CN110518144B - Flexible packaging cover plate, manufacturing method thereof, flexible display panel and display device - Google Patents
Flexible packaging cover plate, manufacturing method thereof, flexible display panel and display device Download PDFInfo
- Publication number
- CN110518144B CN110518144B CN201910768204.2A CN201910768204A CN110518144B CN 110518144 B CN110518144 B CN 110518144B CN 201910768204 A CN201910768204 A CN 201910768204A CN 110518144 B CN110518144 B CN 110518144B
- Authority
- CN
- China
- Prior art keywords
- layer
- functional structure
- hardened layer
- substrate
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009459 flexible packaging Methods 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims description 374
- 239000003292 glue Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 claims description 20
- 208000034189 Sclerosis Diseases 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 238000007639 printing Methods 0.000 claims description 12
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 239000010962 carbon steel Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 18
- 230000000694 effects Effects 0.000 description 14
- 230000035939 shock Effects 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- -1 Polyethylene terephthalate Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a flexible packaging cover plate, a manufacturing method thereof, a flexible display panel and a display device, wherein the flexible packaging cover plate comprises: the substrate, the first hardened layer positioned on the substrate and at least one first functional structure; the first functional structure is located inside the flexible package cover plate and comprises a latticed fiber structure. In the flexible packaging cover plate provided by the embodiment of the invention, the first functional structure comprises the latticed fiber structure, so that the toughness of the first functional structure is better, and the impact resistance of the flexible packaging cover plate can be improved by arranging the first functional structure in the flexible packaging cover plate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible packaging cover plate, a manufacturing method thereof, a flexible display panel and a display device.
Background
With the continuous development of display technology, more and more display devices are widely applied to daily life and work of people, wherein the flexible display panel has the advantages of lightness, thinness, foldability and the like, and can be used and stored in various forms, so that the flexible display panel is more and more favored by people.
Organic Light-Emitting diodes (OLEDs) are the mainstream of flexible display products because of their advantages of self-luminescence, fast response speed, wide viewing angle, high definition, high brightness, low power consumption, etc. However, for the foldable screen, compared with a rigid screen or a curved screen, the foldable screen mostly adopts a flexible and foldable packaging cover plate due to its bending performance, but the packaging cover plate has a smaller rigidity, i.e. the packaging cover plate is softer, so that it is unable to provide sufficient strength to prevent the screen and the components from being impacted by external force or external impact.
Disclosure of Invention
The embodiment of the invention provides a flexible packaging cover plate, a manufacturing method thereof, a flexible display panel and a display device, which are used for solving the problem that the impact resistance of the flexible packaging cover plate is poor in the prior art.
In a first aspect, an embodiment of the present invention provides a flexible package cover plate, including:
the substrate, the first hardened layer positioned on the substrate and at least one first functional structure;
the first functional structure is located inside the flexible packaging cover plate and comprises a latticed fiber structure.
In a possible implementation manner, in the flexible package cover provided in the embodiment of the present invention, the first functional structure is located inside a film layer in the flexible package cover; or the first functional structure is positioned between two adjacent film layers in the flexible packaging cover plate.
In a possible implementation manner, in the above flexible package cover provided in the embodiment of the present invention, the first functional structure is disposed in a whole layer.
In a possible implementation manner, in the above flexible package cover provided by the embodiment of the present invention, at least one of the first functional structures is located inside the first hardened layer.
In a possible implementation manner, in the flexible package cover provided in the embodiment of the present invention, the flexible package cover further includes: the second hardened layer is positioned on one side, away from the first hardened layer, of the substrate;
at least one of the first functional structures is located inside the second hardened layer.
In a possible implementation manner, in the flexible package cover provided in the embodiment of the present invention, the flexible package cover further includes: the ink layer is positioned on one side, away from the substrate, of the second hardened layer; the ink layer is of an annular structure surrounding the edge of the flexible packaging cover plate.
In a possible implementation manner, in the flexible package cover provided in the embodiment of the present invention, the flexible package cover further includes:
the ink layer is positioned on one side, away from the first hardened layer, of the substrate and is of an annular structure surrounding the edge of the flexible packaging cover plate;
the part of the first functional structure, which exceeds the edge of the second hardened layer, is positioned inside the ink layer.
In a possible implementation manner, in the flexible package cover provided in the embodiment of the present invention, the flexible package cover further includes:
the adhesive layer is positioned on one side, away from the first hardened layer, of the substrate, and the ink layer is positioned on one side, away from the first hardened layer, of the adhesive layer;
in the perpendicular to on the planar direction in substrate place, the glue film with the printing ink layer is overlapped each other, first functional structure surpasss the part at second sclerosis layer edge is located inside the glue film.
In a possible implementation manner, in the flexible package cover board provided in the embodiment of the present invention, an edge of a portion of the second hardened layer is located between the glue layer and the ink layer.
In a possible implementation manner, in the above flexible package cover provided in an embodiment of the present invention, the flexible package cover further includes:
an oleophobic layer on the side of the first hardened layer facing away from the substrate; or the like, or, alternatively,
the first hardened layer includes an oleophobic material.
In a possible implementation manner, in the above flexible package cover provided by the embodiment of the present invention, a difference between a refractive index of the first functional structure and a refractive index of the first hardened layer is less than 0.05.
In a possible implementation manner, in the above flexible encapsulating cover plate provided by the embodiment of the present invention, the material of the first functional structure includes one or more of glass fiber, carbon fiber, and steel fiber.
In a possible implementation manner, in the above flexible package cover provided in the embodiment of the present invention, the first functional structure includes a plurality of first lines extending along a first direction and a plurality of second lines extending along a second direction;
the first direction is crosswise to the second direction;
the horizontal distance between two adjacent first lines is larger than or equal to 1 μm, and the horizontal distance between two adjacent second lines is larger than or equal to 1 μm.
In a possible implementation manner, in the above flexible package cover provided by the embodiment of the present invention, a thickness of the first functional structure is less than or equal to one third of a thickness of the first hardened layer.
In a second aspect, based on the same inventive concept, an embodiment of the present invention provides a flexible display panel, including: the flexible packaging cover plate comprises a flexible substrate base plate and the flexible packaging cover plate arranged opposite to the substrate base plate.
In a third aspect, based on the same inventive concept, an embodiment of the present invention provides a display device, including: the flexible display panel is provided.
