CN110524410B - Method for processing scintillator crystal strips in batches - Google Patents
Method for processing scintillator crystal strips in batches Download PDFInfo
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- CN110524410B CN110524410B CN201910863623.4A CN201910863623A CN110524410B CN 110524410 B CN110524410 B CN 110524410B CN 201910863623 A CN201910863623 A CN 201910863623A CN 110524410 B CN110524410 B CN 110524410B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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Abstract
The invention discloses a method for processing scintillator crystal bars in batches, which comprises the following steps: grinding and polishing two end surfaces of the scintillator crystal segment blank, and respectively bonding and fixing a glass sheet on the two end surfaces of the scintillator crystal segment through bonding glue; facing to the other end face along one end face of the scintillator crystal segment and being parallel to the axial scintillator crystal segment to obtain a scintillator wafer; grinding and polishing two cutting surfaces of the scintillator wafer generated by cutting; bonding and fixing the polished surfaces together, wherein two surfaces of all scintillator wafers bonded with glass sheets face the same direction and are correspondingly combined together to form two surfaces to form two end surfaces of a scintillator crystal block, then cutting the scintillator crystal block from one end surface of the scintillator crystal block to the other end surface, and the cutting direction is vertical to a cutting surface generated by cutting; and grinding and polishing two cutting surfaces of the scintillator wafer generated by cutting, and removing the bonding glue and the remaining glass sheets to obtain the scintillator crystal strip. The processing method can effectively avoid the scintillator crystal bar from collapsing and improve the yield and the processing efficiency of the scintillator crystal bar.
Description
Technical Field
The invention belongs to the technical field of scintillator processing, and particularly relates to a method for processing scintillator crystal bars in batches.
Background
Positron Emission Tomography (PET), an advanced nuclear medicine imaging technique, has unique advantages in obtaining functional information of certain organs or lesions of a human body or an animal, and is known as the best diagnostic technique known at present. The scintillator crystal strip is the core component of the detector of the PET system, and the performance of the scintillator crystal strip determines the performance of PET to a great extent. When the scintillator crystal bar is used, a mode of a scintillator crystal bar array is usually adopted, and the manufacturing of the scintillator crystal bar array needs to carry out corresponding technical index processing on each used scintillator crystal bar unit.
Scintillator bars are typically fabricated from scintillator segments, which are all cylindrical in shape as the scintillator crystal grows. And processing the scintillator crystal segment to obtain a scintillator crystal strip, and polishing six sides of the scintillator crystal strip. During side surface grinding and polishing, marking lines on scintillator crystal bars in advance is needed to ensure that all side surfaces of the scintillator crystal bars are ground and polished, the scintillator crystal bars are required to be placed in a planetary gear before grinding and polishing, but the gap between the size of the scintillator crystal bars and the planetary gear is small, mature workers generally need 30-40 minutes for placing each time, the time consumed by the scintillator crystal bars is long when the size of the scintillator crystal bars is small, the efficiency is low, the scintillator crystal bars are prone to being broken in the process of placing the scintillator crystal bars, and in the grinding and polishing process, the scintillator crystal bars are placed in a planetary gear accommodating cavity to be displaced and collided, so that the quality problems of breaking, scratching and the like of the scintillator crystal bars are easily caused; when the end faces are ground and polished, the scintillator crystal strips need to be clamped firstly, then the two end faces are ground and polished, and then the scintillator crystal strips are disassembled, so that a large amount of time is consumed in the clamping and disassembling processes, and the working efficiency is influenced. Six face of scintillator crystal bar mill throw in-process need put 6 crystal bars on the wandering star wheel, have seriously reduced machining efficiency.
Therefore, solving the quality problems of scintillator crystal bar chipping, scratching and the like and improving the processing efficiency are technical problems to be solved urgently by the technical personnel in the field.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a method for processing scintillator crystal bars in batch, which is simple to operate, can effectively avoid the quality problems of scintillator crystal bars such as breakage, scratch and the like, and improves the yield of the scintillator crystal bars; meanwhile, the labor output can be effectively reduced, the production cost can be reduced, and the processing efficiency can be improved.
