CN110415949B

CN110415949B - Connector and electronic device

Info

Publication number: CN110415949B
Application number: CN201810405228.7A
Authority: CN
Inventors: 郭伟静; 曾浴华; 史庚才; 缪桦
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2018-04-29
Filing date: 2018-04-29
Publication date: 2024-09-13
Anticipated expiration: 2038-04-29
Also published as: CN110415949A

Abstract

The application discloses a connector and an electronic device, the connector comprises an integrated transformer and a joint assembly, the integrated transformer comprises: the device comprises a substrate, a magnetic core, a transmission line layer and a conductive piece. The substrate is provided with a plurality of annular accommodating grooves so as to divide the substrate into a central part and a peripheral part, and inner and outer through holes are respectively formed in the central part and the peripheral part; the magnetic core is accommodated in the accommodating groove; the transmission line layers on two opposite sides of the substrate comprise a plurality of conductor patterns connected between the inner and outer via holes in a bridging manner; the conductive parts in the inner and outer conductive holes are sequentially connected with the conductive patterns on the two transmission line layers, so that a coil loop around the magnetic core is formed; the central part, the peripheral part, the magnetic core, the conductive piece and the transmission line layer on the substrate form a plurality of transformers and/or a plurality of filters; the connector assembly includes a housing and a plurality of first conductive connectors electrically connected to the integrated transformer. The uniformity of the transformer is improved by forming a coil loop with high uniformity of winding the magnetic core.

Description

Connector and electronic device

Technical Field

The present application relates to the field of integrated circuits, and more particularly, to a connector and an electronic device.

Background

Connectors have become an indispensable component in modern devices as a medium for signal transmission and control in modern devices. In order to save space and reduce manufacturing and assembly costs more effectively, the prior art adopts to integrate an integrated transformer inside a connector so as to improve the integration degree of the connector and reduce the volume. Manually wound coils are often used in integrated transformers.

With the development of network technology and the requirement of transmission speed upgrading, the performance requirement on an integrated transformer is higher and higher, the consistency of the existing manually wound coil is poorer, the signal is unstable, the production cost is high, and the production efficiency is low.

Disclosure of Invention

The application mainly solves the technical problems of poor performance consistency and low production efficiency of an integrated transformer in a connector by manually winding the coil in the prior art.

In order to solve the technical problems, the application adopts a technical scheme that: there is provided a connector comprising: an integrated transformer, comprising: at least one layer of substrate, wherein a plurality of annular accommodating grooves are formed in each substrate; each annular accommodating groove divides the substrate into a central part surrounded by the annular accommodating groove and a peripheral part arranged around the annular accommodating groove; each central part is provided with a plurality of inner through holes penetrating through the substrate, and each peripheral part is provided with a plurality of outer through holes penetrating through the substrate; the magnetic cores are accommodated in the corresponding annular accommodating grooves; the two opposite sides of each substrate are respectively provided with one transmission line layer; each transmission line layer comprises a plurality of conductor patterns which are arranged at intervals along the circumferential direction of the annular accommodating groove, and each conductor pattern is bridged between a corresponding one of the inner through holes and the corresponding one of the outer through holes; the plurality of conductive pieces are arranged in the inner conductive holes and the outer conductive holes and are used for sequentially connecting the conductive patterns on the two transmission line layers on each substrate, so that a coil loop capable of transmitting current around the magnetic core is formed; wherein, a plurality of said central parts, a plurality of said magnetic cores, a plurality of said conductive members, and said transmission line layers on opposite sides of said substrate form a plurality of transformers and/or a plurality of filters arranged according to a predetermined arrangement rule; the connector assembly comprises a shell and a plurality of first conductive connectors penetrating through the shell, and the first conductive connectors are electrically connected with the integrated transformer.

In order to solve the technical problems, the application adopts another technical scheme that: an electronic device is provided, and the electronic device comprises a motherboard and the connector, wherein the motherboard is provided with a conductive jack, and the connector is spliced with the conductive jack through a plurality of second conductive connectors.

The beneficial effects of the embodiment are as follows: through seting up annular storage tank on the base plate, then bury the magnetic core in annular storage tank to form a plurality of wire patterns of arranging along annular storage tank's circumference interval respectively on the transmission line layer of base plate opposite both sides face, every wire pattern all cross-over connection is between a corresponding inside via hole and an outside via hole. The plurality of conductor patterns on both sides are sequentially connected by the conductive members disposed in the inner and outer via holes, thereby forming a coil loop for transmitting current around the magnetic core. Therefore, a coil loop with higher consistency is formed on the magnetic core, the consistency of the integrated transformer is improved, and the production efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of a connector in an embodiment of the application;

FIG. 2 is an exploded view of the connector of FIG. 1;

FIG. 3 is a schematic top view of the integrated transformer of FIG. 1;

FIG. 4 is a schematic perspective view of the substrate of FIG. 3;

FIG. 5 is a schematic cross-sectional structural view of the integrated transformer of FIG. 1;

FIG. 6 is a schematic diagram of another embodiment of the integrated transformer of FIG. 1;

FIG. 7 is a schematic diagram of the integrated transformer of FIG. 1 with a bonding layer;

FIG. 8 is a schematic diagram of the integrated transformer of FIG. 1 provided with a composite layer;

fig. 9 is a schematic perspective view of an integrated transformer according to another embodiment of the present application;

FIG. 10 is a schematic exploded view of a connector according to another embodiment of the present application;

fig. 11 is a schematic perspective view of the connector of fig. 10;

fig. 12 is a schematic structural diagram of an electronic device in another embodiment.

Detailed Description

The following description of the technical solutions in the embodiments of the present application will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In one aspect, the present application provides a connector 10, as shown in fig. 1 and 2, in this embodiment, the connector 10 may generally comprise: an integrated transformer 100 and a terminal assembly 200 electrically connected to the integrated transformer 100.

Fig. 3-5 illustrate the structure of an integrated transformer 100 in an embodiment of the application. With continued reference to fig. 3-5, the integrated transformer 100 includes at least one substrate 110, a plurality of magnetic cores 120, a transmission line layer 130, and a plurality of conductive members 140. As shown in fig. 3, in the present embodiment, the integrated transformer 100 may include a substrate 110, and referring to fig. 4, a plurality of annular accommodating grooves 112 are formed on the substrate 110, and each annular accommodating groove 112 divides the substrate 110 into a central portion 114 surrounded by the annular accommodating groove 112 and a peripheral portion 116 corresponding to the central portion 114.

Each central portion 114 is provided with a plurality of inner through holes 115 penetrating through the substrate 110, and the plurality of inner through holes 115 are disposed adjacent to an outer sidewall of the central portion 114 and are arranged along a circumferential direction of the central portion 114. Correspondingly, a plurality of external through holes 117 penetrating through the substrate 110 are formed on each peripheral portion 116, and the plurality of external through holes 117 are disposed adjacent to the inner side walls of the peripheral portion 116. Namely: the inner through hole 115 is provided around the top inner peripheral wall of the annular receiving groove 112 at the top surface of the central portion 114, and the outer through hole 117 is provided around the top outer peripheral wall of the annular receiving groove 112 at the top surface of the peripheral portion 116.

Each of the magnetic cores 120 is correspondingly accommodated in one of the annular accommodating grooves 112 on the base plate 110, and the cross-sectional shape of the magnetic core 120 is substantially the same as that of the annular accommodating groove 112, so that the magnetic core 120 can be accommodated in the annular accommodating groove 112. The cross-sectional shape of the magnetic core 120 may be circular, square, elliptical, etc. Correspondingly, the shape of the annular accommodating groove 112 may be a circular ring, a square ring, an ellipse, etc.

In this embodiment, the toroidal core 120 may be formed by stacking a plurality of toroidal sheets in sequence, may be formed by winding a narrow length of metal material, or may be formed by sintering a plurality of metal mixtures. The toroidal core 120 may be formed in various ways, and the present application is not limited thereto, depending on the material thereof.

