CN110473797B - Inspection system and method for semiconductor integrated circuit device - Google Patents
Inspection system and method for semiconductor integrated circuit device Download PDFInfo
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- CN110473797B CN110473797B CN201910611210.7A CN201910611210A CN110473797B CN 110473797 B CN110473797 B CN 110473797B CN 201910611210 A CN201910611210 A CN 201910611210A CN 110473797 B CN110473797 B CN 110473797B
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Abstract
The invention discloses a checking system and a method of a semiconductor integrated circuit device, the checking system comprises a checking module, a control module, an alarm module and a cloud platform, the cloud platform is used for storing and analyzing checking data, the invention is scientific and reasonable, the use is safe and convenient, a database in the cloud platform is used for storing the detection result of each single electronic component pin, and a data analysis submodule, a data extraction submodule and a data combination submodule are used for processing the stored data, the checked pin data can be effectively extracted and judged, which electronic component is easy to be failed in the production process of the semiconductor integrated circuit can be effectively known, the later production process of the semiconductor integrated circuit can be conveniently improved, the production quality of the semiconductor integrated circuit can be effectively improved, improvements in the production of semiconductor integrated circuits can be made continuously.
Description
Technical Field
The present invention relates to the technical field of semiconductor integrated circuits, and particularly to a system and a method for inspecting a semiconductor integrated circuit device.
Background
In a semiconductor integrated circuit, active elements such as transistors and diodes, and passive elements such as resistors and capacitors are interconnected according to a predetermined circuit and integrated on a single semiconductor chip, thereby achieving a specific circuit or system function.
However, after the semiconductor integrated circuit is manufactured, if the electronic components are subjected to a cold joint phenomenon, the semiconductor integrated circuit cannot be used, and the conventional method does not store and process the inspection data when the semiconductor integrated circuit is inspected, so that defects in the production process cannot be summarized according to the conventional inspection records, and the production process of the semiconductor integrated circuit cannot be improved.
Disclosure of Invention
The present invention is directed to a system and method for inspecting a semiconductor integrated circuit device to solve the problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: an inspection system of a semiconductor integrated circuit device, the inspection system including an inspection module, a control module, an alarm module, and a cloud platform;
the output end of the inspection module is electrically connected with the input end of the control module, and the output end of the control module is electrically connected with the alarm module and the input end of the cloud platform;
the inspection module is used for inspecting whether a cold joint phenomenon exists on a welding pin of the semiconductor integrated circuit or not, the control module is used for intelligently controlling the whole system and displaying an inspection result visually, the alarm module is used for alarming when the cold joint phenomenon appears in the inspection of the semiconductor integrated circuit, and the cloud platform is used for storing and analyzing inspection data.
According to the technical scheme, the inspection module comprises a first terminal, a second terminal, a resistor, a power supply, a display diode and a current transformer;
the output end of the power supply is electrically connected with the input end of the first terminal, the output end of the second terminal is electrically connected with the input end of the resistor, the output end of the resistor is electrically connected with the input end of the display diode, the output end of the display diode is electrically connected with the input end of the current transformer, and the output end of the current transformer is electrically connected with the input end of the power supply;
the first terminal and the second terminal are used for being in contact with an electronic component welding pin of the semiconductor integrated circuit and used for checking whether a cold joint phenomenon occurs to the pin, the resistor is used for reducing current in the circuit, the display diode is used for displaying whether the cold joint phenomenon occurs to the pin of the semiconductor integrated circuit, and the current transformer is used for detecting current in the checking module circuit and judging whether the cold joint phenomenon occurs to the pin of the semiconductor integrated circuit.
According to the technical scheme, the control module comprises a PLC (programmable logic controller), an input keyboard and a display screen;
the output end of the input keyboard is electrically connected with the input end of the PLC controller, the output end of the PLC controller is electrically connected with the input end of the display screen, and the PLC controller is electrically connected with the current transformer;
the PLC is used for carrying out intelligent control on the whole system and calculating and processing inspection data, the input keyboard is used for inputting the voltage and the resistance value of the inspection circuit, and the display screen is used for displaying the calculation and inspection results and subjectively judging whether the insufficient soldering phenomenon occurs on the pins of the semiconductor integrated circuit.