In a fourth aspect, based on the same inventive concept, an embodiment of the present invention provides a method for manufacturing the flexible package cover plate, including:
forming a first hardened layer on the surface of the substrate;
forming at least one first functional structure inside the flexible encapsulating cover, wherein the first functional structure comprises a grid-like fiber structure.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present invention, the forming at least one first functional structure inside the flexible package cover includes:
forming a first sub-film layer of the first hardened layer on the surface of the substrate;
forming the first functional structure over the first sub-film layer;
forming a second sub-film layer of the first hardened layer over the first functional structure;
and curing the first hardened layer.
In a possible implementation manner, in the above manufacturing method provided by the embodiment of the present invention, the forming at least one first functional structure inside the flexible package cover includes:
forming a first sub-hardening layer of a second hardening layer on the surface of one side, away from the first hardening layer, of the substrate;
forming the first functional structure on one side of the first sub-hardened layer, which is far away from the substrate;
forming a second sub-hardened layer of the second hardened layer on one side of the first functional structure, which is far away from the substrate;
and curing the second hardened layer.
In a possible implementation manner, in the manufacturing method provided by the embodiment of the present invention, the first functional structure is located inside the second hardened layer;
the manufacturing method further comprises the following steps:
and forming an ink layer surrounding the edge of the flexible packaging cover plate on one side of the second hardened layer, which is far away from the substrate.
In a possible implementation manner, in the manufacturing method provided by the embodiment of the present invention, the first functional structure exceeds an edge of the second hardened layer;
the manufacturing method further comprises the following steps:
the substrate deviates from one side of first sclerosis layer forms and centers on the printing ink layer at flexible encapsulation apron edge, and makes first functional structure surpasss the part at second sclerosis layer edge is located inside the printing ink layer.
In a possible implementation manner, in the manufacturing method provided by the embodiment of the present invention, the first functional structure exceeds an edge of the second hardened layer;
the manufacturing method further comprises the following steps:
forming an adhesive layer on one side of the substrate, which is far away from the first hardened layer, and enabling the part of the first functional structure, which exceeds the edge of the second hardened layer, to be positioned in the adhesive layer;
forming an ink layer surrounding the edge of the flexible packaging cover plate on one side of the adhesive layer, which is far away from the base material; and in the direction vertical to the plane of the substrate, the glue layer and the ink layer are mutually overlapped.
In a possible implementation manner, in the manufacturing method provided by the embodiment of the present invention, the first functional structure exceeds an edge of the first sub-hardened layer, and the first functional structure does not exceed an edge of the second sub-hardened layer;
the first sub-hardened layer deviates from one side of the substrate forms after the first functional structure deviates from one side of the substrate forms before the second sub-hardened layer of the second hardened layer, the method further comprises:
forming an adhesive layer on one side of the substrate, which is far away from the first hardened layer, and enabling the part of the first functional structure, which exceeds the edge of the first sub-hardened layer, to be positioned in the adhesive layer;
after the curing of the second hardened layer, the method further includes:
and forming an ink layer surrounding the edge of the flexible packaging cover plate on one side of the second hardened layer, which is far away from the substrate.
The invention has the following beneficial effects:
the embodiment of the invention provides a flexible packaging cover plate, a manufacturing method thereof, a flexible display panel and a display device, wherein the flexible packaging cover plate comprises the following components: the substrate, the first hardened layer positioned on the substrate and at least one first functional structure; the first functional structure is located inside the flexible package cover plate and comprises a latticed fiber structure. In the flexible packaging cover plate provided by the embodiment of the invention, the first functional structure comprises the latticed fiber structure, so that the toughness of the first functional structure is better, and the impact resistance of the flexible packaging cover plate can be improved by arranging the first functional structure in the flexible packaging cover plate.
Drawings
Fig. 1 is a schematic structural diagram of a flexible package cover according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a first functional structure according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 8 is a schematic top view of a flexible package cover according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of another flexible package cover according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of a flexible display panel according to an embodiment of the present invention;
fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 16 is a flowchart of a method for manufacturing the flexible package cover according to an embodiment of the present invention;
FIG. 17 is a flowchart illustrating a method of forming a first functional structure in a first hardened layer according to an embodiment of the present invention;
fig. 18a to 18d are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the invention;
FIG. 19 is a flowchart illustrating a method of forming a first functional structure in a second hard layer according to an embodiment of the present invention;
fig. 20a to 20e are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the invention;
fig. 21a to 21e are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the invention;
fig. 22a and 22b are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the invention;
fig. 23a to 23d are schematic structural diagrams corresponding to steps in the manufacturing method in the embodiment of the invention.
Detailed Description
Aiming at the problem that the impact resistance of a flexible packaging cover plate is poor in the prior art, the embodiment of the invention provides the flexible packaging cover plate, a manufacturing method of the flexible packaging cover plate, a flexible display panel and a display device.
The following describes in detail specific embodiments of a flexible package cover, a manufacturing method thereof, a flexible display panel, and a display device according to embodiments of the present invention with reference to the accompanying drawings. The thicknesses and shapes of the various film layers in the drawings are not to be considered true proportions, but are merely intended to illustrate the present invention.
In a first aspect, an embodiment of the present invention provides a flexible package cover, as shown in fig. 1, including:
a substrate 101, a first hardened layer 102 located on the substrate 101, and at least one first functional structure 103;
the first functional structure 103 is located inside the flexible package cover plate, and the first functional structure 103 includes a grid-like fiber structure, and a schematic top view of the first functional structure is shown in fig. 2.
In the flexible packaging cover plate provided by the embodiment of the invention, the first functional structure comprises the latticed fiber structure, so that the toughness of the first functional structure is better, and the impact resistance of the flexible packaging cover plate can be improved by arranging the first functional structure in the flexible packaging cover plate.
The flexible packaging cover plate provided by the embodiment of the invention is preferably applied to a folding screen, for example, can be applied to a foldable organic light emitting diode display panel, and in addition, when the flexible packaging cover plate is implemented, the flexible packaging cover plate can also be applied to other types of display panels, for example, a solid curved display panel and the like.
Specifically, the substrate in the flexible package cover plate needs to have certain flexibility, and for example, the substrate may be made of organic materials such as Polyethylene terephthalate (PET), Polyimide (PI), acrylic, epoxy resin, and silicone.
Referring to fig. 1, a first hardened layer (Hard coating)102 is formed on a substrate 101, and the first hardened layer 102 can improve the hardness and scratch resistance of the flexible packaging cover plate, that is, a film layer with a certain hardness exists inside the flexible packaging cover plate, so that a finger can feel a good touch of the flexible packaging cover plate, and the flexible packaging cover plate is protected to prevent the flexible packaging cover plate and the internal structure thereof from being damaged.