The magnetic core 120 may be an iron core or may be composed of various magnetic metal oxides, such as manganese-zinc ferrite, nickel-zinc ferrite, and the like. Among them, the Mn-Zn ferrite has high magnetic permeability, high magnetic flux density and low loss, and the Ni-Zn ferrite has very high impedance and low magnetic permeability. The magnetic core 120 in this embodiment is made of manganese-zinc ferrite and is sintered at high temperature.

As shown in fig. 3 and 5, in the present embodiment, a transmission line layer 130 is disposed on two opposite sides of the substrate 110, each transmission line layer 130 includes a plurality of conductive patterns 136 arranged at intervals along the circumferential direction of the annular accommodating groove 112, and each conductive pattern 136 on each transmission line layer 130 is bridged between a corresponding one of the inner via holes 115 and one of the outer via holes 117.

Further, one conductive member 140 is disposed in each of the inner via holes 115 and each of the outer via holes 117, and both ends of the conductive member 140 are connected to the conductive line patterns 136 on each of the transmission line layers 130, respectively. The conductive member 140 sequentially connects the conductive patterns 136 on the two transmission line layers 130, whereby a coil loop for transmitting current around the magnetic core 120 can be formed.

The conductive member 140 may be a metal pillar or a conductive metal layer. When the conductive member 140 is a metal post disposed within the inner via 115 and the outer via 117, the diameter of the metal post is less than or equal to the diameter of the inner via 115 or the outer via 117 in which it is disposed. When the conductive member 140 is a conductive metal layer, the conductive metal layer may be formed on the inner walls of the inner and outer via holes 115 and 117 by plating, coating, or the like, for example. The material for forming the conductive member 140 may include, but is not limited to, copper, aluminum, iron, nickel, gold, silver, platinum group, chromium, magnesium, tungsten, molybdenum, lead, tin, indium, zinc, or alloys thereof, etc.

With continued reference to fig. 3-5, a central portion 114, a corresponding peripheral portion 116, a core 120, and a plurality of conductive members 140 on the substrate 110, and a conductive pattern 136 on two transmission line layers 130 corresponding to each core 120 may form a transformer or filter. The transformer and the filter are different in winding modes of coil loops wound around the magnetic core 120, the transformer includes an input line and a coupled line, and the filter includes an input line and an output line.

The annular receiving groove 112 on one substrate 110 may be used to form a transformer entirely, may be used to form a filter entirely, may be used to form a transformer partially, and may be used to form a filter partially, without limitation. Therefore, the plurality of central portions 114, the plurality of corresponding peripheral portions 116, the plurality of magnetic cores 120, the plurality of conductive members 140, and the plurality of transmission line layers 130 disposed on opposite sides of the substrate 110 may form a plurality of transformers and/or a plurality of filters arranged according to a predetermined arrangement rule.

In one embodiment, one integrated transformer 100 may include only one layer of substrate 110, and a plurality of transformers and a plurality of filters are simultaneously formed on the substrate 110. I.e. a plurality of transformers and a plurality of filters share the same substrate 110. At this time, the transformer and the filter in the integrated transformer 100 are located at the same layer.

In another embodiment, one integrated transformer 100 may also include multiple layers of substrates 110, and multiple transformers and multiple filters are simultaneously formed on each layer of substrate 110.

In yet another embodiment, an integrated transformer 100 may further include at least one first substrate and at least one second substrate. The annular accommodating grooves 112 on the first substrate are all used for forming the transformer, and the annular accommodating grooves 112 on the second substrate are all used for forming the filter. At this time, the transformers and filters in the integrated transformer 100 are respectively located at different layers, and an electromagnetic assembly may be formed between at least one transformer and at least one filter between adjacent layers. For example, at least one transformer on the first substrate and at least one filter on the second substrate may form an electromagnetic assembly, all transformers and filters in each electromagnetic assembly are electrically connected, and the electromagnetic assemblies of each group are not electrically connected.

