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CN110524082A - A Method for Rapid Wetting of Carbon Fibers in Ceramic Matrix Composites Using Fe as Active Element - Google Patents

A Method for Rapid Wetting of Carbon Fibers in Ceramic Matrix Composites Using Fe as Active Element Download PDF

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CN110524082A
CN110524082A CN201910769668.5A CN201910769668A CN110524082A CN 110524082 A CN110524082 A CN 110524082A CN 201910769668 A CN201910769668 A CN 201910769668A CN 110524082 A CN110524082 A CN 110524082A
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solder
carbon
temperature
brazing
carbon fiber
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CN110524082B (en
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张贵锋
鲍建东
杨冠军
张誉
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Xianyang Gazelle Valley New Material Technology Co ltd
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Xian Jiaotong University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/19Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3053Fe as the principal constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

本发明公开了一种以Fe为活性元素快速润湿陶瓷基复合材料中碳纤维的方法,即以Fe基或含有足量Fe的合金型钎料作为高温活性钎料,通过活性元素Fe与碳纤维发生共晶反应的方式实现对碳纤维的快速、致密润湿。其优点在于:利用共晶反应实现快速润湿碳纤维,以及近缝区复合材料母材内原有孔隙与钎缝的致密化,避免界面反应形成连续的界面反应相;使钎缝中的溶解进来的碳充分石墨化,可降低热应力;钎焊温度达1154℃以上,可使钎焊接头的服役温度提高;无需长时间保温,无需焊前对复合材料表面进行改性处理;不含或含少量贵金属。本发明解决了传统Ag基活性钎料、Ni基钎料在用于钎焊陶瓷基复合材料时分别存在的接头耐热温度低、保温时间长的问题。The invention discloses a method for quickly wetting carbon fibers in ceramic matrix composite materials with Fe as an active element, that is, using Fe-based or alloy-type solders containing sufficient Fe as high-temperature active solders, through the generation of active element Fe and carbon fibers The way of eutectic reaction realizes fast and dense wetting of carbon fibers. Its advantages are: the use of eutectic reaction to achieve rapid wetting of carbon fibers, and the densification of the original pores in the base metal of the composite material near the seam and the densification of the brazing seam, avoiding the formation of a continuous interface reaction phase from the interface reaction; The carbon is fully graphitized, which can reduce thermal stress; the brazing temperature is above 1154°C, which can increase the service temperature of the brazed joint; there is no need for long-term heat preservation, and no need to modify the surface of the composite material before welding; it does not contain or contain a small amount precious metals. The invention solves the problems of low joint heat resistance temperature and long heat preservation time of traditional Ag-based active solder and Ni-based solder respectively when they are used for brazing ceramic matrix composite materials.

Description

以Fe为活性元素快速润湿陶瓷基复合材料中碳纤维的方法A Method for Rapid Wetting of Carbon Fibers in Ceramic Matrix Composites Using Fe as Active Element

技术领域technical field

本发明涉及面向Cf/C(即C/C)及Cf/SiC(即C/SiC)等碳纤维强化的陶瓷基复合材料的活性钎料设计及钎焊方法。The invention relates to the active brazing material design and brazing method for carbon fiber reinforced ceramic matrix composite materials such as C f /C (namely C/C) and C f /SiC (namely C/SiC).

背景技术Background technique

利用连续纤维增韧的碳纤维增强的陶瓷基复合材料(如Cf/C、Cf/SiC)与金属材料相比,具有两项优点:(1)高温强度高(Cf/C在氧化性气氛下450℃以上就开始氧化,参考文献[1]);(2)密度轻(仅为镍基高温合金的1/4,陶瓷材料的1/2,参考文献[2、3]);故作为高温结构材料有广泛的用途。其中,Cf/C复合材料目前主要用于飞机刹车系统、航天器的防热与耐烧蚀结构材料。Compared with metal materials, ceramic matrix composites (such as C f /C, C f/ SiC) reinforced with continuous fibers have two advantages: (1) high temperature strength (C f /C is in the oxidation resistance It starts to oxidize above 450°C in the atmosphere, reference [1]); (2) light density (only 1/4 of nickel-based superalloy, 1/2 of ceramic material, reference [2, 3]); so It has a wide range of uses as a high-temperature structural material. Among them, C f /C composite materials are currently mainly used in aircraft brake systems and spacecraft heat-resistant and ablation-resistant structural materials.

碳纤维增强的陶瓷基复合材料的焊接方法主要采用钎焊(参考文献[4、5])。与普通陶瓷材料类似,其可钎焊性差的原因有两方面:一是常用金属钎料对其润湿性差;二是与金属钎料的热膨胀系数差距较大,在接头冷却中会产生较大的热应力。此外,Cf/C复合材料作为高温结构材料使用时,对钎焊接头的耐热性也要求较高。为解决润湿性问题,绝大多数报道都用Ti作为活性元素,采用含Ti的Ag基钎料、含Ti的Cu基钎料或Ti基钎料,或者焊前对Cf/C复合材料表面进行改性预处理来改进润湿性。The welding method of carbon fiber reinforced ceramic matrix composites mainly adopts brazing (References [4, 5]). Similar to ordinary ceramic materials, there are two reasons for its poor brazeability: one is the poor wettability of commonly used metal solders; the other is that there is a large gap in thermal expansion coefficient with metal solders, which will cause large gaps during joint cooling. of thermal stress. In addition, when C f /C composite materials are used as high-temperature structural materials, the heat resistance of brazed joints is also required to be high. In order to solve the wettability problem, most reports use Ti as the active element, using Ti-containing Ag-based solder, Ti-containing Cu-based solder or Ti-based solder, or C f /C composite materials before welding. The surface is pre-treated to improve wettability.

1997年,意大利的Milena Salvo(参考文献[6])报道采用Si片(silicon sheet)、Al 箔、Ti粉三种活性中间层对(Cf/C)/(Cf/C)同种母材组合进行焊接:对于Si片中间层,在1420℃×90min与流动Ar保护的条件下(已超过Si的熔点1414℃),通过反应生成20μm 厚SiC,获得剪切强度为22MPa的接头,已接近Cf/C的层间剪切强度(interlaminar shearstrength)20~25MPa;但组织观察发现,中间层中心未反应完的Si层仍很明显(厚达~120μm),且中间层在冷却过程中形成垂直裂纹(贯穿SiC反应层与残留的Si片部分)。对于Al箔中间层,在1000℃×45min与流动Ar保护条件下,在Al与Cf/C复合材料的界面反应生成15μm厚的Al4C3反应层,获得剪切强度为10MPa的接头,接头失效发生在 (Cf/C)/Al4C3界面。对于Ti粉中间层,在1420℃×45min的条件下(固相焊),仅有个别部位Ti粘附在Cf/C复合材料母材上。可见,(Cf/C)/(Cf/C)同种母材的固相焊较为困难,即使是采用“活性中间层(Si、Al、Ti均为可与SiC反应的活性中间层)”,因受反应程度、反应产物、原始接触程度的限制,也难以实现高强度、大面积焊合。In 1997, Italy's Milena Salvo (reference [6]) reported the use of Si sheet (silicon sheet), Al foil, Ti powder three kinds of active interlayer pairs (C f /C) / (C f /C) the same mother Welding of the material combination: for the middle layer of the Si sheet, under the condition of 1420 ° C × 90 min and flowing Ar protection (which has exceeded the melting point of Si of 1414 ° C), the SiC with a thickness of 20 μm is formed by the reaction, and a joint with a shear strength of 22 MPa is obtained. The interlaminar shear strength (interlaminar shearstrength) close to C f /C is 20-25MPa; however, the structure observation shows that the unreacted Si layer in the center of the interlayer is still obvious (thickness ~120μm), and the interlayer is in the cooling process Vertical cracks are formed (through the SiC reaction layer and the remaining Si sheet). For the Al foil interlayer, under the condition of 1000℃×45min and flowing Ar protection, a 15 μm thick Al 4 C 3 reaction layer was formed at the interface of Al and C f /C composites, and a joint with a shear strength of 10 MPa was obtained. Joint failure occurs at the (C f /C)/Al 4 C 3 interface. For the Ti powder intermediate layer, under the condition of 1420℃×45min (solid-phase welding), only a few parts of Ti adhere to the C f /C composite base material. It can be seen that (C f /C)/(C f /C) solid phase welding of the same base metal is more difficult, even if the "active interlayer (Si, Al, Ti are all active interlayers that can react with SiC) ", Due to the limitation of reaction degree, reaction product and original contact degree, it is also difficult to achieve high-strength and large-area welding.

2005年,美国NASA的M.Singh(参考文献[7])采用三种含Ti钎料(Cu基:92.8Cu-3Si-2Al-2.25Ti;Ti基:70Ti-15Cu-15Ni;Ag基:68.8Ag-26.7Cu-4.5Ti)对纯Ti与 Cf/C组合按照tube on plate结构形式在(920~1050)℃×5min条件下进行了真空钎焊。所有含Ti钎料都对Cf/C复合材料润湿良好,无界面空洞,同时反应生成了富Ti的碳化物 (TiC1-x),由其将C与钎料很好地连接在一起;其中Cu基钎料所得接头性能较好。M.Singh 从热力学角度,分析了Ti与C反应形成TiC的吉布斯自由能变化(The Gibb’s free energy change forTiC formation),指明在920℃~1050℃范围内吉布斯自由能变化为-174~-169 kJ;热力学计算表明TiC0.48~0.95是可以从Cu中形成的。同时Cu基钎料中的Si通过Si与 C反应形成SiC的自由能变化在920~1050℃范围内为-62.4~-61.1k。该Cu基钎料中的 Ti、Si都能与C反应,分别生成TiC与SiC,因此其接头性能较好。In 2005, M.Singh of NASA (reference [7]) used three kinds of Ti-containing solders (Cu base: 92.8Cu-3Si-2Al-2.25Ti; Ti base: 70Ti-15Cu-15Ni; Ag base: 68.8 Ag-26.7Cu-4.5Ti) was vacuum brazed to the combination of pure Ti and C f /C according to the tube on plate structure at (920~1050)℃×5min. All Ti-containing solders wet the C f /C composites well, without interfacial voids, and react to form Ti-rich carbides (TiC 1-x ), which connect C and solder well ; Among them, the joint performance of Cu-based solder is better. From the perspective of thermodynamics, M.Singh analyzed the Gibb's free energy change for TiC formation from the reaction of Ti and C to form TiC (The Gibb's free energy change for TiC formation), indicating that the Gibb's free energy change in the range of 920 ° C to 1050 ° C is -174 ~-169 kJ; thermodynamic calculations show that TiC 0.48~0.95 can be formed from Cu. At the same time, the free energy change of Si in Cu-based solder to form SiC through the reaction of Si and C is -62.4~-61.1k in the range of 920~1050℃. Ti and Si in the Cu-based solder can react with C to form TiC and SiC respectively, so the joint performance is better.

2007年,哈尔滨工业大学的秦优琼与冯吉才(参考文献[8])采用50微米厚 Ag-26.7Cu-4.6Ti(wt.%)箔带在(860~1000)℃×(3~30)min条件下真空钎焊Cf/C与TC4,其中在910℃×10min条件下获得的剪切强度最高,为25MPa;界面结构的组织组成分析表明,在Cf/C侧的反应层为两层:(Cf/C)/[(TiC+C)/TiCu];在TC4侧的反应层为四层: Ti3Cu4/TiCu/Ti2Cu/Ti2Cu+Ti(s.s)/TC4。秦优琼等(参考文献[9])还采用Ag-28Cu钎料对 Cf/C复合材料和TC4进行了钎焊,试验规范为10min×(820~900)℃;在钎焊温度850℃, 保温时间10min的钎焊条件下,获得的抗剪强度最高,达到38MPa。其润湿Cf/C的活性元素Ti实际来自于另一侧的Ti母材的溶解。北京航空航天大学的Xiujie Cao(参考文献[10])采用50μm厚的Ag68.83-Cu26.77-Ti4.4箔对Cf/C复合材料与TC17在 (840~920)℃×15min条件下进行真空钎焊,在860℃×15min条件下所得剪切强度最大,为24±1MPa。In 2007, Qin Youqiong and Feng Jicai of Harbin Institute of Technology (reference [8]) used a 50-micron thick Ag-26.7Cu-4.6Ti (wt.%) foil strip at (860-1000) ℃ × (3-30) min conditions Under vacuum brazing C f /C and TC4, the shear strength obtained under the condition of 910℃×10min is the highest, which is 25MPa; the microstructure analysis of the interface structure shows that the reaction layer on the C f /C side is two layers: (C f /C)/[(TiC+C)/TiCu]; the reaction layer on the TC4 side is four layers: Ti 3 Cu 4 /TiCu/Ti 2 Cu/Ti 2 Cu+Ti(ss)/TC4. Qin Youqiong et al. (Reference [9]) also used Ag-28Cu solder to braze C f /C composite materials and TC4, and the test specification was 10min×(820~900)℃; at the brazing temperature of 850℃, heat preservation Under the condition of brazing for 10 minutes, the highest shear strength was obtained, reaching 38MPa. The active element Ti that wets C f /C actually comes from the dissolution of the Ti base material on the other side. Xiujie Cao of Beihang University (reference [10]) used 50μm thick Ag68.83-Cu26.77-Ti4.4 foil to C f /C composite material and TC17 under the condition of (840~920)℃×15min Vacuum brazing is carried out, and the shear strength obtained under the condition of 860°C×15min is the largest, which is 24±1MPa.