The technical scheme of the invention is realized as follows:
a method for processing scintillator crystal bars in batches comprises the following steps:
s1: grinding and polishing two end faces of the scintillator crystal segment blank to obtain a scintillator crystal segment with polished end faces;
s2: respectively bonding and fixing two end faces of the scintillator crystal segment with polished end faces by bonding glue to protect the two end faces of the polished scintillator crystal segment, wherein the diameter of the glass sheet is larger than that of the scintillator crystal segment so as to fully cover the two end faces of the scintillator crystal segment;
s3: cutting the scintillator crystal segment polished by the end face obtained in the step S2 along one end face of the scintillator crystal segment obtained in the step S2 to the other end face in parallel to the axial direction to obtain a plurality of scintillator wafers with the same thickness;
s4: grinding and polishing two cut surfaces of the scintillator wafer obtained by cutting in the step S3 to obtain the scintillator wafer with the cut surfaces ground and polished into polished surfaces;
s5: bonding and fixing the scintillator wafers with the polished cutting surfaces obtained in the step S4 together according to the polished surfaces to form a scintillator crystal block, wherein two surfaces of all the scintillator wafers bonded with glass sheets face the same direction and are correspondingly combined together to form two end surfaces of the scintillator crystal block, then cutting the scintillator crystal block from one end surface of the scintillator crystal block to the other end surface, and the cutting direction is perpendicular to the cutting surfaces generated in the step S3 to obtain a plurality of scintillator wafers with the same thickness and generated by cutting from the other direction; the cut thickness of step S5 is the same as the cut thickness of step S3;
s6: grinding and polishing two cutting surfaces of the scintillator wafer obtained by cutting in the step S5 to obtain a scintillator wafer with a cutting surface in the other direction ground and polished into a polished surface;
s7: and removing the bonding glue and the left glass sheet on the scintillator wafer obtained in the step S6 to obtain the scintillator crystal strip with six polished surfaces.
Further, in the step S1, clamping the scintillator crystal segment by using a fixture, and then grinding and polishing two end faces of the scintillator crystal segment blank, wherein the fixture comprises a fixed seat and a fixed part, the fixed seat is cylindrical, a blind hole with an upward opening is axially arranged at the upper part of the fixed seat, the blind hole sequentially comprises a first cylindrical cavity and a second cylindrical cavity from top to bottom, the diameter of the first cylindrical cavity is greater than that of the second cylindrical cavity, and a step is formed at the intersection; the fixing piece is cylindrical, the fixing piece is arranged in a first cylindrical cavity, the outer diameter of the fixing piece is smaller than the diameter of the first cylindrical cavity, the inner diameter of the fixing piece is larger than or equal to the diameter of a second cylindrical cavity, a plurality of threaded through holes are formed in the side wall of the fixing piece, all the threaded through holes are uniformly distributed along the circumference of the fixing piece, the scintillator crystal segment is placed on the fixing base, the lower end face of the scintillator crystal segment is abutted against the bottom of the second cylindrical cavity, and then a plurality of stop screws with rubber heads are inserted into the corresponding threaded through holes to fix the scintillator crystal segment on the central position of the fixing piece; the depth of the second cylindrical cavity is half of the difference between the height of the scintillator crystal segment blank and the height of the fixing piece, so that the distances of two end faces of the scintillator crystal segment blank protruding out of the corresponding end faces of the fixing piece are equal.
Furthermore, the depth of the second cylindrical cavity is 0.8-1.0 mm.
Further, the specific operation steps in step S2 are: firstly, coating adhesive on one end face of a scintillator crystal segment, then adhering and fixing a glass sheet on the end face of the scintillator crystal segment, and ensuring that the height difference of the surface of the glass sheet after the glass sheet is adhered with the scintillator crystal segment is less than 0.01 mm; and turning the scintillator crystal segment, brushing adhesive glue on the other end face of the scintillator crystal segment, and then adhering and fixing the other glass sheet on the other end face of the scintillator crystal segment, and ensuring that the height difference between the other glass sheet and the surface of the glass sheet is less than 0.01 mm.
Further, before the step S5 is bonded, different scintillator segment blanks are processed according to the steps S1-S4, all the obtained scintillator wafers have the same thickness, and then a plurality of scintillator wafers with the same length in the scintillator wafers are bonded and fixed together according to the polished surfaces to form the scintillator crystal block, wherein the scintillator crystal block is rectangular.
Furthermore, when bonding, any two scintillator wafers are combined and bonded together in pairs according to the polished surfaces to form a plurality of bonding bodies consisting of the two scintillator wafers; then, the bonding body composed of two scintillator wafers is combined and bonded together in pairs according to the polished surfaces to form a plurality of bonding bodies composed of four scintillator wafers; and so on until the bonding of the scintillator crystal blocks is finished; if the scintillator crystal block can not match the bonding body of each layer level, the scintillator crystal block is bonded by the bonding body consisting of the scintillator crystal plates with different numbers of corresponding layers.
Further, the difference in height of the surface of the scintillator crystal block is less than 0.01 mm.
Further, in step S5, before the scintillator block is cut, two side surfaces of the scintillator block parallel to the polished surface are respectively bonded and fixed with any one of a plastic sheet and a glass sheet by an adhesive to protect the two side surfaces of the scintillator block.
Compared with the prior art, the invention has the following beneficial effects:
1. the whole scintillator crystal segment is clamped during clamping, and then two end faces of the scintillator crystal segment are ground and polished, so that the operation is convenient, the time is saved, and the processing efficiency is improved; the scintillator crystal segments are scintillator wafers after primary cutting and secondary cutting, and compared with the steps of grinding, polishing, cleaning, inspecting and the like of the scintillator crystal strip in the prior art, the size of the scintillator wafers is large, and a large amount of time can be saved in the steps of grinding, polishing, cutting, cleaning, inspecting and the like, so that the processing efficiency of the scintillator crystal strip is improved.
2. The two end faces of the scintillator crystal section with polished end faces are protected by the glass sheet, after the scintillator crystal section is cut into scintillator wafers at one time, the two side faces of each scintillator wafer are protected by the glass sheet, and the quality problems of chipping, scratching and the like cannot occur to the two side faces containing the glass sheets in the grinding and polishing processes of the two cut faces of each scintillator wafer generated by cutting; the two side surfaces of the scintillator crystal block formed by bonding the scintillator wafer are provided with the glass sheets or the plastic sheets, so that after the scintillator crystal block is cut for the second time, the two cut surfaces of the scintillator wafer generated by the secondary cutting are ground and polished, the glass sheets or the plastic sheets are simultaneously protected at the two end surfaces of the scintillator wafer, and the glass sheets are protected at the other two side surfaces of the scintillator wafer, so that the quality problems of chipping, scratching and the like cannot occur, the quality problems of chipping, scratching and the like in the grinding and polishing process of processing the scintillator are solved through the technical means, and the yield of the scintillator crystal strip is improved.
Drawings
FIG. 1-Process flow diagram of the present invention.
Fig. 2-a schematic view of the structure of the clamp of the present invention.
FIG. 3-schematic view of a scintillator wafer after one cut.
FIG. 4-schematic view of scintillator wafer bonded into scintillator block after one cutting.
Fig. 5-schematic diagram of secondary cutting.
FIG. 6-schematic view of scintillator wafer after double dicing.
Wherein: 1-a fixed seat; 11-a first cylindrical cavity; 12-a second cylindrical cavity; 2-a fixing piece; 21-a threaded hole; 3-glass sheet i; 4-glass sheet II.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
A method for processing scintillator crystal bars in batches is shown in a process flow diagram of FIG. 1, and specifically comprises the following steps:
s1: grinding and polishing two end faces of the scintillator crystal segment blank to obtain a scintillator crystal segment with polished end faces;
here, for the product scintillator bar, this is equivalent to finishing the processing of both end faces of the scintillator bar. Simultaneously, before the scintillator crystal segment blank is ground and polished, if the scintillator crystal segment blank has a cracking problem, the cracking part can be spliced by using bonding glue, and then the edges of two end faces are chamfered by adopting the diamond sanding head, so that the subsequent grinding and polishing quality can be improved.
S2: respectively bonding and fixing two end faces of the scintillator crystal segment with polished end faces by bonding glue to protect the two end faces of the polished scintillator crystal segment, wherein the diameter of the glass sheet I is larger than that of the scintillator crystal segment so as to fully cover the two end faces of the scintillator crystal segment;
therefore, the glass sheet I can protect two end faces of the scintillator crystal segment with polished end faces and also protect two end faces of a subsequent product scintillator crystal strip.
