CN110548949B - Wire bonding device and circuit board wire bonding machine - Google Patents
Wire bonding device and circuit board wire bonding machine Download PDFInfo
- Publication number
- CN110548949B CN110548949B CN201910779971.3A CN201910779971A CN110548949B CN 110548949 B CN110548949 B CN 110548949B CN 201910779971 A CN201910779971 A CN 201910779971A CN 110548949 B CN110548949 B CN 110548949B
- Authority
- CN
- China
- Prior art keywords
- wire
- clamping
- circuit board
- clamp
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 132
- 238000005476 soldering Methods 0.000 claims abstract description 63
- 238000003466 welding Methods 0.000 claims abstract description 63
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000000155 melt Substances 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000523 sample Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 15
- 230000008093 supporting effect Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003031 feeding effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the field of electronic soldering machinery, in particular to a wire welding device, wherein a support frame and a positioning jig are arranged on a machine base, a soldering mechanism is arranged on the support frame and used for preheating and welding a welding position, when a circuit board is positioned in the positioning jig, a welded wire stretches to the welding point position of the circuit board, the soldering mechanism preheats the welding point position of the circuit board and the welding position of the wire, after preheating, the soldering mechanism melts tin to achieve the purpose of welding the wire and the circuit board, the problem that the welding point position of the wire and the circuit board is heated too quickly due to direct welding after melting the tin, uneven heating is caused to damage a plating layer on a wire copper wire and a copper wire is avoided, the quality and the welding stability after welding are improved, and the soldering mechanism is arranged on the support frame and positioned in the positioning jig, so that manual welding is replaced, and the efficiency is improved.
Description
Technical Field
The invention relates to the field of wire soldering machinery, in particular to a soldering device and a circuit board wire bonding machine.
Background
The welding of cables to circuit boards is a common technique in the electronics industry, if built-in antennas such as RF antennas, WIFI antennas, etc. The traditional wire is welded on the circuit board, and the conductor end of the wire is welded on the circuit board by using the electric iron by hands of operators, however, along with continuous progress of technology and high labor cost, the automatic electric iron soldering machine gradually replaces manual operation, improves the production efficiency and reduces the labor cost. However, in the current electronic field, the circuit board and the welded cable are smaller and smaller, when the electric soldering is used for automatic welding, the frequency of changing the soldering iron head is high, the phenomenon of insufficient soldering tin, poor soldering quality, high repair welding rate and delay of labor due to short circuit caused by poor tin point pull tips and the like is easily caused, the copper wire in many current wires is small in diameter and is usually provided with a silver coating, and therefore, in the soldering tin process, the electric soldering iron melts the tin wire to be contacted with the wires, the temperature of a dropped conductor is instantaneously increased, and the phenomenon of unstable heating to destroy part of base materials or welding spots is easily caused.
Disclosure of Invention
The invention aims to solve the technical problems that the soldering device and the circuit board wire bonding machine are provided to solve the problems that the current welding equipment is poor in welding effect when welding wires on a circuit board and unstable in base material or welding spot due to uneven heating.
In order to solve the technical problems, the technical scheme of the invention is that the wire bonding device comprises:
A base;
the support frame is arranged on the stand;
The positioning jig is arranged on the machine base and is used for clamping and positioning the circuit board to be welded;
and the soldering tin mechanism is arranged on the supporting frame and used for preheating and welding a welding position.
Preferably, the soldering mechanism is a laser soldering head.
The circuit board bonding machine comprises the bonding device and further comprises:
A wire clamping mechanism arranged at one side of the soldering tin mechanism and used for clamping the wire to be soldered on the circuit board, and
The feeding mechanical arm is arranged on the base and used for transferring the electric wire to be welded to the wire clamping mechanism;
The feeding manipulator clamps the wire to be welded on the wire clamping mechanism, and after the soldering mechanism preheats the welding contact of the circuit board and the end part of the wire, tin at the end part of the wire is melted, so that the wire is welded on the circuit board.
The feeding manipulator comprises a first linear module, a first connecting plate, a first wire clamp, a second linear module, a second connecting plate and a third wire clamp, wherein the first linear module is arranged on the base, the first connecting plate is arranged on a movable seat of the first linear module, the first wire clamp is arranged at the bottom of the first connecting plate, a clamping opening faces downwards, the second wire clamp is arranged on the base, the clamping opening faces upwards, the second linear module is arranged on the base and is parallel to the first linear module, the second connecting plate is arranged on a movable seat of the second linear module, the third wire clamp is arranged at the bottom of the second connecting plate, the first linear module drives the first wire clamp to clamp a wire to be placed on the second wire clamp, and the second linear module drives the third wire clamp to clamp the wire on the second wire clamp to be placed on the wire clamping mechanism.
