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CN110534872B - 电子封装件 - Google Patents

电子封装件 Download PDF

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Publication number
CN110534872B
CN110534872B CN201810567459.8A CN201810567459A CN110534872B CN 110534872 B CN110534872 B CN 110534872B CN 201810567459 A CN201810567459 A CN 201810567459A CN 110534872 B CN110534872 B CN 110534872B
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electronic package
antenna
antenna body
wire
feed line
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CN110534872A (zh
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卢盈维
方柏翔
陈冠达
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
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    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
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    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
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    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
    • H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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Abstract

一种电子封装件，用于将天线结构及调整结构配置于一承载结构上，且该天线结构包含位于不同层的天线本体与馈入线、及连通各层间以电性连接该天线本体与该馈入线的导电柱，其中，该调整结构自该馈入线延伸出，以改善该天线本体的频宽。

Description

电子封装件
技术领域
本发明有关一种电子封装件，尤指一种具天线结构的电子封装件。
背景技术
随着电子产业的蓬勃发展，电子产品也逐渐迈向多功能、高性能的趋势。目前无线通讯技术已广泛应用于各式各样的消费性电子产品以利接收或发送各种无线讯号。为了满足消费性电子产品的外观设计需求，无线通讯模块的制造与设计朝轻、薄、短、小的需求作开发，其中，平面天线(Patch Antenna)因具有体积小、重量轻与制造容易等特性而广泛利用于手机(cell phone)等电子产品的无线通讯模块中。
图1A为现有无线通讯模块的剖视示意图。该无线通讯模块1包括：一基板10、设于该基板10上的晶片(图略)、一天线结构12以及一接地结构15。该基板10为电路板并呈矩形体，其具有多个绝缘层13a,13b,13c。该晶片配置于该基板10上且电性连接该基板10。该天线结构12具有一设于上侧绝缘层13a的天线本体120、一设于下侧绝缘层13c的馈入线(feedline)121及贯穿该些绝缘层13a,13b,13c以电性连接该天线本体120与该馈入线121的导电柱122，且如图1B所示，该馈入线121的其中一端为端口121a，而另一端连接导电柱122。该接地结构15具有分别设于该些绝缘层13b,13c上的两接地层15a,15b及多个用以连接该些接地层15a,15b的导电盲孔150。
此外，于现有无线通讯模块1中，该天线本体120例如为贴片天线(patchantenna)，其结构简单且易于设计，但因其频宽窄小，造成应用上受制。
据此，业界遂改在该天线本体120的上方增设一介电层140与寄生金属贴片(Parasitic patch)141以作为调整结构14，使该寄生金属贴片141产生额外的共振频带以增加频宽，借此改善现有天线本体120(即贴片天线)的频宽限制。
然而，现有无线通讯模块1中，是采用增层方式，将该调整结构14以压合方式形成于该天线本体120的上方，因而于制作越多层的介电层140及寄生金属贴片141时，不仅制程步骤增加、成本提高及整体结构厚度增厚，且可能导致良率下降问题。
因此，如何克服上述现有技术的种种问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述现有技术的种种缺失，本发明揭露一种电子封装件，以改善该天线本体的频宽。
本发明的电子封装件包括：承载结构；天线结构，其结合该承载结构，其中，该天线结构包含天线本体、馈入线、及电性连接该天线本体与该馈入线的导电柱；以及调整结构，其结合该承载结构并自该馈入线延伸出。
前述的电子封装件中，该馈入线的其中一端为端口，另一端连接该导电柱与该调整结构。
前述的电子封装件中，该调整结构与该馈入线形成于同一表面上。
前述的电子封装件中，该调整结构与该馈入线为一体成形。
前述的电子封装件中，该调整结构与该馈入线由同一金属层构成。
前述的电子封装件中，该调整结构包含连接该馈入线的导线及连接该导线的作用部。例如，该导线的其中一端分叉出该作用部与一延长部。
前述的电子封装件中，还包括结合该承载结构的接地结构。例如，该接地结构包含多个接地层及用以连接该接地层的导电盲孔。进一步，该调整结构电性连接该接地结构。
由上可知，本发明的电子封装件中，主要借由该调整结构自该馈入线延伸而出的设计，以改善该天线本体的频宽而增加其实用性。
此外，借由该调整结构自该馈入线延伸而出的设计，使该调整结构与该馈入线能形成于同一表面上，且能一同制作及一体成形该调整结构与该馈入线，故相较于现有调整结构设在该天线本体上方的结构，本发明的电子封装件无需额外制程步骤，即可制作该调整结构，因而能提高良率、降低成本及薄化该电子封装件整体结构厚度等优点。
