CN110388884A - Structured Light Illumination 3D Measuring Device - Google Patents
Structured Light Illumination 3D Measuring Device Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/254—Projection of a pattern, viewing through a pattern, e.g. moiré
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Abstract
本发明公开了一种结构光照明三维测量装置,包括:一光源,用于发射光束;一分束光芯片,与所述光源通过一光纤连接,用于将所述光束进行分光形成多束出射光;一位移器,设置于所述分束光芯片一侧,与所述分束光芯片机械连接,用于控制分束光芯片移动,间接控制多束光的出射位置;一光电探测器,用于探测多束出射光经待测物体反射的反射光束;一控制模块,分别电连接于所述光源、位移器和光电探测器,用于控制位移器的移动,以及控制光电探测器。本发明利用分束光芯片实现分光,通过干涉产生面结构光投影,其工作波长范围宽,可用于不同应用场景,且没有衍射损耗,光能量利用率高;同时,本装置结构简单,成本低且体积小,适用于多种作业场景。
The invention discloses a three-dimensional measuring device for structured light illumination, comprising: a light source for emitting light beams; a beam splitting optical chip connected to the light source through an optical fiber for splitting the light beams to form multiple output beams emit light; a shifter, arranged on one side of the beam-splitting optical chip, mechanically connected with the beam-splitting optical chip, used to control the movement of the beam-splitting optical chip, and indirectly control the exit position of multiple beams of light; a photodetector, It is used to detect the reflected light beams reflected by the object to be measured by multiple beams of outgoing light; a control module is electrically connected to the light source, the displacer and the photodetector respectively, and is used to control the movement of the displacer and the photodetector. The invention utilizes a beam-splitting light chip to realize light splitting, and generates surface-structured light projection through interference. Its operating wavelength range is wide, it can be used in different application scenarios, and there is no diffraction loss, and the utilization rate of light energy is high; at the same time, the device has a simple structure and low cost And small size, suitable for a variety of job scenarios.
Description
技术领域technical field
本发明涉及一种三维测量装置,尤其涉及到一种结构光照明三维测量装置。The invention relates to a three-dimensional measuring device, in particular to a structured light illumination three-dimensional measuring device.
背景技术Background technique
光学三维测量作为重要的一种测量技术,由于具有非接触、快速以及高分辨率的测量优点,其广泛应用于医疗、工业等行业。随着现代技术的发展,尤其是激光技术、图像处理技术以及光学成像技术的高速发展,三维测量发展出了用于不同应用场景的不同形式。As an important measurement technology, optical three-dimensional measurement is widely used in medical, industrial and other industries due to its non-contact, fast and high-resolution measurement advantages. With the development of modern technology, especially the rapid development of laser technology, image processing technology and optical imaging technology, 3D measurement has developed different forms for different application scenarios.
光学三维测量方法可以分为被动式和主动式,被动式包括单目、双目以及多目立体视觉法;主动式包括时间飞行法、投影结构光法、三角法以及莫尔条纹法;其中投影结构光法具有速度快、直接且精度高的优点,广泛地应用到了包括大型建筑到微小物体的各种目标尺寸的测量。Optical three-dimensional measurement methods can be divided into passive and active. Passive methods include monocular, binocular and multi-eye stereo vision methods; The method has the advantages of fast speed, directness and high precision, and is widely used in the measurement of various target sizes including large buildings to tiny objects.
在结构光照明三维测量技术中,一种现有技术是通常采用液晶显示器或数字投影仪来实现点、线、光栅等类型结构光的投影,通过放置在与投影轴成一定角度上的光电探测器(通常为相机)来记录物体表面的图像,然后再通过对其结构光图案变形的分析,实现物体表面三维形貌的测量。另外,在此类技术中,还可以通过采用不同编码方式的结构光投影实现高精度的测量,但由于投影设备体积较大,难以实现小型化。In the three-dimensional measurement technology of structured light illumination, an existing technology is usually to use liquid crystal display or digital projector to realize the projection of types of structured light such as point, line, grating, etc. A device (usually a camera) is used to record the image of the surface of the object, and then through the analysis of the deformation of its structured light pattern, the measurement of the three-dimensional topography of the object surface is realized. In addition, in this type of technology, high-precision measurement can also be achieved through structured light projection using different encoding methods, but it is difficult to achieve miniaturization due to the large size of the projection equipment.
