CN110461105B - Automatic control copper deposition process for printed circuit board - Google Patents
Automatic control copper deposition process for printed circuit board Download PDFInfo
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- CN110461105B CN110461105B CN201910666695.XA CN201910666695A CN110461105B CN 110461105 B CN110461105 B CN 110461105B CN 201910666695 A CN201910666695 A CN 201910666695A CN 110461105 B CN110461105 B CN 110461105B
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- Prior art keywords
- copper deposition
- control system
- circuit board
- hole
- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 65
- 239000010949 copper Substances 0.000 title claims abstract description 65
- 238000005137 deposition process Methods 0.000 title claims description 10
- 238000000151 deposition Methods 0.000 claims abstract description 46
- 230000008021 deposition Effects 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000005070 sampling Methods 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003384 imaging method Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 5
- 239000003814 drug Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000006855 networking Effects 0.000 description 2
- 238000011002 quantification Methods 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides an automatic copper deposition control process of a printed circuit board, which needs to provide a super-depth-of-field microscope and a control system, wherein the super-depth-of-field microscope is connected with the control system and is controlled by the control system, and the process comprises the following steps: drilling a hole on the PCB; removing burrs in the hole; horizontally depositing copper; sampling the PCB after copper deposition, carrying out in-hole scanning on the sample plate by adopting a super-depth-of-field microscope to obtain an expanded in-hole side image, automatically measuring a percentage value of the area of the whole area, which is not covered by copper, in the image, and outputting the percentage value to a control system; if the percentage value exceeds the preset value, stopping the horizontal copper deposition operation, adjusting copper deposition parameters according to the comparison result, and restarting the horizontal copper deposition operation; and if the preset value is not exceeded, executing the subsequent procedures of the circuit board. According to the invention, the 3D imaging technology is introduced into the circuit board manufacturing, so that the quantitative detection of the light transmission points is realized, the accuracy and the detection speed of backlight judgment are improved, the industrial automation is realized, and the production efficiency and the quality are improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to an automatic control copper deposition process of a printed circuit board.
Background
The traditional copper deposition process mainly comprises copper deposition and plate discharge- > backlight judgment- > production control. The copper deposition and plate drawing refers to the copper deposition after drilling a PCB (printed circuit board), wherein the copper deposition refers to chemical copper deposition (Plated Through Hole), namely Plated Through Hole (PTH for short), and is an extremely important process in the production of printed circuit boards, and the purpose is to cover a layer of compact and firm metal copper layer as a conductor on the Hole wall of a nonconductor in a chemical deposition manner so as to enable the circuit between two layers or multiple layers of the circuit board to be communicated and conductive; and backlight judgment and production control, namely evaluating the copper deposition effect in the hole by sampling and backlight judgment after the copper deposition is discharged from the plate, pausing subsequent processes until the subsequent processes are started after the evaluation result is qualified, returning to the previous process to perform copper deposition again if the evaluation result is unqualified, and repeating the copper deposition process. The following defects exist in the conventional backlight judgment: 1. destructive test, grinding the hole to the radius of the hole by a grinder, irradiating by a lamp under a golden image microscope, observing the light transmission degree in the hole, making the place covered by the copper deposition layer opaque, and judging according to a backlight level table, wherein the process is artificial qualitative judgment and has low accuracy; 2. the copper deposition parameters are adjusted according to the backlight judgment, and the backlight judgment process needs operations such as grinding, so that the time is long, and the control hysteresis exists; 3. in the backlight judgment process, if the liquid medicine is invalid, the produced plate cannot be adjusted in time, and the flowing product has quality risks.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an automatic control copper deposition process for a printed circuit board, which can automatically detect the copper deposition effect, feed back a mechanism in real time and improve the efficiency and quality of copper deposition in holes.