近年来,哈工大冯吉才课题组开始尝试钎料的复合化。Zhou Y.H.(参考文献[11])通过向AgCuTi钎料中添加纳米氧化铝颗粒,用纳米氧化铝颗粒强化的AgCuTi钎料钎焊 Cf/C复合材料与TC4。在TC4一侧的界面结构为TC4/扩散层/Ti-Cu金属间化合物,在Cf/C 一侧的界面结构为TiCu/TiC/(Cf/C);当钎焊温度达到920℃时,钎缝中的TiCu相非常发达,替代了Ag(s,s)与Cu(s,s)。添加纳米氧化铝颗粒通过抑制与TC4相邻的Ti-Cu层的生长、在钎缝中提供分散的TiCu形核点两种机制改善接头性能。在880℃×10min条件下,接头可获得最高强度27.8MPa。哈工大的Zhou Y等(参考文献[12])还向AgCuTi钎料中添加石墨烯纳米片(GNSs:graphene nanosheets),当焊接条件为900℃×10min时,所得接头的剪切强度达到最高30.2MPa;GNSs的主要有益作用体现在降低脆性反应层的厚度、促进TiC与TiCu在钎缝中的形成、由此降低热膨胀系数。In recent years, Feng Jicai's research group at Harbin Institute of Technology has begun to try the compounding of solder. Zhou YH (Reference [11]) brazed Cf /C composites with TC4 with AgCuTi filler metal reinforced with nano-alumina particles by adding nano-alumina particles to the AgCuTi filler metal. The interface structure on the TC4 side is TC4/diffusion layer/Ti-Cu intermetallic compound, and the interface structure on the C f /C side is TiCu/TiC/(C f /C); when the brazing temperature reaches 920°C , the TiCu phase in the brazing joint is very developed, replacing Ag(s,s) and Cu(s,s). The addition of nano-alumina particles improves the joint performance by inhibiting the growth of the Ti-Cu layer adjacent to TC4 and providing dispersed TiCu nucleation sites in the braze joint. Under the condition of 880℃×10min, the joint can obtain the highest strength of 27.8MPa. Zhou Y et al. from Harbin Institute of Technology (reference [12]) also added graphene nanosheets (GNSs: graphene nanosheets) to the AgCuTi solder. When the welding condition was 900℃×10min, the shear strength of the obtained joint reached a maximum of 30.2MPa ; The main beneficial effect of GNSs is to reduce the thickness of the brittle reaction layer, promote the formation of TiC and TiCu in the brazing joint, thereby reducing the thermal expansion coefficient.

中国科学院沈阳金属所的K.X.Zhang(参考文献[13])着眼于核反应器热管理与航空工业的应用背景,对Cu/C-C组合采用铜基含Ti活性钎料(Ag-68.8Cu-4.5Ti)在 910℃×10min条件下真空钎焊,证明了界面形状效应(interfacial shape effect),即锥状界面结构设计(conical interface)比平直界面(straight interface)可大幅提高接头的四点弯曲性能。同时,观察到碳纤维表面另有一层热解碳涂层(PyC:pyrolytic carbon coating),在热解碳的表面,形成厚1μm左右的TiC反应物,促进了润湿与结合。还观察到了钎料可进入Cf/C母材内固有的孔隙。KX Zhang from Shenyang Institute of Metal Research, Chinese Academy of Sciences (reference [13]) focused on the application background of nuclear reactor thermal management and aviation industry, and used copper-based Ti-containing active solder (Ag-68.8Cu-4.5Ti) for Cu/CC combination Vacuum brazing under the condition of 910℃×10min proved the interface shape effect (interfacial shape effect), that is, the conical interface structure design (conical interface) can greatly improve the four-point bending performance of the joint than the straight interface (straight interface). At the same time, it was observed that there is another layer of pyrolytic carbon coating (PyC: pyrolytic carbon coating) on the surface of the carbon fiber. On the surface of the pyrolytic carbon, a TiC reactant with a thickness of about 1 μm is formed, which promotes wetting and bonding. It was also observed that the brazing filler metal can enter the inherent pores in the C f /C base metal.

除了上述Ag基、Cu基以Ti为活性元素的活性钎料外,另一类广为研究的钎料是传统Ni基商用钎料。In addition to the above-mentioned Ag-based and Cu-based active solders with Ti as the active element, another widely studied solder is the traditional Ni-based commercial solder.

2008年,美国NASA的M.Singh(参考文献[14])采用两种Ni基非晶钎料(MBF-20 与MBF-30)进行了Ti/C-C、Ti/C-SiC、Hastealloy/C–SiC的钎焊(前两种为工业纯Ti与陶瓷基复合材料的钎焊)。Ti/C-C接头的界面结构微观分析表明,两种商用Ni基非晶钎料都能很好润湿Cf/C复合材料,无裂纹与空洞缺陷。其中C-C/MBF-20界面层极薄(不足1μm),其中富Ti,并含有少量Cr与Fe;C-C/MBF-30一侧的界面,在Cf/C表面“析出”扇贝状的富Ti层与较厚的富Ni层(5~10μm厚)。Cf/C表面附近高达87~98at.%的Ti含量说明Ti母材事实上已溶解(dissolved)于两种Ni基钎料中,并偏聚(segregated)于 Cf/C的表面。Cf/C表面偏聚的富Ti层的形成促进了对Cf/C的润湿与结合。热力学分析表明,由Ti与C反应形成TiC的自由能变化量(values of the Gibbs free energy change,ΔG,for TiC formation)在1045℃、1085℃分别是-172kJ、-168kJ。虽然在1045℃与1085℃,SiC 形成自由能也是负值,但由于TiC的吉布斯自由能变化量比SiC形成自由能变化量更大,因而界面相应是优先形成TiC。In 2008, M.Singh of NASA (reference [14]) carried out Ti/CC, Ti/C-SiC, Hastealloy/C– Brazing of SiC (the first two are brazing of industrial pure Ti and ceramic matrix composite materials). Microscopic analysis of the interface structure of Ti/CC joints shows that both commercial Ni-based amorphous solders can wet the Cf /C composites well without cracks and void defects. Among them, the interface layer of CC/MBF-20 is extremely thin (less than 1 μm), which is rich in Ti and contains a small amount of Cr and Fe; the interface on the side of CC/MBF-30 "precipitates" scallop-like Ti-rich on the surface of C f /C Layer and thicker Ni-rich layer (5 ~ 10μm thick). The Ti content as high as 87-98 at.% near the surface of C f /C indicates that the Ti base material has actually been dissolved in the two Ni-based solders and segregated on the surface of C f /C. The formation of a segregated Ti-rich layer on the surface of C f /C promotes the wetting and bonding of C f /C. Thermodynamic analysis shows that the free energy changes (values of the Gibbs free energy change, ΔG, for TiC formation) of TiC formed by the reaction of Ti and C are -172kJ and -168kJ at 1045°C and 1085°C, respectively. Although at 1045°C and 1085°C, the SiC formation free energy is also negative, but because the Gibbs free energy change of TiC is larger than that of SiC formation free energy, the interface is correspondingly preferential to form TiC.

田晓羽等(参考文献[15])采用镍基钎料BNi-2在1170℃×60min条件下钎焊Cf/C复合材料与高温合金GH99,得到35MPa的剪切强度;当向BNi-2粉末中添加1~8%TiH2粉末时,3~5%的添加量使接头抗剪强度高于BNi2,添加TiH2粉末含量为3%时,抗剪强度最高可达40MPa。界面结构显微分析表明,Cf/C表面生成条状的Cr3C2Tian Xiaoyu et al. (reference [15]) brazed C f /C composites and superalloy GH99 with nickel-based solder BNi-2 at 1170 °C × 60 min, and obtained a shear strength of 35 MPa; when BNi-2 powder When 1-8% TiH 2 powder is added to the steel, the addition amount of 3-5% makes the shear strength of the joint higher than that of BNi2. When the TiH 2 powder content is 3%, the shear strength can reach up to 40MPa. Microscopic analysis of the interface structure shows that strips of Cr 3 C 2 are formed on the surface of C f /C.

日本东京工业大学的池庄司敏孝(参考文献[16])对Cf/C母材与Inconel 600(Ni基合金)组合,采用Fe-Cr-Ni-(Si,B)钎料,并预置Mo丝与Nb箔(为降低热应力),在1080℃×300s 条件下进行真空钎焊,所得接头强度为2~16MPa(随Nb层厚度变化)。Toshitaka Ikejo of Tokyo Institute of Technology (reference [16]) combined C f /C base metal with Inconel 600 (Ni-based alloy), using Fe-Cr-Ni-(Si,B) solder, and pre-prepared Mo The wire and Nb foil (in order to reduce thermal stress) are vacuum brazed under the condition of 1080℃×300s, and the joint strength obtained is 2-16MPa (varies with the thickness of Nb layer).

相对商用Ni基钎料,塑性好的含Ti的Ag基活性钎料(Ag-Cu-Ti)由于能兼顾润湿性与低的热应力,接头强度略高一些,大约在20~40MPa。商用Ni基钎料与商用Ag钎料都存在共同的问题,即熔点过低,分别在1000℃与800℃左右,影响接头的高温性能。此外,Ag钎料虽然塑性好,但含有贵金属。而Ni基钎料含有大量脆性相,需要较长的保温时间才能实现等温凝固,方可消除钎料内的脆性相。Compared with the commercial Ni-based solder, the Ti-containing Ag-based active solder (Ag-Cu-Ti) with good plasticity can balance wettability and low thermal stress, and the joint strength is slightly higher, about 20-40MPa. Both commercial Ni-based solder and commercial Ag solder have a common problem, that is, the melting point is too low, respectively around 1000°C and 800°C, which affects the high-temperature performance of the joint. In addition, although Ag solder has good plasticity, it contains precious metals. However, Ni-based solder contains a large amount of brittle phases, and it takes a long holding time to achieve isothermal solidification, so as to eliminate the brittle phases in the solder.

Ni基商用钎料(如BNi-2具有Ni-Cr-Fe-Si-B系)在耐热金属材料的高温钎焊中,不但润湿性优良,而且能够利用等温凝固提高钎缝的重熔温度与耐热能力,故而在耐热金属材料的高温钎焊中得到广泛应用。但是,Ni基商用钎料用于碳纤维增强的陶瓷基复合材料(如Cf/C、Cf/SiC)的钎焊时,虽然界面润湿性尚可,但因数分钟的短时保温无法实现等温凝固,导致钎缝重熔温度低、耐热性差、钎缝很脆,因而接头的室温与高温性能均很差。Ni-based commercial solder (such as BNi-2 with Ni-Cr-Fe-Si-B system) in high-temperature brazing of heat-resistant metal materials not only has excellent wettability, but also can use isothermal solidification to improve the remelting of the brazing seam Temperature and heat resistance, so it is widely used in high temperature brazing of heat-resistant metal materials. However, when Ni-based commercial solder is used for brazing of carbon fiber-reinforced ceramic matrix composites (such as C f /C, C f /SiC), although the wettability of the interface is acceptable, short-term heat preservation of several minutes cannot be achieved. Isothermal solidification leads to low remelting temperature of the brazing seam, poor heat resistance, and brittle brazing seam, so the room temperature and high temperature performance of the joint are poor.

最近,焊前对Cf/C表面进行“改性或涂层预处理”来改善润湿性并抑制过度反应的文献逐渐增多,其效果也较为显著,举例如下。Recently, there are more and more literatures on "modification or coating pretreatment" of C f /C surface before welding to improve wettability and inhibit excessive reaction, and the effect is also more significant, as follows.