Preferably, the first wire clamp, the second wire clamp and the third wire clamp are all pneumatic clamps, and the pneumatic clamp comprises a first finger cylinder, a first clamping jaw and a second clamping jaw, wherein the first clamping jaw and the second clamping jaw are arranged on two clamping blocks of the first finger cylinder, and the first finger cylinder drives the first clamping jaw and the second clamping jaw to clamp an electric wire.
The clamping device comprises a first clamping jaw, a second clamping jaw, a first wire clamp, a second wire clamp, a third wire clamp, a clamping part, a first clamping jaw and a second clamping jaw, wherein the first clamping jaw is provided with a V-shaped clamping opening, the opposite sides of the first clamping jaw and the second clamping jaw are provided with a V-shaped clamping opening, the inner side wall of the V-shaped clamping opening of the first clamping jaw is provided with a plurality of clearance grooves, the V-shaped clamping opening of the second clamping jaw is provided with a plurality of clearance spaces, the adjacent clearance spaces form the clamping part, when the first clamping jaw and the second clamping jaw are clamped, the clamping part is clamped into the clearance grooves, and the center of the clamped second wire clamp and the center of the clamped third wire clamp are on the same straight line.
Preferably, the machine base is further provided with a detection probe for positioning the end part of the electric wire clamped on the second wire clamp.
Preferably, the soldering mechanism comprises a laser soldering head and a tin feeder arranged on the support frame, and the output end of the tin feeder extends to the bottom end of the laser soldering head.
The wire clamping mechanism comprises a mounting plate arranged on the support frame, a pneumatic sliding table arranged on the side face of the mounting plate, a second finger cylinder arranged at the bottom end of the sliding part of the pneumatic sliding table, a third clamping jaw and a fourth clamping jaw which are arranged on two clamping blocks, V-shaped clamping openings are arranged on the opposite sides of the third clamping jaw and the fourth clamping jaw, a plurality of second clearance grooves are formed in the inner side wall of each V-shaped clamping opening of the third clamping jaw, a plurality of second clearance holes are formed in each V-shaped clamping opening of the fourth clamping jaw, a second clamping part is formed between every two adjacent second clearance holes, and when the third clamping jaw and the fourth clamping jaw are clamped, the second clamping part is clamped into each second clearance groove.
Preferably, a pressing cylinder is further arranged on the side face of the sliding part of the pneumatic sliding table, a third connecting plate is arranged at the lifting end of the pressing cylinder, a pressing plate is arranged at the bottom of the third connecting plate, and the pressing cylinder pushes the pressing plate to press down the electric wire clamped on the third clamping jaw and the fourth clamping jaw, so that the welding end of the electric wire is in contact with the circuit board.
Further, the circuit board wire bonding machine further comprises a translation mechanism arranged on the support frame, and the soldering tin mechanism and the wire clamping mechanism are arranged on a moving seat of the translation mechanism.
Further, the circuit board wire bonding machine further comprises a positioning conveying mechanism which is arranged on the machine base and used for conveying and positioning the positioning jig below the wire bonding mechanism.
Preferably, the positioning and conveying mechanism is an electric linear module arranged on the machine base, and the positioning jig is arranged on a movable seat of the electric linear module.
Preferably, the machine base is also provided with a circuit board feeding mechanism for placing the circuit board in the positioning jig, and the circuit board feeding mechanism comprises a triaxial manipulator and a positioning material frame which are arranged on the machine base, a carrier plate arranged on the lifting part of the triaxial manipulator, and a sucker arranged at the bottom of the carrier plate.
Preferably, the two sides of the positioning and conveying mechanism are also provided with belt conveying mechanisms which are fixedly connected with the machine base, a lifting mechanism arranged in the machine base drives a lifting plate to move up and down, the positioning and conveying mechanism is arranged on the lifting plate, the circuit board feeding mechanism adsorbs a circuit board on the two belt conveying mechanisms, the two belt conveying mechanisms convey the circuit board to the upper part of the positioning jig, the lifting mechanism pushes the positioning jig to lift, and the positioning jig clamps the positioning circuit board.
Preferably, an auxiliary conveying mechanism is further arranged between the feeding manipulator and the belt conveying mechanism.
