CN110504574A - A kind of charging contact structure and preparation method thereof - Google Patents
A kind of charging contact structure and preparation method thereof Download PDFInfo
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- CN110504574A CN110504574A CN201910795448.XA CN201910795448A CN110504574A CN 110504574 A CN110504574 A CN 110504574A CN 201910795448 A CN201910795448 A CN 201910795448A CN 110504574 A CN110504574 A CN 110504574A
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- 239000011248 coating agent Substances 0.000 claims abstract description 260
- 238000000576 coating method Methods 0.000 claims abstract description 260
- 229910052751 metal Inorganic materials 0.000 claims abstract description 112
- 239000002184 metal Substances 0.000 claims abstract description 112
- 239000010949 copper Substances 0.000 claims abstract description 81
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 78
- 229910052802 copper Inorganic materials 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000004888 barrier function Effects 0.000 claims abstract description 23
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 9
- 229910001172 neodymium magnet Inorganic materials 0.000 claims description 74
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical group [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 claims description 69
- 239000010931 gold Substances 0.000 claims description 54
- 229910045601 alloy Inorganic materials 0.000 claims description 37
- 239000000956 alloy Substances 0.000 claims description 37
- 238000007789 sealing Methods 0.000 claims description 31
- 239000011148 porous material Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 16
- 230000003078 antioxidant effect Effects 0.000 claims description 13
- 239000003963 antioxidant agent Substances 0.000 claims description 12
- 235000006708 antioxidants Nutrition 0.000 claims description 12
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910007637 SnAg Inorganic materials 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 230000007935 neutral effect Effects 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910021124 PdAg Inorganic materials 0.000 claims description 3
- 229910021118 PdCo Inorganic materials 0.000 claims description 3
- 229910021126 PdPt Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 53
- 150000003839 salts Chemical class 0.000 abstract description 17
- 239000007788 liquid Substances 0.000 abstract description 15
- 230000003068 static effect Effects 0.000 abstract description 15
- 239000007921 spray Substances 0.000 abstract description 13
- 230000005347 demagnetization Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 144
- 238000009713 electroplating Methods 0.000 description 12
- 239000003292 glue Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
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- 238000005520 cutting process Methods 0.000 description 5
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- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- ZDVYABSQRRRIOJ-UHFFFAOYSA-N boron;iron Chemical compound [Fe]#B ZDVYABSQRRRIOJ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 4
- 238000012372 quality testing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910002482 Cu–Ni Inorganic materials 0.000 description 2
- 229910018484 Ni—Cu—Ni Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PXAWCNYZAWMWIC-UHFFFAOYSA-N [Fe].[Nd] Chemical compound [Fe].[Nd] PXAWCNYZAWMWIC-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003571 electronic cigarette Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of charging contact structures and preparation method thereof.The charging contact structure, comprising: magnet substrate, magnet substrate surface are covered with coating；Coating is followed successively by noncorroding metal layer, sour layers of copper, metal barrier and anti-synthetic perspiration's electrolytic metal layer from the inside to surface.Embodiment of the present invention not only increases the planarization and smoothness on magnet substrate surface by the way that special functional coating is electroplated on magnet substrate, and realize performance of the magnet substrate with salt spray resistance test, artificial perspiration resistance's liquid static test and the electrolysis test of artificial perspiration resistance's liquid after SMT；Solve the problems, such as that magnet substrate cannot charge after being unable to SMT or SMT in existing charging contact structure.Embodiment of the present invention will have coated magnet substrate SMT to printed circuit board, then carry out processing of magnetizing；It solves the problems, such as to attract each other when SMT after traditional magnet magnetizes and the demagnetization of magnet heat.
Description
Technical field
The present invention relates to charging unit technical fields more particularly to a kind of charging contact structure and preparation method thereof.
Background technique
The common charging modes of intelligence wearing product include that connector mode and charging contact add elastic slice or connector at present
The mode of (Pogo pin)；For example, Bluetooth wireless earphone and charging box are exactly the Pogo pin charging modes used.Wherein charge
The substrate and electroplating schemes of contact are frequently encountered two problems: first, surface patch cannot be done after traditional magnet galvanization coating
Fill (Surface Mounted Technology, SMT) welding；Second, product upper contact bears frictional force simultaneously when charging,
There is the phenomenon that coating falls off, coating internal easily oxygen after falling off in the electrolysis that will receive electric current in the state of having sweat
The magnetic material of change is exposed, and then magnetic material is caused to be oxidized corrosion, therefore reduces the conduction property of charging contact.
The coating of charging contact structure has Ni-Cu-Ni coating, Cu-Ni coating, Cu coating and Ni- in the prior art
Cu-Ni-Au-Ag-Pd-Au coating.However the charging contact structure with Ni-Cu-Ni coating, Cu-Ni coating or Cu coating is deposited
In following Railway Project: 1) in SMT, overlay coating is easy explosion；2) it cannot be surveyed by salt spray test and synthetic perspiration's static state
Examination；It causes not charging if 3) carry out charging synthetic perspiration's electrolysis test all coating in 1 minute after SMT and can be electrolysed.
Charging contact structure with Ni-Cu-Ni-Au-Ag-Pd-Au coating cannot be electrolysed well by synthetic perspiration and be tested, such as
Charging synthetic perspiration carried out after SMT being electrolysed test all coating in 1 minute can be electrolysed and cause not charging.
Summary of the invention
In consideration of it, embodiments of the present invention provide a kind of charging contact structure and preparation method thereof, described fill can be made
Electrical contact structure effectively passes through salt spray test, synthetic perspiration's static test and synthetic perspiration and is electrolysed test.