2004年,意大利的Pietro Appendino(参考文献[17])为实现热核偏滤器中盔甲(Cf/C) 与热沉(Cu)的焊接,在直接将Cu浇注在Cf/C表面(经激光加工的用Ti活化处理的表面)焊接方法的基础上,提出如下改进方法:先将第VIB族过渡金属(transition metal ofthe VI B group:Cr、Mo)的粉末酒精悬浮液(slurry technique:metal powdersuspension in ethanol)预置于Cf/C表面,通过第VIB族过渡金属粉末与Cf/C的高温固态反应(1000℃以上,在流动Ar或真空环境)对Cf/C表面进行改性预处理,然后再将Cu液在1100℃浇注到改性后的Cf/C表面(modified CFC)。Cf/C表面形成的5~10μm厚的碳化物改善了液态Cu对Cf/C表面的润湿性。这种方法也可用于用Si掺杂过的Cf/C(silicon doped CFC) 与Cu的连接。In 2004, Pietro Appendino in Italy (reference [17]) directly poured Cu on the surface of C f / C (via On the basis of the welding method of laser processing (surface treated with Ti activation treatment), the following improved method is proposed: first, the powder alcohol suspension (slurry technique: metal of transition metal of the VI B group: Cr, Mo) powdersuspension in ethanol) is pre-placed on the Cf /C surface, and the Cf /C surface is modified by the high-temperature solid-state reaction (above 1000°C, in flowing Ar or vacuum environment) of VIB group transition metal powder and Cf /C Pretreatment, and then pouring the Cu solution on the modified Cf /C surface (modified CFC) at 1100°C. The 5-10μm thick carbide formed on the surface of C f /C improves the wettability of liquid Cu on the surface of C f /C. This method can also be used to connect Si-doped Cf /C (silicon doped CFC) to Cu.

2011年,西北工业大学的郭领军等人(参考文献[18])在Cf/C与GH3128的焊接中,采用粉末包渗(pack cementation coating technique)技术,预先在Cf/C表面,在 (1700~2400)℃×(1~3)h条件下利用C粉+Si粉在流动氩气氛中制备SiC改性覆层,再利用Ti+Ni粉末在(1050~1250)℃×(15~60)min×(8~20)MPa条件下进行热压焊接。在利用SiC层对Cf/C表面改性后,在1170℃下焊接可获得接头的剪切强度为22.5MPa,而未用SiC层进行改性的接头强度为0。SiC覆层与Cf/C结合致密,且改善了Ni-Ti合金液对Cf/C的润湿性,降低了热失配应力。In 2011, Guo Lingjun and others from Northwestern Polytechnical University (reference [18]) used the technology of pack cementation coating technique in the welding of C f /C and GH3128 . (1700~2400)℃×(1~3)h under the condition of using C powder + Si powder to prepare SiC modified coating in flowing argon atmosphere, and then using Ti+Ni powder at (1050~1250)℃×(15~ 60) min × (8 ~ 20) MPa conditions for hot-press welding. After modifying the C f /C surface with a SiC layer, the shear strength of the joint obtained at 1170 °C is 22.5 MPa, while the joint strength without modification with the SiC layer is 0. The SiC coating is closely combined with C f /C, and the wettability of Ni-Ti alloy liquid to C f /C is improved, and the thermal mismatch stress is reduced.

2018年,西北工业大学的Xinrui Song等(参考文献[19])将高纯Cr粉置于Cf/C复合材料表面,在Ar保护下,进行1300℃×1h热处理,得到CrC改性的Cf/C表面,然后再用Ti-23Cu-11Zr-9Ni钎料在960℃×20min条件下进行真空钎焊。钎焊前Cf/C表面20μm 厚的碳化铬层在钎焊后减薄至5μm,认为这是部分碳化铬溶解入钎料,变为TiC层与TiC 颗粒,这样既避免了厚且连续的TiC层,又降低了热应力,接头剪切强度增高至52±6MPa,远高于未进行碳化铬预处理情况下的接头剪切强度(15±2MPa)。In 2018, Xinrui Song et al. from Northwestern Polytechnical University (reference [19]) placed high-purity Cr powder on the surface of C f /C composites, and under the protection of Ar, heat-treated at 1300 °C for 1 h to obtain CrC-modified C f /C surface, and then vacuum brazing with Ti-23Cu-11Zr-9Ni solder at 960°C×20min. The 20 μm thick chromium carbide layer on the surface of C f /C before brazing is thinned to 5 μm after brazing, which is considered to be part of the chromium carbide dissolved into the brazing filler metal, which becomes the TiC layer and TiC particles, which avoids thick and continuous The TiC layer reduces the thermal stress, and the joint shear strength increases to 52±6MPa, which is much higher than the joint shear strength (15±2MPa) without chromium carbide pretreatment.

2019年,天津大学的Yang Z.W.(参考文献[20])提出对Cf/C复合材料进行预氧化改性处理(可在碳纤维周围形成环形的人为通道),结合导入碳纳米管,大幅提高用0.1mm厚Ag-27.6Cu-1.5Ti活性钎料钎焊(Cf/C)/Nb的接头强度。通过800℃×5min的预氧化, Cf/C与Nb的钎焊接头室温剪切强度可由29MPa提高到57MPa;进一步加Ti,通过形成 TiC,接头剪切强度提高至62MPa;500℃时能保持在48MPa。并认为,接头强度的改善归因于小的残余应力、大的焊合面积与钉扎效果。In 2019, Yang ZW from Tianjin University (reference [20]) proposed to pre-oxidize and modify C f /C composites (which can form a ring-shaped artificial channel around the carbon fiber), combined with the introduction of carbon nanotubes, to greatly improve the efficiency. Joint Strength of 0.1mm Thick Ag-27.6Cu-1.5Ti Active Solder Brazing (C f /C)/Nb. Through pre-oxidation at 800℃×5min, the room temperature shear strength of the brazed joint of C f /C and Nb can be increased from 29MPa to 57MPa; further adding Ti, through the formation of TiC, the shear strength of the joint can be increased to 62MPa; at 500℃, it can maintain At 48MPa. It is also believed that the improved joint strength is attributed to the small residual stress, large welded area and pinning effect.

在焊接方法方面,除了Cf/C表面预处理、直接将金属母材熔化浇注之外,还有燃烧合成方法(Combustion synthesis,参考文献21)。In terms of welding methods, in addition to C f /C surface pretreatment and direct melting and casting of the metal base material, there is also a combustion synthesis method (Combustion synthesis, reference 21).

参考文献references

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发明内容Contents of the invention

针对(1)现有Ag基活性钎料(Ag-Cu-Ti)熔点低(780℃)、贵金属含量大(~70%);(2)传统市售Ni基钎料(如BNi-2,BNi-3等)脆性大,熔点同样也偏低(~1000℃)、且需长时间保温实现润湿与等温凝固的问题;(3)同时兼顾解决陶瓷基复合材料可钎焊性差的三个固有问题(润湿难;热应力;耐高温性能差),本发明提出一种以Fe为活性元素快速润湿陶瓷基复合材料中碳纤维的方法。For (1) the existing Ag-based active solder (Ag-Cu-Ti) has a low melting point (780°C) and a large noble metal content (~70%); (2) traditional commercially available Ni-based solder (such as BNi-2, BNi-3, etc.) have high brittleness, low melting point (~1000°C), and need a long time of heat preservation to achieve wetting and isothermal solidification; Inherent problems (difficult wetting; thermal stress; poor high temperature resistance), the present invention proposes a method for quickly wetting carbon fibers in ceramic matrix composites using Fe as an active element.

为达到上述目的,本发明提出了以下钎料设计方法与相应的钎焊方法:In order to achieve the above object, the present invention proposes following solder design method and corresponding brazing method:

一种针对碳纤维(Cf)强化的陶瓷基复合材料(CMC)的钎料,该钎料在成分设计方面,针对碳纤维强化相在陶瓷基复合材料(如Cf/C、Cf/SiC等)中含量大(>40%~50%)、熔点极高(3827℃)的特点,提出采用能够与碳纤维发生共晶反应的弱碳化物形成元素、非碳化物形成元素或中等强度碳化物形成元素作为润湿碳纤维(对Cf/C陶瓷基复合材料同时可润湿C基体,对Cf/SiC陶瓷基复合材料仅润湿碳纤维)的主要活性元素,以全部或部分代替传统钎料中的强碳化物形成元素(例如,Ti、Nb、V、Si、B),并循此思路设计形成系列面向所述陶瓷基复合材料的高温活性钎料。所述高温活性钎料在界面润湿性改进与钎缝组织改进两方面具有如下独特优势:在界面润湿性方面,由于共晶反应产物为液相,其反应与形成速度(由溶解速度控制)远快于传统钎料中的强碳化物形成元素与碳纤维反应生成的固相碳化物产物的生长速度(由固相扩散速率控制),故可快速润湿碳纤维、碳基体;在钎缝组织改进方面,利用共晶反应产物(即共晶液相)提高钎缝的致密性的同时,又自动地向钎缝中导入了由碳纤维“溶解—结晶”后形成的石墨相,降低了钎缝的热膨胀系数,有利于减小热应力的危害。A kind of filler metal for carbon fiber (C f ) reinforced ceramic matrix composite (CMC), in terms of composition design, the filler metal is designed for carbon fiber reinforced phase in ceramic matrix composite materials (such as C f /C, C f /SiC, etc. ) in large content (>40% ~ 50%), high melting point (3827 ℃), it is proposed to use weak carbide-forming elements, non-carbide-forming elements or medium-strength carbide-forming elements that can undergo eutectic reactions with carbon fibers As the main active elements for wetting carbon fibers (for C f /C ceramic matrix composites, C matrix can be wetted at the same time, for C f /SiC ceramic matrix composites, only carbon fibers can be wetted), to replace all or part of the traditional solder Strong carbide-forming elements (for example, Ti, Nb, V, Si, B), and follow this idea to design and form a series of high-temperature active solders for the ceramic matrix composite material. The high-temperature active solder has the following unique advantages in terms of interface wettability improvement and brazing seam structure improvement: in terms of interface wettability, since the eutectic reaction product is a liquid phase, its reaction and formation speed (controlled by dissolution rate) ) is much faster than the growth rate of solid-phase carbide products generated by the reaction of strong carbide-forming elements in traditional solder and carbon fibers (controlled by solid-phase diffusion rate), so it can quickly wet carbon fibers and carbon matrix; In terms of improvement, while using the eutectic reaction product (i.e. eutectic liquid phase) to improve the compactness of the brazing seam, it also automatically introduces the graphite phase formed by the "dissolution-crystallization" of carbon fibers into the brazing seam, reducing the brazing seam. The coefficient of thermal expansion is beneficial to reduce the harm of thermal stress.

优选的,所述“高温”是指钎焊温度高于1000℃,达到高温钎焊(HTB:HighTemperature Brazing)的温度范围。Preferably, the "high temperature" means that the brazing temperature is higher than 1000° C., reaching the temperature range of high temperature brazing (HTB: High Temperature Brazing).

优选的,所述“活性钎料”是指该钎料能与碳纤维发生明显的共晶反应,即钎料自身的液化及其对碳纤维、碳基体的润湿都是借助于所述活性元素与碳纤维的共晶反应(例如, Fe/Cf、Ni/C、Cr/C共晶反应产物)实现的(并非化学机制形成新的界面相)。Preferably, the "active solder" means that the solder can have an obvious eutectic reaction with the carbon fiber, that is, the liquefaction of the solder itself and its wetting to the carbon fiber and the carbon matrix are all by means of the active element and the carbon fiber. The eutectic reaction of carbon fibers (for example, Fe/C f , Ni/C, Cr/C eutectic reaction products) is achieved (not a chemical mechanism to form a new interface phase).

优选的,所述活性元素选自廉价的弱碳化物形成元素Fe或非碳化物形成元素Ni或中等强度碳化物形成元素Cr,而非其他价格贵、资源缺的元素(如Ti、Pd等)。Preferably, the active element is selected from cheap weak carbide-forming element Fe or non-carbide-forming element Ni or medium-strength carbide-forming element Cr, rather than other expensive and resource-poor elements (such as Ti, Pd, etc.) .

优选的,本发明提出以Fe为活性元素(即共晶活性元素,利用共晶反应实现润湿)的钎料设计思路。所用含Fe高温活性钎料可以是Fe基活性钎料,也可以是含有足量Fe (为合金元素)的其他金属基(该金属与碳不发生共晶反应,或虽与碳可发生共晶反应,但共晶反应温度高于Fe-Cf共晶反应温度)的合金型钎料。循此思路,对应的高温活性钎料还可以为Ni基活性钎料、Cr基活性钎料或含有活性元素Ni或Cr的其他金属基合金型钎料。Preferably, the present invention proposes a solder design idea that uses Fe as the active element (ie eutectic active element, using eutectic reaction to achieve wetting). The Fe-containing high-temperature active solder used can be Fe-based active solder, or other metal bases containing sufficient Fe (as alloying elements) (the metal does not undergo eutectic reaction with carbon, or although eutectic reaction with carbon can occur Reaction, but the eutectic reaction temperature is higher than the Fe-C f eutectic reaction temperature) alloy type solder. Following this idea, the corresponding high-temperature active solder can also be Ni-based active solder, Cr-based active solder, or other metal-based alloy-type solder containing active elements Ni or Cr.