The first functional structure comprises a latticed fiber structure, and in specific implementation, materials such as glass fibers and the like can be manufactured into a latticed shape through a wire drawing process, and the formed latticed fiber structure has certain toughness and can bear larger force in the radial direction, so that the applied force can be transmitted to the edge in the radial direction. The first functional structure is arranged on the flexible packaging cover plate, so that the acting force applied to the flexible packaging cover plate can be dispersed, and the shock resistance of the flexible packaging cover plate is improved, therefore, the flexible packaging cover plate has enough strength to protect the display panel and the components thereof, and the display panel and the components thereof are prevented from being damaged by external force or external impact.
In practical applications, in the flexible package cover provided in the embodiment of the present invention, as shown in fig. 1, the first functional structure 103 may be located inside a film layer in the flexible package cover; set up first functional structure 103 inside certain rete, can be more firm with first functional structure 103 fix inside flexible encapsulation apron, more be favorable to dispersing the effort, guarantee the shock resistance of flexible encapsulation apron.
Alternatively, as shown in fig. 3, the first functional structure 103 may be located between two adjacent film layers in the flexible package cover, for example, in fig. 3, the first functional structure 103 may be located between the substrate 101 and the first hardened layer 102, so that during the manufacturing process, only the first functional structure 103 needs to be attached to the surface of a certain film layer, and no other process step needs to be added, so that the manufacturing process is simple.
That is, the first functional structure 103 may be located at any position inside the flexible packaging cover plate, and the specific position of the first functional structure 103 is not limited herein.
In a specific implementation, in the flexible package cover plate provided in the embodiment of the present invention, the first functional structure is disposed in a whole layer. Can be with the more even dispersion of effort that flexible encapsulation apron received like this to, transmit the edge of effort to flexible encapsulation apron as far as possible, avoid the effort to influence the display area. In practical applications, the first functional structure may be provided in a non-entire layer, for example, a block-shaped first functional structure may be provided in a region that is likely to receive an applied force, or a plurality of first functional structures may be provided in each of a plurality of regions, and the distribution region of the first functional structure is not limited here.
Specifically, in the flexible package cover provided in the embodiment of the present invention, the specific position of the first functional structure may have the following multiple setting manners:
the setting mode is as follows:
as shown in fig. 1, at least one first functional structure 103 is located inside the first hardened layer 102. First sclerosis layer 102 generally can adopt organic matter curable such as ya keli, because first sclerosis layer 102 has better viscidity before the solidification, therefore set up first functional structure 103 inside first sclerosis layer 102, can more firm the fixing inside flexible encapsulation apron with first functional structure 103, more be favorable to the dispersion to act on the effort on flexible encapsulation apron surface, guarantee flexible encapsulation apron have better shock resistance.
As shown in fig. 4, two layers of the first functional structures 103 may be disposed inside the first hardened layer 102, or in a specific implementation, more layers of the first functional structures 103 may be disposed in the first hardened layer 102, and the number of the first functional structures 103 in the first hardened layer 102 is not limited herein.
The setting mode is two:
as shown in fig. 5, the flexible package cover provided in the embodiment of the present invention may further include: a second hardened layer 105 on the side of the substrate 101 facing away from the first hardened layer 102;
at least one first functional structure 103 is located inside the second hardened layer 105.
The second hardening layer 105 is arranged on one side of the substrate 101, which is far away from the first hardening layer 102, so that the hardness and the scratch resistance of the flexible packaging cover plate can be further improved, the surface of the flexible packaging cover plate has good touch feeling, and the flexible packaging cover plate and the internal structure thereof can be prevented from being damaged. It should be noted that the provision of the first hardened layer 102 and the second hardened layer 105 in the flexible encapsulating cover does not affect the flexibility of the flexible encapsulating cover.
As shown in fig. 6, in practical applications, the first functional structure 103 may be disposed in both the first hardened layer 102 and the second hardened layer 105, so that the acting force applied to the flexible package cover can be dispersed in different film layers, respectively, to further improve the impact resistance of the flexible package cover, and in particular, the first functional structure 103 may be disposed in more layers in the first hardened layer 102 and the second hardened layer 105, which is not limited herein.
In specific implementation, as shown in fig. 7, the flexible package cover provided in the embodiment of the present invention may further include: the ink layer 106 is positioned on the side, away from the substrate 101, of the second hardened layer 105; referring also to fig. 8, the ink layer 106 is a ring-shaped structure surrounding the edge of the flexible encapsulation cover.
As shown in fig. 8, the annular ink layer 106 is disposed at the edge of the flexible package cover plate, so as to prevent light leakage at the edge of the display panel, and in addition, the ink layer 106 is generally black or white, so as to improve the contrast of the display panel.
The setting mode is three:
as shown in fig. 9, the flexible package cover provided in the embodiment of the present invention may further include:
an ink layer 106 located on a side of the substrate 101 facing away from the first hardened layer 102, where the ink layer 106 is a ring-shaped structure surrounding an edge of the flexible package cover, and a top view of the flexible package cover shown in fig. 9 can also refer to fig. 8;
the portion of the first functional structure 103 beyond the edge of the second hardened layer 105 is located inside the ink layer 106.
That is to say, the edge of the first functional structure 103 is fixed in the ink layer 106, when the flexible packaging cover plate receives the acting force, the acting force can be dispersed to the edge of the flexible packaging cover plate, even if the acting force is large, the damaged ink layer 106 can only be located at the edge, the film layer in the display area can not be damaged, and the display effect of the display panel can not be influenced.
In addition, compared with the structure shown in fig. 7, the portion of the first functional structure 103 beyond the edge of the second hardened layer 105 shown in fig. 9 is located inside the ink layer 106, so that the thickness of the flexible package cover plate can be reduced, which is beneficial to the lightness and thinness of the display panel.
As shown in fig. 10, two layers of the first functional structures 103 may also be disposed inside the second hardened layer 105, and portions of the two layers of the functional structures 103 beyond the edge of the second hardened layer 105 may be disposed inside the ink layer 106, so as to further increase the impact resistance of the flexible package cover. In specific implementation, a portion of the first functional structure 103 beyond the edge of the second hardened layer 105 in more layers may be disposed in the ink layer 106, where the number of the first functional structures 103 in the ink layer 106 is not limited.
The setting mode is four:
as shown in fig. 11, the flexible package cover provided in the embodiment of the present invention may further include:
the adhesive layer 107 is positioned on the side, away from the first hardened layer 102, of the substrate 101, and the ink layer 106 is positioned on the side, away from the first hardened layer 102, of the adhesive layer 107;
in the direction perpendicular to the plane of the substrate 101, the glue layer 107 and the ink layer 106 are overlapped, and the portion of the first functional structure 103 beyond the edge of the second hardened layer 105 is located inside the glue layer 107.
Because the viscidity of glue film 107 is better, fix the edge of first functional structure 103 through increasing glue film 107, can be more firm fixed first functional structure 103, further strengthen the shock resistance of flexible encapsulation apron. And, in the direction of perpendicular to base material 101 place plane, glue film 107 and printing ink layer 106 overlap each other, therefore, at least part of glue film 107 can be sheltered from by printing ink layer 106, avoids glue film 107 to influence display panel's display effect, when concrete implementation, in the direction of perpendicular to base material 101 place plane, can set up glue film 107 in the coverage of printing ink layer 106 to make glue film 107 shelter from by printing ink layer 106 completely, guarantee display panel's display effect.
Further, in the flexible package cover provided in the embodiment of the present invention, as shown in fig. 12, an edge of a portion of the second hardened layer 105 is located between the glue layer 107 and the ink layer 106.
As shown in fig. 12, in the direction perpendicular to the plane of the base material 101, the surface of the second hardened layer 105 on the side close to the base material 101 is located within the range of the surface of the second hardened layer 105 on the side away from the base material 101. As shown in the schematic cross-sectional view of fig. 12, the cross-section of the second hardened layer 105 is in a shape of a "convex", that is, the second hardened layer 105 has a step, the glue layer 107 is located at the step of the second hardened layer 105, so that the glue layer 107 is connected with the ink layer 106 through a part of the second hardened layer 105, because the contact effect of the ink layer 106 and the second hardened layer 105 is better, and the contact effect of the glue layer 107 and the second hardened layer 105 is also better, the problem of the poor contact effect of the glue layer 107 and the ink layer 106 in direct contact can be avoided.
It should be noted that, the first to fourth arrangement modes are exemplified for the specific position of the first functional structure in the embodiment of the present invention, and in the specific implementation, the display panel in the embodiment of the present invention may also be in other structures, for example, the first functional structure 103 may also be provided in the first hardened layer 102 in the third and fourth arrangement modes, or the first functional structure 103 may also be provided in other film layers of the flexible encapsulating cover, and the structure of the flexible encapsulating cover is not limited herein.
In practical applications, in the flexible package cover provided in the embodiment of the present invention, as shown in fig. 1, the flexible package cover may further include:
an oleophobic (Anti finger) layer 104 on the side of the first hardened layer 102 facing away from the substrate 101;
or the like, or, alternatively,
as shown in fig. 13, the first hardened layer 102 includes an oleophobic material.
Through setting up oil-repellent layer 104 in one side that deviates from substrate 101 at first sclerosis layer 102, or directly mix oleophobic material in first sclerosis layer 102, can make the surface of flexible encapsulation apron have oleophobic effect, prevent to leave the fingerprint after the finger touch, make flexible encapsulation apron have better sense of touch.
Specifically, in the flexible package cover provided in the embodiment of the present invention, as shown in fig. 1, a difference between a refractive index of the first functional structure 103 and a refractive index of the first hardened layer 102 is less than 0.05.
Generally, the refractive index of the first hardened layer 102 is about 1.5, so the refractive index of the first functional structure 103 can be in the range of 1.45-1.55, the refractive index of the first functional structure 103 is as close as possible to the refractive index of the first hardened layer 102, and the refractive index of the first functional structure 103 is preferably the same as the refractive index of the first hardened layer 102, thereby preventing the phenomena of fogging, diffraction, interference and the like after light passes through the first functional structure 103 and the first hardened layer 102, that is, preventing the first functional structure 103 from affecting the display effect of the display panel.
In practical implementation, in the above flexible encapsulating cover plate provided by the embodiment of the present invention, the material of the first functional structure includes one or more of glass fiber, carbon fiber and steel fiber.
In order to avoid the first functional structure from affecting the light transmittance of the display panel, the first functional structure is preferably made of a transparent material, for example, glass fiber may be used to make the first functional structure. In addition, the first functional structure may also be made of an opaque material, such as carbon fiber or steel fiber, and the grid-like fiber structure of the first functional structure may be disposed in the non-opening area of the display panel to prevent the first functional structure from affecting the display effect of the display panel.
Specifically, in the above flexible package cover according to the embodiment of the present invention, as shown in fig. 2, the first functional structure 103 includes a plurality of first lines L1 extending along the first direction x and a plurality of second lines L2 extending along the second direction y;
the first direction x is crossed with the second direction y;
the horizontal distance D1 between two adjacent first lines L1 is 1 μm or more, and the horizontal distance D2 between two adjacent second lines L2 is 1 μm or more.
The shock resistance of the flexible packaging cover plate depends on the number of layers of the first functional structure and the distribution density of the latticed fiber structure in the first functional structure, the horizontal distance between two adjacent first lines L1 is set to be larger than or equal to 1 mu m, and the horizontal distance between two adjacent second lines L2 is set to be larger than or equal to 1 mu m, so that the light transmission of the first functional structure is better on the basis of ensuring that the first functional structure has better shock resistance, and the display panel is ensured to have better display effect.
In addition, the first direction x is intersected with the second direction y, that is, the included angle θ between the first line L1 and the second line L2 may be in the range of 0 to 180 °, so as to ensure that the plurality of first lines L1 and the plurality of second lines L2 may form a grid shape. The first lines L1 and the second lines L2 may be in contact with each other to form a grid structure, or may be overlapped without contact with each other to form a grid structure.
In the embodiment of the present invention, the first functional structure is exemplified as the lattice-like fiber structure shown in fig. 2, but in the specific implementation, the first functional structure may be a lattice-like fiber structure having another shape, for example, the lattice to be formed may have a triangular shape, a hexagonal shape, or the like, and the shape of the lattice-like fiber structure of the first functional structure is not limited herein.
In a specific implementation, in the flexible package cover provided by the embodiment of the present invention, a thickness of the first functional structure is less than or equal to one third of a thickness of the first hardened layer. The first functional structure is generally formed by drawing a fibrous structure, and the thickness of the first functional structure is also understood to be the diameter of the fibrous structure of the first functional structure. The thickness of the first functional structure is set to be less than or equal to one third of the thickness of the first hardened layer, so that the first functional structure can be firmly arranged in the first hardened layer, and the flexible packaging cover plate is guaranteed to have better impact resistance.