另一种现有技术是利用线激光器实现线结构光的投影,通过手持或固定角度扫描,实现物体三维的测量。这种技术虽然能够实现测量装置的小型化,但需要移动物体(或测量装置)来实现物体整体的三维形貌的测量。还有一种现有技术是利用垂直腔面发射激光器搭配DOE(Diffractive optical elements,衍射光学器件),利用光学衍射的原理实现结构光图案的投影,从而实现三维测量,其广泛应用于目前手机的前置人脸识别,虽然这种技术具有体积小,衍射效率高的优点,但其依赖于复杂的DOE设计和加工,且工作波长必须与DOE设计相关。Another existing technology is to use line lasers to realize the projection of line structured light, and to realize three-dimensional measurement of objects by hand-held or fixed-angle scanning. Although this technique can realize the miniaturization of the measuring device, it needs to move the object (or the measuring device) to realize the measurement of the overall three-dimensional shape of the object. Another existing technology is to use vertical cavity surface emitting lasers with DOE (Diffractive optical elements, diffractive optical elements), and use the principle of optical diffraction to realize the projection of structured light patterns, thereby realizing three-dimensional measurement, which is widely used in the front of current mobile phones. For face recognition, although this technology has the advantages of small size and high diffraction efficiency, it relies on complex DOE design and processing, and the working wavelength must be related to the DOE design.
因此,基于以上现有技术存在的问题,亟待研发一种小体积、低成本且结构简单的结构光照明三维测量装置。Therefore, based on the above existing problems in the prior art, it is urgent to develop a three-dimensional measurement device with structured light illumination that is small in size, low in cost and simple in structure.
发明内容Contents of the invention
(一)要解决的技术问题(1) Technical problems to be solved
本发明提供了一种结构光照明三维测量装置,以至少部分解决现有方法中存在的体积庞大或不能固定测量,以及涉及和加工复杂的缺点。The invention provides a three-dimensional measurement device with structured light illumination to at least partly solve the shortcomings of the existing methods, which are bulky or cannot be fixed for measurement, and involve and process complicatedly.
(二)技术方案(2) Technical solution
根据本发明的一方面,提供了一种结构光照明三维测量装置,包括一光源,用于发射光束;一分束光芯片,与所述光源通过一光纤连接,用于将所述光束进行分光形成多束出射光;一位移器,设置于所述分束光芯片一侧,与所述分束光芯片机械连接,用于控制分束光芯片移动,间接控制多束光的出射位置;一光电探测器,用于探测多束出射光经待测物体反射的反射光束;一控制模块,分别电连接于所述光源、位移器和光电探测器,用于控制位移器的移动,以及控制光电探测器。According to one aspect of the present invention, a three-dimensional measuring device with structured light illumination is provided, including a light source for emitting light beams; a beam-splitting optical chip connected to the light source through an optical fiber for splitting the light beams forming multiple beams of outgoing light; a shifter, arranged on one side of the beam-splitting optical chip, mechanically connected to the beam-splitting optical chip, used to control the movement of the beam-splitting optical chip, and indirectly control the exit position of multiple beams of light; A photodetector is used to detect multiple beams of outgoing light reflected by the object to be measured; a control module is electrically connected to the light source, the displacement device and the photoelectric detector, and is used to control the movement of the displacement device and control the photoelectric detector.
在进一步的方案中,所述光源为具有单一波长的激光光源,其波长范围为400-1600nm。In a further solution, the light source is a laser light source with a single wavelength, and its wavelength range is 400-1600nm.