优选的,所述高温活性钎料以Fe为活性元素,该高温活性钎料含有足量的Fe,足以与所述陶瓷基复合材料的碳纤维(Cf)在Fe-Cf共晶反应温度1154℃之上(大于1154℃) 发生共晶反应并形成液相反应产物,从而润湿碳纤维。Preferably, the high-temperature active solder has Fe as the active element, and the high-temperature active solder contains a sufficient amount of Fe, which is sufficient to react with the carbon fiber (C f ) of the ceramic matrix composite at the Fe-C f eutectic reaction temperature of 1154 Above 1154°C (greater than 1154°C) the eutectic reaction occurs and a liquid phase reaction product is formed, thereby wetting the carbon fibers.

优选的,所述高温活性钎料以Ni为活性元素,该高温活性钎料含有足量的Ni,足以与所述陶瓷基复合材料的碳纤维(Cf)在Ni-Cf共晶反应温度1327℃之上(大于1327℃) 发生共晶反应并形成液相反应产物,从而润湿碳纤维。Preferably, the high-temperature active solder uses Ni as the active element, and the high-temperature active solder contains enough Ni to react with the carbon fiber (C f ) of the ceramic matrix composite material at a Ni-C f eutectic reaction temperature of 1327 Above 1327°C (greater than 1327°C) the eutectic reaction occurs and a liquid phase reaction product is formed, thereby wetting the carbon fibers.

优选的,上述以Fe或Ni为活性元素的高温活性钎料中,可添加低热膨胀系数的陶瓷相、低热膨胀系数的难熔金属粉末或短纤维(1~10微米),从而通过降低高温活性钎料的热膨胀系数,以进一步降低该类高温活性钎料与所述陶瓷基复合材料母材之间的热应力。Preferably, in the above-mentioned high-temperature active solder with Fe or Ni as the active element, ceramic phases with low thermal expansion coefficients, refractory metal powders or short fibers (1 to 10 microns) with low thermal expansion coefficients can be added, thereby reducing the high-temperature activity The thermal expansion coefficient of the brazing filler metal is used to further reduce the thermal stress between the high-temperature active brazing filler metal and the base material of the ceramic matrix composite material.

一种针对碳纤维(Cf)强化的陶瓷基复合材料(CMC)的钎焊方法,包括以下步骤:A brazing method for carbon fiber (C f ) reinforced ceramic matrix composites (CMC), comprising the following steps:

(1)钎料设计、制备:设计并制备含有足量上述弱碳化物形成元素(Fe)、非碳化物形成元素(Ni)或中等强度碳化物形成元素(Cr)的合金或对应共晶活性元素(Fe、Ni、 Cr)的单质作为高温活性钎料(“共晶元素”特指针对“碳纤维”的共晶元素;“足量”是指与碳纤维发生共晶反应后,所生成的液相足以饱满填充界面间隙)。即利用上述高温活性钎料中的弱碳化物、非碳化物或中等强度碳化物形成元素作为通过共晶反应润湿碳纤维 (对Cf/C陶瓷基复合材料同时可润湿C基体,对Cf/SiC陶瓷基复合材料仅润湿碳纤维) 的活性元素(如Fe、Ni、Cr),全部或部分代替传统的强碳化物形成元素(如Ti、Nb、V、 Si、B)。(1) Brazing material design and preparation: design and prepare alloys containing sufficient amounts of the above-mentioned weak carbide-forming elements (Fe), non-carbide-forming elements (Ni) or medium-strength carbide-forming elements (Cr) or corresponding eutectic activities The simple substance of elements (Fe, Ni, Cr) is used as a high-temperature active solder ("eutectic element" specifically refers to the eutectic element for "carbon fiber";"sufficientamount" refers to the liquid formed after the eutectic reaction with carbon fiber phase enough to fill the interfacial gap). That is to use the weak carbide, non-carbide or medium-strength carbide-forming elements in the above-mentioned high-temperature active solder as the wet carbon fiber through the eutectic reaction (for C f /C ceramic matrix composites, it can wet the C matrix at the same time, and for C The f /SiC ceramic matrix composite only wets the active elements (such as Fe, Ni, Cr) of carbon fibers, and replaces the traditional strong carbide-forming elements (such as Ti, Nb, V, Si, B) in whole or in part.

(2)钎焊工艺:通过所述活性元素(如Fe、Ni、Cr)与碳纤维的共晶反应生成液相产物,既实现对碳纤维强化陶瓷基复合材料中碳纤维、碳基体的快速与致密润湿,又饱满填充界面间隙,形成钎缝。该工艺一方面利用所述活性元素与碳纤维的共晶反应温度相对较高(比传统Ag基钎料及Ni基钎料的熔点分别高300℃与150℃)的优势(Fe-Cf共晶反应温度为1154℃;Ni-Cf共晶反应温度为1327℃;Cr-Cf共晶反应温度为1534℃),可提高钎焊接头的耐热温度,这是本发明所提出的“特定优化组合共晶反应钎焊方法(如Fe-Cf、 Ni-Cf、Cr-Cf)”的优势之一。另一方面,由于共晶反应温度低于活性元素本身,且钎缝中能导入较多的石墨相(由碳纤维经共晶反应溶解后导入钎缝的),“低的共晶反应温度”与“钎缝中原位生成的石墨相”有利于降低钎料与母材之间的热应力,这是本发明所提出的基于特定优化组合(如Fe-Cf、Ni-Cf、Cr-Cf)共晶反应的钎焊方法的优势之二。(2) Brazing process: through the eutectic reaction of the active elements (such as Fe, Ni, Cr) and carbon fibers to generate liquid phase products, it can realize the rapid and dense wetting of carbon fibers and carbon matrix in carbon fiber reinforced ceramic matrix composites. Wet, and full fill the interfacial gap, forming a brazing seam. On the one hand, this process takes advantage of the relatively high eutectic reaction temperature of the active elements and carbon fibers (300°C and 150°C higher than the melting points of traditional Ag-based solder and Ni-based solder, respectively) (Fe-C f eutectic reaction temperature is 1154°C; Ni- Cf eutectic reaction temperature is 1327°C; Cr- Cf eutectic reaction temperature is 1534°C), which can improve the heat-resistant temperature of brazed joints, which is the "specific optimization" proposed by the present invention Combining eutectic reaction brazing methods (such as Fe-C f , Ni-C f , Cr-C f )" is one of the advantages. On the other hand, since the eutectic reaction temperature is lower than the active element itself, and more graphite phases can be introduced into the brazing seam (introduced into the brazing seam after the carbon fiber is dissolved by the eutectic reaction), "low eutectic reaction temperature" and "Graphite phase generated in situ in the brazing seam" is conducive to reducing the thermal stress between the brazing filler metal and the base metal, which is based on a specific optimized combination (such as Fe-C f , Ni-C f , Cr-C f ) The second advantage of the eutectic reaction brazing method.

优选的,在具体钎焊方法方面,以纯Fe或含Fe合金作为中间层预置于碳纤维(Cf)强化的陶瓷基复合材料(CMC)母材之间,采用Fe-Cf共晶反应获得共晶液相,无需长时间保温即可实现反应润湿碳纤维、形成钎缝;并利用反应形成的共晶液相深度填充所述陶瓷基复合材料的碳纤维与陶瓷基体间的原始遗留孔隙(陶瓷基复合材料因制备过程中致密化困难而往往含有15%左右的原始孔隙),由此可进一步强化近缝区的陶瓷基复合材料。利用富余的共晶反应液相深度填充并强化近缝区陶瓷基复合材料母材,是本发明所提出的基于特定优化组合(如Fe-Cf)共晶反应钎焊方法的优势之三。Preferably, in terms of specific brazing methods, pure Fe or Fe-containing alloys are used as an intermediate layer to be pre-placed between carbon fiber (C f ) reinforced ceramic matrix composite (CMC) base materials, and Fe-C f eutectic reaction is used to obtain The eutectic liquid phase can achieve reaction-wetting carbon fibers and form brazing seams without long-term heat preservation; and use the eutectic liquid phase formed by the reaction to deeply fill the original remaining pores between the carbon fibers and the ceramic matrix of the ceramic matrix composite (ceramic The ceramic matrix composite material often contains about 15% of the original pores due to the difficulty in densification during the preparation process), which can further strengthen the ceramic matrix composite material near the seam. It is the third advantage of the eutectic reaction brazing method based on a specific optimized combination (such as Fe-C f ) proposed by the present invention to deeply fill and strengthen the base material of the ceramic matrix composite material near the seam by using the surplus eutectic reaction liquid phase.

此外,本发明所提出的“共晶反应钎焊方法”除了在共晶反应产物方面具有上述三方面的优势外,在反应参与物方面,由钎料中的特定部分(活性元素)与母材中的特定部分(碳纤维)参与共晶反应,为钎料设计提供了更为广阔的思路。这是本发明提出的共晶反应钎焊方法的优势之四。In addition, the "eutectic reaction brazing method" proposed by the present invention has the advantages of the above three aspects in terms of eutectic reaction products, and in terms of reaction participants, a specific part (active element) in the solder and A specific part (carbon fiber) in the solder participates in the eutectic reaction, which provides a broader idea for the design of the solder. This is the fourth advantage of the eutectic reaction brazing method proposed by the present invention.

优选的,对于钎焊接头耐热温度要求达到1000℃~1154℃的接头,其钎焊采用以Fe 为活性元素的活性钎料,钎焊温度(保温温度)为Fe-Cf共晶反应温度1154℃之上(例如,>1154℃,且≤1400℃)。Preferably, for joints whose heat resistance temperature of brazing joints is required to reach 1000°C to 1154°C, the brazing uses active solder with Fe as the active element, and the brazing temperature (insulation temperature) is the Fe-C f eutectic reaction temperature Above 1154°C (eg, >1154°C, and ≤1400°C).

优选的,对于钎焊接头耐热温度要求达到1200℃~1300℃的接头,其钎焊采用以Ni 为活性元素的活性钎料,钎焊温度为Ni-Cf共晶反应温度1327℃之上。Preferably, for joints whose heat resistance temperature of brazing joints is required to reach 1200°C to 1300°C, the brazing uses active solder with Ni as the active element, and the brazing temperature is above the Ni- Cf eutectic reaction temperature of 1327°C .

优选的,对于钎焊接头耐热温度要求达到1400℃~1500℃的接头,其钎焊采用以Cr 为活性元素的活性钎料,钎焊温度为1534℃之上。Preferably, for joints whose heat resistance temperature is required to reach 1400°C to 1500°C, the active solder with Cr as the active element is used for brazing, and the brazing temperature is above 1534°C.

优选的,上述钎焊中,保温时间为1~10min,压力为0.1~10MPa。Preferably, in the above brazing, the holding time is 1-10 minutes, and the pressure is 0.1-10 MPa.

本发明的有益效果体现在:The beneficial effects of the present invention are reflected in:

1、本发明的特点1. Features of the present invention

(1)本发明着眼于碳纤维增强相润湿性的解决,不同于传统钎焊思路着眼于以基体为研究对象的思路。(1) The present invention focuses on solving the wettability of the carbon fiber reinforced phase, which is different from the traditional brazing thinking that focuses on the matrix as the research object.

(2)本发明对碳纤维增强相,提出了以Fe为代表的共晶活性元素(代替传统活性元素Ti),这些活性元素的反应生成物为共晶液相,由此带来两大优势:其一,能快速反应并快速润湿碳纤维增强相;其二,钎缝实际为碳(石墨)与Fe组成的复合材料,其中的碳(石墨)可降低钎缝的热膨胀系数,从而降低接头内部的热应力,有利于提高接头制备工艺中的室温性能。(2) The present invention proposes a eutectic active element represented by Fe (replacing the traditional active element Ti) for the carbon fiber reinforced phase. The reaction product of these active elements is a eutectic liquid phase, which brings two major advantages: First, it can react quickly and quickly wet the carbon fiber reinforced phase; second, the brazing joint is actually a composite material composed of carbon (graphite) and Fe, and the carbon (graphite) in it can reduce the thermal expansion coefficient of the brazing joint, thereby reducing the internal temperature of the joint. The thermal stress is beneficial to improve the room temperature performance in the joint preparation process.