As shown in fig. 6, in the present embodiment, the integrated transformer 100 includes a single substrate 110, and a plurality of transformers 152 and a plurality of filters 154 are formed on the single substrate 110, respectively, that is, the transformers 152 and the filters 154 share the same substrate 110. And a transformer 152 and a filter 154 on the substrate 110 are electrically connected to form a set of electromagnetic assemblies 150. In this embodiment, referring to fig. 6, four sets of electromagnetic assemblies 150 are formed on the substrate 110, and the transformer 152 and the filter 154 in each set of electromagnetic assemblies 150 are electrically connected, and the sets of electromagnetic assemblies 150 are not electrically connected to each other.

With continued reference to fig. 7, in an embodiment of the present application, the bonding layer 160 for fixing and electrically connecting the electronic component 300 is further disposed on the side of the integrated transformer 100 having the transmission line layer 130. Specifically, the bonding layer 160 is disposed directly on the side of the substrate 110 having the transmission line layer 130, and the electronic component 300 is directly connected to the bonding layer 160. Herein, "directly connected" means that the electronic component 300 is connected to the bonding layer 160 without other intermediate medium. In practice, the electronic component 300 includes an outgoing terminal, and the outgoing terminal is directly connected to the bonding layer 160.

For example, in the embodiment shown in fig. 7, one side of the substrate 110 of the integrated transformer 100 has the transmission line layer 130 and the bonding layer 160 arranged in the same layer, wherein the electronic component 300 is directly connected to the bonding layer 160. The bonding layer 160 is disposed in the same layer as, does not overlap with, and is electrically connected to the transmission line layer 130 on one side thereof. That is, the bonding layer 160 and the transmission line layer 130 are simultaneously disposed at different regions of the same surface of the substrate 110, and the bonding layer 160 may be electrically connected to the transmission line layer 130 disposed therewith, for example, through conductive connection lines. In other embodiments, the bonding layer 160 may also be electrically connected to the transmission line layer 130 on the other side of the substrate 110. For example, the bonding layer 160 may be provided with a conductive via (not shown), and the conductive via may be electrically connected to the transmission line layer 130 on the side of the substrate 110 opposite to the bonding layer 160.

In another embodiment, as shown in fig. 8, integrated transformer 100 further includes a composite layer 170. Wherein the composite layer 170 is disposed on a side of the transmission line layer 130 furthest from the substrate 110 facing away from the substrate 110. The composite layer 170 is used to dispose the electronic device 300 such that the electronic device 300 is electrically connected to at least one transmission line layer 130 adjacent to the composite layer 170.

In this embodiment, the composite layer 170 includes a connection layer 172 and a conductive layer 174. Wherein the connection layer 172 is located between the conductive layer 174 and the corresponding transmission line layer 130, for fixing the conductive layer 174 to the transmission line layer 130 of the integrated transformer 100 and isolating the conductive layer 174 from the transmission line layer 130 against short-circuiting.

Further, in other embodiments, the connector 10 may further include an integrated transformer 100, a header assembly 200 electrically connected to the integrated transformer 100, and an electronic component 300 disposed on the integrated transformer 100 and electrically connected to the integrated transformer 100. The specific configuration of the integrated transformer 100 is referred to above, and will not be described herein.

The electronic component 300 is disposed on the integrated transformer 100, specifically, the electronic component 300 is disposed on the bonding layer 160 shown in fig. 6 or the composite layer 170 shown in fig. 7 of the integrated transformer 100.

In one embodiment, the conductive layer 174 of the composite layer 170 is a pad layer, and the electronic component 300 is attached or soldered to the conductive layer 174.

The number of electronic elements 300 disposed on the bonding layer 160 or the conductive layer 174 is one or more, and the electronic elements 300 may include, but are not limited to, capacitance, resistance, inductance, and the like. In addition, a plurality of electronic components 300 may be connected to each other to form a circuit having a certain function, such as a filter circuit. When the plurality of electronic components 300 are connected to form the filter circuit, the interference signal in the signal processed by the integrated transformer 100 can be filtered, so that the performance of the integrated transformer 100 is improved.