S3: cutting the scintillator crystal segment polished by the end face obtained in the step S2 along one end face of the scintillator crystal segment obtained in the step S2 to the other end face in parallel to the axial direction to obtain a plurality of scintillator wafers with the same thickness; (one-time cutting)
Here, for the product scintillator bar, this corresponds to cutting both sides of the scintillator bar. The scintillator wafer obtained after cutting the scintillator segment whose end face is polished once is shown in fig. 3, and both sides of the scintillator wafer obtained in step S3 are protected by glass sheets i 3.
S4: grinding and polishing two cut surfaces of the scintillator wafer obtained by cutting in the step S3 to obtain the scintillator wafer with the cut surfaces ground and polished into polished surfaces;
here, the two cut surfaces correspond to two side surfaces of the scintillator boule, and for the product scintillator boule, the processing of the two side surfaces of the scintillator boule is completed. When two cut surfaces generated by cutting are ground and polished, the two side surfaces containing the glass sheet I are protected by the glass sheet I, so that the quality problems of chipping, scratching and the like cannot occur on the two side surfaces containing the glass sheet I.
S5: bonding and fixing the scintillator wafers with the polished cutting surfaces obtained in the step S4 together according to the polished surfaces to form a scintillator crystal block, wherein two surfaces of all the scintillator wafers, which are bonded with glass sheets, face the same direction and are correspondingly combined together to form two surfaces to form two end surfaces of the scintillator crystal block, then cutting the scintillator crystal block from one end surface of the scintillator crystal block to the other end surface, and the cutting direction is vertical to the cutting surface generated by the step S3 to obtain a plurality of scintillator wafers (secondary cutting) with the same thickness and generated by cutting from the other direction; the cut thickness of step S5 is the same as the cut thickness of step S3;
here, for the product scintillator bar, this is equivalent to completing the cutting of the other two sides of the scintillator bar.
S6: grinding and polishing two cutting surfaces of the scintillator wafer obtained by cutting in the step S5 to obtain a scintillator wafer with a cutting surface in the other direction ground and polished into a polished surface;
here, two cut surfaces of the scintillator wafer generated by the cutting are ground and polished, and actually, the last two side surfaces of the scintillator crystal bar are ground and polished, so that the six surfaces of the scintillator crystal bar are ground and polished.
S7: and removing the bonding glue and the left glass sheet on the scintillator wafer obtained in the step S6 to obtain the scintillator crystal strip with six polished surfaces.
In actual operation, the scintillator crystal strips are cleaned and then inspected, qualified products are put in storage, and unqualified scintillator crystal strips inspected are waste products and can be recycled.
In specific implementation, referring to fig. 2, in step S1, a fixture is used to clamp a scintillator segment blank, and then two end faces of the scintillator segment blank are ground and polished, the fixture includes a fixing seat 1 and a fixing part 2, the fixing seat 1 is cylindrical, a blind hole with an upward opening is axially arranged at the upper part of the fixing seat 1, the blind hole sequentially includes a first cylindrical cavity 11 and a second cylindrical cavity 12 from top to bottom, the diameter of the first cylindrical cavity 11 is greater than that of the second cylindrical cavity 12, and a step is formed at the intersection; the fixing piece 2 is cylindrical, the fixing piece 2 is arranged in the first cylindrical cavity 11, the outer diameter of the fixing piece 2 is slightly smaller than the diameter of the first cylindrical cavity 11, the inner diameter of the fixing piece 2 is larger than or equal to the diameter of the second cylindrical cavity 12, a plurality of threaded through holes 21 are formed in the side wall of the fixing piece 2, all the threaded through holes 21 are uniformly distributed along the circumference of the fixing piece 2, the scintillator crystal segment is placed on the fixing base 1, the lower end face of the scintillator crystal segment is abutted against the bottom of the second cylindrical cavity 12, and then a plurality of stop screws with rubber heads are inserted into the corresponding threaded through holes 21 to fix the scintillator crystal segment on the central position of the fixing piece 2; the depth of the second cylindrical cavity is half of the difference between the height of the scintillator crystal segment blank and the height of the fixing piece, so that the distances of two end faces of the scintillator crystal segment blank protruding out of the corresponding end faces of the fixing piece are equal.