在进一步的方案中,所述的分束光芯片包括一石英基板和一分光波导,其输出端面为平面,出射光以设定发散角垂直输出。In a further solution, the beam-splitting optical chip includes a quartz substrate and a light-splitting waveguide, the output end surface of which is a plane, and the outgoing light is output vertically at a set divergence angle.
在进一步的方案中,所述的位移器为电动机械位移器或压电位移器。In a further solution, the displacement device is an electromechanical displacement device or a piezoelectric displacement device.
在进一步的方案中,所述的光电探测器包括带有定焦或变焦镜头的CMOS相机。In a further solution, the photodetector includes a CMOS camera with a fixed or zoom lens.
在进一步的方案中,所述控制模块可配置为单片机系统或FPGA(Field-Programmable Gate Array,现场可编程门阵列),此外,该控制模块还包括一通信端口,并通过该通信端口将测量数据传输至后端计算系统,后端计算系统利用相应三维重建算法重建待测物体的表面三维形貌。In a further solution, the control module can be configured as a single-chip microcomputer system or FPGA (Field-Programmable Gate Array, Field-Programmable Gate Array). In addition, the control module also includes a communication port, and the measurement data is transmitted through the communication port. It is transmitted to the back-end computing system, and the back-end computing system uses the corresponding three-dimensional reconstruction algorithm to reconstruct the surface three-dimensional topography of the object to be measured.
在进一步的方案中,所述装置还包括一外壳,所述外壳包括一水平底座,用于将所述光源,分束光芯片,位移器,光电探测器以及控制模块固定于同一水平面。In a further solution, the device further includes a casing, and the casing includes a horizontal base for fixing the light source, the beam splitting optical chip, the displacer, the photodetector and the control module on the same horizontal plane.
(三)有益效果(3) Beneficial effects
从上述技术方案可以看出,本发明提供的一种结构光照明三维测量装置,利用分束光芯片实现分光,通过干涉产生面结构光投影,其工作波长范围宽,可用于不同应用场景,同时没有类似于空间光调制器的衍射损耗,其光能量利用率高;同时,本装置结构简单,成本低且体积小,适用于多种作业场景。It can be seen from the above technical solutions that the three-dimensional measurement device for structured light illumination provided by the present invention uses a beam-splitting light chip to achieve light splitting, and produces surface structured light projection through interference. Its operating wavelength range is wide and can be used in different application scenarios. There is no diffraction loss similar to that of a spatial light modulator, and its light energy utilization rate is high; at the same time, the device has a simple structure, low cost and small volume, and is suitable for various operating scenarios.
附图说明Description of drawings
图1是本发明实施例一种结构光照明三维测量装置的俯视图。Fig. 1 is a top view of a three-dimensional measurement device with structured light illumination according to an embodiment of the present invention.
图2是图1所示装置的前视图。Figure 2 is a front view of the device shown in Figure 1 .
图3是图1所示装置三维测量的示意图Fig. 3 is a schematic diagram of three-dimensional measurement of the device shown in Fig. 1
图4是图1所示装置光电探测器采集的干涉条纹图像。Fig. 4 is an interference fringe image collected by the photodetector of the device shown in Fig. 1 .
