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CN110459537A - Display device - Google Patents

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Publication number
CN110459537A
CN110459537A CN201910389008.4A CN201910389008A CN110459537A CN 110459537 A CN110459537 A CN 110459537A CN 201910389008 A CN201910389008 A CN 201910389008A CN 110459537 A CN110459537 A CN 110459537A
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Prior art keywords
led chips
row
display device
electrodes
led
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叶一平
林丽娟
高尚甫
林治民
叶寅夫
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Everlight Electronics Co Ltd
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Everlight Electronics Co Ltd
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开提供一种显示装置,包括LED晶片阵列,包括N1行N2列LED晶片,每行LED晶片按照第一色、第二色、第三色顺次等距循环排列,LED晶片的阴极和阳极分别位于上表面和下表面;显示屏幕,包括在第一方向上平行等距设置的N1个第一电极,每个第一电极电连接一行LED晶片的上表面;基板,包括在第二方向上平行等距设置的N2个第二电极,每个第二电极电连接一列LED晶片的下表面;控制模块,电连接N1个第一电极和N2个第二电极,用于向第一电极和第二电极输出电信号以一次控制两行LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。本公开实施例提供的显示装置可以降低成本、提高制造可靠性。

The present disclosure provides a display device, including an LED chip array, including N1 rows and N2 columns of LED chips, each row of LED chips is arranged in a cyclical manner according to a first color, a second color, and a third color, and the cathode and anode of the LED chip are respectively located on the upper surface and the lower surface; a display screen, including N1 first electrodes arranged in parallel and equidistantly in a first direction, each first electrode is electrically connected to the upper surface of a row of LED chips; a substrate, including N2 second electrodes arranged in parallel and equidistantly in a second direction, each second electrode is electrically connected to the lower surface of a column of LED chips; a control module, electrically connected to the N1 first electrodes and the N2 second electrodes, for outputting electrical signals to the first electrodes and the second electrodes to control part of the LED chips in two rows of LED chips to light up as multiple pixel units at a time, each pixel unit includes three LED chips arranged in a triangle and having different colors. The display device provided by the embodiment of the present disclosure can reduce costs and improve manufacturing reliability.

Description

显示装置display device

技术领域technical field

本公开涉及显示技术领域,具体而言,涉及一种在单位面积内包括更多像素且能克服小尺寸、小间距LED制程困扰的显示装置。The present disclosure relates to the field of display technology, in particular, to a display device that includes more pixels per unit area and can overcome the problems of small-size and small-pitch LED manufacturing processes.

背景技术Background technique

随着显示技术的发展,提高分辨率成为领域内研究的重要课题。减小LED晶片体积、缩小LED晶片间距以增加单位面积内的LED晶片数量成为提高显示装置分辨率的常规手段。With the development of display technology, improving the resolution has become an important research topic in the field. Reducing the volume of LED chips and reducing the pitch of LED chips to increase the number of LED chips per unit area has become a conventional means for improving the resolution of display devices.

目前业界使用倒装芯片(Flip Chip)配合巨量转移来制作微小型LED,在这种技术中,晶片尺寸小于30μm时,Flip Chip底部的焊盘尺寸将小于10μm,对于工艺上使用不易,且容易发生固晶不易、晶片焊盘过近造成爬锡短路的问题。由此,在现有技术基础上难以进一步增加单位面积内的LED晶片数量,进而使显示装置的分辨率受限。At present, the industry uses flip chip (Flip Chip) combined with mass transfer to produce micro-miniature LEDs. In this technology, when the chip size is less than 30 μm, the pad size at the bottom of the flip chip will be less than 10 μm, which is not easy to use in the process, and It is prone to problems such as difficult crystal bonding and too close chip pads to cause short circuit of tin climbing. Therefore, based on the prior art, it is difficult to further increase the number of LED chips in a unit area, thereby limiting the resolution of the display device.

需要说明的是,在上述背景技术部分公开的信息仅用于加强对本公开的背景的理解,因此可以包括不构成对本领域普通技术人员已知的现有技术的信息。It should be noted that the information disclosed in the above background section is only for enhancing the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to those of ordinary skill in the art.

发明内容Contents of the invention

本公开的目的在于提供一种显示装置,用于至少在一定程度上克服由于相关技术的限制和缺陷而导致的在一定显示面积内像素数量有限、缩小LED尺寸和间距容易导致制程中连焊的问题。The purpose of the present disclosure is to provide a display device for overcoming the limitations and defects of related technologies at least to a certain extent, such as the limited number of pixels in a certain display area, and the reduction of LED size and spacing, which may easily lead to continuous soldering in the manufacturing process. question.

根据本公开的一个方面,提供一种显示装置,包括:According to one aspect of the present disclosure, there is provided a display device, comprising:

LED晶片阵列,包括N1行N2列LED晶片,每行所述LED晶片按照第一色、第二色、第三色顺次等距循环排列,所述LED晶片的阴极和阳极分别位于上表面和下表面;The LED chip array includes LED chips in N1 rows and N2 columns. The LED chips in each row are arranged in an equidistant cycle according to the first color, the second color, and the third color. The cathode and anode of the LED chip are respectively located on the upper surface and the lower surface;

显示屏幕,包括在第一方向上平行等距设置的N1个第一电极,每个所述第一电极电连接一行所述LED晶片的上表面;A display screen, including N1 first electrodes arranged parallel and equidistant in the first direction, each of the first electrodes is electrically connected to the upper surface of a row of the LED chips;

基板,包括在第二方向上平行等距设置的N2个第二电极,每个所述第二电极电连接一列所述LED晶片的下表面;The substrate includes N2 second electrodes arranged in parallel and equidistant in the second direction, each of the second electrodes is electrically connected to the lower surface of a column of the LED chip;

控制模块,电连接N1个所述第一电极和N2个所述第二电极,用于向所述第一电极和所述第二电极输出电信号以一次控制两行所述LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个所述像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。A control module, electrically connected to the N1 first electrodes and the N2 second electrodes, for outputting electrical signals to the first electrodes and the second electrodes to control two rows of LED chips at a time The LED chip is turned on simultaneously as a plurality of pixel units, and each pixel unit includes three LED chips arranged in a triangle and having different colors.

在本公开的一种示例性实施例中,每个所述像素单元包括分属两行三列的三个LED晶片,包括两个上行LED晶片和一个下行LED晶片,或者包括一个上行LED晶片和两个下行LED晶片,同一像素单元中两个同一行LED晶片之间包括一个不被点亮的LED晶片。In an exemplary embodiment of the present disclosure, each pixel unit includes three LED chips belonging to two rows and three columns, including two upper row LED chips and one lower row LED chip, or one upper row LED chip and one lower row LED chip. For the two downstream LED chips, there is a non-lit LED chip between the two LED chips in the same row in the same pixel unit.

在本公开的一种示例性实施例中,每两个所述像素单元之间间隔有不被点亮的LED晶片,所述间隔包括延所述第一方向间隔和延所述第二方向间隔。In an exemplary embodiment of the present disclosure, there is an interval between every two pixel units without an illuminated LED chip, and the interval includes an interval along the first direction and an interval along the second direction. .

在本公开的一种示例性实施例中,所述控制模块设置为:根据显示控制信号确定两个所述像素单元间隔的不被点亮的LED晶片的数量。In an exemplary embodiment of the present disclosure, the control module is configured to: determine the number of non-lit LED chips separated by two pixel units according to the display control signal.

在本公开的一种示例性实施例中,两个所述像素单元间隔的不被点亮的LED晶片为一行或一列。In an exemplary embodiment of the present disclosure, the non-lit LED chips separated by two pixel units form a row or a column.

在本公开的一种示例性实施例中,所述像素单元中的LED晶片分别属于第n行和第n+2行,或者,所述像素单元中的LED晶片分别属于第n行和第n+1行,其中n∈[1,N1]。In an exemplary embodiment of the present disclosure, the LED chips in the pixel unit respectively belong to the nth row and the n+2th row, or, the LED chips in the pixel unit respectively belong to the nth row and the nth row +1 row, where n ∈ [1,N1].

在本公开的一种示例性实施例中,所述控制模块设置为:根据显示控制信号确定每行所述LED晶片的扫描次数和扫描频率。In an exemplary embodiment of the present disclosure, the control module is configured to: determine the number of scans and the scan frequency of each row of the LED chips according to the display control signal.

在本公开的一种示例性实施例中,所述第一电极和/或所述第二电极为ITO导电玻璃。In an exemplary embodiment of the present disclosure, the first electrode and/or the second electrode is ITO conductive glass.

在本公开的一种示例性实施例中,所述基板为透明基板。In an exemplary embodiment of the present disclosure, the substrate is a transparent substrate.

在本公开的一种示例性实施例中,所述第一色、所述第二色、所述第三色分别为红色、绿色、蓝色。In an exemplary embodiment of the present disclosure, the first color, the second color, and the third color are red, green, and blue, respectively.

根据本公开的一个方面,提供一种显示装置,包括:According to one aspect of the present disclosure, there is provided a display device, comprising:

LED晶片阵列,包括N1行N2列LED晶片,其中所述LED晶片仅设置在奇数行奇数列交叉的位置和偶数行偶数列交叉的位置,或者所述LED晶片仅设置在奇数行偶数列交叉的位置和偶数行奇数列交叉的位置,每个所述LED晶片的颜色与相邻LED晶片的颜色均不同,所述LED晶片的阳极和阴极分别位于上表面和下表面;The LED chip array includes LED chips in N1 rows and N2 columns, wherein the LED chips are only arranged at positions where odd rows and odd columns intersect and even rows and even columns intersect, or the LED chips are only arranged at odd rows and even columns intersect The position where even rows and odd columns intersect, the color of each LED chip is different from that of adjacent LED chips, and the anode and cathode of the LED chip are located on the upper surface and the lower surface, respectively;

显示屏幕,包括在第一方向上平行等距设置的N1个第一电极,每个所述第一电极电连接一行所述LED晶片的上表面;A display screen, including N1 first electrodes arranged parallel and equidistant in the first direction, each of the first electrodes is electrically connected to the upper surface of a row of the LED chips;

基板,包括在第二方向上平行等距设置的N2个第二电极,每个所述第二电极电连接一列所述LED晶片的下表面。The substrate includes N2 second electrodes arranged parallel and equidistant in the second direction, and each of the second electrodes is electrically connected to the lower surface of a column of the LED chips.

在本公开的一种示例性实施例中,还包括:In an exemplary embodiment of the present disclosure, it also includes:

控制模块,电连接N1个所述第一电极和N2个所述第二电极,用于向所述第一电极和所述第二电极输出电信号以一次控制两行所述LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个所述像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。A control module, electrically connected to the N1 first electrodes and the N2 second electrodes, for outputting electrical signals to the first electrodes and the second electrodes to control two rows of LED chips at a time The LED chip is turned on simultaneously as a plurality of pixel units, and each pixel unit includes three LED chips arranged in a triangle and having different colors.

在本公开的一种示例性实施例中,每两个所述像素单元之间均间隔有不被点亮的LED晶片,所述间隔包括在所述第一方向上间隔和在所述第二方向上间隔。In an exemplary embodiment of the present disclosure, there is an interval between every two pixel units without an illuminated LED chip, and the interval includes an interval in the first direction and an interval in the second direction. interval in the direction.

在本公开的一种示例性实施例中,所述控制模块设置为:根据显示控制信号确定每两个所述像素之间间隔的不被点亮的LED晶片的个数。In an exemplary embodiment of the present disclosure, the control module is configured to: determine the number of non-lit LED chips spaced between every two pixels according to the display control signal.

在本公开的一种示例性实施例中,两个所述像素单元间隔的不被点亮的LED晶片为一个或两个。In an exemplary embodiment of the present disclosure, there are one or two non-lit LED chips separated by two pixel units.

在本公开的一种示例性实施例中,所述控制模块设置为:根据显示控制信号确定每行所述LED晶片的扫描次数和扫描频率。In an exemplary embodiment of the present disclosure, the control module is configured to: determine the number of scans and the scan frequency of each row of the LED chips according to the display control signal.

在本公开的一种示例性实施例中,所述第一电极和/或所述第二电极为ITO导电玻璃。In an exemplary embodiment of the present disclosure, the first electrode and/or the second electrode is ITO conductive glass.

在本公开的一种示例性实施例中,所述基板为透明基板。In an exemplary embodiment of the present disclosure, the substrate is a transparent substrate.

