CN1105071A - A kind of name plate electroplating method - Google Patents
A kind of name plate electroplating method Download PDFInfo
- Publication number
- CN1105071A CN1105071A CN 94100383 CN94100383A CN1105071A CN 1105071 A CN1105071 A CN 1105071A CN 94100383 CN94100383 CN 94100383 CN 94100383 A CN94100383 A CN 94100383A CN 1105071 A CN1105071 A CN 1105071A
- Authority
- CN
- China
- Prior art keywords
- metal
- metal substrate
- ink
- electroplating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000009713 electroplating Methods 0.000 title claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000005266 casting Methods 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 14
- 239000003153 chemical reaction reagent Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000002860 competitive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 230000035807 sensation Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a plating method of name plate, its step includes polish the metal base plate, and wash it; (b) printing the picture on the metal substrate by ink printing, and drying to make the ink picture fixed on the metal substrate; (c) the engraving and casting method is to place the metal base plate with fixed ink picture in electroplating bath and to complete electroplating to obtain the mirror nameplate with stereo floating drawing.
Description
The present invention relates to a kind of method for nameplate plating, specifically, the present invention adopts galvanized step to produce minute surface inscription plate, can be used for the manufacturing of the series products of medal, medal, nameplate, badge, adopt its etching face of inscription plate of etching production that little droplet shape is arranged thereby improved custom, and product only limit to shortcomings such as single base material.
The general traditionally method of making the inscription plate can be summarized as follows:
1) manufacture method of back printing-type inscription plate is electroplated on the plane, be metal substrate that polishing was cleaned through electroplating the required Metal plating face of one deck, carry out ink printing again, treat to paint the layer of transparent lacquer again after its drying, can obtain the plane and electroplate to print and engrave plate.Via the plane plating formula inscription plate that this law is produced, though plate the required metal level of one deck, the picture proof surface is smooth, do not have to float to paint stereoscopic sensation, thereby value added is not high, and the competitive power in market is not good.
The manufacture method of 2) etching formula inscription plate, this kind method for making is the most frequently used traditionally inscription board fabrication method, it goes out required picture proof with ink printing, and dried, picture proof with required retention is bonded on this metal substrate again, carry out erosion with etching reagent such as iron(ic) chloride again, there is not the picture proof part, promptly can be etched and form slightly concave, made nameplate, to have the floating stereoscopic sensation of painting, value added is just high, yet this method shortcoming is: (1) made inscription plate is not having the picture proof place after etching, will be little droplet shape because of the effect of etching reagent, or cause drip vestige, inferior quality; (2) sting the plate effect because of etching reagent carries out etching on single substrate,, and one or more layers other electrodeposition of metalss can't be arranged again so made inscription plate is single material; (3) if make other required electrolytic coatings, then still need and carry out again in addition electroplating again behind the ink printing, time-consuming, effort does not meet economy yet; (4) etching reagent (iron(ic) chloride) is the chemical agent of high pollution, will produce the problem of environmental protection.
The shortcoming of above-mentioned traditional method for making can reduce: (1) product does not have to float paints stereoscopic sensation, and economic worth is not high, so benefit is not good; (2) the made inscription plate of traditional etch recipe does not cause little droplet shape because of etching reagent effect etching has printing ink picture proof place, perhaps can cause the vestige of drip, so inferior quality; (3) the made inscription plate of traditional etch recipe lies in and carries out etching on the single base material, can not have the electroplated metal layer more than one deck, so product does not have diversity; (4) its employed etching reagent of traditional etched method for making can cause environmental pollution.
The present invention system provides a kind of method for nameplate plating, the purpose of this method to comprise that (1) make and have the floating inscription plate of painting of electroplating minute surface; (2) make the inscription plate of the electroplated metal layer that can meet the requirements of the customers; (3) this method for making is not used etching reagent, will can not cause environmental pollution, and no longer need extra plating step, get final product multifarious inscription plate, so meet economic worth, and help environmental protection, therefore have preferable productivity effect and competitive power.
Above-mentioned purpose of the present invention realizes in the following manner:
A kind of method for nameplate plating, its step comprises polishes metal substrate (can be copper coin) earlier with the cloth turbine, clean with grease-removing agent again, after treating its drying, mode with ink printing is printed in picture proof on the metal substrate, after being dried, the picture proof set is formed on this metal substrate, and then the carving casting of engraving plate, and the carving casting method of this inscription plate is the metal substrate that set is had printing ink circle original text, places plating tank, carry out galvanized step, can obtain a three-dimensional floating plating minute surface inscription plate of painting.Metal substrate wherein used in the present invention can be copper coin, and its copper plate thickness can be between 1.0mm to 10mm.And can form ink lay, and the electroplated metal layer outside the printing ink, and can be respectively in the electrolyzer that contains electroplate liquids such as nickel, silver, gold or copper, electroplate and to form, or can plate one deck nickel metal layer earlier, plate other metal level again, and the minute surface of gained inscription plate, the step that can paint in the picture proof place of its nick, and after having painted, can paint the layer of transparent lacquer again, promptly obtain high-quality minute surface inscription plate, be used to make medal, medal, the product of badge and so on is rich in value added, and has preferable competitive capacity and productivity effect.
Below by preferred embodiment further the present invention is made detailed description:
Embodiment 1:
(1) get the long 150mm of a copper coin, wide 100mm, thickness 5mm, with the polishing of cloth turbine, and then the oil stain to adhere on the grease-removing agent cleaning removal copper face.
(2) in the mode of ink printing with the required picture proof that forms on the copper coin, be printed on the copper coin, and below 180 ℃, toasted 10 minutes in about, this picture proof can be bonded on the copper coin.
(3) in containing the plating tank of nickel plating solution, electroplate after 20 minutes, plate other metal level again, can obtain the gold-plated inscription plate of high-quality minute surface.
(4) above-mentioned other metal level that plates again preferentially is selected from the coating in gold or the plating solution for silver-plating plating.
Only for purpose of the present invention is described, protection scope of the present invention will embody in claims the foregoing description.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94100383 CN1105071A (en) | 1994-01-08 | 1994-01-08 | A kind of name plate electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94100383 CN1105071A (en) | 1994-01-08 | 1994-01-08 | A kind of name plate electroplating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1105071A true CN1105071A (en) | 1995-07-12 |
Family
ID=5029611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 94100383 Pending CN1105071A (en) | 1994-01-08 | 1994-01-08 | A kind of name plate electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1105071A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922029A (en) * | 2010-07-22 | 2010-12-22 | 中兴通讯股份有限公司 | Mirror surface character processing technique and equipment |
| CN101713088B (en) * | 2009-11-10 | 2011-04-13 | 宁波康强电子股份有限公司 | Electroplating method of integrated circuit lead frame |
| CN101188337B (en) * | 2006-11-24 | 2011-12-14 | 富士通株式会社 | Terminal and mobile terminal apparatus |
| CN102618898A (en) * | 2011-01-26 | 2012-08-01 | 上海造币有限公司 | Local gilding technology for commemorative coin (badge) |
| CN102629433A (en) * | 2011-12-05 | 2012-08-08 | 上海迈极电子有限公司 | Method for manufacturing electroforming nameplate |
| CN103029503A (en) * | 2011-10-09 | 2013-04-10 | 王淑锦 | Nameplate processing method |
| CN104772600A (en) * | 2014-01-15 | 2015-07-15 | 王淑锦 | Processing method of nameplate |
| CN104947159A (en) * | 2015-05-19 | 2015-09-30 | 科世达（上海）管理有限公司 | Manufacturing method of nonelectroplating-beacon-bearing electroplating product |
| CN107620096A (en) * | 2017-09-29 | 2018-01-23 | 佛山市春暖花开科技有限公司 | One kind layering electroplating process |
-
1994
- 1994-01-08 CN CN 94100383 patent/CN1105071A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188337B (en) * | 2006-11-24 | 2011-12-14 | 富士通株式会社 | Terminal and mobile terminal apparatus |
| CN101713088B (en) * | 2009-11-10 | 2011-04-13 | 宁波康强电子股份有限公司 | Electroplating method of integrated circuit lead frame |
| CN101922029A (en) * | 2010-07-22 | 2010-12-22 | 中兴通讯股份有限公司 | Mirror surface character processing technique and equipment |
| CN102618898A (en) * | 2011-01-26 | 2012-08-01 | 上海造币有限公司 | Local gilding technology for commemorative coin (badge) |
| CN102618898B (en) * | 2011-01-26 | 2015-07-15 | 上海造币有限公司 | Local gilding technology for commemorative coin (badge) |
| CN103029503A (en) * | 2011-10-09 | 2013-04-10 | 王淑锦 | Nameplate processing method |
| CN103029503B (en) * | 2011-10-09 | 2015-03-11 | 王淑锦 | Processing method of nameplate |
| CN102629433A (en) * | 2011-12-05 | 2012-08-08 | 上海迈极电子有限公司 | Method for manufacturing electroforming nameplate |
| CN104772600A (en) * | 2014-01-15 | 2015-07-15 | 王淑锦 | Processing method of nameplate |
| CN104772600B (en) * | 2014-01-15 | 2017-05-24 | 王淑锦 | Processing method of nameplate |
| CN104947159A (en) * | 2015-05-19 | 2015-09-30 | 科世达（上海）管理有限公司 | Manufacturing method of nonelectroplating-beacon-bearing electroplating product |
| CN107620096A (en) * | 2017-09-29 | 2018-01-23 | 佛山市春暖花开科技有限公司 | One kind layering electroplating process |
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| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |