CN110516357B - Determination method of thermal parameters of gold ribbon flexible interconnection oriented to the electrical properties of microwave components - Google Patents

Abstract

The invention discloses a method for determining the thermal parameters of a gold ribbon flexible interconnection oriented to the electrical performance of a microwave component, which includes determining the geometric parameters, physical property parameters and electromagnetic transmission parameters of the gold ribbon flexible interconnection, and parameterizing the shape of the gold ribbon flexible interconnection; Gold ribbon flexible interconnection working conditions and ambient temperature load, establish the gold ribbon flexible interconnection structure-thermal deformation analysis model; determine the thermal deformation of the gold ribbon flexible interconnection morphological parameters, establish the gold ribbon flexible interconnection structure-electromagnetic analysis model; design the gold ribbon flexible interconnection Orthogonal test of morphological thermal deformation parameters and electrical performance indicators to calculate the thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection; determine the morphological thermal parameters and the thermal sensitivity of the morphological parameters of the gold ribbon flexible interconnection. This method can guide the design and optimization of microwave components considering the application environment, and improve the development quality of microwave products.

Description

Determination method of thermal parameters of gold ribbon flexible interconnection oriented to the electrical properties of microwave components

technical field

The invention belongs to the technical field of microwave radio frequency circuits, in particular to a method for determining the thermal parameters of a gold ribbon flexible interconnection oriented to the electrical performance of a microwave component, which can be used to guide the module interconnection design and the regulation of electromagnetic transmission performance in the microwave component.

Background technique

Modern information and electronic technology is developing rapidly. As the core of hardware technical support, microwave components and microwave circuits are widely used in high-precision fields such as deep space exploration, target tracking, interconnected communication and various space applications. The development of microwave electronic equipment is gradually showing the development trend of high reliability, integration, miniaturization and high speed, which makes the breakthrough in the development of high-quality microwave components an urgent need for the development of electronic equipment technology.

Flexible interconnection structures are often used in high-frequency active microwave components to connect circuits and modules. This structure not only achieves accurate signal transmission, but also has the effect of buffering itself and environmental loads, which significantly improves circuit reliability. However, the study found that with the increase of the signal transmission frequency, the influence of the interconnection shape change in the microwave component on the signal transmission performance increased sharply, and even caused the function of the microwave component to fail. When microwave electronic equipment is used in a large temperature change and extreme temperature environment, the flexible interconnection form is easily deformed by the influence of temperature load, which in turn affects signal transmission. The above makes the thermal deformation problem of circuit flexible interconnection in high-frequency microwave components a key factor that affects the performance of microwave components and restricts the development of microwave electronic equipment under extreme temperature conditions.

At present, there are few theoretical and technical studies on the influence of thermal deformation of flexible interconnection forms in microwave circuits and microwave components on signal transmission performance. Most of the research in engineering is based on manual experience and a large number of interconnected thermodynamic software simulations, resulting in high work costs, low efficiency and poor results. Therefore, according to the typical coaxial and microstrip interconnection structures in microwave components, this paper deeply studies the thermal parameter determination method of gold ribbon flexible interconnection oriented to the electrical performance of microwave components. The thermal-interconnected structure-electromagnetic analysis model of morphological features breaks through the identification of interconnected morphological thermal parameters and the thermal sensitivity calculation of morphological parameters. It provides theoretical guidance for engineering designers in terms of interconnect optimization design and thermal environment transmission performance regulation in microwave components. Improve the research and development level of high-frequency active microwave products to meet the high-performance service requirements of microwave electronic equipment in extreme temperature environments.

SUMMARY OF THE INVENTION

In view of the above problems, the present invention provides a method for determining the thermal parameters of a gold ribbon flexible interconnection oriented to the electrical properties of a microwave component, so as to quickly and accurately determine the morphological thermal parameters and morphological parameter thermal sensitivity of a gold ribbon flexible interconnection. Provide theoretical guidance for performance improvement and guarantee of electrical performance in complex environments.

The technical solution for realizing the purpose of the present invention is a method for determining the thermal parameters of a gold ribbon flexible interconnection oriented to the electrical performance of a microwave assembly, the method comprising the following steps:

(1) According to the specific requirements of the high-frequency microwave component interconnection, determine the geometric parameters and physical parameters of the gold ribbon flexible interconnection;

(2) According to the interconnection conditions and performance indicators of the microwave components, determine the electromagnetic transmission parameters of the flexible interconnection of gold ribbons in the microwave components;

(3) According to the investigation of the interconnection pattern of microwave components and the actual engineering, carry out parametric characterization of the flexible interconnection pattern of the gold ribbon;

(4) According to the working requirements and working conditions of the microwave components, determine the working conditions and ambient temperature load of the flexible interconnection of the gold ribbon of the microwave components;

(5) According to the determined geometric parameters, thermophysical parameters, morphological parameter characterization and working environment conditions of the gold ribbon flexible interconnection in the microwave component, a gold ribbon flexible interconnection structure-thermal deformation analysis model is established;

(6) According to the established gold ribbon flexible interconnection structure-thermal deformation analysis model, use Ansys to analyze and solve the thermal deformation of the morphological parameters of the gold ribbon flexible interconnection;

(7) According to the geometric and physical parameters of the interconnection, the parametric characterization of the shape and the electromagnetic transmission parameters, a gold ribbon flexible interconnection structure-electromagnetic analysis model with thermal deformation parameters as variable control parameters is established;

(8) According to the morphological parameters and electrical performance evaluation indexes of gold ribbon flexible interconnection in microwave components, determine the factors, levels and indexes, and design the orthogonal test of the morphological thermal deformation parameters and electrical performance indexes of gold ribbon flexible interconnection;

(9) Calculate the thermal influence degree of the morphological parameters of the flexible interconnection of the gold ribbon according to the variance analysis of the orthogonal test results;

(10) According to the thermal influence degree of the morphological parameter of the flexible interconnection of the gold ribbon, determine the morphological thermal parameter of the flexible interconnection of the gold ribbon and calculate the thermal sensitivity of the morphological parameter.

Further, in step (1), the geometric parameters of the gold ribbon flexible interconnection in the microwave assembly are determined including: gold ribbon width B, gold ribbon thickness T, gold ribbon horizontal segment length L ₁ , gold ribbon half span P, gold ribbon microstrip bond Bonding length b ₄ , coaxial bonding angle θ of the gold ribbon, distance b ₂ from the end of the gold ribbon to the dielectric substrate, length L _c of the inner conductor, diameter d ₁ of the inner conductor, distance b ₃ from the end of the inner conductor to the gold ribbon, drop g , insulating medium length b ₁ , insulating medium diameter d ₂ , conductor strip length L _m , conductor strip width W _m , conductor strip thickness H ₁ , dielectric substrate length L _s , dielectric substrate width W _s , dielectric substrate thickness h ₂ and the module gap S;

Determining electromagnetic characteristic parameters includes: dielectric constant ε _s of dielectric substrate, dielectric substrate loss tangent θ _s , dielectric constant of glass ε _g and glass dielectric loss tangent θ _g .

Determining thermophysical parameters including: dielectric substrate, conductor strip, gold strip, inner conductor and insulating medium thermophysical parameters, said dielectric substrate, conductor strip, gold strip, inner conductor and insulating medium thermophysical parameters include elastic modulus E , thermal expansion coefficient α and Poisson's ratio μ.

Further, in step (2), it is determined that the electromagnetic transmission parameters of the gold ribbon flexible interconnection in the microwave assembly include: signal transmission frequency f, return loss S ₁₁ and insertion loss S ₂₁ .

Further, in the step (3), the parametric characterization of the flexible interconnection form of the gold ribbon is performed according to the following steps:

(3a) According to the analysis of the morphological characteristics of the flexible interconnection of the gold ribbon, the interconnection morphology is divided into four regions, namely: the gold ribbon coaxial bonding area, the gold ribbon microstrip bonding area, the left non-bonding area and the right non-bonding area. bond area. Since the flexible interconnection of gold ribbons has a symmetrical structure, the left half is selected for parametric characterization;

(3b) According to the analysis of the morphological characteristics of the left half of the flexible interconnection of the gold ribbon, a Cartesian Cartesian coordinate system is established, and the flexible interconnection of the gold ribbon is divided into five segments: AB arc segment, BC straight segment, CD upper parabolic segment, and DE lower parabolic segment and EF straight line segment, respectively, perform piecewise function characterization;

(3c) According to the analysis of the morphological characteristics of the flexible interconnection of the gold ribbon, the flexible interconnection of the gold ribbon is divided into 5 segments for piecewise function characterization, including the characterization function of the AB arc segment for the coaxial bonding of the gold ribbon, and the non-bonding on the left side of the gold ribbon. The characterization function of the straight line segment BC in the upper part of the gold ribbon, the characterization function of the upper parabolic segment of the non-bonding region CD on the left side of the gold ribbon, the characterization function of the parabolic segment characterization function of the left non-bonding region DE of the gold ribbon, and the characterization function of the EF straight line segment of the bonding region of the gold ribbon microstrip .

Further, in step (4), the working conditions and ambient temperature load of the gold ribbon flexible interconnection are determined, and according to the working requirements and working conditions of the microwave components, the working conditions of the gold ribbon flexible interconnection of the microwave components are determined as extreme temperature and large temperature change environment. When the thermal analysis load is applied, the thermal shock temperature range is set to be T _min ~ T _max , the temperature rise and fall rate is T _c , and the high and low temperature peak holding times are both t _k , and the temperature cycle period is determined.

When conducting gold ribbon flexible interconnect structure-thermal deformation analysis, in order to traverse each temperature process, two cycles of temperature load are applied to the interconnect structure.

Further, in the step (5), the establishment of the gold ribbon flexible interconnection structure-thermal deformation analysis model is carried out according to the following steps:

(5a) According to the geometric parameters and physical property parameters of the gold ribbon flexible interconnection of the microwave components determined in step (1), and the parametric characterization of the gold ribbon flexible interconnection form in step (3), establish a gold ribbon flexible interconnection in Ansys software. Structural-thermal deformation analysis model;

(5b) The established model includes an insulating medium, an inner conductor, a gold strip, a microstrip conductor and a dielectric substrate; according to the temperature load determined in step 4, an environmental load is applied to the gold strip flexible interconnect structure.

Further, in the described step (6), use Ansys to analyze and solve the thermal deformation of the morphological parameter of the flexible interconnection of the gold ribbon according to the following steps:

(6a) According to the actual engineering investigation, it is determined that the six main parameters affecting the flexible interconnection of gold ribbon are: drop g, distance b ₂ from the end of the gold ribbon to the dielectric substrate, distance b ₃ from the end of the inner conductor to the gold ribbon, Tape bond length b ₄ , module gap S and gold tape half span P;

(6b) According to the analysis results of Ansys for the flexible interconnection structure of gold ribbon-thermal deformation, it is specified that when the thermal deformation of the parameter size increases, the thermal deformation amount is a positive value, and when the thermal deformation of the parameter size decreases, the thermal deformation amount is a negative value. From this, the thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon in (6a) is determined;

(6c) Based on the thermal deformation formula, determine the size of the morphological parameters of the gold ribbon interconnection after thermal deformation.

Further, in step (7), the established gold ribbon flexible interconnect structure-electromagnetic analysis model includes an insulating medium, an inner conductor, a gold ribbon, a microstrip conductor and a dielectric substrate.

Further, in the step (8), determine the factors, levels and indicators, and design the orthogonal test of the thermal deformation parameters of the gold ribbon flexible interconnection shape and the electrical performance indicators according to the following steps:

(8a) According to the thermal deformation parameters of the interconnection shape and the amount of thermal deformation, select the values of 6 factors and 7 levels at equal intervals for the flexible interconnection shape of the gold ribbon considering the thermal deformation;

(8b) According to the electromagnetic transmission parameters of the gold ribbon flexible interconnection of the microwave component determined in step (2), determine that the electromagnetic transmission performance indicators of the gold ribbon flexible interconnection are return loss and insertion loss;

(8c) Design the orthogonal table L ₄₉ (7 ⁸ ) with 6 factors and 7 levels, and analyze and design the orthogonal test of thermal deformation parameters and electrical performance indicators of the flexible interconnection of gold ribbons combined with 3D electromagnetic full-wave simulation software.

Further, in the step (9), the calculation of the thermal influence degree of the morphological parameter of the flexible interconnection of the gold ribbon is performed according to the following steps:

(9a) According to the results of the variance analysis of the orthogonal test, calculate the normalized thermal influence degree of the morphological parameters of the flexible interconnection of the gold ribbon;

(9b) At the same time, considering the comprehensive electrical performance index of return loss S11 and insertion loss S21, calculate the thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection.

