CN110434456A - A kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser - Google Patents

Abstract

The invention discloses a laser welding system based on a MOPA structure high-peak short-pulse nanosecond laser, which includes a nanosecond laser, a beam expander, a high-speed galvanometer scanning system, a beam focusing lens and a vision system sequentially arranged on a three-dimensional mobile platform; The invention analyzes the visual data through the visual system to accurately locate the weldment and detect the welding effect of the solder joint in real time, and then returns the effect to the control system. The control system adjusts the emission time intensity and control of the nanosecond laser according to the received data. The deflection angle of the high-galvanometer scanning system enables the micro-level laser beam generated by the nanosecond laser to form multiple micro-solder spots at the spot on the metal sheet to be welded, and arranges the many micro-spots according to the preset route. A tooth-shaped occlusal area composed of multiple nail-shaped fine solder joints is formed at the welding point to realize the fusion of thin plate metal, thereby greatly improving the quality and yield of weldments.

Description

A Laser Welding System Based on MOPA Structure High Peak Short Pulse Nanosecond Laser

technical field

The invention relates to the technical field of laser welding, in particular to a laser welding system based on a MOPA structure high-peak short-pulse nanosecond laser.

Background technique

Thin plate metal welding technology is a technology that fuses two or more thin plate metals together; traditional laser welding generally uses ms laser for welding, and the two materials are liquefied and fused together to form a U Because of the difference in the peak value of the laser, the physical characteristics of the fusion formed are different, so that when the ms laser welds the thin plate dissimilar metal, there are problems such as the metal is not easy to fuse and the welding strength is poor. At the same time, the heat of the material is affected by the ms laser welding The effect of thermal deformation is also greater.

In order to solve the above-mentioned technical problems, in the prior art, the emission time intensity of the nanosecond laser is controlled by the control module, the deflection angle of the galvanometer scanning deflection device is controlled by the control module, or the position of the metal sheet to be welded is adjusted by the sheet holder, thereby The micro-level laser beam generated by the welding system forms a number of tiny welding spots set according to the preset route on the technical thin plate to be welded, so that the welding spots have stronger bite force, and at the same time will not cause excessive damage to the metal However, this system is not suitable for miniaturized weldments, it is difficult to accurately locate the solder joints of small weldments, and it is difficult to accurately distinguish the welding effect of solder joints in real time. Therefore, the quality and yield of weldments are not high .

Contents of the invention

The purpose of the present invention is to address the deficiencies in the prior art, to provide a laser welding system based on a MOPA structure high-peak short-pulse nanosecond laser, and to analyze the visual data through the visual system to accurately locate the weldment and detect the welding accurately in real time. point welding effect, and then return the effect to the control system, the control system adjusts the emission time intensity of the nanosecond laser and controls the deflection angle of the high-galvanometer scanning system according to the received data, so that the micro-level laser beam generated by the nanosecond laser is in the A plurality of fine solder points are formed at the solder points on the metal sheet to be welded, and the multiple fine solder points are arranged according to a preset route, and a tooth-shaped occlusal area composed of a plurality of nail-shaped fine solder points is formed at the solder points, which has a more Strong bite force to achieve thin sheet metal fusion.

To achieve the above object, the technical solution adopted in the present invention is:

A laser welding system based on a MOPA structure high-peak short-pulse nanosecond laser, including a nanosecond laser, a beam expander, a high-speed galvanometer scanning system, a beam focusing lens, and a vision system arranged sequentially through a three-dimensional mobile platform. The laser beam emitted by the laser is emitted to several metal sheets to be welded through the beam expander, the high-speed galvanometer scanning system, and the beam focusing lens. The emission control end of the nanosecond laser and the high-speed galvanometer The deflection control ends of the scanning system are all connected to the signal output ends of the control module; the beam focusing lens is aligned with the several metal sheets to be welded; the vision system includes a CCD lens and a visual information processing module, and the CCD The lens, the visual information processing module and the control module are electrically connected in sequence, and the CCD lens is arranged on the beam focusing lens.