Compared with the prior art, the circuit board wire bonding machine has the following beneficial effects:
1. The welding machine comprises a machine base, a support frame, a positioning jig, a soldering tin mechanism, a welding wire copper wire, a welding stability and a welding wire, wherein the support frame and the soldering jig are arranged on the machine base, the soldering tin mechanism is arranged on the support frame and is used for preheating and welding at a welding position;
2. the soldering tin mechanism is arranged on the supporting frame, and the circuit board is positioned in the positioning jig, so that manual welding is replaced, the efficiency is improved, the soldering tin quantity can be mastered, the soldering tin on the circuit board is prevented from being conducted with other electronic components, and the problem of short circuit is avoided.
Drawings
FIG. 1 is a block diagram of a soldering apparatus according to the present invention;
fig. 2 is a block diagram of a circuit board wire bonding machine of the present invention;
FIG. 3 is a block diagram of the solder mechanism of the wire bonding machine for circuit boards of the present invention disposed on a housing;
FIG. 4 is a block diagram of the solder mechanism of the circuit board wire bonding machine of the present invention;
Fig. 5 is a block diagram of the loading manipulator of the wire bonding machine for circuit boards of the present invention;
Fig. 6 is a block diagram of the first wire clamp of the wire bonding machine for circuit boards of the present invention;
fig. 7 is a block diagram of the second wire clamp of the wire bonding machine for circuit boards of the present invention;
fig. 8 is a block diagram of the third wire clamp of the wire bonding machine for circuit boards of the present invention;
Fig. 9 is a block diagram of the wire clamping mechanism of the wire bonding machine for circuit boards of the present invention;
fig. 10 is a block diagram of the second finger cylinder of the circuit board bonding machine of the present invention;
fig. 11 is a view showing the structure of the other side of the wire clamping mechanism of the wire bonding machine for circuit board according to the present invention;
Fig. 12 is a block diagram of the probe head of the wire bonding machine of the present invention disposed on the housing;
Fig. 13 is a diagram showing a structure in which the circuit board feeding mechanism of the circuit board wire bonding machine of the present invention is disposed on a stand;
fig. 14 is a block diagram of the circuit board loading mechanism of the circuit board wire bonding machine of the present invention;
fig. 15 is a block diagram of the transport positioning mechanism of the circuit board wire bonding machine of the present invention;
fig. 16 is a block diagram of the auxiliary feeding mechanism of the wire bonding machine for circuit board of the present invention disposed on the housing.
Detailed Description
The following detailed description will be further described in conjunction with the above-described figures.
In the following, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art that the described embodiments may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail.
Referring to fig. 1, the wire bonding apparatus includes a base 1, a supporting frame 2, a positioning jig 3, and a soldering mechanism 4. Wherein, the support frame 2 is arranged on the machine base 1. And the positioning jig 3 is arranged on the base 1 and is used for clamping and positioning the circuit board to be welded. And the soldering tin mechanism 4 is arranged on the supporting frame 2 and is used for preheating and welding a welding position. When the circuit board is positioned in the positioning jig 3, the welded electric wire stretches to the welding spot position of the circuit board, the soldering tin mechanism 4 preheats the welding spot position of the circuit board and the welding position of the electric wire, after the preheating is finished, the soldering tin mechanism 4 melts tin to weld the electric wire and the circuit board, after the preheating is finished, the problem that the welding spot position of the electric wire and the circuit board is heated too quickly to cause uneven heating and damage to the copper wire of the electric wire and the plating layer on the copper wire is avoided by directly welding after the welding position is preheated, and therefore the quality and the welding stability after welding are improved. And set up at support frame 2 through soldering tin mechanism 4, the circuit board location has consequently replaced manual welding in positioning jig 3, improves efficiency to can master the volume of soldering tin, avoid welding soldering tin and other electronic component on the circuit board and switch on, avoid the problem of short circuit.
Preferably, the soldering mechanism 4 is a laser soldering head. The laser soldering tin head ensures that the position of a soldering point reaches the highest temperature in a focusing mode, and realizes the melting of a tin wire. The welding position is preheated and welded through the laser soldering tin head, when preheating, the power of the laser soldering tin head is reduced, the temperature of the focus is reduced, the preheating is achieved, and when welding, the power of the laser soldering tin head is utilized.