To achieve the above object, embodiment of the present invention first aspect provides a kind of charging contact structure.The charging contact
Structure, comprising: magnet substrate, the magnet substrate surface are covered with coating；The coating is followed successively by anticorrosive gold from the inside to surface
Belong to layer, sour layers of copper, metal barrier and anti-synthetic perspiration's electrolytic metal layer.
Further, the charging contact structure further include: printed circuit board；Have coated magnet substrate to paste by surface
Load is connected on the printed circuit board.
Further, anti-synthetic perspiration's electrolytic metal layer is Rh, Ru or RhRu alloy layer；Further, described anti-
Synthetic perspiration's electrolytic metal layer is RhRu alloy layer；Further, anti-synthetic perspiration's electrolytic metal layer with a thickness of
0.75μ-1μ。
Further, the noncorroding metal layer is burnt copper coating or neutral nickel coating；Further, the noncorroding metal
Layer is burnt copper coating；Further, the noncorroding metal layer with a thickness of 8 μ -10 μ.
Further, the metal barrier is Pd coating, Pt coating, PdCo coating, PdPt coating, PdAg coating, PdAu
Coating or PdIn coating；Further, the metal barrier is Pd coating；Further, the thickness of the metal barrier
For 0.6 μ -0.75 μ.
Further, the charging contact structure further include: setting is between the sour layers of copper and the metal barrier
Anti-oxidant metal layer；The anti-oxidant metal layer is Ag coating, SnAg coating or CuSnZn coating；Further, described anti-
Metal oxide layer is CuSnZn coating；Further, the anti-oxidant metal layer with a thickness of 2 μ -4.5 μ.
Further, the charging contact structure further include: setting is electrolysed in the metal barrier and anti-synthetic perspiration
Conductive metal layer between metal layer；The conductive metal layer is Ag, SnAg, CuSnZn or Au coating；Further, described
Conductive metal layer is Au coating；Further, the conductive metal layer with a thickness of 0.5 μ -0.75 μ.
Further, easy weld metal layers are set outside anti-synthetic perspiration's electrolytic metal layer；The easy welding metal coating
For Au, Sn, CuSnZn or SnAg coating；Further, the easy weld metal layers are Au coating；Further, the easy weldering
Connect metal layer with a thickness of 0.125 μ -0.25 μ.
Further, the sour layers of copper can be replaced by the sour nickel layer；Further, the sour layers of copper with a thickness of 18 μ-
20μ。
Further, the magnet substrate is neodymium iron boron or SmCo.
Further, the coating is that outermost layer has carried out the coating of sealing pores；The outermost layer refers to the anti-human work
Other coating on anti-synthetic perspiration's electrolytic metal layer are electroplated in sweat electrolytic metal layer.
Embodiment of the present invention second aspect provides a kind of charging contact knot as described in embodiment of the present invention first aspect
The preparation method of structure, comprising:
Choose the magnet substrate of specific standard；It is electroplated on the magnet substrate surface, forms coating；Described
Coating surface carries out sealing pores, obtains having coated magnet substrate；
Processing of magnetizing is carried out to the coated magnet substrate of tool, obtains charging contact structure.
Further, processing of magnetizing is carried out to the coated magnet substrate of tool, comprising: by the coated magnet of tool
Substrate surface is mounted into the printed circuit board, is then carried out processing of magnetizing to the coated magnet substrate of tool, must be filled
Electrical contact structure.
Embodiment of the present invention has the following beneficial effects: compared with prior art
1, embodiment of the present invention not only increases magnet substrate by the way that special functional coating is electroplated on magnet substrate
The planarization and smoothness on surface, and the SMT of magnet substrate is realized, solve magnet substrate in existing charging contact structure
It is unable to the problem of cannot charging after SMT or SMT.
2, there is after charging contact structure SMT salt spray resistance test, artificial perspiration resistance's liquid static test in present embodiment, and
The performance of artificial perspiration resistance's liquid electrolysis test；It is achieved that the charging contact structure of earphone, wrist-watch etc. and the charging of charging box are touched
Charging works normally point structure for a long time in the state of having human sweat, substantially prolongs the products such as earphone, wrist-watch and charging
The service life of box.
3, earphone, wrist-watch, glasses or VR etc. are wearable in the market sets existing for the charging contact structure of embodiment of the present invention
The direct magnetic charge function of magnet is realized in the electronic products such as standby and electronic cigarette for the first time, by traditional magnet and charging
POGO PIN structural is combined into one, and realizes new technological break-through for product weight reducing.
4, present embodiment will have on coated magnet substrate SMT to printed circuit board, then magnetize；So not
It can only solve the problems, such as to adsorb other part devices when conventional belt magnetic magnet SMT, and can solve to occur with magnetic magnet in SMT
The problem of high temperature demagnetizes, facilitates on charging contact structure SMT to printed circuit board.
Detailed description of the invention
Fig. 1 is the coating schematic diagram in the embodiment of the present invention 1 on neodymium iron boron；
Fig. 2 is the schematic diagram of charging contact structure in the embodiment of the present invention 2；
Fig. 3 is the cross-sectional view of charging contact structure in the embodiment of the present invention 2；
Fig. 4 is the schematic diagram that synthetic perspiration is electrolysed test in the embodiment of the present invention 9.
Wherein, 10, neodymium iron boron, 20, coating, 201, burnt copper coating, 202, sour layers of copper, 203, CuSnZn coating, 204, Pd
Coating, the 205, the first Au coating, 206, RhRu alloy layer, the 207, the 2nd Au coating, 30, printed circuit board.