Preferably, the nanosecond laser includes a pre-amplification level optical path structure and a main amplification level optical path structure, and the pre-amplification level optical path structure includes a seed source, a first multimode semiconductor laser, a first beam combiner, a first gain fiber and The first isolator; the main amplifier stage optical path structure includes a second gain fiber, a second beam combiner, a second multimode semiconductor laser, a second isolator and an output end; the output end of the seed source is connected to the The first beam combiner, the first gain fiber, the first isolator, the second beam combiner, the second gain fiber, the second isolator and the output end; the first A multimode semiconductor laser is connected to the first beam combiner in a backward pumping manner as a pumping source; the second multimode semiconductor laser is connected to the second beam combiner in a backward pumping manner as a pumping source connected to the device.

Preferably, the first gain fiber and the second gain fiber are double-clad ytterbium-doped fibers.

Preferably, the core diameter/inner cladding diameter of the double-clad ytterbium-doped optical fiber is 10/125 μm, and the core numerical aperture/inner cladding numerical aperture is 0.08/0.46.

Preferably, the seed source is a 1550nm semiconductor laser directly electrically modulated; the first multimode semiconductor laser and the second multimode semiconductor laser are a 975nm multimode semiconductor laser or a 950nm multimode semiconductor laser or a 915nm multimode semiconductor laser.

Preferably, it also includes a pre-amplifier driving circuit for driving the first multi-mode semiconductor laser, a seed source driving circuit for driving the seed source, and a main amplifier for driving the second multi-mode semiconductor laser. stage drive circuit and a control circuit for controlling the aforementioned drive circuits.

Preferably, the high-speed vibrating mirror scanning system includes an X-axis stepping motor and a Y-axis stepping motor connected to the vibrating mirror driver, and the X-axis stepping motor and the Y-axis stepping motor are respectively connected with mirrors, and the The high-speed galvanometer scanning system forms movable or stationary multi-beam laser beams through two reflections of mirrors respectively connected to the X-axis stepping motor and the Y-axis stepping motor.

Preferably, the diameter of the spot formed by emitting the laser beam onto the metal sheet to be welded is not greater than 100 μm.

Preferably, it also includes a temperature acquisition system, the temperature acquisition system includes an infrared temperature acquisition module and a temperature signal processing module, the infrared temperature acquisition module, the temperature signal processing module and the control module are electrically connected in sequence, and the infrared temperature acquisition module The temperature sensor is arranged on the CCD lens.

Preferably, a display module is also included, and the display module is electrically connected to the control module.

Compared with prior art, the beneficial effect of the present invention is:

(1) The present invention analyzes the visual data through the visual system to precisely locate the weldment and detect the welding effect of the solder joint accurately in real time, and then returns the effect to the control system, and the control system adjusts the emission time of the nanosecond laser according to the received data Intensity and control of the deflection angle of the high-galvanometer scanning system, so that the micro-level laser beam generated by the nanosecond laser forms multiple tiny solder spots at the welding points on the metal sheet to be welded, and makes multiple tiny solder spots follow the preset route Arrangement, a tooth-shaped occlusal area composed of multiple nail-shaped fine solder joints is formed at the welding point, which has stronger occlusal force and realizes the fusion of thin plate metal, thereby greatly improving the quality and yield of weldments.

(2) The present invention adopts a two-stage MOPA amplification structure with a directly modulated semiconductor laser as the seed source, and the seed light passes through the double-clad ytterbium-doped fiber twice for gain, which can save the length of the gain fiber, obtain higher gain and improve The light-to-light conversion efficiency of the seed source improves the amplification ability of the gain fiber for small signals and ensures the high-fidelity amplification of nanosecond laser pulses; and in the two-stage MOPA amplification optical path structure, the multi-mode semiconductor lasers all adopt the backward pumping method , can effectively suppress the ASE effect, and increase the output power at the same time, so that the high anti-metal can also be effectively absorbed, realize the gasification and liquefaction of the metal, and make a nail-shaped occlusal area formed by multiple fine solder joints set according to the preset route. It has a stronger bite force without excessive thermal impact on the metal, thus providing a reliable and stable light source output for high-quality welding of thin-plate dissimilar metals.

Description of drawings

Fig. 1 is a kind of structure block diagram of the laser welding system based on MOPA structure high-peak short-pulse nanosecond laser of the present invention;

Fig. 2 is the structural representation of nanosecond laser of the present invention;

Fig. 3 is a partial structural schematic diagram of a laser welding system based on a MOPA structure high-peak short-pulse nanosecond laser according to the present invention.