(3)本发明所述活性元素包括Fe、Ni、Cr等,均非贵金属或稀有金属,具有价格经济、容易获得的优势。(3) The active elements in the present invention include Fe, Ni, Cr, etc., which are not noble metals or rare metals, and have the advantages of economical price and easy availability.

(4)本发明润湿反应速度快,生产效率高,无需长时间保温。(4) The wetting reaction speed of the present invention is fast, the production efficiency is high, and no long-term heat preservation is required.

(5)本发明在钎焊中无需真空系统,生产条件要求低,成本低。(5) The present invention does not need a vacuum system in brazing, and the requirements for production conditions are low and the cost is low.

(6)本发明无需焊前对碳纤维强化的陶瓷基复合材料表面进行任何改性处理。(6) The present invention does not require any modification treatment on the surface of the carbon fiber reinforced ceramic matrix composite material before welding.

(7)本发明在钎缝高温性能方面改善尤其显著:提高接头的服役温度,例如,即使在700~900℃范围内(Ag-Cu-Ti钎料固相线为780℃;Ni基钎料固相线接近970~1080℃),钎缝也能维持常见奥氏体的强度。(7) The present invention is particularly remarkable in improving the high-temperature performance of the brazing joint: increasing the service temperature of the joint, for example, even in the range of 700 to 900°C (the solidus line of the Ag-Cu-Ti solder is 780°C; the Ni-based solder The solidus line is close to 970~1080℃), and the brazing joint can also maintain the strength of common austenite.

2、本发明的优点2. Advantages of the present invention

(1)与传统Ag基钎料的活性金属钎焊方法相比(1) Compared with the active metal brazing method of traditional Ag-based solder

(a)在界面润湿性与润湿产物方面:利用共晶反应(例如,Fe-Cf),获得液相,迅速实现对碳纤维增强相的润湿;且在碳纤维表面并不生成脆性相。(b)在改善钎缝组织与降低热应力方面:尽管所得为钎缝铸铁类组织,但该铸铁实际可看作石墨与活性元素(例如,Fe)的复合材料,从而可利用钎缝中的石墨相降低钎缝的热膨胀系数,减小热应力。(c) 在接头耐热性方面:因Fe-Cf、Ni-Cf、Cr-Cf共晶反应温度(1154℃以上)比Ag-Cu-Ti钎料固相线(780℃)高出374℃,故接头重熔温度可大幅提高;可以推知,由于钎缝为铸铁型或合金铸铁型组织,即使在700~900℃的高温下(已接近或超过Ag-Cu-Ti钎料的固相线780℃)的钎缝的强度可以达到高温奥氏体的强度。(a) In terms of interfacial wettability and wetting products: use the eutectic reaction (for example, Fe-C f ) to obtain a liquid phase, and quickly realize the wetting of the carbon fiber reinforced phase; and no brittle phase is formed on the surface of the carbon fiber . (b) In terms of improving the brazing seam structure and reducing thermal stress: Although the obtained brazing seam cast iron structure, the cast iron can actually be regarded as a composite material of graphite and active elements (such as Fe), so that the brazing seam can be used The graphite phase reduces the thermal expansion coefficient of the brazing joint and reduces thermal stress. (c) In terms of joint heat resistance: because the eutectic reaction temperature of Fe-C f , Ni-C f , and Cr-C f (above 1154°C) is higher than the solidus line of Ag-Cu-Ti solder (780°C) 374 ℃, so the remelting temperature of the joint can be greatly increased; it can be inferred that since the brazing seam is cast iron or alloy cast iron structure, even at a high temperature of 700-900 ℃ (which is close to or exceeds that of Ag-Cu-Ti solder) The strength of the brazing seam at the solidus line (780°C) can reach the strength of high-temperature austenite.

(2)与传统金属的共晶反应钎焊(如Al/Cu/Al)相比,不需要长时间的等温凝固。(2) Compared with the eutectic reaction brazing of traditional metals (such as Al/Cu/Al), long-term isothermal solidification is not required.

(3)与传统Ni基钎料高温钎焊相比具有三大优势:(a)Fe-Cf、Ni-Cf、Cr-Cf共晶反应温度远高出Ni基钎料的熔点100~150℃,则钎缝的重熔温度与接头的耐热温度均得以提高;(b)钎缝脆性小于传统Ni基钎料(如BNi-2等),不需要长时间等温凝固;(c)钎料成本低(Ni资源有限)。(3) Compared with traditional Ni-based solder high-temperature brazing, it has three advantages: (a) Fe-C f , Ni-C f , Cr-C f eutectic reaction temperature is much higher than the melting point of Ni-based solder by 100 ~150°C, the remelting temperature of the brazing joint and the heat-resistant temperature of the joint can be improved; (b) the brittleness of the brazing joint is less than that of traditional Ni-based solders (such as BNi-2, etc.), and does not require long-term isothermal solidification; (c ) The cost of solder is low (Ni resources are limited).

进一步的,以Fe基或含有足量Fe的合金型钎料作为高温活性钎料,通过活性元素Fe与碳纤维发生共晶反应的方式实现对碳纤维的快速、致密润湿。其优点在于:利用共晶反应实现快速润湿碳纤维,以及近缝区复合材料母材内原有孔隙与钎缝的致密化,避免界面反应形成连续的界面反应相;使钎缝中的溶解进来的碳充分石墨化,可降低热应力;钎焊温度达1154℃以上,可使钎焊接头的服役温度提高;无需长时间保温,及焊前对复合材料表面进行改性处理;不含或含少量贵金属。本发明解决了传统Ag基活性钎料、Ni 基钎料在用于钎焊陶瓷基复合材料时分别存在的接头耐热温度低、保温时间长的问题。Further, Fe-based or alloy-type solder containing sufficient Fe is used as the high-temperature active solder to achieve rapid and dense wetting of the carbon fiber through the eutectic reaction between the active element Fe and the carbon fiber. Its advantages are: the use of eutectic reaction to achieve rapid wetting of carbon fibers, and the densification of the original pores in the base metal of the composite material near the seam and the densification of the brazing seam, avoiding the formation of a continuous interface reaction phase from the interface reaction; The carbon is fully graphitized, which can reduce thermal stress; the brazing temperature is above 1154°C, which can increase the service temperature of the brazed joint; there is no need for long-term heat preservation, and the surface of the composite material should be modified before welding; it does not contain or contain a small amount precious metals. The invention solves the problems of low joint heat-resistant temperature and long heat preservation time respectively existing when the traditional Ag-based active solder and Ni-based solder are used for brazing ceramic matrix composite materials.

附图说明Description of drawings

图1为(Cf/C)/纯Fe/(Cf/C)钎焊接头整体与不同选定区域组织(焊接规范:1250℃×5min) 背散射BSE照片,其中,图1(a)为钎焊接头整体低倍组织均匀性及挤出液态钎料珠:表明纯Fe与C均被顺利被溶解;图1(b)为图1(a)中b处钎缝放大2000倍的显微组织:由粗大的一次石墨相、残余奥氏体、二次石墨相组成;图1(c)为图1(a)中c处钎缝区域扩散区放大500倍的显微组织:致密钎缝及其内部粗大一次石墨棒;图1(d)为图1(c)中界面及扩散区高倍放大照片(3000倍):界面致密,润湿良好,Fe更易在碳基体中扩散,扩散深度达到~25μm;图1(e)为图1(d)中界面超高倍(10000倍)放大照片:界面仍然致密,未观察到空洞与裂纹;图1(f)为图1(a)中f处挤出液态珠凝固组织:由一次球状石墨、二次短条状石墨与残余奥氏体组成。Figure 1 is the backscattered BSE photo of the (C f /C)/pure Fe/(C f /C) brazed joint as a whole and different selected regions (welding specification: 1250℃×5min), among which, Figure 1(a) It shows the overall low magnification structure uniformity of the brazed joint and extruded liquid solder beads: it shows that both pure Fe and C are dissolved smoothly; Fig. 1(b) is a magnified 2000 times of the brazing seam at b in Fig. 1(a) Microstructure: Composed of coarse primary graphite phase, retained austenite, and secondary graphite phase; Figure 1(c) is a 500-fold magnified microstructure of the diffusion zone in the brazing seam area at c in Figure 1(a): dense brazing slit and its internal thick primary graphite rod; Figure 1(d) is a high-magnification photo (3000 times) of the interface and diffusion area in Figure 1(c): the interface is dense and wetted well, Fe is easier to diffuse in the carbon matrix, and the diffusion depth Reach ~ 25μm; Figure 1(e) is a super high magnification (10000 times) magnified photo of the interface in Figure 1(d): the interface is still dense, no voids and cracks are observed; Figure 1(f) is the f in Figure 1(a) Solidification structure of extruded liquid beads: composed of primary spherical graphite, secondary short strip graphite and retained austenite.

图2为(Cf/C)/4J36/(Cf/C)钎焊接头整体与不同选定区域组织(1250℃×5min)BSE照片,其中,图2(a)为钎焊接头整体低倍组织均匀性及挤出液态钎料珠:表明4J36(低膨胀合金) 与C均被顺利被溶解;图2(b)为图2(a)中b处放大图:钎料熔化(但因Fe含量低而无一次石墨),C基体与钎料界面润湿致密;图2(c)为图2(a)中c处放大图:钎料熔化(但因 Fe含量低而无一次石墨),C纤维与钎料界面润湿致密;图2(d)为图2(a)中d处放大图:钎料熔化(但因Fe含量低而无一次石墨),C纤维与钎料界面致密;图2(e)为图2(d)中e 处放大图:即使放大15000倍,C纤维与钎料界面仍致密。Fig. 2 is the BSE photo of (C f /C)/4J36/(C f /C) brazing joint as a whole and different selected regions (1250℃×5min). Double structure uniformity and extruded liquid solder beads: It shows that 4J36 (low expansion alloy) and C are dissolved smoothly; Figure 2(b) is an enlarged view of b in Figure 2(a): solder melting (but due to Fe content is low and there is no primary graphite), C matrix and solder interface are wet and dense; Figure 2(c) is an enlarged view of point c in Figure 2(a): the solder melts (but there is no primary graphite due to low Fe content) , the interface between C fiber and solder is wet and dense; Figure 2(d) is an enlarged view of point d in Figure 2(a): the solder melts (but there is no primary graphite due to low Fe content), and the interface between C fiber and solder is dense ; Fig. 2(e) is an enlarged view of e in Fig. 2(d): even at 15,000 times magnification, the interface between C fiber and solder is still dense.

图3为(Cf/C)/630SS/(Cf/C)钎焊接头整体与不同选定区域组织(1250℃×5min)BSE照片,其中,图3(a)为钎焊接头整体低倍组织均匀性及挤出液态钎料珠:纯Fe与C均被顺利溶解;挤出的料珠与C/C母材接触角呈锐角,表明液相对碳基体润湿性也良好;图3(b) 为图3(a)中b处(挤出的钎料珠)的显微组织:大量碳的出现表明碳共晶反应发生,碳未能以石墨相析出而是以Fe-Cr-C三元化合物(Fe,Cr)7C3形式存在;图3(c)为图3(a)中c处钎缝的显微组织:碳基体/钎料界面致密,钎缝为三元碳化物;图3(d)为图3(a)中d处钎缝的显微组织:纤维/钎料界面致密,钎缝为三元碳化物;图3(e)为图3(d)中e处纤维/钎料界面放大图:10000倍下纤维/钎料界面致密。Fig. 3 is the BSE photo of (C f /C)/630SS/(C f /C) brazing joint overall and different selected regions (1250℃×5min), in which, Fig. 3(a) is the brazing joint overall low Double structure uniformity and extruded liquid solder beads: pure Fe and C were dissolved smoothly; the contact angle between the extruded beads and the C/C base material was an acute angle, indicating that the wettability of the liquid to the carbon matrix was also good; Figure 3 (b) is the microstructure at b (extruded solder beads) in Figure 3(a): the appearance of a large amount of carbon indicates that the carbon eutectic reaction occurs, and the carbon fails to precipitate in the graphite phase but in the form of Fe-Cr- C ternary compound (Fe, Cr) 7 C 3 exists in the form; Figure 3(c) is the microstructure of the brazing joint at point c in Figure 3(a): the carbon matrix/brazing material interface is dense, and the brazing joint is ternary carbonization Figure 3(d) is the microstructure of the brazing seam at d in Fig. 3(a): the fiber/solder interface is dense, and the brazing seam is ternary carbide; Fig. 3(e) is the microstructure in Fig. 3(d) Enlarged picture of the fiber/solder interface at e: the fiber/solder interface is dense at 10,000 times.

