CN110474192B - Signal connection structure and quantum chip packaging box based on interference fit - Google Patents
Signal connection structure and quantum chip packaging box based on interference fit Download PDFInfo
- Publication number
- CN110474192B CN110474192B CN201910669989.8A CN201910669989A CN110474192B CN 110474192 B CN110474192 B CN 110474192B CN 201910669989 A CN201910669989 A CN 201910669989A CN 110474192 B CN110474192 B CN 110474192B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 57
- 239000000463 material Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 7
- 230000000295 complement effect Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 2
- 230000008602 contraction Effects 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
一种基于过盈配合的信号连接结构及量子芯片封装盒体，基于过盈配合的信号连接结构，包括：一壳体，其上设置有连接器安装孔；信号连接器，用于安装于所述连接器安装孔中，包含连接器外壳；其中该连接器外壳与该连接器安装孔呈过盈配合的状态。在极低温的应用场景下，保证了连接器与电路板以及封装盒体的紧密接触及不漏光，增强了连接器与电路板及封装盒体的连接强度，并减少或避免了连接器与封装盒体的缝隙，有效保证了连接器与封装盒体的连接强度以及量子处理器的信号质量。
A signal connection structure based on interference fit and a quantum chip packaging box body, the signal connection structure based on interference fit, comprising: a shell, on which a connector mounting hole is provided; a signal connector, used to be installed in the connector mounting hole, comprising a connector shell; wherein the connector shell and the connector mounting hole are in an interference fit state. In extremely low temperature application scenarios, the close contact and light leakage of the connector, the circuit board and the packaging box body are ensured, the connection strength of the connector, the circuit board and the packaging box body is enhanced, and the gap between the connector and the packaging box body is reduced or avoided, effectively ensuring the connection strength of the connector and the packaging box body and the signal quality of the quantum processor.
Description
Technical Field
The disclosure belongs to the technical field of integrated circuit packaging, and relates to a signal connection structure and a quantum chip packaging box body based on interference fit, in particular to a signal connection structure which is used for connecting a quantum chip and an external signal connector and is based on interference fit and has high reliability at extremely low temperature (near absolute zero degree), and a quantum chip packaging box body comprising the signal connection structure.
Background
In the implementation of superconducting quantum computing, connecting the quantum processor to peripheral circuitry is an indispensable step. The superconducting quantum processor packaging box is a first-stage device connected with the quantum processor. How to connect and fan out various performance pins of the superconducting quantum processor and ensure that the interference on the signal performance of the line is reduced as small as possible becomes a design difficulty in the industry.
Regardless of how the quantum chip is connected to the first level connection, the connection size is ultimately scaled up to a macroscopically acceptable level by a standard or non-standard connector. How to connect the connector with the packaging box of the quantum processor with high performance and high reliability becomes a problem to be solved.
The technical difficulty is that the connector which is well connected with the box body at room temperature can cause separation of materials under extremely low temperature environment because of different thermal expansion coefficient characteristics of the materials, and light leakage is generated (single photon leakage is enough for the quantum processor to receive quite large noise), so that the working of the quantum processor is seriously influenced. On the other hand, the separation of materials due to the difference in thermal expansion coefficients of the materials tends to deteriorate the connection strength between the connector and the circuit board, and the connector and the package case are easily damaged due to the separation during the insertion and extraction of the connector.
In addition, how to achieve a tight connection also at low temperatures is of great importance.
Disclosure of Invention
First, the technical problem to be solved
The disclosure provides a signal connection structure and a quantum chip packaging box body based on interference fit, so as to at least partially solve the technical problems set forth above.
(II) technical scheme
In one aspect of the disclosure, a signal connection structure based on interference fit is provided, which comprises a shell 1 provided with a connector mounting hole 8, and a signal connector which is used for being mounted in the connector mounting hole 8 and comprises a connector shell 4, wherein the connector shell 4 and the connector mounting hole 8 are in an interference fit state.
In some embodiments of the present disclosure, the signal connector further comprises an outer conductor 5 disposed at a position above the inside of the connector housing 4, an insulator 6 disposed at a position below the inside of the connector housing 4, and an inner conductor 7 penetrating the inside of the insulator 6.
