CN110471242A - Light source fixed substrate, light source heat radiation mechanism and projector - Google Patents

Abstract

The embodiment of the invention provides a kind of light source fixed substrate, light source heat radiation mechanism and projectors, belong to porjector technology field.The light source fixed substrate includes bottom surface, top surface and the first side being connected between bottom surface and top surface, bottom surface is opposite with top surface, light source fixed substrate is provided at least one mounting hole for grafting heat-conducting piece, and mounting hole forms the entrance being inserted into for heat-conducting piece through first side.Volume can be reduced under the premise of guaranteeing heat dissipation effect using the light source heat radiation mechanism of the light source fixed substrate, and to further reduce volume using the projector of the light source fixed substrate, conducive to the miniaturization of projector.

Description

Light source fixing substrate, light source cooling mechanism and projector

technical field

The invention relates to the technical field of projectors, in particular to a light source fixing substrate, a light source cooling mechanism and a projector.

Background technique

Micro projectors, also known as portable projectors, make the traditional huge projectors compact, portable, miniaturized, entertaining, and practical, making projection technology closer to life and entertainment, and have a wide range of application prospects.

For high-brightness micro-projectors, the total power of the system is large, and how to design products with low noise and low surface temperature is a major difficulty. Therefore, the heat dissipation design of the system is a major challenge. At the same time, limited by the size of the heat dissipation module, it is difficult for the existing miniature projectors to further reduce the volume of the projector under the premise of ensuring the heat dissipation performance.

Contents of the invention

The object of the present invention is to provide a light source fixing substrate, which has an excellent heat conduction structure.

Another object of the present invention is to provide a heat dissipation mechanism for a light source, which has the characteristics of excellent heat dissipation performance and small volume.

Another object of the present invention is to provide a projector, which greatly reduces the volume of the projector while ensuring heat dissipation performance by providing the above heat dissipation mechanism.

Embodiments of the present invention are achieved like this:

A light source fixing substrate for a projector, the light source fixing substrate includes a bottom surface, a top surface, and a first side face connected between the bottom surface and the top surface, the bottom surface is opposite to the top surface, and the light source The fixed base plate is provided with at least one installation hole for inserting the heat conduction element, and the installation hole passes through the first side to form an entrance for the heat conduction element to be inserted into.

In some embodiments of the present invention, the installation hole is a through hole, and the axis of the installation hole is parallel to the bottom surface.

In some embodiments of the present invention, the top surface is provided with a mounting groove for mounting a circuit board.

In some embodiments of the present invention, a through hole is provided in the installation groove, and the through hole penetrates through the bottom surface.

In some embodiments of the present invention, there are at least two installation holes, and at least two installation holes are distributed on both sides of the installation groove.

A heat dissipation mechanism for a light source, comprising: the above-mentioned light source fixing substrate, a heat conduction element, and a heat dissipation device, one end of the heat conduction element is plugged into the installation hole, and the other end is exposed from the inlet, and the heat dissipation device is connected to the heat dissipation device. One end of the heat conducting element exposed to the inlet is connected.

In some embodiments of the present invention, the heat dissipation device includes a plurality of heat dissipation fins, each of the heat dissipation fins is connected to the heat conducting element, and there is a predetermined gap between adjacent heat dissipation fins.

A projector, comprising: the above-mentioned light source fixing substrate, light source, circuit board and heat dissipation device, the light source is detachably mounted on the light source fixing substrate; the circuit board is arranged on the top surface and electrically connected to the light source One end of the heat conducting element is plugged into the installation hole, and the other end is exposed from the inlet, and the heat sink is connected to the end of the heat conducting element exposed to the inlet.

In some embodiments of the present invention, the top surface is provided with a mounting groove for mounting a circuit board, and the circuit board is accommodated in the mounting groove.

In some embodiments of the present invention, a through hole is provided in the installation groove, and the through hole penetrates through the bottom surface, and the pins of the light source extend into the through hole and are electrically connected with the circuit board.

The beneficial effects of the present invention include: by setting mounting holes on the light source fixing base plate and assembling with the heat conducting parts for heat dissipation through the mounting holes, on the one hand, parts are reduced, volume space is saved, and space for further volume reduction is reserved , so it can be applied to projectors, lasers, and other devices that use light sources to fix substrates. When the light source fixed substrate is connected to the heat conducting member, heat can be directly transferred, and the heat transfer efficiency is improved, which is more conducive to heat dissipation.