在本公开的一种示例性实施例中,所述LED晶片阵列的行间距大于等于列间距。In an exemplary embodiment of the present disclosure, the row pitch of the LED chip array is greater than or equal to the column pitch.

在本公开的一种示例性实施例中,所述LED晶片包括红色、蓝色、绿色的LED晶片。In an exemplary embodiment of the present disclosure, the LED chips include red, blue and green LED chips.

在本公开的一种示例性实施例中,所述显示屏幕包括玻璃屏幕、塑胶屏幕、蓝宝石屏幕或柔性屏幕。In an exemplary embodiment of the present disclosure, the display screen includes a glass screen, a plastic screen, a sapphire screen or a flexible screen.

在本公开的一种示例性实施例中,基板为不透明基板,包括印刷电路基板、陶瓷基板、半导体基板、塑胶基板或柔性基板。In an exemplary embodiment of the present disclosure, the substrate is an opaque substrate, including a printed circuit substrate, a ceramic substrate, a semiconductor substrate, a plastic substrate or a flexible substrate.

在本公开的一种示例性实施例中,所述LED晶片的制造材料包括氮化物、氮化镓、砷化镓、磷化镓或硅。In an exemplary embodiment of the present disclosure, the manufacturing material of the LED chip includes nitride, gallium nitride, gallium arsenide, gallium phosphide or silicon.

本公开实施例提供的显示装置,通过使用位于两行三列的三个LED晶片构成一个像素单元,可以在相同的单位面积内使用同样数量的LED晶片实现更多的像素;此外,通过在各LED晶片的上表面和下表面设置公用电极,可以避免制程中LED晶片尺寸和间距过小导致的连焊,为进一步缩小LED晶片的尺寸和间距提供技术保障。因此,本公开实施例提供的技术方案可以设置更小尺寸的晶片、更小的晶片间距,在相同的单位面积内实现更多的像素,极大地增加了分辨率,尽可能降低了成本,提高了制程可靠性。In the display device provided by the embodiments of the present disclosure, by using three LED chips located in two rows and three columns to form a pixel unit, more pixels can be realized by using the same number of LED chips in the same unit area; The upper surface and the lower surface of the LED chip are provided with common electrodes, which can avoid the continuous welding caused by the small size and spacing of the LED chip during the manufacturing process, and provide technical guarantee for further reducing the size and spacing of the LED chip. Therefore, the technical solutions provided by the embodiments of the present disclosure can set smaller-sized wafers and smaller wafer pitches, realize more pixels in the same unit area, greatly increase resolution, reduce costs as much as possible, and improve process reliability.

应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本公开。It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

附图说明Description of drawings

此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本公开的实施例,并与说明书一起用于解释本公开的原理。显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure. Apparently, the drawings in the following description are only some embodiments of the present disclosure, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.

图1A和图1B示意性示出本公开示例性实施例中显示装置100的结构示意图。FIG. 1A and FIG. 1B schematically illustrate the structure of a display device 100 in an exemplary embodiment of the present disclosure.

图2是本公开实施例中显示装置100的电连接关系的平面示意图。FIG. 2 is a schematic plan view of the electrical connection relationship of the display device 100 in an embodiment of the present disclosure.

图3A~图3D是本公开示例性实施例中显示装置100的像素单元的构成示意图。。3A to 3D are schematic structural diagrams of pixel units of the display device 100 in an exemplary embodiment of the present disclosure. .

图4A和图4B是图3A~图3D所示像素单元的效果示意图。4A and 4B are schematic diagrams showing the effect of the pixel units shown in FIGS. 3A to 3D .

图5是本公开实施例中另一种像素单元的构成示意图。FIG. 5 is a schematic diagram of another pixel unit in an embodiment of the disclosure.

图6是本公开一个实施例中像素单元之间间隔的示意图。FIG. 6 is a schematic diagram of spacing between pixel units in an embodiment of the present disclosure.

图7A和图7B是本公开提供的又一种显示装置700的结构示意图。FIG. 7A and FIG. 7B are schematic structural diagrams of another display device 700 provided in the present disclosure.

图8是本公开实施例中显示装置700的电连接关系的平面示意图。FIG. 8 is a schematic plan view of an electrical connection relationship of a display device 700 in an embodiment of the present disclosure.

图9是本公开实施例中显示装置700中三角形像素单元的效果示意图。FIG. 9 is a schematic diagram of the effect of a triangular pixel unit in a display device 700 in an embodiment of the present disclosure.

图10A和图10B是本公开实施例中显示装置700的像素单元排布的示意图。FIG. 10A and FIG. 10B are schematic diagrams of pixel unit arrangement of a display device 700 in an embodiment of the present disclosure.

具体实施方式Detailed ways

现在将参考附图更全面地描述示例实施方式。然而,示例实施方式能够以多种形式实施,且不应被理解为限于在此阐述的范例;相反,提供这些实施方式使得本公开将更加全面和完整,并将示例实施方式的构思全面地传达给本领域的技术人员。所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施方式中。在下面的描述中,提供许多具体细节从而给出对本公开的实施方式的充分理解。然而,本领域技术人员将意识到,可以实践本公开的技术方案而省略所述特定细节中的一个或更多,或者可以采用其它的方法、组元、装置、步骤等。在其它情况下,不详细示出或描述公知技术方案以避免喧宾夺主而使得本公开的各方面变得模糊。Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, devices, steps, etc. may be adopted. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure.

此外,附图仅为本公开的示意性图解,图中相同的附图标记表示相同或类似的部分,因而将省略对它们的重复描述。附图中所示的一些方框图是功能实体,不一定必须与物理或逻辑上独立的实体相对应。可以采用软件形式来实现这些功能实体,或在一个或多个硬件模块或集成电路中实现这些功能实体,或在不同网络和/或处理器装置和/或微控制器装置中实现这些功能实体。In addition, the drawings are only schematic illustrations of the present disclosure, the same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software, or in one or more hardware modules or integrated circuits, or in different network and/or processor means and/or microcontroller means.

下面结合附图对本公开示例实施方式进行详细说明。Exemplary implementations of the present disclosure will be described in detail below in conjunction with the accompanying drawings.

图1A和图1B示意性示出本公开示例性实施例中显示装置的结构示意图。FIG. 1A and FIG. 1B schematically illustrate the structure of a display device in an exemplary embodiment of the present disclosure.

参考图1A和图1B,显示装置100可以包括:Referring to FIG. 1A and FIG. 1B , the display device 100 may include:

LED晶片阵列11,包括N1行N2列LED晶片111,每行LED晶片按照第一色、第二色、第三色顺次等距循环排列,LED晶片的阴极和阳极分别位于上表面和下表面;The LED chip array 11 includes LED chips 111 in N1 rows and N2 columns. Each row of LED chips is arranged in a cycle of equal intervals according to the first color, the second color, and the third color. The cathode and anode of the LED chip are respectively located on the upper surface and the lower surface. ;

显示屏幕12,包括在第一方向上平行等距设置的N1个第一电极121,每个第一电极电连接一行LED晶片的上表面;The display screen 12 includes N1 first electrodes 121 arranged parallel and equidistant in the first direction, and each first electrode is electrically connected to the upper surface of a row of LED chips;

基板13,包括在第二方向上平行等距设置的N2个第二电极131,每个第二电极电连接一列LED晶片的下表面;The substrate 13 includes N2 second electrodes 131 arranged parallel and equidistant in the second direction, and each second electrode is electrically connected to the lower surface of a row of LED chips;

控制模块14,电连接N1个第一电极121和N2个第二电极131,用于向第一电极121和第二电极131输出电信号以一次控制两行LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。The control module 14 is electrically connected to N1 first electrodes 121 and N2 second electrodes 131, and is used to output electrical signals to the first electrodes 121 and the second electrodes 131 to control part of the LED chips in two rows of LED chips at a time as multiple The pixel units light up at the same time, and each pixel unit includes three triangularly arranged LED chips with different colors.

其中,显示屏幕12例如可以为玻璃屏幕、塑胶屏幕、蓝宝石屏幕或柔性屏幕;LED晶片的制造材料包括氮化物、氮化镓、砷化镓、磷化镓或硅。Wherein, the display screen 12 can be, for example, a glass screen, a plastic screen, a sapphire screen or a flexible screen; the manufacturing material of the LED chip includes nitride, gallium nitride, gallium arsenide, gallium phosphide or silicon.

在一些实施例中,第一电极121和第二电极131均为ITO导电玻璃,此时,基板13可以为透明基板。在另一些实施例中,第一电极121可以为ITO导电玻璃,第二电极131可以为铜或其他导电材质,此时基板13可以为不透明基板,包括印刷电路基板、陶瓷基板、半导体基板、塑胶基板或柔性基板等。本公开实施例不以显示屏幕、基板、LED晶片的材质为限。In some embodiments, both the first electrode 121 and the second electrode 131 are ITO conductive glass, at this time, the substrate 13 may be a transparent substrate. In some other embodiments, the first electrode 121 can be ITO conductive glass, and the second electrode 131 can be copper or other conductive materials. At this time, the substrate 13 can be an opaque substrate, including a printed circuit substrate, a ceramic substrate, a semiconductor substrate, a plastic substrate or flexible substrate, etc. Embodiments of the present disclosure are not limited to the materials of the display screen, the substrate, and the LED chip.

图2是本公开实施例中显示装置100电连接关系的平面示意图。FIG. 2 is a schematic plan view showing the electrical connection relationship of the device 100 in an embodiment of the present disclosure.

参考图2,在一个实施例中,第一色、第二色、第三色分别为红色、绿色、蓝色。第一电极121作为连接LED晶片阴极或阳极的共用电极连接到控制模块14,对应地,第二电极131作为连接LED晶片阳极或阴极的共用电极连接到控制模块14。在本公开实施例中,LED晶片的上表面既可以为阳极也可以为阴极,对应地,LED晶片下表面既可以为阴极也可以为阳极。本公开对LED晶片上下表面的极性不作限制。Referring to FIG. 2 , in one embodiment, the first color, the second color, and the third color are red, green, and blue, respectively. The first electrode 121 is connected to the control module 14 as a common electrode connected to the cathode or anode of the LED chip, and correspondingly, the second electrode 131 is connected to the control module 14 as a common electrode connected to the anode or cathode of the LED chip. In the embodiment of the present disclosure, the upper surface of the LED chip can be either an anode or a cathode, and correspondingly, the lower surface of the LED chip can be either a cathode or an anode. The present disclosure does not limit the polarity of the upper and lower surfaces of the LED chip.

由于第一电极121和第二电极131分别连接LED晶片的上下表面,可以克服由于晶片尺寸过小或间距过小带来的连锡短路问题,可以大大缩小对晶片尺寸或晶片间距的限制,极大扩展了增加分辨率的可能性。Since the first electrode 121 and the second electrode 131 are respectively connected to the upper and lower surfaces of the LED chip, it can overcome the problem of tin short circuit caused by too small chip size or too small spacing, and can greatly reduce the limitation on chip size or chip spacing. Great extension with possibilities for increasing resolution.

图3A~图3D是本公开示例性实施例中像素单元的构成示意图。3A to 3D are schematic diagrams of a pixel unit in an exemplary embodiment of the present disclosure.

参考图3A~图3D,在本公开的一种示例性实施例中,每个像素单元包括分属两行三列的三个不同颜色的LED晶片,或者包括两个上行LED晶片和一个下行LED晶片(如图3A和图3C),或者包括一个上行LED晶片和两个下行LED晶片(如图3B和图3D),同一像素单元中两个同一行LED晶片之间包括一个不被点亮的LED晶片。Referring to FIG. 3A to FIG. 3D , in an exemplary embodiment of the present disclosure, each pixel unit includes three LED chips of different colors belonging to two rows and three columns, or includes two LED chips in an upper row and one LED chip in a lower row. chip (as shown in Fig. 3A and Fig. 3C), or include an upper row LED chip and two lower row LED chips (as shown in Fig. 3B and Fig. 3D), and include a non-lit LED chip between two LED chips in the same row in the same pixel unit LED chips.

在图3A~图3D所示实施例中,像素单元中的三个LED晶片分别位于阵列中的第n行和第n+1行,n∈[1,N1]。此时为了使像素单元获得很好的发光效果,可以设置LED晶片阵列的行间距大于列间距,从而使三角形像素单元具有更加均衡的三条边。In the embodiment shown in FIG. 3A to FIG. 3D , the three LED chips in the pixel unit are respectively located in row n and row n+1 in the array, n∈[1, N1]. At this time, in order to obtain a good luminous effect for the pixel unit, the row spacing of the LED chip array can be set to be greater than the column spacing, so that the triangular pixel unit has more balanced three sides.

有图3A~图3D所示实施例可以看出,使用同样数量的九个LED晶片,在相关技术中只能构成三个像素单元,在本公开实施例中却能够构成四个具有不同中心位置的像素单元,这种效果通过数量放大后能够极大增加像素单元的数量和密度。It can be seen from the embodiments shown in Figures 3A to 3D that using the same number of nine LED chips, only three pixel units can be formed in the related art, but four pixel units with different center positions can be formed in the embodiment of the present disclosure. Pixel units, this effect can greatly increase the number and density of pixel units after the number is enlarged.

图4A和图4B是图3A~图3D所示像素单元的效果示意图。4A and 4B are schematic diagrams showing the effect of the pixel units shown in FIGS. 3A to 3D .

参考图4A,在设置有6*4共24个LED晶片的情况下,在现有技术中仅能实现2*4共8个像素单元。Referring to FIG. 4A , in the case of 24 LED chips of 6*4, only 8 pixel units of 2*4 can be realized in the prior art.

而在图4B中,横向可以实现A1~A4四个像素单元,每个单元可以有上三角形和下三角形两种实现方式;纵向可以实现A1~C1三行像素单元,一种可以实现4*3=12个像素单元,且每个像素单元均有两种实现方式,一种可以实现12*2=24种像素单元,为增加分辨率提供了有利的条件。由于共用电极分别连接在LED晶片的上下表面,有效避免了连锡短路问题,可以单位面积内设置较现有技术更多的LED晶片,配合如图4B所示的像素单元形成方式,可以通过更高密度的LED晶片排布实现更多像素单元,极大地增加显示装置的分辨率。In Figure 4B, four pixel units from A1 to A4 can be implemented in the horizontal direction, and each unit can have two implementation methods: upper triangle and lower triangle; vertically, three rows of pixel units A1 to C1 can be realized, and one can realize 4*3 =12 pixel units, and each pixel unit has two implementation methods, one can implement 12*2=24 pixel units, which provides favorable conditions for increasing the resolution. Since the common electrodes are respectively connected to the upper and lower surfaces of the LED chips, the problem of short-circuiting with tin can be effectively avoided, and more LED chips can be arranged per unit area than in the prior art. With the formation of pixel units as shown in Figure 4B, more LED chips can be used. The high-density LED chip arrangement realizes more pixel units, which greatly increases the resolution of the display device.

图5是本公开实施例中另一种像素单元的构成示意图。FIG. 5 is a schematic diagram of another pixel unit in an embodiment of the disclosure.

在图5所示实施例中,像素单元12中的三个LED晶片分别位于阵列中的第n行和第n+2行,n∈[1,N1]。此时为了使像素单元获得很好的发光效果,可以设置LED晶片阵列的行间距等于列间距,从而使三角形像素单元具有更加均衡的三条边。In the embodiment shown in FIG. 5 , the three LED chips in the pixel unit 12 are respectively located in row n and row n+2 in the array, n∈[1, N1]. At this time, in order to obtain a good luminous effect for the pixel unit, the row spacing of the LED chip array can be set equal to the column spacing, so that the triangular pixel unit has more balanced three sides.

同理,图5所示的像素单元构成方式也能够实现更密集的像素分布,配合连接LED晶片上下表面的共用电极,极大地增加显示装置的分辨率。Similarly, the pixel unit structure shown in FIG. 5 can also achieve denser pixel distribution, and cooperate with the common electrode connecting the upper and lower surfaces of the LED chip to greatly increase the resolution of the display device.

在一些实施例中,为了实现更好的发光效果,可以在每两个像素单元之间间隔有不被点亮的LED晶片,间隔包括延第一方向间隔和延第二方向间隔。In some embodiments, in order to achieve a better luminous effect, there may be an interval between every two pixel units with an LED chip that is not turned on, and the interval includes an interval along the first direction and an interval along the second direction.

图6是本公开一个实施例中像素单元之间间隔的示意图。FIG. 6 is a schematic diagram of spacing between pixel units in an embodiment of the present disclosure.

参考图6,在第一方向(即行方向)上,两个像素单元之间可以间隔一列LED晶片,在第二方向(即列方向上),两个像素单元之间可以间隔一行LED晶片,以获得更好的发光效果。此外,也可以通过行间距和列间距的设置实现像素单元之间间隔的调整。Referring to FIG. 6, in the first direction (i.e. row direction), a column of LED wafers can be spaced between two pixel units, and in the second direction (i.e. column direction), a row of LED wafers can be spaced between two pixel units, so that Get a better glow effect. In addition, the adjustment of the spacing between pixel units can also be realized by setting the row spacing and the column spacing.

由于LED晶片的密集设置,控制模块14可以根据显示控制信号确定两个像素单元间隔的不被点亮的LED晶片的数量,调整像素单元之间的间隔,通过短间隔实现更细腻的显示效果或通过长间隔实现种类更多的显示效果。此外,在本公开的一种示例性实施例中,控制模块还可以根据显示控制信号确定每行LED晶片的扫描次数和扫描频率,来实现更多显示效果。Due to the dense arrangement of LED chips, the control module 14 can determine the number of LED chips that are not lighted between two pixel units according to the display control signal, adjust the spacing between pixel units, and achieve a more delicate display effect or A wider variety of display effects can be achieved through long intervals. In addition, in an exemplary embodiment of the present disclosure, the control module can also determine the number of scans and the scan frequency of each row of LED wafers according to the display control signal, so as to achieve more display effects.