图4为(Cf/C)/630SS/(Cf/C)钎焊接头(1250℃×5min)压剪测试位移—载荷曲线。Fig. 4 is the displacement-load curve of (C f /C)/630SS/(C f /C) brazed joint (1250℃×5min) compression shear test.

具体实施方式Detailed ways

下面结合附图和实施例对本发明做进一步详细说明。The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

针对传统含Ti的银基与铜基活性钎料用于钎焊Cf/C及Cf/SiC等陶瓷基复合材料时存在的接头耐热温度低问题,以及Ni基商用钎料用于钎焊Cf/C及Cf/SiC等陶瓷基复合材料时存在的脆性大而需长时间保温的问题,本发明在碳纤维(Cf)强化的陶瓷基复合材料(CMC)的钎焊中,提出通过弱碳化物形成元素Fe、非碳化物形成元素Ni或中等强度碳化物形成元素Cr与碳纤维的共晶反应,在较高温度(1154℃之上)快速实现对碳纤维强化陶瓷基复合材料中碳纤维的润湿(对Cf/C陶瓷基复合材料同时可润湿C基体)。Aiming at the problem of low joint heat resistance temperature when traditional Ti-containing silver-based and copper-based active solders are used for brazing C f /C and C f /SiC and other ceramic matrix composite materials, and Ni-based commercial solders are used for brazing The brittleness of existing ceramic matrix composites such as welding C f /C and C f /SiC is big and needs the problem of keeping warm for a long time, the present invention is in the brazing of the ceramic matrix composite (CMC) that carbon fiber (C f ) reinforces, It is proposed that through the eutectic reaction of weak carbide-forming element Fe, non-carbide-forming element Ni, or medium-strength carbide-forming element Cr with carbon fibers, carbon fiber-reinforced ceramic matrix composites can be quickly realized at higher temperatures (above 1154°C). Wetting of carbon fibers (for C f/ C ceramic matrix composites, C matrix can be wetted at the same time).

本发明提出的“针对碳纤维的活性元素”应满足如下要求:一是能与碳纤维发生共晶反应;二是在发生共晶反应时,对碳有较高的溶解度,有利于获得洁净的碳界面并润湿之;三是共晶反应发生温度应低于其高熔点稳定碳化物形成温度,即在反应形成高熔点稳定碳化物之前,能先以共晶反应的方式与碳纤维发生反应获得液相并润湿碳纤维。否则,高熔点稳定碳化物将覆盖在碳纤维表面成为阻挡层,无法使碳纤维与共晶元素接触而发生共晶反应,从而无法实现润湿。The "active element for carbon fiber" proposed by the present invention should meet the following requirements: first, it can undergo eutectic reaction with carbon fiber; second, when eutectic reaction occurs, it has a higher solubility for carbon, which is conducive to obtaining a clean carbon interface and wet it; the third is that the eutectic reaction temperature should be lower than its high melting point stable carbide formation temperature, that is, before the reaction forms a high melting point stable carbide, it can first react with the carbon fiber in a eutectic reaction to obtain a liquid phase and wet the carbon fibers. Otherwise, the high-melting-point stable carbide will cover the surface of the carbon fiber and become a barrier layer, which prevents the carbon fiber from contacting with the eutectic element and causing a eutectic reaction, so that wetting cannot be achieved.

碳(C)虽然自身熔点极高(3827℃),但碳作为间隙原子能与多种元素发生共晶反应,形成共晶液相,故有可能利用共晶反应在相对于碳的熔点较低的温度下使Cf溶解,从而润湿Cf。能与C发生共晶反应的常见元素汇总于表1。其中,能同时胜任上述三项要求的元素并不多,主要为弱碳化物形成元素Fe、非碳化物形成元素Ni与中等强度碳化物形成元素Cri。而常见的强碳化物形成元素Ti、Si虽然从相图上看能与C发生共晶反应,但其共晶液相对C的溶解度极低,Ti-C共晶液相对C的溶解度只有1.8C%;特别是Si-C共晶液相对C的溶解度接近0。因此,Ti、Si是被排除在外的,不能利用其与C的共晶反应来润湿C纤维。事实上,Milena Salvo等在采用Si作中间层时,即使焊接温度(1420℃) 已略微超过了Si的熔点(1414℃),但焊缝中心仍为Si,C/C复合材料母材并未溶解进去。这一结果也证明了不能利用Si-Cf共晶反应达到润湿目的。Although carbon (C) itself has a very high melting point (3827°C), carbon, as an interstitial atom, can undergo eutectic reactions with various elements to form a eutectic liquid phase, so it is possible to use eutectic reactions in places with a lower melting point than carbon. The temperature dissolves C f and thus wets C f . The common elements that can undergo eutectic reaction with C are summarized in Table 1. Among them, there are not many elements that can meet the above three requirements at the same time, mainly weak carbide-forming element Fe, non-carbide-forming element Ni and medium-strength carbide-forming element Cri. Although the common strong carbide forming elements Ti and Si can undergo eutectic reaction with C from the phase diagram, the solubility of the eutectic liquid relative to C is extremely low, and the solubility of Ti-C eutectic liquid relative to C is only 1.8C %; especially the solubility of Si-C eutectic liquid relative to C is close to 0. Therefore, Ti and Si are excluded, and their eutectic reaction with C cannot be used to wet C fibers. In fact, when Milena Salvo et al. used Si as the intermediate layer, even though the welding temperature (1420°C) had slightly exceeded the melting point of Si (1414°C), the center of the weld was still Si, and the base material of the C/C composite material did not dissolve in. This result also proves that the Si- Cf eutectic reaction cannot be used for the purpose of wetting.

参见表1,在1300℃以下(比传统Ni基钎料高温钎焊温度略高),常见合金元素中只有Fe与C能发生共晶反应,从而快速润湿C。其他元素在1300℃由于不能与C发生共晶反应,则这些元素作中间层时,因不能与C发生共晶反应,只能通过固态扩散反应在高熔点的C的表层形成固态化合物,以此形成与C的接合,而通过固态扩散反应形成固态化合物则需要较长的保温时间,降低了生产效率,而且形成的化合物反应层在界面上呈层状连续分布,难以进入钎缝中并在钎缝中呈分散、无序、均匀分布,这种仅存在于界面的连续层状反应产物不利于降低热应力的危害。See Table 1. Below 1300°C (slightly higher than the high-temperature brazing temperature of traditional Ni-based solder), among the common alloying elements, only Fe and C can undergo eutectic reaction, thereby rapidly wetting C. Since other elements cannot undergo eutectic reaction with C at 1300°C, when these elements are used as the intermediate layer, because they cannot undergo eutectic reaction with C, they can only form solid compounds on the surface of C with a high melting point through solid-state diffusion reaction. Forming a bond with C, and forming a solid compound through a solid-state diffusion reaction requires a long holding time, which reduces production efficiency, and the formed compound reaction layer is continuously distributed in layers on the interface, and it is difficult to enter the brazing seam. The cracks are dispersed, disordered, and uniformly distributed. This continuous layered reaction product that only exists at the interface is not conducive to reducing the harm of thermal stress.

当要求服役温度逐渐提高,候选的共晶活性元素可依次选Ni、Cr、V、Nb,这是由于所得共晶钎缝的重熔温度依次为1327℃、1543℃、1690℃、2340℃。When the service temperature is required to gradually increase, the candidate eutectic active elements can be selected in sequence Ni, Cr, V, and Nb. This is because the remelting temperatures of the obtained eutectic solder joints are 1327°C, 1543°C, 1690°C, and 2340°C in sequence.

表1.碳与主要合金元素共晶点成分及共晶反应温度Table 1. Eutectic point composition and eutectic reaction temperature of carbon and main alloying elements

本发明提出的快速润湿陶瓷基复合材料中碳纤维的思路为:采用低成本的“以Fe为活性元素的高温活性钎料”,并以Fe-Cf共晶反应的方式进行高温钎焊,以此达到快速润湿碳纤维的目的。在这种高温活性钎焊方法中,活性元素并非经典的Ti元素,而是低成本的Fe元素,即其钎料成分设计特征在于设计、制备以Fe为活性元素的高温活性钎料。循此思路,可开发出系列面向碳纤维增强的陶瓷基复合材料的低成本、实用高温活性钎料。这一思路的优点体现在以下几个方面:(1)利用共晶反应实现快速润湿与致密化(含界面与钎缝的致密化),避免界面反应形成连续的反应相(传统活性金属钎焊方法中界面产物按固相扩散反应速率依附于C表面生长,且不能进入到液态钎缝中而被分散,不利于降低热应力的危害);(2)钎焊温度较高(Fe-C共晶温度1154℃远高于Ag-Cu共晶温度 780℃),可使服役温度随之提高;(3)使钎缝中的溶解进来的碳充分石墨化,可降低钎缝的热膨胀系数,从而有利于降低热应力;(3)钎缝脆性程度小于传统Ni基钎料,无需长时间保温;(4)无需焊前对陶瓷基复合材料表面进行任何改性处理;(5)不含或仅含少量贵金属;(6)利用钎缝内充裕的共晶液相可填充位于近缝区的陶瓷基复合材料母材内原有孔隙(指陶瓷基复合材料制备工艺中残留的孔隙),改善近缝区母材的致密性,强化近缝区母材。The idea of quickly wetting the carbon fiber in the ceramic matrix composite material proposed by the present invention is: adopt low-cost "high-temperature active solder with Fe as the active element", and perform high-temperature brazing in the form of Fe- Cf eutectic reaction, In this way, the purpose of quickly wetting the carbon fiber can be achieved. In this high-temperature active brazing method, the active element is not the classic Ti element, but a low-cost Fe element, that is, the design feature of the solder composition is to design and prepare a high-temperature active solder with Fe as the active element. Following this idea, a series of low-cost, practical high-temperature active solders for carbon fiber-reinforced ceramic matrix composites can be developed. The advantages of this idea are reflected in the following aspects: (1) Use the eutectic reaction to achieve rapid wetting and densification (including the densification of the interface and the brazing seam), avoiding the formation of a continuous reaction phase from the interface reaction (traditional active metal brazing In the welding method, the interface product grows on the C surface according to the solid phase diffusion reaction rate, and cannot enter the liquid brazing seam and be dispersed, which is not conducive to reducing the harm of thermal stress); (2) the brazing temperature is relatively high (Fe-C The eutectic temperature of 1154°C is much higher than the Ag-Cu eutectic temperature of 780°C), which can increase the service temperature; (3) fully graphitize the dissolved carbon in the brazing seam, which can reduce the thermal expansion coefficient of the brazing seam, Thereby it is beneficial to reduce the thermal stress; (3) the degree of brittleness of the solder joint is less than that of the traditional Ni-based solder, and there is no need for long-term heat preservation; (4) there is no need to modify the surface of the ceramic matrix composite material before welding; (5) it does not contain or Contains only a small amount of precious metals; (6) Using the abundant eutectic liquid phase in the brazing seam can fill the original pores in the base material of the ceramic matrix composite material located in the near seam area (referring to the remaining pores in the preparation process of the ceramic matrix composite material), improving the near-slit area. The compactness of the base material in the fracture area strengthens the base material near the fracture area.

(一)以Fe为活性元素的高温活性钎料(1) High temperature active solder with Fe as active element

以下分别采用纯Fe及Fe基合金进行钎焊试验,揭示本发明提出的“以Fe为活性元素的高温活性钎料快速润湿Cf/C复合材料的方法”的特点。The brazing tests of pure Fe and Fe-based alloys are respectively carried out below to reveal the characteristics of the "method for rapid wetting of C f /C composite materials by high-temperature active solder with Fe as the active element" proposed by the present invention.

(1)纯Fe中间层(1) Pure Fe middle layer

为验证本发明提出的“针对碳纤维的以Fe为活性元素的快速反应润湿”技术路线的正确性,首先用纯Fe片进行快速共晶反应润湿实验。In order to verify the correctness of the technical route of "rapid reaction wetting with Fe as the active element for carbon fibers" proposed by the present invention, a rapid eutectic reaction wetting experiment was first performed with pure Fe flakes.

实际施焊方法为:选用市售(Cf/C)/(Cf/C)复合材料组合为母材,选用市售纯Fe 片作为钎料(厚度:0.3mm);砂纸打磨、超声清洗母材待焊面与纯Fe钎料片表面后,预置纯Fe片于(Cf/C)/(Cf/C)复合材料之间的焊接界面;适当加压(0.5MPa);通入Ar 气保护;加热至1250℃后短时保温(5min)。界面润湿性及显微组织如图1所示。The actual welding method is: select the commercially available (C f /C)/(C f /C) composite material combination as the base material, select the commercially available pure Fe sheet as the solder (thickness: 0.3mm); sandpaper grinding, ultrasonic cleaning After the surface of the base metal to be welded and the surface of the pure Fe solder sheet, pre-set the pure Fe sheet at the welding interface between the (C f /C)/(C f /C) composite material; apply appropriate pressure (0.5MPa); Enter Ar gas protection; heat to 1250°C and keep warm for a short time (5min). The interface wettability and microstructure are shown in Fig. 1.