According to the technical scheme, the alarm module is an alarm lamp;
the output end of the PLC is electrically connected with the input end of the alarm lamp;
the alarm lamp is used for giving an alarm and reminding timely when the pin insufficient soldering phenomenon occurs to the semiconductor integrated circuit.
According to the technical scheme, the cloud platform comprises a data analysis sub-module, a data extraction sub-module, a data composition sub-module and a database;
the output end of the PLC controller is electrically connected with the input end of the database, the output end of the database is electrically connected with the input end of the data analysis submodule, the output end of the data molecule module is electrically connected with the input end of the data extraction submodule, and the output end of the data extraction submodule is electrically connected with the input end of the data combination submodule;
the database is used for storing the inspection data of the inspection module, the database comprises a plurality of data tables and is used for classifying and storing the data, the data molecule module is used for analyzing and processing the inspection data of the inspection module, the data extraction submodule is used for extracting the current data with similar current values, and the data composition submodule is used for combining the data with similar current values, storing the current with similar data into the data tables and calling and checking the current in the later period.
An inspection method of a semiconductor integrated circuit device, the inspection method comprising the steps of:
s1, inputting the voltage value and the resistance value of the checking module into the control module by using the input keyboard;
s2, lapping the first terminal and the second terminal at two pin welding positions of the semiconductor integrated circuit;
s3, detecting the current value in the checking module circuit by using a current transformer;
s4, comparing the current value of the current transformer with the calculated current value, and judging whether a cold joint phenomenon occurs or not;
s5, when the cold joint phenomenon occurs, the PLC controller is used for controlling the alarm module to alarm and remind in a memorial mode;
s6, storing the detection data of the inspection module into a database, so as to facilitate later retrieval and summarization;
and S7, classifying the detection data stored in the data by using the data analysis submodule, the data extraction submodule and the data combination submodule in the cloud platform, and processing the detection data.
According to the above technical solution, in the steps S1-S5, firstly, the voltage value U, the resistance value R and the resistance value R of the display diode of the module circuit are checked by using the input keyboardLInputting the data into a PLC controller, and according to ohm's law:
calculating the due current value I in the circuit of the inspection module1；
Respectively overlapping a first terminal and a second terminal at adjacent pins of two different electronic components of a semiconductor integrated circuit, connecting an inspection circuit, displaying whether the semiconductor integrated circuit has a cold joint phenomenon by using a display diode, and inspecting the real-time current I of a module circuit by using a current transformer2Carrying out detection;
when I is1≠I2During the time, the cold joint phenomenon has appeared in the welding of semiconductor integrated circuit's electronic components, utilizes the display screen to calculate the current value and detect the current value and show, PLC controller control alarm module's alarm lamp carries out timely warning, reminds the staff in time to look over.
According to the technical scheme, in the steps S6-S7, the detected current value and the calculated current value are stored into a database by using a PLC controller, the stored data are analyzed and processed by using a data molecule submodule in a cloud platform, the detected current value approximate to the pin of the corresponding electronic component in the data is extracted and classified by using a data extraction submodule, the data extracted by the data extraction submodule are composed by using a data combination submodule, and the corresponding data are stored into the same data table in the database.
According to the above technical scheme, the pin inspection frequency of one electronic component in the semiconductor integrated circuit is set to be N, and the normal current value of the pin of one electronic component in the semiconductor integrated circuit is set to be I, and the current value detected each time is respectively N1、n2、n3、...、nnAccording to the formula:
when N is presentFlat plateWhen the surface semiconductor integrated circuit is I, the pin welding of one electronic component in the surface semiconductor integrated circuit is in a normal state for a long time, and the production state of the electronic component in the production flow does not need to be monitored;
when N is presentFlat plateWhen the current is not equal to I, the pin soldering of one electronic component in the surface semiconductor integrated circuit is in an abnormal state, and the production state of the electronic component in the production flow needs to be monitored.