Specific embodiment
To keep the purpose of the present invention, feature, advantage more obvious and understandable, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is only a part of the embodiment of the present invention, and not all embodiments.Based on the embodiments of the present invention, those skilled in the art are not having
Every other embodiment obtained under the premise of creative work is made, shall fall within the protection scope of the present invention.
Embodiment of the present invention provides a kind of charging contact structure in first aspect, and the charging contact structure includes: magnetic
Iron-based material, the magnet substrate surface are covered with coating；The coating be followed successively by from the inside to surface noncorroding metal layer, sour layers of copper,
Metal barrier and anti-synthetic perspiration's electrolytic metal layer.
In further embodiment, charging contact structure further include: printed circuit board；Has coated magnet substrate
It is connected on the printed circuit board by surface mount.
Embodiment of the present invention is in order to avoid sour layers of copper is to magnet base in magnet substrate electroplating surface noncorroding metal layer
The corrosion of material.The electroplating acid copper layer on noncorroding metal layer, being on the one hand to fill and lead up the fine pore on magnet substrate surface makes
Its surface is smooth, the roughness on magnet substrate surface is reduced, to improve the adhesive force of other coats of metal；On the other hand
It is the mute degree of light of controllable whole coating, the mute degree of charging contact body structure surface light is made to reach necessary requirement.It is electroplated in sour layers of copper
Metal barrier is on the one hand to effectively prevent being covered on the copper in the sour layers of copper and noncorroding metal layer on magnet substrate surface
Release is diffused into other coating, and then influences the performance of other coating；It on the other hand is the salt tolerant in order to improve whole coating
Mist and artificial perspiration resistance's liquid static test.Anti-human work sweat electrolytic metal layer is electroplated on metal barrier, this is to enhance magnetic
Synthetic perspiration is electrolysed the performance of test when whole coating salt spray resistance test, artificial perspiration resistance's liquid static test and charging outside iron-based material.
In the present embodiment, electroplating process is that the conventional plating process used is realized.
In further embodiment, anti-synthetic perspiration's electrolytic metal layer is Rh, Ru or RhRu alloy layer；
In further embodiment, in order to make the coating outside magnet substrate that there is good artificial perspiration resistance's liquid to be electrolysed testability
Can, anti-synthetic perspiration's electrolytic metal layer is RhRu alloy layer.
In further embodiment, anti-synthetic perspiration's electrolytic metal layer with a thickness of 0.75 μ -100 μ (such as
0.75,0.8,0.85,0.9,1,10 or 100 μ)；In further embodiment, anti-synthetic perspiration's electrolytic metal layer
With a thickness of 0.75 μ -1 μ (such as 0.75,0.8,0.85,0.9 or 1 μ).
In further embodiment, the noncorroding metal layer is burnt copper coating or neutral nickel layer；Further
Embodiment in, the noncorroding metal layer is burnt copper coating；This is because appearance when magnet substrate and strong alkaline substance contact
Easily it is corroded, and burnt copper electroplating liquid partial neutral, therefore in magnet substrate electroplating surface coke copper coating, it on the one hand can be very good to hinder
Every contact of the sour copper electroplating liquid with magnet substrate, to guarantee that magnet substrate is not corroded, on the other hand due to burnt copper coating with
Magnet substrate has good adhesive force, therefore burnt copper coating is electroplated, the adhesive force of other subsequent coats of metal can be improved, and keeps away
The phenomenon that exempting from other coats of metal and magnet substrate poor adhesive force generation.
In further embodiment, the noncorroding metal layer with a thickness of 8 μ -100 μ (such as 8,8.5,9,9.5,
10,50 or 100 μ)；In further embodiment, the noncorroding metal layer with a thickness of 8 μ -10 μ (such as 8,8.5,
9,9.5 or 10 μ).
In further embodiment, other metals are diffused into order to effectively prevent the Cu layer on magnet substrate surface to discharge
In coating, and then influence the performance of other coats of metal；The metal barrier is Pd coating, Pt coating, PdCo coating, PdPt
Coating, PdAg coating, PdAu coating or PdIn coating；In further embodiment, in order to improve magnet substrate surface
The heat resistance of coating, and then prevent the coating on magnet substrate surface from Decrepitation Phenomena occur, the metal barrier is Pd coating.
In further embodiment, the metal barrier with a thickness of 0.4 μ -100 μ (such as 0.4,0.6,
0.63,0.65,0.7,0.8,1,10,50 or 100 μ)；In further embodiment, the metal barrier with a thickness of
0.6 μ -0.75 μ (such as 0.6,0.63,0.65,0.7 or 0.75 μ).
In further embodiment, in order to protect the copper in sour layers of copper and/or burnt copper coating to be electroplated in entire coating
Not oxidized in the process, described charging contact structure further include: setting is between the sour layers of copper and the metal barrier
Anti-oxidant metal layer, the anti-oxidation metal coating be Ag coating, SnAg coating or CuSnZn coating.Further
In embodiment, in order to improve the antioxidant effect of anti-oxidant metal layer, the anti-oxidant metal layer is CuSnZn coating.
In further embodiment, the anti-oxidant metal layer with a thickness of 1 μ -100 μ (such as 1,2,2.5,3,
3.5,4,4.5,10,50 or 100 μ)；In further embodiment, the anti-oxidant metal layer with a thickness of 2 μ -4.5 μ
(such as 2,2.5,3,3.5,4 or 4.5 μ).
In further embodiment, in order to improve the electric conductivity of whole coating, the charging contact structure is also wrapped
It includes: the conductive metal layer between the metal barrier and anti-synthetic perspiration's electrolytic metal layer is set；The conductive metal layer
For Ag, SnAg, CuSnZn or Au coating；In further present embodiment, the conductive metal layer is Au coating.Choosing
It uses Au coating as conductive metal layer, is on the one hand to have the characteristics that impedance is small and good conductivity due to Au coating；On the other hand
The performance of the salt spray resistance test and artificial perspiration resistance's liquid static test of whole coating can be improved in Au coating.