施焊温度为1250℃,高于Fe-C共晶反应温度(1154℃)与渗碳体熔点(1227℃),但远低于纯Fe钎料熔点(1538℃)和C母材熔点(3827℃)。在此温度下边缘有液相挤出(见图1(a)),表明所期待的Fe-C共晶反应可以顺利实现;而且钎缝的背散射照片夹杂有白色(Fe的原子序号为26,远高于C的原子序号6,故Fe呈白色)表明液态Fe未被完全挤出,有利于保证润湿性与致密性;即使高倍下观察(图1(c)为500×,图1(b)为2000×,图1(d)为3000×,图1(e)为×10000),界面仍致密无缺陷,钎焊接头润湿良好,钎缝也致密无缺陷(见图1(c))。The welding temperature is 1250°C, which is higher than the Fe-C eutectic reaction temperature (1154°C) and cementite melting point (1227°C), but far lower than the pure Fe solder melting point (1538°C) and C base metal melting point (3827°C). ℃). At this temperature, there is liquid phase extrusion at the edge (see Figure 1(a)), indicating that the expected Fe-C eutectic reaction can be successfully realized; and the backscattered photo of the brazing seam is mixed with white (the atomic number of Fe is 26 , much higher than the atomic number 6 of C, so Fe is white) indicating that liquid Fe has not been completely extruded, which is beneficial to ensure wettability and compactness; even under high magnification (Fig. 1(c) is 500×, (b) is 2000×, Figure 1(d) is 3000×, Figure 1(e) is ×10000), the interface is still dense and without defects, the brazed joint is well wetted, and the brazing seam is also dense and defect-free (see Figure 1( c)).

能谱点分析(见图1(b)与图1(f))表明钎缝只有Fe、C两种元素,充分证明了Fe-C共晶反应的顺利发生,并且紧密润湿性优良、钎缝致密。焊后钎缝由纯Fe转变为Fe-20C(at.%),挤出的钎料珠成分由纯Fe转变为Fe-36C(at.%)且钎缝/母材界面基本平直,说明碳纤维与碳基体都被均匀溶解,均参与了Fe-C共晶反应;反应后过量溶解的C的存在形式为:或呈各种形态(粗大杆状、球状、蠕虫状)的石墨而结晶出来,或固溶于残余奥氏体中中。Energy spectrum point analysis (see Figure 1(b) and Figure 1(f)) shows that there are only two elements, Fe and C, in the brazing joint, which fully proves that the Fe-C eutectic reaction occurs smoothly, and the tight wettability is excellent, and the brazing The seams are dense. After welding, the brazing seam changes from pure Fe to Fe-20C (at.%), the composition of the extruded solder beads changes from pure Fe to Fe-36C (at.%) and the brazing seam/base metal interface is basically straight, indicating that Both the carbon fiber and the carbon matrix are uniformly dissolved, and both participate in the Fe-C eutectic reaction; after the reaction, the excess dissolved C exists in the form of: or crystallized from graphite in various forms (coarse rod-shaped, spherical, worm-shaped) , or solid solution in the retained austenite.

虽然钎缝厚度高达50μm(因原始Fe片过厚导致)但已无单质Fe存在;钎缝组织由直接跨接两侧Cf/C母材的一次粗长杆状石墨(10×50μm;应是由过共晶液相中直接结晶出来的一次石墨相)、蠕虫状石墨(平均尺寸10μm)、碳含量高达20at.%的残余奥氏体组成(背散射显示白色的钎缝基体成分分布均匀,可见此高碳奥氏体非常稳定而尚未分解)。钎缝两侧有泛白(含Fe之故)的扩散层,由图1(d)可知,主要是Fe扩散入疏松C基体(并非致密的碳纤维)形成的,每侧厚约25μm。由于钎缝中一次粗大石墨相明显,因此推测钎缝中的白色基体相应是由过共晶液相凝固后的共晶高碳奥氏体直接冷却所得,即使高达 10000倍的背散射照片中(图1(e))也未观察到碳的析出迹象,可能是由于极高的含碳量增大了该高碳奥氏体的稳定性,抑制了其冷却过程中发生相变与分解,故此基体相应为残余奥氏体。挤出的液态珠组织有一次球状石墨(平均尺寸d=10μm)、片状石墨(average size:5μm)残留于钎料珠中,但并未形成介于球墨铸铁和蠕墨铸铁间的组织,而基体依然是高碳的残余奥氏体。Although the thickness of the brazing joint is as high as 50 μm (caused by the excessive thickness of the original Fe sheet), there is no elemental Fe; It is composed of the primary graphite phase directly crystallized from the hypereutectic liquid phase), vermicular graphite (average size 10 μm), and retained austenite with a carbon content of up to 20 at.% (back scattering shows that the white brazing seam matrix components are evenly distributed , it can be seen that this high-carbon austenite is very stable and has not yet decomposed). On both sides of the brazing seam, there is a white (because of Fe) diffusion layer. It can be seen from Figure 1(d) that it is mainly formed by the diffusion of Fe into the loose C matrix (not dense carbon fiber), with a thickness of about 25 μm on each side. Since the primary coarse graphite phase in the brazing seam is obvious, it is speculated that the white matrix in the brazing seam is obtained by direct cooling of the eutectic high-carbon austenite after the hypereutectic liquid phase solidifies, even in the backscattered photos up to 10000 times ( Figure 1(e)) also did not observe signs of carbon precipitation, probably because the extremely high carbon content increased the stability of the high-carbon austenite and inhibited its phase transformation and decomposition during cooling, so The matrix is correspondingly retained austenite. The extruded liquid beads have primary spherical graphite (average size d=10μm) and flake graphite (average size: 5μm) remaining in the solder beads, but no structure between nodular cast iron and vermicular graphite cast iron has been formed. The matrix is still high carbon retained austenite.

上述显微组织观察表明,Cf/C复合材料与钎缝界面均致密无空洞、无显微裂纹,证实了Fe可以作为活性元素与碳纤维、碳基体反应并润湿碳纤维与碳基体,完全有能力获得优异的界面润湿效果。而且,Fe在碳基体中的扩散更易进行,深度可达25μm。但因纯 Fe较厚,引发碳被溶解的量过大,导致钎缝组织中出现粗大(甚至横跨整个焊缝厚度) 的一次石墨;此外,大量的碳溶解于Fe中,使钎缝基体变脆。由此导致接头虽然润湿性理想,但因钎缝脆性大而接头性能很低(5MPa以下)。The observation of the microstructure above shows that the interface between the C f /C composite material and the brazing joint is dense without voids and microcracks, which confirms that Fe can act as an active element to react with carbon fiber and carbon matrix and wet the carbon fiber and carbon matrix. Ability to obtain excellent interfacial wetting effect. Moreover, the diffusion of Fe in the carbon matrix is easier, and the depth can reach 25 μm. However, due to the thicker pure Fe, the amount of carbon dissolved is too large, resulting in coarse (even across the entire weld thickness) primary graphite in the brazing seam structure; in addition, a large amount of carbon dissolves in Fe, making the brazing seam matrix become brittle. As a result, although the wettability of the joint is ideal, the performance of the joint is very low (below 5MPa) due to the high brittleness of the brazing seam.

(2)4J36(Fe-36Ni)因瓦合金中间层:(2) 4J36 (Fe-36Ni) Invar alloy middle layer:

为同时降低碳的溶解量与热膨胀系数失配引起的热应力,采用Fe含量低、热膨胀系数极低的低膨胀合金4J36(Fe-36Ni-0.2C,Invar alloy)作中间层。4J36熔点约1430℃。In order to simultaneously reduce the thermal stress caused by the mismatch between the dissolved amount of carbon and the thermal expansion coefficient, the low-expansion alloy 4J36 (Fe-36Ni-0.2C, Invar alloy) with low Fe content and extremely low thermal expansion coefficient is used as the intermediate layer. The melting point of 4J36 is about 1430°C.

实际施焊方法为:砂纸打磨、超声清洗(Cf/C)/(Cf/C)复合材料焊接面及4J36钎料片(厚度:0.3mm)后,预置4J36片于(Cf/C)/(Cf/C)复合材料之间的焊接界面;适当加压(0.5MPa);通入Ar气保护;加热至1250℃后短时保温(5min)。界面润湿性及显微组织如图2所示。The actual welding method is: after sandpaper grinding, ultrasonic cleaning (C f /C)/(C f /C) composite material welding surface and 4J36 solder sheet (thickness: 0.3mm), preset 4J36 sheet in (C f / C)/(C f /C) Welding interface between composite materials; Appropriate pressure (0.5MPa); Ar gas protection; Heating to 1250°C and holding it for a short time (5min). The interface wettability and microstructure are shown in Fig. 2.

图2(a)中被挤出的液态钎料的出现证明Fe-C共晶反应得以顺利实现,但挤出的钎料珠与Cf/C母材表面的接触角约为90度;另一方面,液相并未被完全挤出钎缝。高倍观察表明,以4J36作为钎料的钎焊接头润湿良好,无石墨析出。Cf/C复合材料钎焊接头界面可分类为:C基体/钎料界面(如图2(b))和Cf/钎料界面(如图2(c)),这两类界面均润湿良好。将Cf/钎料放大至15000倍时(如图2(d)、图2(e)),可发现Cf/钎料界面仍结合致密。综合挤出的钎料珠、致密的界面与钎缝、以及EDS数据可知,润湿只能靠Fe-C共晶反应,但 4J36对C的溶解量比纯Fe少(比纯Fe的溶解能力弱),故未在钎缝中析出石墨,钎缝为无Cr、稳定性高Fe-Ni-C三元残余奥氏体与化合物。虽然界面致密、但溶解的碳未能析出将导致钎缝的脆化,加之接触角略大,接头强度仍较低(不足5MPa)。The appearance of the extruded liquid solder in Figure 2(a) proves that the Fe-C eutectic reaction has been successfully realized, but the contact angle between the extruded solder beads and the surface of the C f /C base metal is about 90 degrees; On the one hand, the liquid phase is not completely squeezed out of the solder joint. The high-magnification observation shows that the brazed joint with 4J36 as the solder has good wetting and no graphite precipitation. The interfaces of C f /C composite brazed joints can be classified into: C matrix/solder interface (as shown in Figure 2(b)) and C f /solder interface (as shown in Figure 2(c)). Wet well. When C f / solder is magnified to 15000 times (as shown in Figure 2(d) and Figure 2(e)), it can be found that the C f / solder interface is still tightly bonded. Comprehensively extruded solder beads, dense interface and brazing seam, and EDS data show that wetting can only rely on Fe-C eutectic reaction, but the amount of 4J36 to dissolve C is less than that of pure Fe (than the solubility of pure Fe Weak), so graphite is not precipitated in the brazing seam, and the brazing seam is Cr-free and highly stable Fe-Ni-C ternary retained austenite and compounds. Although the interface is dense, the failure of dissolved carbon to precipitate will lead to the embrittlement of the brazing joint. In addition, the contact angle is slightly larger, and the joint strength is still low (less than 5MPa).

(3)630不锈钢中间层(630SS)(3) 630 stainless steel middle layer (630SS)

该中间层为沉淀硬化型马氏体不锈钢,其热膨胀系数(10×10-6/℃)比常见奥氏体不锈钢的热膨胀系数(17×10-6/℃)小,有利于抑制热应力;其成分为0Cr17Ni4Cu4Nb,其 Fe含量75%(高于低膨胀合金4J36,低于纯Fe),且另含有其他碳化物形成元素(如Cr 与Nb);熔点约1450℃。The middle layer is precipitation hardening martensitic stainless steel, whose thermal expansion coefficient (10×10 -6 /℃) is smaller than that of common austenitic stainless steel (17×10 -6 /℃), which is beneficial to suppress thermal stress; Its composition is 0Cr17Ni4Cu4Nb, its Fe content is 75% (higher than low expansion alloy 4J36, lower than pure Fe), and it also contains other carbide forming elements (such as Cr and Nb); melting point is about 1450 ° C.