In the figure: 1, nanosecond laser; 100, seed source; 101, the first multimode semiconductor laser; 102, the first beam combiner; 103, the first gain fiber; 104, the first isolator; 105, the second multiple Mode semiconductor laser; 106, second beam combiner; 107, second gain fiber; 108, second isolator; 109, output end; 110, control circuit; 111, seed source drive circuit; 112, pre-amplification stage drive circuit ; 113. Main amplifier drive circuit; 2. Beam expander; 3. High-speed galvanometer scanning system; 4. Beam focusing lens; 5. Control module; 6. Display module; 7. Visual system; 701. CCD lens; 702 . Visual information processing module; 8. Temperature acquisition system; 801. Infrared temperature acquisition module; 802. Temperature signal processing module.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail in conjunction with the following examples; it should be understood that the specific examples described here are only used to explain the present invention and are not intended to limit the present invention Unless otherwise specified, the reagents, methods and equipment used in the present invention are conventional reagents, methods and equipment in this technical field.

The present invention will be described in further detail below through specific implementation examples and in conjunction with the accompanying drawings.

Example 1

As shown in Figures 1 to 3, a laser welding system based on a MOPA structure high-peak short-pulse nanosecond laser 1 includes a nanosecond laser 1, a beam expander 2, and a high-speed galvanometer scanning system 3 sequentially set up through a three-dimensional mobile platform , beam focusing lens 4 and vision system 7, the laser beam that described nanosecond laser 1 sends is through described beam expander 2, described high-speed galvanometer scanning system 3, described beam focusing lens 4 launches to several to be welded For thin metal plates, the emission control end of the nanosecond laser 1 and the deflection control end of the high-speed galvanometer scanning system 3 are all connected to the signal output end of the control module 5; the beam focusing lens 4 is aligned with the to-be-welded Several thin metal plates are set; the visual system 7 includes a CCD lens 701 and a visual information processing module 702, and the CCD lens 701, the visual information processing module 702 and the control module 5 are electrically connected in turn, and the CCD lens 701 is arranged on the The light beam is focused on the lens 4.

When working, put several metal sheets to be welded layer by layer on the workbench, and the beam focusing lens 4 is aligned with several metal sheets to be welded on the workbench; several metal sheets to be welded are stacked on the sheet holder Above, the sheet holder is movable on the workbench, and the laser beam is emitted to the metal sheet to be welded to form a spot diameter not greater than 100 μm.

In the present invention, the visual system 7 is used to obtain the visual parameters of the welding zone and the weldment to realize position positioning, power control and quality monitoring, wherein the visual system 7 includes a CCD lens 701 and a visual information processing module 702, and the CCD lens 701 is located at the place. On the beam focusing lens 4, let the CCD lens 701 move with the beam focusing lens 4; the CCD lens 701 is located directly above the welding zone and is used to collect the image information of the workpiece to be welded; wherein, the CCD lens 701 is high-speed, high-resolution Lens, the resolution of which is greater than 10 million to ensure the detection effect, the visual information processing module 702 is used to process the video data such as amplification, filtering, and analog-to-digital conversion, which can be specifically a video signal acquisition card; Carry out precise positioning and identify the welding effect; then the control module 5 will adjust the output power of the nano-laser according to the feedback of the vision system 7 on the welding effect, and the power adjustment time will be completed within 100ms, which ensures the weldment. Quality, improve the yield of weldments.

The main function of the beam expander 2 is to expand the spot of the laser beam, reduce the divergence angle of the laser, and use the laser to focus better. The galvanometer scanning deflection device includes two lenses, which are respectively connected to the X-axis drive arm and The Y-axis drive arm, the X-axis drive arm and the Y-axis drive arm are respectively connected to the output ends of the X-axis motor and the Y-axis motor. The focusing lens is a laser optical device, which realizes the laser through a group of lens groups. Focus to obtain the micron-sized spot required for laser processing.

