CN110418225B

CN110418225B - A microphone device

Info

Publication number: CN110418225B
Application number: CN201810388306.7A
Authority: CN
Inventors: 张磊; 廖风云; 齐心
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2018-04-26
Filing date: 2018-04-26
Publication date: 2024-12-03
Anticipated expiration: 2038-04-26
Also published as: CN110418225A

Abstract

The application provides a microphone device which comprises a microphone and a vibration sensor, wherein the microphone is used for receiving a first signal, the first signal comprises a voice signal and a first vibration signal, the vibration sensor is used for receiving a second vibration signal, and the microphone and the vibration sensor are configured so that the first vibration signal can be counteracted with the second vibration signal.

Description

Microphone device

Technical Field

The present application relates to a device and a method for removing noise from an earphone, and more particularly, to a device and a method for removing vibration noise from an earphone using dual microphones.

Background

Because bone conduction headphones open both ears, allowing the wearer to hear ambient sound, it is becoming increasingly popular in the marketplace. As the use scene becomes complex, the requirements for the communication effect in communication become higher. During a conversation, vibrations of the bone conduction headset housing may be picked up by the microphone, thereby creating echoes or other disturbances during the conversation. In some headsets integrated with bluetooth chips, multiple signal processing methods may be integrated on the bluetooth chip, such as wind noise resistance, echo cancellation, dual microphone noise reduction, etc. But compared with a common air conduction Bluetooth headset, the bone conduction headset has the advantages that signals received by the bone conduction headset are more complex, noise reduction is more difficult to achieve through a signal processing method, the phenomena of word loss/reverberation are serious, explosion sound is generated, and the communication effect is seriously affected. In some cases, in order to ensure the conversation effect, a damping structure needs to be arranged in the earphone. But the volume of the shock absorbing structure is limited due to the limited volume of the earphone body.

Disclosure of Invention

According to an aspect of the present application, there is provided a microphone apparatus including a microphone and a vibration sensor. The microphone is configured to receive a first signal, the first signal including a voice signal and a first vibration signal, the vibration sensor is configured to receive a second vibration signal, and the microphone and the vibration sensor are configured such that the first vibration signal is offset from the second vibration signal.

In some embodiments, the cavity volume of the vibration sensor is configured such that the amplitude-frequency response of the vibration sensor to the second vibration signal is the same as the amplitude-frequency response of the microphone to the first vibration signal and/or such that the phase-frequency response of the vibration sensor to the second vibration signal is the same as the phase-frequency response of the microphone to the first vibration signal.

In some embodiments, the cavity volume of the vibration sensor is proportional to the cavity volume of the microphone such that the second vibration signal may cancel out with the first vibration signal.

In some embodiments, the ratio of the cavity volume of the vibration sensor to the cavity volume of the microphone is between 3:1 and 6.5:1.

In some embodiments, the microphone apparatus further comprises a signal processing unit. The signal processing unit is configured to cancel the first vibration signal and the second vibration signal and output the voice signal.

In some embodiments, the vibration sensor is a closed microphone or a duplex microphone.

In some embodiments, the microphone is a front cavity opening or a rear cavity opening, the vibration sensor is a closed microphone, and the closed microphone is closed for both the front cavity and the rear cavity.

In some embodiments, the microphone is a front cavity or a rear cavity opening, and the vibration sensor is a dual communication microphone that is both front and rear cavity openings.

In some embodiments, the microphone front cavity opening is at least one opening in the top or side wall of the front cavity.

In some embodiments, the microphone and the vibration sensor are independently connected to the same housing structure.

In some embodiments, the device further comprises a vibration unit. At least a portion of the vibration unit is located within the housing, the vibration unit configured to generate the first vibration signal and the second vibration signal. Wherein the microphone and the vibration sensor are located at adjacent positions on the housing or at symmetrical positions on the housing with respect to the vibration unit.

In some embodiments, the microphone or vibration sensor is connected to the housing in one of a cantilever connection, a rim connection, or a base connection.

In some embodiments, the microphone and the vibration sensor are both microelectromechanical systems microphones.

According to another aspect of the present application, there is provided a headset system comprising a vibration speaker, a microphone arrangement and a housing. Wherein the vibration speaker is located within the housing with the microphone apparatus, the microphone apparatus including a microphone and a vibration sensor. Wherein the microphone is configured to receive a first signal comprising a speech signal and a first vibration signal, the vibration sensor is configured to receive a second vibration signal, the first vibration signal and the second vibration signal being generated by vibration of the vibration speaker, and the microphone and the vibration sensor are configured such that the first vibration signal is cancelled by the second vibration signal.

Compared with the prior art, the application has the following beneficial effects:

the effect of removing vibration noise in the earphone is better by adopting a mode of combining structural design and algorithm;

By adopting a vibration sensor (such as a bone conduction microphone, a closed microphone or a duplex microphone) with special design, the air conduction sound signal in the earphone can be effectively shielded, so that only vibration noise signals are picked up;

Through structural design, vibration sensor (for example, bone conduction microphone, closed microphone or duplex communication microphone) and air conduction microphone are unanimous to vibration noise signal's amplitude frequency response and/or phase frequency response, reach better denoising effect.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some embodiments of the present application, and it is apparent to those skilled in the art that the present application can be applied to other similar situations according to the drawings without inventive effort. Unless otherwise apparent from the context of the language, the same reference numbers in the drawings refer to the same structures and operations.

Fig. 1 is a schematic diagram of a dual microphone headset according to some embodiments of the application;

FIGS. 2-A through 2-C are schematic diagrams of signal processing methods for removing vibration noise, according to some embodiments of the application;

FIG. 3 is a schematic diagram of an earphone housing according to some embodiments of the present application;

FIGS. 4-A and 4-B are amplitude and phase frequency response curves for microphones disposed at different locations of an earphone housing according to some embodiments of the present application;

FIG. 5 is a schematic illustration of a microphone or vibration sensor coupled to a housing, according to some embodiments of the application;

FIGS. 6-A and 6-B are amplitude and phase frequency response curves for a microphone or vibration sensor at various connection locations with a housing, according to some embodiments of the application;

FIG. 7 is a schematic illustration of a microphone or vibration sensor coupled to a housing, according to some embodiments of the application;

FIGS. 8-A and 8-B are amplitude and phase frequency response curves for a microphone or vibration sensor coupled at different locations of a housing, according to some embodiments of the application;

FIGS. 9-A through 9-C are schematic structural diagrams of microphones and vibration sensors according to some embodiments of the present application;

FIGS. 10-A and 10-B are amplitude and phase frequency response curves for vibration noise signals at different cavity heights of a vibration sensor according to some embodiments of the present application;

FIGS. 11-A and 11-B are amplitude-frequency and phase-frequency response curves of an air conduction microphone as the volume of the front cavity changes, according to some embodiments of the application;

FIG. 12 is a plot of the amplitude-frequency response of microphones at different aperture locations, in accordance with some embodiments of the present application;

FIG. 13 is a graph showing the amplitude-frequency response of an air conduction microphone and a fully enclosed microphone to vibration as the volume of the front cavity changes in a peripheral edge connection, in accordance with some embodiments of the present application;

FIG. 14 is a graph showing the amplitude-frequency response of an air conduction microphone and two duplex microphones to air conduction sound signals in accordance with some embodiments of the application;

FIG. 15 is a graph of amplitude versus frequency response of a vibration sensor versus vibration, according to some embodiments of the application;

Fig. 16 is a schematic diagram of a dual microphone headset according to some embodiments of the application;

fig. 17 is a schematic diagram of an embodiment of a dual microphone assembly structure according to some embodiments of the application;

fig. 18 is a schematic diagram of a dual microphone headset according to some embodiments of the application;

fig. 19 is a schematic diagram of a dual microphone headset according to some embodiments of the application;

Fig. 20 is a schematic diagram of a dual microphone headset according to some embodiments of the application, and

Fig. 21 is a schematic diagram of a dual microphone headset according to some embodiments of the application.