Like this, just can utilize anchor clamps to place the brilliant section blank of scintillator in the second cylinder intracavity, and make the brilliant section lower extreme face of scintillator and second cylinder chamber bottom butt, then the mounting cover is established on the brilliant section of scintillator, and place in first cylinder intracavity and with the step butt, move the brilliant section of scintillator in the central point of mounting gently and put, the edge is the same according to 2 internal diameters of mounting, then fix with the brilliant section of scintillator of the screw ground of stopping of taking the rubber head, adopt the screw of stopping to guarantee that the mounting surface does not have any arch, place the mounting that is fixed with the brilliant section blank of scintillator in the machine of grinding, grind, polish scintillator brilliant section blank both ends face.
In specific implementation, the depth of the second cylindrical cavity is 0.8-1.0 mm.
Therefore, the distance between the two end faces of the scintillator crystal segment blank and the corresponding end faces of the fixing pieces is 0.8-1.0 mm, so that the requirements on grinding and polishing sizes are met.
In specific implementation, the specific operation steps in step S2 are as follows: firstly, coating adhesive on one end face of a scintillator crystal segment, then adhering and fixing a glass sheet on the end face of the scintillator crystal segment, and ensuring that the height difference of the surface of the glass sheet is less than 0.01 mm after the glass sheet is adhered to the scintillator crystal segment; and turning the scintillator crystal segment, brushing adhesive glue on the other end face of the scintillator crystal segment, then adhering and fixing another glass sheet on the other end face of the scintillator crystal segment, and ensuring that the height difference of the surface of the other glass sheet is less than 0.01 mm after the other glass sheet is adhered to the scintillator crystal segment.
The height difference of the surfaces is measured by using a vertical dial indicator, the height difference of the surfaces of the two end surfaces of the crystal section of the scintillator is ensured to be less than 0.01 mm, and the height difference of the surfaces of the two glass sheets after the glass sheets are bonded is less than 0.01 mm.
In specific implementation, before the step S5 is bonded, different scintillator segment blanks are processed according to the steps S1-S4, the obtained scintillator wafers are the same in thickness, and then a plurality of scintillator wafers with the same length in all the scintillator wafers are bonded and fixed together according to polished surfaces to form the scintillator crystal block, wherein the scintillator crystal block is rectangular.
The same length means that the lengths are substantially the same, and since processing different scintillator segment blanks into scintillator wafers causes small differences in the lengths of the scintillator wafers, it is not significant to consider the scintillator wafers having substantially the same length as the scintillator wafers having the same length, and to bond and fix a plurality of scintillator wafers together according to the polished surfaces to form a scintillator block.
Meanwhile, after the blanks of different scintillator crystal segments are processed, a plurality of scintillator crystal blocks can be formed by bonding, and then each scintillator crystal block is processed one by one.
In the specific implementation, when bonding, any two scintillator wafers are combined and bonded together in pairs according to the polished surfaces to form a plurality of bonding bodies consisting of the two scintillator wafers; then, the bonding body composed of two scintillator wafers is combined and bonded together in pairs according to the polished surfaces to form a plurality of bonding bodies composed of four scintillator wafers; and so on until the bonding of the scintillator crystal blocks is finished; if the scintillator crystal block can not match the bonding body of each layer level, the scintillator crystal block is bonded by the bonding body consisting of the scintillator crystal plates with different numbers of corresponding layers.
Here, when bonding two scintillator wafers, need to guarantee that the length of scintillator wafer, width direction align, and then guarantee the straightness that hangs down and the depth of parallelism of every scintillator wafer, concrete step when bonding is: firstly coating adhesive glue on the surface of a polished surface of one scintillator wafer, overlapping and combining the polished surface of the other scintillator wafer with the polished surface of the other scintillator wafer, mutually squeezing and rubbing the polished surfaces by hands, wiping redundant adhesive glue flowing out from the edge, ensuring the alignment of the length direction and the width direction by using a vertical block, ensuring that the height difference of the surface is less than 0.01 mm by using a vertical dial indicator, and curing the adhesive glue, thereby completing the bonding body consisting of the two scintillator wafers. Then the bonding of the scintillator crystal block that the quantity that can hold the scintillator wafer goes on according to the wandering star wheel to forming the scintillator crystal block process in the bonding, guaranteeing that every bonding body all bonds the back in place, go on in proper order again, improve scintillator crystal block bonding precision and straightness that hangs down.