After the above-mentioned light source is used to fix the substrate and assembled with the heat conducting element and the heat dissipation device, the volume of the light source heat dissipation mechanism can be greatly reduced. The projector with the heat dissipation mechanism achieves the effect of further reducing the volume on the premise of ensuring the heat dissipation effect.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or can be learned by practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

FIG. 1 is a schematic structural view of a light source fixing substrate provided by an embodiment of the present invention;

Fig. 2 is a sectional view along line A-A in Fig. 1;

FIG. 3 is a schematic structural diagram of a heat dissipation mechanism in a projector provided by an embodiment of the present invention at a first viewing angle;

FIG. 4 is a schematic structural diagram of a heat dissipation mechanism in a projector provided by an embodiment of the present invention under a second viewing angle;

Fig. 5 is a schematic structural diagram of the heat dissipation mechanism in the projector provided by the embodiment of the present invention under a third viewing angle;

FIG. 6 is a schematic structural diagram of a heat dissipation fin in a projector provided by an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of the projector provided in an embodiment of the present invention in an assembled state.

Reference signs: 10-projector; 20-heat dissipation mechanism; 100-light source fixed substrate; 101-bottom surface; 102-first side; 103-top surface; 105-inlet; 110-installation hole; 120-installation groove; - through hole; 200 - heat conducting element; 300 - heat dissipation device; 310 - heat dissipation fin; 320 - connection hole; 400 - light source; 410 - pin; 500 - circuit board.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present invention, it should be noted that the terms "middle", "upper", "lower", "front", "rear", "vertical", "inner", "outer", etc. The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that is usually placed when the product of the invention is used, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device Or elements must have a certain orientation, be constructed and operate in a certain orientation, and thus should not be construed as limiting the invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that a component is absolutely level or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "setting", "communication", and "connection" should be interpreted in a broad sense, for example, it can be a fixed connection or an optional connection. Detachable connection, or integral connection; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

Example

Please refer to FIG. 1 and FIG. 2 together. This embodiment provides a light source fixing substrate 100 . The light source fixing substrate 100 is a plate structure, which can be applied to devices such as micro projectors. The light source fixing substrate 100 is made of metal material or metal alloy material, such as aluminum, aluminum alloy, etc. In this embodiment, the light source fixing substrate 100 is made of copper.

Please continue to refer to FIG. 1 , the light source fixing substrate 100 includes a bottom surface 101, a first side surface 102, a top surface 103, and a second side surface (not shown), wherein the bottom surface 101 is opposite to the top surface 103, and the first side surface 102 is connected to Between the bottom surface 101 and the top surface 103, the first side 102 is opposite to the second side. The bottom surface 101 is used for installing the light source 400, and the installation methods include but not limited to welding, threaded connection, clamping and the like.

It should be understood that the "bottom surface" and "top surface" in the present disclosure are only used for distinguishing descriptions, and are not used to limit their specific orientation or position. For example, the positions of the bottom surface 101 and the top surface 103 do not specifically refer to downward or upward, When the light source fixing substrate 100 is turned over, the bottom surface 101 may also be located above the top surface 103 .

The light source fixing substrate 100 is provided with a mounting hole 110, and the mounting hole 110 may be a through hole or a blind hole. In this embodiment, the mounting hole 110 penetrates through the first side 102 to form an entrance 105 for inserting a heat conducting member, and the mounting hole 110 penetrates second side. The heat conduction element here refers to: a component used to conduct heat outward, wherein the heat conduction element can be in the shape of a tube, a rod or other shapes, and the material of the heat conduction element can be metal or other materials.

In some embodiments, the axis of the mounting hole 110 is parallel to the bottom surface 101. It should be understood that the "parallel" mentioned in the present disclosure is not limited to the absolute parallel state of the two objects, including the approximately parallel state of the two objects. . The "perpendicular" is not limited to the absolute vertical state of two objects, including the approximately vertical state of two objects.

The number of mounting holes 110 can be one, two or more, which can be set according to specific heat dissipation requirements. As a preferred embodiment, when the number of mounting holes 110 is two or more, all It is more appropriate that the axes of the mounting holes 110 are parallel to each other, so as to facilitate assembly and connection with the heat conducting element 200 and the heat sink 300 .

In this embodiment, there are two installation holes 110 , and the axes of the two installation holes 110 are parallel to each other, and the two installation holes 110 respectively pass through the first side surface 102 and the second side surface. Regarding the cross-sectional design of the mounting hole 110 , the cross-section here refers to a cut plane perpendicular to the axial direction of the mounting hole 110 . According to actual assembly requirements, it only needs to be matched with the heat conducting element 200 . For example: when the heat conducting element 200 is in the shape of a round tube or a round rod, the cross-sectional shape of the installation hole 110 can be designed as a circle, that is, the installation hole 110 is a round hole. When the heat conducting element 200 is an oval tube, correspondingly, the cross-sectional shape of the installation hole 110 can be designed to be oval. In this embodiment, as an example, the cross section of the installation hole 110 is oblong, that is, the installation hole 110 is an oblong hole (waist hole).

In order to further make the light source fixing substrate 100 fit with other components and realize the miniaturization of the structure during application, for example, fit with electrical components such as the circuit board 500 .

In this embodiment, the top surface 103 is also provided with a mounting groove 120, and the mounting groove 120 is used to accommodate the mounting circuit board 500. Therefore, the shape of the mounting groove 120 is configured as a structure adapted to the corresponding circuit board 500, wherein the circuit The board 500 is an element for supplying power and controlling the light source. In this embodiment, the installation groove 120 is a substantially bar-shaped groove, and two ends of the installation groove 120 respectively pass through the first side 102 and the second side.

In this embodiment, as an example, the extension direction of the installation groove 120 is parallel to the axial direction of the installation hole 110. This arrangement is conducive to the installation of the light source on the light source fixing substrate. In particular, when there are multiple light sources, multiple light sources They may be arranged along the axial direction of the mounting hole 110 to facilitate heat dissipation. It should be understood that, in other embodiments, the extending direction of the installation groove 120 is not limited, and it may extend in any direction according to actual usage requirements.

As a more preferred implementation, in this embodiment, the installation groove 120 is arranged in the middle of the light source fixing substrate 100, and the two installation holes 110 are distributed on both sides of the axis of the installation groove 120. This arrangement has the following advantages: The distribution of the holes 110 is relatively uniform. After being assembled with the heat conducting element 200 , the effect of uniform heat dissipation can be achieved, the heat dissipation efficiency can be improved, and the local overheating of the light source fixing substrate 100 can be prevented.

In some implementations, the number of mounting holes 110 is more than two. In this case, a similar manner may be used to evenly distribute the multiple mounting holes 110 on both sides of the axis of the mounting groove 120 .

When the light source fixing substrate 100 is used, the circuit board 500 installed in the installation groove 120 needs to be electrically connected with the light source 400. Therefore, for the convenience of assembly, a through hole 130 is provided in the installation groove 120, and the through hole 130 communicates with the installation groove 120 and runs through the The bottom surface 101 , in some embodiments, the through hole 130 runs through the bottom surface in such a way that its axis is perpendicular to the bottom surface. The number of through holes 130 is set according to the number of light sources 400, and usually each light source 400 is provided with two pins 410 for electrical connection, so a more preferred embodiment is to set the through holes 130 as the pins of the light source 400 410 fit form.

In this embodiment, as an example: referring to FIG. 1 and FIG. 2, the through hole 130 is a circular hole, and the diameter of the through hole 130 is slightly larger than the width of the installation groove 120, and the through hole 130 can supply all the light sources 400 simultaneously. Pin 410 goes through. Wherein, two through holes 130 are arranged in the installation groove 120, and the two through holes 130 are arranged at a certain distance apart.

The light source fixing substrate 100 provided in this embodiment can be applied to the micro-projector 10 and other devices that require the light source fixing substrate 100, because the structure of the light source fixing substrate 100 can be directly assembled with the heat conducting member 200, and by installing The groove 120 accommodates the circuit board 500 , which does not need additional elements for connecting with the heat conducting element 200 , so the volume of the micro projector 10 can be further reduced while maintaining good heat dissipation performance.