In the present embodiment, a connection terminal for connection with the connector assembly 200 is further provided on the integrated transformer 100. In one embodiment, as shown in fig. 2 and 3, the connection terminal may be a plurality of first conductive vias 180a. The first conductive via 180a penetrates the integrated transformer 100 in the axial direction of the inner via 115, is electrically connected to the at least one transmission line layer 130, and has a conductive material formed on an inner wall thereof. The conductive material in the first conductive via 180a and the metal layer in the inner conductive via 115 are formed in the same manner, and the two conductive materials may be the same or different, which is not particularly limited herein.

In another embodiment, as shown in fig. 9, the connection terminal may be a plurality of first conductive pins 180b having a predetermined length. The first conductive pins 180b are disposed on a side of the integrated transformer 100 perpendicular to the transmission line layer 130, the first conductive pins 180b are spaced apart from each other, and each first conductive pin 180b is electrically connected to at least one transmission line layer 130.

The predetermined length of the first conductive pin 180b may be greater than one fifth of the height of the integrated transformer 100 along the axial direction of the inner via 115 and less than or equal to the height of the integrated transformer 100 along the axial direction of the inner via 115. That is, the length of the first conductive pin 180b may be greater than one fifth of the height of the integrated transformer 100.

In the present embodiment, the length of the first conductive leads 180b is equal to the height of the integrated transformer 100 in the axial direction of the internal via hole 115, i.e., a plurality of first conductive leads 180b spaced apart from each other are provided on the entire side. Specifically, a circular arc groove 182 adapted to each first conductive pin 180b is formed on a side perpendicular to the transmission line layer 130, and the first conductive pins 180b are disposed in the circular arc groove 182.

In this embodiment, a plurality of circular arc grooves 182 may be formed on a side surface perpendicular to the transmission line layer 130, and then the first conductive pins 180b may be formed in the circular arc grooves 182 by, for example, coating or plating. Of course, in other embodiments, the first conductive pin 180b may be welded within the circular arc recess 182 by, for example, welding within the circular arc recess 182. The forming manner of the first conductive pin 180b is not particularly limited in the present application.

The connection terminals of the conventional integrated transformer 100 are often disposed on the transmission line layer 130, and since the transmission line layer 130 is generally provided with a plurality of conductive patterns 136 and other electronic components 300, the area for disposing the connection terminals is small, which easily causes unstable connection of the connection terminals with the connector assembly 200.

The present application is achieved by punching holes in the surface of the integrated transformer 100 parallel to the transmission line layer 130 and forming conductive material in the holes to form first conductive vias 180a electrically connected to at least one transmission line layer 130; or the first conductive pins 180b electrically connected to at least one transmission line layer 130 are provided on the side walls perpendicular to the transmission line layer 130 with a predetermined length, so that the area of the connection terminals connected to the connector assembly 200 is increased, and the connection of the connection terminals to the connector assembly 200 is more stable.

As further shown in fig. 2, in the present embodiment, the connector assembly 200 may generally include a housing 210 and a plurality of first conductive connectors 220 penetrating the housing 210, and the connector assembly 200 is electrically connected to the integrated transformer 100 through the plurality of first conductive connectors 220.

As shown in fig. 2, in one embodiment, a plurality of first conductive connectors 220 are disposed side by side, and each first conductive connector 220 may include a first conductive connection portion 222, a second conductive connection portion 224, and a third conductive connection portion 226 connected in sequence. Wherein, an included angle is formed between the first conductive connection portion 222 and the second conductive connection portion 224, and the included angle is smaller than 90 °; the second conductive connection 224 is perpendicular to the third conductive connection 226, i.e. the angle between the second conductive connection 224 and the third conductive connection 226 is equal to 90 °.