Detailed Description

As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. The terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified and do not constitute an exclusive list, and other steps or elements may be included in a method or apparatus. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment" and the term "another embodiment" means "at least one other embodiment". Related definitions of other terms will be given in the description below.

A flowchart is used in the present application to describe the operations performed by a system according to embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in order precisely. Rather, the various steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.

Fig. 1 is a schematic diagram of an earphone 100 according to some embodiments of the present application. The earphone 100 may include a vibration speaker 101, a resilient structure 102, a housing 103, a first connection structure 104, a microphone 105, a second connection structure 106, and a vibration sensor 107.

The vibration speaker 101 may convert an electric signal into a sound signal. The sound signal may be transmitted to the user by means of air conduction or bone conduction. For example, the vibratory speaker 101 may contact the user's head directly or through a specific medium (e.g., one or more panels) and deliver the sound signal to the user's auditory nerve by way of skull vibration.

The housing 101 may be used to support and protect one or more components in the earphone 100 (e.g., the vibration speaker 101). The elastic structure 102 may connect the vibration speaker 101 and the housing 103. In some embodiments, the resilient structure 102 may secure the vibration speaker 101 within the housing 103 in the form of a sheet metal and reduce vibrations transmitted by the vibration speaker 101 to the housing 103 in a vibration reducing manner.

The microphone 105 may collect sound signals (e.g., a user's voice) in the environment and convert the sound signals into electrical signals. In some embodiments, microphone 105 may capture sound that propagates via air (also referred to as an "air conduction microphone").

The vibration sensor 107 may collect a mechanical vibration signal (e.g., a signal generated by the vibration of the housing 103) and convert the mechanical vibration signal into an electrical signal. In some embodiments, the vibration sensor 107 may be a device that is sensitive to mechanical vibrations and insensitive to air-conduction sounds (i.e., the response capability of the vibration sensor 107 to mechanical vibrations exceeds the response capability of the vibration sensor 107 to air-conduction sounds). The term mechanical vibration signal as used herein refers primarily to vibrations propagating through a solid body. In some embodiments, the vibration sensor 107 may be a bone conduction microphone. In some embodiments, the vibration sensor 107 may be obtained by changing the configuration of the air conduction microphone. Details of changing the air conduction microphone to obtain a vibration sensor are described elsewhere in this disclosure, for example, in fig. 9-B and 9-C and their corresponding descriptions.

The microphone 105 may be connected to the housing 103 by a first connection structure 104. The vibration sensor 107 may be connected to the housing 103 by a second connection structure 106. The first connection structure 104 and/or the second connection structure 106 may connect the microphone 105 and the vibration sensor 107 to the inside of the housing 103 by the same way, or by different ways. For more details regarding the first connection structure 104 and/or the second connection structure 106, see, for example, fig. 5 and/or fig. 7, and their corresponding descriptions, for additional details of the present application.

The microphone 105 may generate noise during operation due to the effects of other components in the headset 100. By way of illustration only, the process by which the microphone 105 generates noise is described below. The vibration speaker 101 vibrates when an electric signal is applied. The vibration speaker 101 transmits vibration to the housing 103 through the elastic structure 102. Since the housing 103 and the microphone 105 are directly connected by the connection structure 104, vibration of the housing 103 causes vibration of the diaphragm in the microphone 105, thereby generating noise (also referred to as "vibration noise" or "mechanical vibration noise").

The vibration signal acquired by the vibration sensor 107 may be used to cancel vibration noise generated in the microphone 105. In some embodiments, the type of the microphone 105 and/or the vibration sensor 107 may be selected, and the microphone 105 and/or the vibration sensor 107 may be connected to the housing 103 at a position inside the housing 103, and the microphone 105 and/or the vibration sensor 107 may be connected to the housing 103 in such a manner that the amplitude-frequency response and/or the phase-frequency response of the microphone 105 and the vibration sensor 107 to vibrations are consistent, so as to achieve the effect of eliminating vibration noise generated in the microphone 105 by using the vibration signal collected by the vibration sensor 107.

The above description of the earphone structure is only a specific example and should not be considered as the only possible implementation. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific manner of implementing the headset may be made without departing from this principle, but remain within the scope of the above description. For example, additional microphones or vibration sensors may be included in the headset 100 to cancel vibration noise generated by the microphone 105.

Fig. 2-a is a signal processing method for removing vibration noise according to some embodiments of the application. In some embodiments, the signal processing method includes canceling the vibration noise signal received by the microphone and the vibration signal received by the vibration sensor by digital signal processing. In some embodiments, the signal processing method includes directly performing a cancellation operation on the signal with an analog circuit in the manner of an analog signal. In some embodiments, the signal processing method may be implemented by one signal processing unit in the headset.

As shown in fig. 2-a, in the signal processing circuit 210, a ₁ is one vibration sensor (e.g., vibration sensor 107), and B ₁ is one microphone (e.g., microphone 105). Vibration sensor a ₁ may receive the vibration signal and microphone B ₁ may receive the air conduction sound signal and the vibration noise signal. The vibration signal received by vibration sensor a ₁ and the vibration noise signal received by microphone B ₁ may originate from the same vibration source (e.g., vibration speaker 101). The vibration signal received by vibration sensor a ₁ is passed through an adaptive filter C and superimposed on the vibration noise signal received by microphone B ₁. The adaptive filter C may adjust the vibration signal received by the vibration sensor a (e.g., adjust the amplitude and/or phase of the vibration signal) according to the superposition result, so that the vibration signal received by the vibration sensor a ₁ and the vibration noise signal received by the microphone B ₁ cancel each other, thereby achieving the purpose of noise cancellation.

In some embodiments, the parameters of the adaptive filter C are fixed. For example, because the connection location and connection manner of the vibration sensor a ₁ and the microphone B ₁ to the earphone housing are fixed, the amplitude-frequency response and/or the phase-frequency response of the vibration sensor a ₁ and the microphone B ₁ to the vibration remain unchanged. Thus, the parameters of the adaptive filter C may be stored in one signal processing chip after determination and may be used directly in the signal processing circuit 210. In some embodiments, the parameters of the adaptive filter C are variable. In the process of noise cancellation, the adaptive filter C may adjust its parameters according to the signals received by the vibration sensor a ₁ and/or the microphone B ₁, so as to achieve the purpose of noise cancellation.

Fig. 2-B is a signal processing method for removing vibration noise according to some embodiments of the application. The difference from fig. 2-a is that the signal processing circuit 220 of fig. 2-B employs one signal amplitude modulation element D and one signal phase modulation element E instead of the adaptive filter C. Vibration signals received by the vibration sensor A ₂ can be offset with vibration noise signals received by the microphone B ₂ after amplitude modulation and phase modulation, so that the purpose of noise elimination is achieved. In some embodiments, the signal processing method may be implemented by one signal processing unit in the headset. In some embodiments, neither signal amplitude modulation element D nor signal phase modulation element E is necessary.

Fig. 2-C illustrates a signal processing method for removing vibration noise according to some embodiments of the application. Unlike the signal processing circuits in fig. 2-a and 2-B, in fig. 2-C, the vibration noise signal S2 obtained by the microphone B ₃ can be directly subtracted from the vibration signal S1 received by the vibration sensor a ₃ by a reasonable structural design, so as to achieve the purpose of noise cancellation. In some embodiments, the signal processing method may be implemented by one signal processing unit in the headset.