Referring to fig. 1-3, the circuit board wire bonding machine comprises the wire bonding device, a wire clamping mechanism 5 arranged on one side of the soldering mechanism 4 and used for clamping wires to be welded on a circuit board, and a feeding manipulator 6 arranged on the machine base 1 and used for transferring the wires to be welded to the wire clamping mechanism 5, wherein the feeding manipulator 6 clamps the wires to be welded on the wire clamping mechanism 5, and after the soldering mechanism 4 preheats the welding contacts of the circuit board and the ends of the wires, the tin at the ends of the wires is melted, so that the wires are welded on the circuit board. Specifically, the circuit board is positioned in the positioning jig 3, the feeding manipulator 6 clamps the wire to be welded onto the wire clamping mechanism 5, and after the soldering mechanism 4 preheats the welding contact of the circuit board and the end part of the wire, the tin at the end part of the wire is melted, so that the wire is welded on the circuit board.
Preferably, referring to fig. 2-5, the feeding manipulator 6 includes a first linear module 60 disposed on the base 1, a first connection plate 61 disposed on a moving seat of the first linear module 60, a first linear clamp 62 disposed at a bottom of the first connection plate 61 with a clamp opening facing downward, a second clamp 63 disposed on the base 1 with a clamp opening facing upward, a second linear module 64 disposed on the base 1 and parallel to the first linear module 60, a second connection plate 65 disposed on a moving seat of the second linear module 64, a third linear clamp 66 disposed at a bottom of the second connection plate 65, wherein the first linear module 60 drives the first linear clamp 62 to clamp a wire to be placed on the second clamp 63, and the second linear module 64 drives the third clamp 66 to clamp the wire on the second clamp 63 to the wire clamping mechanism 5. Specifically, when the feeding manipulator 6 clamps the electric wire to realize feeding, the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 can all have the clamped electric cable, so that after welding, the electric cable can be quickly conveyed to the position of the wire clamping mechanism 5.
Further, the first linear module 60 is fixed on the stand 1 through a first bracket, and the second linear module 64 is fixed on the stand 1 through a second bracket.
Referring to fig. 5-8, the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 are pneumatic clamps 600, and include a finger cylinder 610, and a first clamping jaw 620 and a second clamping jaw 630 disposed on two clamping blocks of the finger cylinder, where the finger cylinder 610 drives the first clamping jaw 620 and the second clamping jaw 630 to clamp a wire.
Preferably, referring to fig. 6-8, V-shaped clamping openings 620a and 630a are formed on opposite sides of the first clamping jaw 620 and the second clamping jaw 630, a plurality of clearance grooves 620b are formed on inner side walls of the V-shaped clamping opening 620a of the first clamping jaw 620, a plurality of clearance spaces 630b are formed on the V-shaped clamping opening 630a of the second clamping jaw 630, a clamping portion 630c is formed between adjacent clearance spaces 630b, and the clamping portion 630c is clamped into the clearance grooves 620b when the first clamping jaw 620 and the second clamping jaw 630 clamp, so that a traditional front-back wire clamping is replaced when a cable is clamped, a wire clamping bending phenomenon in a clamping process is avoided, and clamping accuracy and stability are improved. The centers of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 after clamping are on the same straight line and horizontal straight line. Through the cable translation, then can accomplish the centre gripping one by one.
Specifically, in order to avoid the first wire clamp 62, the second wire clamp 63, and the third wire clamp 66 from each other during the wire clamping and transferring process, the first wire clamp 62 and the third wire clamp 66 form a clearance gap by bending.
Further, in another embodiment of the third wire clamp 66, the third wire clamp 66 includes a lifting cylinder disposed on a movable seat of the second linear module 65, and a pneumatic clamp 600 disposed at a lifting end of the lifting cylinder. When the lifting cylinder moves to the lowest position, the centers of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 after clamping are on the same straight horizontal straight line.
Preferably, referring to fig. 12, the base 1 is further provided with a detecting probe 200 for positioning an end of the electric wire clamped on the second wire clamp 63. When the position of the end part of the cable is detected by the detection probe 200 and clamped with the third wire clamp 66, the position of the origin at the position of the second wire clamp 63 is automatically compensated, so that when the third wire clamp 66 detects that the electric wire is conveyed to the wire clamping mechanism 5, the end part of the cable can be always welded on a welding spot of a circuit board. In this embodiment, the detecting probe 200 is disposed on a supporting rod, and the supporting rod is fixed on the stand 1. Further, the detection probe 200 is a CCD camera.
Preferably, the soldering mechanism 4 comprises a laser soldering head 40 and a tin feeder 41 which are arranged on the support frame 2, and the output end of the tin feeder 41 extends to the bottom end of the laser soldering head 40. The tin wire is conveyed to the bottom end of the laser soldering head 40 by a tin feeder 41, and is melted by the laser soldering head 40, so that the cable is soldered on the circuit board.