In further embodiment, the conductive metal layer with a thickness of 0.3 μ -100 μ (such as 0.3,0.5,
0.55,0.6,0.65,0.7,0.75,10 or 100 μ)；In further embodiment, the thickness of the conductive metal layer
For 0.5 μ -0.75 μ (such as 0.5,0.55,0.6,0.65,0.7 or 0.75 μ).
The welding performance of magnet substrate serving and scolding tin, described when in further embodiment, in order to improve SMT
Easy weld metal layers are provided with outside anti-synthetic perspiration's electrolytic metal layer；The easy welding metal coating be Au, Sn, CuSnZn, or
SnAg coating；In further embodiment, in order to improve coating electric conductivity, weldability, salt spray resistance test and resistance to people
The performance of work sweat static test, the easy weld metal layers are Au coating.Au coating improves the welding performance of whole coating,
Scolding tin can easily infiltrate Au coating when being due to SMT, to be conducive to rapidly realize welding.
In further embodiment, the easy welding metal coating with a thickness of 0.125 μ -100 μ (such as 0.125,
0.15,0.18,0.20,0.25,10 or 100 μ)；In further embodiment, the thickness of the easy welding metal coating
For 0.125 μ -0.25 μ (such as 0.125,0.15,0.18,0.20,10 or 0.25 μ).
In further embodiment, the sour layers of copper can be replaced by the sour nickel layer；For example, the coating is from inner
Noncorroding metal layer, sour nickel layer, metal barrier and anti-synthetic perspiration's electrolytic metal layer are followed successively by outer.
In further embodiment, the sour layers of copper with a thickness of 10 μ -100 μ (such as 10,18,18.5,19,
19.5,20 or 100 μ)；In further embodiment, it is described acid layers of copper with a thickness of 18 μ -20 μ (such as 18,18.5,
19,19.5 or 20 μ).
In further embodiment, the magnet substrate is neodymium iron boron or SmCo.Neodymium is selected in the present embodiment
Iron boron or SmCo as magnet substrate be since the magnet substrate has big magnetic flux, be easy to reach magnetize after magnet suction it is big
Purpose.
In further embodiment, the coating is that outermost layer has carried out the coating of sealing pores.Coating is sealed
Hole processing not only can protect that outermost coating is not oxidized, the welding effect of coating when improving SMT；And it can be to avoid sky
Gas prevents the coating on magnet substrate surface when SMT from Decrepitation Phenomena occurs by microporous alumina magnet substrate.It should be understood that institute
It states outermost layer and refers to anti-synthetic perspiration's electrolytic metal layer or the easy welding being electroplated on anti-synthetic perspiration's electrolytic metal layer gold
Belong to layer.
The coating of traditional magnet substrate causes traditional magnet substrate to be unable to SMT since high temperature is easy to happen explosion.Separately
Outside, tradition carries out charging synthetic perspiration's electrolysis test after having coated magnet substrate SMT, and all coating can electricity in 1 minute
It takes off, in turn resulting in charging contact structure can not charge.Embodiment of the present invention is in magnet substrate surface covering specific function
Coating, not only increases the planarization and smoothness on magnet substrate surface, and realizes magnet substrate after SMT with salt tolerant
The performance of mist test, artificial perspiration resistance's liquid static test and the electrolysis test of artificial perspiration resistance's liquid；Solves existing charging contact structure
Middle magnet substrate is unable to the problem of cannot charging after SMT or SMT.
Embodiment of the present invention is provided in second aspect as embodiment of the present invention charging contact described in first aspect
The preparation method of structure, comprising: choose the magnet substrate of specific standard；It is electroplated on the magnet substrate surface, shape
At coating；Sealing pores are carried out in the coating surface, obtain having coated magnet substrate；To the coated magnet of tool
Substrate carries out processing of magnetizing, and obtains charging contact structure.
In further embodiment, the preparation method of charging contact structure further include: by the coated magnetic of tool
Then iron-based material SMT carries out processing of magnetizing to the coated magnet substrate of tool, must charge touching into the printed circuit board
Point structure.
In the present embodiment, sealing pores, which refer to, carries out sealing of hole to the micropore on outermost layer coating surface using hole sealing agent
Processing.
Present embodiment will have on coated magnet substrate SMT to printed circuit board, then magnetize；So not only
It can solve the problems, such as to adsorb other part devices when conventional belt magnetic magnet SMT, and the height occurred with magnetic magnet in SMT can be solved
The problem of temperature demagnetization, facilitate on charging contact structure SMT to printed circuit board.
Embodiment 1
Fig. 1 is the coating schematic diagram in the embodiment of the present invention 1 on neodymium iron boron.A kind of charging contact structure, comprising: neodymium iron boron
10,10 surface of neodymium iron boron is covered with coating 20；Coating 20 is followed successively by burnt copper coating 201, sour layers of copper 202, CuSnZn from the inside to surface
Coating 203, Pd coating 204, the first Au coating 205, RhRu alloy layer 206 and the 2nd Au coating 207.Burnt copper coating 201
With a thickness of 8 μ -10 μ, sour layers of copper 202 with a thickness of 18 μ -20 μ, CuSnZn coating 203 with a thickness of 2 μ -4.5 μ, Pd coating
204 with a thickness of 0.6 μ -0.75 μ, the first Au coating 205 with a thickness of 0.5 μ -0.75 μ, RhRu alloy layer 206 with a thickness of
0.75 μ -1 μ, the 2nd Au coating 207 with a thickness of 0.125 μ -0.25 μ, the 2nd Au coating 207 be carry out sealing pores after plating
Layer.