Based on the above-mentioned light source fixing substrate 100 , this embodiment also provides a projector 10 . The projector 10 includes a light source fixing substrate 100 , a heat conducting element 200 , a heat sink 300 , a light source 400 and a circuit board 500 . Wherein, the light source fixing substrate 100 , the heat conducting member 200 and the heat dissipation device 300 are connected to form a heat dissipation mechanism 20 , which transfers heat generated by the light source to the outside. The light source 400 is detachably installed on the bottom surface 101 of the power supply fixing substrate 100 , and the circuit board 500 is disposed in the installation groove 120 on the top surface 103 .

Please refer to Fig. 3, Fig. 4, and Fig. 5 together. Fig. 3-Fig. Including other parts such as the housing, since other parts of the projector 10 do not belong to the key point of the present invention, they are not shown in the figure, and those skilled in the art can refer to the existing technology to realize it, and will not repeat them here.

Specifically, the heat dissipation mechanism 20 includes a light source fixing substrate 100 , a heat conducting element 200 , and a heat dissipation device 300 , wherein the structure of the light source fixing substrate 100 can be referred to the foregoing section. One end of the heat conducting member 200 extends from the inlet 105 into the mounting hole 110 to connect with the light source fixing substrate 100 , and the other end connects with the heat sink 300 to conduct heat.

The heat conducting member 200 is used to transfer the heat on the light source fixing substrate 100 to the heat sink 300. In this embodiment, the heat conducting member 200 is a heat pipe whose shape matches the oblong mounting hole 110 of the light source fixing substrate 100, and its cross section is Oval. There are two heat-conducting elements 200 , and the two heat-conducting elements 200 correspond to the two installation holes 110 one by one. During assembly, the heat-conducting elements 200 extend into the installation holes 110 from the entrance 105 of the first side 102 and form a fixed position. It should be understood that the fixing methods of the heat conduction element 200 and the installation hole 110 include but not limited to screw connection, clamping, interference fit, etc. In this embodiment, the heat conduction element 200 extends into the installation hole 110 and is welded and fixed with the light source fixing substrate 100 .

The heat conduction element 200 can be a solid and/or hollow structure, and when the heat conduction element 200 adopts a hollow structure, its interior can also be filled with other heat conduction materials.

The heat dissipation device 300 includes a plurality of stacked heat dissipation fins 310. The structure of the heat dissipation fins 310 is shown in FIG. , copper, etc. The heat dissipation fins 310 are provided with connection holes 320, the connection holes 320 are used for passing the heat conduction element 200, so the number of the connection holes 320 is the same as the number of the heat conduction elements 200, in this embodiment, the same number as the heat conduction elements 200, The number of the connecting holes 320 is two, and the axes of the two connecting holes 320 are both perpendicular to the cooling fins 310 . During assembly, the two heat-conducting elements 200 respectively protrude into the connection holes 320 and connect with the heat dissipation fins 310 , preferably by welding.

It should be understood that the structure of the heat dissipation fins 310 shown in FIG. The position of the connection hole 310 provided on the top can also be changed according to the specific application environment. The number of connection holes 310 can also be adjusted accordingly according to the number of heat conducting elements 200 .

In this embodiment, the projections of the plurality of cooling fins 310 on a plane perpendicular to the heat conducting element 200 overlap each other. This arrangement minimizes the volume of the cooling device, which is more conducive to further reducing the volume of the projector 10 . It should be understood that the heat dissipation fins 310 in the same heat dissipation device 300 do not have to adopt the same structure. For example, in the same heat dissipation device 300, rectangular and circular heat dissipation fins are selected at the same time, and the stacking method does not have to be kept parallel to each other or kept the same. spacing.

Each heat dissipation fin 310 is connected to the heat conducting element 200 and is approximately parallel to each other. There is a gap between adjacent heat dissipation fins 310 , and the gap is preset according to the requirement of heat conduction. The number of heat dissipation fins 310 is set according to heat dissipation requirements, for example, 5 pieces, 10 pieces, etc., and the gap between adjacent heat dissipation fins 310 may be, for example, 0.5mm-1cm.

In some embodiments, the number of heat sinks 300 can be more than one, for example, a part of the heat conduction element 200 is passed through the second side, and a heat sink 300 is connected to the part of the heat conduction element 200 that passes through the second side, so as to achieve more Good cooling effect.

The light source 400 can be a gas discharge light source 400, an LED light source 400 or a laser light source 400. In this embodiment, the light source 400 is a laser light source 400. The light source 400 includes two pins 410. The pins 410 are made of conductors and are used to communicate with the circuit. The board 500 is electrically connected.

The circuit board 500 is used to supply power to the light source 400 and control the light source 400. The circuit board 500 is arranged in the installation groove 120 and is housed in the installation groove 120 as a whole. The light source 400 is arranged on the bottom surface 101, and the pin 410 of the light source 400 extends into the through hole. 130 and is electrically connected with the circuit board 500.

In other embodiments, according to the size of the circuit board 500 and the light source fixing substrate 100, the circuit board 500 can also be only partially accommodated in the installation groove 120, for example: the size of the circuit board 500 in the length direction is larger than that of the light source fixing substrate 100 The length of the installation slot 120 is at this time, a part of the circuit board 500 can protrude from the installation slot 120 .

When the projector 10 provided in this embodiment is in operation, the heat generated by the light source 400 and the circuit board 500 is transferred to the light source fixing substrate 100, and then transferred to the heat dissipation fins 310 of the heat dissipation device 300 through the heat conduction member 200, and the heat generated by the heat dissipation fins 310 scatter the heat outward, since there is no need to add a fixed substrate of the heat conduction member 200 on the light source fixed substrate 100, and the circuit board is accommodated in the light source fixed substrate 100 by 500 times, no additional volume is required, thus further reducing the size of the micro projector. At the same time, since the heat on the light source fixing substrate 100 is directly transferred to the heat conducting member 200, the heat transfer efficiency is further improved. Based on the above technical effects, the projector 10 provided by this embodiment further realizes the miniaturization of the structure.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. a kind of light source fixed substrate, which is characterized in that the light source fixed substrate includes bottom surface, top surface and is connected on described First side between bottom surface and the top surface, the bottom surface is opposite with the top surface, the light source fixed substrate be provided with to Few one is used for the mounting hole of grafting heat-conducting piece, and the mounting hole is formed through the first side for heat-conducting piece insertion Entrance.

2. light source fixed substrate according to claim 1, which is characterized in that the mounting hole is through-hole, the mounting hole Axis it is parallel with the bottom surface.

3. light source fixed substrate according to claim 1, which is characterized in that the top surface is provided with for mounting circuit boards Mounting groove.

4. light source fixed substrate according to claim 3, which is characterized in that through-hole is provided in the mounting groove, it is described Through-hole runs through the bottom surface.

5. light source fixed substrate according to claim 3, which is characterized in that the mounting hole is at least two, at least two A mounting hole is distributed in the two sides of the mounting groove.

6. a kind of light source heat radiation mechanism characterized by comprising

The described in any item projector light source fixed substrates of claim 1-5；

Heat-conducting piece, one end of the heat-conducting piece are plugged in the mounting hole, and the other end exposes from the entrance, and；

Radiator, the radiator are connect with one end of the exposing entrance of the heat-conducting piece.

7. light source heat radiation mechanism according to claim 6, which is characterized in that the radiator includes dissipating for muti-piece stacking Hot fin, every piece of radiating fin are connect with the heat-conducting piece, have preset gap between the adjacent radiating fin.

8. a kind of projector characterized by comprising

Projector light source fixed substrate described in claim 1；

Light source, the light source are removably mounted to the bottom surface of the light source fixed substrate；

Circuit board, the circuit board are set to the top surface and are electrically connected with the light source；

Heat-conducting piece, one end of the heat-conducting piece are plugged in the mounting hole, and the other end exposes from the entrance, and；

Radiator, the radiator are connect with one end of the exposing entrance of the heat-conducting piece.

9. projector according to claim 8, which is characterized in that the top surface is provided with the installation for mounting circuit boards Slot, the circuit board are incorporated in the mounting groove.

10. projector according to claim 9, which is characterized in that be provided with through-hole in the mounting groove, the through-hole passes through Wear the bottom surface, the pin of the light source protrude into the through-hole and with the circuit board electrical connection.