Preferably, referring to fig. 2-4 and fig. 9-11, the wire clamping mechanism 5 includes a mounting plate 50 provided on the support frame 2, a pneumatic sliding table 51 provided on a side surface of the mounting plate 50, a second finger cylinder 52 provided at a bottom end of a sliding portion of the pneumatic sliding table 51, a third clamping jaw 53 and a fourth clamping jaw 54 provided on two clamping blocks of the second finger cylinder 52, V-shaped clamping openings 53a and 54a provided on opposite sides of the third clamping jaw 53 and the fourth clamping jaw 54, a plurality of second clearance grooves 53b provided on inner side walls of the V-shaped clamping opening 53a of the third clamping jaw 53, a plurality of second clearance grooves 54b provided on the V-shaped clamping opening 54a of the fourth clamping jaw 54, and a second engaging portion 54c formed between adjacent second clearance grooves 54b, wherein the second engaging portion 54c engages into the second clearance grooves 53b when the third clamping jaw 53 and the fourth clamping jaw 54 are clamped.
Preferably, referring to fig. 11, a pressing cylinder 55 is further disposed on a side surface of the sliding portion of the pneumatic sliding table 51, a third connecting plate 56 is disposed at a lifting end of the pressing cylinder 55, and a pressing plate 57 disposed at a bottom of the third connecting plate 56, and the pressing cylinder 55 pushes the pressing plate 57 to press down the electric wire clamped on the third clamping jaw 53 and the fourth clamping jaw 54, so that an end portion of the electric wire is bent, and a welding end of the electric wire contacts with the circuit board. Therefore, the situation that the cable conductor is not in contact welding with the circuit board can be effectively avoided.
Further, referring to fig. 2, 3 and 13, the circuit board wire bonding machine further includes a translation mechanism 7 disposed on the support frame 2, and the soldering mechanism 4 and the wire clamping mechanism 5 are disposed on a moving seat of the translation mechanism 7. In this embodiment, when a plurality of cables are required to be soldered on a circuit board, the translation mechanism 7 drives the soldering mechanism 4 and the wire clamping mechanism 5 to move simultaneously, so that a plurality of positions are soldered. The welding of the wire and the shielding layer in the coaxial cable and the circuit board can also be realized, and particularly, when the coaxial cable is required to be welded on the circuit board, the wire clamping mechanism 5 clamps the wire, the soldering tin mechanism 4 welds the wire of the cable on the circuit board, the wire clamping mechanism 5 is loosened, but the cable is still hung, and the soldering tin mechanism 4 moves to the welding position of the shielding layer through the translation of the translation mechanism 7, so that the welding of the shielding layer and the circuit board can be realized. Further, the translation mechanism is a linear module.
Further, referring to fig. 3, 13 and 15, the circuit board wire bonding machine further includes a positioning and conveying mechanism 8, which is disposed on the stand 1 and is used for conveying and positioning the positioning jig 3 below the wire bonding mechanism. In this embodiment, the circuit board is positioned in the positioning jig 3, and the positioning conveying mechanism 8 drives the positioning jig 3 to move to the bottom end of the soldering mechanism 4, so that the wire and the circuit board are welded. In this embodiment, a plurality of wires can be welded on the circuit board, specifically, after the first wire is welded, the wire clamping mechanism 5 clamps the second wire, and the positioning and conveying mechanism 8 drives the positioning jig 3 to move, so that a plurality of wires are welded on the circuit board.
Preferably, the positioning and conveying mechanism 8 is an electric linear module arranged on the stand 1, and the positioning jig 3 is arranged on a movable seat of the electric linear module.
Preferably, referring to fig. 11 and 12, the base 1 is further provided with a circuit board feeding mechanism 9 for placing the circuit board in the positioning fixture 3. The circuit board feeding mechanism 9 comprises a triaxial manipulator 90 and a positioning material rack 91 which are arranged on the machine base 1, a carrier plate 92 arranged on the lifting part of the triaxial manipulator 90, and a sucker 93 arranged at the bottom of the carrier plate 92. The three-axis mechanical arm 90 drives the sucker 93 to move downwards, so that a circuit board placed on the positioning material rack 91 is placed on the positioning jig 3, and the circuit board is positioned and clamped by the positioning jig 3, and automatic feeding of the circuit board is realized.