Correspondingly, a plurality of mounting slots 212 adapted to the second conductive connection portions 224 of each first conductive connector 220 are disposed on the housing 210, and a positioning hole 214 is formed in the housing 210 at a position corresponding to the third conductive connection portion 226. The second conductive connection portion 224 is accommodated in the mounting groove 212, and the third conductive connection portion 226 penetrates out of the positioning hole 214 and is connected with the first conductive through hole 180a or the first conductive pin 180b on the integrated transformer 100, thereby achieving the electrical connection between the first conductive connector 220 and the integrated transformer 100.

Specifically, in one embodiment, as shown in fig. 2, when the connection terminal on the integrated transformer 100 is the first conductive via 180a, the third conductive connection part 226 is inserted into the first conductive via 180a, and is contacted with the third conductive connection part 226 through the conductive material in the first conductive via 180a, thereby electrically connecting the tab assembly 200 with the integrated transformer 100.

In another embodiment, referring to fig. 2 and 9, when the connection terminal on the integrated transformer 100 is the first conductive pin 180b provided on the sidewall, the third conductive connection part 226 is soldered with the first conductive pin 180b, or the third conductive connection part 226 and the first conductive pin 180b are bonded with conductive paste (not shown) to electrically connect the tab assembly 200 with the integrated transformer 100.

Fig. 10 shows another embodiment of the first conductive connector of the present application. In another embodiment, as shown in fig. 10, a plurality of first conductive connectors 220 are disposed side by side, and each first conductive connector 220 may include a first conductive connection portion 222a and a second conductive connection portion 224a connected to each other. The first conductive connection portion 222a and the second conductive connection portion 224a have an included angle therebetween, and the included angle is smaller than 90 °.

Correspondingly, a plurality of mounting slots 212 are provided on the housing 210, which are adapted to the second conductive connection portions 224 of each of the first conductive connectors 220. The second conductive connecting portion 224a is partially received in the mounting groove 212, and an end of the second conductive connecting portion 224a away from the first conductive connecting portion 222a further penetrates out of the mounting groove 212 and is electrically connected to the integrated transformer 100, so that the electrical connection between the first conductive connector 220 and the integrated transformer 100 can be achieved through the second conductive connecting portion 224 a.

With continued reference to fig. 10, in the present embodiment, a plurality of first pads 190 are disposed on a surface of the integrated transformer 100 near the housing 210, and the plurality of first pads 190 are disposed on a side near the connector assembly 200. Each of the second conductive connection portions 224a is soldered or bonded with a corresponding one of the first pads 190 after passing through the mounting groove 212, thereby electrically connecting the second conductive connection portions 224a to the integrated transformer 100.

In the above two embodiments, the plane of the second conductive connection portions 224 or 224a of all the first conductive connectors 220 is parallel to the plane of the transmission line layer 130 of the integrated transformer 100. Of course, in other embodiments, the planes of the second conductive connection portions 224 and 224a of all the first conductive connectors 220 may also be perpendicular to the plane of the transmission line layer 130 of the integrated transformer 100.

In the above two embodiments of the present application, by fixing the plurality of first conductive connectors 220 on the housing 210 and further connecting with the integrated transformer 100, the positions of the plurality of first conductive connectors 220 can be relatively fixed, thereby enhancing the connection reliability of the connector assembly 200 and the integrated transformer 100.

Referring to fig. 2 and 10, in the present embodiment, a plurality of second conductive vias 184 are further disposed on a side of the integrated transformer 100 away from the connector assembly 200, the second conductive vias 184 penetrate the integrated transformer 100 along an axial direction of an inner via (not shown), and each second conductive via 184 is electrically connected to at least one transmission line layer. The structure and the formation manner of the second conductive via 184 are the same as those of the first conductive via 180a, please refer to the arrangement of the first conductive via 180a, and the description thereof is omitted herein.

In this embodiment, with continued reference to fig. 2 and 10, the connector 10 further includes a plurality of second conductive contacts 230 disposed at intervals for electrically connecting the connector 10 to an external circuit. The second conductive connector 230 may be a conductive pin.

In one embodiment, the conductive pin is disposed only on the integrated transformer 100. Specifically, one end of the conductive pin may be inserted into the second conductive via 184 and electrically connected to the second conductive via 184, and the other end of the conductive pin extends out of the second conductive via 184 for electrical connection with an external circuit. The conductive pin may be soldered to the second conductive via 184 or abut against the inner wall of the second conductive via 184, so as to electrically connect the conductive pin and the second conductive via 184.

In one embodiment, the external circuit is located on a side of the integrated transformer 100 remote from the housing 210. At this time, the other end of the conductive pin extends out of the second conductive via 184 in a direction away from the housing 210, and is then electrically connected to an external circuit.

In another embodiment, the housing 210 is located between the external circuit and the integrated transformer 100. At this time, as shown in fig. 1-2, the length of the housing 210 may be smaller than the length of the integrated transformer 100, so that the second via 184 formed on the integrated transformer 100 is exposed and not blocked by the housing 210. Thus, the conductive pin does not pass through the housing 210 while the other end of the conductive pin extends out of the second conductive via 184.

Of course, in another embodiment, the conductive pin may be disposed on the housing 210 of the header assembly 200. As shown in fig. 10 and 11 in particular, in the present embodiment, the length of the housing 210 may be equal to or greater than the length of the integrated transformer 100. In addition, a plurality of fixing holes 216 may be disposed on the housing 210, and each fixing hole 216 is coaxially disposed with respect to each second conductive through hole 184. One end of the conductive pin is penetrated from one side of the housing 210 through the fixing hole 216 for connection with an external circuit, and the other end of the conductive pin is inserted into the second conductive via 184 and electrically connected with the second conductive via 184. The conductive pin may be soldered to the second conductive via 184 or abut against the inner wall of the second conductive via 184, so as to electrically connect the conductive pin and the second conductive via 184. The advantage of this is that the fixing hole 216 on the housing 210 can locate the conductive pin, so that the connection between the second conductive via 184 connected to the conductive pin and the external circuit is more stable.

On the other hand, referring to fig. 12, the present application further provides an electronic device 20, where the electronic device 20 includes a motherboard 12 and a connector 10. The structure of the connector 10 is as described above, and will not be described here again. The motherboard 12 is provided with a plurality of conductive jacks 14, and each second conductive header 230 of the connector 10 is plugged with each conductive jack 14 correspondingly, so as to realize the electrical connection between the connector 10 and the motherboard 12.

The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.

Claims

1. A connector for a portable electronic device, characterized by comprising the following steps:

An integrated transformer, comprising:

At least one layer of substrate, wherein a plurality of annular accommodating grooves are formed in each substrate; each annular accommodating groove divides the substrate into a central part surrounded by the annular accommodating groove and a peripheral part arranged around the annular accommodating groove; each central part is provided with a plurality of inner through holes penetrating through the substrate, and each peripheral part is provided with a plurality of outer through holes penetrating through the substrate;

the magnetic cores are accommodated in the corresponding annular accommodating grooves;

The two opposite sides of each substrate are respectively provided with one transmission line layer; each transmission line layer comprises a plurality of conductor patterns which are arranged at intervals along the circumferential direction of the annular accommodating groove, and each conductor pattern is bridged between a corresponding one of the inner through holes and the corresponding one of the outer through holes; and

The plurality of conductive pieces are arranged in the inner conductive holes and the outer conductive holes and are used for sequentially connecting the conductive patterns on the two transmission line layers on each substrate, so that a coil loop capable of transmitting current around the magnetic core is formed;

Wherein, a plurality of said central parts, a plurality of said magnetic cores, a plurality of said conductive members, and said transmission line layers on opposite sides of said substrate form a plurality of transformers and/or a plurality of filters arranged according to a predetermined arrangement rule;

The connector assembly comprises a shell and a plurality of first conductive connectors penetrating through the shell, and the first conductive connectors are electrically connected with the integrated transformer;