When the scintillator crystal block correspondingly processed by the planetary gear is eight scintillator wafers, the scintillator crystal block is formed by bonding two bonding bodies consisting of four scintillator wafers, and the bonding body consisting of four scintillator wafers is formed by bonding two bonding bodies consisting of two scintillator wafers; when the scintillator crystal block processed correspondingly by the planetary gear is sixteen scintillator wafers, the scintillator crystal block is formed by bonding two bonding bodies consisting of eight scintillator wafers, the bonding bodies consisting of eight scintillator wafers are formed by bonding two bonding bodies consisting of four scintillator wafers, and the bonding bodies consisting of four scintillator wafers are formed by bonding two bonding bodies consisting of two scintillator wafers; when the scintillator crystal block processed correspondingly by the planetary gear is twelve scintillator wafers, the scintillator crystal block is formed by bonding an adhesive body consisting of eight scintillator wafers and an adhesive body consisting of four scintillator wafers, the adhesive body consisting of eight scintillator wafers is formed by bonding the adhesive bodies consisting of two four scintillator wafers, and the adhesive body consisting of four scintillator wafers is formed by bonding the adhesive bodies consisting of two scintillator wafers. When the planetary wheel contains the scintillator crystal blocks of twelve scintillator wafers and only ten scintillator wafers, the planetary wheel can be used for supplementing gaskets of specifications such as scintillator wafers and the like, and then the scintillator crystal blocks are formed by bonding according to the method; the actual processing process is flexible, the scintillator crystal blocks of ten scintillator wafers can be formed first, and the rest scintillator wafers and the scintillator wafers of the next batch are processed.
In specific implementation, the height difference of the surface of the scintillator crystal block is less than 0.01 mm.
In specific implementation, in step S5, before the scintillator block is cut, two side surfaces of the scintillator block parallel to the polished surface are respectively bonded and fixed with any one of a plastic sheet or a glass sheet through an adhesive to protect the two side surfaces of the scintillator block.
As shown in fig. 5, when a plurality of scintillator wafers with the same length are bonded and fixed together along a cut surface to form a scintillator block, glass pieces ii 4 are bonded to both side surfaces of the scintillator block parallel to the cut surface. The schematic diagram of the secondary cutting and the schematic diagram of the scintillator wafer obtained by the secondary cutting are respectively shown in fig. 5 and fig. 6, after the secondary cutting, the scintillator wafer is composed of a plurality of scintillator crystal bars, two end faces of the scintillator wafer are protected by glass sheets II, and two side faces of the scintillator wafer are protected by glass sheets I. The scintillator wafers with the same length specifications obtained by batch processing are bonded, so that the alignment in the length direction and the width direction is ensured, and the operation is simpler and more convenient. The glass sheet or plastic sheet is removed after secondary cutting, grinding and polishing.
Finally, it should be noted that the above-mentioned examples of the present invention are only examples for illustrating the present invention, and are not intended to limit the embodiments of the present invention. Variations and modifications in other variations will occur to those skilled in the art upon reading the foregoing description. Not all embodiments are exhaustive. All obvious changes and modifications of the present invention are within the scope of the present invention.
Claims (8)
1. A method for processing scintillator crystal bars in batch is characterized by comprising the following steps:
s1: grinding and polishing two end faces of the scintillator crystal segment blank to obtain a scintillator crystal segment with polished end faces;
s2: respectively bonding and fixing two end faces of the scintillator crystal segment with polished end faces by bonding glue to protect the two end faces of the polished scintillator crystal segment, wherein the diameter of the glass sheet is larger than that of the scintillator crystal segment so as to fully cover the two end faces of the scintillator crystal segment;
s3: cutting the scintillator crystal segment polished by the end face obtained in the step S2 along one end face of the scintillator crystal segment obtained in the step S2 to the other end face in parallel to the axial direction to obtain a plurality of scintillator wafers with the same thickness;
s4: grinding and polishing two cut surfaces of the scintillator wafer obtained by cutting in the step S3 to obtain the scintillator wafer with the cut surfaces ground and polished into polished surfaces;
s5: bonding and fixing the scintillator wafers with the polished cutting surfaces obtained in the step S4 together according to the polished surfaces to form a scintillator crystal block, wherein two surfaces of all the scintillator wafers bonded with glass sheets face the same direction and are correspondingly combined together to form two end surfaces of the scintillator crystal block, then cutting the scintillator crystal block from one end surface of the scintillator crystal block to the other end surface, and the cutting direction is perpendicular to the cutting surfaces generated in the step S3 to obtain a plurality of scintillator wafers with the same thickness and generated by cutting from the other direction; the cut thickness of step S5 is the same as the cut thickness of step S3;
s6: grinding and polishing two cutting surfaces of the scintillator wafer obtained by cutting in the step S5 to obtain a scintillator wafer with a cutting surface in the other direction ground and polished into a polished surface;
s7: and removing the bonding glue and the left glass sheet on the scintillator wafer obtained in the step S6 to obtain the scintillator crystal strip with six polished surfaces.