Preferably, referring to fig. 3, 13, 15 and 16, belt conveying mechanisms 100 are further disposed on two sides of the positioning and conveying mechanism 8, the two belt conveying mechanisms 100 are fixedly connected with the base 1, a lifting mechanism 110 disposed in the base 1 drives a lifting plate 120 to move up and down, the positioning and conveying mechanism 8 is disposed on the lifting plate 120, the circuit board feeding mechanism 9 adsorbs a circuit board on the two belt conveying mechanisms 100, the two belt conveying mechanisms 100 convey the circuit board above the positioning jig 3, the lifting mechanism 110 pushes the positioning jig 3 to lift, and the positioning jig 3 clamps the positioning circuit board.
Preferably, referring to fig. 15 and 16, the lifting mechanism 110 includes a plurality of connection columns 111 disposed on the top wall of the cavity of the stand 1, a support plate 112 connected to the bottoms of the plurality of connection columns 111, a guide post 113 slidably penetrating through the support plate 112, and a lifting cylinder 114, wherein the lifting plate 120 is connected to the upper end of the guide post 113, the lifting cylinder 114 is disposed on the support plate 112, and the upper end of the lifting cylinder 114 is fixedly connected to the bottom of the lifting plate 150.
Preferably, referring to fig. 15, the positioning jig 3 includes a bottom plate 30 disposed on a moving seat of the positioning and conveying mechanism 8, a wide air jaw 31 disposed on the bottom plate 30, clamping plates 32 disposed on two moving blocks of the wide air jaw 31, a supporting member 33 disposed on a body of the wide air jaw 31, and a positioning plate 34 disposed on the supporting member 33, wherein an outer end of the clamping plates 32 is provided with a clamping portion 35 extending upward, a positioning clamping groove 36 is disposed on an inner side of the clamping portion 35, and an opening end of the clamping groove 36 has a guiding position. The circuit board is placed on the positioning plate 34, the finger cylinder 31 drives the clamping plates 32 to move towards each other, the two ends of the circuit board are clamped, and the circuit board is positioned in the clamping grooves 36, so that the circuit board is clamped and positioned.
Preferably, referring to fig. 2, 13, and 16, an auxiliary conveying mechanism 130 is further disposed between the feeding manipulator 6 and the belt conveying mechanism 100. The tail ends of the wires soldered on the circuit board are placed on the auxiliary feeding mechanism 130, thereby not only achieving an auxiliary supporting effect on the cable, but also achieving a feeding effect.
Further, referring to fig. 11, the motor driving the auxiliary conveying mechanism 130 drives one of the belt conveying mechanisms 100 to operate through the transmission mechanism, so that the loading and unloading of the positioning fixture 3 are performed simultaneously, the orderly proceeding of the loading and unloading is ensured, and meanwhile, one driving power can be reduced.
The present invention is not limited to the above-described specific embodiments, and various modifications may be made by those skilled in the art without inventive effort from the above-described concepts, and are within the scope of the present invention.
Claims (8)
1. Circuit board bonding machine, its characterized in that includes:
The welding wire device comprises a machine base, a support frame, a positioning jig and a soldering tin mechanism, wherein the support frame and the positioning jig are arranged on the machine base;
The wire clamping mechanism is arranged at one side of the soldering tin mechanism and used for clamping the wire to be welded on the circuit board, and the feeding manipulator is arranged on the machine base and used for transferring the wire to be welded to the wire clamping mechanism;
The tin soldering mechanism comprises a laser welding head and a tin feeder which are arranged on the support frame, wherein the output end of the tin feeder extends to the bottom end of the laser welding head;
the circuit board is positioned in the positioning jig, the feeding manipulator clamps the wire to be welded on the wire clamping mechanism and stretches to the welding spot position of the circuit board, the soldering tin mechanism preheats the welding spot position of the circuit board and the welding position of the wire, the tin feeder conveys the tin wire to the bottom end of the laser welding head, the laser welding head melts the tin wire, and the wire is welded on the circuit board;
The feeding manipulator comprises a first linear module, a second linear module and a feeding mechanism, wherein the first linear module is arranged on the base; the first connecting plate is arranged on the movable seat of the first linear module; the wire clamping device comprises a first wire clamp, a second linear module, a third wire clamp, a first connecting plate, a third wire clamp, a wire clamping mechanism and a wire clamping mechanism, wherein the first wire clamp is arranged at the bottom of the first connecting plate, the clamping opening is downward, the second wire clamp is arranged on the machine base, the clamping opening is upward, the second linear module is arranged on the machine base and is parallel to the first linear module, the second connecting plate is arranged on a movable seat of the second linear module, the third wire clamp is arranged at the bottom of the second connecting plate, the first linear module drives the first wire clamp to clamp a wire to be placed on the second wire clamp, and the second linear module drives the third wire clamp to clamp the wire on the second wire clamp to the wire clamping mechanism;
The positioning and conveying mechanism is arranged on the machine base and used for conveying and positioning the positioning jig below the soldering tin mechanism, the positioning and conveying mechanism is an electric linear module arranged on the machine base, the positioning jig is arranged on a movable seat of the electric linear module, the machine base is further provided with a circuit board feeding mechanism used for placing a circuit board in the positioning jig, the circuit board feeding mechanism comprises a triaxial manipulator and a positioning material rack which are arranged on the machine base, a carrier plate arranged on a lifting part of the triaxial manipulator and a sucker arranged at the bottom of the carrier plate, belt conveying mechanisms are further arranged on two sides of the positioning and conveying mechanism and fixedly connected with the machine base, the lifting mechanisms arranged in the machine base drive lifting plates to move up and down, the positioning and conveying mechanism is arranged on the lifting plates, the circuit board feeding mechanism adsorbs the circuit board on the two belt conveying mechanisms, the two belt conveying mechanisms convey the circuit board to the upper side of the positioning jig, and the lifting mechanisms push the positioning jig to lift the positioning jig, and the positioning jig clamps the circuit board.