实际施焊方法为:砂纸打磨、超声清洗(Cf/C)/(Cf/C)复合材料焊接面及630SS钎料片(厚度:0.3mm)后,预置630SS片于(Cf/C)/(Cf/C)复合材料之间的焊接界面;适当加压(0.5MPa);通入Ar气保护;加热至1250℃后短时保温(5min)。界面润湿性及显微组织如图3所示。The actual welding method is: after sandpaper grinding, ultrasonic cleaning (C f /C)/(C f /C) composite material welding surface and 630SS solder sheet (thickness: 0.3mm), preset 630SS sheet on (C f / C)/(C f /C) Welding interface between composite materials; Appropriate pressure (0.5MPa); Ar gas protection; Heating to 1250°C and holding it for a short time (5min). The interface wettability and microstructure are shown in Fig. 3.

图3(a)中同样也观察到挤出的液相珠,表明共晶反应顺利实现;挤出的液相珠边缘与Cf/C复合材料母材表面的接触角呈锐角,预示润湿性得到一定改善。钎缝中液态金属未被完全挤出,界面致密无裂纹产生,但中心区域有两条贯穿钎缝的长条状石墨相析出,应是过共晶液相中直接结晶出来的一次石墨相。由图3(b)可知,挤出的液相中含有大量的C与Cr,其中Cr的出现有利于进一步改善对Cf/C界面的润湿性。由图3(c)~(e)可知,Cf/钎料界面即使放大(10000×)仍致密。由图3(b)与图3(c)中的能谱分析数据可知,钎料珠与钎缝中C含量均大幅升高,可知630SS润湿(Cf/C)复合材料主要依靠Fe-C共晶反应,兼以Cr元素进一步强化润湿后的结合。虽然所测到的碳含量较大,但在绝大多数区域钎缝中并无单质石墨析出,说明Cr有抑制碳以单质石墨析出的趋势。The extruded liquid phase beads are also observed in Fig. 3(a), indicating that the eutectic reaction is successfully realized; the contact angle between the edge of the extruded liquid phase beads and the surface of the Cf /C composite parent material is acute, indicating that wetting Sex has been improved to a certain extent. The liquid metal in the brazing seam is not completely squeezed out, and the interface is dense without cracks, but there are two long strips of graphite phases in the central area that penetrate the brazing seam, which should be the primary graphite phase directly crystallized from the hypereutectic liquid phase. It can be seen from Figure 3(b) that the extruded liquid phase contains a large amount of C and Cr, and the appearance of Cr is beneficial to further improve the wettability of the C f /C interface. From Figure 3(c)~(e), it can be seen that the C f / solder interface is still dense even if it is enlarged (10000×). From the energy spectrum analysis data in Figure 3(b) and Figure 3(c), it can be seen that the content of C in the solder bead and the brazing seam increased significantly, and it can be seen that the wetting (C f /C) composite of 630SS mainly depends on Fe- C eutectic reaction, combined with Cr element to further strengthen the combination after wetting. Although the measured carbon content is relatively large, there is no elemental graphite precipitation in the brazing joints in most areas, indicating that Cr has a tendency to inhibit the precipitation of carbon as elemental graphite.

接头强度:根据断裂载荷(见图4)与钎焊接头截面积(7.5×7.5mm),可求得 (Cf/C)/630SS/(Cf/C)钎焊接头(1250℃×5min)抗剪强度可达18.4MPa。三个平行试样的剪切强度分别为18.1MPa、17.2MPa、18.4MPa,表明本发明的钎焊结果分散性小,重复性良好。该剪切强度接近意大利的Milena Salvo(参考文献[6])报道采用Si片(silicon sheet)、在1420℃×90min与流动Ar保护的条件下(已超过Si的熔点1414℃),通过反应生成20μm 厚SiC,获得剪切强度为22MPa的接头,已接近Cf/C的层间剪切强度(interlaminar shear strength)20~25MPa。但本发明具有保温时间短的明显优势(5min<<90min)。Joint strength: According to the fracture load (see Figure 4) and the cross-sectional area of the brazed joint (7.5×7.5mm), the (C f /C)/630SS/(C f /C) brazed joint (1250°C×5min) can be obtained ) The shear strength can reach 18.4MPa. The shear strengths of the three parallel samples are 18.1MPa, 17.2MPa, and 18.4MPa respectively, indicating that the brazing results of the present invention have little dispersion and good repeatability. The shear strength is close to that of Italy's Milena Salvo (reference [6]) reported that using a silicon sheet (silicon sheet), under the conditions of 1420 ° C × 90 min and flowing Ar protection (it has exceeded the melting point of Si 1414 ° C), through the reaction to generate With 20μm thick SiC, a joint with a shear strength of 22MPa is obtained, which is close to the interlaminar shear strength (interlaminar shear strength) of C f /C of 20-25MPa. But the present invention has the obvious advantage of short holding time (5min<<90min).

在碳纤维增强陶瓷基复合材料(如Cf/C)高温钎焊中,从生产与应用角度看,本发明相对于广为应用的Ag-Cu-Ti钎料的优点有:(1)克服了经典Ag-Cu-Ti活性钎料存在的钎料成本高(含有较多的Ag,约72%);(2)本发明以价廉的Fe等为活性元素,焊接温度在Fe-C共晶反应温度(1154℃)之上,利用共晶反应大幅提高生产效率,可谓又快又好;尤其是即使在700~900℃范围内,钎缝也能维持常见奥氏体的强度;而Ag基活性钎料熔点偏低,导致服役温度偏低(一般在600℃以下)的问题。In the high-temperature brazing of carbon fiber reinforced ceramic matrix composites (such as C f /C), from the perspective of production and application, the present invention has the advantages relative to the widely used Ag-Cu-Ti solder: (1) overcomes The brazing filler metal cost that classic Ag-Cu-Ti active brazing filler metal exists is high (contains more Ag, about 72%); (2) the present invention is active element with cheap Fe etc., and welding temperature is at Fe-C eutectic Above the reaction temperature (1154°C), the eutectic reaction can be used to greatly improve the production efficiency, which can be described as fast and good; especially in the range of 700-900°C, the brazing joint can maintain the strength of common austenite; and the Ag-based The low melting point of active solder leads to low service temperature (generally below 600°C).

(二)以Ni为活性元素的高温活性钎料(2) High temperature active solder with Ni as active element

本发明提出采用低成本含Ni高温活性钎料,通过Ni-C共晶反应快速润湿碳纤维强化陶瓷基复合材料中的碳纤维方法。在这种方法中,活性元素并非经典的Ti元素,而是Ni元素,即其钎料成分设计特征在于设计、制备以Ni为活性元素的高温活性钎料,例如, Ni基活性钎料。The invention proposes a low-cost Ni-containing high-temperature active solder to quickly wet the carbon fiber in the carbon fiber-reinforced ceramic matrix composite material through Ni-C eutectic reaction. In this method, the active element is not the classic Ti element, but Ni element, that is, the design feature of its solder composition is to design and prepare a high-temperature active solder with Ni as the active element, for example, Ni-based active solder.

所述Ni基活性钎料不同于传统Ni基钎料(如BNi-2),其区别在于:(1)熔点高——传统Ni基钎料熔点低,加热中自行熔化,而本发明所说的Ni钎料只有当加热温度超过 C-Ni共晶温度(1327℃)后才能通过两者之间的共晶反应实现熔化;(2)活性元素及润湿机理不同——本发明润湿碳纤维是以Ni为活性元素,是通过Ni与C的共晶反应润湿C 纤维的,而传统Ni基钎料是通过其中的合金元素Cr、B、Si等活性元素润湿碳纤维的,并非Ni本身。Described Ni-based active solder is different from traditional Ni-based solder (such as BNi-2), and its difference is: (1) melting point is high——traditional Ni-based solder has a low melting point, and self-melting in heating, and the present invention says Only when the heating temperature exceeds the C-Ni eutectic temperature (1327 ° C) can the Ni solder be melted through the eutectic reaction between the two; (2) the active elements and the wetting mechanism are different - the present invention wets the carbon fiber Ni is used as the active element, and the C fiber is wetted through the eutectic reaction of Ni and C, while the traditional Ni-based solder wets the carbon fiber through the alloy elements Cr, B, Si and other active elements, not Ni itself. .

在碳纤维增强陶瓷基复合材料(如Cf/C)高温钎焊中,本发明相对于传统商用Ni基钎料的优点有:与Ni基商用钎料相比,无需实现等温凝固,则钎焊保温时间可大幅缩短。传统商用镍基钎料用于陶瓷基复合材料钎焊时无法实现等温凝固,导致钎缝重熔温度低、耐热性差、钎缝很脆,因而存在接头的室温与高温性能均很差的问题。In the high-temperature brazing of carbon fiber reinforced ceramic matrix composites (such as C f /C), the present invention has the advantages relative to the traditional commercial Ni-based solder: compared with the Ni-based commercial solder, it does not need to realize isothermal solidification, and the brazing The holding time can be greatly shortened. Traditional commercial nickel-based brazing filler metals cannot achieve isothermal solidification when used for brazing ceramic matrix composites, resulting in low remelting temperature of the brazing seam, poor heat resistance, and very brittle brazing seam, so there are problems with poor room temperature and high temperature performance of the joint .

Claims (10)

1. a kind of solder for carbon fiber-reinforced ceramic matric composite, it is characterised in that: the solder is in ingredient design Using weak carbide formation element, non-carbide forming element or the moderate strength carbide shape that eutectic reaction can occur with carbon At element as wetting carbon fiber or as wetting carbon fiber and the active element of carbon base body, formed compound towards the ceramic base The high temperature active solder of material.
2. a kind of solder for carbon fiber-reinforced ceramic matric composite according to claim 1, it is characterised in that: institute It states active element and is selected from Fe, Ni or Cr.
3. a kind of solder for carbon fiber-reinforced ceramic matric composite according to claim 1, it is characterised in that: institute State the alloy-type solder that high temperature active solder is selected from Fe base solder or other Metal Substrates containing Fe.
4. a kind of solder for carbon fiber-reinforced ceramic matric composite according to claim 1, it is characterised in that: institute High temperature active solder is stated using Fe as active element, which contains enough Fe, with the ceramic base composite wood Eutectic reaction occurs on eutectic reaction temperature and forms liquid-phase reaction product for the carbon of material, to soak carbon fiber, carbon base body; Alternatively, the high temperature active solder, using Ni as active element, which contains enough Ni, with the ceramic base Eutectic reaction occurs on eutectic reaction temperature and forms liquid-phase reaction product for the carbon of composite material, thus soak carbon fiber, Carbon base body.
5. a kind of solder for carbon fiber-reinforced ceramic matric composite according to claim 1, it is characterised in that: institute State the refractory metal powder or low-heat of ceramic phase, low thermal coefficient of expansion that low thermal coefficient of expansion is also added in high temperature active solder The staple fiber of the coefficient of expansion.
6. a kind of method for welding for carbon fiber-reinforced ceramic matric composite, it is characterised in that: the following steps are included:
1) prepare high temperature active solder, the high temperature active solder is formed using the weak carbide that eutectic reaction can occurs with carbon Element, non-carbide forming element or moderate strength carbide former as wetting carbon fiber or as wetting carbon fiber and The active element of carbon base body;
2) soldering processes: generating liquid product by the eutectic reaction of the active element and carbon, utilizes liquid product realization pair The quick and fine and close wetting of carbon fiber, carbon base body in the ceramic matric composite, and full filling weld interface gap, with shape At brazed seam.
7. a kind of method for welding for carbon fiber-reinforced ceramic matric composite, feature exist according to claim 6 In: the soldering processes are specifically includes the following steps: be preset in the ceramic base using the high temperature active solder as middle layer Between composite material base material, the then held for some time on eutectic reaction temperature.
8. a kind of method for welding for carbon fiber-reinforced ceramic matric composite, feature exist according to claim 6 In: reach 1000 DEG C~1154 DEG C of connector for the requirement of soldered fitting heat resisting temperature, uses the activity using Fe as active element Solder, brazing filler metal melts temperature is on 1154 DEG C of Fe-C eutectic reaction temperature in soldering, and≤1400 DEG C.
9. a kind of method for welding for carbon fiber-reinforced ceramic matric composite, feature exist according to claim 6 In: reach 1200 DEG C~1300 DEG C of connector for the requirement of soldered fitting heat resisting temperature, uses the activity using Ni as active element Solder, brazing filler metal melts temperature is on 1327 DEG C of Ni-C eutectic reaction temperature in soldering;For the requirement of soldered fitting heat resisting temperature The connector for reaching 1400 DEG C~1500 DEG C uses the active solder using Cr as active element, and brazing filler metal melts temperature is Cr- in soldering On 1534 DEG C of C eutectic reaction temperature.
10. a kind of method for welding for carbon fiber-reinforced ceramic matric composite, feature exist according to claim 6 In: the condition of the soldering processes are as follows: soaking time is 1~10min, and pressure is 0.1~10MPa.
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