2. The method according to claim 1, wherein in step S1, the scintillator segment is clamped by a fixture, and then both end surfaces of the scintillator segment blank are ground and polished, the fixture comprises a fixed base and a fixed part, the fixed base is cylindrical, a blind hole with an upward opening is axially formed in an upper portion of the fixed base, the blind hole sequentially comprises a first cylindrical cavity and a second cylindrical cavity from top to bottom, the diameter of the first cylindrical cavity is larger than that of the second cylindrical cavity, and a step is formed at a junction; the fixing piece is cylindrical, the fixing piece is arranged in a first cylindrical cavity, the outer diameter of the fixing piece is smaller than the diameter of the first cylindrical cavity, the inner diameter of the fixing piece is larger than or equal to the diameter of a second cylindrical cavity, a plurality of threaded through holes are formed in the side wall of the fixing piece, all the threaded through holes are uniformly distributed along the circumference of the fixing piece, the scintillator crystal segment is placed on the fixing base, the lower end face of the scintillator crystal segment is abutted against the bottom of the second cylindrical cavity, and then a plurality of stop screws with rubber heads are inserted into the corresponding threaded through holes to fix the scintillator crystal segment on the central position of the fixing piece; the depth of the second cylindrical cavity is half of the difference between the height of the scintillator crystal segment blank and the height of the fixing piece, so that the distances of two end faces of the scintillator crystal segment blank protruding out of the corresponding end faces of the fixing piece are equal.
3. The method of claim 2, wherein the second cylindrical cavity has a depth of 0.8-1.0 mm.
4. The method of claim 1, wherein the step S2 comprises the following steps: firstly, coating adhesive on one end face of a scintillator crystal segment, then adhering and fixing a glass sheet on the end face of the scintillator crystal segment, and ensuring that the height difference of the surface of the glass sheet is less than 0.01 mm after the glass sheet is adhered to the scintillator crystal segment; and turning the scintillator crystal segment, brushing adhesive glue on the other end face of the scintillator crystal segment, then adhering and fixing another glass sheet on the other end face of the scintillator crystal segment, and ensuring that the height difference of the surface of the other glass sheet is less than 0.01 mm after the other glass sheet is adhered to the scintillator crystal segment.
5. The method of claim 1, wherein before the step S5, different scintillator segment blanks are processed according to the steps S1-S4 to obtain scintillator wafers with the same thickness, and then a plurality of scintillator wafers with the same length are bonded and fixed together according to the polished surface to form the scintillator block, wherein the scintillator block is rectangular.
6. The method of claim 5, wherein any two scintillator wafers are bonded together in a polished surface pair-by-pair combination to form a plurality of bonds comprising two scintillator wafers; then, the bonding body composed of two scintillator wafers is combined and bonded together in pairs according to the polished surfaces to form a plurality of bonding bodies composed of four scintillator wafers; and so on until the bonding of the scintillator crystal blocks is finished; if the scintillator crystal block can not match the bonding body of each layer level, the scintillator crystal block is bonded by the bonding body consisting of the scintillator crystal plates with different numbers of corresponding layers.
7. The method of claim 5, wherein the difference in surface height of the scintillator crystal blocks is less than 0.01 mm.
8. The method of claim 1, wherein before the scintillator crystal block is cut in step S5, two side surfaces of the scintillator crystal block parallel to the polished surface are respectively bonded and fixed with any one of a plastic sheet and a glass sheet by an adhesive to protect the two side surfaces of the scintillator crystal block.
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| CN113172777B (en) * | 2021-04-23 | 2022-10-04 | 深圳大学 | Detector-grade high-purity germanium single crystal seed crystal and preparation method and application thereof |
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| JP4124753B2 (en) * | 2004-04-27 | 2008-07-23 | Ｔｄｋ株式会社 | Thin film magnetic head element polishing method, thin film magnetic head element wafer, and thin film magnetic head element polishing apparatus |
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