In some embodiments of the present disclosure, the signal connection structure is mounted on at least one of a top cover or a base of an enclosure, and the enclosure is sealed at an outer portion thereof and has a receiving space therein.
In some embodiments of the present disclosure, the signal connection structure is used as two components or one component of an encapsulation box body, the encapsulation box body includes a first shell and a second shell, shapes of opposite sides of the first shell and the second shell are complementary, and connector mounting holes are formed in the first shell and/or the second shell, and a correspondingly mounted connector housing and the connector mounting holes are in an interference fit state.
In some embodiments of the disclosure, the second housing is used as a base, the first housing is used as a top cover, a boss is arranged on the base, and a groove is correspondingly arranged on the top cover, wherein the depth of the groove is larger than the height of the boss.
In some embodiments of the present disclosure, the accommodating space is used for placing a PCB board, and the PCB board is used for placing a quantum chip.
In some embodiments of the present disclosure, the connector housing 4 is sized to have an interference fit with the connector mounting hole 8.
In some embodiments of the present disclosure, the connector housing 4 is sized to mate with the connector mounting hole 8, and the materials are configured to have an interference fit depending on the coefficient of thermal expansion of the materials.
In some embodiments of the present disclosure, the signal connection structure can be used in a working environment of 10mK to room temperature.
According to another aspect of the present disclosure, there is provided a quantum chip package comprising any one of the mentioned signal connection structures of the present disclosure.
(III) beneficial effects
From above-mentioned technical scheme, can see that the signal connection structure and quantum chip packaging box body based on interference fit that this disclosure provided has following beneficial effect:
1. Through the design connector shell size, make its and encapsulation casing on the connector mounting hole of reservation present interference fit's state to with the joint strength problem between connector and the circuit board, shift to the connector and be connected with encapsulation box mounting hole, can reach different joint strength requirements through adjusting interference fit's degree moreover. And when in interference fit, the connector mounting hole reserved in the packaging box body and the connector shell cannot form a gap, and the effect of light tightness is achieved. Therefore, in an extremely low-temperature application scene, the tight contact and light leakage prevention of the connector, the circuit board and the packaging box body are ensured, the connection strength of the connector, the circuit board and the packaging box body is enhanced, the gap between the connector and the packaging box body is reduced or avoided, and the connection strength of the connector and the packaging box body and the signal quality of the quantum processor are effectively ensured.
2. The signal connection structure can be used as a top cover or a base of the packaging box body or used as the top cover and the base at the same time, and can be adaptively arranged according to actual signal output requirements, and the quantum chip packaging box body comprising the signal connection structure has good signal transmission capacity, sealing performance and connection reliability.
Drawings
Fig. 1 is a schematic diagram of an interference fit-based signal connection structure according to an embodiment of the present disclosure.
[ Symbolic description ]
1-A first shell, 2-a PCB board;
A 3-second housing, a 4-connector housing;
5-outer conductor, 6-insulator;
7-inner conductors, 8-connector mounting holes.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
The signal connection structure based on interference fit in the disclosure may be only one package component, such as a top cover or a base, as a package box body illustrated in fig. 1, where the top cover or the base is used for external output of an electrical signal, and of course, in some embodiments, the signal connection structure may also be used for packaging a quantum chip, including a packaged integral structure, and in other embodiments, the signal connection structure is the signal connection structure based on interference fit in two package components correspondingly provided, so that output of an electrical signal can be achieved on two surfaces. Any technical concept that can be applied in very low temperature environments (e.g., temperatures of at least 10 mK) based on an interference fit of a connector housing with a connector mounting hole provided on a housing is within the scope of the present disclosure.
First embodiment
In a first exemplary embodiment of the present disclosure, a signal connection structure based on an interference fit is provided.
Fig. 1 is a schematic diagram of an interference fit-based signal connection structure according to an embodiment of the present disclosure.
Referring to fig. 1, the signal connection structure based on interference fit of the present disclosure includes a housing 1, on which a connector mounting hole 8 is provided, and a signal connector, which is configured to be mounted in the connector mounting hole 8 and includes a connector housing 4, wherein the connector housing 4 and the connector mounting hole 8 are in an interference fit state.
In the present disclosure, the signal connection structure is mounted on at least one of a top cover or a base of an enclosure, and the enclosure is sealed at the outside and has a receiving space therein for accommodating a quantum processor, such as a quantum chip.
In fig. 1, the case where the signal connection structure based on interference fit of the present embodiment is used as the top cover of the package box body is illustrated, however, in other embodiments, the signal connection structure may be used as the base of the package box body alone, or in the case where signal output is performed on both sides of the package box body, one signal connection structure is used as the top cover, one signal connection structure is used as the base, and the shapes of the shells of the two signal connection structures need to be correspondingly set, which will be described in the following embodiments.
In this embodiment, the signal connection structure based on interference fit is used for signal transmission of a quantum chip, can be used in a working environment ranging from 10mK to room temperature, and has better connection strength especially in an extremely low temperature environment, and can ensure close contact between a connector and a circuit board and close contact between the connector and a packaging box body and light leakage prevention.
In this embodiment, the signal connector further comprises an outer conductor 5 disposed at an upper position inside the connector housing 4, an insulator 6 disposed at a lower position inside the connector housing 4, and an inner conductor 7 penetrating inside the insulator 6.
In order to ensure the high frequency characteristic of signal transmission, the connection side of the conventional connector and the circuit board is generally electrically connected by adopting a surface welding mode, and in order to facilitate the assembly of the packaging shell, a hole which is equal to or slightly larger than the size of the connector is reserved on the packaging box body for installation, but an unavoidable gap is formed. In addition, at this time, the connector and the circuit board are welded through the surface with a small area, so that the connection strength is poor, the bearable tensile force is small, and the connector and the circuit board are easily separated from each other due to the plugging operation between the signal wire and the connector, so that the connector and the circuit board are damaged. In addition, due to the special use situation of the quantum chip packaging box body, the quantum chip packaging box body needs to work in an extremely low-temperature environment, a connector which is well connected with the packaging box body is seen at room temperature, under the extremely low-temperature environment, the problems of material separation, light leakage, poor connection strength of the connector and a circuit board and the like can be caused due to the fact that the material is different in thermal expansion coefficient characteristic, the quantum processor receives quite large noise due to the fact that single photon leakage is enough, and therefore the problem that the signal to noise ratio of the quantum processor is affected by the light leakage and the connection strength at low temperature can be generated by a traditional assembly process.
This disclosure is through design connector shell size, makes its and encapsulation casing on reserved mounting hole present interference fit's state to with the joint strength problem between connector and the circuit board, shift to the connector and encapsulation box body mounting hole be connected on, can reach different joint strength requirements through adjusting interference fit's degree moreover. And when in interference fit, the preformed hole of the packaging box body and the connector shell can not form a gap, and the effect of light tightness is achieved. Therefore, in an extremely low-temperature application scene, the tight contact and light leakage prevention of the connector, the circuit board and the packaging box body are ensured, the connection strength of the connector, the circuit board and the packaging box body is enhanced, and the gap between the connector and the packaging box body is reduced or avoided.
Of course, in this embodiment, there are various ways to make the connector housing 4 and the connector mounting hole 8 in an interference fit state, for example, the connector housing 4 and the connector mounting hole 8 are matched in size, and according to the different thermal expansion coefficients of the materials, the two materials are set to make them in an interference fit state, for example, the thermal expansion coefficient of the material of the housing 1 is greater than that of the connector housing 4, so that in the case of extremely low temperature, the shrinkage degree of the connector housing 4 is smaller than that of the housing 1, and in the case of extremely low temperature, an interference fit effect is achieved correspondingly, and the connection gap disappears, and in the case of ambient temperature, the interference fit state can still be maintained. For another example, the relative sizes of the connector housing 4 and the connector mounting hole 8 are designed so that the connector housing 4 and the connector mounting hole 8 are in an interference fit state in the use temperature range. And can also reach different joint strength requirements through adjusting interference fit's degree, have very strong practicality. The above-mentioned adjustment modes can be freely combined, for example, the size or the arrangement of materials are carried out singly, or the matching of materials is added in the case that the size accords with the interference fit, so as to adjust the degree of the interference fit.
Second embodiment
In a second exemplary embodiment of the present disclosure, a signal connection structure based on an interference fit is provided. The signal connection structure of the present embodiment has a function of chip packaging in addition to a signal connection function.
The signal connection structure is used as two components or one component of the packaging box body, the packaging box body comprises a first shell and a second shell, the shapes of the opposite sides of the first shell and the second shell are complementary, connector mounting holes are formed in the first shell and/or the second shell, and correspondingly mounted connector shells are in interference fit with the connector mounting holes.
In this embodiment, the signal connection structure based on interference fit is used as a top cover (for example, in the case of being used as a top cover illustrated in fig. 1) or a base of the packaging box body, and the corresponding packaging box body realizes signal output on the top cover or the base.
Namely, the signal connection structure based on interference fit of the embodiment comprises a first shell 1, a signal connector and a second shell 3, wherein the first shell is provided with a connector mounting hole 8, the signal connector is used for being mounted in the connector mounting hole 8 and comprises a connector shell 4, the second shell 3 is arranged opposite to the first shell 1 to form a packaging box body with sealed outside and a containing space inside, and the connector shell 4 and the connector mounting hole 8 are in an interference fit state.
Referring to fig. 1, a first case 1 of the present embodiment is exemplified by a top cover, a second case 3 is exemplified by a base, and a shape of a surface of the second case 3 opposite to the first case 1 is complementary to form a package case having an exterior sealed and a space for placing therein.
The first shell (such as a top cover) and the second shell (such as a base) are complementary in shape, in an example, an upward boss is arranged on the base and used for bearing a PCB and a quantum chip, a groove is formed in the surface of the top cover, which is opposite to the base, and the depth of the groove is larger than the height of the boss, so that a containing space is formed, the PCB can be placed in the containing space, and an external sealed packaging box body is formed after the top cover and the base are in butt joint.
Of course, in other embodiments, the first housing and the second housing may be other types of packaging forms and components, not limited to the forms of the top cover and the base in this embodiment, and may be expanded and changed based on the forms.
In this embodiment, the packaging box body is inside to have the space of placing the PCB board, the PCB board is used for placing the quantum chip, carries out the signal transmission through signal connection end and the connector of PCB board after the lead wire is carried out with the PCB board to the quantum chip.
The signal connection structure in the present embodiment has a function of chip packaging in addition to a signal connection function, and of course, in the present embodiment, signal connection is performed on the first housing 1 as an example, and in other embodiments, signal connection may be performed on the second housing, that is, a connector mounting hole is provided on the second housing and the connector mounting hole and a connector housing to be mounted are provided in an interference fit form.
Third embodiment
In a third exemplary embodiment of the present disclosure, a signal connection structure based on an interference fit is provided. The signal connection structure of the present embodiment is different from the signal connection structure of the second embodiment in that, in the present embodiment, the signal connection structure based on interference fit includes a first housing and a second housing, and the shape of the opposite side of the first housing and the second housing is complementary, as a top cover (for example, as a top cover illustrated in fig. 1) and a base of the package box at the same time. The second shell and the first shell form a packaging box body with sealed outside and a containing space inside.
In this embodiment, connector mounting holes are formed in the first housing and the second housing, and the connector housing of the connector to be mounted is in an interference fit state with the corresponding connector mounting hole. In this embodiment, two housings (a first housing and a second housing) of the signal connection structure are both used for signal transmission, so that a path of signal output is expanded.
Fourth embodiment
In a fourth exemplary embodiment of the present disclosure, a quantum chip package is provided comprising any one of the integrated signal connection structures of the present disclosure.
The signal connection structure based on interference fit can be used as a top cover or a base of the packaging box body or used as the top cover and the base simultaneously, and the signal connection structure is adaptively arranged according to actual signal output requirements.
To sum up, the disclosure provides an interference fit's signal connection structure and quantum chip encapsulation box, through designing connector shell size, makes its and encapsulation casing on reserved connector mounting hole present interference fit's state to on transferring the connection strength problem between connector and the circuit board to the connection of connector and encapsulation box mounting hole, can reach different connection strength requirement through adjusting interference fit's degree moreover. And when in interference fit, the connector mounting hole reserved in the packaging box body and the connector shell cannot form a gap, and the effect of light tightness is achieved. Therefore, in an extremely low-temperature application scene, the tight contact and light leakage prevention of the connector, the circuit board and the packaging box body are ensured, the connection strength of the connector, the circuit board and the packaging box body is enhanced, the gap between the connector and the packaging box body is reduced or avoided, and the connection strength of the connector and the packaging box body and the signal quality of the quantum processor are effectively ensured. In addition, the signal connection structure can be used as a top cover or a base of the packaging box body or used as the top cover and the base at the same time, and the quantum chip packaging box body comprising the signal connection structure has good signal transmission capability, sealing performance and connection reliability.
It should be noted that, no matter at room temperature or in a low temperature or very low temperature state, the scheme of ensuring close contact and no light leakage under the very low temperature condition only by utilizing the form or effect of interference fit belongs to the protection category. And the form of the interference fit is not limited to designs that utilize different materials with different thermal expansion coefficient characteristics or dimensions, any form that enables an interference fit is within the scope of the present disclosure.
It should be further noted that, the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings, and are not intended to limit the scope of the present disclosure. The shapes and dimensions of the various elements in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of the embodiments of the present disclosure. In addition, in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
The use of ordinal numbers such as "first," "second," "third," etc., in the description and the claims to modify a corresponding element does not by itself connote any ordinal number of elements or the order of manufacturing or use of the ordinal numbers in a particular claim, merely for enabling an element having a particular name to be clearly distinguished from another element having the same name. Furthermore, the word "comprising" or "comprises" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The various embodiments of the disclosure described above may be freely combined to form additional embodiments, unless otherwise technical hurdles or contradictions exist, which are all within the scope of the disclosure.
While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910669989.8A CN110474192B (en) | 2019-07-23 | 2019-07-23 | Signal connection structure and quantum chip packaging box based on interference fit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910669989.8A CN110474192B (en) | 2019-07-23 | 2019-07-23 | Signal connection structure and quantum chip packaging box based on interference fit |
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| CN110474192B true CN110474192B (en) | 2025-02-14 |
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| CN210517094U (en) * | 2019-07-23 | 2020-05-12 | 中国科学技术大学 | Signal connection structure and quantum chip package box body based on interference fit |
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| DE3128418A1 (en) * | 1981-07-17 | 1983-02-03 | Siemens AG, 1000 Berlin und 8000 München | HOUSINGS FOR ELECTRONIC COMPONENTS, ESPECIALLY OPTOELECTRONIC SEMICONDUCTOR COMPONENTS |
| US5781682A (en) * | 1996-02-01 | 1998-07-14 | International Business Machines Corporation | Low-cost packaging for parallel optical computer link |
| DE102013109261A1 (en) * | 2013-08-27 | 2015-03-05 | R.Stahl Schaltgeräte GmbH | Pressure relief device for flameproof enclosures with a porous body with interference fit |
| DE212015000174U1 (en) * | 2014-07-03 | 2017-02-17 | Firecomms Limited | An optocoupler and its components |
| CN104064922B (en) * | 2014-07-11 | 2016-07-27 | 中国工程物理研究院核物理与化学研究所 | A kind of real core radio frequency coaxial-cable switching device |
| US10136517B2 (en) * | 2015-11-27 | 2018-11-20 | Kyocera Corporation | Electronic component mounting package and electronic device |
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| CN208272245U (en) * | 2018-04-18 | 2018-12-21 | 广东林积为实业投资有限公司 | A waterproof structure of an adapter |
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| CN205693101U (en) * | 2016-06-16 | 2016-11-16 | 罗森伯格技术（昆山）有限公司 | A kind of cavity body filter |
| CN209087811U (en) * | 2018-12-19 | 2019-07-09 | 合肥本源量子计算科技有限责任公司 | A quantum chip three-dimensional packaging box |
| CN210517094U (en) * | 2019-07-23 | 2020-05-12 | 中国科学技术大学 | Signal connection structure and quantum chip package box body based on interference fit |
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