The present invention focuses the laser light on the sheet metal through the beam transmission focusing system to realize the nail-like occlusion of the sheet metal, thereby solving the problem that the sheet is too thin or the fusion of dissimilar metals is difficult, and realizes the fusion of the sheet metal. Compared with the ms laser, the ns laser has Smaller pulse width (1ms=1000us, 1us=1000ns), higher peak power, high anti-metal can also effectively absorb, realize the gasification and liquefaction of metal, multiple fine solder joint phases set according to the preset route Compared with the traditional U-shaped area, it has a stronger bite force, and at the same time, it will not have an excessive thermal impact on the metal. The control module 5 controls the high-speed galvanometer scanning system 3 to deflect according to the preset route, so that several tiny solder joints follow the preset route. The routes are arranged in sequence to form welding points; in the present invention, the welding position and angle can also be adjusted by moving the metal sheet to be welded or the sheet holder.

The laser beam emitted by the nano-laser can be scanned by the high-speed galvanometer to form a laser beam of a certain size. By controlling the deflection angle of the high-speed galvanometer lens, the laser beam can be controlled to be emitted to the stacked metal sheets to be welded according to a specific trajectory. Several fine solder joints form a nail-shaped bite area at the point to be welded, and each fine solder joint is filled with the gasification or liquefaction of the materials of the upper and lower metal sheets in the area where the laser beam passes through, and then fused and solidified .

Among them, the arrangement forms of several fine solder joints arranged in sequence according to the preset route to form solder joints include: a spiral arrangement formed by arranging at one welding point, a mesh arrangement, a broken line arrangement, a spiral arrangement, a net The distance between each of the micro-solder spots in the shape arrangement or the zigzag line arrangement and the two adjacent micro-solders in front and back is not greater than 0.5mm.

Specifically, the nanosecond laser 1 includes a pre-amplification level optical path structure and a main amplification level optical path structure, and the pre-amplification level optical path structure includes a seed source 100, a first multimode semiconductor laser 101, a first beam combiner 102, a second A gain fiber 103 and a first isolator 104; the main amplifier stage optical path structure includes a second gain fiber 107, a second beam combiner 106, a second multimode semiconductor laser 105, a second isolator 108 and an output end 109; The output end of the seed source 100 is sequentially connected to the first beam combiner 102, the first gain fiber 103, the first isolator 104, the second beam combiner 106, and the second gain fiber 107. The second isolator 108 and the output terminal 109; the first multimode semiconductor laser 101 is used as a pumping source and connected to the first beam combiner 102 in a backward pumping manner; the first Two multimode semiconductor lasers 105 are used as pumping sources and connected to the second beam combiner 106 in a backward pumping manner.

The advantage of the nanosecond laser 1 adopted in the present invention is that the pulse width is small, the peak value is high, and it breaks down the upper metal sheet, so that the lower metal gasifies and liquefies and rises to the upper metal layer to solidify, so that a large number of fine solder joints are formed between the upper and lower metal layers , several fine solder joints form a nail-shaped occlusal area at the solder joints to realize the fusion of thin metal plates. After the laser beam emitted by the nanosecond laser 1 passes through the beam expander 2, it is transmitted to the focusing lens by the laser high-speed galvanometer scanning system 3, and the laser After the beam is focused on the thin plate metal to the micron level, a large number of micro-holes are drilled at high speed through the control module 5, so that the lower metal layer is vaporized and liquefied and rises to the upper metal layer to solidify, thereby forming a large number of fine nail-shaped bites.

Specifically, the first gain fiber 103 and the second gain fiber 107 are double-clad ytterbium-doped fibers, and the ytterbium-doped fibers can overcome the concentration quenching effect of erbium-doped fibers and improve the pump conversion efficiency of the gain fibers, thereby improving Output Power.

Specifically, the core diameter/inner cladding diameter of the double-clad ytterbium-doped optical fiber is 10/125 μm, and the core numerical aperture/inner cladding numerical aperture is 0.08/0.46.

Specifically, the seed source 100 is a 1550nm semiconductor laser directly electrically modulated, its bandwidth is 2.5GHz, the modulated output pulse width is 519±0.6ps, and the repetition frequency is continuously adjustable within the range of 1MHz-2MHz; the first The first multimode semiconductor laser 101 and the second multimode semiconductor laser 105 are 975nm multimode semiconductor lasers or 950nm multimode semiconductor lasers or 915nm multimode semiconductor lasers.