附图说明
图1A为现有无线通讯模块的剖视示意图；
图1B为现有无线通讯模块的局部上视示意图；
图2A为本发明的电子封装件的剖视示意图；
图2B为图2A的底视平面示意图；
图2C为图2A的层间的局部平面示意图；以及
图2C’为图2C的另一实施例。
符号说明：
1 无线通讯模块
10 基板
12,22 天线结构
120,220 天线本体
121,221 馈入线
121a,221a 端口
122,222 导电柱
13a,13b,13c 绝缘层
14,24 调整结构
140 介电层
141 寄生金属贴片
15,25 接地结构
15a,15b,25a,25b 接地层
150,250 导电盲孔
2 电子封装件
20 承载结构
221b 垫部
23a,23b,23c 绝缘层
240 导线
241 作用部
242 延长部。
具体实施方式
以下借由特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供本领域技术人员的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”及“一”等的用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2C为本发明的电子封装件2的示意图。于本实施例中，该电子封装件2例如为系统级封装(System in package，简称SiP)的无线通讯模块。
该电子封装件2包括：承载结构20、设于该承载结构20上的电子元件(图略)、天线结构22、调整结构24以及接地结构25。
如图2A所示，所述的承载结构20呈矩形体。于本实施例中，该承载结构20例如为具有核心层与线路结构的封装基板(substrate)或无核心层(coreless)的线路结构，包含有多个绝缘层23a,23b,23c及形成于该绝缘层23a,23b,23c上的多个线路层，如扇出(fanout)型重布线路层(redistribution layer，简称RDL)。
此外，该绝缘层23a,23b,23c为介电材、聚酰亚胺(polyimide，简称PI)、干膜(dryfilm)、环氧树脂(epoxy)或封装材(molding compound)等，但不限于上述。
所述的电子元件为主动元件、被动元件或其二者组合，且该主动元件例如为半导体晶片，而该被动元件例如为电阻、电容及电感。于本实施例中，该电子元件借由多个焊线以打线方式电性连接该线路层；或者，该电子元件可借由多个如焊锡材料的导电凸块以覆晶方式设于该线路层上并电性连接该线路层；亦或，该电子元件可直接接触该线路层。应可理解地，有关该电子元件电性连接该承载结构20的方式繁多，不限于上述。
所述的天线结构22结合该承载结构20并电性连接该承载结构20的线路层，且包含一设于上侧绝缘层23a的天线本体220、一设于下侧绝缘层23c的馈入线(feed line)221、贯穿该些绝缘层23a,23b,23c以电性连接该天线本体220与该馈入线221的导电柱222。
于本实施例中，可借由涂布金属层(如铜材)的加工方式形成该天线结构22，如溅镀(sputtering)、蒸镀(vaporing)、电镀或化镀等；或者，利用压合或贴膜(foiling)等设置方式形成该天线本体220。
此外，如图2C所示，该馈入线221的其中一端为端口221a以电性连接该承载结构20的线路层，而另一端为垫部221b以连接该导电柱222与该调整结构24，其中，该导电柱222自该垫部221b朝纵向(垂直垫部221b平面方向)延伸。
所述的调整结构24自该馈入线221延伸而出，以作为步阶阻抗共振器(steppedimpedance resonator，简称SIR)，使该调整结构24能进行匹配调整。
于本实施例中，该调整结构24与该馈入线221形成于同一绝缘层23b上。例如，该调整结构24与该馈入线221可利用图案化(如电镀金属或蚀刻金属)制程一同制作以成为同一金属层，甚至可与该承载结构的线路层一同制作，如RDL制程。
此外，该调整结构24包含一连接该垫部221b的导线240与一连接该导线240的作用部241。具体地，如图2C所示，该调整结构24以其导线240自该垫部221b沿同一平面延伸，使该导线240的另一端形成该作用部241。
所述的接地结构25结合该承载结构20，其包含设于该承载结构20上的两接地层25a,25b及多个用以连接该些接地层25a,25b且围绕该馈入线221与该调整结构24布设的导电盲孔250。
于本实施例中，该些接地层25a,25b为相互隔离，且配置于绝缘层的相对两侧上，例如分别位于不同绝缘层23b,23c上。具体地，可借由涂布金属层(如铜材)的加工方式形成该接地结构25，如溅镀(sputtering)、蒸镀(vaporing)、电镀或化镀等；或者，利用压合或贴膜(foiling)等设置方式形成该些接地层25a,25b。
此外，该些接地层25a,25b可依需求选择覆盖该承载结构20的表面区域的垂直投影范围，如图2B所示的全部表面，使其垂直投影范围大于该天线本体220的垂直投影范围。
又，如图2C’所示，该调整结构24可包含一连接该导线240的延长部242，以连接至其中一导电盲孔250。具体地，该导线240的末端分叉，其中一歧路为作用部241，其视为短路残段(short end stub)，而另一歧路为延长部242，其视为开路残段(open end stub)，理论上，末端短路的步阶阻抗共振器于共振频率时可视为电容与电感并联的等效结构，使该作用部241与该延长部242亦可视为电容与电感并联的等效结构，以经适当的设计调整也能与SIR具同样的效果。
综上所述，本发明的电子封装件2中，主要借由该调整结构24自该馈入线221延伸而出的设计，以改善该天线本体220的频宽而增加其实用性。
此外，借由该调整结构24自该馈入线221延伸而出的设计，使该调整结构24与该馈入线221能形成于同一绝缘层23b上，且能一同制作及一体成形该调整结构24与该馈入线221，故相较于现有调整结构设在该天线本体上方的结构，本发明的电子封装件无需额外制程步骤，即可制作该调整结构24，因而能提高良率、降低成本及薄化该电子封装件2整体结构厚度等优点。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何所属领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (9)