The thickness of the first hardened layer is generally less than 100 μm, and thus the thickness of the first functional structure is generally less than 30 μm, and the thickness of the first functional structure may have other values, and in order to ensure the firmness of the first functional structure, the thickness of the first functional structure is preferably not more than 50 μm.
In a second aspect, based on the same inventive concept, an embodiment of the present invention further provides a flexible display panel, as shown in fig. 14, including: a flexible substrate 200, and the flexible package cover 100 provided to face the substrate 200. The flexible package cover in the flexible display panel provided in the embodiment of the present invention may be any one of the flexible package covers in the first aspect.
In addition, the flexible display panel may further include: the flexible package cover plate comprises a light emitting layer 201 positioned on one side of a substrate base plate 200 facing the flexible package cover plate 100, a touch electrode layer 202 positioned on one side of the light emitting layer 201 facing away from the substrate base plate 200, and a polarization layer 203 positioned on one side of the touch electrode layer 202 facing away from the substrate base plate 200. Because the principle of solving the problems of the flexible display panel is similar to that of the flexible packaging cover plate, the implementation of the flexible display panel can refer to the implementation of the flexible packaging cover plate, and repeated details are not repeated.
In a third aspect, based on the same inventive concept, an embodiment of the present invention further provides a display device, including: the display device can be applied to any product or component with a display function, for example, a mobile phone, as shown in fig. 15, the display panel of the mobile phone can be the flexible display panel provided in the embodiment of the present invention, and in addition, the display device can be applied to products or devices such as a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Because the principle of the display device for solving the problems is similar to that of the flexible display panel, the implementation of the display device can be referred to that of the flexible display panel, and repeated details are not repeated.
In a fourth aspect, an embodiment of the present invention further provides a manufacturing method of the flexible package cover, and because a principle of the manufacturing method for solving the problem is similar to that of the flexible package cover, implementation of the manufacturing method may refer to implementation of the flexible package cover, and repeated details are not repeated.
Specifically, as shown in fig. 16, the method for manufacturing the flexible package cover according to the embodiment of the present invention includes:
s301, forming a first hardening layer on the surface of the base material;
s302, at least one first functional structure is formed inside the flexible packaging cover plate, wherein the first functional structure comprises a grid-shaped fiber structure.
In the manufacturing method provided by the embodiment of the invention, at least one first functional structure is formed in the first packaging cover plate, and the first functional structure comprises the latticed fiber structure, so that the toughness of the first functional structure is better, and the impact resistance of the flexible packaging cover plate can be improved.
It should be noted that, in the manufacturing method provided in the embodiment of the present invention, step S301 and step S302 do not indicate that step S302 needs to be performed after step S301, and the order of the manufacturing process may be adjusted according to the specific structure of the flexible package cover plate, where the order of step S301 and step S302 is not limited here.
For the flexible package cover in the first configuration of the first aspect:
specifically, in the manufacturing method provided by the embodiment of the present invention, as shown in fig. 17, the step S302 may include:
s401, as shown in fig. 18a, forming a first sub-film layer 102a of a first hardened layer on the surface of the substrate 101;
s402, as shown in fig. 18b, forming a first functional structure 103 on the first sub-film layer 102 a; specifically, in the case where the first functional structure 103 is made of glass fibers, the glass fibers may be formed into a filament-like fiber structure by a drawing process, and then the plurality of filament-like fiber structures may be formed into a mesh shape, and in a specific implementation, after the first sub-film layer 102a is formed, the mesh-like fiber structure may be directly formed on the first sub-film layer 102a by a drawing process, or a mesh-like fiber structure may be formed in advance, and after the first sub-film layer 102a is formed, the mesh-like fiber structure may be directly bonded to the first sub-film layer 102 a.
S403, as shown in fig. 18c, forming a second sub-film layer 102b of the first hardened layer on the first functional structure 103; the first and second sub-film layers 102a and 102b are made of the same material, i.e., made of the material of the first hardened layer, so that after the second sub-film layer 102b is formed, the second sub-film layer 102b may be integrated with the first sub-film layer 102a, i.e., made of the first hardened layer.
S404, as shown in fig. 18d, the first hardened layer 102 is cured to firmly fix the first functional structure 103 inside the first hardened layer 102. Then, an oil-repellent layer 104 is formed on the side of the first hardened layer 102 facing away from the substrate 101, i.e., the structure shown in fig. 1 is obtained.
In addition, referring to fig. 4, for the case that the first hardened layer 102 has two or more layers of the first functional structures 103, referring to the above steps S401 to S404, two or more layers of the first functional structures 103 are formed according to actual requirements, taking the example of forming two layers of the first functional structures 103 in the first hardened layer 102, before the first hardened layer is cured in step S404, a layer of the first functional structures 103 is further formed on the second sub-film layer 102b shown in fig. 18c, and a layer of the sub-film layer is further formed on the first functional structures 103, and then the first hardened layer is cured, and when there are more layers of the first functional structures 103 in the first hardened layer 102, the fabrication can be performed by analogy with the steps, and details are not repeated herein.
For the flexible package cover in the second arrangement of the first aspect:
in a specific implementation, in the manufacturing method provided in an embodiment of the present invention, as shown in fig. 19, the step S302 may include:
s501, as shown in FIG. 20a, a first sub-hardened layer 105a of a second hardened layer is formed on the surface of the substrate 101 on the side away from the first hardened layer 102; in a specific implementation, after the film layers such as the first hardened layer 102 and the oil-repellent layer 104 are formed on the substrate 101, the substrate 101 is turned over by 180 °, and the first sub-hardened layer 105a and the subsequent film layers are formed on the surface of the other side of the substrate 101 (i.e., the surface of the substrate 101 away from the first hardened layer 102).
S502, as shown in fig. 20b, forming a first functional structure 103 on a side of the first sub-cured layer 105a away from the substrate 101; for a specific process of forming the first functional structure 103, reference may be made to the step S402, which is not described herein again.
S503, as shown in fig. 20c, forming a second sub-hardened layer 105b of a second hardened layer on the side of the first functional structure 103 away from the substrate 101; the first sub hardened layer 105a and the second sub hardened layer 105b are both made of the same material, that is, the material of the second hardened layer, so that after the second sub hardened layer 105b is formed, the second sub hardened layer 105b can be integrated with the first sub hardened layer 105a, that is, the second hardened layer is formed. Specifically, the second hardened layer may be made of the same material as the first hardened layer, or may be made of another material, which is not limited herein.
S504, as shown in fig. 20d, the second hardened layer 105 is cured, and the structure shown in fig. 20d is turned over by 108 ° to obtain the structure shown in fig. 5.
In practical applications, referring to fig. 6, for the structure having the first functional structure 103 in each of the first and second hardened layers 102 and 105, the first functional structure 103 may be fabricated inside the first hardened layer 102 according to the steps S401 to S404, and then the substrate 101 may be turned over by 180 °, and the second hardened layer 105 having the first functional structure 103 inside may be formed on the surface of the other side of the substrate 101 according to the steps S501 to S504. Alternatively, the second hardened layer 105 may be formed on one side of the substrate 101 in accordance with the above steps S501 to S504, and then the substrate may be turned over by 180 °, and the first hardened layer 102 may be formed on the other side of the substrate in accordance with the above steps S401 to S404.
With the structure shown in fig. 7, that is, with the first functional structure 103 located inside the second hardened layer 105;
the manufacturing method may further include, after the step S504:
as shown in fig. 20e, an ink layer 106 is formed around the edge of the flexible package cover on the side of the second hardened layer 105 facing away from the substrate 101, and the structure shown in fig. 7 can be obtained by turning the structure shown in fig. 20e by 108 °.
For the flexible encapsulating cover in the third configuration of the first aspect:
referring to fig. 9, for the structure in which the first functional structure 103 exceeds the edge of the second hardened layer 105;
in the above step S501, as shown in fig. 21a, the first sub-hardened layer 105a is formed on the surface of the substrate 101 on the side away from the first hardened layer 102, and unlike the structure shown in fig. 20a, the edge of the first sub-hardened layer 105a formed in fig. 21a has a certain distance from the edge of the substrate 101.
In the above step S502, as shown in fig. 21b, the first functional structure 103 is formed on the side of the first sub-hardened layer 105a away from the substrate 101, and the edge of the first functional structure 103 is made to exceed the edge of the first sub-hardened layer 105 a.
In the above step S503, as shown in fig. 21c, the second sub hardened layer 105b is formed on the side of the first functional structure 103 away from the substrate 101, and unlike the structure shown in fig. 20c, the edge of the second sub hardened layer 105b formed in fig. 21c is also at a certain distance from the edge of the substrate 101, specifically, the second sub hardened layer 105b may be formed to be substantially flush with the edge of the first sub hardened layer 105 a.
In the above step S504, as shown in fig. 21d, the second hardened layer 105 is cured, so that the first functional structure 103 is formed beyond the edge of the second hardened layer 105.
The manufacturing method may further include, after the step S504:
as shown in fig. 21e, an ink layer 106 surrounding the edge of the flexible package cover is formed on the side of the substrate 101 away from the first hardened layer 102, the portion of the first functional structure 103 beyond the edge of the second hardened layer 105 is located inside the ink layer 106, and the structure shown in fig. 21e is turned over by 180 ° to obtain the structure shown in fig. 9. Thereby realize being fixed in printing ink layer 106 with the edge of first functional structure 103, when flexible encapsulation apron received the effort, can disperse the effort to the edge of flexible encapsulation apron, even the effort is very big, receive the damage also can only be the printing ink layer 106 that is located the edge, can not destroy the rete in the display area, can not influence display panel's display effect.
Referring to fig. 10, for the structure having two or more layers of the first functional structure 103 in the second hardened layer 105, the steps S501 to S504 can be referred to, and more layers of the first functional structure 103 are formed inside the second hardened layer 105, which is not described again.
For the flexible encapsulating cover of the fourth configuration of the first aspect:
referring to fig. 11, another structure in which the first functional structure 103 exceeds the edge of the second hardened layer 105;
the steps of forming the first functional structure 103 in the second hardened layer 105 can refer to fig. 21a to 21d, and refer to the steps S501 to S504 corresponding to the structures of the third manufacturing and disposing method, which are not described herein again.
The manufacturing method may further include, after the step S504:
as shown in fig. 22a, a glue layer 107 is formed on a side of the substrate 101 away from the first hardened layer 102, and a portion of the first functional structure 103 beyond the edge of the second hardened layer 105 is located inside the glue layer 107;
as shown in fig. 22b, an ink layer 106 surrounding the edge of the flexible packaging cover plate is formed on the side of the glue layer 107 facing away from the substrate 101; the glue layer 107 and the ink layer 106 are overlapped with each other in a direction perpendicular to the plane of the substrate 101. The structure shown in fig. 11 is obtained by turning the structure shown in fig. 22b 180 °. Therefore, the edge of the first functional structure 103 is fixed in the adhesive layer 107, and the adhesive layer 107 has better viscosity, so that the first functional structure 103 can be more firmly fixed, and the impact resistance of the flexible packaging cover plate is further enhanced.
Referring to fig. 12, for the structure in which the first functional structure 103 exceeds the edge of the first sub-hardened layer 105a, and the first functional structure 103 does not exceed the edge of the second sub-hardened layer 105 b;
the steps of forming the first sub-hardened layer 105a on the surface of the substrate 101 facing away from the first hardened layer 102 and forming the first functional structure 103 on the side of the first sub-hardened layer 105a facing away from the substrate 101 can refer to fig. 21a and 21b, and refer to the step S501 and the step S502 corresponding to the structure of the third manufacturing and setting manner, which are not described herein again.
After step S502 and before step S503, the method may further include:
as shown in fig. 23a, a glue layer 107 is formed on a side of the substrate 101 away from the first hardened layer 102, and a portion of the first functional structure 103 beyond an edge of the first sub-hardened layer 105a is located inside the glue layer 107;
as shown in fig. 23b, a second sub-hardened layer 105b is formed on the side of the film layer where the glue layer 107 is located, which is away from the substrate 101, and the edge of the second sub-hardened layer 105b exceeds the edge of the first sub-hardened layer 105a and covers the first functional structure 103 and the glue layer 107. As shown in fig. 23c, the second hardened layer 105 is cured, thereby fixing the first functional structure 103 inside the second hardened layer 105.
After the step S504, the method may further include:
as shown in fig. 23d, an ink layer 106 is formed around the edge of the flexible package cover on the side of the second hardened layer 105 facing away from the substrate 101, and the structure shown in fig. 23d is turned over by 180 ° to obtain the structure shown in fig. 12. That is to say, the ink layer 106 and the glue layer 107 are not in direct contact, but are connected through a part of the second hardened layer 105, because the contact effect of the ink layer 106 and the second hardened layer 105 is better, and the contact effect of the glue layer 107 and the second hardened layer 105 is also better, so that the problem that the contact effect of the glue layer 107 and the ink layer 106 in direct contact is not good can be avoided.
In addition, the flexible package cover plate with other structures can also be manufactured by combining the steps in the manufacturing method, and the details are not repeated here.
The embodiment of the invention provides a flexible packaging cover plate, a manufacturing method thereof, a flexible display panel and a display device, wherein the flexible packaging cover plate comprises the following components: the substrate, the first hardened layer positioned on the substrate and at least one first functional structure; the first functional structure is located inside the flexible package cover plate and comprises a latticed fiber structure. In the flexible packaging cover plate provided by the embodiment of the invention, the first functional structure comprises the latticed fiber structure, so that the toughness of the first functional structure is better, and the impact resistance of the flexible packaging cover plate can be improved by arranging the first functional structure in the flexible packaging cover plate.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (20)
1. A flexible packaging cover, comprising:
the substrate, the first hardened layer positioned on the substrate and at least one first functional structure;
the first functional structure is positioned inside the flexible packaging cover plate and comprises a latticed fiber structure;
the flexible packaging cover plate further comprises: the second hardened layer is positioned on one side, away from the first hardened layer, of the substrate, the adhesive layer is positioned on one side, away from the first hardened layer, of the substrate, and the ink layer is positioned on one side, away from the first hardened layer, of the adhesive layer;
at least one first functional structure is located inside the second sclerosis layer, at the perpendicular to in the planar direction in substrate place, the glue film with the printing ink layer overlaps each other, first functional structure surpasss the part at second sclerosis layer edge is located inside the glue film.
2. The flexible packaging cover of claim 1, wherein the first functional structure is located inside a film layer in the flexible packaging cover; or the first functional structure is positioned between two adjacent film layers in the flexible packaging cover plate.
3. The flexible packaging cover of claim 2, wherein the first functional structure is a monolithic layer.
4. The flexible packaging cover of claim 3, wherein at least one of the first functional structures is located inside the first hardened layer.
5. The flexible packaging cover of claim 1, wherein the ink layer is a ring-shaped structure surrounding the edge of the flexible packaging cover.
6. The flexible packaging cover of claim 1, wherein the ink layer is a ring-shaped structure surrounding the edge of the flexible packaging cover;
the part of the first functional structure, which exceeds the edge of the second hardened layer, is positioned inside the ink layer.
7. The flexible packaging cover of claim 1, wherein an edge of a portion of the second stiffening layer is located between the glue layer and the ink layer.
8. The flexible packaging cover according to any one of claims 1 to 7, further comprising:
an oleophobic layer on the side of the first hardened layer facing away from the substrate; or the like, or, alternatively,
the first hardened layer includes an oleophobic material.
9. The flexible packaging cover plate of any one of claims 1 to 7, wherein the difference between the refractive index of the first functional structure and the refractive index of the first hardened layer is less than 0.05.
10. The flexible packaging cover of claim 9, wherein the material of the first functional structure comprises one or more of glass fibers, carbon fibers, and steel fibers.
11. The flexible packaging cover plate of any one of claims 1 to 7, wherein the first functional structure comprises a plurality of first lines extending along a first direction and a plurality of second lines extending along a second direction;
the first direction is crosswise to the second direction;
the horizontal distance between two adjacent first lines is larger than or equal to 1 μm, and the horizontal distance between two adjacent second lines is larger than or equal to 1 μm.
12. The flexible packaging cover plate of any one of claims 1 to 7, wherein the thickness of the first functional structure is less than or equal to one third of the thickness of the first hardened layer.
13. A flexible display panel, comprising: a flexible substrate base plate, a flexible package cover plate according to any one of claims 1 to 12 disposed opposite to the substrate base plate.
14. A display device, comprising: the flexible display panel of claim 13.
15. A method for manufacturing a flexible packaging cover plate according to any one of claims 1 to 12, comprising:
forming a first hardened layer on the surface of the substrate;
forming at least one first functional structure inside the flexible encapsulating cover, wherein the first functional structure comprises a grid-like fiber structure;
the flexible packaging cover plate further comprises: the second hardened layer is positioned on one side, away from the first hardened layer, of the substrate, and the first functional structure exceeds the edge of the second hardened layer;
the manufacturing method further comprises the following steps:
forming an adhesive layer on one side of the substrate, which is far away from the first hardened layer, and enabling the part of the first functional structure, which exceeds the edge of the second hardened layer, to be positioned in the adhesive layer;
forming an ink layer surrounding the edge of the flexible packaging cover plate on one side of the adhesive layer, which is far away from the base material; and in the direction vertical to the plane of the substrate, the glue layer and the ink layer are mutually overlapped.
16. The method of manufacturing according to claim 15, wherein forming at least one first functional structure inside the flexible encapsulation cover comprises:
forming a first sub-film layer of the first hardened layer on the surface of the substrate;
forming the first functional structure over the first sub-film layer;
forming a second sub-film layer of the first hardened layer over the first functional structure;
and curing the first hardened layer.
17. The method of manufacturing according to claim 15, wherein forming at least one first functional structure inside the flexible encapsulation cover comprises:
forming a first sub-hardening layer of a second hardening layer on the surface of one side, away from the first hardening layer, of the substrate;
forming the first functional structure on one side of the first sub-hardened layer, which is far away from the substrate;
forming a second sub-hardened layer of the second hardened layer on one side of the first functional structure, which is far away from the substrate;
and curing the second hardened layer.
18. The method of claim 17, wherein the first functional structure is located inside the second hardened layer;
the manufacturing method further comprises the following steps:
and forming an ink layer surrounding the edge of the flexible packaging cover plate on one side of the second hardened layer, which is far away from the substrate.
19. The method of claim 17, wherein the first functional structure extends beyond an edge of the second hardened layer;
the manufacturing method further comprises the following steps:
the substrate deviates from one side of first sclerosis layer forms and centers on the printing ink layer at flexible encapsulation apron edge, and makes first functional structure surpasss the part at second sclerosis layer edge is located inside the printing ink layer.
20. The method of claim 17, wherein the first functional structure extends beyond an edge of the first sub-hardened layer, and the first functional structure does not extend beyond an edge of the second sub-hardened layer;
the first sub-hardened layer deviates from one side of the substrate forms after the first functional structure deviates from one side of the substrate forms before the second sub-hardened layer of the second hardened layer, the method further comprises:
forming an adhesive layer on one side of the substrate, which is far away from the first hardened layer, and enabling the part of the first functional structure, which exceeds the edge of the first sub-hardened layer, to be positioned in the adhesive layer;
after the curing of the second hardened layer, the method further includes:
and forming an ink layer surrounding the edge of the flexible packaging cover plate on one side of the second hardened layer, which is far away from the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768204.2A CN110518144B (en) | 2019-08-20 | 2019-08-20 | Flexible packaging cover plate, manufacturing method thereof, flexible display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910768204.2A CN110518144B (en) | 2019-08-20 | 2019-08-20 | Flexible packaging cover plate, manufacturing method thereof, flexible display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110518144A CN110518144A (en) | 2019-11-29 |
| CN110518144B true CN110518144B (en) | 2021-10-15 |
Family
ID=68626769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910768204.2A Active CN110518144B (en) | 2019-08-20 | 2019-08-20 | Flexible packaging cover plate, manufacturing method thereof, flexible display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110518144B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111697158A (en) * | 2020-05-29 | 2020-09-22 | 云谷（固安）科技有限公司 | Display panel and manufacturing method thereof |
| CN114360386B (en) * | 2022-01-28 | 2024-05-14 | 合肥维信诺科技有限公司 | Flexible cover plate and display device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438711C (en) * | 2001-03-30 | 2008-11-26 | 三洋电机株式会社 | Field luminescent device with impact buffer function and sealing component used in it |
| JP2010050173A (en) * | 2008-08-20 | 2010-03-04 | Semiconductor Energy Lab Co Ltd | Light emitting device and electronic apparatus |
| JP2012227153A (en) * | 2012-07-10 | 2012-11-15 | Semiconductor Energy Lab Co Ltd | Light emitting device and method for manufacturing light emitting device |
| CN104409657A (en) * | 2014-12-01 | 2015-03-11 | 昆山国显光电有限公司 | Encapsulating cover plate and application thereof in organic electroluminescence device |
| CN105977398A (en) * | 2016-07-08 | 2016-09-28 | 京东方科技集团股份有限公司 | Package cover plate and preparation method thereof, and display apparatus |
| CN107415333A (en) * | 2017-07-17 | 2017-12-01 | 武汉华星光电半导体显示技术有限公司 | Cured film and preparation method thereof, flexible AMOLED display device |
| KR20180045573A (en) * | 2016-10-26 | 2018-05-04 | 한국과학기술원 | Organic light emitting diodes on fibers, producing method of the same and flexible devices comprising the same |
| JP2019031100A (en) * | 2018-11-01 | 2019-02-28 | 日東電工株式会社 | Laminate |
| CN109461826A (en) * | 2018-08-29 | 2019-03-12 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
| CN109659344A (en) * | 2018-12-17 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED-device |
| CN110085761A (en) * | 2019-04-04 | 2019-08-02 | 深圳市华星光电技术有限公司 | Encapsulation cover plate and the display panel for using the encapsulation cover plate |
-
2019
- 2019-08-20 CN CN201910768204.2A patent/CN110518144B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438711C (en) * | 2001-03-30 | 2008-11-26 | 三洋电机株式会社 | Field luminescent device with impact buffer function and sealing component used in it |
| JP2010050173A (en) * | 2008-08-20 | 2010-03-04 | Semiconductor Energy Lab Co Ltd | Light emitting device and electronic apparatus |
| JP2012227153A (en) * | 2012-07-10 | 2012-11-15 | Semiconductor Energy Lab Co Ltd | Light emitting device and method for manufacturing light emitting device |
| CN104409657A (en) * | 2014-12-01 | 2015-03-11 | 昆山国显光电有限公司 | Encapsulating cover plate and application thereof in organic electroluminescence device |
| CN105977398A (en) * | 2016-07-08 | 2016-09-28 | 京东方科技集团股份有限公司 | Package cover plate and preparation method thereof, and display apparatus |
| KR20180045573A (en) * | 2016-10-26 | 2018-05-04 | 한국과학기술원 | Organic light emitting diodes on fibers, producing method of the same and flexible devices comprising the same |
| CN107415333A (en) * | 2017-07-17 | 2017-12-01 | 武汉华星光电半导体显示技术有限公司 | Cured film and preparation method thereof, flexible AMOLED display device |
| CN109461826A (en) * | 2018-08-29 | 2019-03-12 | 云谷（固安）科技有限公司 | A kind of display panel and display device |
| JP2019031100A (en) * | 2018-11-01 | 2019-02-28 | 日東電工株式会社 | Laminate |
| CN109659344A (en) * | 2018-12-17 | 2019-04-19 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED-device |
| CN110085761A (en) * | 2019-04-04 | 2019-08-02 | 深圳市华星光电技术有限公司 | Encapsulation cover plate and the display panel for using the encapsulation cover plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110518144A (en) | 2019-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10949010B2 (en) | Display apparatus | |
| EP4020141B1 (en) | Flexible display device | |
| US11600799B2 (en) | Display device | |
| US10396304B2 (en) | Organic EL display device and liquid crystal display device | |
| US10748458B2 (en) | Flexible display device and method manufacturing the same | |
| CN206849868U (en) | A kind of organic EL display panel and display device | |
| US20190235658A1 (en) | Touch panel, touch display panel using same, and method for making same | |
| CN106876434B (en) | Organic light-emitting diode display panel, manufacturing method thereof and display device | |
| CN112037664B (en) | Cover plate and display panel display device | |
| CN210896333U (en) | Flexible cover plate and flexible display screen | |
| US20140139985A1 (en) | Environmental sensitive electronic device package | |
| TW201624080A (en) | Optical film and display device | |
| CN110518144B (en) | Flexible packaging cover plate, manufacturing method thereof, flexible display panel and display device | |
| TW201536559A (en) | Electronic device and attaching method of the elements thereof | |
| WO2021036088A1 (en) | Display panel and display apparatus | |
| CN112820200A (en) | Cover plate and display device | |
| CN110323262B (en) | Array substrate, display panel and display device | |
| US12167558B2 (en) | Cover plate for foldable display module, foldable display module and display device | |
| CN111490067A (en) | Flexible display panel and display device | |
| CN115083287A (en) | Display module and display device | |
| CN111354743A (en) | An organic light-emitting display panel and display device | |
| KR102535371B1 (en) | Cover substrate and display device comprising the same | |
| US12295249B2 (en) | Display device and method of providing the same | |
| CN114843421B (en) | Display panel and mobile terminal | |
| CN223067465U (en) | Display panel and display device including the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |