射喷嘴的更换通过对水射流加工装置进行操作的操作者来进行,但在操作者弄错要安装的喷射喷嘴的情况下,会通过错误的喷射喷嘴进行加工,有可能无法适当地对被加工物进行加工而产生不良品。因此,优选在进行了喷射喷嘴的更换之后,对水射流加工装置中是否安装了适当的喷射喷嘴进行确认,从而防止通过错误的喷射喷嘴进行加工。The replacement of this spray nozzle is carried out by the operator who operates the water jet processing device, but if the operator mistakenly installs the spray nozzle, the processing will be performed with the wrong spray nozzle, and it may not be possible to properly process the spray nozzle. Processed products are processed to produce defective products. Therefore, it is preferable to check whether or not an appropriate spray nozzle is attached to the water jet processing apparatus after exchanging the spray nozzle, so as to prevent processing with a wrong spray nozzle.
但是,喷射喷嘴安装于复杂地配置有多个部件的水射流加工装置的内部。因此,一旦将喷射喷嘴安装于水射流加工装置,之后就难以对该喷射喷嘴的种类、喷射口的直径等进行确认。However, the spray nozzle is mounted inside a water jet processing device in which a plurality of components are arranged in a complicated manner. Therefore, once the spray nozzle is attached to the water jet processing apparatus, it is difficult to confirm the type of the spray nozzle, the diameter of the spray port, and the like thereafter.
发明内容Contents of the invention
本发明是鉴于该问题而完成的,其目的在于提供水射流加工装置,即使在将喷射喷嘴安装于水射流加工装置之后,也能够确定所安装的喷射喷嘴。The present invention has been made in view of this problem, and an object of the present invention is to provide a water jet processing device capable of specifying the mounted spray nozzle even after the spray nozzle is mounted on the water jet processing device.
根据本发明的一个方式,提供水射流加工装置,其中,该水射流加工装置具有:喷射单元,其以能够装卸的方式安装有喷射喷嘴,该喷射喷嘴将已加压的液体喷射至对被加工物进行保持的卡盘工作台上所保持的该被加工物;移动单元,其使该卡盘工作台和该喷射喷嘴相对地移动;以及喷嘴判定部,其对该喷射喷嘴的直径或面积进行判定,该喷射单元具有泵,该泵根据电动机的转速而对该液体进行加压,该喷嘴判定部具有:电动机转速存储部,其按照该喷射喷嘴的喷射口的直径或面积而存储有为了按照规定的压力从该喷射喷嘴的喷射口喷射该液体而需要的该电动机的转速;判定部,其参照存储于该电动机转速存储部的信息,根据从该喷射喷嘴按照规定的压力喷射了该液体时的该电动机的转速,对喷射了该液体的该喷射喷嘴的喷射口的直径或面积进行判定;以及通知部,其通知该判定部的判定结果。According to one aspect of the present invention, there is provided a water jet processing device, wherein the water jet processing device has: a spray unit detachably mounted with a spray nozzle for spraying a pressurized liquid onto the object to be processed; The workpiece held on the chuck table holding the object; the moving unit that relatively moves the chuck table and the injection nozzle; and the nozzle determination unit that evaluates the diameter or area of the injection nozzle It is determined that the injection unit has a pump that pressurizes the liquid according to the rotation speed of the motor, and the nozzle determination unit has: a motor rotation speed storage unit that stores information according to the diameter or area of the injection port of the injection nozzle. The rotation speed of the motor required to inject the liquid from the injection port of the injection nozzle at a predetermined pressure; the rotation speed of the motor to determine the diameter or area of the injection port of the injection nozzle that injects the liquid; and a notification unit that notifies the determination result of the determination unit.
另外,优选该喷射喷嘴判定部还具有喷嘴种类存储部,该喷嘴种类存储部按照该喷射喷嘴的喷射口的直径或面积而存储有该喷射喷嘴的种类,该判定部参照存储于该喷嘴种类存储部的信息,根据已根据该电动机的转速进行了判定的该喷射喷嘴的喷射口的直径或面积,进一步对该喷嘴的种类进行判定,该通知部通知利用该判定部而判定的该喷嘴的种类。In addition, it is preferable that the injection nozzle determination unit further has a nozzle type storage unit that stores the type of the injection nozzle according to the diameter or area of the injection port of the injection nozzle, and that the determination unit refers to the nozzle type storage unit. The information of the injection nozzle further determines the type of the nozzle based on the diameter or area of the injection nozzle of the injection nozzle that has been determined based on the rotation speed of the motor, and the notification unit notifies the type of the nozzle determined by the determination unit. .
另外,优选该水射流加工装置还具有切削单元,该切削单元利用切削刀具对该卡盘工作台上所保持的该被加工物进行切削。In addition, it is preferable that the water jet processing apparatus further includes a cutting unit that cuts the workpiece held on the chuck table with a cutting tool.
另外,优选该泵是柱塞泵,从该喷射喷嘴按照规定的压力喷射该液体时的该电动机的转速是通过输入至与该电动机连接的逆变器的信号而指定的该电动机的转速或是通过与该电动机连接的编码器所检测的该电动机的转速。In addition, it is preferable that the pump is a plunger pump, and the rotation speed of the motor when the liquid is injected from the injection nozzle at a predetermined pressure is the rotation speed of the motor specified by a signal input to an inverter connected to the motor or The rotational speed of the motor detected by the encoder connected to the motor.
本发明的一个方式的水射流加工装置具有喷嘴判定部,该喷嘴判定部根据与对液体进行加压的泵连接的电动机的转速,确定已安装于水射流加工装置的喷射喷嘴。由此,能够对水射流加工装置中是否安装了适当的喷射喷嘴进行确认,能够防止通过错误的喷射喷嘴对被加工物进行加工而产生加工不良。A water jet processing device according to one aspect of the present invention includes a nozzle determination unit for specifying a spray nozzle mounted on the water jet processing device based on the rotation speed of a motor connected to a pump that pressurizes liquid. Thereby, it is possible to confirm whether or not an appropriate spray nozzle is attached to the water jet processing apparatus, and it is possible to prevent processing defects caused by processing a workpiece with a wrong spray nozzle.
附图说明Description of drawings
图1是示出水射流加工装置的立体图。FIG. 1 is a perspective view showing a water jet processing device.
图2的(A)是示出框架单元的立体图,图2的(B)是示出被加工物的放大立体图。FIG. 2(A) is a perspective view showing a frame unit, and FIG. 2(B) is an enlarged perspective view showing a workpiece.
图3是示出水射流单元的局部剖视侧视图。Fig. 3 is a partially cutaway side view showing the water jet unit.
图4的(A)和图4的(B)是示出喷射喷嘴的主视图。4(A) and 4(B) are front views showing the spray nozzle.
图5是示出从喷射喷嘴被喷射的液体的压力与电动机的转速的关系的图表。FIG. 5 is a graph showing the relationship between the pressure of the liquid injected from the injection nozzle and the rotational speed of the motor.
图6是示出水射流加工装置的外观的立体图。Fig. 6 is a perspective view showing the appearance of the water jet processing device.
图7是示出通过切削单元进行加工的情况的局部剖视主视图。Fig. 7 is a partially cutaway front view showing a state of machining by a cutting unit.
图8是示出通过水射流单元进行加工的情况的局部剖视主视图。Fig. 8 is a partially cutaway front view showing the state of processing by the water jet unit.
标号说明Label description
2:水射流加工装置;4:基台;4a:开口;4b:开口;4c:开口;6:盒支承台;8:盒;10:X轴移动机构;12:工作台罩;14:防尘防滴罩;16:暂放机构;16a、16b:导轨;18:卡盘工作台;18a:保持面;20:夹具;22:切削单元;24:水射流单元;26:支承构造;28a、28b:移动单元;30:Y轴导轨;32a、32b:Y轴移动板;34a、34b:Y轴滚珠丝杠;36:Y轴脉冲电动机;38a、38b:Z轴导轨;40a、40b:Z轴移动板;42a、42b:Z轴滚珠丝杠;44:Z轴脉冲电动机;46a、46b:拍摄单元;48:清洗单元;50:喷射喷嘴;50a:喷射口;52:液体;54:罩;54a:开口;54b:缘;54c:开口;56:管;60:泵单元;62:泵;64:流量控制单元;66:电动机;68:逆变器;70:编码器;72:液体提供源;80:控制部;82:流量控制部;84:加压控制部;90:喷嘴判定部;92:电动机转速存储部;94:喷嘴种类存储部;96:判定部;98:通知部;100:喷射喷嘴;100a:喷射口;100b:流路;102:喷射喷嘴;102a:喷射口;102b:流路;110:罩;112:监视器;114:显示灯;120:主轴;122:切削刀具;11:被加工物;11a:切削槽;13:基板;13a:正面;13b:背面;15:树脂层;15a:正面;15b:凹部;17:粘接带;19:环状框架;21:框架单元;23:间隔道。2: Water jet processing device; 4: Abutment; 4a: Opening; 4b: Opening; 4c: Opening; 6: Box supporting platform; 8: Box; 10: X-axis moving mechanism; Dust drip-proof cover; 16: Temporary release mechanism; 16a, 16b: Guide rail; 18: Chuck table; 18a: Holding surface; 20: Fixture; 22: Cutting unit; 24: Water jet unit; 26: Supporting structure; 28a , 28b: moving unit; 30: Y-axis guide rail; 32a, 32b: Y-axis moving plate; 34a, 34b: Y-axis ball screw; 36: Y-axis pulse motor; 38a, 38b: Z-axis guide rail; 40a, 40b: Z-axis moving plate; 42a, 42b: Z-axis ball screw; 44: Z-axis pulse motor; 46a, 46b: shooting unit; 48: cleaning unit; 50: injection nozzle; 50a: injection port; 52: liquid; 54: Cover; 54a: opening; 54b: rim; 54c: opening; 56: tube; 60: pump unit; 62: pump; 64: flow control unit; 66: motor; 68: inverter; 70: encoder; 72: Liquid supply source; 80: control unit; 82: flow rate control unit; 84: pressurization control unit; 90: nozzle determination unit; 92: motor speed storage unit; 94: nozzle type storage unit; 96: determination unit; 98: notification 100: injection nozzle; 100a: injection port; 100b: flow path; 102: injection nozzle; 102a: injection port; 102b: flow path; 110: cover; 112: monitor; 114: display lamp; 120: spindle; 122: cutting tool; 11: workpiece; 11a: cutting groove; 13: substrate; 13a: front; 13b: back; 15: resin layer; 15a: front; 15b: recess; 17: adhesive tape; 19: ring shape frame; 21: frame unit; 23: spacer.
具体实施方式Detailed ways
以下,参照附图对本实施方式进行说明。图1是示出本实施方式的水射流加工装置2的立体图。水射流加工装置2通过切削刀具对被加工物进行切削,并且将已加压的液体喷射至被加工物而对被加工物进行加工。另外,在图1中,用块示出水射流加工装置2的结构的一部分。Hereinafter, this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view showing a water
水射流加工装置2具有对构成水射流加工装置2的各构成要素进行支承的基台4。在基台4的前方的角部形成有开口4a,在该开口4a内设置有通过升降机构(未图示)进行升降的盒支承台6。在盒支承台6的上表面上搭载有对多个被加工物进行收纳的盒8。另外,在图1中,为了便于说明,仅示出盒8的轮廓。The water
被加工物在支承于环状框架的状态下收纳在盒8内。图2的(A)是示出通过环状框架19对被加工物11进行支承的框架单元21的立体图。The workpiece is accommodated in the cassette 8 in a state supported by the ring frame. (A) of FIG. 2 is a perspective view showing the
被加工物11是封装基板,其具有形成为俯视矩形状的板状的基板13和配置在基板13的正面13a侧的多个器件芯片(未图示)。在基板13的正面13a侧形成有对多个器件芯片进行密封的树脂层(模制树脂)15。另外,这里,作为一例,对被加工物11是封装基板的情况进行说明,但被加工物11的种类没有限制。例如,被加工物11也可以是在正面上形成有IC(Integrated Circuit:集成电路)等器件的半导体晶片等。The
在基板13的背面13b侧粘贴有圆形的粘接带17,该圆形的粘接带17具有能够覆盖基板13的整个背面13b的直径。沿着粘接带17的外周粘贴有环状框架19,并且将基板13的背面13b侧粘贴于粘接带17的中央部,从而构成由被加工物11、粘接带17和环状框架19形成的框架单元21,被加工物11在树脂层15向上方露出的状态下支承于环状框架19。但是,也可以按照基板13的背面13b侧向上方露出的方式将树脂层15粘贴于粘接带17。A circular
图2的(B)是示出被加工物11的放大立体图。被加工物11由按照相互交叉的方式呈格子状排列的多条间隔道(分割预定线)23划分成多个区域。将被加工物11沿着间隔道23进行分割而进行单片化,从而得到分别包含器件芯片的多个封装器件。(B) of FIG. 2 is an enlarged perspective view showing the
另外,在树脂层15的正面15a侧沿着间隔道23形成有俯视椭圆状的多个凹部(腔体)15b。凹部15b配置成使其长轴方向沿着与间隔道23的长度方向垂直的方向,凹部15b的深度小于树脂层15的厚度。Also, on the
在树脂层15的内部配置有与通过树脂层15覆盖的器件芯片连接的金属(电极),当在树脂层15的正面15a侧形成凹部15b时,该金属在凹部15b的内壁和底面露出。在将被加工物11分割成多个封装器件且将各个封装器件安装于其他安装基板时,该露出的金属作为与形成在安装基板侧的端子连接的连接用的电极发挥功能。Metal (electrode) connected to the device chip covered by the
在图1所示的盒支承台6的侧方按照长度方向沿着X轴方向(前后方向、加工进给方向)的方式形成有矩形的开口4b。在开口4b内配置有滚珠丝杠式的X轴移动机构10以及覆盖X轴移动机构10的上部的工作台罩12和防尘防滴罩14。X轴移动机构10具有被工作台罩12覆盖的X轴移动工作台(未图示),使该X轴移动工作台在X轴方向上移动。A
在与盒支承台6的侧方接近的位置设置有用于暂放被加工物11的暂放机构16。暂放机构16例如包含一边维持与Y轴方向(左右方向、分度进给方向)平行的状态一边相互接近和远离的一对导轨16a、16b。一对导轨16a、16b在X轴方向上对从盒8中拉出的被加工物11进行夹持而使其对齐在规定的位置。A
在X轴移动工作台的上表面上按照从工作台罩12露出的方式设置有对被加工物11进行吸引保持的卡盘工作台18。该卡盘工作台18与电动机等旋转驱动源(未图示)连结,绕与Z轴方向(铅垂方向)大致平行的旋转轴旋转。另外,卡盘工作台18通过X轴移动机构10与X轴移动工作台及工作台罩12一起在X轴方向上移动。A chuck table 18 for sucking and holding the
卡盘工作台18的上表面构成对被加工物11进行吸引保持的保持面18a。保持面18a相对于X轴方向和Y轴方向大致平行地形成,经由设置于卡盘工作台18的内部的吸引路(未图示)等而与喷射器等吸引源(未图示)连接。The upper surface of the chuck table 18 constitutes a holding
在卡盘工作台18的周围设置有四个夹具20,该四个夹具20从四边对支承被加工物11的环状框架19(参照图2的(A))进行固定。另外,在与开口4b相邻的区域配置有将被加工物11搬送至卡盘工作台18等的搬送单元(未图示)。Four clamps 20 are provided around the chuck table 18, and the four clamps 20 fix the ring frame 19 (see FIG. 2(A) ) supporting the workpiece 11 from four sides. In addition, a transfer unit (not shown) for transferring the
在卡盘工作台18的上方设置有:切削单元22,其通过环状的切削刀具对被加工物11进行切削;以及水射流单元24,其将已加压的液体喷射至被加工物11。另外,在基台4的上表面上按照跨越开口4b的方式配置有用于对切削单元22和水射流单元24进行支承的门型的支承构造26。Above the chuck table 18 are provided: a cutting
在支承构造26的前表面上部设置有:移动单元28a,其使切削单元22在Y轴方向和Z轴方向上移动;以及移动单元28b,其使水射流单元24在Y轴方向和Z轴方向上移动。On the upper part of the front surface of the
移动单元28a具有Y轴移动板32a,移动单元28b具有Y轴移动板32b。Y轴移动板32a和Y轴移动板32b以能够滑动的方式安装于一对Y轴导轨30上,该一对Y轴导轨30沿着Y轴方向配置在支承构造26的前表面上。The moving
在Y轴移动板32a的背面侧(后面侧)设置有螺母部(未图示),在该螺母部中螺合有Y轴滚珠丝杠34a,该Y轴滚珠丝杠34a设置成沿着相对于Y轴导轨30大致平行的方向。另外,在Y轴移动板32b的背面侧(后面侧)设置有螺母部(未图示),在该螺母部中螺合有Y轴滚珠丝杠34b,该Y轴滚珠丝杠34b设置成沿着相对于Y轴导轨30大致平行的方向。A nut part (not shown) is provided on the back side (rear side) of the Y-
在Y轴滚珠丝杠34a、34b的一个端部分别连结有Y轴脉冲电动机36。通过与Y轴滚珠丝杠34a连结的Y轴脉冲电动机36使Y轴滚珠丝杠34a旋转,从而Y轴移动板32a沿着Y轴导轨30在Y轴方向上移动。另外,通过与Y轴滚珠丝杠34b连结的Y轴脉冲电动机36使Y轴滚珠丝杠34b旋转,从而Y轴移动板32b沿着Y轴导轨30在Y轴方向上移动。Y-
在Y轴移动板32a的正面(前表面)侧沿着Z轴方向设置有一对Z轴导轨38a,在Y轴移动板32b的正面(前表面)侧沿着Z轴方向设置有一对Z轴导轨38b。另外,在一对Z轴导轨38a上以能够滑动的方式安装有Z轴移动板40a,在一对Z轴导轨38b上以能够滑动的方式安装有Z轴移动板40b。A pair of Z-
在Z轴移动板40a的背面侧(后面侧)设置有螺母部(未图示),在该螺母部中螺合有Z轴滚珠丝杠42a,该Z轴滚珠丝杠42a设置成沿着相对于Z轴导轨38a大致平行的方向。在Z轴滚珠丝杠42a的一个端部连结有Z轴脉冲电动机44,通过该Z轴脉冲电动机44使Z轴滚珠丝杠42a旋转,从而Z轴移动板40a沿着Z轴导轨38a在Z轴方向上移动。A nut part (not shown) is provided on the back side (rear side) of the Z-
在Z轴移动板40b的背面侧(后面侧)设置有螺母部(未图示),在该螺母部中螺合有Z轴滚珠丝杠42b,该Z轴滚珠丝杠42b设置成沿着相对于Z轴导轨38b大致平行的方向。在Z轴滚珠丝杠42b的一个端部连结有Z轴脉冲电动机44,通过该Z轴脉冲电动机44使Z轴滚珠丝杠42b旋转,从而Z轴移动板40b沿着Z轴导轨38b在Z轴方向上移动。A nut portion (not shown) is provided on the back side (rear side) of the Z-
在Z轴移动板40a的下部设置有切削单元22。在与切削单元22相邻的位置设置有用于对卡盘工作台18所吸引保持的被加工物11等进行拍摄的拍摄单元(相机)46a。另外,在Z轴移动板40b的下部设置有水射流单元24。在与水射流单元24相邻的位置设置有用于对卡盘工作台18所吸引保持的被加工物11等进行拍摄的拍摄单元(相机)46b。A cutting
通过移动单元28a对切削单元22和拍摄单元46a的Y轴方向和Z轴方向的位置进行控制,通过移动单元28b对水射流单元24和拍摄单元46b的Y轴方向和Z轴方向的位置进行控制。即,分别独立地控制切削单元22的位置和水射流单元24的位置。The positions in the Y-axis direction and the Z-axis direction of the cutting
在位于开口4b的侧方的与开口4a相反的一侧的区域形成有开口4c。在开口4c内配置有用于对被加工物11进行清洗的清洗单元48,在卡盘工作台18上实施了规定的加工的被加工物11通过清洗单元48进行清洗。An opening 4c is formed in a region on the side of the
使安装于切削单元22的环状的切削刀具(未图示)旋转而切入至被加工物11,从而能够进行被加工物11的切削加工。具体而言,切削单元22具有主轴,该主轴在相对于卡盘工作台18的保持面18a大致平行的方向上具有轴心,在该主轴的前端部安装有环状的切削刀具。切削刀具例如通过电铸磨具构成,该电铸磨具是利用镀镍将金刚石磨粒固定而成的。The
主轴与电动机等旋转驱动源连结,安装于主轴的切削刀具通过从旋转驱动源传递的力进行旋转。使切削刀具旋转而切入至卡盘工作台18所保持的被加工物11,使被加工物11和切削刀具沿着X轴方向(加工进给方向)相对地进行移动,从而对被加工物11进行切削。The main shaft is connected to a rotational drive source such as a motor, and the cutting tool attached to the main shaft is rotated by force transmitted from the rotational drive source. The cutting tool is rotated to cut into the
另外,将已加压的液体从水射流单元24朝向被加工物11喷射,从而能够进行被加工物11的一部分的去除、形成于被加工物11的金属的飞边的去除等加工。另外,在后文对使用水射流单元24的飞边的去除进行叙述。In addition, by spraying the pressurized liquid from the
图3是示出水射流单元24的局部剖视侧视图。在水射流单元24中安装有能够装卸的喷射喷嘴50,该喷射喷嘴50朝向下方喷射已加压的液体52。喷射喷嘴50与对液体进行加压而提供的泵单元60(参照图1)连接,从泵单元60提供的液体从喷射喷嘴50的喷射口50a朝向被加工物11喷射,从而对被加工物11进行加工。FIG. 3 is a partially cutaway side view showing the
另外,水射流单元24具有覆盖喷射喷嘴50的下部的罩54。罩54形成为内部空洞的半球状(碗型),在罩54的俯视时位于中央的区域(顶部)设置有开口54a。在该开口54a中插入喷射喷嘴50,罩54按照使圆环状的缘54b与卡盘工作台18的保持面18a对置的方式安装于喷射喷嘴50。Moreover, the
如图3所示,在从喷射喷嘴50喷射液体52而对被加工物11进行加工时,罩54定位成覆盖被加工物11的被加工区域。因此,通过罩54防止因加工而产生的雾或加工屑的飞散。另外,罩54的形状只要能够防止雾或加工屑的飞散则可以适当进行变更。例如,罩54可以形成为内部空洞的圆锥状。As shown in FIG. 3 , when the
另外,在罩54上,在与开口54a不同的位置形成有开口54c,开口54c与设置于罩54的外侧的管56的一端连接。该管56的另一端与吸引源(未图示)连接,通过被加工物11的加工而在罩54的内部产生的雾或加工屑经由管56而被吸引去除。In addition, in the
另外,喷射喷嘴50的位置能够通过图1所示的移动单元28b进行控制。通过对移动单元28b进行控制,能够使卡盘工作台18和喷射喷嘴50相对地移动。In addition, the position of the
如图1所示,水射流单元24与泵单元60连接。泵单元60对水等液体进行加压而提供至水射流单元24的喷射喷嘴50。另外,泵单元60与控制部80连接,泵单元60的动作通过控制部80进行控制。As shown in FIG. 1 , the
泵单元60具有对液体进行加压的泵62。泵62与由容器等构成的液体提供源72连接,从液体提供源72提供的水等液体通过泵62进行加压。The
另外,泵62经由流量控制单元64而与液体提供源72连接,通过该流量控制单元64对从液体提供源72提供至泵62的液体的流量进行控制。流量控制单元64与控制部80连接,流量控制单元64的动作通过控制部80进行控制。In addition, the
具体而言,控制部80具有与流量控制单元64连接的流量控制部82。流量控制部82对流量控制单元64的动作进行控制,以便按照规定的流量从液体提供源72向泵62提供液体。另外,是否从液体提供源72向泵62提供液体也能够通过流量控制单元64进行控制。Specifically, the
另外,泵62与电动机66连接,根据电动机66的转速,对从流量控制单元64提供的液体的压力进行控制。作为这样根据电动机66的转速而对液体进行加压的泵62,例如可以使用柱塞泵。In addition, the
另外,在电动机66上连接有逆变器68,逆变器68按照从控制部80输出的信号对电动机66的转速进行控制。具体而言,控制部80具有与逆变器68连接的加压控制部84,加压控制部84对逆变器68输出指定电动机66的转速(频率)的信号。当该信号被输入至逆变器68时,逆变器68按照加压控制部84所指定的转速(指令频率)使电动机66旋转。In addition, an
并且,根据逆变器68所控制的电动机66的转速,泵62将液体加压至规定的压力。其结果是,将规定的压力的液体提供至水射流单元24的喷射喷嘴50(参照图3),从喷射口50a朝向被加工物11喷射液体52。Then, the
另外,在电动机66上连接有编码器70,通过编码器70对电动机66的转速进行检测。将编码器70所检测的电动机66的转速输出至控制部80。In addition, an
在从水射流单元24对被加工物11喷射已加压的液体52时,首先从液体提供源72经由流量控制单元64对泵62提供规定的流量的液体,并且通过逆变器68对电动机66的转速进行控制。然后,泵62将液体加压至与电动机66的转速对应的压力。另外,此时的电动机66的转速通过编码器70进行检测并输出至控制部80。然后通过泵62将已加压至规定的压力的液体提供至水射流单元24。When the
这样,通过水射流单元24和泵单元60构成对从液体提供源72提供的液体进行加压而对卡盘工作台18所保持的被加工物11喷射液体的单元(喷射单元)。In this manner, the
另外,使盒支承台6升降的升降机构、X轴移动机构10、卡盘工作台18、搬送单元(未图示)、切削单元22、移动单元28a、28b、拍摄单元46a、46b、清洗单元48等构成要素也与控制部80连接,通过控制部80对它们的动作进行控制。In addition, an elevating mechanism for elevating and descending the cartridge support table 6, an
在通过水射流单元24对被加工物11进行加工时,有时需要根据加工条件(加工区域的大小、加工区域的形状、被加工物11的材质等)而变更喷射喷嘴50的喷射口50a的形状、直径。在该情况下,由操作者进行更换喷射喷嘴50的作业,但当操作者弄错要安装的喷射喷嘴50时,通过错误的喷射喷嘴50对被加工物11进行加工,有可能产生加工不良。When the
本实施方式的水射流加工装置2具有喷嘴判定部90,该喷嘴判定部90对已安装于水射流单元24的喷射喷嘴50的种类进行判别。在对喷射喷嘴50进行更换之后,通过喷嘴判定部90对已安装于水射流单元24的喷射喷嘴50的种类进行确认,从而能够防止通过错误的喷射喷嘴50对被加工物11进行加工而产生加工不良。The water
喷射喷嘴50的种类例如能够根据喷射喷嘴50的喷射口50a的直径或面积来进行区别。图4的(A)是示出作为喷射喷嘴50的一例的喷射喷嘴100的主视图,图4的(B)是示出作为喷射喷嘴50的其他例的喷射喷嘴102的主视图。喷射喷嘴100和喷射喷嘴102的喷射口的直径不同。The type of the
喷射喷嘴100具有喷射液体的圆形的喷射口100a,喷射口100a经由形成于喷射喷嘴100的内部的流路100b而与泵单元60(参照图1)连接。喷射喷嘴102也同样地具有喷射液体的圆形的喷射口102a,喷射口102a经由形成于喷射喷嘴102的内部的流路102b而与泵单元60(参照图1)连接。The
喷射喷嘴102的喷射口102a的直径大于喷射喷嘴100的喷射口100a的直径。具体而言,喷射口100a形成为直径的圆形,喷射口102a形成为直径的圆形。The diameter of the
从喷射喷嘴喷射的液体的压力根据泵单元60所具有的泵62对液体进行加压的程度而决定,泵62的加压通过电动机66的转速进行控制。即,为了从喷射喷嘴喷射规定的压力的液体,需要按照与该压力相对应的规定的转速使电动机66旋转。其中,从喷射喷嘴喷射的液体的压力与电动机66的转速的关系根据喷射喷嘴的种类而不同。The pressure of the liquid sprayed from the spray nozzle is determined by the degree to which the
图5是对于具有直径的喷射口100a的喷射喷嘴100和具有直径的喷射口102a的喷射喷嘴102分别示出从喷射喷嘴喷射的液体的压力与电动机66的转速(频率)的关系的图表。在图5中示出为了从喷射喷嘴按照规定的压力(0MPa至70MPa)喷射液体所需的电动机66的转速。Figure 5 is for a diameter The
如图5所示,从喷射喷嘴喷射的液体的压力与电动机66的转速的关系根据喷射喷嘴的喷射口的直径而不同。因此,预先按照喷射口的直径记录从喷射喷嘴喷射的液体的压力与电动机66的转速的关系,在更换喷射喷嘴时,从更换后的喷射喷嘴按照规定的压力喷射液体,对此时的电动机66的转速进行检测,从而能够确定喷射口的直径,判定喷射喷嘴的种类。As shown in FIG. 5 , the relationship between the pressure of the liquid injected from the injection nozzle and the rotation speed of the
另外,喷射喷嘴的种类也可以根据喷射喷嘴的直径以外的参数进行判定。例如预先按照喷射口的面积记录从喷射喷嘴喷射的液体的压力与电动机66的转速的关系,通过确定喷射喷嘴的喷射口的面积,也能够判定喷射喷嘴的种类。In addition, the type of the injection nozzle may be determined based on parameters other than the diameter of the injection nozzle. For example, the relationship between the pressure of the liquid sprayed from the spray nozzle and the rotation speed of the
图1所示的控制部80具有喷嘴判定部90,该喷嘴判定部90对已安装于水射流单元24的喷射喷嘴50的种类进行判定。并且,喷嘴判定部90根据从已安装于水射流单元24的喷射喷嘴50的喷射口50a按照规定的压力喷射液体时的电动机66的转速来确定喷射口50a的直径或面积,从而对喷射喷嘴50的种类进行判定。具体而言,喷嘴判定部90具有:电动机转速存储部92,其存储有从喷射喷嘴喷射的液体的压力与电动机66的转速的关系;以及喷嘴种类存储部94,其存储有喷射喷嘴的种类。The
在电动机转速存储部92中按照喷射喷嘴的喷射口的直径或面积存储有为了从喷射喷嘴按照规定的压力喷射液体所需的电动机66的转速。即,将图5所示那样的液体的压力与电动机66的转速的关系存储于电动机转速存储部92。存储于电动机转速存储部92的数据例如通过预先进行如下的实验而获取:从喷射口的直径或面积不同的多个喷射喷嘴喷射液体,记录此时的液体的压力与电动机66的转速。The motor rotation
在喷嘴种类存储部94中存储有多个喷射喷嘴的喷射口的直径或面积以及具有该直径或面积的喷射喷嘴的种类。作为喷射喷嘴的种类,例如可以使用喷射喷嘴的名称、识别记号、分类记号等。另外,在图1中,独立地设置电动机转速存储部92和喷嘴种类存储部94,但电动机转速存储部92和喷嘴种类存储部94也可以通过单一的存储部构成。The nozzle
另外,喷嘴判定部90具有判定部96,该判定部96参照存储于电动机转速存储部92和喷嘴种类存储部94的信息,对已安装于水射流单元24的喷射喷嘴50的喷射口50a的直径或面积以及喷射喷嘴50的种类进行判定。In addition, the
对判定部96输入从安装于水射流单元24的喷射喷嘴50按照规定的压力(指定压力)喷射液体时的电动机66的转速(输入转速)。该输入转速例如从加压控制部84输入至判定部96。另外,输入转速与通过从加压控制部84输入至逆变器68的信号所指定的电动机66的转速(指令频率)相同。The rotation speed (input rotation speed) of the
另外,关于是否从喷射喷嘴50按照规定的压力(指定压力)喷射液体,例如能够利用压力测量器对通过泵62加压的液体的压力进行测量而确认。该压力测量器例如设置于从泵62至喷射喷嘴50的喷射口50a的液体的流路上。并且,判定部96根据输入转速,参照存储于电动机转速存储部92的信息而对喷射喷嘴50的直径或面积进行判别。In addition, whether or not the liquid is ejected from the
例如考虑在电动机转速存储部92中存储有图5所示的压力与电动机的转速的关系。在对已安装于水射流单元24的喷射喷嘴50的种类进行判别时,判定部96参照存储于电动机转速存储部92的信息并根据从加压控制部84输入的输入转速,来确定喷射喷嘴50是图5所示的2种喷射喷嘴中的哪一个喷射喷嘴。For example, consider that the relationship between the pressure and the rotational speed of the motor shown in FIG. 5 is stored in the motor rotational
具体而言,对于图5所示的两种喷射喷嘴,分别参照为了使从液体提供源72按照一定的流量提供的液体按照指定压力喷射而需要的电动机的转速(参照转速)。并且,对两种参照转速是否与输入转速一致(或两种参照转速与输入转速之差是否为一定值以下)进行判定,从而确定已安装于水射流单元24的喷射喷嘴50是两种喷射喷嘴中的哪一个喷射喷嘴。由此,通过判定部96对喷射喷嘴50的喷射口50a的直径进行判定(第1判定步骤)。Specifically, for the two types of injection nozzles shown in FIG. 5 , the rotation speed (reference rotation speed) of the motor required to inject the liquid supplied at a constant flow rate from the
另外,对判定部96输入通过与电动机66连接的编码器70所检测的电动机66的转速。判定部96可以代替从加压控制部84输出的电动机66的转速而使用通过编码器70所检测的电动机66的转速来对喷射口50a的直径或面积进行判定。在该情况下,根据实际的电动机66的转速而确定喷射口50a的直径或面积,可以省略从加压控制部84对判定部96输入电动机66的转速。In addition, the rotation speed of the
接着,判定部96参照存储于喷嘴种类存储部94的信息,根据在第1判定步骤中判定的喷射口50a的直径或面积,对喷射喷嘴50的种类进行判定(第2判定步骤)。例如在喷嘴种类存储部94中按照多个喷射喷嘴的喷射口的直径或面积与这些喷射喷嘴的识别记号相关联的状态进行存储。在该情况下,判定部96对在上述第1判定步骤中判定的喷射口50a的直径或面积与存储于喷嘴种类存储部94的多个喷射喷嘴的喷射口的直径或面积进行比较。Next, the
然后,判定部96确定存储于喷嘴种类存储部94的多个喷射喷嘴中的其直径或面积与在第1判定步骤中判定的喷射口50a的直径或面积一致的喷射喷嘴(或直径或面积之差为一定以下的喷射喷嘴),并确定该喷射喷嘴的种类(识别记号)。由此,对已安装于水射流单元24的喷射喷嘴50的种类进行判定。Then, the judging
将通过判定部96判定出的喷射喷嘴50的种类从判定部96输出至通知部98,由通知部98通知给操作者。通知部98例如由设置于水射流加工装置2的监视器构成。The type of the
图6是示出水射流加工装置2的外观的立体图。如图6所示,水射流加工装置2的构成要素的一部分被罩110覆盖,在罩110的侧面侧设置有作为用户接口的触摸面板式的监视器112。监视器112的动作通过控制部80(参照图1)进行控制。FIG. 6 is a perspective view showing the appearance of the water
将通过判定部96判定出的喷射喷嘴50的种类显示于监视器112。由此,操作者能够确认已安装于水射流单元24的喷射喷嘴50的种类。The type of the
另外,在上述中,对在通知部98显示喷射喷嘴50的种类的情况进行了说明,也可以在通知部98显示喷射喷嘴50的喷射口50a的直径或面积。在该情况下,判定部96在实施了第1判定步骤之后,将喷射口50a的直径或面积的信息输出至通知部98,通知部98对喷射口50a的直径或面积进行显示。这样在通知部98显示喷射口50a的直径或面积的情况下,可以省略喷嘴种类存储部94和第2判定步骤。In addition, above, the case where the type of the
另外,作为通知部98,可以使用除了监视器112以外的设备。例如设置于罩110的上表面侧的显示灯114可以通知喷射喷嘴50的种类。在该情况下,通过显示灯114的点亮颜色或点亮图案等来表示喷射喷嘴50的种类。另外,显示灯114的动作通过控制部80(参照图1)进行控制。In addition, a device other than the
如上所述,本实施方式的水射流加工装置2具有喷嘴判定部90,该喷嘴判定部90根据与对液体进行加压的泵62连接的电动机66的转速而确定水射流单元24中所安装的喷射喷嘴50。由此,能够确认水射流单元24中是否安装了适当的喷射喷嘴50,能够防止通过错误的喷射喷嘴50对被加工物11进行加工而产生加工不良。As described above, the water
上述的设置于水射流加工装置2的水射流单元24可以单独对被加工物11进行加工,也可以与切削单元22一起对被加工物11进行加工。以下,对使用切削单元22和水射流单元24这双方对图2的(B)所示的被加工物11进行加工的例子进行说明。The above-mentioned
图7是示出通过切削单元22进行加工的情况的局部剖视主视图。卡盘工作台18的上表面构成对被加工物11进行吸引保持的保持面18a,保持面18a经由设置于卡盘工作台18的内部的吸引路(未图示)等而与吸引源(未图示)连接。FIG. 7 is a partially cutaway front view showing the state of machining by the cutting
在卡盘工作台18的上方配置有用于对被加工物11进行切削的切削单元22。切削单元22具有主轴120,该主轴120在相对于保持面18a大致平行的方向上具有轴心,在主轴120的前端部安装有环状的切削刀具122。另外,主轴120与电动机等旋转驱动源(未图示)连结,安装于主轴120的切削刀具122通过从旋转驱动源传递的力进行旋转。A cutting
在对被加工物11进行加工时,首先将被加工物11隔着粘接带17而配置在卡盘工作台18的保持面18a上,并且通过夹具20对环状框架19进行固定。在该状态下使吸引源的负压作用于保持面18a,从而被加工物11隔着粘接带17而被卡盘工作台18吸引保持。When processing the
接着,使主轴120旋转而使切削刀具122切入至树脂层15的正面15a侧。然后,使卡盘工作台18在与保持面18a大致平行且与主轴120的轴心大致垂直的方向(加工进给方向)上移动,从而使被加工物11和切削刀具122沿着间隔道23(参照图2的(B))相对地移动。由此,在被加工物11上沿着间隔道23形成有直线状的切削槽11a。Next, the
另外,在树脂层15的正面15a侧沿着间隔道23形成有凹部15b,在凹部15b的内部,与被树脂层15覆盖的器件芯片(未图示)连接的金属露出。另外,切削刀具122按照使其下端配置于比凹部15b的底靠下侧且比基板13的背面13b靠上侧的位置的方式进行定位。因此,切削槽11a的深度大于凹部15b的深度且小于被加工物11的厚度,成为未将被加工物11完全切断的状态。Further, on the
当这样沿着间隔道23对被加工物11进行切削时,在凹部15b的内部露出的金属与切削刀具122接触而被拉长,有时在通过被加工物11的切削而生成的面(切削面)上产生由金属形成的须状的飞边。当该飞边残留在凹部15b的内部时,会成为在之后的工序中使在凹部15b的内部露出的金属与其他金属(安装基板的连接端子等)连接时的障碍,因此优选将飞边去除。因此,在利用切削刀具122对被加工物11进行切削之后,通过水射流单元24将残留在切削槽11a的内部的飞边去除。When the
图8是示出通过水射流单元24进行加工的情况的局部剖视主视图。在被加工物11上形成了切削槽11a之后,如图8所示,按照将喷射口50a配置于切削槽11a上的方式对水射流单元24所具有的喷射喷嘴50进行定位。然后,从泵单元60(参照图1)对水射流单元24提供已加压的液体,从而从喷射口50a朝向切削槽11a按照规定的压力喷射液体52。FIG. 8 is a partially cutaway front view showing the state of processing by the
由此,残留在凹部15b的内部的飞边被液体52吹飞而去除。另外,水射流单元24对飞边的去除是在未将被加工物11完全切断的状态下进行的。因此,能够防止由于已加压的液体52的喷射而使被加工物11的单片从粘接带17脱落。As a result, the burrs remaining inside the
水射流单元24的移动通过移动单元28b(参照图1)独立于切削单元22而进行控制。因此,能够自由设定喷射已加压的液体52的位置。例如在通过切削刀具122形成了一个切削槽11c之后,使水射流单元24沿着该切削槽11c相对地移动,对切削槽11c喷射液体52而能够将飞边去除。The movement of the
其中,实施飞边的去除的时机不限于上述时机。例如也可以在沿着所有间隔道23形成了切削槽11a之后,一起进行飞边的去除。另外,也可以在通过切削单元22对一个切削槽11c进行切削的同时,使水射流单元24沿着已经形成的其他切削槽11c相对地移动而进行飞边的去除。在该情况下,能够按照同时进行的方式实施被加工物11的切削和飞边的去除。However, the timing at which flash removal is performed is not limited to the above-mentioned timing. For example, after the cutting
在完成水射流单元24对飞边的去除之后,使用切削单元22沿着间隔道23对被加工物11进行进一步切削。此时,切削刀具122按照下端配置于比基板13的背面13b靠下侧的位置的方式进行定位。由此,沿着间隔道23对被加工物11进行分割。沿着所有的间隔道23进行该切削,从而将被加工物11分割成多个封装器件。After the flash is removed by the
另外,在通过水射流单元24将飞边去除时,根据被加工物11的材质、厚度、切削槽11c的形状、深度等,选择适当的喷射喷嘴50,安装于水射流单元24。此时,通过图1所示的喷嘴判定部90对是否安装了适当的喷射喷嘴50进行确认,从而能够适当地实施飞边的去除。In addition, when removing burrs by the
除此以外,上述实施方式的构造、方法等只要不脱离本发明的目的的范围,则可以适当地变更并实施。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as it does not deviate from the scope of the objective of this invention.
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KR102713531B1 (en) | 2024-10-04 |
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JP7072986B2 (en) | 2022-05-23 |
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