Preferably, the first multimode semiconductor laser 101 adopts a multimode semiconductor laser with the highest output power of 20W, the working wavelength is 915nm, the core/cladding diameter of the output pigtail is 105/125μm, and the numerical aperture is 0.22; the main amplifier stage The optical path structure uses two second multimode semiconductor lasers 105 with the highest output power of 30W, the working wavelength is 915nm, the core/cladding diameter of the output pigtail is 105/125μm, and the numerical aperture is 0.22.

Specifically, the optical path structure of the pre-amplification stage uses a (2+1)×1 beam combiner, the maximum power of a single arm at the pump end is 30W, the core/cladding diameter of the pigtail fiber at the pump end is 105/125μm, and the numerical aperture is 0.22 , the core/cladding diameter of the pigtail at the signal input and output ends is 10/125 μm, the optical path structure of the main amplifier stage also uses a (2+1)×1 beam combiner, and the core/cladding of the pigtail at the signal output end The layer diameter is 20/125 μm.

The working wavelength of the optical isolator used in the pre-amplification level optical path structure is 1064nm, and the maximum withstand power is 15W, so it can protect the seed source 100; the working wavelength of the optical isolator used in the main amplification level optical path structure is 1064nm, and the maximum withstand power is 50W ; Connect the isolator at the output end 109, which can prevent the Fresnel reflection of the end face from generating parasitic laser oscillation, and then connect the fiber collimator to ensure the collimated output of the laser.

The present invention adopts a two-stage MOPA amplification structure with a directly modulated semiconductor laser as the seed source 100 to realize stable output of high-power nanosecond laser pulses; adopts a double-pass single-stage amplification to overcome problems such as small signal amplification difficulties and too long gain fibers; adopts a single-pass The backward pumping method overcomes the problem of ASE light accumulation in the small signal pulse amplification process and greatly increases the output power. Therefore, the laser output power is high, the number of amplification stages is small, the structure is compact, and the cost is low. The average power is finally obtained by using a two-stage amplifier. It is 30.3W, the repetition frequency is adjustable in the range of 10-80KHz, and the laser pulse output with a center wavelength of 1064.016nm.

Specifically, it also includes a pre-amplification stage drive circuit 112 for driving the first multimode semiconductor laser 101, a seed source drive circuit 111 for driving the seed source 100, and a seed source drive circuit 111 for driving the second multimode semiconductor laser. The main amplifier driving circuit 113 of the laser 105 and the control circuit 110 for controlling the aforementioned driving circuits.

Specifically, the high-speed vibrating mirror scanning system 3 includes an X-axis stepping motor and a Y-axis stepping motor connected to the vibrating mirror driver, and the X-axis stepping motor and the Y-axis stepping motor are respectively connected with mirrors, so The high-speed galvanometer scanning system 3 forms movable or stationary multi-beam laser beams through two reflections of mirrors respectively connected to the X-axis stepping motor and the Y-axis stepping motor.

Specifically, the diameter of the spot formed by emitting the laser beam onto the metal sheet to be welded is not greater than 100 μm.

Specifically, a temperature acquisition system 8 is also included, and the temperature acquisition system 8 includes an infrared temperature acquisition module 801 and a temperature signal processing module 802, and the infrared temperature acquisition module 801, the temperature signal processing module 802 and the control module 5 are electrically connected in sequence, The temperature sensor of the infrared temperature acquisition module 801 is arranged on the CCD lens 701; the temperature acquisition system 8 is used to obtain the temperature parameters of the welding zone to realize power control; wherein the infrared temperature acquisition module 801 can be a common infrared thermometer , which is electrically connected to the temperature sensor through a wire; wherein, the acquisition range of the temperature sensor of the infrared temperature acquisition module 801 in this embodiment is 200-800°C to ensure the detection effect; the temperature signal processing module 802 is used to amplify the temperature data , analog-to-digital conversion and other processing, specifically it can be a temperature signal acquisition card.

Specifically, it also includes a display module 6, which is electrically connected to the control module 5, and is used to display the visual data acquired by the visual system 7, and can also display setting parameters, welding trajectory and welding temperature, etc.