The invention is realized by the following steps: a printed circuit board automatically controls a copper deposition process, a super depth of field microscope and a control system are required to be provided, the super depth of field microscope is connected with the control system and is controlled by the control system, and the process comprises the following steps:
step 3, carrying out horizontal copper deposition;
step 4, sampling the PCB after copper deposition, scanning the sample plate in a hole by adopting a super-depth-of-field microscope to obtain an expanded hole inner side image, automatically measuring a percentage value of the area of the whole area which is not covered by copper in the image, and outputting the percentage value to a control system;
step 5, the control system compares the percentage value with a preset value, if the percentage value exceeds the preset value, the step 6 is carried out, otherwise, the step 7 is carried out;
step 6, stopping the horizontal copper deposition operation, adjusting copper deposition parameters according to the comparison result, and restarting the horizontal copper deposition operation;
and 7, executing subsequent processes of the circuit board.
Further, the specific way of removing burrs in the hole in the step 2 is as follows: the burrs in the hole are washed by controlling the water pressure, and ultrasonic vibration cleaning is adopted.
Further, the control system is further connected with an alarm device, and the step 6 further comprises alarming through the alarm device.
Further, the subsequent processes of the step 7 include whole board copper plating, circuit manufacturing, pattern electroplating, etching, ink printing, character printing and forming.
The invention has the following advantages:
1. the 3D imaging technology is introduced in the manufacturing process of the circuit board, quantification of light transmission points is realized through automatic calculation of the system, and the accuracy of backlight judgment is improved;
2. the backlight judgment mode and the copper deposition line control system are integrated and butted, networking and butting are realized, the adjustment of process parameters can be realized according to the backlight judgment result, and the automatic stable control of the copper deposition backlight quality is realized;
3. when the backlight detection result is close to the critical value, the liquid medicine can be adjusted at the first time, so that the backlight condition is not deteriorated, and the backlight quality is stabilized;
4. the industrial automation is realized, the material cost and the labor cost are saved, and the production efficiency and the quality are improved.
Drawings
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
Fig. 1 is a flow chart of the automatic copper deposition control process of the printed circuit board according to the present invention.
Fig. 2 is a schematic diagram of an unsatisfactory image under an ultra-depth microscope according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a qualified image under an ultra-depth microscope according to another embodiment of the present invention.
Detailed Description
As shown in fig. 1 to 3, in the automatic copper deposition control process for a printed circuit board according to the present invention, an ultra-depth-of-field microscope and a control system are provided, the ultra-depth-of-field microscope is connected to the control system and controlled by the control system, and the process includes the following steps:
step 3, carrying out horizontal copper deposition; the selection of horizontal copper deposition can be more favorable for realizing an automatic production line than vertical copper deposition, because during horizontal copper deposition, the PCB board is transferred one by one through the scroll bar instead of batch transmission like vertical copper deposition, and the follow-up mechanical arm can grab at random for sampling detection.
Step 4, sampling the PCB after copper deposition, performing in-hole scanning on the sample plate by using a microscope with ultra depth of field to obtain an expanded in-hole side image, automatically measuring a percentage value of the area of the image, which is not covered by copper, in the whole area, outputting the percentage value to a control system, if copper deposition is performed in a large range, displaying an image and data shown in fig. 3 when the coverage in the hole is better, and if copper deposition is performed in a small range, displaying an image and data shown in fig. 2 when the coverage in the hole is insufficient;
step 5, the control system compares the percentage value with a preset value, if the percentage value exceeds the preset value (specifically, a grade evaluation value in a traditional backlight grade comparison table can be adopted), the step 6 is executed, otherwise, the step 7 is executed;
step 6, stopping the horizontal copper deposition operation, adjusting copper deposition parameters according to the comparison result, and restarting the horizontal copper deposition operation;
and 7, executing subsequent processes of the circuit board.
In order to better clean the drilled PCB and remove burrs, the step 2 "removing burrs in the hole" may be performed in a specific manner: the burrs in the hole are washed by controlling the water pressure, and ultrasonic vibration cleaning is adopted.
Preferably, the control system is further connected with an alarm device, the alarm device may be an audible and visual alarm, and the step 6 further includes giving an alarm through the alarm device.
And 7, performing subsequent processes including whole-board copper plating, circuit manufacturing, pattern electroplating, etching, ink printing, character printing and forming.
According to the invention, the 3D imaging technology is introduced in the manufacturing process of the circuit board, and the quantification of the light transmission points is realized through the automatic calculation of the system, so that the accuracy of backlight judgment is improved; the backlight judgment mode and the copper deposition line control system are integrated and butted, networking and butting are realized, the adjustment of process parameters can be realized according to the backlight judgment result, and the automatic stable control of the copper deposition backlight quality is realized; when the backlight detection result is close to the critical value, the liquid medicine can be adjusted at the first time, the backlight condition is not worsened, the backlight quality is stabilized, and the quick detection and quick return of the production line are realized, so that the liquid on the PCB separated from the production line is prevented from solidifying and losing efficacy, and the original effect of the liquid is prevented from influencing the final copper deposition quality; the industrial automation is realized, the material cost and the labor cost are saved, and the production efficiency and the quality are improved.
Although specific embodiments of the invention have been described above, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the appended claims.
Claims (4)
1. The utility model provides a heavy copper process of printed wiring board automated control which characterized in that: the method is characterized by comprising the following steps of providing an ultra-depth-of-field microscope and a control system, wherein the ultra-depth-of-field microscope is connected with the control system and is controlled by the control system:
step 1, drilling a PCB;
step 2, removing burrs in the hole;
step 3, carrying out horizontal copper deposition;
step 4, sampling the PCB after copper deposition, scanning the sample plate in a hole by adopting a super-depth-of-field microscope to obtain an expanded hole inner side image, automatically measuring a percentage value of the area of the whole area which is not covered by copper in the image, and outputting the percentage value to a control system;
step 5, the control system compares the percentage value with a preset value, if the percentage value exceeds the preset value, the step 6 is carried out, otherwise, the step 7 is carried out;
step 6, stopping the horizontal copper deposition operation, adjusting copper deposition parameters according to the comparison result, and restarting the horizontal copper deposition operation;
and 7, executing subsequent processes of the circuit board.
2. The automatic control copper deposition process of the printed circuit board according to claim 1, wherein: the specific mode of removing burrs in the hole in the step 2 is as follows: the burrs in the hole are washed by controlling the water pressure, and ultrasonic vibration cleaning is adopted.
3. The automatic control copper deposition process of the printed circuit board according to claim 1, wherein: the control system is further connected with an alarm device, and the step 6 further comprises the step of giving an alarm through the alarm device.
4. The automatic control copper deposition process of the printed circuit board according to claim 1, wherein: and the subsequent processes of the step 7 comprise whole-board copper plating, circuit manufacturing, pattern electroplating, etching, ink printing, character printing and forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910666695.XA CN110461105B (en) | 2019-07-23 | 2019-07-23 | Automatic control copper deposition process for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910666695.XA CN110461105B (en) | 2019-07-23 | 2019-07-23 | Automatic control copper deposition process for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110461105A CN110461105A (en) | 2019-11-15 |
| CN110461105B true CN110461105B (en) | 2022-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910666695.XA Active CN110461105B (en) | 2019-07-23 | 2019-07-23 | Automatic control copper deposition process for printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111575752B (en) * | 2020-05-14 | 2021-10-12 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
| CN112326667A (en) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | Copper-clad detection method and device for conductive connecting hole |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2492041Y (en) * | 2001-07-06 | 2002-05-15 | 凯崴电子股份有限公司 | Non-destructive testing device for circuit board microhole wall |
| JP4776197B2 (en) * | 2004-09-21 | 2011-09-21 | 日本特殊陶業株式会社 | Wiring board inspection equipment |
| IL247733A0 (en) * | 2015-09-10 | 2017-01-31 | Camtek Ltd | Automated optical inspection of ibump and vut process defects including dislocation |
| CN105323973B (en) * | 2015-11-03 | 2018-11-06 | 大连崇达电路有限公司 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
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- 2019-07-23 CN CN201910666695.XA patent/CN110461105B/en active Active
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| CN110461105A (en) | 2019-11-15 |
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