2. The wire bonding machine of claim 1 wherein the first wire clamp, the second wire clamp, and the third wire clamp are pneumatic clamps comprising a first finger cylinder and a first jaw and a second jaw disposed on two clamping blocks of the first finger cylinder, the first finger cylinder driving the first jaw and the second jaw to clamp the wire.
3. The circuit board wire bonding machine of claim 2, wherein the opposite sides of the first clamping jaw and the second clamping jaw are provided with V-shaped clamping openings, the inner side walls of the V-shaped clamping openings of the first clamping jaw are provided with a plurality of clearance grooves, the V-shaped clamping openings of the second clamping jaw are provided with a plurality of clearance spaces, clamping portions are formed between adjacent clearance spaces, when the first clamping jaw and the second clamping jaw clamp, the clamping portions are clamped into the clearance grooves, and centers of the first wire clamp, the second wire clamp and the third wire clamp after clamping are on the same straight line.
4. A circuit board wire bonding machine according to any one of claims 1-3 wherein the housing is further provided with a test probe for locating the end of the wire clamped to the second wire clamp.
5. The circuit board wire bonding machine according to any one of claims 1-3, wherein the wire clamping mechanism comprises a mounting plate arranged on the support frame, a pneumatic sliding table arranged on the side face of the mounting plate, a second finger cylinder arranged at the bottom end of the sliding part of the pneumatic sliding table, a third clamping jaw and a fourth clamping jaw arranged on two clamping blocks of the second finger cylinder, V-shaped clamping openings are arranged on opposite sides of the third clamping jaw and the fourth clamping jaw, a plurality of second clearance grooves are formed in inner side walls of the V-shaped clamping openings of the third clamping jaw, a plurality of second clearance grooves are formed in the V-shaped clamping openings of the fourth clamping jaw, a second clamping portion is formed between every two adjacent second clearance grooves, and when the third clamping jaw and the fourth clamping jaw are clamped, the second clamping portion is clamped into the second clearance grooves.
6. The wire bonding machine for circuit boards according to claim 5, wherein a pressing cylinder is further arranged on the side surface of the sliding part of the pneumatic sliding table, a third connecting plate is arranged at the lifting end of the pressing cylinder, and a pressing plate is arranged at the bottom of the third connecting plate, and the pressing cylinder pushes the pressing plate to press down the electric wire clamped on the third clamping jaw and the fourth clamping jaw, so that the welding end of the electric wire is in contact with the circuit board.
7. The wire bonding machine of claim 1 further comprising a translation mechanism disposed on the support frame, the solder mechanism and the wire clamping mechanism being disposed on a movable seat of the translation mechanism.