综上所述,本公开实施例提供的显示装置100通过设置连接LED晶片上下表面的共用电极可以避免LED晶片尺寸过小或间距过小造成的焊接时连锡短路,从而允许在单位面积内设置间距更小、尺寸更小的LED晶片,即增大LED晶片的分布密度;此外,通过设置三角形像素单元,可以在同样数量的LED晶片数量基础上实现更多像素单元的分布,提供更多像素单元的间距、位置设置,可以进一步增加显示装置的分辨率。To sum up, the display device 100 provided by the embodiment of the present disclosure can avoid short-circuiting with tin during soldering caused by too small size or too small pitch of the LED chip by setting the common electrode connected to the upper and lower surfaces of the LED chip, thereby allowing the display device 100 to be set within a unit area. LED chips with smaller spacing and smaller size increase the distribution density of LED chips; in addition, by setting triangular pixel units, the distribution of more pixel units can be realized on the basis of the same number of LED chips, providing more pixels The spacing and position setting of the units can further increase the resolution of the display device.

图7A和图7B是本公开提供的又一种显示装置700的结构示意图。FIG. 7A and FIG. 7B are schematic structural diagrams of another display device 700 provided in the present disclosure.

参考图7A和图7B,显示装置700可以包括:7A and 7B, the display device 700 may include:

LED晶片阵列71,包括N1行N2列LED晶片711,其中LED晶片仅设置在奇数行奇数列交叉的位置和偶数行偶数列交叉的位置,或者LED晶片仅设置在奇数行偶数列交叉的位置和偶数行奇数列交叉的位置,每个LED晶片的颜色与相邻LED晶片的颜色均不同,LED晶片的阳极和阴极分别位于上表面和下表面;The LED chip array 71 includes N1 rows and N2 columns of LED chips 711, wherein the LED chips are only arranged at the positions where odd rows and columns intersect and the positions where even rows and even columns intersect, or the LED chips are only arranged at positions where odd rows and even columns intersect and At the intersection of even rows and odd columns, the color of each LED chip is different from that of adjacent LED chips, and the anode and cathode of the LED chip are located on the upper surface and the lower surface respectively;

显示屏幕72,包括在第一方向上平行等距设置的N1个第一电极,每个第一电极电连接一行LED晶片的上表面;The display screen 72 includes N1 first electrodes arranged parallel and equidistant in the first direction, and each first electrode is electrically connected to the upper surface of a row of LED chips;

基板73,包括在第二方向上平行等距设置的N2个第二电极,每个第二电极电连接一列LED晶片的下表面。The substrate 73 includes N2 second electrodes arranged parallel and equidistant in the second direction, and each second electrode is electrically connected to the lower surface of a row of LED chips.

其中,显示屏幕72例如可以为玻璃屏幕、塑胶屏幕、蓝宝石屏幕或柔性屏幕;LED晶片711的制造材料包括氮化物、氮化镓、砷化镓、磷化镓或硅。Wherein, the display screen 72 can be, for example, a glass screen, a plastic screen, a sapphire screen or a flexible screen; the manufacturing material of the LED chip 711 includes nitride, gallium nitride, gallium arsenide, gallium phosphide or silicon.

在一些实施例中,第一电极721和第二电极731均为ITO导电玻璃,此时,基板73可以为透明基板。在另一些实施例中,第一电极721可以为ITO导电玻璃,第二电极731可以为铜或其他导电材质,此时基板73可以为不透明基板,包括印刷电路基板、陶瓷基板、半导体基板、塑胶基板或柔性基板等。本公开实施例不以显示屏幕、基板、LE晶片的材质为限。In some embodiments, both the first electrode 721 and the second electrode 731 are ITO conductive glass, and at this time, the substrate 73 may be a transparent substrate. In some other embodiments, the first electrode 721 can be ITO conductive glass, and the second electrode 731 can be copper or other conductive materials. At this time, the substrate 73 can be an opaque substrate, including a printed circuit substrate, a ceramic substrate, a semiconductor substrate, a plastic substrate, etc. substrate or flexible substrate, etc. Embodiments of the present disclosure are not limited to the materials of the display screen, the substrate, and the LE chip.

图8是本公开实施例中显示装置700的电连接关系的平面示意图。FIG. 8 is a schematic plan view of an electrical connection relationship of a display device 700 in an embodiment of the present disclosure.

参考图8,在一些实施例中,LED晶片阵列71中的LED晶片仅设置在奇数行奇数列交叉的位置和偶数行偶数列交叉的位置,例如第一行第一列、第一行第三列、第一行第五列、第二行第二列、第二行第四列、第三行第一列、第三行第三列、第三行第五列等等。Referring to FIG. 8 , in some embodiments, the LED chips in the LED chip array 71 are only arranged at positions where odd rows and columns intersect and positions where even rows and even columns intersect, for example, the first column in the first row, the third row in the first row column, first row and fifth column, second row and second column, second row and fourth column, third row and first column, third row and third column, third row and fifth column, and so on.

在另一些实施例中,LED晶片阵列71中的LED晶片也可以仅设置在奇数行偶数列交叉的位置和偶数行奇数列交叉的位置,例如第一行第二列、第一行第四列、第二行第一列、第二行第三列、第二行第五列、第三行第二列、第三行第四列等等。In some other embodiments, the LED chips in the LED chip array 71 can also be arranged only at the positions where the odd-numbered rows and even-numbered columns cross and the positions where the even-numbered rows and odd-numbered columns cross, for example, the second column in the first row, the fourth column in the first row , the first column of the second row, the third column of the second row, the fifth column of the second row, the second column of the third row, the fourth column of the third row, and so on.

在图8所示实施例中,显示装置还包括电连接N1个第一电极和N2个第二电极的控制模块74,用于向第一电极和第二电极输出电信号以一次控制两行LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。In the embodiment shown in FIG. 8, the display device further includes a control module 74 electrically connected to N1 first electrodes and N2 second electrodes, and is used to output electrical signals to the first electrodes and the second electrodes to control two rows of LEDs at a time. Part of the LED chips in the chip light up simultaneously as multiple pixel units, and each pixel unit includes three LED chips arranged in a triangle with different colors.

如图8所示的LED晶片排布方式中,LED晶片颜色例如为红色、绿色、蓝色,相邻上下两行的相邻LED晶片颜色均不相同,相邻上下两行中位于两行三列的三个LED晶片构成一个三角形像素单元。In the arrangement of LED chips shown in Figure 8, the colors of the LED chips are, for example, red, green, and blue. Three LED chips in a column form a triangular pixel unit.