Each first conductive connector comprises a first conductive connecting part, a second conductive connecting part and a third conductive connecting part which are sequentially connected, an included angle between the first conductive connecting part and the second conductive connecting part is smaller than 90 degrees, the second conductive connecting parts are perpendicular to the third conductive connecting parts, planes of all the second conductive connecting parts are parallel to planes of the transmission line layers, and the third conductive connecting parts are electrically connected with the integrated transformer;

The shell is provided with a plurality of mounting grooves matched with the second conductive connecting parts of the first conductive connectors, a through positioning hole is formed in the position, corresponding to the third conductive connecting parts, of the shell, the second conductive connecting parts are accommodated in the mounting grooves, and the third conductive connecting parts penetrate out of the positioning holes;

the integrated transformer is further provided with a plurality of second conductive through holes penetrating through the integrated transformer along the axial direction of the internal through holes at one side far away from the joint assembly, and each second conductive through hole is electrically connected with at least one transmission line layer;

the housing further comprises: the fixing holes are coaxially and correspondingly arranged with the second conductive through holes;

The connector further comprises: and one end of each second conductive connector is inserted into one second conductive through hole and is electrically connected with the second conductive through hole, and the other end of each second conductive connector is used for electrically connecting the connector with an external circuit.

2. The connector of claim 1, wherein a plurality of said transformers and a plurality of said filters share the same substrate.

3. The connector of claim 1, wherein at least one layer of the substrate comprises at least one first substrate and at least one second substrate; all of the transformers are formed on at least one first substrate; at least one of the second substrates is entirely formed with a filter.

4. The connector of claim 1, wherein a side of the integrated transformer adjacent to the plurality of first conductive lands is provided with a plurality of first conductive vias extending through the integrated transformer in an axial direction of the inner conductive vias, each of the first conductive vias being electrically connected to at least one of the transmission line layers; each third conductive connecting part is inserted into a corresponding first conductive through hole and is electrically connected with the first conductive through hole.

5. The connector of claim 1, wherein a side of the integrated transformer perpendicular to the transmission line layers is provided with a plurality of first conductive pins having a predetermined length, the plurality of first conductive pins are disposed at intervals, and each of the first conductive pins is electrically connected to at least one of the transmission line layers.

6. The connector of claim 5, wherein a plurality of the third conductive connecting portions are in one-to-one correspondence with and electrically connected to a plurality of the first conductive pins.

7. The connector of claim 5, wherein the predetermined length is greater than one fifth of a height of the integrated transformer along the axial direction of the internal via and less than or equal to the height of the integrated transformer along the axial direction of the internal via.

8. The connector of claim 1, wherein one side of the integrated transformer having the transmission line layer is further provided with a bonding layer for fixing and electrically connecting electronic components; the bonding layer is arranged in the same layer as the transmission line layer on the one side, does not overlap, and is electrically connected.

9. The connector of claim 1, wherein the integrated transformer further comprises:

the composite layer is arranged on one side of at least one transmission line layer, which is opposite to the substrate, and is used for arranging an electronic element so as to electrically connect the electronic element with at least one transmission line layer.

10. The connector of claim 9, wherein the composite layer comprises a connection layer and a conductive layer, the connection layer being located between the conductive layer and the corresponding transmission line layer; the electronic component is arranged on the conductive layer.

11. The connector of claim 10, further comprising an electronic component; the conductive layer is a bonding pad layer, and the electronic element is welded on the conductive layer.

12. The connector of claim 1, wherein the connector further comprises: and one end of each second conductive connector is correspondingly inserted into one second conductive through hole and is electrically connected with the second conductive through hole, and the other end of each second conductive connector is used for electrically connecting the connector with an external circuit.

13. The connector of claim 1 or 12, wherein the second conductive header abuts against an inner wall of the second conductive via or the second conductive header is soldered to the second conductive via.

14. An electronic device, the electronic device comprising: a motherboard and a connector as claimed in any one of claims 1 to 13, said connector being electrically connected to said motherboard.