1.一种电子封装件，其特征在于，该电子封装件包括：
承载结构；
天线结构，其结合该承载结构并包含天线本体、馈入线及电性连接该天线本体与该馈入线的导电柱；以及
调整结构，其结合该承载结构并自该馈入线延伸出，且该调整结构与该馈入线形成于同一表面上，以供调整该天线本体的频宽。
2.根据权利要求1所述的电子封装件，其特征在于，该馈入线的其中一端为端口，另一端连接该导电柱与该调整结构。
3.根据权利要求1所述的电子封装件，其特征在于，该调整结构与该馈入线为一体成形。
4.根据权利要求1所述的电子封装件，其特征在于，该调整结构与该馈入线由同一金属层构成。
5.根据权利要求1所述的电子封装件，其特征在于，该调整结构包含连接该馈入线的导线及连接该导线的作用部。
6.根据权利要求5所述的电子封装件，其特征在于，该导线的其中一端分叉出该作用部与一延长部。
7.根据权利要求1所述的电子封装件，其特征在于，该电子封装件还包括结合该承载结构的接地结构。
8.根据权利要求7所述的电子封装件，其特征在于，该接地结构包含多个接地层及用以连接该接地层的导电盲孔。
9.根据权利要求7所述的电子封装件，其特征在于，该调整结构电性连接该接地结构。
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