Compared with the prior art, the invention has the beneficial effects that: the current transformer is used for detecting the actual current in the circuit of the inspection module and comparing the actual current with the calculated current, so that whether a welding pin in the semiconductor integrated circuit has a fault or not and whether a false welding phenomenon occurs or not can be effectively inspected, the semiconductor integrated circuit is effectively inspected, the cloud platform is arranged, a database in the cloud platform is used for storing the detection result of each single electronic component pin, the data analysis submodule, the data extraction submodule and the data combination submodule are used for processing the stored data, the inspected pin data can be effectively extracted and judged, which electronic component is easy to have a fault in the production process of the semiconductor integrated circuit can be effectively known, the later production process of the semiconductor integrated circuit is convenient to improve, and the production quality of the semiconductor integrated circuit can be effectively improved, improvements in the production of semiconductor integrated circuits can be made continuously.
Drawings
FIG. 1 is a block diagram of an inspection system for a semiconductor integrated circuit device according to the present invention;
FIG. 2 is a schematic view of a connection structure of an inspection system of a semiconductor integrated circuit device according to the present invention;
FIG. 3 is a schematic diagram of a circuit connection structure of an inspection module of an inspection system of a semiconductor integrated circuit device according to the present invention;
FIG. 4 is a step diagram illustrating a method for inspecting a semiconductor integrated circuit device according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b): as shown in fig. 1 to 3, the present invention provides an inspection system of a semiconductor integrated circuit device, the inspection system including an inspection module, a control module, an alarm module, and a cloud platform;
the output end of the inspection module is electrically connected with the input end of the control module, and the output end of the control module is electrically connected with the alarm module and the input end of the cloud platform;
an inspection module: the device is used for checking whether the insufficient soldering phenomenon exists on the soldering pin of the semiconductor integrated circuit;
a control module: the system is used for intelligently controlling the whole system and also used for visually displaying the inspection result;
an alarm module: the alarm is used for alarming when the cold joint phenomenon appears in the inspection of the semiconductor integrated circuit;
cloud platform: for storing and analyzing the examination data.
The inspection module comprises a first terminal, a second terminal, a resistor, a power supply, a display diode and a current transformer;
the output end of the power supply is electrically connected with the input end of the first terminal, the output end of the second terminal is electrically connected with the input end of the resistor, the output end of the resistor is electrically connected with the input end of the display diode, the output end of the display diode is electrically connected with the input end of the current transformer, and the output end of the current transformer is electrically connected with the input end of the power supply;
first and second terminals: the device is used for contacting with the electronic component welding pin of the semiconductor integrated circuit and checking whether the pin has a cold joint phenomenon;
resistance: for reducing current in the circuit;
a display diode: the display device is used for displaying whether the cold joint phenomenon occurs to the pins of the semiconductor integrated circuit;
a current transformer: the detection module is used for detecting the current in the detection module circuit and judging whether the pin of the semiconductor integrated circuit has the cold joint phenomenon or not.
The control module comprises a PLC controller, an input keyboard and a display screen;
the output end of the input keyboard is electrically connected with the input end of the PLC controller, the output end of the PLC controller is electrically connected with the input end of the display screen, and the PLC controller is electrically connected with the current transformer;
a PLC controller: the system is used for intelligently controlling the whole system and calculating and processing the inspection data;
inputting a keyboard: a voltage and resistance value for inputting the inspection circuit;
a display screen: the method is used for displaying the results of calculation and inspection and subjectively judging whether the pin of the semiconductor integrated circuit has the cold joint phenomenon or not.
The alarm module is an alarm lamp;
the output end of the PLC is electrically connected with the input end of the alarm lamp;
an alarm lamp: the alarm device is used for alarming and reminding when the pin insufficient soldering phenomenon occurs to the semiconductor integrated circuit.