A kind of preparation method of charging contact structure, includes the following steps:
Step 1: having the preparation of coated magnet substrate
1) the neodymium iron boron blank is fastened with glue onto cutting plate, is then cut using cutting machine, the side's of obtaining item
Shape neodymium iron boron.Wherein, glue is 502 glue.
2) the square strip neodymium iron boron being sticked on cutting plate and water are added to boiling in charging basket, water is boiled after being heated to boiling
Material；When the glue on square strip neodymium iron boron is boiled, square strip neodymium iron boron is taken out and utilizes drying machine drying；Other side's strip neodymium
The specification of iron boron carries out quality testing.
3) will test by square strip neodymium iron boron using spheronizator it is round as a ball, be made cylinder type neodymium iron boron；To cylindrical neodymium
The specification of iron boron carries out quality testing.
4) will test by more cylinder type neodymium iron borons one end alignment, then by one end of alignment by glue stickup
It to cutting plate, is cemented between more cylinder type neodymium iron borons with glue, using cutting on the length direction of cylinder type neodymium iron boron
Machine is cut, and quasi-cylindrical neodymium iron boron is obtained；It is directed at cylinder type neodymium iron boron and carries out quality testing；Wherein, quasi-cylindrical neodymium iron boron
Refer to the cylinder type neodymium iron boron of specific length；Glue is 502 glue.
5) will test by quasi-cylindrical neodymium iron boron and water be added to boiling in charging basket, water is boiled after being heated to boiling
Material；When the glue on quasi-cylindrical neodymium iron boron is boiled, quasi-cylindrical neodymium iron boron is taken out and utilizes drying machine drying.To drying
Quasi-cylindrical neodymium iron boron afterwards carries out quality testing.
6) the abrasive grain lead angle for the quasi-cylindrical neodymium iron boron ∮ 5mm that detection is passed through；By the quasi-cylindrical neodymium iron boron after lead angle
Pickling is carried out, then ultrasonic cleaning；Obtain the neodymium iron boron of specific standard；Wherein the neodymium iron boron of specific standard is surface completely and has
There is the neodymium iron boron of specific dimensions.
Wherein the aqueous solution of pickling is nitric acid, volumetric concentration 5%, pickling time 30S.
7) it is electroplated on the neodymium iron boron of specific standard, successively coke-plated copper coating, sour layers of copper, CuSnZn coating, Pd plating
Layer, the first Au coating, RhRu alloy layer and the 2nd Au coating；Then sealing of hole is carried out using hole sealing agent on the 2nd Au coating
Processing, must have coated neodymium iron boron.
8) thickness, appearance and the size for detecting coating, then will test by tool coated neodymium iron boron vacuum packaging.
Wherein, Deposit appearance examination criteria is: coating surface, which cannot have, to be collapsed scarce, is burnt, and is ruptured, peeling, corrugation, knife mark etc. are bad existing
As coating needs uniformly, and surface needs flat and smooth.Tolerance in +/- 0.05mm need to be controlled by having coated neodymium iron boron overall dimensions
In range.
Step 2: carrying out carrier band packaging to having coated magnet substrate, processing of then magnetizing obtains charging contact structure.
The present embodiment carrier band packaging refers to that the product that will be electroplated is put into the hole slot of carrier band by requirement is put, on transparent
Film covers product, and upper film edge is included to be glued on carrier band, while carrier band being rolled on carrier band disk, and film is used after the completion of packaging
Carrier band is fixed on carrier band disk by several circles of multireel, is prevented carrier band from unclamping and is fallen off.
The implementation method of electroplating technology in the present embodiment: by quasi-cylindrical neodymium iron boron and plating steel ball is accompanied to be put into togerther electroplating pool
In, power-up stream is electroplated.Plating steel ball is accompanied primarily to preventing small size quasi-cylindrical neodymium iron boron from lamination phenomenon occur, and
There is the even problem of uneven coating by electric current hour.Each coating is both needed to survey after having corresponding electroplating pool, each coating to plate
The film thickness of coating, thickness of coating place into next electroplating pool after reaching necessary requirement, are successively electroplated in order.
The present embodiment is equipped with the coating of specific function on magnet substrate surface；To make charging contact body structure surface have
Flatness and smoothness, but also can protect charging contact structure by salt spray test, synthetic perspiration's static test and filling
Electric synthetic perspiration is electrolysed test.
Embodiment 2
Fig. 2 is the schematic diagram of charging contact structure in the embodiment of the present invention 2；Fig. 3 is charging contact in the embodiment of the present invention 2
The cross-sectional view of structure.A kind of charging contact structure, comprising: neodymium iron boron 10 and printed circuit board 30, neodymium iron boron 10 are pasted by surface
Load is connected on printed circuit board 30；10 surface of neodymium iron boron is covered with coating 20；Coating 20 is followed successively by burnt copper coating from the inside to surface
201, sour layers of copper 202, CuSnZn coating 203, Pd coating 204, the first Au coating 205, RhRu alloy layer 206 and the 2nd Au
Coating 207.Burnt copper coating 201 with a thickness of 8 μ -10 μ, the thickness with a thickness of 18 μ -20 μ, CuSnZn coating 203 of sour layers of copper 202
Degree is 2 μ -4.5 μ, Pd coating 204 with a thickness of 0.6 μ -0.75 μ, the first Au coating 205 with a thickness of 0.5 μ -0.75 μ, RhRu
Alloy layer 206 with a thickness of 0.75 μ -1 μ, the 2nd Au coating 207 with a thickness of 0.125 μ -0.25 μ, the 2nd Au coating 207 is
Coating after carrying out sealing pores.