8. The wire bonding machine of claim 1, wherein an auxiliary conveying mechanism is further arranged between the feeding manipulator and the belt conveying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910779971.3A CN110548949B (en) | 2019-08-22 | 2019-08-22 | Wire bonding device and circuit board wire bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910779971.3A CN110548949B (en) | 2019-08-22 | 2019-08-22 | Wire bonding device and circuit board wire bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110548949A CN110548949A (en) | 2019-12-10 |
| CN110548949B true CN110548949B (en) | 2025-01-07 |
Family
ID=68737938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910779971.3A Active CN110548949B (en) | 2019-08-22 | 2019-08-22 | Wire bonding device and circuit board wire bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110548949B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111283290B (en) * | 2020-03-13 | 2025-01-14 | 深圳市四维自动化设备有限公司 | Automatic welding machine |
| CN111659969A (en) * | 2020-07-14 | 2020-09-15 | 广东华灿电讯科技有限公司 | Wire inner conductor welding tin amount control system and control method thereof |
| CN112025023B (en) * | 2020-09-08 | 2021-05-25 | 士业电子科技徐州有限公司 | Convenient circuit board intelligence welding set of material loading |
| CN114473099A (en) * | 2020-10-27 | 2022-05-13 | 神讯电脑(昆山)有限公司 | Circuit board welding device |
| CN114054878B (en) * | 2021-11-03 | 2023-02-07 | 深圳市美师傅科技有限公司 | Be used for RFID production antenna chip automatic welder |
| CN116117260B (en) * | 2022-12-28 | 2023-10-20 | 江苏暖阳半导体科技有限公司 | LED chip board welding fixture |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203418195U (en) * | 2013-08-15 | 2014-02-05 | 深圳市普德激光设备有限公司 | Laser tin soldering device of micro-electronic circuit board |
| CN106112176A (en) * | 2016-07-29 | 2016-11-16 | 长沙金诺自动化技术有限公司 | A kind of Full-automatic laser welding machine |
| CN211305121U (en) * | 2019-08-22 | 2020-08-21 | 广东银钢智能科技有限公司 | Wire bonding device and circuit board wire bonding machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6803538B2 (en) * | 2001-08-31 | 2004-10-12 | Honda Canada Inc. | Laser welding system |
| EP2317613B1 (en) * | 2009-10-28 | 2015-08-12 | Komax Holding AG | Device and method for handling the ends of cables |
| CN105798418A (en) * | 2016-05-12 | 2016-07-27 | 常州市武进恒辉通信设备有限公司 | Automatic tin soldering equipment for manufacturing electronic element |
-
2019
- 2019-08-22 CN CN201910779971.3A patent/CN110548949B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203418195U (en) * | 2013-08-15 | 2014-02-05 | 深圳市普德激光设备有限公司 | Laser tin soldering device of micro-electronic circuit board |
| CN106112176A (en) * | 2016-07-29 | 2016-11-16 | 长沙金诺自动化技术有限公司 | A kind of Full-automatic laser welding machine |
| CN211305121U (en) * | 2019-08-22 | 2020-08-21 | 广东银钢智能科技有限公司 | Wire bonding device and circuit board wire bonding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110548949A (en) | 2019-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110548949B (en) | Wire bonding device and circuit board wire bonding machine | |
| CN110253101A (en) | Wire circuit board welding device | |
| CN111531238B (en) | Transformer welding and assembling integrated production line | |
| CN109332840B (en) | Intelligent welding system and method | |
| CN103747665A (en) | Multi-station plug-in mounting production line and automatic mouse PCB (printed circuit board) production line | |
| CN212917968U (en) | Whole PCB board automatic weld machine | |
| CN110153620B (en) | Automatic welding equipment for the yoke combination bracket of the thermal-magnetic system of the miniature circuit breaker | |
| CN113977138A (en) | Welding device for PCB | |
| CN113555756B (en) | Full-automatic wire stripping and welding production line equipment for electronic wire | |
| CN110571615A (en) | Cable welding equipment and welding method for probe connector | |
| CN219379253U (en) | Stator winding tin coating structure | |
| CN211305121U (en) | Wire bonding device and circuit board wire bonding machine | |
| CN213764365U (en) | Novel punching capacitor pin welding equipment | |
| CN118809040B (en) | An automatic welding unit for a transformer production line | |
| CN117715404B (en) | Packaging chip pin tin bridge processing equipment | |
| CN118809041A (en) | A production line for transformer welding | |
| CN109604795B (en) | Volute supporting block welding equipment | |
| CN208580770U (en) | A kind of wire-soldering device | |
| CN213706990U (en) | Novel punching capacitor pin welding equipment conveying jig | |
| CN113579123B (en) | Assembling equipment for WIFI antenna | |
| CN213614678U (en) | An upper limit component of a feedthrough capacitor pin AC spot welding device | |
| CN114361073A (en) | An automatic packaging device for high current field effect transistors | |
| CN218040150U (en) | Rubber-insulated-wire lamp welding set and rubber-insulated-wire lamp encapsulation equipment | |
| JPS6315746B2 (en) | ||
| CN213794677U (en) | Novel punching capacitor stitch welding equipment jig conveying device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |