CN110461091A - Conductive spring mounting assembly, PCB assembly and remote controller - Google Patents
Conductive spring mounting assembly, PCB assembly and remote controller Download PDFInfo
- Publication number
- CN110461091A CN110461091A CN201910825295.9A CN201910825295A CN110461091A CN 110461091 A CN110461091 A CN 110461091A CN 201910825295 A CN201910825295 A CN 201910825295A CN 110461091 A CN110461091 A CN 110461091A
- Authority
- CN
- China
- Prior art keywords
- power spring
- mounting assembly
- spring mounting
- jack
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a conductive spring mounting assembly, a PCB assembly and a remote controller. This electrically conductive spring installation component includes electrically conductive spring and installed part, be equipped with the jack on the installed part, the one end of electrically conductive spring is equipped with grafting portion, grafting portion inserts and establishes and is fixed in the jack. Set up the jack on the installed part, the grafting portion inserts and establishes and is fixed in this jack on the conductive spring, can ensure that conductive spring is in stably behind the cartridge, and the crooked phenomenon of difficult appearance can realize quick cartridge and welding, need not manual operation can automatic cartridge and welding, improves the welded reliability of product.
Description
Technical field
The invention belongs to remote controler technical fields, and in particular to a kind of power spring mounting assembly and pcb board component and distant
Control device.
Background technique
It always is the production model using manual welding due to being influenced by its lopsided structure for remote controler spring, wraps
Include the production routines such as spring inserting and manual welding spring；This production method has following defects that in 1. spring production processes
It plays pendulum, handwork is needed to maintain its stabilization, causing every production line that need to configure two talents can complete to weld, raw
It is lower to produce efficiency；2. being in addition easy to appear welding consistency difference problem, secondary repair welding problem is caused, the reliability of quality is influenced.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is that provide a kind of power spring mounting assembly and pcb board component and
Remote controler can cancel manual welding mode, improve soldering reliability.
To solve the above-mentioned problems, the present invention provides a kind of power spring mounting assembly, including power spring and installation part,
The installation part is equipped with jack, and one end of the power spring is equipped with plug division, and the plug division plugs and is fixed on described
In jack.
Preferably, the installation part is equipped with pad, and the jack is located in the pad.
Preferably, the installation part is pcb board, and the jack is set as through-hole, and the plug division part is pierced by the through-hole.
Preferably, the through-hole is set as rectangle, the rectangle size are as follows: long 3.5~3.8mm, wide 0.4~0.8mm.
Preferably, the plug division is set as the U-type groove structure to close up.
Preferably, the two sides of the through-hole are designed with pad.
Preferably, the through-hole is inserted into the plug division, and the pad hem width of insertion side is 0.3~0.7mm, prominent side
The pad hem width be 0.1~0.3mm.
Preferably, print solder paste layer is coated on the pcb board, the print solder paste layer covers the pad.
Preferably, the print solder paste layer is set as square structure, four edges of the square structure and the pad away from
From are as follows: 0.5~2.0mm of a left side, the right side 0.5~2.0mm, upper 1.0~2.0mm, lower 1.0~2.0mm.
According to another aspect of the present invention, a kind of pcb board component, including power spring installation group as described above are provided
Part.
In accordance with a further aspect of the present invention, a kind of remote controler, including power spring mounting assembly as described above are provided
Or pcb board component as described above.
A kind of power spring mounting assembly provided by the invention, including power spring and installation part are set on the installation part
There is jack, one end of the power spring is equipped with plug division, and the plug division plugs and is fixed in the jack.In installation part
Upper setting jack, plug division plugs and is fixed in the jack on power spring, can ensure that after inserting that power spring is in and stablizes,
It is less prone to crooked phenomenon, is able to achieve fast inserted and welding, can insert and weld automatically without human intervention, improves product
Welding reliability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the pcb board component of the embodiment of the present invention；
Fig. 2 is the structure schematic diagram of the pcb board component of the embodiment of the present invention；
Fig. 3 is the cross-sectional view of the pcb board component of the embodiment of the present invention.
Appended drawing reference indicates are as follows:
1, pcb board；11, through-hole；2, power spring；21, plug division；3, the first pad；3 ', second pad；4, tin is printed
Layer of paste.
Specific embodiment
In conjunction with referring to shown in Fig. 1 to Fig. 3, according to an embodiment of the invention, a kind of power spring mounting assembly, including conduction
Spring 2 and installation part, the installation part are equipped with jack, and one end of the power spring 2 is equipped with plug division 21, the plug division
21 plug and are fixed in the jack.
Jack is set on mountings, then plug division 21, plug division are equipped with to the fixed one end of power spring 2 and installation part
21 plug and are fixed in jack, and the conducting wire spring 2 after grafting is less prone to unstable phenomenon, facilitate carry out mechanized operation；It is right
2 two components of installation part and power spring are processed into required structure respectively, can be inserted automatically the two by particular device
Dress operation can complete inserting and subsequent automatic back flow welding production automatically, can thus cancel hand such as SMT workshop
Work bond pattern, and improve the reliability of welding.
For convenience of the agility of the welding of power spring 2 and jack, it is equipped with pad on mountings, jack is located at pad
In, after plug division 21 inserts in jack, it can facilitate and be welded.
Installation part is pcb board 1, and the jack is set as through-hole 11, and 21 part of plug division is pierced by the through-hole 11, is such as schemed
Shown in 3, plug division 21 is fallen off after preventing insertion through-hole 11 using clamping header structure.Installation part also can be used other thickness
Biggish part, wherein jack is blind hole structure, only needs plug division 21 to be inserted into and is fixed in jack, so that power spring 2 is not
There is labile state.
Through-hole 11 preferably uses rectangle structure, and plug division 21 as shown in Figure 3 is set as the U-type groove structure to close up, production
The bending of 2 one end of Shi Caiyong power spring is constituted, and is contacted with 11 four direction of through-hole, therefore 2 stability of power spring obtains
Increase.Preferably, 11 size of through-hole are as follows: long 3.5~3.8mm, wide 0.4~0.8mm.
On the two sides of pcb board 1, the two sides of through-hole 11 are designed with pad, facilitate plug division 21 to be inserted into and are pierced by through-hole 11,
Two sides are welded.
Through-hole 11 is inserted into plug division 21, and 3 hem width of the first pad of insertion side is 0.3~0.7mm, the second pad of prominent side
3 ' hem widths are 0.1~0.3mm.
Print solder paste layer 4 is covered on pcb board 1, print solder paste layer 4 covers pad, and welding is facilitated to operate.Print solder paste layer
4 are set as square structure, and four edges of square structure are at a distance from the first pad 3 are as follows: 0.5~2.0mm of a left side, 0.5~2.0mm of the right side,
Upper 1.0~2.0mm, lower 1.0~2.0mm.
The above-mentioned size to pad and print solder paste layer 4 is defined, and mechanical equipment is facilitated more precisely to operate, and is produced
The quality conformance of product is good.
The manufacturing process of above-mentioned power spring mounting assembly are as follows: rectangular through holes 11 and pad are set on pcb board 1, led
Plug division 21 is made in wire spring one end；To carrying out paste solder printing around the through-hole 11 and pad and pad on pcb board 1；It will be conductive
The plug division 21 of spring 2 is inserted into and part is pierced by through-hole 11；1 component of pcb board after inserting carries out welding procedure.
Wherein, solder needed for the filling of tin cream need to meet welding.
The invention be applied to power spring 2 automatic welding produce, by pcb board upper spring jack, pad design with
Print solder paste design realizes that PCB carries out the inserting of power spring 2 again after printing tin cream and then crosses the automation that reflow ovens complete welding
Production method realizes manless production operation, cancels former manual welding production, improve production efficiency and quality consistency.
According to another embodiment of the present invention, a kind of pcb board component, including power spring mounting assembly as described above.
Another embodiment according to the present invention, a kind of remote controler, including power spring mounting assembly as described above or such as
The upper pcb board component.
Those skilled in the art will readily recognize that the respective embodiments described above can be free under the premise of not conflicting
Ground combination, superposition.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.With
It is only the preferred embodiment of the present invention described in upper, it is noted that for those skilled in the art, not
Under the premise of being detached from the technology of the present invention principle, several improvements and modifications can also be made, these improvements and modifications also should be regarded as this
The protection scope of invention.
Claims (11)
1. a kind of power spring mounting assembly, which is characterized in that including power spring (2) and installation part, set on the installation part
There is jack, one end of the power spring (2) is equipped with plug division (21), and the plug division (21) plugs and is fixed on the jack
In.
2. power spring mounting assembly according to claim 1, which is characterized in that the installation part is equipped with pad, institute
Jack is stated to be located in the pad.
3. power spring mounting assembly according to claim 1 or 2, which is characterized in that the installation part is set as pcb board
(1), the jack is set as through-hole (11), and the plug division (21) is partially pierced by the through-hole (11).
4. power spring mounting assembly according to claim 3, which is characterized in that the through-hole (11) is set as rectangle,
The rectangle size are as follows: long 3.5~3.8mm, wide 0.4~0.8mm.
5. power spring mounting assembly according to claim 4, which is characterized in that the plug division (21) is set as closing in
U-type groove structure.
6. power spring mounting assembly according to claim 3, which is characterized in that the two sides of the through-hole (11) are designed with
Pad.
7. power spring mounting assembly according to claim 6, which is characterized in that plug division (21) insertion is described logical
Hole (11), the pad hem width of insertion side are 0.3~0.7mm, and the pad hem width of prominent side is 0.1~0.3mm.
8. power spring mounting assembly according to claim 6, which is characterized in that be coated with printing on the pcb board (1)
Tin paste layer (4), the print solder paste layer (4) cover the pad.
9. power spring mounting assembly according to claim 8, which is characterized in that print solder paste layer (4) side of being set as
Shape structure, four edges of the square structure are at a distance from the pad are as follows: 0.5~2.0mm of a left side, 0.5~2.0mm of the right side, upper 1.0
~2.0mm, lower 1.0~2.0mm.
10. a kind of pcb board component, which is characterized in that including the power spring mounting assembly as described in claim 1-9 is any.
11. a kind of remote controler, which is characterized in that including the power spring mounting assembly as described in claim 1-9 is any or such as
Pcb board component described in any one of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910825295.9A CN110461091A (en) | 2019-09-02 | 2019-09-02 | Conductive spring mounting assembly, PCB assembly and remote controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910825295.9A CN110461091A (en) | 2019-09-02 | 2019-09-02 | Conductive spring mounting assembly, PCB assembly and remote controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110461091A true CN110461091A (en) | 2019-11-15 |
Family
ID=68490452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910825295.9A Pending CN110461091A (en) | 2019-09-02 | 2019-09-02 | Conductive spring mounting assembly, PCB assembly and remote controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110461091A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584653A (en) * | 2020-12-18 | 2021-03-30 | 珠海格力电器股份有限公司 | Remote controller |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127471A (en) * | 1989-10-12 | 1991-05-30 | Matsushita Electric Ind Co Ltd | Remote control system |
| JPH11102677A (en) * | 1997-09-29 | 1999-04-13 | Nec Shizuoka Ltd | Terminal for dry battery |
| JPH11242950A (en) * | 1997-12-05 | 1999-09-07 | Matsushita Electric Ind Co Ltd | Terminal connecting device for power supply circuit |
| CN101730394A (en) * | 2008-10-17 | 2010-06-09 | 海洋王照明科技股份有限公司 | Process method for plug-in mounting connector on circuit board |
| CN110290651A (en) * | 2019-07-22 | 2019-09-27 | 珠海格力电器股份有限公司 | Method for assembling PCB and spring, PCB assembly and remote controller |
-
2019
- 2019-09-02 CN CN201910825295.9A patent/CN110461091A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127471A (en) * | 1989-10-12 | 1991-05-30 | Matsushita Electric Ind Co Ltd | Remote control system |
| JPH11102677A (en) * | 1997-09-29 | 1999-04-13 | Nec Shizuoka Ltd | Terminal for dry battery |
| JPH11242950A (en) * | 1997-12-05 | 1999-09-07 | Matsushita Electric Ind Co Ltd | Terminal connecting device for power supply circuit |
| CN101730394A (en) * | 2008-10-17 | 2010-06-09 | 海洋王照明科技股份有限公司 | Process method for plug-in mounting connector on circuit board |
| CN110290651A (en) * | 2019-07-22 | 2019-09-27 | 珠海格力电器股份有限公司 | Method for assembling PCB and spring, PCB assembly and remote controller |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584653A (en) * | 2020-12-18 | 2021-03-30 | 珠海格力电器股份有限公司 | Remote controller |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191115 |