It should be noted that, in the processing of the two signals in fig. 2-a, 2-B or 2-C, the superposition process of the signal received by the vibration sensor and the signal received by the microphone may be understood as removing the portion related to the vibration noise in the signal received by the microphone based on the signal received by the vibration sensor, so as to achieve the purpose of eliminating the vibration noise.

The above description of noise cancellation is merely a specific example and should not be considered as the only viable implementation. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific way of implementing noise cancellation may be made without departing from this principle, but remain within the scope of the above description. For example, it will be apparent to those skilled in the art that the adaptive filter C, the signal amplitude modulation element D, and the signal phase modulation element E may be replaced by other elements or circuits that may be used for signal conditioning, so long as the replacement elements or circuits may be used for conditioning the vibration signal of the vibration sensor for the purpose of eliminating the vibration noise signal in the microphone.

As previously described, the amplitude frequency response and/or the phase frequency response of the vibration sensor and/or microphone to vibrations is related to its position on the earphone housing. By adjusting the positions of the vibration sensor and/or the microphone connected to the shell, the amplitude-frequency response and/or the phase-frequency response of the microphone and the vibration sensor to vibration can be kept basically consistent, so that the effect of counteracting vibration noise generated by the microphone by using vibration signals acquired by the vibration sensor is achieved. Fig. 3 is a schematic structural view of an earphone housing according to some embodiments of the present application. As shown in fig. 3, the housing 300 is of a ring-shaped structure, and the housing 300 can support and protect a vibration speaker (e.g., the vibration speaker 101) in the earphone. Position 301, position 302, position 303, and position 304 are optional four locations within the earphone housing 300 where a microphone or vibration sensor may be placed. When the microphone and vibration sensor are coupled at different locations within the housing 300, their amplitude-frequency response and/or phase-frequency response to vibrations may also be different. Wherein position 301 and position 302 are adjacent. Position 303 and position 301 are located at adjacent angular positions of housing 300. Position 304 is furthest from position 301 and is located diagonally to housing 300.

Fig. 4-a and 4-B are amplitude-frequency response curves for microphones disposed at different locations of an earphone housing according to some embodiments of the present application. As shown in fig. 4-a, the horizontal axis represents vibration frequency and the vertical axis represents amplitude-frequency response of the microphone to vibration. The vibrations are generated by a vibration speaker within the headset and transferred to the microphone via a housing, connection structure, etc. Wherein curves P1, P2, P3 and P4 represent the amplitude-frequency response curves of the microphone at locations 301, 302, 303 and 304, respectively, within the housing 300. As shown in fig. 4-B, the horizontal axis is the vibration frequency and the vertical axis is the phase frequency response of the microphone to vibration. Wherein curves P1, P2, P3 and P4 represent the phase frequency response curves of the microphone at locations 301, 302, 303 and 304, respectively, within the housing.

Based on the position 301, it can be seen that the amplitude frequency response curve and the phase frequency response curve of the microphone at the position 302 are most similar to those of the microphone at the position 301, and secondly, the amplitude frequency response curve and the phase frequency response curve of the microphone at the position 304 are more similar to those of the microphone at the position 301. In some embodiments, the microphone and the vibration sensor may be connected in a close position (e.g., adjacent position) inside the earphone housing or in a symmetrical position relative to the vibration speaker inside the earphone housing (e.g., the microphone and the vibration sensor may be located at opposite angles of the earphone housing when the vibration speaker is located at the center of the earphone housing), regardless of other factors such as the microphone and the vibration sensor structure and the connection, the difference in amplitude-frequency response and/or phase-frequency response of the microphone and the vibration sensor may be minimized, thereby helping to better eliminate vibration noise in the microphone.

Fig. 5 is a schematic diagram illustrating a microphone or vibration sensor coupled to a housing according to some embodiments of the application. For convenience of description, connection of the microphone to the housing is described below as an example.

As shown in fig. 5, the side wall of the microphone 503 is connected to the side wall 501 of the earphone housing by a connection structure 502, so as to form a cantilever connection. The connection structure 502 may fix the microphone 503 and the housing sidewall 501 in a manner of interference of a silicone sleeve, or connect the microphone 503 and the housing sidewall 501 in a manner of direct bonding of glue (hard glue or soft glue). As shown, the contact point 504 of the central axis of the connection structure 502 with the housing sidewall 501 is defined as the dispensing location. The distance between the dispensing position 504 and the bottom of the microphone 503 is H1. The amplitude frequency response and/or the phase frequency response of the microphone 503 to vibration may vary with the position of the dispensing.

Fig. 6-a is a graph showing the amplitude-frequency response of a microphone at different connection locations with a housing, according to some embodiments of the application. Wherein the horizontal axis represents vibration frequency, and the vertical axis represents amplitude-frequency response of the microphone to vibration of different frequencies. The vibrations are generated by a vibration speaker within the headset and transferred to the microphone via a housing, connection structure, etc. As shown in the figure, when the distance H1 from the dispensing position to the bottom of the microphone is 0.1mm, the peak value of the microphone amplitude frequency response is highest, when H1 is 0.3mm, the peak value of the microphone amplitude frequency response is lower than that when H1 is 0.1mm and moves towards the high frequency, when H1 is 0.5mm, the peak value of the microphone amplitude frequency response is further reduced and moves towards the high frequency, when H1 is 0.7mm, the peak value of the microphone amplitude frequency response is further reduced and moves towards the high frequency, and at the moment, the peak value is almost reduced to 0. It can be seen that the amplitude-frequency response of the microphone to vibration varies with the position of dispensing. In practical application, the positions of the dispensing can be flexibly selected according to practical requirements, so that the amplitude frequency of the microphone meeting the conditions corresponds to the vibration.

Fig. 6-B is a plot of the phase-frequency response of a microphone at different connection locations of the microphone to the housing, according to some embodiments of the application. Wherein the horizontal axis represents vibration frequency, and the vertical axis represents phase frequency response of the microphone to vibration of different frequencies. As can be seen from fig. 6-B, as the distance from the dispensing position to the bottom of the microphone increases, the vibration phase of the microphone diaphragm will also change accordingly, and the position of the abrupt phase change will move to high frequency. Thus, the phase frequency response of the microphone to vibration can be changed along with the change of the dispensing position. In practical application, the position of dispensing can be flexibly selected according to practical requirements so as to obtain the phase frequency correspondence of the microphone meeting the conditions to vibration.

It will be apparent to those skilled in the art that the microphone may be attached to the housing in other ways or locations than the way the microphone is attached to the side wall of the housing as described above, for example, the bottom of the microphone may be attached to the bottom of the inside of the housing (also referred to as "base attachment").

In addition, the microphone and the housing can be connected by a peripheral edge. For example, fig. 7 is a schematic diagram of a microphone and housing connection in the form of a peripheral edge according to some embodiments of the application. As shown in fig. 7, at least two side walls of the microphone 703 are respectively connected with the housing 701 by a connection structure 702, and form a connection manner in the form of a surrounding edge. The connection structure 702 is similar to the connection structure 502 and will not be described in detail herein. As shown, contact points 704 and 705 of the central axis of the connection structure 702 and the housing are dispensing positions that are a distance H2 from the bottom of the microphone 703. The amplitude frequency response and/or the phase frequency response of the microphone 703 to vibrations may vary with the H2 variation of the dispensing position.

Fig. 8-a is an amplitude-frequency response plot showing various connection locations of a microphone to a housing in the form of a perimeter, according to some embodiments of the application. Wherein the horizontal axis represents vibration frequency, and the vertical axis represents amplitude-frequency response of the microphone to vibration of different frequencies. As can be seen from fig. 8-a, the peak value of the amplitude-frequency response of the microphone becomes larger gradually as the distance from the dispensing position to the bottom of the microphone increases. It can be seen that in the case where the microphone is connected to the housing in the form of a peripheral edge, the amplitude-frequency response of the microphone to vibration varies with the position of dispensing. In practical application, the positions of the dispensing can be flexibly selected according to practical requirements, so that the amplitude frequency of the microphone meeting the conditions corresponds to the vibration.

Fig. 8-B is a plot of the phase-frequency response for different connection locations of a microphone to a housing in the form of a perimeter according to some embodiments of the application. Wherein the horizontal axis represents vibration frequency, and the vertical axis represents phase frequency response of the microphone to vibration of different frequencies. As can be seen from fig. 8-B, as the distance from the dispensing position to the bottom of the microphone increases, the vibration phase of the diaphragm of the microphone also changes, and the position of the abrupt phase change moves to high frequency. It can be seen that, in the case where the microphone is connected to the housing in the form of a peripheral edge, the phase-frequency response of the microphone to vibration varies with the position of dispensing. In practical application, the position of dispensing can be flexibly selected according to practical requirements so as to obtain the phase frequency correspondence of the microphone meeting the conditions to vibration.

In some embodiments, in order to keep the amplitude/phase frequency response of the vibration sensor and microphone to vibrations as uniform as possible, the vibration sensor and microphone may be connected within the housing in the same manner (e.g., one of a cantilever connection, a base connection, a rim-type connection) with the respective dispensing locations of the vibration sensor and microphone remaining the same or as close as possible.

As previously described, the amplitude-frequency response and/or the phase-frequency response of the vibration sensor and/or the microphone to vibrations is related to the type of microphone and/or the vibration sensor. By selecting the proper type of the microphone and/or the vibration sensor, the amplitude-frequency response and/or the phase-frequency response of the microphone and the vibration sensor to vibration can be kept substantially consistent, so that the effect of eliminating vibration noise generated by the microphone by using the vibration signal acquired by the vibration sensor can be achieved.

Fig. 9-a is a schematic diagram illustrating an air conduction microphone 910 according to some embodiments of the application. In some embodiments, air conduction microphone 910 may be a MEMS (Micro-electromechanical System) microphone. The MEMS microphone has the characteristics of small size, low power consumption, high stability, good consistency amplitude frequency and phase frequency response and the like. As shown in fig. 9-a, the air conduction microphone 910 includes an opening 911, a housing 912, an integrated circuit (ASIC) 913, a Printed Circuit Board (PCB) 914, a front cavity 915, a diaphragm 916, and a back cavity 917. The opening 911 is located on one side (upper side, i.e., top, in fig. 9-a) of the housing 912. The integrated circuit 913 is mounted on the PCB 914. The front cavity 915 and the rear cavity 917 are isolated by a diaphragm 916. As shown, the front cavity 915 includes a space above the diaphragm 916, formed by the diaphragm 916 and the housing 912. Rear cavity 917 includes a space below diaphragm 916, formed by diaphragm 916 and PCB 914. In some embodiments, when the air conduction microphone 910 is placed within the earpiece, air conduction sounds in the environment (e.g., the user's voice) may enter the front cavity 915 through the aperture 911 and cause the diaphragm 916 to vibrate. Meanwhile, the vibration signal generated by the vibration speaker may cause the vibration of the housing 912 of the air conduction microphone 910 via the housing of the earphone, the connection structure, etc., thereby driving the vibration of the diaphragm 916, thereby generating a vibration noise signal.

In some embodiments, air conduction microphone 910 may be replaced with a rear cavity 917 open while front cavity 915 is isolated from outside air.

Fig. 9-B is a schematic diagram of a vibration sensor 920 according to some embodiments of the application. As shown, vibration sensor 920 includes a housing 922, an integrated circuit (ASIC) 923, a Printed Circuit Board (PCB) 924, a front cavity 925, a diaphragm 926, and a rear cavity 927. In some embodiments, the vibration sensor 920 may be obtained by closing the opening 911 of the air conduction microphone in fig. 9-a (in the present application, the vibration sensor 920 may also be referred to as a closed microphone 920). In some embodiments, when the enclosed microphone 920 is placed within an earphone, air-guided sounds in the environment (e.g., the user's voice) cannot enter the interior of the enclosed microphone 920 causing the diaphragm 926 to vibrate. The vibration generated by the vibration speaker causes the housing 922 of the enclosed microphone 920 to vibrate via the housing of the earphone, the connection structure, etc., and further drives the vibration of the diaphragm 926 to generate a vibration signal.

Fig. 9-C is a schematic diagram of another vibration sensor 930 according to some embodiments of the application. As shown, vibration sensor 930 includes an aperture 931, a housing 932, an integrated circuit (ASIC) 933, a Printed Circuit Board (PCB) 934, a front cavity 935, a diaphragm 936, a rear cavity 937, and an aperture 938. In some embodiments, the vibration sensor 930 may be obtained by punching a bottom of the rear cavity 937 of the air conduction microphone in fig. 9-a so that the rear cavity 937 communicates with the outside (in the present application, the vibration sensor 930 may also be referred to as a dual communication microphone 930). In some embodiments, when the dual-communication microphone 930 is placed within the headset, the air-guided sound in the environment (e.g., the user's voice) enters the dual-communication microphone 930 through apertures 931 and 938, respectively, such that the air-guided sound signals received on both sides of diaphragm 936 cancel each other out. The air-guide sound signal cannot cause significant vibration of the diaphragm 936. The vibration generated by the vibration speaker causes the vibration of the housing 932 of the dual-communication microphone 930 via the housing, the connection structure, etc. of the earphone, and thus drives the vibration of the diaphragm 936 to generate a vibration signal.

The above description of the air conduction microphone and vibration sensor is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that numerous modifications and variations of the specific structure of the microphone and/or vibration sensor are possible without departing from the principles of the microphone, but are still within the scope of the foregoing description. For example, it will be apparent to those skilled in the art that the openings 911 or 931 in the air conduction microphone 910 or the vibration sensor 930 may be disposed on the left or right side of the housing 912 or the housing 932, so long as the microphone openings are capable of communicating the front cavity 915 or 935 with the outside. Further, the number of the openings is not limited to one, and the air conduction microphone 910 or the vibration sensor 930 may include a plurality of openings like the openings 911 or 931.

In some embodiments, the vibration signal generated by the diaphragm 926 or 936 of the closed microphone 920 or the duplex microphone 930 may be used to cancel the vibration noise signal generated by the diaphragm 916 of the air conduction microphone 910. In some embodiments, in order to obtain better effect of removing vibration noise, the amplitude-frequency response or the phase-frequency response of the enclosed microphone 920 or the duplex microphone 930 and the air conduction microphone 910 to the mechanical vibration of the earphone shell are made to be the same as possible.

For illustrative purposes only, the air conduction microphone and vibration speaker mentioned in FIGS. 9-A, 9-B and 9-C are described below as examples. The amplitude-frequency response and/or the phase-frequency response of the air-conduction microphone and the vibration sensor to vibration can be consistent or substantially consistent by changing the front cavity volume, the back cavity volume, and/or the cavity volume of the air-conduction microphone or the vibration sensor (e.g., the closed microphone 920 or the duplex microphone 930), thereby achieving the effect of removing vibration noise. The cavity volume is the sum of the front cavity volume and the back cavity volume of the microphone or the closed microphone. In some embodiments, the cavity volume of the vibration sensor may be considered an "equivalent volume" of the cavity volume of the air conduction microphone 910 when the amplitude-frequency response and/or the phase-frequency response of the vibration sensor and the air conduction microphone to the vibrations of the earphone housing are consistent. In some embodiments, a closed microphone is selected in which the cavity volume is the equivalent volume of the cavity volume of the air conduction microphone, which helps to eliminate the vibration noise signal of the air conduction microphone.