The cloud platform comprises a data analysis submodule, a data extraction submodule, a data composition submodule and a database;
the output end of the PLC controller is electrically connected with the input end of the database, the output end of the database is electrically connected with the input end of the data analysis submodule, the output end of the data molecule module is electrically connected with the input end of the data extraction submodule, and the output end of the data extraction submodule is electrically connected with the input end of the data combination submodule;
a database: the database comprises a plurality of data tables and is used for storing the inspection data of the inspection module in a classified manner;
a data molecule module: the system is used for analyzing and processing the inspection data of the inspection module;
a data extraction submodule: the current data extraction module is used for extracting current data with similar current values;
data composition submodule: the current storage device is used for combining the data with similar current values, storing the current with similar data into a data table and calling and checking the current at the later stage.
As shown in fig. 4, an inspection method of a semiconductor integrated circuit device, the inspection method comprising the steps of:
s1, inputting the voltage value and the resistance value of the checking module into the control module by using the input keyboard;
s2, lapping the first terminal and the second terminal at two pin welding positions of the semiconductor integrated circuit;
s3, detecting the current value in the checking module circuit by using a current transformer;
s4, comparing the current value of the current transformer with the calculated current value, and judging whether a cold joint phenomenon occurs or not;
s5, when the cold joint phenomenon occurs, the PLC controller is used for controlling the alarm module to alarm and remind in a memorial mode;
s6, storing the detection data of the inspection module into a database, so as to facilitate later retrieval and summarization;
and S7, classifying the detection data stored in the data by using the data analysis submodule, the data extraction submodule and the data combination submodule in the cloud platform, and processing the detection data.
According to the above technical solution, in the steps S1-S5, firstly, the voltage value U, the resistance value R and the resistance value R of the display diode of the module circuit are checked by using the input keyboardLInputting the data into a PLC controller, and according to ohm's law:
calculating the due current value I in the circuit of the inspection module1；
Respectively overlapping a first terminal and a second terminal at adjacent pins of two different electronic components of the semiconductor integrated circuit, connecting an inspection circuit, displaying whether the semiconductor integrated circuit has a cold joint phenomenon by using a display diode, and detecting the real-time current I2 of the inspection module circuit by using a current transformer;
when I1 is not equal to I2, the cold joint phenomenon appears in the welding of the electronic components of the semiconductor integrated circuit, the calculated current value and the detected current value are displayed by utilizing the display screen, and the PLC controller controls the alarm lamp of the alarm module to give an alarm in time to remind a worker to check in time.
According to the technical scheme, in the steps S6-S7, the detection current value and the calculated current value are stored into a database by using a PLC, the stored data are analyzed by using a data molecule submodule in a cloud platform, the detection current value approximate to the pin of the corresponding electronic component in the data is extracted and classified by using a data extraction submodule, the data extracted by the data extraction submodule are composed by using a data combination submodule, and the corresponding data are stored into the same data table in the database.
According to the above technical scheme, the pin inspection frequency of one electronic component in the semiconductor integrated circuit is set to be N, and the normal current value of the pin of one electronic component in the semiconductor integrated circuit is set to be I, and the current value detected each time is respectively N1、n2、n3、...、nnAccording to the formula:
when N is presentFlat plateWhen the surface semiconductor integrated circuit is I, the pin welding of one electronic component in the surface semiconductor integrated circuit is in a normal state for a long time, and the production state of the electronic component in the production flow does not need to be monitored;
when N is presentFlat plateWhen the current is not equal to I, the pin soldering of one electronic component in the surface semiconductor integrated circuit is in an abnormal state, and the production state of the electronic component in the production flow needs to be monitored.
The first embodiment is as follows: the voltage value 4.8V, the resistance value 22 omega of the checking module circuit and the resistance value 2 omega of the display diode are input into the PLC by using the input keyboard, and according to ohm's law:
calculating the due current value I in the circuit of the inspection module1＝0.5A；
Real-time current I2 of the checking module circuit is equal to 0A by using a current transformer;
I1≠I2it is indicated that the cold joint phenomenon occurs in the welding of the electronic components of the semiconductor integrated circuit.