Further, in the described step (10), determine the morphological thermal parameters of the flexible interconnection of the gold ribbon and calculate the thermal sensitivity of the morphological parameters according to the following steps:

(10a) Determine the critical value F _α (f _j , f _e ) according to the parameter degree of freedom f _j and the error degree of freedom f _e , and combine the F distribution and α quantile, then calculate the normalization of the morphological parameters of the flexible interconnection of the gold ribbon critical heat impact degree;

(10b) Simultaneously face the comprehensive electrical performance index of return loss S11 and insertion loss S21, calculate the critical thermal influence degree of the morphological parameters of the flexible interconnection of gold ribbon;

及归一化临界热影响度

确定金带柔性互联形态热敏参数的判定准则为：(10c) Normalize the thermal influence degree according to the morphological parameters of the flexible interconnection of gold ribbons

and normalized critical thermal influence degree

The criterion for determining the thermal parameters of the flexible interconnection of gold ribbons is as follows:

(10d) According to the thermal influence degree of the morphological parameters of the flexible interconnection of the gold ribbon, and combined with the judgment criteria of the thermal parameters, the normalized thermal sensitivity of the interconnect morphological parameters is determined.

Compared with the prior art, the present invention has the following characteristics:

1. Aiming at the flexible interconnection structure of gold ribbons of microwave components, the present invention establishes a morphological parametric characterization model of flexible interconnection of gold ribbons oriented to electrical performance. Based on this characterization model, the relationship between the temperature load and the signal transmission performance of the flexible interconnection was studied, the morphological thermal parameters of the gold ribbon flexible interconnection were determined, and the thermal sensitivity of the interconnected morphological parameter was calculated. It solves the problem that the influence between the thermal deformation parameters of the flexible interconnection and the transmission performance of the microwave component under thermal load is unclear, and the direction of thermal optimization design is unclear.

2. Using the gold ribbon flexible interconnect thermal parameter determination method for the electrical properties of microwave components, the flexible interconnect morphological parameters can be quantitatively and accurately characterized in the process of microwave component design, manufacture and operation, and the flexible interconnect morphological thermal parameters can be quickly given. The thermal sensitivity of morphological parameters provides theoretical guidance for engineering designers in terms of module interconnection design and transmission performance regulation in microwave components under the influence of thermal environmental loads, improving work efficiency, reducing product development costs, and ensuring product service performance.

Description of drawings

1 is a flow chart of a method for determining a thermal parameter of a gold ribbon flexible interconnection oriented to the electrical properties of a microwave assembly of the present invention;

Fig. 2 is a schematic diagram of a parametric model of the flexible interconnection of gold ribbons considering thermal deformation;

Fig. 3 is a schematic diagram of the characterization of the flexible interconnection sub-sections of the gold ribbon;

Figure 4 is the temperature change load curve;

Figure 5 is the gold ribbon flexible interconnect structure-thermal deformation analysis model;

Figure 6 is a model of the flexible interconnection structure of gold ribbon-thermal deformation meshing;

Figure 7 is the total deformation of the gold ribbon flexible interconnection at the highest temperature;

Figure 8 is the total deformation of the gold ribbon flexible interconnection at the lowest temperature moment;

Figure 9 is a gold ribbon flexible interconnection structure-electromagnetic analysis model with thermal deformation parameters as variable control parameters;

Detailed ways

The present invention will be further described below with reference to the accompanying drawings and embodiments.

Referring to Fig. 1, the present invention is a method for determining the thermal parameters of a gold ribbon flexible interconnection oriented to the electrical performance of a microwave assembly, and the specific steps are as follows:

Step 1. Determine the geometric parameters and physical parameters of the flexible interconnection of gold ribbons in microwave components

Referring to FIG. 2, the flexible interconnection of gold ribbons in the high-frequency microwave assembly includes a grounding plate 1, a dielectric substrate 2 is connected on the upper layer of the grounding plate 1, and the conductor ribbons 3 connected on the dielectric substrate 2 are connected to the inner surface through the gold ribbons 6. The conductor 5 and the inner conductor 5 are connected to the insulating medium 4 . According to the specific requirements of the interconnection in the high-frequency microwave components, the geometric parameters and physical parameters of the gold ribbon interconnection in the microwave components are determined respectively.

The determined geometric parameters include: gold ribbon width B, gold ribbon thickness T, gold ribbon horizontal segment length L ₁ , gold ribbon half span P, gold ribbon microstrip bonding length b ₄ , gold ribbon coaxial bonding angle θ, gold ribbon The distance from the end of the tape to the dielectric substrate b ₂ , the length of the inner conductor L _c , the diameter of the inner conductor d ₁ , the distance from the end of the inner conductor to the gold tape b ₃ , the drop g, the length of the insulating medium b ₁ , the diameter of the insulating medium d ₂ , the conductor tape length L _m , conductor strip width W _m , conductor strip thickness H ₁ , dielectric substrate length L _s , dielectric substrate width W _s , dielectric substrate thickness h ₂ and module gap S;

Determining electromagnetic characteristic parameters includes: dielectric constant ε _s of dielectric substrate, dielectric substrate loss tangent θ _s , dielectric constant of glass ε _g and glass dielectric loss tangent θ _g ;

The determined thermophysical parameters include: dielectric substrate thermophysical parameters, conductor strip thermophysical parameters, gold strip thermophysical parameters, inner conductor thermophysical parameters and insulating medium thermophysical parameters. Specific thermophysical parameters of dielectric substrate, conductor strip, gold strip, inner conductor and insulating medium include elastic modulus E, thermal expansion coefficient α and Poisson's ratio μ.

Step 2: Determine the electromagnetic transmission parameters of the gold ribbon flexible interconnection in the microwave assembly

Determine the electromagnetic transmission parameters of the gold ribbon flexible interconnection in the microwave assembly, specifically including: signal transmission frequency f, return loss S ₁₁ and insertion loss S ₂₁ .

Step 3: Parametric characterization of the shape of the gold ribbon flexible interconnect structure

According to the investigation of the interconnection pattern of microwave components and the actual engineering, the segmental characterization of the flexible interconnection pattern of the gold ribbon is carried out. Referring to Figure 3, follow the steps below:

(3a) According to the analysis of the morphological characteristics of the flexible interconnection of the gold ribbon, the interconnection morphology is divided into four regions, namely: the gold ribbon coaxial bonding area, the gold ribbon microstrip bonding area, the left non-bonding area and the right non-bonding area. bond area. Due to the symmetric structure of the gold ribbon flexible interconnection, the left half is selected for parametric characterization.

(3b) According to the analysis of the morphological characteristics of the left half of the flexible interconnection of the gold ribbon, a Cartesian Cartesian coordinate system is established, and the flexible interconnection of the gold ribbon is divided into five segments: AB arc segment, BC straight segment, CD upper parabolic segment, and DE lower parabolic segment and EF straight line segment, respectively perform piecewise function characterization; let the intermediate variable:

(3c) According to the analysis of the morphological characteristics of the flexible interconnection of the gold ribbon, the flexible interconnection of the gold ribbon is divided into 5 segments for piecewise function characterization, wherein the characterization function of the AB arc segment of the coaxial bonding of the gold ribbon is:

The characterization function of the upper BC straight line segment of the non-bonding region on the left side of the gold ribbon is:

The characterization function of the parabolic segment on the non-bonded region CD on the left side of the gold ribbon is:

The characterization function of the parabolic segment under the non-bonding region DE on the left side of the gold ribbon is:

The characterization function of the EF straight line segment of the gold ribbon microstrip bonding area is:

Step 4: Determine the working conditions and ambient temperature load of the gold ribbon flexible interconnection of microwave components

According to the working requirements and working conditions of the microwave components, referring to Fig. 4, the working conditions of the flexible interconnection of the gold ribbons of the microwave components are determined to be extreme temperature and a large temperature change environment; when the thermal analysis load is applied, the thermal shock temperature change range is set to be T _min ~ T _max , the heating and cooling rate is T _c , and the high and low temperature peak holding times are both t _k , then the temperature cycle Cy is:

When conducting gold ribbon flexible interconnect structure-thermal deformation analysis, in order to traverse each temperature process, two cycles of temperature load are applied to the interconnect structure.

Step 5, establish the gold ribbon flexible interconnect structure-thermal deformation analysis model

According to the determined geometric parameters, thermophysical parameters, morphological parameterization and working environment conditions of the gold ribbon flexible interconnection in the microwave component, a gold ribbon flexible interconnection structure-thermal deformation analysis model is established. Referring to Figure 5 and Figure 6, follow the steps below:

(5a) According to the geometric parameters and physical property parameters of the gold ribbon flexible interconnection of the microwave components determined in step (1), and the parametric characterization of the gold ribbon flexible interconnection form in step (3), establish a gold ribbon flexible interconnection in Ansys software. Structural-thermal deformation analysis model;

(5b) The established model includes insulating medium, inner conductor, gold strip, microstrip conductor and dielectric substrate; according to the temperature load determined in step 4, environmental load is applied to the flexible interconnection structure of gold strip.

Step 6, use Ansys to analyze and solve the thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon

According to the established gold ribbon flexible interconnection structure-thermal deformation analysis model, use Ansys to analyze and solve the thermal deformation of the morphological parameters of the gold ribbon flexible interconnection. Referring to Figure 7 and Figure 8, follow the steps below:

(6a) According to the actual engineering investigation, it is determined that the six main parameters affecting the flexible interconnection of gold ribbon are: drop g, distance b ₂ from the end of the gold ribbon to the dielectric substrate, distance b ₃ from the end of the inner conductor to the gold ribbon, Tape bond length b ₄ , module gap S and gold tape half span P;

(6b) According to the analysis results of the flexible interconnection structure of gold ribbon-thermal deformation by Ansys, it is specified that when the thermal deformation of the parameter size increases, the thermal deformation amount is a positive value, and when the thermal deformation of the parameter size decreases, the thermal deformation amount is a negative value; The thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon in (6a) is determined as:

Part _t = (g _t , b _2t , b _3t , b _4t , S _t , P _t ), Part _t ∈ [par _min -par ₀ ,par _max -par ₀ ]

Among them, Par _t represents the parameter thermal deformation vector; g _t is the thermal deformation of the drop, b _2t is the thermal deformation of the gold strip from the end of the dielectric substrate, b _3t is the thermal deformation of the distance from the end of the inner conductor to the gold strip, b _4t is the thermal deformation of the gold ribbon microstrip bonding length, S _t is the thermal deformation of the module gap, and P _t is the thermal deformation of the gold ribbon half-span;

Par _min =(g _min ,(b ₂ ) _min ,(b ₃ ) _min ,(b ₄ ) _min ,S _min ,P _min ) represents the minimum size vector after parameter thermal deformation;

Among them, g _min is the minimum value of the drop after thermal deformation, (b ₂ ) _min is the minimum value of the distance from the end of the gold strip to the dielectric substrate after thermal deformation, and (b ₃ ) _min is the minimum distance from the end of the inner conductor to the gold ribbon after thermal deformation (b ₄ ) _min is the minimum value after thermal deformation of the bonding length of the gold ribbon microstrip, S _min is the minimum value after thermal deformation of the module gap, and P _min is the minimum value after thermal deformation of the gold ribbon half-span;

Par ₀ =(g ₀ ,b ₂₀ ,b ₃₀ ,b ₄₀ ,S ₀ ,P ₀ ) represents the parameter initial value vector,

Among them, g ₀ is the initial value of the drop, b ₂₀ is the initial value of the distance from the end of the gold strip to the dielectric substrate, b ₃₀ is the initial value of the distance from the end of the inner conductor to the gold strip, b ₄₀ is the initial value of the bonding length of the gold strip and microstrip, S ₀ is the initial value of the module gap, and P ₀ is the initial value of the half span of the gold belt;

Par _max =(g _max ,(b ₂ ) _max ,(b ₃ ) _max ,(b ₄ ) _max ,S _max ,P _max ) represents the vector of the maximum size of the parameter after thermal deformation;

Among them, g _max is the maximum value after thermal deformation of the drop, (b ₂ ) _max is the maximum value of the distance from the end of the gold strip to the dielectric substrate after thermal deformation, and (b ₃ ) _max is the maximum distance from the end of the inner conductor to the gold strip after thermal deformation value, (b ₄ ) _max is the maximum value after thermal deformation of the bonding length of the gold ribbon microstrip, S _max is the maximum value after thermal deformation of the module gap, and P _max is the maximum value after thermal deformation of the gold ribbon half-span;

(6c) Based on the thermal deformation formula, the size vector of the gold ribbon interconnection shape parameters after thermal deformation is determined as:

Par=Par ₀ +Par _t =(g ₀ +g _t , b ₂₀ +b _2t , b ₃₀ +b _3t , b ₄₀ +b _4t , S ₀ +S _t , P ₀ +P _t ).

Step 7: Establish a flexible interconnection structure-electromagnetic analysis model with thermal deformation parameters as variable control parameters

According to the geometric and physical parameters of the interconnection, the morphological parameterization characterization and the electromagnetic transmission parameters, a gold ribbon flexible interconnection structure-electromagnetic analysis model with thermal deformation parameters as variable control parameters is established, referring to FIG. The geometric parameters and physical parameters of the flexible interconnection of the gold ribbon of the component, and the electromagnetic transmission parameters of the flexible interconnection of the gold ribbon of the microwave component determined in the step (2), and the parametric characterization of the flexible interconnection of the gold ribbon in the step (3), and the step ( The morphological parameters of the gold ribbon interconnection after thermal deformation determined in 6), the gold ribbon flexible interconnection structure-electromagnetic analysis model was established in the three-dimensional electromagnetic full-wave simulation analysis software. It is composed of components such as conductors and dielectric substrates.

Step 8: Determine the factors, levels and indicators, and design the orthogonal test of the thermal deformation parameters and electrical performance indicators of the flexible interconnection of gold ribbons

According to the morphological parameters and electrical performance evaluation indexes of gold ribbon flexible interconnection in microwave components, determine the factors, levels and indexes, and design the orthogonal test of thermal deformation parameters and electrical performance indexes of gold ribbon flexible interconnection morphological parameters, and carry out according to the following steps:

(8a) According to the thermal deformation parameters of the interconnection shape and the amount of thermal deformation, for the flexible interconnection shape of gold ribbons considering thermal deformation, the values of 6 factors and 7 levels at equal intervals are:

Among them, (g ₀ +g _t ) _v1 ~ (g ₀ +g _t ) _v7 is the level value of 7 for the drop, and (b ₂₀ +b _2t ) _v1 ~ (b ₂₀ +b _2t ) _v7 is the gold band to the end of the dielectric substrate The distance from the inner conductor to the gold belt is taken as a horizontal value of 7, (b ₃₀ +b _3t ) _v1 ~ (b ₃₀ +b _3t ) _v7 is a horizontal value of 7 for the distance from the end of the inner conductor to the gold belt, (b ₄₀ +b _4t ) _v1 ~ (b ₄₀ +b _4t ) _v7 is the gold-strip microstrip bonding length and takes 7 levels, (S ₀ +S _t ) _v1 ~ (S ₀ +S _t ) _v7 is the module gap and takes 7 levels, (P ₀ +P _t ) _v1 ~ (P ₀ +P _t ) _v7 is the horizontal value of 7 for the half span of the gold belt.

The formula for calculating the factor levels in the table is:

In the formula, m is the number of levels;

(8b) According to the electromagnetic transmission parameters of the gold ribbon flexible interconnection of the microwave component determined in step (2), determine the electromagnetic transmission performance indicators of the gold ribbon flexible interconnection as return loss and insertion loss:

Ind = [S11 S21];

(8c) Design the orthogonal table L ₄₉ (7 ⁸ ) with 6 factors and 7 levels, and analyze and design the orthogonal test of thermal deformation parameters and electrical performance indicators of the flexible interconnection of gold ribbons combined with 3D electromagnetic full-wave simulation software.

Step 9: Calculate the influence degree of the morphological parameters of the flexible interconnection of the gold ribbon

Carry out variance analysis according to the orthogonal test results to calculate the influence degree of the morphological parameters of the flexible interconnection of the gold ribbon, and proceed according to the following steps:

(9a) According to the results of the variance analysis of the orthogonal test, the normalized thermal influence degree Eff _j of the morphological parameters of the flexible interconnection of the gold ribbon is calculated as:

In the above formula, F _j is the ratio of the average sum of variance of the index corresponding to the jth parameter to the average sum of variance of errors;

为：(9b) Simultaneously facing the comprehensive electrical performance indicators of return loss S11 and insertion loss S21, calculate the thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection

for:

为面向回波损耗指标S11的金带柔性互联形态参数热影响度，Eff^S21为面向插入损耗指标S21的金带柔性互联形态参数热影响度，w₁和w₂分别为对应热影响度的权系数。In the formula,

is the thermal influence degree of the morphological parameter of the gold ribbon flexible interconnection oriented to the return loss index S11, Eff ^S21 is the thermal influence degree of the morphological parameter of the gold ribbon flexible interconnection oriented to the insertion loss index S21, w ₁ and w ₂ are the weights corresponding to the thermal influence degree, respectively coefficient.

Step 10: Determine the shape thermal parameters of the flexible interconnection of the gold ribbon and calculate the thermal sensitivity of the shape parameters

According to the thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection, determine the morphological thermal parameters of the gold ribbon flexible interconnection and calculate the thermal sensitivity of the morphological parameters. Follow the steps below:

(10a) Determine the critical value F _α (f _j , f _e ) according to the parameter degree of freedom f _j and the error degree of freedom f _e , and combine the F distribution and α quantile, then calculate the normalization of the morphological parameters of the flexible interconnection of the gold ribbon The critical heat influence degree Eff _jα is:

为：(10b) Simultaneously facing the comprehensive electrical performance indicators of return loss S11 and insertion loss S21, calculate the critical thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection

for:

为面向回波损耗指标S11的金带柔性互联形态参数临界热影响度，

为面向插入损耗指标S21的金带柔性互联形态参数临界热影响度；In the formula,

is the critical thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection oriented to the return loss index S11,

is the critical thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection oriented to the insertion loss index S21;

及归一化临界热影响度

确定金带柔性互联形态热敏参数的判定准则为：(10c) Normalize the thermal influence degree according to the morphological parameters of the flexible interconnection of gold ribbons

and normalized critical thermal influence degree

The criterion for determining the thermal parameters of the flexible interconnection of gold ribbons is as follows:

(10d) According to the thermal influence degree of the morphological parameters of the flexible interconnection of the gold ribbon, and combined with the thermal parameter judgment criteria, the normalized thermal sensitivity of the interconnected morphological parameters is determined as:

The advantages of the present invention can be further illustrated by the following example calculations:

1. Determine the geometric parameters and physical parameters of the flexible interconnection of gold ribbons

In this experiment, the Ku-band active phased array antenna T/R component is taken as an example to study the influence of the thermal deformation of the interconnect shape on the microwave transmission performance of the circuit when the flexible interconnect structure in the T/R component is affected by the thermal environment load, and to explore the microwave transmission performance. Interconnected morphological thermal parameters of performance transmission and methods for determining thermal sensitivities of morphological parameters. In order to simplify the analysis, the typical coaxial circuit and microstrip circuit conversion structure in T/R components are selected to explore the shape correlation mechanism of gold ribbon flexible interconnection affected by thermal load. The schematic diagram of the parametric model of the gold ribbon flexible interconnection considering thermal deformation is shown in Figure 2. The geometric parameters and physical parameters of the gold ribbon flexible interconnection are shown in Tables 1 and 2, and the electromagnetic operating center frequency of the T/R component is taken as 15GHz.

Table 1 Geometric parameters and physical parameters of gold ribbon flexible interconnection

Table 2 Thermophysical parameters of gold ribbon flexible interconnection

2. Calculate and solve the thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon

1. Determine the working conditions and ambient temperature load of the gold ribbon flexible interconnection

The working conditions of T/R component gold ribbon flexible interconnection are extreme temperature and large temperature change environment. Referring to Figure 4, when the thermal analysis load is applied, the thermal shock temperature change range is set to -180°C to +150°C, the temperature rise and fall rate is 66°C/s, the high and low temperature peak holding times are both 900s, and the temperature cycle period is 1810s, the temperature load is applied for 2 cycles.

2. Establish a gold ribbon flexible interconnect structure-thermal deformation analysis model

According to the geometric parameters, physical parameters, and the parametric characterization of the interconnection shape of the gold ribbon flexible interconnection of the T/R component, the gold ribbon flexible interconnection structure-thermal deformation analysis model is established in Ansys software, as shown in Figure 5 and Figure 6. The established model consists of insulating medium, inner conductor, gold strip, microstrip conductor and dielectric substrate components. The ambient temperature load is applied to the gold ribbon flexible interconnect structure as shown in Figure 4.

3. Analyze and calculate the thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon;

Ansys software is used to analyze the thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon, and the thermal deformation of each parameter of the flexible interconnection of the gold ribbon is calculated separately according to the calculation formula of the thermal deformation of the parameters. Determine the thermal deformation range of the interconnect characterization parameters as shown in Table 3 below.

Table 3 The key characterization parameters of the gold ribbon interconnection morphology when the temperature load is applied at -180 ~ 150 ℃ thermal deformation

3. Determine the thermal parameters of the flexible interconnection of the gold ribbon and calculate the thermal sensitivity of the morphological parameters

1. Establish a gold ribbon flexible interconnection structure-electromagnetic analysis model with thermal deformation parameters as variable control parameters

According to the determined geometric parameters, physical parameters, morphological parameters and electromagnetic transmission parameters of the gold ribbon flexible interconnection in the T/R component, a gold ribbon flexible interconnection with thermal deformation parameters as variable control parameters is established in the three-dimensional electromagnetic full-wave simulation analysis software. The structure-electromagnetic analysis model is shown in Figure 9. The established model is composed of insulating medium, inner conductor, gold strip, microstrip conductor and dielectric substrate.

2. Orthogonal test of thermal deformation parameters and electrical performance indexes of gold ribbon flexible interconnection shape

(1) Determine the design variables, initial design value and design space of the flexible interconnection of the gold ribbon

According to the investigation of the interconnection form of microwave components and the actual engineering, and combined with the thermal deformation of the morphological parameters of the flexible interconnection of the gold ribbon, the design variables, initial design values and design space corresponding to the six control factors of the flexible interconnection form of the gold ribbon are determined as shown in Table 4 below.

Table 4 Design variables and design space of gold ribbon flexible interconnection

(2) Select orthogonal test factors, levels and indicators to design orthogonal test

For the flexible interconnection form of gold ribbons, according to the design space, the values of 6 factors and 7 levels of equal spacing are selected, and the orthogonal table L ₄₉ (7 ⁸ ) of 6 factors and 7 levels is designed, and the return loss and insertion loss are used as electromagnetic transmission performance indicators. The wave simulation software analyzes and designs the orthogonal test of the morphological parameters of the gold ribbon flexible interconnection and the electromagnetic transmission performance index.

3. Calculate the thermal influence degree of the morphological parameters of the flexible interconnection of the gold ribbon

According to the results of the variance analysis of the orthogonal test, the calculation results of the thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection oriented to the return loss index S11 are as follows:

The calculation results of the thermal influence degree analysis of the morphological parameters of the flexible interconnection of gold ribbons oriented to the insertion loss index S21 are:

The weight coefficients of the thermal influence degree are taken as w ₁ =w ₂ =0.5 respectively, so for the comprehensive electrical performance index of return loss S11 and insertion loss S21 at the same time, the thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection is:

4. Determine the morphological thermal parameters of the gold ribbon flexible interconnection and calculate the thermal sensitivity of the morphological parameters

The critical value F _α (f _j , f _e ) is determined according to the parameter degree of freedom f _j and the error degree of freedom f _e , combined with the F distribution and the α quantile, and the flexible interconnection shape of the gold ribbon oriented to the return loss index S11 is calculated. The parameter critical heat influence degree is:

The critical thermal influence degree of the gold ribbon flexible interconnection morphological parameters for the insertion loss index S21 is calculated as:

Therefore, for the comprehensive electrical performance index of return loss S11 and insertion loss S21 at the same time, the critical thermal influence degree of the morphological parameters of the gold ribbon flexible interconnection is:

Calculated according to the criteria for determining the thermal parameters of the flexible interconnection of gold ribbons:

Then, the thermal parameters of the gold ribbon flexible interconnection form for comprehensive electrical properties are determined as:

Par _c =[b ₂ b ₄ SP]

According to the normalized thermal sensitivity calculation formula of the morphological parameters of the flexible interconnection of gold ribbons, the thermal sensitivity is calculated as:

RSen _j = [0 0.2148 0 0.2455 0.2378 0.3019].

The present invention is not limited to the above-mentioned embodiments. On the basis of the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some of the technical features according to the disclosed technical contents without creative work. Modifications, replacements and modifications are all within the protection scope of the present invention.

Claims (10)

1. A method for determining gold belt flexible interconnection thermosensitive parameters for electric properties of a microwave assembly is characterized by comprising the following steps:

(1) determining the flexible interconnection geometric parameters and thermophysical parameters of the gold belt according to the specific interconnection requirements of the high-frequency microwave assembly;

(2) determining flexible interconnection electromagnetic transmission parameters of the gold strips in the microwave assembly according to the interconnection working conditions and the performance indexes of the microwave assembly;

(3) carrying out parametric characterization on the flexible interconnection form of the gold belt according to the interconnection form of the microwave assembly and the actual research of engineering;

the method comprises the following steps:

(3a) according to the characteristic analysis of the flexible interconnection form of the gold belt, the interconnection form is divided into four regions which are respectively: the gold strip coaxial bonding region, the gold strip micro-strip bonding region, the left non-bonding region and the right non-bonding region; because the flexible interconnection of the gold strips has a symmetrical structure, the left half is selected for parametric representation;

(3b) according to morphological feature analysis of the left half side of the flexible interconnection of the gold strips, a Cartesian rectangular coordinate system is established, and the flexible interconnection of the gold strips is divided into 5 sections: respectively carrying out piecewise function representation on an AB arc segment, a BC straight-line segment, a CD upper parabolic segment, a DE lower parabolic segment and an EF straight-line segment;

(3c) according to characteristic analysis of the flexible interconnection form of the gold ribbon, dividing the flexible interconnection form of the gold ribbon into 5 sections for performing piecewise function representation, wherein the piecewise function representation comprises an AB arc section representation function of coaxial bonding of the gold ribbon, a BC straight section representation function of the upper part of a left non-bonding area of the gold ribbon, a parabolic section representation function on a CD of the left non-bonding area of the gold ribbon, a parabolic section representation function under a DE of the left non-bonding area of the gold ribbon and an EF representation function of the straight section of the micro-strip bonding area of the gold ribbon;

(4) determining the flexible interconnection working condition of the gold belt of the microwave assembly and the environmental temperature load according to the working requirement and working condition of the microwave assembly;

(5) establishing a gold belt flexible interconnection structure-thermal deformation analysis model according to the determined gold belt flexible interconnection geometric parameters, thermophysical parameters, morphological parametric characterization and working environment conditions in the microwave assembly;

(6) according to the established gold belt flexible interconnection structure-thermal deformation analysis model, solving the thermal deformation quantity of the gold belt flexible interconnection form parameter by using Ansys analysis;

(7) establishing a gold belt flexible interconnection structure-electromagnetic analysis model taking thermal deformation parameters as variable regulation parameters according to interconnection geometry and thermophysical parameters, morphological parametric characterization and electromagnetic transmission parameters;

(8) determining factors, levels and indexes according to the gold strip flexible interconnection form parameters and the electrical performance evaluation indexes in the microwave assembly, and designing an orthogonal test of the gold strip flexible interconnection form thermal deformation parameters and the electrical performance indexes;

(9) calculating the heat influence degree of the gold belt flexible interconnection form parameter according to the analysis of the variance of the orthogonal test result;

(10) and determining the thermal sensitivity of the gold belt flexible interconnection form parameters and calculating the thermal sensitivity of the form parameters according to the thermal influence degree of the gold belt flexible interconnection form parameters.

2. The method for determining gold ribbon flexible interconnection thermal sensitive parameters of microwave module electrical performance according to claim 1, wherein in the steps (1) and (2), determining the gold ribbon flexible interconnection geometric parameters comprises: width B of gold belt, thickness T of gold belt and length L of horizontal section of gold belt₁Gold belt half span P, gold belt micro-strip bonding length b₄The coaxial bonding angle theta of the gold strip, the distance b from the gold strip to the end of the dielectric substrate₂Length L of inner conductor_cInner conductor diameter d₁Distance b from the end of the inner conductor to the gold strip₃A step g and an insulating medium length b₁Diameter d of insulating medium₂Length L of conductor strip_mWidth W of the conductor strip_mThickness H of the conductor strip₁And a mediumSubstrate length L_sWidth W of the dielectric substrate_sDielectric substrate thickness h₂And a module gap S;

determining the electromagnetic transmission parameter comprises: dielectric constant of dielectric substrate_sDielectric substrate loss tangent theta_sDielectric constant of glass_gAnd glass dielectric loss tangent theta_g；

The thermophysical parameters include: the thermophysical parameters of the dielectric substrate, the conductor strip, the gold strip, the inner conductor and the insulating medium; the thermophysical parameters of the dielectric substrate, the conductor strip, the gold strip, the inner conductor and the insulating medium comprise an elastic modulus E, a thermal expansion coefficient alpha and a Poisson ratio mu;

in the step (2), the flexible interconnection electromagnetic transmission parameters of the gold band in the microwave assembly include: signal transmission frequency f, return loss S₁₁And insertion loss S₂₁。

3. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 2, wherein the step (3) is performed as follows:

(3a) according to the characteristic analysis of the flexible interconnection form of the gold belt, the interconnection form is divided into four regions which are respectively: the gold strip coaxial bonding region, the gold strip micro-strip bonding region, the left non-bonding region and the right non-bonding region; because the flexible interconnection of the gold strips has a symmetrical structure, the left half is selected for parametric representation;

(3b) according to morphological feature analysis of the left half side of the flexible interconnection of the gold strips, a Cartesian rectangular coordinate system is established, and the flexible interconnection of the gold strips is divided into 5 sections: respectively carrying out piecewise function representation on an AB arc segment, a BC straight-line segment, a CD upper parabolic segment, a DE lower parabolic segment and an EF straight-line segment; let the intermediate variable:

(3c) according to the characteristic analysis of the flexible interconnection form of the gold belt, dividing the flexible interconnection form of the gold belt into 5 sections for performing piecewise function representation, wherein the representation function of the AB arc section of the coaxial bonding of the gold belt is as follows:

the characterization function of the BC straight line segment at the upper part of the left non-bonding area of the gold strip is as follows:

the characterization function of the parabolic segment on the left non-bonding region CD of the gold band is:

the parabolic section characterization function under the left non-bonding region DE of the gold strip is:

the characterization function of the EF straight line segment of the gold-strip microstrip bonding region is as follows:

4. the method for determining gold ribbon flexible interconnection thermosensitive parameters for microwave assembly electrical performance according to claim 1, wherein the step (4) determines the microwave assembly gold ribbon flexible interconnection working conditions to be extreme temperature and large temperature change environment according to the microwave assembly working requirements and working conditions; when a thermal analysis load is applied, the thermal shock temperature change range is set to T_min～T_maxThe temperature rise and fall rate is T_cThe peak holding times of high and low temperature are t_kThe temperature cycle period Cy is then:

when the thermal deformation analysis of the gold-strip flexible interconnection structure is carried out, in order to traverse each temperature process, a temperature load of 2 periods is applied to the interconnection structure.

5. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 1, wherein the step (5) is performed as follows:

(5a) establishing a gold belt flexible interconnection structure-thermal deformation analysis model in Ansys software according to the microwave assembly gold belt flexible interconnection geometric parameters and physical parameters determined in the step (1) and the parameterized representation of the gold belt flexible interconnection form in the step (3);

(5b) the established model comprises an insulating medium, an inner conductor, a gold strip, a microstrip conductor and a medium substrate; and (4) applying an environmental load to the gold strip flexible interconnection structure according to the temperature load determined in the step (4).

6. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 2, wherein the step (6) is performed as follows:

(6a) according to the actual research of engineering, 6 main parameters influencing the flexible interconnection form of the gold strip are determined as follows: drop g, distance b from gold strip to end of dielectric substrate₂Distance b from the end of the inner conductor to the gold strip₃Gold strip microstrip bonding length b₄Module spacing S and gold band half span P;

(6b) according to Ansys, the analysis and solving result of the thermal deformation of the flexible interconnected structure of the gold belt is determined, and when the thermal deformation of the parameter size is increased, the thermal deformation amount is a positive value, and when the thermal deformation of the parameter size is decreased, the thermal deformation amount is a negative value; thus, determining the flexible interconnection form parameter thermal deformation of the gold belt in (6a) as:

Par_t＝(g_t,b_2t,b_3t,b_4t,S_t,P_t)，Par_t∈[par_min-par₀,par_max-par₀]

wherein, Par_tRepresenting a parametric heat distortion vector; g_tIs the amount of thermal deformation by the fall, b_2tThe amount of thermal deformation of the gold ribbon from the end of the dielectric substrate, b_3tThe amount of thermal deformation of the distance from the end of the inner conductor to the gold band, b_4tThermal deformation of the gold strip microstrip bonding length, S_tAmount of thermal deformation of module gap, P_tThe half span thermal deformation of the gold strip is taken as the thermal deformation;

Par_min＝(g_min,(b₂)_min,(b₃)_min,(b₄)_min,S_min,P_min) Representing a vector of minimum size of the parameter after thermal deformation;

wherein, g_minIs the minimum value after thermal deformation of drop height, (b)₂)_minThe distance from the gold strip to the end of the dielectric substrate is the minimum after thermal deformation, (b)₃)_minThe minimum distance from the end of the inner conductor to the gold strip after thermal deformation, (b)₄)_minIs the minimum value after thermal deformation of the gold strip microstrip bonding length, S_minMinimum value of module gap after thermal deformation, P_minIs the minimum value after the half span thermal deformation of the gold strip;

Par₀＝(g₀,b₂₀,b₃₀,b₄₀,S₀,P₀) Representing parameter initial value vector;

wherein, g₀Is the initial value of the fall, b₂₀An initial value of the distance from the gold strip to the end of the dielectric substrate, b₃₀The initial distance from the end of the inner conductor to the gold strip, b₄₀Is an initial value of the gold strip microstrip bonding length, S₀Is an initial value of module gap, P₀The initial value of the gold belt half span is obtained;

Par_max＝(g_max,(b₂)_max,(b₃)_max,(b₄)_max,S_max,P_max) Representing the vector of the maximum value of the parameter after thermal deformation;

wherein, g_maxIs the maximum value after thermal deformation of drop height, (b)₂)_maxFor heating the distance from the gold strip to the end of the dielectric substrateMaximum after deformation, (b)₃)_maxMaximum distance from the end of the inner conductor to the gold strip after thermal deformation, (b)₄)_maxIs the maximum value after thermal deformation of the gold strip microstrip bonding length, S_maxMaximum value of module gap after thermal deformation, P_maxThe maximum value after the gold strip is subjected to half span thermal deformation;

(6c) based on a thermal deformation formula, determining the size vector of the interconnection morphological parameters of the gold belt after thermal deformation as follows:

Par＝Par₀+Par_t＝(g₀+g_t,b₂₀+b_2t,b₃₀+b_3t,b₄₀+b_4t,S₀+S_t,P₀+P_t)。

7. the method for determining gold-ribbon flexible interconnection thermal sensitive parameters of electric properties of microwave assemblies according to claim 1, wherein the gold-ribbon flexible interconnection structure-electromagnetic analysis model established in step (7) comprises an insulating medium, an inner conductor, a gold ribbon, a microstrip conductor and a dielectric substrate.

8. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 6, wherein the step (8) is performed as follows:

(8a) selecting the 6-factor 7 equal interval horizontal numerical values for the flexible interconnection form of the gold belt considering thermal deformation according to the thermal deformation parameters and the thermal deformation amount of the interconnection form as follows:

wherein (g)₀+g_t)_v1～(g₀+g_t)_v7Taking a value of 7 for the fall, (b)₂₀+b_2t)_v1～(b₂₀+b_2t)_v7The distance from the gold strip to the end of the dielectric substrate was taken to be 7 levels, (b)₃₀+b_3t)_v1～(b₃₀+b_3t)_v7Is insideThe distance from the end of the conductor to the gold strip is 7 horizontal values, (b)₄₀+b_4t)_v1～(b₄₀+b_4t)_v7The gold strip microstrip bonding length is taken as 7 horizontal values, (S)₀+S_t)_v1～(S₀+S_t)_v7Taking 7 horizontal values for module clearance, (P)₀+P_t)_v1～(P₀+P_t)_v7Taking a horizontal value of 7 for the half span of the gold belt;

the factor level calculation formula in the table is:

wherein m is a horizontal number;

(8b) determining the flexible interconnection electromagnetic transmission performance indexes of the gold belt as return loss and insertion loss according to the flexible interconnection electromagnetic transmission parameters of the gold belt of the microwave assembly determined in the step (2): ind ═ S11S 21;

(8c) design 6-factor 7 horizontal orthography L₄₉(7⁸) And analyzing and designing orthogonal tests of thermal deformation parameters and electrical performance indexes of the gold band flexible interconnection form by combining three-dimensional electromagnetic full-wave simulation software.

9. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 1, wherein the step (9) is performed as follows:

(9a) according to the analysis result of the variance of the orthogonal test, calculating the normalized heat influence degree of the gold belt flexible interconnection form parameters as follows:

in the above formula, F_jThe ratio of the average difference sum of indexes corresponding to the jth parameter to the average difference sum of errors is obtained;

(9b) meanwhile, for the comprehensive electrical performance indexes of return loss S11 and insertion loss S21, the heat influence degree of the gold strip flexible interconnection form parameter is calculated as follows:

in the formula (I), the compound is shown in the specification,

the heat influence degree, Eff, of the gold strip flexible interconnection form parameter facing the return loss index S11^S21The heat influence degree, w, of the gold strip flexible interconnection form parameter facing the insertion loss index S21₁And w₂The weights corresponding to the thermal influence degrees are respectively.

10. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 9, wherein the step (10) is performed as follows:

(10a) according to the parameter degree of freedom f_jAnd degree of freedom of error f_eAnd determining the threshold value F by combining the F distribution and the alpha quantile_α(f_j,f_e) Calculating the normalized critical heat influence degree Eff of the gold strip flexible interconnection form parameter_jαComprises the following steps:

(10b) meanwhile, the critical heat influence degree of the gold belt flexible interconnection form parameter is calculated by aiming at the comprehensive electrical performance indexes of return loss S11 and insertion loss S21

Comprises the following steps:

in the formula (I), the compound is shown in the specification,

the critical heat influence degree of the gold strip flexible interconnection form parameter facing the return loss index S11,

the critical heat influence degree of the gold strip flexible interconnection form parameter facing the insertion loss index S21;

(10c) normalizing heat influence degree according to gold strip flexible interconnection form parameters

And normalized critical heat influence degree

The judgment criterion for determining the thermosensitive parameters of the gold strip flexible interconnection form is as follows:

(10d) determining interconnection form parameter normalization thermal sensitivity RSen according to the thermal influence degree of the gold-strip flexible interconnection form parameter and combining a thermal sensitive parameter judgment criterion_jComprises the following steps:

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