FIG. 10-A is a graph of amplitude versus frequency response of vibration signals for vibration sensors of different cavity volumes, according to some embodiments of the present application. In some embodiments, the amplitude-frequency response curves of the vibration sensors for the different cavity volumes to vibrations may be obtained by finite element calculation methods or actual measurements. As an example, the vibration sensor is a closed microphone and the bottom of the vibration sensor is mounted inside the earphone housing. As shown in fig. 10-a, the horizontal axis is the vibration frequency and the vertical axis is the amplitude-frequency response of the closed microphone to vibrations of different frequencies. The vibration is generated by a vibration speaker in the earphone and is transmitted to a vibration signal of the air conduction microphone or the vibration sensor through the housing and the connection structure. Wherein the solid line is the amplitude-frequency response curve of the air conduction microphone to vibration. The dashed lines are amplitude-frequency response curves of the closed microphone to vibration when the volume ratio of the closed microphone to the air conduction microphone cavity is 1:1, 3:1, 6.5:1 and 9.3:1 respectively. When the cavity volume ratio is 1:1, the amplitude frequency response curve of the closed microphone is lower than the amplitude frequency response curve of the air guide microphone as a whole, when the cavity volume ratio is 3:1, the amplitude frequency response curve of the closed microphone is raised but is slightly lower than the amplitude frequency response curve of the air guide microphone as a whole, when the cavity volume ratio is 6.5:1, the amplitude frequency response curve of the closed microphone is slightly higher than the amplitude frequency response curve of the air guide microphone as a whole, and when the cavity volume ratio is 9.3:1, the amplitude frequency response curve of the closed microphone is higher than the amplitude frequency response curve of the air guide microphone as a whole. It can be seen that the amplitude-frequency response curves of the closed microphone and the air conduction microphone are substantially identical when the cavity volume ratio is between 3:1 and 6.5:1. Thus, the equivalent volume of the cavity volume of the air conduction microphone (i.e., the cavity volume of the closed microphone) can be considered to be between 3:1 and 6.5:1. In some embodiments, when a vibration sensor (e.g., the closed microphone 920) and an air conduction microphone (e.g., the air conduction microphone 910) receive vibration signals from the same vibration source, and the ratio of the cavity volume of the vibration sensor to the cavity volume of the air conduction microphone is between 3:1 and 6.5:1, the vibration sensor can help cancel the vibration signals received by the air conduction microphone.

Similarly, fig. 10-B is a schematic diagram illustrating the phase-frequency response of a closed microphone to vibration for different cavity volumes, according to some embodiments of the application. As shown in fig. 10-B, the horizontal axis is the vibration frequency and the vertical axis is the phase-frequency response of the closed microphone to vibrations of different frequencies. 10-B, wherein the solid line is a phase frequency response curve of the air conduction microphone to vibration, and the dotted line is a phase frequency response curve of the closed microphone to vibration when the volume ratio of the closed microphone to the air conduction microphone cavity is 1:1, 3:1, 6.5:1 and 9.3:1, respectively. In some embodiments, when a closed microphone (e.g., closed microphone 920) and an air conduction microphone (e.g., air conduction microphone 910) receive vibration signals from the same vibration source and the ratio of the cavity volume of the closed microphone to the cavity volume of the air conduction microphone is greater than 3:1, the closed microphone can help cancel the vibration signals received by the air conduction microphone.

The above description of the equivalent volume of the air conduction microphone cavity volume is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that, upon understanding the basic principles of the air conduction microphone, various modifications and changes to the specific structure of the microphone and/or vibration sensor may be made without departing from such principles, but such modifications and changes remain within the scope of the description above. For example, the equivalent volume of the cavity volume of the air guide microphone can be changed through the structural modification of the air guide microphone or/and the vibration sensor, and the purpose of eliminating vibration noise can be achieved only by selecting a closed microphone with a proper cavity volume.

As described above, when the air-conduction microphone has different structures, the equivalent volume of the cavity volume will also be different. In some embodiments, factors affecting the equivalent volume of the air conduction microphone cavity include the front cavity volume, rear cavity volume, aperture location, and/or acoustic source propagation path of the air conduction microphone, among others. Alternatively, in some embodiments, the equivalent volume of the air conduction microphone front cavity volume may be used to characterize the front cavity volume of the vibration sensor. The equivalent volume of the front cavity volume of the microphone can be described as the "equivalent volume" of the front cavity volume of the air guide microphone when the back cavity volumes of the vibration sensor and the air guide microphone are the same, and the amplitude-frequency response and/or the phase-frequency response of the vibration sensor and the air guide microphone to the vibration of the earphone shell are identical. In some embodiments, the back cavity volume is selected to be equal to the back cavity volume of the air conduction microphone, and the front cavity volume is a closed microphone of the equivalent volume of the front cavity volume of the air conduction microphone, which is helpful for eliminating vibration noise signals of the air conduction microphone.

When the air-conduction microphone has different structures, the equivalent volume of the front cavity volume will also be different. In some embodiments, factors affecting the equivalent volume of the front cavity volume of the air conduction microphone include the front cavity volume, the back cavity volume, the location of the aperture, and/or the path of sound source propagation, among others, of the air conduction microphone.

Fig. 11-a is a graph illustrating the amplitude-frequency response of an air conduction microphone to vibration as the volume of the front cavity changes, in accordance with some embodiments of the present application. In some embodiments, the amplitude-frequency response curves of the air conduction microphones of different front cavity volumes to vibration can be obtained by a finite element calculation method or actual measurement. As shown in fig. 11-a, the horizontal axis represents the vibration frequency, and the vertical axis represents the amplitude-frequency response of the air conduction microphone to vibrations of different frequencies. V ₀ is the front cavity volume of the air conduction microphone. Wherein, the solid line is the amplitude-frequency response curve of the air conduction microphone when the front cavity volume is V ₀, and the dotted line is the amplitude-frequency response curve of the air conduction microphone when the front cavity volume is 2V ₀、3V₀、4V₀、5V₀、6V₀. As can be seen from the figure, as the volume of the front cavity of the air guide microphone increases, the vibration amplitude of the vibrating diaphragm of the air guide microphone becomes larger, and the vibrating diaphragm is more prone to vibrating.

For air conduction microphones having different front cavity volumes, the equivalent volume of each air conduction microphone front cavity volume can be determined according to the corresponding amplitude-frequency response curve. In some embodiments, the equivalent volume of the antechamber volume may be determined in a manner similar to that of FIG. 10-A. For example, for an air conduction microphone having a front cavity volume of 2V ₀, the equivalent volume of the front cavity volume is determined to be 6.7V ₀ by the method of fig. 10-a according to the corresponding amplitude-frequency response curve in fig. 11-a. That is, when the back cavity volume of the vibration sensor is equal to the back cavity volume of the air conduction microphone, and the front cavity volume of the vibration sensor and the front cavity volume of the air conduction microphone are 6.7V ₀ and 2V ₀, respectively, the amplitude-frequency response of the vibration sensor to the vibration is the same as the amplitude-frequency response of the air conduction microphone to the vibration. As shown in table 1, as the front cavity volume increases, the equivalent volume of the air conduction microphone front cavity volume also increases.