Example two: the voltage value 4.8V, the resistance value 22 omega of the checking module circuit and the resistance value 2 omega of the display diode are input into the PLC by using the input keyboard, and according to ohm's law:
calculating the due current value I in the circuit of the inspection module1＝0.5A；
Real-time current I for checking module circuit by current transformer2＝0.5A；
I1＝I2It is indicated that the soldering of the electronic components of the semiconductor integrated circuit is in a normal state.
Example three: setting the pin checking frequency of one electronic component in the semiconductor integrated circuit as 10 times, setting the pin normal current value of one electronic component in the semiconductor integrated circuit as 0.5A, and setting the current values detected each time as 0.5A, 0.5A and 0.5A, respectively, according to the formula:
Nflat plate＝0.5A；
NFlat plateThe pin welding of one electronic component in the surface semiconductor integrated circuit is in a normal state for a long time, and the production state of the electronic component in the production flow does not need to be monitored;
example four: setting the pin checking frequency of one electronic component in the semiconductor integrated circuit as 10 times, setting the pin normal current value of one electronic component in the semiconductor integrated circuit as 0.5A, and setting the current values detected each time as 0.5A, 0A, 0.5A and 0.5A respectively, according to the formula:
Nflat plate＝0.4A；
NFlat plateNot equal to I, the pin soldering of an electronic component in a surface semiconductor integrated circuit is in an abnormal state, which is required for this in the production flowThe production state of each electronic component is monitored.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. An inspection system for a semiconductor integrated circuit device, characterized in that: the inspection system comprises an inspection module, a control module, an alarm module and a cloud platform;
the output end of the inspection module is electrically connected with the input end of the control module, and the output end of the control module is electrically connected with the alarm module and the input end of the cloud platform;
the inspection module is used for inspecting whether a cold joint phenomenon exists on a welding pin of the semiconductor integrated circuit, the control module is used for intelligently controlling the whole system and visually displaying an inspection result, the alarm module is used for giving an alarm when the cold joint phenomenon occurs on the inspection of the semiconductor integrated circuit, and the cloud platform is used for storing and analyzing inspection data;
the inspection module comprises a first terminal, a second terminal, a resistor, a power supply, a display diode and a current transformer;
the output end of the power supply is electrically connected with the input end of the first terminal, the output end of the second terminal is electrically connected with the input end of the resistor, the output end of the resistor is electrically connected with the input end of the display diode, the output end of the display diode is electrically connected with the input end of the current transformer, and the output end of the current transformer is electrically connected with the input end of the power supply;
the first terminal and the second terminal are used for being in contact with an electronic component welding pin of the semiconductor integrated circuit and used for checking whether a cold joint phenomenon occurs to the pin, the resistor is used for reducing current in the circuit, the display diode is used for displaying whether the cold joint phenomenon occurs to the pin of the semiconductor integrated circuit, and the current transformer is used for detecting current in the checking module circuit and judging whether the cold joint phenomenon occurs to the pin of the semiconductor integrated circuit.
2. The inspection system of a semiconductor integrated circuit device according to claim 1, wherein: the control module comprises a PLC controller, an input keyboard and a display screen;
the output end of the input keyboard is electrically connected with the input end of the PLC controller, the output end of the PLC controller is electrically connected with the input end of the display screen, and the PLC controller is electrically connected with the current transformer;
the PLC is used for carrying out intelligent control on the whole system and calculating and processing inspection data, the input keyboard is used for inputting the voltage and the resistance value of the inspection circuit, and the display screen is used for displaying the calculation and inspection results and subjectively judging whether the insufficient soldering phenomenon occurs on the pins of the semiconductor integrated circuit.
3. The inspection system of a semiconductor integrated circuit device according to claim 2, wherein: the alarm module is an alarm lamp;
the output end of the PLC is electrically connected with the input end of the alarm lamp;
the alarm lamp is used for giving an alarm and reminding timely when the pin insufficient soldering phenomenon occurs to the semiconductor integrated circuit.