The above is only an illustrative embodiment of the present invention, and is not intended to limit the present invention in any form and in essence. Several improvements and supplements should also be regarded as the scope of protection of the present invention; those who are familiar with this profession can use the technical content disclosed above to make some changes, modifications and evolutions without departing from the spirit and scope of the present invention. The equivalent changes are all equivalent embodiments of the present invention; at the same time, all changes, modifications and evolutions of any equivalent changes made to the above-mentioned embodiments according to the substantive technology of the present invention still belong to the protection scope of the present invention.

Claims (10)

1. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser, which is characterized in that including logical Cross nanosecond laser, beam expanding lens, high-speed vibrating mirror scanning system, beam focusing lens and vision that three-dimensional mobile platform is set gradually System, the laser beam that the nanosecond laser issues are poly- through the beam expanding lens, the high-speed vibrating mirror scanning system, the light beam Focus lens are emitted to several sheet metals to be welded, the emission control end of the nanosecond laser and high-speed vibrating mirror scanning The deflection control terminal of system is all connected to the signal output end of control module；The beam focusing lens are aligned described to be welded Several sheet metal settings；The vision system includes CCD camera lens and Vision information processing module, the CCD camera lens, vision letter Breath processing module and control module are sequentially connected electrically, and the CCD camera lens is set on the beam focusing lens.

2. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 1 System, which is characterized in that the nanosecond laser includes pre-amplification stage light channel structure and main amplifier stage light channel structure, the pre-amplification Grade light channel structure includes seed source, the first multimode semiconductor laser, the first bundling device, the first gain fibre and the first isolation Device；The main amplifier stage light channel structure includes the second gain fibre, the second bundling device, the second multimode semiconductor laser, second Isolator and output end；The output end of the seed source is sequentially connected first bundling device, first gain fibre, described First isolator, second bundling device, second gain fibre, second isolator and the output end；Described One multimode semiconductor laser is connected in a manner of backward pump with first bundling device as pumping source；More than described second Mould semiconductor laser is connected with backward pump mode with second bundling device as pumping source.

3. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 2 System, which is characterized in that first gain fibre, the second gain fibre are Double Cladding Ytterbium Doped Fiber.

4. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 3 System, which is characterized in that core diameter/inner cladding diameter of the Double Cladding Ytterbium Doped Fiber is 10/125 μm, fibre core numerical aperture/ Inner cladding numerical aperture is 0.08/0.46.

5. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 2 System, which is characterized in that the seed source is the 1550nm semiconductor laser of direct electrical modulation；First multiple die semiconductor swashs Light device, the second multimode semiconductor laser be 975nm multimode semiconductor laser or 950nm multimode semiconductor laser or 915nm multimode semiconductor laser.

6. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 2 System, which is characterized in that further include for driving the pre-amplification stage driving circuit of first multimode semiconductor laser, for driving Move the seed source driving circuit of the seed source, for driving the main amplifier stage of second multimode semiconductor laser to drive electricity Road and the control circuit that aforementioned each driving circuit is controlled.

7. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 1 System, which is characterized in that the high-speed vibrating mirror scanning system includes the X-axis stepper motor being connected with vibrating mirror driver and Y-axis stepping Motor, the X-axis stepper motor, y-axis stepper motor are connected separately with reflecting mirror, the high-speed vibrating mirror scanning system by with institute It is removable or static more to state reflecting to form twice for the reflecting mirror that X-axis stepper motor and the y-axis stepper motor are separately connected Beam laser beam.

8. a kind of laser welding based on MOPA structure peak value short pulse nanosecond laser according to claim 1 or claim 7 System, which is characterized in that the laser beam, which emits to the spot diameter formed on the sheet metal to be welded, to be not more than 100μm。

9. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 1 System, which is characterized in that further include temperature acquisition system, the temperature acquisition system includes infrared temperature acquisition module and temperature letter Number processing module, the infrared temperature acquisition module, processes temperature signal module and control module are sequentially connected electrically, described infrared The temperature sensor of temperature collecting module is set on the CCD camera lens.

10. a kind of laser welding system based on MOPA structure peak value short pulse nanosecond laser according to claim 1 System, which is characterized in that further include display module, the display module is electrically connected with control module.