The preparation method is the same as that of Example 1, it is unique unlike, step 2.
Step 2: by the neodymium iron boron 10SMT with coating 20 into printed circuit board 30, then to the neodymium with coating 20
Iron boron 10 carries out processing of magnetizing, and obtains charging contact structure.
Embodiment 3
A kind of charging contact structure, comprising: neodymium iron boron and printed circuit board, neodymium iron boron are connected to printing by surface mount
On circuit board；Neodymium iron boron surface is covered with coating；Coating is followed successively by burnt copper coating, sour layers of copper, Pd coating from the inside to surface, and
RhRu alloy layer.Burnt copper coating with a thickness of 8 μ -10 μ, sour layers of copper with a thickness of 18 μ -20 μ, Pd coating with a thickness of 0.6 μ -
0.75 μ, RhRu alloy layer with a thickness of 0.75 μ -1 μ, RhRu alloy layer be carry out sealing pores after coating.
The preparation method is the same as that of Example 1, it is unique unlike, 7 in step 1) and step 2.
Step 1:7) it is electroplated on the neodymium iron boron of specific standard, successively coke-plated copper coating, sour layers of copper, Pd coating, with
And RhRu alloy layer；Then sealing pores are carried out using hole sealing agent on RhRu alloy layer, must has coated neodymium iron boron.
Step 2: will have coated neodymium iron boron SMT into printed circuit board, then the coated neodymium iron boron of tool is carried out
It magnetizes processing, obtains charging contact structure.
Embodiment 4
A kind of charging contact structure, comprising: neodymium iron boron and printed circuit board, neodymium iron boron are connected to printing by surface mount
On circuit board；Neodymium iron boron surface is covered with coating；Coating is followed successively by neutral nickel layer, sour layers of copper, Pd coating, RhRu from the inside to surface and closes
Gold plate.Neutral nickel coating with a thickness of 8 μ -10 μ, sour layers of copper with a thickness of 18 μ -20 μ, Pd coating with a thickness of 0.6 μ -0.75
μ, RhRu alloy layer are the coating for carrying out sealing pores with a thickness of 0.75 μ -1 μ, RhRu alloy layer.
The preparation method is the same as that of Example 1, it is unique unlike, 7 in step 1) and step 2.
Step 1:7) it is electroplated on the neodymium iron boron of specific standard, neutral nickel layer, sour layers of copper, Pd coating are successively plated, with
And RhRu alloy layer；Then sealing pores are carried out using hole sealing agent on RhRu alloy layer, must has coated neodymium iron boron.
Step 2: will have coated neodymium iron boron SMT into printed circuit board, then the coated neodymium iron boron of tool is carried out
It magnetizes processing, obtains charging contact structure.
Embodiment 5
A kind of charging contact structure, comprising: neodymium iron boron and printed circuit board, neodymium iron boron are connected to printing by surface mount
On circuit board；Neodymium iron boron surface is covered with coating；Coating is followed successively by burnt copper coating, sour layers of copper, CuSnZn coating, Pd from the inside to surface
Coating, RhRu alloy layer.Burnt copper coating with a thickness of 8 μ -10 μ, the thickness with a thickness of 18 μ -20 μ, CuSnZn coating of sour layers of copper
Degree is for 2 μ -4.5 μ, Pd coating with a thickness of 0.6 μ -0.75 μ, RhRu alloy layer with a thickness of 0.75 μ -1 μ, RhRu Alloy Plating
Layer is the coating carried out after sealing pores.
The preparation method is the same as that of Example 1, it is unique unlike, 7 in step 1) and step 2.
Step 1:7) it is electroplated on the neodymium iron boron of specific standard, successively coke-plated copper coating, sour layers of copper, CuSnZn plating
Layer, Pd coating and RhRu alloy layer；Then sealing pores are carried out using hole sealing agent on RhRu alloy layer, must had
The neodymium iron boron of coating.
Step 2: will have coated neodymium iron boron SMT into printed circuit board, then the coated neodymium iron boron of tool is carried out
It magnetizes processing, obtains charging contact structure.
Embodiment 6
A kind of charging contact structure, comprising: neodymium iron boron and printed circuit board, neodymium iron boron are connected to printing by surface mount
On circuit board；Neodymium iron boron surface is covered with coating；Coating is followed successively by burnt copper coating, sour layers of copper, Pd coating, the first Au from the inside to surface
Coating, RhRu alloy layer.Burnt copper coating with a thickness of 8 μ -10 μ, sour layers of copper with a thickness of 18 μ -20 μ, Pd coating with a thickness of
0.6 μ -0.75 μ, the first Au coating with a thickness of 0.5 μ -0.75 μ, RhRu alloy layer with a thickness of 0.75 μ -1 μ, RhRu alloy
Coating is the coating carried out after sealing pores.
The preparation method is the same as that of Example 1, it is unique unlike, 7 in step 1) and step 2.
Step 1:7) it is electroplated on the neodymium iron boron of specific standard, successively coke-plated copper coating, sour layers of copper, Pd coating, the
One Au coating and RhRu alloy layer；Then sealing pores are carried out using hole sealing agent on RhRu alloy layer, obtaining has plating
The neodymium iron boron of layer.
Step 2: will have coated neodymium iron boron SMT into printed circuit board, then the coated neodymium iron boron of tool is carried out
It magnetizes processing, obtains charging contact structure.
Embodiment 7
A kind of charging contact structure, comprising: SmCo and printed circuit board, SmCo are connected to printed circuit by surface mount
On plate；SmCo surface is covered with coating；Coating is followed successively by burnt copper coating, sour layers of copper, Pd coating, RhRu Alloy Plating from the inside to surface
Layer, the 2nd Au coating.Burnt copper coating with a thickness of 8 μ -10 μ, sour layers of copper with a thickness of 18 μ -20 μ, Pd coating with a thickness of 0.6
μ -0.75 μ, RhRu alloy layer with a thickness of 0.75 μ -1 μ, the 2nd Au coating with a thickness of 0.125 μ -0.25 μ, the 2nd Au plating
Layer is the coating carried out after sealing pores.
The preparation method is the same as that of Example 1, it is unique unlike, 7 in step 1) and step 2.
Step 1:7) it is electroplated on the SmCo of specific standard, successively coke-plated copper coating, sour layers of copper, Pd coating, RhRu
Alloy layer and the 2nd Au coating；Then sealing pores are carried out using hole sealing agent on Au coating, must has coated samarium
Cobalt.
Step 2: will have coated SmCo SMT into printed circuit board, and then magnetize to the coated SmCo of tool
Processing, obtains charging contact structure.
Embodiment 8
A kind of charging contact structure, comprising: neodymium iron boron and printed circuit board, neodymium iron boron are connected to printing by surface mount
On circuit board；Neodymium iron boron surface is covered with coating；Coating is followed successively by burnt copper coating, sour layers of copper, CuSnZn coating, Pd from the inside to surface
Coating, the first Au coating, RhRu alloy layer and the 2nd Au coating.Burnt copper coating with a thickness of 8 μ -100 μ, sour layers of copper
With a thickness of 10 μ -100 μ, CuSnZn coating with a thickness of 1 μ -100 μ, Pd coating with a thickness of 0.4 μ -100 μ, the first Au coating
With a thickness of 0.3 μ -100 μ, RhRu alloy layer with a thickness of 0.75 μ -100 μ, the 2nd Au coating with a thickness of 0.125 μ -100 μ,
2nd Au coating is the coating carried out after sealing pores.
The preparation method is the same as that of Example 1, it is unique unlike, 7 in step 1) and step 2.
Step 1:7) it is electroplated on the neodymium iron boron of specific standard, successively coke-plated copper coating, sour layers of copper, CuSnZn plating
Layer, Pd coating, the first Au coating, RhRu alloy layer and the 2nd Au coating；Then hole sealing agent is utilized on the 2nd Au coating
Sealing pores are carried out, must have coated neodymium iron boron.
Step 2: will have coated neodymium iron boron SMT into printed circuit board, then the coated neodymium iron boron of tool is carried out
It magnetizes processing, obtains charging contact structure.
Embodiment 9
Fig. 4 is the schematic diagram that synthetic perspiration is electrolysed test in the embodiment of the present invention 9.
1, synthetic perspiration is electrolysed test:
1) end pad of the charging contact structure of earphone and the pin of the charging contact structure suitable for charging box will be suitable for
It is welded respectively with conducting wire at end；Wherein, the scolding tin that charging contact structure has carried out SMT cannot be covered on test contact surface, keep surveying
The cleaning for contacting surface of trying.
2) it magnetizes respectively to the magnet substrate of two charging contact structures, makes the middle end pad and the end pin of charging contact structure
It is drawn onto (i.e. consistent with the contact condition at the end pad and the end pin when charging normal) together, obtains one group of charging contact structure.
3) treated two groups of charging contact structures are placed in the same container for filling synthetic perspiration (PH4.7),
And charging contact structure can be completely submerged in synthetic perspiration；Using the anode and cathode as electrolytic cell, positive and negative anodes spacing
For 1-3cm, 55 Ω resistance are series between two sets of charging contact structures, and connect to power supply into circuit.
4) by current regulation to 90mA (voltage be 5V or so) and current stabilization is carried out, connects circuit, remains powered on state, often lead to
Disconnecting circuit after electricity one minute, the pad that will be close to positive terminal take out from synthetic perspiration, observe under the microscope after wiped clean
Coating breakage continues to test if coating is silver color；If nigrescence situation, which occurs, in coating exposes bottom magnet, stop surveying
Examination.As shown in Figure 3.
The standard of test is electrolysed by synthetic perspiration: it is required that coating failure time >=2min.
2, salt spray test:
Charging contact structure is placed in salt fog machine chamber, at 35 ± 2 DEG C of temperature, is continuously sprayed under the conditions of humidity > 85%
The NaCl solution that 48 hours concentration of saline fog are 5%, pH value 6.5-7.2,1 ± 0.3kg/cm of atomisation pressure2；Room temperature after test
Lower placement 2H reexamines appearance, function；
It is by the standard of salt spray test: it is required that appearance does not change as before the same progress salt spray test of function.It is logical
Normal appearance cannot have corrosion metachromatism.
3, synthetic perspiration's static test:
Charging contact structure is placed in sweat (acid ph 4.7) to impregnate, wraps up sample with non-dust cloth after immersion, and in 60
DEG C, 48h is placed under 90% temperature and humidity conditions, places 2h after test under room temperature, reexamines appearance, function；
Standard: it is required that appearance does not change as before the same progress synthetic perspiration's static test of function.Usual appearance is not
There can be corrosion metachromatism.
It is verified, the charging contact structure of the present embodiment passed above-mentioned synthetic perspiration be electrolysed test, salt spray test and
Synthetic perspiration's static test.And charging contact structure artificial perspiration resistance's liquid of embodiment 1 and embodiment 2 electrolysis test, salt fog are surveyed
The best performance of examination and synthetic perspiration's static test.
The embodiment of the present invention not only increases magnet substrate surface by the way that special functional coating is electroplated on magnet substrate
Planarization and smoothness, and realize the SMT of magnet substrate, solve magnet in existing charging contact structure and be unable to SMT
The problem of.Charging contact structure has salt spray resistance test, artificial perspiration resistance's liquid static test and artificial perspiration resistance's liquid in the present embodiment
It is electrolysed the performance of test, carries out charging synthetic perspiration's electrolysis test institute in 1 minute after solving traditional magnet electroplating technology SMT
There is coating that can be electrolysed and causes the problem of can not charging.
It is further noted that if not otherwise specified, any range documented by the present invention includes end value and end value
Between any numerical value and any subrange for being constituted with any number between end value or end value.
In the description of this specification, particular features, structures, materials, or characteristics described can be at any one or more
It can be combined in any suitable manner in embodiment or example.In addition, without conflicting with each other, those skilled in the art can be with
The feature of different embodiments or examples described in this specification and different embodiments or examples is combined.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or hidden
It include at least one this feature containing ground.In the description of the present invention, the meaning of " plurality " is two or more, unless otherwise
Clear specific restriction.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (13)
1. a kind of charging contact structure characterized by comprising magnet substrate, the magnet substrate surface are covered with coating；Institute
It states coating and is followed successively by noncorroding metal layer, sour layers of copper, metal barrier and anti-synthetic perspiration's electrolytic metal layer from the inside to surface.
2. charging contact structure according to claim 1, which is characterized in that further include: printed circuit board；Have coated
Magnet substrate is connected on the printed circuit board by surface mount.
3. charging contact structure according to claim 1, which is characterized in that
Anti- synthetic perspiration's electrolytic metal layer is Rh, Ru or RhRu alloy layer；Preferably, anti-synthetic perspiration's electrolysis
Metal layer is RhRu alloy layer；It is highly preferred that anti-synthetic perspiration's electrolytic metal layer with a thickness of 0.75 μ -1 μ.
4. charging contact structure according to claim 1, which is characterized in that the noncorroding metal layer be burnt copper coating or
Neutral nickel coating；Preferably, the noncorroding metal layer is burnt copper coating；It is highly preferred that the thickness of the noncorroding metal layer
For 8 μ -10 μ.
5. charging contact structure according to claim 1, which is characterized in that the metal barrier is Pd coating, Pt plating
Layer, PdCo coating, PdPt coating, PdAg coating, PdAu coating or PdIn coating；Preferably, the metal barrier is Pd plating
Layer；It is highly preferred that the metal barrier with a thickness of 0.6 μ -0.75 μ.
6. charging contact structure according to claim 1, which is characterized in that further include: setting is in the sour layers of copper and institute
State the anti-oxidant metal layer between metal barrier；The anti-oxidant metal layer is Ag coating, SnAg coating or CuSnZn plating
Layer；Preferably, the anti-oxidant metal layer is CuSnZn coating；It is highly preferred that the anti-oxidant metal layer with a thickness of 2 μ-
4.5μ。
7. charging contact structure according to claim 1, which is characterized in that further include: it is arranged in the metal barrier
Conductive metal layer between anti-synthetic perspiration's electrolytic metal layer；The conductive metal layer is Ag, SnAg, CuSnZn or Au plating
Layer；Preferably, the conductive metal layer is Au coating；It is highly preferred that the conductive metal layer with a thickness of 0.5 μ -0.75 μ.
8. charging contact structure according to claim 1, which is characterized in that anti-synthetic perspiration's electrolytic metal layer peripheral hardware
It is equipped with easy weld metal layers；The easy welding metal coating is Au, Sn, CuSnZn or SnAg coating；Preferably, the easy weldering
Connecing metal layer is Au coating；It is highly preferred that the easy weld metal layers with a thickness of 0.125 μ -0.25 μ.
9. charging contact structure according to claim 1, which is characterized in that the acid layers of copper can be replaced by the sour nickel layer
It changes；Preferably, the sour layers of copper with a thickness of 18 μ -20 μ.
10. charging contact structure according to claim 1, which is characterized in that the magnet substrate is neodymium iron boron or SmCo.
11. charging contact structure according to claim 1, which is characterized in that the coating is that outermost layer has carried out sealing of hole
The coating of processing；The outermost layer refers to anti-synthetic perspiration's electrolytic metal layer or plating in anti-synthetic perspiration's electrolyzing gold
Belong to other coating on layer.
12. a kind of preparation method of charging contact structure as described in any one of claim 1 to 10 characterized by comprising
Choose the magnet substrate of specific standard；It is electroplated on the magnet substrate surface, forms coating；In the coating surface
Sealing pores are carried out, obtain having coated magnet substrate；
Processing of magnetizing is carried out to the coated magnet substrate of tool, obtains charging contact structure.
13. preparation method according to claim 12, which is characterized in that filled to the coated magnet substrate of tool
Magnetic treatment, comprising: by the coated magnet substrate surface mount of tool into the printed circuit board, then have to described
The magnet substrate of coating carries out processing of magnetizing, and obtains charging contact structure.
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| PCT/CN2019/129053 WO2021036137A1 (en) | 2019-08-23 | 2019-12-27 | Contact, contact structure, electronic device and charging device |
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| CN113604847A (en) * | 2021-08-27 | 2021-11-05 | 歌尔科技有限公司 | Electric connector and electronic equipment with same |
| CN114250494A (en) * | 2021-12-30 | 2022-03-29 | 东莞中探探针有限公司 | Easily-welded workpiece and production method thereof |
| CN114709662A (en) * | 2022-03-29 | 2022-07-05 | 天津大学 | Vacuum magnetic flexible electronic interface |
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