Anterior chamber volume	1V₀	2V₀	3V₀	4V₀	5V₀
						Equivalent volume	4V₀	6.7V₀	8V₀	9.3V₀	12V₀

TABLE 1 equivalent volume at different antechamber volumes

Similarly, fig. 11-B is a schematic diagram illustrating the amplitude-frequency response of an air conduction microphone to vibration as the volume of the rear cavity changes, in accordance with some embodiments of the present application. In some embodiments, the amplitude-frequency response curves of the air conduction microphones of different back cavity volumes to vibration can be obtained through a finite element calculation method or actual measurement. As shown in fig. 11-B, the horizontal axis represents the vibration frequency, and the vertical axis represents the amplitude-frequency response of the air conduction microphone to vibrations of different frequencies. V ₁ is the back volume of the air conduction microphone. The solid line is the amplitude-frequency response curve of the air conduction microphone when the volume of the rear cavity is 0.5V ₁, and the dotted lines are the amplitude-frequency response curves of the air conduction microphone when the volume of the rear cavity is 1V ₁、1.5V₁、2V₁、2.5V₁、3V₁. As can be seen from the figure, as the volume of the rear cavity of the air guide microphone increases, the vibration amplitude of the vibrating diaphragm of the air guide microphone becomes larger, and the vibrating diaphragm is more prone to vibrating. For air conduction microphones with different back cavity volumes, the equivalent volume of the front cavity volume of each air conduction microphone can be determined according to the corresponding amplitude-frequency response curve. In some embodiments, the equivalent volume of the antechamber volume may be determined in a manner similar to that of FIG. 10-A. For example, according to the solid line shown in fig. 11-B, for an air conduction microphone having a back volume of 0.5V ₁, the equivalent volume of its front volume is determined to be 3.5V ₀ using the method of fig. 10-a. That is, when the back cavity volumes of the air conduction microphone and the vibration sensor are both 0.5V ₁, and the front cavity volumes of the vibration sensor and the air conduction microphone are 3.5V ₀ and 1V ₀, respectively, the amplitude-frequency response of the vibration sensor to vibration is the same as the amplitude-frequency response of the air conduction microphone to vibration. for another example, when the back cavity volumes of the air conduction microphone and the vibration sensor are both 3.0V ₁, and the front cavity volumes of the vibration sensor and the air conduction microphone are respectively 7V ₀ and 1V ₀, the amplitude-frequency response of the vibration sensor to vibration is the same as the amplitude-frequency response of the air conduction microphone to vibration. When the front cavity volume of the air conduction microphone remains unchanged at 1V ₀ and the back cavity volume increases from 0.5V ₁ to 3.0V ₁, the equivalent volume of the front cavity volume of the air conduction microphone increases from 3.5V ₀ to 7V ₀.

In some embodiments, the location of the opening in the air conduction microphone housing also affects the equivalent volume of the air conduction microphone front cavity volume. FIG. 12 is a graph showing amplitude versus frequency response of a diaphragm for different aperture locations according to some embodiments of the present application. In some embodiments, the amplitude-frequency response curve of the air conduction microphone to vibration when the air conduction microphone has different opening positions can be obtained through a finite element calculation method or actual measurement. As shown, the horizontal axis is the vibration frequency, and the vertical axis is the amplitude-frequency response of the air conduction microphone at different opening positions to the vibration. As shown in fig. 12, the solid line is the amplitude-frequency response curve of the air conduction microphone with the opening at the top of the housing to the vibration, and the dotted line is the amplitude-frequency response curve of the air conduction microphone with the opening at the side wall of the housing to the vibration. It can be seen that the amplitude frequency response of the air conduction microphone when the aperture is at the top is overall higher than the amplitude frequency response of the air conduction microphone when the aperture is at the side wall. In some embodiments, for the air conduction microphones with different opening positions, the equivalent volumes of the corresponding front cavity volumes can be respectively determined according to the corresponding amplitude-frequency response curves. The equivalent volume determination method of the antechamber volume may be the method of fig. 10-a.

In some embodiments, the equivalent volume of the air conduction microphone front cavity volume with the opening at the top of the housing is greater than the equivalent volume of the air conduction microphone front cavity volume with the opening at the side wall. For example, the front cavity volume of a top-vented air conduction microphone is 1V ₀, the equivalent volume of the front cavity volume is 4V ₀, and the equivalent volume of the front cavity volume of a side-wall-vented air conduction microphone of the same size is about 1.5V ₀. The same size means that the front cavity volume and the back cavity volume of the air guide microphone with the side wall open hole are respectively equal to the front cavity volume and the back cavity volume of the air guide microphone with the top open hole.

In some embodiments, the path of propagation of the vibration source may be different, as may the equivalent volume of the front cavity volume of the air conduction microphone. In some embodiments, the vibration source propagation path is related to the connection of the microphone and the earphone housing, and different connection modes of the microphone and the earphone housing generate different amplitude-frequency responses. For example, when the microphone is attached within the housing in the form of a rim, the amplitude-frequency response to vibrations is different from when the side wall attachment is used.

Unlike the bottom connection to the housing of fig. 10, fig. 13 is a graph of the amplitude versus frequency response of the air conduction microphone and the fully enclosed microphone to vibration as the front cavity volume changes in a rim connection as shown in some embodiments of the present application. It should be noted that, when discussing the front cavity volume or the equivalent volume of the cavity volume of the air conduction microphone, the connection manner of the air conduction microphone and the vibration sensor having the corresponding equivalent volume (the equivalent volume of the front cavity volume or the equivalent volume of the cavity volume) is the same. For example, in fig. 7, 8 and 13, the air guide microphone and the vibration sensor are connected by a surrounding edge. For another example, in other embodiments of the present application, the air conduction microphone and the vibration sensor may be connected by a base connection, a surrounding connection, or other connection. in some embodiments, the amplitude-frequency response curve of the air conduction microphone and the full-closed microphone when connected in the form of the surrounding edge can be obtained through a finite element calculation method or actual measurement. As shown in fig. 13, the solid line is the amplitude-frequency response curve of the air conduction microphone to vibration when the front cavity volume is V ₀ and the air conduction microphone is connected with the housing in the form of a surrounding edge. The dashed lines respectively represent amplitude-frequency response curves of the fully-closed microphones with the front cavity volumes of 1V ₀、2V₀、4V₀、6V₀ and the front cavity volumes of the surrounding edge connection to vibration. when the air conduction microphone with the front cavity volume of 1V ₀ is connected in a surrounding edge mode, the amplitude-frequency response curve is lower than that of a fully-closed microphone with the front cavity volume of 1V ₀ connected in the surrounding edge mode. When the fully-closed microphone with the front cavity volume of 2V ₀ is connected in a surrounding edge mode, the amplitude-frequency response curve is wholly lower than that of the air-conduction microphone with the front cavity volume of 1V ₀ connected in the surrounding edge mode. When the fully-closed microphones with the front cavity volumes of 4V ₀ and 6V ₀ are connected in a surrounding edge mode, the amplitude-frequency response curve is continuously reduced and is lower than that of the air-conduction microphone with the front cavity volume of 1V ₀ connected in the surrounding edge mode. As can be seen from the figure, when the front cavity volume of the closed microphone is between 1V ₀-2V₀, the amplitude-frequency response curve of the closed microphone connected by the surrounding edge is closest to the amplitude-frequency response curve of the air conduction microphone connected with the side wall. It can be obtained that if the air guide microphone and the closed microphone are connected in a surrounding edge mode, the equivalent volume of the front cavity of the air guide microphone is between 1V ₀-2V₀.

Fig. 14 is a graph showing the amplitude-frequency response of an air conduction microphone and two duplex communication microphones to an air conduction sound signal, according to some embodiments of the application. Specifically, the solid line corresponds to the amplitude-frequency response curve of the air conduction microphone, and the dotted line corresponds to the amplitude-frequency response curve of the duplex microphone with the opening at the top of the housing and the duplex microphone with the opening at the side wall. As shown by the dashed line in the figure, the duplex microphone is not responsive to the air-guide sound signal when the frequency of the air-guide sound signal is less than 5 kHz. When the frequency of the air conduction sound signal exceeds 10kHz, the wavelength of the air conduction sound signal gradually approaches to the characteristic length of the double-communication microphone, and meanwhile, the frequency of the air conduction sound signal approaches to or reaches the characteristic frequency of the vibrating diaphragm structure, so that the vibrating diaphragm resonates and can have larger amplitude, and the double-communication microphone responds to the air conduction sound signal. The characteristic length of the duplex microphone may be the dimension of the duplex microphone in one dimension. For example, when the duplex microphone is a rectangular or near rectangular parallelepiped, the characteristic length may be the length, width, or height of the duplex microphone. For another example, when the dual communication microphone is a cylinder or approximately a cylinder, the characteristic length may be a diameter or a height of the dual communication microphone. In some embodiments, the wavelength of the air conduction sound signal is close to the characteristic length of the dual-communication microphone, and it is understood that the wavelength of the air conduction sound signal is on the same order of magnitude (e.g., both are in the order of mm) as the characteristic length of the dual-communication microphone. In some embodiments, the frequency band of the voice communication is in the range of 500Hz-3400Hz, the duplex microphone is insensitive to the air conduction sound in the range, and can be used for measuring the vibration noise signal, and compared with the closed microphone, the duplex microphone has better isolation effect on the air conduction sound signal in the low frequency band, so that the duplex microphone with the opening at the top of the shell or the opening at the side wall can be used as a vibration sensor to help eliminate the vibration noise signal in the air conduction microphone.

FIG. 15 is a graph of amplitude versus frequency response of a vibration sensor versus vibration, according to some embodiments of the application. The vibration sensor includes a closed microphone and a duplex microphone. Specifically, fig. 15 is a graph of amplitude versus frequency response of two closed microphones and two duplex microphones to vibration. Wherein, the thick solid line represents the amplitude-frequency response curve of the duplex microphone with the front cavity volume of the top opening being 1V ₀ to vibration, and the thin solid line represents the amplitude-frequency response curve of the duplex microphone with the front cavity volume of the side wall opening being 1V ₀ to vibration. The two dashed lines represent the amplitude-frequency response curves of the closed microphones with front cavity volumes of 9V ₀ and 3V ₀, respectively, to vibration. As can be seen from the figure, the front cavity volume of the side wall opening is approximately "equivalent" to the front cavity volume of the duplex microphone of 1V ₀ and the front cavity volume of the closed microphone of 9V ₀, and the front cavity volume of the top opening is approximately "equivalent" to the front cavity volume of the duplex microphone of 1V ₀ and the front cavity volume of the closed microphone of 3V ₀. Thus, a smaller-sized dual communication microphone may be used instead of a larger-sized fully enclosed microphone. In some embodiments, a dual communication microphone and a closed microphone that are "equivalent" or approximately "equivalent" to each other may be used instead.

Example 1

As shown in fig. 16, headset 1600 includes an air conduction microphone 1601, a bone conduction microphone 1602, and a housing 1603. Wherein the sound inlet 1604 of the air guiding microphone 1601 is in communication with air outside the earphone 1600, and the side of the air guiding microphone 1601 is connected to the side in the housing 1603. Bone conduction microphone 1602 is bonded to one side within housing 1603. The air conduction microphone 1601 may acquire an air conduction voice signal through the sound inlet 1604 and a first vibration signal (i.e., a vibration noise signal) through a connection structure of the side and the housing 1603. Bone conduction microphone 1602 may acquire a second vibration signal (i.e., a mechanical vibration signal transmitted by housing 1603). The first vibration signal and the second vibration signal are both generated by the vibrations of the housing 1603. In particular, since the bone conduction microphone 1602 and the air conduction microphone 1601 are greatly different in configuration, the two microphones have different amplitude frequency responses and phase frequency responses, and the signal processing method shown in fig. 2-a can be used for eliminating the vibration noise signal.

Example 2

As shown in fig. 17, the dual microphone assembly 1700 includes an air conduction microphone 1701, a closed microphone 1702, and a housing 1703. The air-guide microphone 1701 and the closing microphone 1702 are an integral component, and the outer walls of the two microphones are respectively bonded to the inner side of the housing 1703. The sound inlet 1704 of the air conduction microphone 1701 communicates with the air outside the dual microphone assembly 1700, and the sound inlet 1702 of the closed microphone 1702 is located at the bottom of the air conduction microphone 1701 while remaining isolated from the outside air (equivalent to the closed microphone in fig. 9-B). In particular, the closed microphone 1702 may use the same air conduction microphone as the air conduction microphone 1701, and a closed form in which the closed microphone 1702 is not in communication with the outside air may be realized by a structural design. This unitary structure allows the air conduction microphone 1701 and the closed microphone 1702 to have the same vibration propagation path with respect to the vibration source (e.g., the vibration speaker 101 in fig. 1), so that the air conduction microphone 1701 and the closed microphone 1702 receive the same vibration signal. The air conduction microphone 1701 may acquire an air conduction voice signal through the sound inlet 1704 and a first vibration signal (i.e., vibration noise signal) through the housing 1703. The closed microphone 1702 only captures the second vibration signal (i.e., the mechanical vibration signal transmitted by the housing 1703). The first vibration signal and the second vibration signal are both generated by the vibrations of the housing 1603. In particular, the front cavity volume, the back cavity volume, and/or the cavity volume of the closed microphone 1702 may be correspondingly set to an equivalent volume of the corresponding volume (front cavity volume, back cavity volume, and/or cavity volume) of the air conduction microphone 1701 such that the air conduction microphone 1701 and the closed microphone 1702 have the same or approximately the same frequency response. The dual microphone assembly 1700 has the advantage of small volume and can be independently debugged, and the production process is simple. In some embodiments, the microphone assembly 1700 may eliminate vibration noise in all communication bands received by the air conduction microphone 1701.

Fig. 18 is a headset structure including the dual microphone assembly of fig. 17. As shown in fig. 18, the headset 1800 includes a dual microphone assembly 1700, a housing 1801, and a connection structure 1802. The housing 1703 of the assembly of the dual microphone assembly 1700 is connected to the earphone housing 1801 by a peripheral form. This connection may allow the two microphones in the dual microphone assembly 1700 to remain symmetrical with respect to the connection location on the housing 1801, thereby further ensuring that the vibration propagation paths from the vibration source to the two microphones are communicated. In some embodiments, the earphone structure in fig. 18 can well eliminate the influence on the effect of removing the vibration noise due to the propagation path of the vibration noise, the difference in the types of the two microphones, or the like.

Example 3

Fig. 19 is a schematic diagram of a dual microphone headset configuration. As shown in fig. 19, the headset 1900 includes a vibration speaker 1901, a housing 1902, a resilient member 1903, an air conduction microphone 1904, a bone conduction microphone 1905, and an aperture 1906. Wherein the vibration speaker 1901 is fixed to the housing 1902 by an elastic member 1903. Air conduction microphone 1904 and bone conduction microphone 1905 are each connected at different locations inside housing 1902. Air conduction microphone 1904 communicates with the ambient air through opening 1906 to receive air conduction sound signals. When the vibration speaker 1901 vibrates to sound, the housing 1902 is driven to vibrate, and the housing 1902 transmits the vibration to the air conduction microphone 1904 and the bone conduction microphone 1905. In some embodiments, the vibration noise signal received by air conduction microphone 1904 may be canceled using the vibration signal acquired by bone conduction microphone 1905 using a signal processing method as in fig. 2-B. In some embodiments, bone conduction microphone 1905 may be used to cancel vibration noise in all communications bands received by air conduction microphone 1904.

Example 4

Fig. 20 is a schematic diagram of a dual microphone earphone structure for eliminating vibration noise. As shown in fig. 20, the earphone 2000 includes a vibration speaker 2001, a housing 2002, an elastic member 2003, an air conduction microphone 2004, a vibration sensor 2005, and an opening 2006. The vibration sensor 2005 may be a closed microphone, a duplex microphone or a bone conduction microphone according to some embodiments of the present application, or may be other sensor devices having a vibration signal acquisition function. The vibration speaker 2001 is fixed to the housing 2002 by an elastic member 2003. The air conduction microphone 2004 and the vibration sensor 2005 are two microphones that have the same amplitude-frequency response and/or phase-frequency response after being selected or tuned. The top and sides of air conduction microphone 2004 are connected to the inside of housing 2006, respectively, and the sides of vibration sensor 2005 are connected to the inside of housing 2006. The air conduction microphone 2004 communicates with the outside air through the opening 2006. When the vibration speaker 2001 vibrates to sound, the housing 2002 is driven to vibrate, and the vibration of the housing 2002 is transmitted to the air guide microphone 2004 and the vibration sensor 2005. Since the air conduction microphone 2004 and the vibration sensor 2005 are connected to the housing 2006 in close proximity (e.g., the two microphones may be located at positions 301 and 302, respectively, in fig. 3), the vibrations transmitted to the two microphones by the housing 2006 are the same. In some embodiments, the signals received by air conduction microphone 2004 and vibration sensor 2005 may employ signal processing methods as shown in fig. 2-C to cancel the vibration noise signals received by air conduction microphone 2004. In some embodiments, the vibration sensor 2005 may be used to cancel vibration noise in all communications bands received by the air conduction microphone 2004.

Example 5

Fig. 21 is a schematic diagram of a dual microphone headset. The dual microphone headset 2100 is another variation of the ear speaker 2000 of fig. 20. The earphone 2100 includes, among other things, a vibration speaker 2101, a housing 2102, an elastic element 2103, an air conduction microphone 2104, a vibration sensor 2105, and an aperture 2106. The vibration sensor 2105 may be a closed microphone, a duplex microphone, or a bone conduction microphone. The air guide microphone 2104 and the vibration sensor 2105 are connected to the inside of the housing 2102 by a peripheral edge form, respectively, and are symmetrically distributed with respect to the vibration speaker 2101 (for example, the two microphones may be located at the position 301 and the position 304 in fig. 3, respectively). The air conduction microphone 2104 and the vibration sensor 2105 may be two microphones that have the same amplitude-frequency response and/or phase-frequency response after being selected or tuned. In some embodiments, the signals received by the air conduction microphone 2104 and the vibration sensor 2105 may be processed using the signal processing method shown in fig. 2-C to cancel the vibration noise signal received by the air conduction microphone 2104. In some embodiments, the vibration sensor 2105 may be used to cancel vibration noise in all communications bands received by the air conduction microphone 2104.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements and adaptations of the application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within the present disclosure, and therefore, such modifications, improvements, and adaptations are intended to be within the spirit and scope of the exemplary embodiments of the present disclosure.

Furthermore, the order in which the elements and sequences are presented, the use of numerical letters, or other designations are used in the application is not intended to limit the sequence of the processes and methods unless specifically recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of example, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the application. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in order to simplify the description of the present disclosure and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure does not imply that the subject application requires more features than are set forth in the claims. Indeed, less than all of the features of a single embodiment disclosed above.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the application may be considered in keeping with the teachings of the application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly described and depicted herein.

Claims

1. A microphone arrangement comprising a microphone and a vibration sensor, characterized in that,

The microphone is used for receiving a first signal, and the first signal comprises a voice signal and a first vibration signal;

the vibration sensor is used for receiving a second vibration signal, and

The microphone and the vibration sensor are configured such that the first vibration signal is cancelled out by the second vibration signal;

wherein the microphone arrangement fulfils at least one of the two conditions a and b:

The cavity volume of the vibration sensor is configured such that the amplitude-frequency response of the vibration sensor to the second vibration signal is the same as the amplitude-frequency response of the microphone to the first vibration signal and/or such that the phase-frequency response of the vibration sensor to the second vibration signal is the same as the phase-frequency response of the microphone to the first vibration signal;

And b, the cavity volume of the vibration sensor is proportional to the cavity volume of the microphone, so that the second vibration signal can be counteracted with the first vibration signal.

2. The device of claim 1, wherein a ratio of a cavity volume of the vibration sensor to a cavity volume of the microphone is between 3:1 and 6.5:1.

3. The apparatus of claim 1, further comprising a signal processing unit configured to cancel the first vibration signal and the second vibration signal and output the speech signal.

4. The apparatus of claim 1, wherein the vibration sensor is a closed microphone or a duplex microphone.

5. The apparatus of claim 4, wherein the device comprises a plurality of sensors,

The microphone is a front cavity opening or a rear cavity opening, and

The vibration sensor is a closed microphone, and the closed microphone is formed by closing both a front cavity and a rear cavity.

6. The apparatus of claim 4, wherein the device comprises a plurality of sensors,

The microphone is configured as a front cavity opening or a rear cavity opening, and

The vibration sensor is a duplex microphone, and the duplex microphone is provided with holes for both a front cavity and a rear cavity.

7. The apparatus of claim 5 or 6, wherein the front cavity opening of the microphone is at least one opening in a top or side wall of the front cavity.

8. The device of claim 1, wherein the microphone and the vibration sensor are independently connected to the same housing structure.

9. The apparatus of claim 8, further comprising a vibration unit, at least a portion of the vibration unit being located within the housing, the vibration unit configured to generate the first vibration signal and the second vibration signal, wherein the microphone and the vibration sensor are located adjacent to or symmetrical to the vibration unit on the housing.

10. The device of claim 8, wherein the microphone or vibration sensor is connected to the housing in one of a cantilever connection, a perimeter connection, and a base connection.

11. The apparatus of claim 1, wherein the microphone and the vibration sensor are microelectromechanical system microphones.

12. An earphone system comprising a vibration speaker, a microphone arrangement and a housing, characterized in that,

The vibration speaker and the microphone apparatus are located within the housing,

The microphone arrangement comprises a microphone and a vibration sensor,

the vibration sensor is used for receiving a second vibration signal, the first vibration signal and the second vibration signal are generated by the vibration of the vibration loudspeaker, and

and b, the cavity volume of the vibration sensor is proportional to the volume of the microphone, so that the second vibration signal can be counteracted with the first vibration signal.

13. The earphone system of claim 12, wherein a volume ratio of a cavity of the vibration sensor to a cavity of the microphone is between 3:1 and 6.5:1.

14. The headphone system of claim 12, further comprising a signal processing unit configured to cancel the first vibration signal and the second vibration signal and output the voice signal.

15. The earphone system of claim 12, wherein the vibration sensor is a closed microphone or a duplex microphone.

16. The earphone system of claim 15, wherein the microphone is a front cavity opening or a rear cavity opening, and

17. The headset system of claim 15, wherein the earphone system is configured to receive the earphone signal,

18. The earphone system of claim 16 or 17, wherein the front cavity opening of the microphone is at least one opening present in a top or side wall of the front cavity.

19. The earphone system of claim 12, wherein the microphone and the vibration sensor are independently connected to the housing.

20. The earphone system of claim 19, wherein the microphone and the vibration sensor are located adjacent to each other on the housing or are located symmetrically with respect to the vibration speaker on the housing.

21. The earphone system of claim 19, wherein the microphone or the vibration sensor is connected to the housing in one of a cantilever connection, a rim connection and a base connection.

22. The earphone system of claim 12, wherein the microphone and the vibration sensor are microelectromechanical system microphones.