【附图标记说明】[Description of Reference Signs]
1-光源;2-光纤;3-分束光芯片;4-位移器;5-光电探测器;1-light source; 2-optical fiber; 3-beam splitting chip; 4-displacer; 5-photodetector;
6-控制模块;7-外壳;8-待测物体;301-石英基板;302-分光波导。6-control module; 7-housing; 8-object to be measured; 301-quartz substrate; 302-split waveguide.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚明白,以下结合具体实施例,并参照附图,对本发明作进一步的详细说明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
在本发明中,“设置于...上”或“贴附至...上”用于包括与单一或多个组件间的直接接触关系。而且,说明书与权利要求书所使用的序数例如“第一”、“第二”、“一号”或“二号”等用词,以修饰请求保护的部件,其本身并不包含及代表该部件有任何之前的序数,也不代表某一部件与另一部件的顺序或是制造方法上的顺序,这些序数的使用仅用来使具有某命名的一部件得以和另一具有相同命名的部件能做出清楚区分。In the present invention, "disposed on" or "attached to" is used to include a direct contact relationship with a single or multiple components. Moreover, the ordinal numbers used in the specification and claims, such as "first", "second", "number one" or "number two", are used to modify the components claimed for protection, which do not themselves contain and represent the Parts have any previous ordinal numbers, nor do they imply the order of one part with another or in terms of manufacturing methods, and these ordinal numbers are used only to enable a part with a certain designation to be related to another part with the same designation Can make a clear distinction.
本发明提供了一种结构光照明三维测量装置,利用分束光芯片实现将光源输出的单束入射光分为两束或多束,通过将该两束或多束光从平整端面直接输出至待测物体的方式,干涉形成面结构光投影,然后通过位移器的位移功能实现干涉条纹的相位调制,同时光电探测器采集待测物体的反射光,最后利用相应三维重建算法重建待测物体的表面三维形貌。The invention provides a three-dimensional measurement device for structured light illumination, which uses a beam-splitting light chip to divide a single beam of incident light output by a light source into two or more beams, and directly outputs the two or more beams of light from a flat end surface to In the way of the object to be measured, the interference forms the surface structured light projection, and then the phase modulation of the interference fringes is realized through the displacement function of the displacer. The three-dimensional topography of the surface.
图1是本发明实施例一种结构光照明三维测量装置的俯视图,如图1所示,包括:Fig. 1 is a top view of a structured light illumination three-dimensional measurement device according to an embodiment of the present invention, as shown in Fig. 1 , including:
光源1,在本实施例中,光源1为具有单一波长的激光光源,其波长范围为400-1600nm;A light source 1, in this embodiment, the light source 1 is a laser light source with a single wavelength, and its wavelength range is 400-1600nm;
分束光芯片3,用于将所述光源1的单束入射光分成两束或多束,该分束光芯片3与光源1通过光纤2相连接,光源1所产生的单束入射光通过光纤2耦合进分束光芯片;The beam-splitting optical chip 3 is used to divide the single incident light of the light source 1 into two or more beams. The beam-splitting optical chip 3 is connected to the light source 1 through the optical fiber 2, and the single incident light generated by the light source 1 passes through The optical fiber 2 is coupled into the beam-splitting optical chip;
位移器4,设置于所述分束光芯片3一端,与所述分束光芯片3机械连接,所述位移器4可为电动机械位移器和压电位移器,用于在出射光方向移动所述的分束光芯片3,以便实现干涉条纹的相位调制;The displacement device 4 is arranged at one end of the beam-splitting optical chip 3 and is mechanically connected to the beam-splitting optical chip 3. The displacement device 4 can be an electromechanical displacement device or a piezoelectric displacement device for moving in the direction of the outgoing light The beam-splitting optical chip 3, so as to realize phase modulation of interference fringes;
光电探测器5,可配置为带有定焦或变焦镜头的CMOS相机,用于采集与所述光源一致的波长的光信息,记录物体表面的图像,并通过对其结构光图案变形的分析,从而实现物体表面三维形貌的测量,在本发明的其他实施例中,如需进一步提高检测的特异性,可以在该光电探测器5的相机镜片表面镀膜,使其仅探测光源输出波长的光。The photodetector 5, which can be configured as a CMOS camera with a fixed-focus or zoom lens, is used to collect light information of a wavelength consistent with the light source, record the image of the object surface, and analyze the deformation of its structured light pattern, Thereby, the measurement of the three-dimensional topography of the object surface is realized. In other embodiments of the present invention, if the specificity of detection needs to be further improved, a film can be coated on the surface of the camera lens of the photodetector 5 so that it only detects the light of the output wavelength of the light source. .