为了改善显示效果或制程考虑,在一些情况下,本领域技术人员会倾向于使用较大尺寸的LED晶片,此时于同一行设置过多晶片会导致晶片间距过小而引起工艺困难,因此,可以通过设置三角形排布的LED晶片像素单元来实现三角形像素单元。In order to improve the display effect or process considerations, in some cases, those skilled in the art tend to use larger-sized LED chips. At this time, setting too many chips in the same row will cause the chip pitch to be too small and cause process difficulties. Therefore, The triangular pixel unit can be realized by arranging LED wafer pixel units arranged in a triangle.

图9是本公开实施例中显示装置700中三角形像素单元的效果示意图。FIG. 9 is a schematic diagram of the effect of a triangular pixel unit in a display device 700 in an embodiment of the present disclosure.

参考图9,相比于现有技术,六行共27个LED晶片在水平方向能够形成C1~C7等七个三角形像素单元,在垂直方向能够实现A1~E1五个三角形像素单元,即共可以实现35个像素单元,较之现有技术,能够实现更高密度的像素单元设置(现有技术通过27个LED晶片仅能实现9个像素单元设置),节省了成本。Referring to Fig. 9, compared with the prior art, a total of 27 LED chips in six rows can form seven triangular pixel units C1-C7 in the horizontal direction, and five triangular pixel units A1-E1 in the vertical direction, that is, a total of Realizing 35 pixel units, compared with the prior art, can realize higher density pixel unit arrangement (the prior art can only realize 9 pixel unit arrangement through 27 LED wafers), saving cost.

图10A和图10B是本公开实施例中显示装置700的像素单元排布的示意图。FIG. 10A and FIG. 10B are schematic diagrams of pixel unit arrangement of a display device 700 in an embodiment of the present disclosure.

参考图10A,在一些实施例中,为了实现更好的发光效果,像素单元之间可以在第一方向或第二方向上间隔有若干个未被点亮的LED晶片,例如一个或两个。此外,控制模块74也可以根据显示控制信号确定每两个像素之间间隔的不被点亮的LED晶片的个数,如图10B。控制模块74也可以根据显示控制信号确定每行LED晶片的扫描次数和扫描频率,从而实现更多显示效果。Referring to FIG. 10A , in some embodiments, in order to achieve better luminous effect, several unlit LED chips, such as one or two, may be spaced between the pixel units in the first direction or the second direction. In addition, the control module 74 can also determine the number of non-lit LED chips between every two pixels according to the display control signal, as shown in FIG. 10B . The control module 74 can also determine the scanning times and scanning frequency of each row of LED wafers according to the display control signal, so as to achieve more display effects.

综上所述,图7A~图10B所示的显示装置通过设置三角形排布的像素单元可以实现更多的像素单元,此外,通过设置连接LED晶片上表面和下表面的共用电极可以避免LED晶片尺寸和间距减小带来的工艺难题,极大地提高显示装置的分辨率。In summary, the display devices shown in Figures 7A to 10B can realize more pixel units by setting pixel units arranged in a triangle. In addition, by setting a common electrode connecting the upper surface and the lower surface of the LED chip, the LED chip can be avoided. The technical difficulties brought about by the reduction of size and spacing greatly improve the resolution of the display device.

此外,上述附图仅是根据本发明示例性实施例的方法所包括的处理的示意性说明,而不是限制目的。易于理解,上述附图所示的处理并不表明或限制这些处理的时间顺序。另外,也易于理解,这些处理可以是例如在多个模块中同步或异步执行的。In addition, the above-mentioned figures are only schematic illustrations of the processes included in the method according to the exemplary embodiments of the present invention, and are not intended to be limiting. It is easy to understand that the processes shown in the above figures do not imply or limit the chronological order of these processes. In addition, it is also easy to understand that these processes may be executed synchronously or asynchronously in multiple modules, for example.

本领域技术人员在考虑说明书及实践这里公开的发明后,将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化,这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的,本公开的真正范围和构思由权利要求指出。Other embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with the true scope and concept of the disclosure indicated by the appended claims.

Claims (20)

1.一种显示装置,其特征在于,包括:1. A display device, characterized in that, comprising: LED晶片阵列,包括N1行N2列LED晶片,每行所述LED晶片按照第一色、第二色、第三色顺次等距循环排列,所述LED晶片的阴极和阳极分别位于上表面和下表面;The LED chip array includes LED chips in N1 rows and N2 columns. The LED chips in each row are arranged in an equidistant cycle according to the first color, the second color, and the third color. The cathode and anode of the LED chip are respectively located on the upper surface and the lower surface; 显示屏幕,包括在第一方向上平行等距设置的N1个第一电极,每个所述第一电极电连接一行所述LED晶片的上表面;A display screen, including N1 first electrodes arranged parallel and equidistant in the first direction, each of the first electrodes is electrically connected to the upper surface of a row of the LED chips; 基板,包括在第二方向上平行等距设置的N2个第二电极,每个所述第二电极电连接一列所述LED晶片的下表面;The substrate includes N2 second electrodes arranged in parallel and equidistant in the second direction, each of the second electrodes is electrically connected to the lower surface of a column of the LED chip; 控制模块,电连接N1个所述第一电极和N2个所述第二电极,用于向所述第一电极和所述第二电极输出电信号以一次控制两行所述LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个所述像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。A control module, electrically connected to the N1 first electrodes and the N2 second electrodes, for outputting electrical signals to the first electrodes and the second electrodes to control two rows of LED chips at a time The LED chip is turned on simultaneously as a plurality of pixel units, and each pixel unit includes three LED chips arranged in a triangle and having different colors. 2.如权利要求1所述的显示装置,其特征在于,每个所述像素单元包括分属两行三列的三个LED晶片,包括两个上行LED晶片和一个下行LED晶片,或者包括一个上行LED晶片和两个下行LED晶片,同一像素单元中两个同一行LED晶片之间包括一个不被点亮的LED晶片。2. The display device according to claim 1, wherein each pixel unit includes three LED chips belonging to two rows and three columns, including two LED chips in the upper row and one LED chip in the lower row, or one LED chip in the lower row. An LED chip in the upper row and two LED chips in the lower row, and a non-lit LED chip is included between the two LED chips in the same row in the same pixel unit. 3.如权利要求2所述的显示装置,其特征在于,所述像素单元中的LED晶片分别属于第n行和第n+2行,或者,所述像素单元中的LED晶片分别属于第n行和第n+1行,其中n∈[1,N1]。3. The display device according to claim 2, wherein the LED chips in the pixel units respectively belong to the nth row and the n+2th row, or, the LED chips in the pixel units respectively belong to the nth row row and row n+1, where n∈[1,N1]. 4.如权利要求1所述的显示装置,其特征在于,每两个所述像素单元之间间隔有不被点亮的LED晶片,所述间隔包括延所述第一方向间隔和延所述第二方向间隔。4. The display device according to claim 1, wherein an LED chip that is not lit is spaced between every two pixel units, and the space includes the space along the first direction and the space along the first direction. Second direction spacing. 5.如权利要求4所述的显示装置,其特征在于,所述控制模块设置为:根据显示控制信号确定两个所述像素单元间隔的不被点亮的LED晶片的数量。5. The display device according to claim 4, wherein the control module is configured to: determine the number of non-lit LED chips separated by two pixel units according to the display control signal. 6.如权利要求4所述的显示装置,其特征在于,两个所述像素单元间隔的不被点亮的LED晶片为一行或一列。6 . The display device according to claim 4 , wherein the non-lit LED chips separated by two pixel units form a row or a column. 7.如权利要求1所述的显示装置,其特征在于,所述控制模块设置为:根据显示控制信号确定每行所述LED晶片的扫描次数和扫描频率。7 . The display device according to claim 1 , wherein the control module is configured to: determine the scanning times and scanning frequency of each row of the LED chips according to the display control signal. 8.如权利要求1所述的显示装置,其特征在于,所述第一电极和/或所述第二电极为ITO导电玻璃。8. The display device according to claim 1, wherein the first electrode and/or the second electrode is ITO conductive glass. 9.如权利要求8所述的显示装置,其特征在于,所述基板为透明基板。9. The display device according to claim 8, wherein the substrate is a transparent substrate. 10.如权利要求1~9任一项所述的显示装置,其特征在于,所述第一色、所述第二色、所述第三色分别为红色、绿色、蓝色。10 . The display device according to claim 1 , wherein the first color, the second color, and the third color are red, green, and blue, respectively. 11 . 11.一种显示装置,其特征在于,包括:11. A display device, characterized in that it comprises: LED晶片阵列,包括N1行N2列LED晶片,其中所述LED晶片仅设置在奇数行奇数列交叉的位置和偶数行偶数列交叉的位置,或者所述LED晶片仅设置在奇数行偶数列交叉的位置和偶数行奇数列交叉的位置,每个所述LED晶片的颜色与相邻LED晶片的颜色均不同,所述LED晶片的阳极和阴极分别位于上表面和下表面;The LED chip array includes LED chips in N1 rows and N2 columns, wherein the LED chips are only arranged at positions where odd rows and odd columns intersect and even rows and even columns intersect, or the LED chips are only arranged at odd rows and even columns intersect The position where even rows and odd columns intersect, the color of each LED chip is different from that of adjacent LED chips, and the anode and cathode of the LED chip are located on the upper surface and the lower surface, respectively; 显示屏幕,包括在第一方向上平行等距设置的N1个第一电极,每个所述第一电极电连接一行所述LED晶片的上表面;A display screen, including N1 first electrodes arranged parallel and equidistant in the first direction, each of the first electrodes is electrically connected to the upper surface of a row of the LED chips; 基板,包括在第二方向上平行等距设置的N2个第二电极,每个所述第二电极电连接一列所述LED晶片的下表面。The substrate includes N2 second electrodes arranged parallel and equidistant in the second direction, and each of the second electrodes is electrically connected to the lower surface of a column of the LED chips. 12.如权利要求11所述的显示装置,其特征在于,还包括:12. The display device according to claim 11, further comprising: 控制模块,电连接N1个所述第一电极和N2个所述第二电极,用于向所述第一电极和所述第二电极输出电信号以一次控制两行所述LED晶片中的部分LED晶片作为多个像素单元同时点亮,每个所述像素单元均包括三个呈三角形排布且颜色均不相同的LED晶片。A control module, electrically connected to the N1 first electrodes and the N2 second electrodes, for outputting electrical signals to the first electrodes and the second electrodes to control two rows of LED chips at a time The LED chip is turned on simultaneously as a plurality of pixel units, and each pixel unit includes three LED chips arranged in a triangle and having different colors. 13.如权利要求12所述的显示装置,其特征在于,每两个所述像素单元之间均间隔有不被点亮的LED晶片,所述间隔包括在所述第一方向上间隔和在所述第二方向上间隔。13. The display device according to claim 12, wherein an LED chip that is not lit is spaced between every two pixel units, and the space includes spaced in the first direction and in the first direction. spaced in the second direction. 14.如权利要求13所述的显示装置,其特征在于,所述控制模块设置为:根据显示控制信号确定每两个所述像素之间间隔的不被点亮的LED晶片的个数。14. The display device according to claim 13, wherein the control module is configured to: determine the number of non-lit LED chips spaced between every two pixels according to the display control signal. 15.如权利要求13所述的显示装置,其特征在于,两个所述像素单元间隔的不被点亮的LED晶片为一个或两个。15. The display device according to claim 13, wherein there are one or two non-lit LED chips separated by two pixel units. 16.如权利要求12所述的显示装置,其特征在于,所述控制模块设置为:根据显示控制信号确定每行所述LED晶片的扫描次数和扫描频率。16 . The display device according to claim 12 , wherein the control module is configured to: determine the scanning times and scanning frequency of each row of the LED chips according to the display control signal. 17.如权利要求11所述的显示装置,其特征在于,所述第一电极和/或所述第二电极为ITO导电玻璃。17. The display device according to claim 11, wherein the first electrode and/or the second electrode is ITO conductive glass. 18.如权利要求17所述的显示装置,其特征在于,所述基板为透明基板。18. The display device according to claim 17, wherein the substrate is a transparent substrate. 19.如权利要求11所述的显示装置,其特征在于,所述LED晶片阵列的行间距大于等于列间距。19. The display device according to claim 11, wherein the row pitch of the LED chip array is greater than or equal to the column pitch. 20.如权利要求11~19任一项所述的显示装置,其特征在于,所述LED晶片包括红色、蓝色、绿色的LED晶片。20. The display device according to any one of claims 11-19, wherein the LED chips include red, blue and green LED chips.
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