4. The inspection system of a semiconductor integrated circuit device according to claim 3, wherein: the cloud platform comprises a data analysis sub-module, a data extraction sub-module, a data composition sub-module and a database;
the output end of the PLC controller is electrically connected with the input end of the database, the output end of the database is electrically connected with the input end of the data analysis submodule, the output end of the data analysis submodule is electrically connected with the input end of the data extraction submodule, and the output end of the data extraction submodule is electrically connected with the input end of the data combination submodule;
the database is used for storing the inspection data of the inspection module, the database comprises a plurality of data tables and is used for classifying and storing the data, the data analysis submodule is used for analyzing and processing the inspection data of the inspection module, the data extraction submodule is used for extracting the current data with similar current values, and the data composition submodule is used for combining the data with similar current values, storing the current with similar data into the data tables and calling and checking the current in the later period.
5. A method for inspecting a semiconductor integrated circuit device, comprising: the inspection method comprises the following steps:
s1, inputting the voltage value and the resistance value of the checking module into the control module by using the input keyboard;
s2, lapping the first terminal and the second terminal at two pin welding positions of the semiconductor integrated circuit;
s3, detecting the current value in the checking module circuit by using a current transformer;
s4, comparing the current value of the current transformer with the calculated current value, and judging whether a cold joint phenomenon occurs or not;
s5, when the cold joint phenomenon occurs, the PLC controller is used for controlling the alarm module to alarm and remind in a memorial mode;
s6, storing the detection data of the inspection module into a database, so as to facilitate later retrieval and summarization;
and S7, classifying the detection data stored in the data by using the data analysis submodule, the data extraction submodule and the data combination submodule in the cloud platform, and processing the detection data.
6. The semiconductor of claim 5A method for inspecting a bulk integrated circuit device, comprising: in the steps S1-S5, first, the voltage value U, the resistance value R and the resistance value R of the display diode of the inspection module circuit are checked by using the input keyboardLInputting the data into a PLC controller, and according to ohm's law:
calculating the due current value I in the circuit of the inspection module1；
Respectively overlapping a first terminal and a second terminal at adjacent pins of two different electronic components of a semiconductor integrated circuit, connecting an inspection circuit, displaying whether the semiconductor integrated circuit has a cold joint phenomenon by using a display diode, and inspecting the real-time current I of a module circuit by using a current transformer2Carrying out detection;
when I is1≠I2During the time, the cold joint phenomenon has appeared in the welding of semiconductor integrated circuit's electronic components, utilizes the display screen to calculate the current value and detect the current value and show, PLC controller control alarm module's alarm lamp carries out timely warning, reminds the staff in time to look over.
7. The inspection method of a semiconductor integrated circuit device according to claim 5, wherein: in the steps S6-S7, the PLC controller stores the detected current value and the calculated current value into the database, the data molecule submodule in the cloud platform analyzes and processes the stored data, the data extraction submodule extracts and classifies the detected current value approximate to the pin of the corresponding electronic component in the data, the data combination submodule composes the data extracted by the data extraction submodule, and the corresponding data is stored into the same data table in the database.
8. The inspection method of a semiconductor integrated circuit device according to claim 5, wherein:setting the number of pin checks of an electronic component in a semiconductor integrated circuit to be N, and setting the normal current value of the pin of the electronic component in the semiconductor integrated circuit to be I, wherein the detected current values are N1、n2、n3、...、nnAccording to the formula:
when N is presentFlat plateWhen the surface semiconductor integrated circuit is I, the pin welding of one electronic component in the surface semiconductor integrated circuit is in a normal state for a long time, and the production state of the electronic component in the production flow does not need to be monitored;
when N is presentFlat plateWhen the current is not equal to I, the pin soldering of one electronic component in the surface semiconductor integrated circuit is in an abnormal state, and the production state of the electronic component in the production flow needs to be monitored.
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