控制模块6,分别电连接于所述光源1、位移器4和光电探测器5,用于设置光源1波长,位移器4的工作模式以及采集光电探测器5所收集的数据,在本实施例中,所述控制模块6可配置为单片机系统或FPGA,优选的,控制模块6还包括一通信端口,并通过该通信端口将测量数据传输至后端计算系统,后端计算系统利用相应三维重建算法重建待测物体的表面三维形貌。The control module 6 is electrically connected to the light source 1, the shifter 4 and the photodetector 5 respectively, and is used to set the wavelength of the light source 1, the working mode of the shifter 4 and collect the data collected by the photodetector 5. In this embodiment Among them, the control module 6 can be configured as a single-chip microcomputer system or FPGA. Preferably, the control module 6 also includes a communication port, and the measurement data is transmitted to the back-end computing system through the communication port, and the back-end computing system utilizes the corresponding three-dimensional reconstruction The algorithm reconstructs the surface three-dimensional topography of the object to be measured.
此外,所述分束光芯片3包括石英基板301和分光波导302,出射光的输出端面为平面,垂直于分光波导302。In addition, the beam-splitting optical chip 3 includes a quartz substrate 301 and a light-splitting waveguide 302 , and the output end surface of the emitted light is a plane, perpendicular to the light-splitting waveguide 302 .
本装置还包括外壳7,所述外壳7包括一水平底座,用于将所述光源1,分束光芯片3,位移器4,光电探测器5以及控制模块6固定于同一水平面。The device also includes a casing 7, and the casing 7 includes a horizontal base for fixing the light source 1, beam-splitting optical chip 3, displacer 4, photodetector 5 and control module 6 on the same horizontal plane.
图2为图1所示装置的前视图,如图2所示,位移器4设置于分束光芯片3的一侧,通过于出射光方向位移分束光芯片3,实现条纹位移,从而获得满足条纹结构光三维图像重构所需的数据。Fig. 2 is the front view of the device shown in Fig. 1, as shown in Fig. 2, the shifter 4 is arranged on one side of the beam-splitting optical chip 3, by displacing the beam-splitting optical chip 3 in the outgoing light direction, the fringe displacement is realized, thereby obtaining Meet the data required for 3D image reconstruction with striped structured light.
图3是图1所示装置三维测量的示意图,下面结合图3对本发明的一个具体实施例做进一步阐述,请参阅图3。FIG. 3 is a schematic diagram of three-dimensional measurement of the device shown in FIG. 1 , and a specific embodiment of the present invention will be further described below in conjunction with FIG. 3 , please refer to FIG. 3 .
在本实施例中,光源1输出光的波长为635nm,分束光芯片3为PLC(planarlightwave circuit,平面光波导)光芯片,能够将光均匀地分成两束,两个分光波导302间距为250μm,位移器4为压电陶瓷位移器,能够在控制模块6输出的电信号的控制下驱使分束光芯片3的移动,其移动方向与两个分光波导302输出点的连线平行,光电探测器5为包含有镜头的CMOS相机。In this embodiment, the wavelength of the light output by the light source 1 is 635nm, and the beam-splitting optical chip 3 is a PLC (planar lightwave circuit, planar light waveguide) optical chip, which can evenly divide the light into two beams, and the distance between the two light-splitting waveguides 302 is 250 μm , the displacement device 4 is a piezoelectric ceramic displacement device, which can drive the movement of the beam-splitting optical chip 3 under the control of the electrical signal output by the control module 6, and its moving direction is parallel to the connection line of the output points of the two optical waveguides 302, and the photoelectric detection Device 5 is a CMOS camera that includes a lens.
如图3所示,两个分光波导302输出的光直接照射在待测物体8上,同时光电探测器5采集从待测物体上反射的光。图4是图1所示装置光电探测器采集的干涉条纹图像,如图4所示,根据干涉原理,分光波导302输出的光在待测物体8表面干涉,形成干涉条纹图像。As shown in FIG. 3 , the light output by the two light-splitting waveguides 302 is directly irradiated on the object 8 to be measured, while the photodetector 5 collects the light reflected from the object to be measured. FIG. 4 is an interference fringe image collected by the photodetector of the device shown in FIG. 1 . As shown in FIG. 4 , according to the interference principle, the light output by the splitting waveguide 302 interferes on the surface of the object 8 to be measured to form an interference fringe image.
光电探测器5采集到的图像为带有干涉条纹的图像I,其数学表达为:The image collected by the photodetector 5 is an image I with interference fringes, and its mathematical expression is:
I(x,y)=I′(x,y)+I″(x,y)cos(φ(x,y)).I(x,y)=I'(x,y)+I"(x,y)cos(φ(x,y)).
其中x和y代表图像的像素点的坐标,相位φ(x,y)代表了物体表面三维形貌的信息。Among them, x and y represent the coordinates of the pixel points of the image, and the phase φ(x, y) represents the information of the three-dimensional topography of the object surface.
通过位移器4驱使分束光芯片3的位移,实现干涉条纹相位步长为π/2的位移,在本实施例中,位移3次,总共采集4幅图像,其数学表达分别为:The displacement of the beam-splitting optical chip 3 is driven by the displacement device 4 to realize the displacement of the interference fringe phase step length of π/2. In this embodiment, the displacement is performed 3 times, and a total of 4 images are collected. The mathematical expressions are respectively:
I1(x,y)=I′(x,y)+I″(x,y)cos(φ(x,y))I 1 (x, y) = I'(x, y)+I"(x, y) cos(φ(x, y))
I2(x,y)=I′(x,y)+I″(x,y)cos(φ(x,y)+π/2)I 2 (x, y)=I'(x, y)+I"(x, y) cos(φ(x, y)+π/2)
I3(x,y)=I′(x,y)+I″(x,y)cos(φ(x,y)+π)I 3 (x, y)=I'(x, y)+I"(x, y)cos(φ(x, y)+π)
I4(x,y)=I′(x,y)+I″(x,y)cos(φ(x,y)+3π/2)I 4 (x, y) = I'(x, y)+I"(x, y)cos(φ(x, y)+3π/2)
根据这四幅图像即可计算出相位φ(x,y):The phase φ(x, y) can be calculated based on these four images:
最后通过相应相位展开算法即可恢复出待测物体8的三维表面形貌。Finally, the three-dimensional surface topography of the object 8 to be measured can be recovered through the corresponding phase unwrapping algorithm.
通过上述陈述,针对现有技术中存在的问题及缺点,本发明实施例提供了一种结构光照明三维测量装置,利用分束光芯片实现分光,通过干涉产生面结构光投影,其工作波长范围宽,可用于不同应用场景,同时没有类似于空间光调制器的衍射损耗,其光能量利用率高;同时,本装置结构简单,成本低且体积小,适用于多种作业场景。Through the above statement, in view of the problems and shortcomings in the prior art, the embodiment of the present invention provides a three-dimensional measurement device for structured light illumination, which uses a beam splitter chip to achieve light splitting, and generates surface structured light projection through interference. Its working wavelength range is Wide, can be used in different application scenarios, and has no diffraction loss similar to the spatial light modulator, and its light energy utilization rate is high; at the same time, the device has a simple structure, low cost and small size, and is suitable for various operating scenarios.
以上所述的具体实施例,对本发明的目的、技术方案和有益效果进行了进一步详细说明,应理解的是,以上所述仅为本发明的具体实施例而已,并不用于限制本发明,凡在本发明的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention, and are not intended to limit the present invention. Within the spirit and principles of the present invention, any modifications, equivalent replacements, improvements, etc., shall be included in the protection scope of the present invention.
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